Electrical Characteristics Unless otherwise specified, all limits are guaranteed to T
J
= 25˚C. VDD= 2.8V.
Boldface limits apply at temperature extremes. (Continued)
Symbol Parameter Condition Min Typ Max Units
V
O
Output Swing from Rail Sourcing, IO= 5mA 55 85
105
mV
Sinking, I
O
= −5mA 45 75
95
I
O
Output Short Circuit Current
(Note 3)
Sourcing, VO=0V 25 145
mA
Sinking, V
O
= 2.8V 25 180
e
n
Output Referred Noise RF input = 1800 MHz,
-10dBm, 20kΩ // 27pF
between V
OUT
and V
COMP
,
V
OUT
=1.4V, set by V
RAMP
,
(Note 8)
700 nV/
SR Slew Rate 8
5
11 V/µs
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model: 1.5kΩ in series with 100pF. Machine model, 0Ω in series with 100pF.
Note 3: Shorting circuit output to either V
+
or V−will adversely affect reliability.
Note 4: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T
J=TA
. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T
J
>
TA.
Note 5: Power in dBV = dBm + 13 when the impedance is 50Ω.
Note 6: The maximum power dissipation is a function of T
J(MAX)
, θJAand TA. The maximum allowable power dissipation at any ambient temperature is PD=
(T
J(MAX)-TA
)/θJA. All numbers apply for packages soldered directly into a PC board
Note 7: All limits are guaranteed by design or statistical analysis
Note 8: Typical values represent the most likely parametric norm.
Note 9: Slope and intercept are calculated from graphs ’V
OUT
vs. RF input Power’ where the current is obtained by division of the voltage by 20kΩ.
Connection Diagram
8-Bump micro SMD
20029035
Top View
LMV243
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