NSC LMV243MDA, LMV243BL, LMV243BLX Datasheet

LMV243 Single-Channel, Quad-Band GSM Power Controller in micro SMD
General Description
The device is intended for use within an RF transmit power control loopin GSM mobile phones and supports GaAs HBT and bipolar RF single supply power amplifiers. The circuit operates with a single supply from 2.7V to 3.3V.
A single external RC combination is used to provide stable operations that accommodates individual PA characteristics. The LMV243 is offered in a 8-bump micro SMD 1.5mm x
1.5mm package. This space savings package supports flex­ible product placement almost anywhere in the circuitboard.
Features
(Typical Unless Otherwise Noted)
n 50dB RF detection range (typical) n micro SMD package 1.5mm x 1.5mm x 0.995mm n Support of GaAs HBT, bipolar technology n Quad-band operation n Shutdown mode for Power Save in Rx slot n GPRS compliant n External loop compensation option n Accurate temperature compensation n Frequency range is 450MHz to 2GHz
Applications
n GSM mobile phone n AGC for digital audio n TDMA RF control n Wireless LAN
Typical Application
20029034
May 2002
LMV243 Single-Channel, Quad-Band GSM Power Controller in micro SMD
© 2002 National Semiconductor Corporation DS200290 www.national.com
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact theNational Semiconductor SalesOffice/ Distributors for availability and specifications.
Supply Voltage
V
DD
- GND 4V Max
ESD Tolerance (Note 2)
Human Body Model 2000V
Machine Model 200V Storage Temperature Range −65˚C to 150˚C Junction Temperature (Note 6) 150˚C Max
Mounting Temperature
Infrared or convection (20 sec) 235˚C
Operating Ratings (Note 1)
Nominal Supply Voltage 2.7V to 3.3V Temperature Range −40˚C
<
T
J
<
85˚C
V
RAMP
Voltage Range 0V to 2V
V
HOME
Voltage Range 0V to 2V
RF Frequency Range 450MHz to 2GHz
Electrical Characteristics Unless otherwise specified, all limits are guaranteed to T
J
= 25˚C. VDD= 2.8V.
Boldface limits apply at temperature extremes.
Symbol Parameter Condition Min Typ Max Units
I
DD
Supply Current V
OUT
=(VDD- GND)/2 8.7 10.5
12.5
mA
In Shutdown (TX_EN = 0.8V) V
OUT
=(VDD- GND)/2
4.6 30 µA
V
HIGH
Logic Level to Enable Power (Note 7) 1.8 V
V
LOW
Logic Level to Disable Power (Note 7) 0.8 V
T
ON
Turn-on- Time from Shutdown 3.7 6.5
7.5
µs
I
EN
Current into TX_EN Pin 0.108 5 µA
RAMP Amplifier
V
RD
V
RAMP
Deadband 170
150
210 250
270
mV
1/R
RAMP
Transconductance (Note 8) 78 µa/V
I
OUT RAMP
Ramp Amplifier Output Current V
RAMP
=2V 100 140 µA
RF Input
P
IN
RF Input Power Range (Note 5) 20k// 27pF between V
OUT
and V
COMP
−50 +5
dBm
−63
−7
dBV
Logarithmic Slope (Note 9)
@
900MHz, 20k// 27pF
between V
OUT
and V
COMP
−1.79
µa/dB
@
1800MHz, 20k// 27pF
between V
OUT
and V
COMP
−1.89
@
1900MHz, 20k// 27pF
between V
OUT
and V
COMP
−1.89
Logarithmic Intercept (Note 9)
@
900MHz, 20k// 27pF
between V
OUT
and V
COMP
−50.5
dBm
@
1800MHz, 20k// 27pF
between V
OUT
and V
COMP
−46.9
@
1900MHz, 20k// 27pF
between V
OUT
and V
COMP
−45.9
R
IN
DC Resistance (Note 8) 50
C
IN
Input Capacitance (Note 8) 0.5 pF
Error Amplifier
GBW Gain-Bandwidth Product (Note 8) 7.6 MHz
LMV243
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Electrical Characteristics Unless otherwise specified, all limits are guaranteed to T
J
= 25˚C. VDD= 2.8V.
Boldface limits apply at temperature extremes. (Continued)
Symbol Parameter Condition Min Typ Max Units
V
O
Output Swing from Rail Sourcing, IO= 5mA 55 85
105
mV
Sinking, I
O
= −5mA 45 75
95
I
O
Output Short Circuit Current (Note 3)
Sourcing, VO=0V 25 145
mA
Sinking, V
O
= 2.8V 25 180
e
n
Output Referred Noise RF input = 1800 MHz,
-10dBm, 20k// 27pF between V
OUT
and V
COMP
,
V
OUT
=1.4V, set by V
RAMP
,
(Note 8)
700 nV/
SR Slew Rate 8
5
11 V/µs
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model: 1.5kin series with 100pF. Machine model, 0in series with 100pF. Note 3: Shorting circuit output to either V
+
or V−will adversely affect reliability.
Note 4: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that T
J=TA
. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T
J
>
TA.
Note 5: Power in dBV = dBm + 13 when the impedance is 50. Note 6: The maximum power dissipation is a function of T
J(MAX)
, θJAand TA. The maximum allowable power dissipation at any ambient temperature is PD=
(T
J(MAX)-TA
)/θJA. All numbers apply for packages soldered directly into a PC board
Note 7: All limits are guaranteed by design or statistical analysis Note 8: Typical values represent the most likely parametric norm. Note 9: Slope and intercept are calculated from graphs ’V
OUT
vs. RF input Power’ where the current is obtained by division of the voltage by 20k.
Connection Diagram
8-Bump micro SMD
20029035
Top View
LMV243
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Pin Descriptions
Pin Name Description
Power Supply A3 V
DD
Supply Voltage
A2, C3 GND Power Ground. Operation requires both pins be grounded. Digital Inputs C2 TX_EN A Logic High to enable device. Analog Inputs B3 RF IN RF Input connected to the Coupler output with optional attenuation to measure the
Power Amplifier (PA) / Antenna RF power levels.
C1 RAMP IN Sets the RF output power level. The useful input voltage range is from 0.2V to 1.8V,
although voltages from 0V to V
DD
are allowed.
Compensation A1 Comp Connects an external RC network between the Comp pin and the Output pin for an
overall loop compensation and to control the closed loop frequency response. Conventional loop stability techniques can be used in selecting this network, such as Bode plots. A good starting value for the RC combination will be C = 68pF andR=0Ω.
Output B1 Out A rail-to-rail output capable of sourcing 25mA and sinking 25mA, with less than 200mV
total voltage drop over the specified temperature. The output is free from glitches when enabled by TX_EN. When TX_EN is low, the output voltage is near GND.
Note: 1. All inputs and outputs are referenced to GND (pin A2, C3).
2. For the digital inputs, a LOW is
<
0.8V and a HIGH is>1.8V.
3. RF power detection is performed internally in the LMV243 and only an RF power coupler with optional extra attenuation has to be used.
Ordering Information
Package Part Number Package Marking Transport Media NSC Drawing
8-Bump micro SMD
LMV243BL 01 1k Units Tape and Reel
BLA08AAC
LMV243BLX 01 3k Units tape and Reel
Block Diagram
20029036
FIGURE 1.
LMV243
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