NSC DS7837J-883 Datasheet

TL/F/5811

DS7837/DS8837 Hex Unified Bus Receiver

February 1996

DS7837/DS8837 Hex Unified Bus Receiver

General Description

The DS7837/DS8837 are high speed receivers designed for
use in bus organized data transmission systems intercon­nected by terminated 120X impedance lines. The external
termination is intended to be 180X resistor from the bus to
the

a

5V logic supply together with a 390X resistor from the
bus to ground. The receiver design employs a built-in input
hysteresis providing substantial noise immunity. Low input
current allows up to 27 driver/receiver pairs to utilize a com­mon bus. Disable inputs provide time discrimination. Disable
inputs and receiver outputs are TTL compatible. Perform­ance is optimized for systems with bus rise and fall times

s

1.0 ms/V.

Features

Y

Low receiver input current for normal VCCor V

CC

e

0V

(15 mA typ)

Y

Six separate receivers per package

Y

Built-in receiver input hysteresis (1V typ)

Y

High receiver noise immunity (2V typ)

Y

Temperature insensitive receiver input thresholds track
bus logic levels

Y

TTL compatible disable and output

Y

Molded or cavity dual-in-line or flat package

Y

High speed

Typical Application

TL/F/5811– 1

Connection Diagram

Dual-In-Line Package

TL/F/5811– 2

Top View

Order Number DS7837J, DS8837M or DS8837N

See NS Package Number J16A, M16A or N16A

C

1996 National Semiconductor Corporation RRD-B30M36/Printed in U. S. A.

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Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.

Supply Voltage 7V

Input Voltage 5.5V

Operating Temperature Range

DS7837

b

55§Ctoa125§C

DS8837 0

§

Ctoa70§C

Storage Temperature Range

b

65§Ctoa150§C

Maximum Power Dissipation* at 25

§

C
Cavity Package 1433 mW
Molded DIP Package 1362 mW

SO Package 1002 mW

Lead Temperature (Soldering, 4 seconds) 260

§

C

*Derate cavity package 9.6 mW/§C above 25§C; derate molded DIP package

10.9 mW/

§

C above 25§C; derate SO package 8.01 mW/§C above 25§C.

Operating Conditions

Min Max Units

Supply Voltage, (V

CC

)
DS7837 4.5 5.5 V
DS8837 4.75 5.25 V

Temperature (T

A

)

DS7837

b

55

a

125

§

C

DS8837 0

a

70

§

C

Electrical Characteristics

The following apply for V

MIN

s

V

CC

s

V

MAX,TMIN

s

T

A

s

T

MAX

, unless otherwise specified (Notes 2 and 3)

Symbol Parameter Conditions Min Typ Max Units

V

TH

High Level Receiver Threshold V

CC

e

Max DS7837 1.65 2.25 2.65 V

DS8837 1.80 2.25 2.50 V

V

TL

Low Level Receiver Threshold V

CC

e

Min DS7837 0.97 1.30 1.63 V

DS8837 1.05 1.30 1.55 V

I

IH

Maximum Receiver Input Current V

IN

e

4V V

CC

e

V

MAX

15.0 50.0 mA

V

CC

e

0V 1.0 50.0 mA

I

IL

Logical ‘‘0’’ Receiver Input Current V

IN

e

0.4V, V

CC

e

V

MAX

1.0 50.0 mA

V

IH

Logical ‘‘1’’ Input Voltage Disable 2.0 V

V

IL

Logical ‘‘0’’ Input Voltage Disable 0.8 V

I

IH

Logical ‘‘1’’ Input Current Disable Input V

IND

e

2.4V 80.0 mA

V

IND

e

5.5V 2.0 mA

I

IL

Logical ‘‘0’’ Input Current V

IN

e

4V, V

IND

e

0.4V, Disable Input

b

3.2 mA

V

OH

Logical ‘‘1’’ Output Voltage V

IN

e

0.5V, V

IND

e

0.8V,

2.4 V

I

OH

eb

400 mA

V

OL

Logical ‘‘0’’ Output Voltage V

IN

e

4V, V

IND

e

0.8V, I

OH

e

16 mA 0.25 0.4 V

I

OS

Output Short Circuit Current V

IN

e

0.5V, V

IND

e

0V, V

OS

e

0V,

b

18.0

b

55.0 mA

V

CC

e

V

MAX

, (Note 4)

I

CC

Power Supply Current V

IN

e

4V, V

IND

e

0V, (Per Package) 45.0 60.0 mA

V

CL

Input Clamp Diode V

IN

eb

12 mA, V

IND

eb

12 mA,

b

1.0

b

1.5 V

T

A

e

25§C

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