NSC DS14C535MSAX, DS14C535MSA Datasheet

DS14C535
+5V Supply EIA/TIA-2323x5Driver/Receiver

General Description

The DS14C535 is three driver, five receiver device which
conforms to EIA/TIA-232-E and CCITT (ITU-T) V.28 stan­dard specifications. This device employs an internal DC-DC
converter to generate the necessary output levels from a
+5V power supply. A SHUTDOWN (SD) mode reduces the
supply current to 10 µA maximum. In the SD mode, one re­ceiver is active, allowing ring indicator (RI) to be monitored.
PC Board space consumption isminimizedbythe availability
of Shrink Small Outline Packaging (SSOP).

The DS14C535 provides a one-chipsolution for the common
9-pin serial RS-232 interface between data terminal and
data circuit-terminating equipment.

This device allows an easy migration path to the 3.3V
DS14C335. The packages are the same. The N/C pins on
the DS14C535 are not physically connected to the chip.
Board layout for the DS14C335 will accommodate both de­vices.

This device’s low power requirement and small footprint
makes it an ideal choice for Laptop and Notebook applica­tions.

Features

n Pin compatible with DS14C335
n Conforms to EIA/TIA-232-E and CCITT (ITU-T) V.28

specifications

n Failsafe receiver outputs high when inputs open
n Operates with single +5V power supply
n Low power requirement — I

CC

12 mA maximum

n SHUTDOWN mode—I

CX

10 µA maximum

n One Receiver (R5) active during SHUTDOWN
n Operates up to 128 kbps—Lap-Link

®

Compatible

n 4V/µs minimum Slew Rate guaranteed
n ESD rating of 3 kV on all pins (H, B, M)
n Available in 28-lead SSOP EIAJ Type II package
n Only four 0.1 µF capacitors required for the DC-DC

converter

Connection Diagram Functional Diagram

Lap-Link®is a registered trademark of Traveling Software Inc.

DS14C535

DS011910-1

Order Number DS14C535MSA

See NS Package Number MSA28

DS011910-2

May 1998

DS14C535 +5V Supply EIA/TIA-2323x5Driver/Receiver

© 1999 National Semiconductor Corporation DS011910 www.national.com

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National SemiconductorSales Office/
Distributors for availability and specifications.

Supply Voltage (V

CC

) −0.3V to +6V

V

+

Pin (VCC− 0.3V) to +14V

V

−

Pin +0.3V to −14V

Input Voltage (D

IN

, SD) −0.3V to +5.5V

Driver Output Voltage (V

+

+0.3V) to (V−− 0.3V)

Receiver Input Voltage

±

25V

Receiver Output Voltage − 0.3V to (V

CC

+0.3V)
Junction Temperature +150˚C
Storage Temperature Range −65˚C to +150˚C
Lead Temperature (Soldering 4

sec.) +260˚C
Short Circuit Duration (D

OUT

) Continuous

Maximum Package Power Dissipation

@

+25˚C

SSOP MSAPackage 1286 mW

Derate MSA Package 10.3 mW/˚C above +25˚C

ESD Rating (HBM, 1.5 kΩ, 100
pF) ≥ 3.0 kV

Recommended Operating
Conditions

Min Max Units

Supply Voltage (V

CC

) 4.5 5.5 V

Operating Free Air Temperature (T

A

)

DS14C535 0 +70 ˚C
DC-DC Converter Capacitors (C1–C4)
Recommended range of values is 0.1 µF to 0.68 µF,

±

20%.
For more detail referto application informationsection ofthis
data sheet.

Electrical Characteristics (Notes 2, 3)

Over recommended operating conditions, SD=0.8V, unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Units
DEVICE CHARACTERISTICS

V

+

Positive Power Supply No Load D

IN

=

0.8V +8.5 V

V

−

Negative Power Supply C1–C4=0.1 µF D

IN

=

2.0V −7.0 V

I

CC

Supply Current No Load 12 mA

I

CX

SHUTDOWN Supply Current R

L

=

3kΩ,SD=V

CC

1.0 10 µA

V

IH

High Level Enable Voltage SD 2.0 V

V

IL

Low Level Enable Voltage GND 0.8 V

I

IH

High Level Enable Current 2.0V ≤ VIN≤ 5.5V +2.0 µA

I

IL

Low Level Enable Current GND ≤ VIN≤ 0.8V −2.0 µA

DRIVER CHARACTERISTICS

V

IH

High Level Input Voltage D

IN

2.0 V

V

IL

Low Level Input Voltage GND 0.8 V

I

IH

High Level Input Current 2.0V ≤ VIN≤ 5.5V +1.0 µA

I

IL

Low Level Input Current GND ≤ VIN≤ 0.8V −1.0 µA

V

OH

High Level Output Voltage R

L

=

3kΩ +5.0 8 V

V

OL

Low Level Output Voltage −6.7 −5.0 V

I

OS+

Output High Short V

O

=

0V, V

IN

=

0.8V (Note 7) −40 −20 −8 mA

Circuit Current

I

OS−

Output Low Short V

O

=

0V, V

IN

=

2.0V (Note 7) 6 15 40 mA

Circuit Current

R

O

Output Resistance −2V ≤ VO≤ +2V, V

CC

=

GND=0V 300 1200 Ω
RECEIVER CHARACTERISTICS (Note 4)
V

TH

Input High Threshold Voltage R1–R5, SD=0.8V (Active Mode) 1.4 2.4 V

R5, 2.0V ≤ SD ≤ 5.5V (Shutdown Mode) 2.0 2.8 V

V

TL

Input Low Threshold Voltage R1–R5, SD=0.8V (Active Mode) 0.8 1.1 V

R5, 2.0V ≤ SD ≤ 5.5V (Shutdown Mode) 0.8 1.1 V

V

HY

Hysteresis (Note 4) 0.15 1.0 V

R

IN

Input Resistance V

IN

=

±

3V to±15V 3.0 5.4 7.0 kΩ

I

IN

Input Current V

IN

=

+15V 2.14 5.0 mA

V

IN

=

+3V 0.43 1.0 mA

V

IN

=

−3V −1.0 −0.43 mA

V

IN

=

−15V −5.0 −2.14 mA

www.national.com 2

Electrical Characteristics (Notes 2, 3) (Continued)

Over recommended operating conditions, SD=0.8V, unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Units
RECEIVER CHARACTERISTICS (Note 4)

V

OH

High Level Output Voltage V

IN

=

−3V, I

OH

=

−2.0 mA 3.8 V

V

IN

=

−3V, I

OH

=

−20 µA 4.0 V

V

OL

Low Level Output Voltage V

IN

=

+3V, I

OL

=

+2.0 mA 0.23 0.4 V

Switching Characteristics (Note 4)

Over recommended operating conditions, SD=0.8V, unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Units

DRIVER CHARACTERISTICS

t

PLH

Propagation Delay LOW to HIGH R

L

=

3kΩ 0.1 0.6 1.0 µs

t

PHL

Propagation Delay HIGH to LOW C

L

=

50 pF 0.1 0.6 1.0 µs

t

SK

Skew |t

PLH–tPHL

|(

Figures 1, 2

) 0 0.2 µs

SR1 Output Slew Rate R

L

=

3kΩto7kΩ,C

L

=

50 pF (

Figure 2

) 4 13 30 V/µs

SR2 Output Slew Rate R

L

=

3kΩ,C

L

=

2500 pF (

Figure 2

) 4 10 30 V/µs

t

PLS

Propagation Delay LOW to SD (

Figures 5, 6

) 0.48 ms

t

PSL

Propagation Delay SD to LOW R

L

=

3kΩ 1.88 ms

t

PHS

Propagation Delay HIGH to SD C

L

=

50 pF 0.62 ms

t

PSH

Propagation Delay SD to HIGH 1.03 ms

RECEIVER CHARACTERISTICS

t

PLH

Propagation Delay LOW to HIGH C

L

=

50 pF 0.1 0.4 1.0 µs

t

PHL

Propagation Delay HIGH to LOW (

Figures 3, 4

) 0.1 0.6 1.0 µs

t

SK

Skew |t

PLH–tPHL

| 0.1 0.5 µs

t

PLS

Propagation Delay LOW to SD (

Figures 7, 8

) 0.13 µs

t

PSL

Propagation Delay SD to LOW R

L

=

1kΩ 1.0 µs

t

PHS

Propagation Delay HIGH to SD C

L

=

50 pF 0.19 µs

t

PSH

Propagation Delay SD to HIGH R1–R4 Only 0.58 µs

Note 1: “Absolute Maximum Ratings”are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.

Note 2: Typical values are given for V

CC

=

5V and T

A

=

+25˚C.

Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise speci­fied. For voltage logic levels, the more positive value is designated as maximum. For example, if −5V is a maximum, the typical value (−6.7V) is more negative.

Note 4: Receiver characteristics are guaranteed for SD=0.8V. When SD=2.0V, receiver five (R5) is activeand meets receiverparameters in SHUTDOWN (SD)
mode, unless otherwise specified.

Note 5: Generator characteristics for driver input: f=64 kHz (128 kbits/sec), t

r

=

t

f

<

10 ns, V

IH

=

3V, V

IL

=

0V, duty cycle=50%.

Note 6: Generator characteristics for receiver input: f=64 kHz (128 kbits/sec), t

r

=

t

f

<

10 ns, V

IH

=

3V, V

IL

=

−3V, duty cycle=50%.

Note 7: Only one driver output shorted at a time.

Parameter Measurement Information

DS011910-3

FIGURE 1. Driver Propagation Delay and Slew Rate Test Circuit

www.national.com3