NSC 5962-9209001M3A, 54F827SDMQB Datasheet

TL/F/9598
54F/74F827
#
74F828 10-Bit Buffers/Line Drivers
December 1994
54F/74F827#74F828 10-Bit Buffers/Line Drivers
General Description
The ’F827 and ’F828 10-bit bus buffers provide high per­formance bus interface buffering for wide data/address paths or buses carrying parity. The 10-bit buffers have NOR output enables for maximum control flexibility.
The ’F827 and ’F828 are functionally- and pin-compatible to AMD’s Am29827 and Am29828. The ’F828 is an inverting version of the ’F827.
Features
Y
TRI-STATEÉoutput
Y
’F828 is inverting
Y
Direct replacement for AMD’s Am29827 and Am29828
Commercial Military
Package
Package Description
Number
74F827SPC N24C 24-Lead (0.300×Wide) Molded Dual-In-Line
54F827SDM (Note 2) J24F 24-Lead (0.300×Wide) Ceramic Dual-In-Line
74F827SC (Note 1) M24B 24-Lead (0.300×Wide) Molded Small Outline, JEDEC
54F827FM (Note 2) W24C 24-Lead Cerpack
54F827LM (Note 2) E28A 24-Lead Ceramic Leadless Chip Carrier, Type C
74F828SPC N24C 24-Lead (0.300×Wide) Molded Dual-In-Line
74F828SC (Note 1) M24B 24-Lead (0.300×Wide) Molded Small Outline, JEDEC
Note 1: Devices also available in 13×reel. Use suffixeSCX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix
e
SDMQB, FMQB and LMQB.
Connection Diagrams
Pin Assignment for
DIP, Flatpak and SOIC
Pin Assignment
for LCC
’F827
TL/F/9598– 1
’F828
TL/F/9598– 8
’F827
TL/F/9598– 2
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.
Logic Symbols
IEEE/IEC
’F827
TL/F/9598– 6
IEEE/IEC
’F828
TL/F/9598– 7
’F827
TL/F/9598– 3
’F828
TL/F/9598– 10
2
Unit Loading/Fan Out
54F/74F
Pin Names Description
U.L. Input I
IH/IIL
HIGH/LOW Output IOH/I
OL
OE1,OE2Output Enable Input 1.0/1.0 20 mA/b0.6 mA D
0–D7
Data Inputs 1.0/1.0 20 mA/b0.6 mA
O
0–O7
Data Outputs, TRI-STATE 600/106.6 (80)b12 mA/64 mA (48 mA)
Functional Description
The ’F827 and ’F828 are line drivers designed to be em­ployed as memory address drivers, clock drivers and bus­oriented transmitters/receivers which provide improved PC board density. The devices have TRI-STATE outputs con­trolled by the Output Enable (OE
) pins. The outputs can sink 64 mA (48 mA mil) and source 15 mA. Input clamp diodes limit high-speed termination effects.
Function Table
Inputs Outputs
OE D
n
O
n
Function
’F827 ’F828
L H H L Transparent L L L H Transparent H X Z Z High Z
HeHIGH Voltage level L
e
LOW Voltage Level
Z
e
High Impedance
X
e
Immaterial
Logic Diagrams
’F827
TL/F/9598– 4
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
’F828
TL/F/9598– 11
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
3
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