NSC 5962-9081201MPA, 5962-9081201MGA Datasheet
LM6121/LM6221/LM6321
High Speed Buffer
General Description
These high speed unity gain buffers slew at 800 V/µs and
have a small signal bandwidth of 50 MHz while driving a 50Ω
load. They can drive
±
300 mA peak and do not oscillate
while driving large capacitive loads. The LM6121 family are
monolithic ICs which offer performance similar to the
LH0002 with the additional features of current limit and thermal shutdown.
These buffers are built with National’s VIP
™
(Vertically Integrated PNP) process which provides fast PNP transistors
that are true complements to the already fast NPN devices.
This advanced junction-isolated process delivers high speed
performance without the need for complex and expensive dielectric isolation.
Features
n High slew rate: 800 V/µs
n Wide bandwidth: 50 MHz
n Slew rate and bandwidth 100%tested
n Peak output current:
±
300 mA
n High input impedance: 5 MΩ
n LH0002H pin compatible
n No oscillations with capacitive loads
n 5V to
±
15V operation guaranteed
n Current and thermal limiting
n Fully specified to drive 50Ω lines
Applications
n Line Driving
n Radar
n Sonar
Simplified Schematic
VIP™is a trademark ofNational Semiconductor Corporation.
DS009223-1
Numbers in ( ) are for 8-pin N DIP.
May 1998
LM6121/LM6221/LM6321 High Speed Buffer
© 1999 National Semiconductor Corporation DS009223 www.national.com
Connection Diagrams
Plastic DIP
DS009223-2
*Heat-sinking pins. See Application section on heat sinking requirements.
Order Number LM6221N,
LM6321N or LM6121J/883
See NS Package
Number J08A or N08E
Metal Can
DS009223-3
Note: Pin 6 connected to case.
Top View
Order Number LM6221H or
LM6121H/883
See NS Package
Number H08C
Plastic SO
DS009223-7
*Pin 3 must be connected to the negative supply.
**Heat-sinking pins. See Application section on heat-sinking requirements.
These pins are at V
−
potential.
Order Number LM6321M
See NS Package Number M14A
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage 36V (
±
18)
Input to Output Voltage (Note 2)
±
7V
Input Voltage
±
Vsupply
Output Short-Circuit to GND Continuous
(Note 3)
Storage Temperature Range −65˚C to +150˚C
Lead Temperature
(Soldering, 10 seconds) 260˚C
Power Dissipation (Note 10)
ESD Tolerance (Note 8)
±
2000V
Junction Temperature (T
J(max)
) 150˚C
Operating Ratings
Operating Temperature Range
LM6121H/883 −55˚C to +125˚C
LM6221 −40˚C to +85˚C
LM6321 0˚C to +70˚C
Operating Supply Range 4.75 to
±
16V
Thermal Resistance (θ
JA
), (Note 4)
H Package 150˚C/W
N Package 47˚C/W
M Package 69˚C/W
Thermal Resistance (θ
JC
), H Package 17˚C/W
DC Electrical Characteristics
The following specifications apply for Supply Voltage
=
±
15V, V
CM
=
0, R
L
≥ 100 kΩ and R
S
=
50Ω unless otherwise noted.
Boldface limits apply for T
A
=
T
J
=
T
MIN
to T
MAX
; all other limits T
A
=
T
J
=
25˚C.
Symbol Parameter Conditions Typ LM6121 LM6221 LM6321 Units
Limit Limit Limit
(Notes 5, 9) (Note 5) (Note 5)
A
V1
Voltage Gain 1 R
L
=
1kΩ,V
IN
=
±
10V 0.990 0.980 0.980 0.970
0.970 0.950 0.950
A
V2
Voltage Gain 2 R
L
=
50Ω,V
IN
=
±
10V 0.900 0.860 0.860 0.850 V/V
0.800 0.820 0.820 Min
A
V3
Voltage Gain 3 R
L
=
50Ω,V
+
=
5V 0.840 0.780 0.780 0.750
(Note 6) V
IN
=
2V
pp
(1.5 Vpp) 0.750 0.700 0.700
V
OS
Offset Voltage R
L
=
1kΩ 15 30 30 50 mV
50 60 100 Max
I
B
Input Bias Current R
L
=
1kΩ,R
S
=
10 kΩ 14 45µA
777Max
R
IN
Input Resistance R
L
=
50Ω 5MΩ
C
IN
Input Capacitance 3.5 pF
R
O
Output Resistance I
OUT
=
±
10 mA 3 5 5 5 Ω
10 10 6 Max
I
S1
Supply Current 1 R
L
=
∞
15 18 18 20 mA
Max
20 20 22
I
S2
Supply Current 2 R
L
=
∞
,V
+
=
5V 14 16 16 18
18 18 20
V
O1
Output Swing 1 R
L
=
1k 13.5 13.3 13.3 13.2
13 13 13
V
O2
Output Swing 2 R
L
=
100Ω 12.7 11.5 11.5 11
±
V
10 10 10 Min
V
O3
Output Swing 3 R
L
=
50Ω 12 11 11 10
999
V
O4
Output Swing 4 R
L
=
50Ω,V
+
=
5V 1.8 1.6 1.6 1.6 V
PP
(Note 6) 1.3 1.4 1.5 Min
PSSR Power Supply V
±
=
±
5V to±15V 70 60 60 60 dB
Rejection Ratio 55 50 50 Min
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