Nokia Customer Care
7 - System Module
Issue 1 01/2005 COMPANY CONFIDENTIAL
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Nokia Customer Care 7 - System Module
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Table of Contents
Page No
Glossary of Terms............................................................................................... 7
Baseband...........................................................................................................10
Block diagram .................................................................................................. 11
Environmental Specifications.......................................................................... 13
Absolute maximum ratings............................................................................... 13
Temperature conditions................................................................................... 13
Humidity and water resistance......................................................................... 13
Frequencies in baseband................................................................................. 14
PWB................................................................................................................. 14
Characteristics of the PWB ............................................................................14
Key components ............................................................................................14
Technical Specifications .................................................................................. 16
Baseband core................................................................................................. 16
UPP ................................................................................................................16
UEMEK ..........................................................................................................16
External SRAM and Flash ..............................................................................17
Energy management........................................................................................ 17
Modes of operation ........................................................................................17
No Supply ......................................................................................................17
Backup ...........................................................................................................17
Acting Dead ...................................................................................................17
Active .............................................................................................................18
Sleep Mode ....................................................................................................18
Charging ........................................................................................................18
Power distribution ............................................................................................ 18
DC characteristics............................................................................................ 19
Supply voltage ranges ...................................................................................19
Baseband regulators ......................................................................................20
Function Groups ............................................................................................... 21
Battery.............................................................................................................. 21
Audio................................................................................................................ 21
Internal microphone ....................................................................................... 21
Internal speaker ............................................................................................. 22
IHF speaker ...................................................................................................23
External audio ................................................................................................23
External microphone connection ....................................................................23
Headset connections .....................................................................................23
Test possibilities .............................................................................................23
Camera............................................................................................................ 23
Key features ...................................................................................................24
Specifications .................................................................................................25
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CCP bus .........................................................................................................25
CCI bus ..........................................................................................................25
UIF bus ..........................................................................................................26
Clocks ............................................................................................................26
Test possibility ...............................................................................................26
Vibra................................................................................................................. 26
Test possibility ...............................................................................................26
LCD module..................................................................................................... 27
Characteristics ...............................................................................................27
LCD connector ............................................................................................... 28
Test possibility ...............................................................................................29
Keypad............................................................................................................. 30
Test possibility ...............................................................................................30
Illumination....................................................................................................... 30
Test possibility ...............................................................................................31
SIM................................................................................................................... 31
Test possibility ...............................................................................................32
IR Module......................................................................................................... 32
Interfaces ...........................................................................................................33
BB-RF interface ............................................................................................... 33
System connector interface ............................................................................. 33
System connector ..........................................................................................33
ACI .................................................................................................................34
FBUS .............................................................................................................34
VOUT .............................................................................................................34
DC plug .......................................................................................................... 35
Component Replacement Hints....................................................................... 36
Power switch (S2419)...................................................................................... 36
Helgo RF-chip (N7500).................................................................................... 37
Camera socket (X1470)................................................................................... 38
Hardware accelerator (D1470)......................................................................... 39
UEM (D2800)................................................................................................... 39
Flash (D3000) .................................................................................................. 40
SIM card reader (X2700) ................................................................................. 40
System connector (X2002) .............................................................................. 41
UEM (D2200)................................................................................................... 41
Battery connector (X2000)............................................................................... 42
Label placement............................................................................................... 43
RF Module Description.....................................................................................44
General specifications of the transceiver......................................................... 45
Frequency concept .......................................................................................... 46
RF power supply configuration ........................................................................ 46
RF block diagram............................................................................................. 47
Antenna switch (TX/RX switch)........................................................................ 48
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Receiver .........................................................................................................49
Transmitter .....................................................................................................49
Frequency synthesizer ...................................................................................49
Signal paths..................................................................................................... 50
Receiver signal paths .....................................................................................50
Transmitter signal paths .................................................................................52
Frequency synthesizer signals .......................................................................53
Printed Wiring Board ........................................................................................ 54
RF key component placement ......................................................................... 55
Differentiation between 900 MHz and 850 MHz (US) version
(RM-30 vs. RM-31) .............................................................................................58
Antenna radiator (I039) and deco foil (I041).................................................... 58
RF components................................................................................................ 59
MCU-SW.............................................................................................................61
Tuning.............................................................................................................. 61
Flash exchange ................................................................................................. 62
Tuning and testing .........................................................................................63
Power Amplifier / Antenna Switch Exchange / SAW Filter............................ 65
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Glossary of Terms
ACI Accessory Control Interface
ADC Analogue to Digital Converter
AFC Automatic Frequency Control
ASIC Application Specific Integrated Circuit
ASM Antenna switch module
BB Baseband
BSI Battery Size Indicator
DCT4 Digital Core Technology, generation 4
DSP Digital Signal Processor
DUT Device under test
EDGE Enhanced Data Rates for Global Evolution
EGPRS Enhanced General Packed Radio Service
EMC Electro Magnetic Compatibility
ESD Electro Static Discharge
FC Functional Cover
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packed Radio Service
GSM Global System for Mobile Communication
GSM900 GSM900 (channels 1 - 124)+extended GSM900
(channels 975 - 1023, 0)
HSCSD High Speed Circuit Switched Data
HW Hardware
IF Interface
IHF Integrated Hands Free
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IMEI International Mobile Equipment Identity
I/O Input/Output
IR Infrared
IrDA Infrared Data Association
LCD Liquid Crystal Display
LED Light Emitting Diode
LDO Low Drop Out
LNA Low Noise Amplifier
LO Local Oscillator
MCU Micro Controller Unit
PA Power Amplifier
Phoenix SW tool of DCT4
PLL Phase Locked Loop
PWB Printed Wired Board
RF Radio Frequency
RTC Real Time Clock
RX Receiver
SA Spectrum analyzer
SIM Subscriber Identification Module
SW Software
TP Test point
TX Transmitter
UEMEK Universal Energy Management ASIC enhanced version
UI User Interface
UPP Universal Phone Processor
USB Universal Serial Bus
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VBU
<COFF>
Back-up Battery Cut Off voltage (typical: 2.0 V)
VCO Voltage controlled oscillator
VCTCXO Voltage controlled temperature compensated oscillator
V
<MSTR+>
Master Reset Threshold (typical: 2.1 V)
8-PSK Phase Shift Keying with 8 states (Modulation scheme for EDGE/
GPRS)
Issue 1 01/2005 COMPANY CONFIDENTIAL 9
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Baseband
The RM-30 product is a DCT4.5 Expression segment phone. There are two variants: An
EGSM900/GSM1800/GSM1900 phone and a US variant, RM-31, with GSM850/1800/1900.
The HW has the following features:
• GPRS and HSCSD with EDGE in up to (2RX + 2TX) (MCS5), without EDGE also
in (3RX + 1TX) (MCS6)
• DCT4 with AMR and 16 MIDI tones
• 128/16 Mbit Combo memory
• Amazon Active display with 64k colours
• Battery BL-5B
• Illuminated XPress on grips
• PopPort
TM
interface
• 5-way navigation key with select
• FCI rear side (C-cover)
•VGA Camera
•Vibra
•IHF
The RM-30 BB is based on the DCT4/4.5 engine and is compatible to the PopPort
ries. The DCT4/4.5 engine consists basically of two ASICs. The UEMEK (Universal Energy
Management IC including voltage regulators, charge control and audio circuit s, audio IFH amplifier from DCT4.5) and the UPP (Universal Phone Processor including MCU, DSP and RAM
from DCT4).
TM
accesso-
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■ Block diagram
Figure 1:Baseband block diagram
UEMEK supplies both baseband and RF with power via built in voltage regulators, which are
connected to the battery . The RF pa rts use mainly 2.78 V and the baseband p arts 1.8V I/O voltage. The UPP core is supplied with programmable core voltage of 1.0V, 1.3V or 1.5V . UEMEK
includes 7 linear LDO (Low Drop-Out) regulators for baseband and 7 regulators for RF. It also
includes 4 current sources for biasing purposes and internal usage. The UEMEK is furthermore
supplying the SIM interface with a programmable voltage of 1.8V or 3V.
Note: 5V SIM cards are no longer supported by DCT-4 generation Baseband.
UPP operates from a 26 MHz clock coming from the RF ASIC Helgo. The clock signal is divided
by two down to the nominal system clock frequency of 13 MHz. The DSP and MCU contain
PLLs, which can multiply the system clock to a higher frequency.
A real time clock function is integrated into the UEMEK, which utilizes the same 32kHz clock
supply as the sleep clock.
The communication between UEMEK and UPP is implemented using two bi-directional serial
busses, CBUS and DBUS. The CBUS is controlled by the MCU and operates at a speed of 1
MHz. The DBUS is controlled by the MCU and operates at a speed of 13 MHz. Both processors
are located in the UPP.
Issue 1 01/2005 COMPANY CONFIDENTIAL 11
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The UEMEK ASIC handles the analog interface between the Baseband and the RF section.
UEMEK provides A/D and D/A conversion of the in-phase and quadrature receive and transmit
signal paths and also A/D and D/A conversions of received and transmitted audio signals to
and from the user interface. The UEMEK supplies the analog TXC and AFC sign als to the RF
section according to UPP signal control. There are also separate signals for PDM coded audio.
Digital speech processing is handled by the DSP inside UPP ASIC.
UEMEK is a dual voltage circuit, the digital parts are running from the baseband supply 1.8V
and the analog parts are running from the analog supply 2.78V or backup battery. Also VBAT
is directly used (Vibra, LED-driver, Camera Regulator).
The Baseband supports both internal and external microphone inputs and speaker outputs.
Keypad tones, DTMF , and other audio tones are generated and encoded by the UPP and transmitted to the UEMEK for decoding. An external vibra alert control signals are generated by the
UEMEK with separate PWM outputs.
EMC shielding is implemented using a soldered shielding, RF cans and PWB grounding.
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Environmental Specifications
■ Absolute maximum ratings
Table 1: Absolute maximum ratings
Signal Note
Battery Voltage (Idle) -0.3…5.5V
Battery Voltage (Call) Max 4.8V
Charger Input Voltage -0.3V …16V
■ Temperature conditions
Table 2: Temperature conditions
Condition Min Max
Normal operating temperature -10°C+55°C
Reduced functionality -25°C+75°C
Storage -40°C+85°C
■ Humidity and water resistance
Table 3: Humidity conditions
Condition Min Max
Relative Humidity 5% 95%
The module is not protected against water.
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■ Frequencies in baseband
Table 4: Frequencies in baseband
Frequency Context UPP UEMEK Flash SIM Comment
32 kHz SleepClk X
1 MHz CBUS X X
Up to 1 MHz RFConvClk X X Estimation
6,5 MHz Display IF X
3,25 MHz SIMIF X X Min
13 MHz DBUS, RFBUClik X X
26 MHz RF Clk X
52 MHz Memory Clock X X
■ PWB
Characteristics of the PWB
•Single PWB
• 8 layer board
• Double side assembled
Key components
Figure 2:Key components
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Table 5: Key components
Position Component Name
D1470 HW Accelerator
D2800 UPP8M V4.2E
D2200 UEMEKv2.0
D3000 Combo Memory (128M NOR + 16M
UTRAM)
Issue 1 01/2005 COMPANY CONFIDENTIAL 15
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Technical Specifications
■ Baseband core
UPP
Main characteristics of the used UPP are:
• DSP, LEAD3 16 bit DSP core 32 bit IF max. 200 MHz
• MCU based on ARM7 RISC MCU core max 50 MHz
• Internal 8 Mbit SRAM (PDRAM)
• General purpose UARTS
• SIM card interface
• Accessory interface (ACI)
• Interface control for Keypad, LCD, Audio and UEM control
• Handling of BB-RF Interface
UEMEK
Main characteristics of the used UEMEK are:
• ACI support
• Audio codec
• 11 Channel A/D converter
• Auxiliary A/D converter
• 32 KHz crystal oscillator
• SIM interface and drivers
• Security logic
• Storage of IMEI code
• Buzzer and vibra motor drivers
•PWM
• 2 LED drivers, keyboard and display backlight drivers
• Voltage reference for analogue blocks
• Charging function
• Baseband regulators
• RF regulators
• RF interface converters
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External SRAM and Flash
The Combo-Memory is a multi chip package memory which combines 128 Mbit (8Mx1 6) muxed
burst multibank flash and 16 Mbit muxed CMOS PSRAM (Pseudo SRAM: DRAM with SRAM
interface).
The combo is supplied by single 1,8 V for read, write and erase operations. For accelerated
flash programming, Vpp = 9.0 V has to be applied to VPP input of the combo device.
The combo memory is housed in a 44-ball FBGA.
■ Energy management
The energy management of RM-30 is based on BB 4.0 architecture. A so-called semi fixed battery (BL-5B) supplies power primarily to UEMEK ASIC and the RF PA. The UEMEK includes
several regulators to supply RF and Baseband. It provides energy management including power up/down procedure.
Modes of operation
The baseband engine has six different functional modes: Since the UEMEK controls the regulated power distribution; each of these states affects the general functionality of the phone.
1. No supply
2. Backup
3. Acting Dead
4. Active
5. Sleep
6. Charging
No Supply
In NO_SUPPLY mode, the phone has no supply volt age. This mode is due to the disconnection
of the main battery and backup battery or low battery voltage level in both of the batteries.
The phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is detected.
The battery voltage can rise either by connecting a new battery with VBA T > V
necting charger and charging the battery above V
MSTR+
.
MSTR+
or by con-
Backup
In BACKUP mode the backup battery has suf ficient charge but the main battery can be discon-
nected or empty (VBAT < V
The VTRC regulator is disabled in BACKUP mode. VRTC output is supplied witho ut regulation
from the backup battery (VBACK). All the other regulators are disabled.
and VBACK > VBU
MSTR
COFF
).
Acting Dead
If the phone is off when the charger is connected, the phone is powered on but enters a state
called ”Acting Dead”. To the user, the phone acts as if it was switched off. A battery-charging
alert is given and/or a battery charging indication on the display is shown to acknowledge the
user that the battery is being charged.
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Active
In Active mode, the phone is in normal operation, scanning for channels, listing to a base station, transmitting and processing information.
Sleep Mode
Sleep mode is entered when both MCU and DSP are in stand–by mode. Both processors control the sleep mode.
The sleep mode is exited either by the expiration of a sleep clock counter in the UEMEK or by
some external interrupt, generated by a charger connection, key press, headset connection
etc.
In the sleep mode, VCTCXO is shut down and 32 kHz sleep clock oscillator is used as reference clock for the Baseband.
Charging
In RM-30, the battery type/size is indicated by a BSI-resistor. The resistor value corresponds
to a specific battery capacity. Also BTEMP, NTC resistor, is located on an engine board.
The battery voltage, temperature, size and current are measur ed by the UEMEK controlle d by
the charging software running in the UPP.
The charging control circuitry (CHACON) inside the UEMEK controls the charging current delivered from the charger to the battery . The battery volt age rise is limited by turning the UEMEK
switch off when the battery voltage has reached 4.2 V. Charging current is monitored by measuring the voltage drop across a 220 mΩ resistor.
■ Power distribution
Under normal conditions, the battery powers the baseband module. Individual regulators located within the UEMEK regulate the battery voltage VBAT. These regulators supply the different
parts of the phone. 7 regulators are dedicated to the RF module and 7 to the baseband module.
The VSIM regulator is able to deliver both 1,8V and 3,0 V DC and thus supporting two different
SIM technologies.
The system connector provides a voltage to supply accessories.
The white LEDs need a higher voltage supply than the battery can supply and are fed by a sep-
arate external voltage regulator.
VBAT is directly distributed to the RF power amplifier, FCI and external baseband regulators.
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Figure 3:Power Distribution Diagram
■ DC characteristics
Supply voltage ranges
Signal Min Nom Max Note
VBAT 3.1V 3.7V 4.2V 3.2V SW cut off
Table 6: Battery voltage ranges
2.95V HW power off
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Baseband regulators
Table 7: Regulator specification
Regulator
Load current
(mA)
Limit (V) Min/Max (Typ)
VCORE 200 1.476 / 1.65 (1.57)
VIO 150 1.72 / 1.88 (1.8)
VSIM1 25 1.745 / 1.855 (1.8)
VANA 80 2.70 / 2.86 (2.78)
VFLASH1 70 2.70 / 2.86 (2.78)
VAUX2 70 2.70 / 2.86 (2.78)
VAUX3 10 2.70 / 2.86 (2.78)
VR2 100 2.70 / 2.86 (2.78)
VR3 20 2.70 / 2.86 (2.78)
VR4 50 2.70 / 2.86 (2.78)
VR5 50 2.70 / 2.86 (2.78)
VR6 50 2.70 / 2.86 (2.78)
VR7 45 2.70 / 2.86 (2.78)
VR1A 5* 4.6 / 4.9 (4.75)
VR1B 5* 4.6 / 4.9 (4.75)
* When both enabled. Load current is 10 mA if other is disabled.
Note: This list shows the band regulators only. Please see other descriptions in th e Glossary of
Terms and in the dedicated sections.
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Function Groups
■ Battery
A battery of the type BL-5B is used. It is a Li Ion based standard cell. The battery capacity is
760mAh.
The battery has a three-pin connector. In order to get temperature information of the battery,
the NTC mounted on the PWB within the BB area is used.
Ni based batteries are not supported.
The BSI resistor has a nominal value of 75 kOhm.
Figure 4:Battery BL-5B
■ Audio
Internal microphone
The internal microphone capsule is mounted to in the PopPortTM system connector . The microphone is omni directional and it’s connected to the UEMEK microphone input MIC1P/N. The
microphone input is symmetric and the UEMEK (MICB1) provides bias voltage. The microphone input on the UEMEK is ESD protected. Spring contacts are used to connect the microphone to the PWB.
Issue 1 01/2005 COMPANY CONFIDENTIAL 21
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