Nokia 5100 Service Manual

Customer Care Europe Middle East & Africa NPM-6 / 5100 Repair Hints SCCE Training Group Version 1.0 Approved 2003 Nokia Mobile Phones
CONFIDENTIAL
19.05.2003
1 (12)
Repair Hints
Service-Level 3 & 4
5100
NPM-6
© NMP 2003
SCCE Training Group
Approved by: CC Europe & Africa
CONFIDENTIAL
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Customer Care Europe Middle East & Africa NPM-6 / 5100 Repair Hints SCCE Training Group Version 1.0 Approved 2003 Nokia Mobile Phones
19.05.2003
GENERAL
-How to use this document
Put the colored schematics behind this manual. Now you are able to follow these specifications with graphical layouts and it is easier for you to find the components and measuring points.
-Component characteristics
Some components contain important data such as tuning values or security data; therefore several steps described are only feasible if you are able to reflash/ realign the phone and/or rewrite IMEI/SIMlock in certain cases. Please pay attention to separate notes.
-Broken balls / underfill, µBGAs
All replaceable (not underfilled) µBGA components must be renewed after removing. Reflow with uncontrolled hot air fan is strictly forbidden! µBGA must only be soldered with NMP approved µBGA rework machines (e.g. Zevac / OK-Metcal / Martin) to get durable soldering joints. After removing a µBGA, check soldering points; if necessary rework oxidated solderings (broken balls) carefully by tinplating these areas with few flux and a hot soldering iron. Before placing a new component remove the tin and clean the PCB, e.g. with help of solder wick and flux cleaner such as “Kontakt LR”. Use only recommended flux type and an appropriate amount of it – avoid drowning the PCB in flux as this will result in additional faults! Also check underfilled parts for broken underfill material below. In this case, carefully evaluate possible repair actions as the phone probably was exposed to strong mechanical stress.
“rework” done with uncontrolled hot air PCB drowned in flux Oxidated solderings
© NMP 2003
SCCE Training Group
Approved by: CC Europe & Africa
CONFIDENTIAL
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Customer Care Europe Middle East & Africa NPM-6 / 5100 Repair Hints SCCE Training Group Version 1.0 Approved 2003 Nokia Mobile Phones
19.05.2003
-PCB handling & cleaning
To avoid damages of PCB and/or components through electrostatic discharging, handle the module in ESD Area only as shown on page 5 / “ESD protection requirements”. When handling PCBs outside an ESD-bag always wear ESD-bracelets, which must be connected to earth bonding point. Damage by electrostatic discharge often leads to a module not failing directly but in a short period of time! For cleaning use only appropriate materials, do not use scratching or rubbing tools. Useful tools for cleaning are flux cleaners such as “Kontakt LR” or “Electrolube FLU” in connection with ionized compressed air. For shield disassembling or any other work on the PCB it is very important to place the PCB into the rework jig MJS-72 (NMP-code 0775325) to prevent damaging the LEDs – the pads, the LEDs are connected with to the PCB, are turn off by applying only little pressure onto the PCB!!!
-Realign after repair
Characteristics of replacement parts may vary. To prevent additional faults after repair (e.g. low standby time, losing network etc.) it is necessary to retune phone values after repair, but never try to cover up a fault by adjusting the phone settings!
-Fault report in fault log (Phoenix)
It is very important to report all repaired failures in fault log after finishing the complete phone repair. The report content should only In this case the report content should contain the symptom code that is given from the customer e.g “Does not switch on”(2101) and the faultcode“no fault found”(470). If the symptom code from the customer is not the same as the observed symptom, always use the self-observed symptom code.
contain the self-observed fault symptom, except “no fault found”.
© NMP 2003
SCCE Training Group
Approved by: CC Europe & Africa
CONFIDENTIAL
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Customer Care Europe Middle East & Africa NPM-6 / 5100 Repair Hints SCCE Training Group Version 1.0 Approved 2003 Nokia Mobile Phones
19.05.2003
-Shieldings, screw torques
To avoid RF-problems it is not allowed to reuse any shielding that once having been removed from shielding frame. Always use new shieldings after successful repair! Also the C-Cover (9458479) can only be used twice!
To assemble the phone after a succesfull repair it is necessary to use a T6 screwdriver with a torque range of minimum 40 Ncm. Suitable torque screwdrivers must be ordered locally. Refer to SB006 for more information.
The screwdriver torque must be adjusted to 40 Ncm for the screws 1, 2, 3 & 4. For the screws 5&6 the screwdriver torque must be adjusted to 25 Ncm (see picture “Torque adjustment”).
“Torque adjustment”
“Assemble order”
Notice the tightening order to assemble the phone (from 1 to 6) as shown in the picture “Assemble order”! To disassemble the phone proceed in reverse order (from 6 to 1) and use a T6 screwdriver without torque for this!
Note: All screws can be assembled only once. Always use new screws for assembling.
© NMP 2003
SCCE Training Group
Approved by: CC Europe & Africa
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