Nokia 5100 Service Manual 07 npm6_6x sys

Customer Care Solutions
NPM-6/6X Series Transceivers
System Module and User
Interface
Issue 2 06/03 Nokia Corporation.
NPM-6/6X
System Module and User Interface CCS Technical Documentation
Page 2 Nokia Corporation. Issue 2 06/03
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CCS Technical Documentation System Module and User Interface
Table of Contents
Page No
Glossary of Terms.......................................................................................................... 5
Introduction.................................................................................................................... 8
Electrical Modules .......................................................................................................8
Interconnection Diagram .............................................................................................8
Temperature Conditions ..............................................................................................9
Humidity ......................................................................................................................9
System Module ............................................................................................................ 10
Baseband Module ......................................................................................................10
Block Diagram ........................................................................................................ 11
Technical Summary ...................................................................................................11
DC Characteristics................................................................................................... 12
External and Internal Signals and Connections .........................................................15
Digital Signals ......................................................................................................... 15
Analogue Signals..................................................................................................... 16
Keyboard (board-to-board) Connector.................................................................... 17
LCD Connector (Board to Board)........................................................................... 19
DC Connector.......................................................................................................... 20
Bottom Connector ................................................................................................... 20
SIM connector ......................................................................................................... 22
Internal Signals and Connections............................................................................ 23
Headset connector ................................................................................................... 24
Functional Description................................................................................................. 25
Modes of Operation ...................................................................................................25
No Supply................................................................................................................ 25
Back-up ................................................................................................................... 25
Acting Dead............................................................................................................. 25
Active ...................................................................................................................... 25
Sleep Mode.............................................................................................................. 26
Charging .................................................................................................................. 26
Battery ..................................................................................................................... 26
Power Up and Reset..................................................................................................... 28
A/D Channels............................................................................................................... 28
FM Radio ...................................................................................................................30
IR Module ............................................................................................................... 30
Backup Battery........................................................................................................ 30
SIM Interface........................................................................................................... 30
ACI .......................................................................................................................... 31
External Accessory Regulator................................................................................. 32
External Audio ...........................................................................................................32
internal Audio ............................................................................................................33
IHF Speaker & Stereo Audio Amplifier ................................................................. 33
Internal Microphone................................................................................................ 34
Internal Speaker....................................................................................................... 34
Memory Block ...........................................................................................................35
Security.................................................................................................................... 35
Clock distribution ......................................................................................................35
Audio Control.......................................................................................................... 36
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Accessory identification and Power Supply............................................................ 37
RF Module ................................................................................................................... 38
RF Frequency Plan .................................................................................................. 39
DC characteristics ......................................................................................................40
Regulators................................................................................................................ 40
Power Distribution .................................................................................................. 41
RF characteristics .......................................................................................................42
Transmitter characteristics ...................................................................................... 42
Receiver characteristics........................................................................................... 43
RF Block Diagram .................................................................................................. 43
RF Block Diagram NPM-6/6X ............................................................................... 44
Frequency synthesizers ........................................................................................... 45
Receiver................................................................................................................... 45
Transmitter .............................................................................................................. 46
Front End................................................................................................................. 47
Power Amplifier...................................................................................................... 48
RF ASIC Helga ....................................................................................................... 49
AFC function........................................................................................................... 49
Antenna .................................................................................................................. 49
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Glossary of Terms

ACCIf Accessory Interface block of MAD2WD1
ACI Accessory Control Interface
ADC Analog-Digital Converter
AEC Acoustic Echo Canceller
AFC Automatic Frequency Control
AEM Auxiliary Energy Management ASIC
AGC Automatic Gain Control
AIF Application Interface
ALWE Background noise suppressor
API Application Programming Interface
ARM Processor architecture
ASIC Application Specific Integrated Circuit
BB Baseband
BT Bluetooth
CBus Control Bus connecting UPP_WD2 with AEM and UEM
CCONT Power management IC for digital phones
CCI Camera Control Interface
CCP Compact Camera Port
CIS PCMCIA Card Information Structure
CMT Cellular Mobile Telephone (MCU and DSP)
CPU Central Processing Unit
CTSI Clocking Timing Sleep Interrupt
COBBA_GJP DCT3 RF-interface and audio codec ASIC with serial MAD interface
CSP Chip Scale Package
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DAC Digital-Analog Converter
DAI Digital Audio Interface
DB Dual band
DCT3 Digital Core Technology, 3rd generation
DCN Offset Cancellation control signal
DLL Dynamic Link Library
DRC Dynamic Range Controller
DSP Digital Signal Processor
EGSM Extended – GSM
EFR Enhanced Full Rate
EGPRS Enhanced General Packet Radio Service
EMC Electromagnetic compatibility
EMI Electromagnetic Interference
EXT RF External RF
FBUS Asynchronous Full Duplex Serial Bus
GPRS General Packet Radio Service
GSM Global System for Mobile communications
HS Half Rate Speech
HSCSD High Speed Circuit Switched Data
IC Integrated Circuit
I/O Input/Output
IrDA Infrared Association
LCD Liquid Crystal Display
LNA Low Noise Amplifier
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MBUS 1-wire half duplex serial bus
MCU Micro Controller Unit
MDI MCU-DSP Interface
MFI Modulator and Filter Interface
PA Transmit Power Amplifier
PC Personal Computer
PCM Pulse Code Modulation
PCM SIO Synchronous serial bus for PCM audio transferring
PCMCIA PC Memory Card International Association
PIFA Planar Inverted F-antenna
PWB Printed Wiring Board
RF Radio Frequency
SIM Subscriber Identity Module
SMART PCMCIA interface ASIC
UEM Universal Energy Management
UI User Interface
UPP Universal Phone Processor
VCXO Voltage Controlled Crystal Oscillator
VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator.
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Introduction

Electrical Modules

The system module AK4 consists of Radio Frequency (RF) and baseband (BB). User Inter­face (UI) contains display, keyboard, IR link, vibra, HF/HS connector and audio parts.
FM radio is located on the main PWB AK4.
The electrical part of the keyboard is located in separate UI PWB named KU4. KU4 is con­nected to radio PWB through spring connectors.
The Baseband blocks provide the MCU, DSP, external memory interface and digital con­trol functions in the UPP ASIC. Power supply circuitry, charging, audio processing and RF control hard ware are in the UEM ASIC.
The purpose of the RF block is to receive and demodulate the radio frequency signal from the base station and to transmit a modulated RF signal to the base station.
The UI module is described in a dedicated section of the manual.

Interconnection Diagram

Keyboard module
Flashlight
Antenna
Microphone
Figure 1: Interconnection diagram
Display
IHF
speaker
Radio
Module
NPM-6/6X
NHL-4
IR Link
Earpiece
BatterySIM
Charger
omahawk
Accessories
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Temperature Conditions

Specifications are met within range of -10...+55 deg. C ambient temperature Storage temperature range -40...+70 deg. C

Humidity

Relative humidity range is 5... 95%. This module is not protected against water. Condensated or splashed water might cause malfunction momentary. Long term wetness will cause permanent damage.
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System Module

The System module (or Engine) consists of Baseband and RF sub-modules, each described below.

Baseband Module

Main functionality of the baseband is implemented into two ASICs: UPP (Universal Phone Processor) and UEM (Universal Energy Management).
UPP ASIC provides the MCU, DSP, external memory interface and digital control func­tions.
UEM ASIC contains power supply circuitry, charging, audio processing and RF control hardware.
The baseband architecture supports a power saving function called "sleep mode". This sleep mode shuts off the VCTCXO, which is used as system clock source for both RF and baseband. During the sleep mode the system runs from a 32 kHz crystal. The phone is waken up by a timer running from this 32 kHz clock supply. The sleep time is determined by net work parameters. Sleep mode is entered when both the MCU and the DSP are in standby mode and the normal VCTCXO clock is switched off.
NPM-6/6X supports both three and two wire type of Nokia chargers. Three wire chargers are treated like two wire ones. There is not separate PWM output for controlling charger but it is connected to GND inside the bottom connector. Charging is controlled by UEM ASIC (Universal Energy Management) and EM SW running in the UPP (Universal Phone Processor).
BL-4C Li-ion rechargeable battery is used as main power source for NPM-6/6X. BL-4C has a capacity of 720 mAh.
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Block Diagram
Figure 2: Baseband block diagram
FLASH
64Mbit
(incl. EEPROM)
LCD
Passive colour STN
RF Interface
Flashlight
SIM
DCT-3
Battery
BL-4C
Vibra
Accessory
Regulator
Charger
SRAM
DC
ack
UEM
v4
IHF
System connector
Tomahawk
UPP8M
v2
Mo/St Amp
LM4855
Keyboard
FM radio
TEA5767
4Mbit
Keyboard
Illumination
1.8 V
IR

Technical Summary

Baseband of the NPM-6/6X is running from power rails 2.8V analog voltage and 1.8V I/O voltage. UPP core voltages can be lowered down to 1.0V, 1.3V and 1.5V. UEM includes 6 linear LDO (low drop-out) regulator for baseband and 7 regulator for RF. It also includes 4 current sources for biasing purposes and internal usage. UEM also includes SIM inter­face which has supports both 1.8V and 3V SIM cards.
A real time clock function is integrated into the UEM, which utilizes the same 32kHz clock supply as the sleep clock. A backup power supply is provided for the RTC-battery, which keeps the real time clock running when the main battery is removed. The backup power supply is a rechargeable surface mounted Li-Ion battery. The backup time with the battery is 30 minutes minimum.
The interface between the baseband and the RF section is mainly handled by the UEM ASIC. The UEM provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the user interface. The UEM supplies the analog TXC and AFC signals to RF section according to the UPP DSP digital control.
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Data transmission between the UEM and the UPP is implemented using two serial bus­ses, DBUS for DSP and CBUS for MCU. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP ASIC.
The UEM is a dual voltage circuit, the digital parts are running from the baseband supply
1.8V and the analog parts are running from the analog supply 2.78V also VBAT is directly used.
The baseband supports both internal and external microphone inputs and speaker out­puts. Input and output signal source selection and gain control is performed by the UEM according to control messages from the UPP. Keypad tones, DTMF, and other audio tones are generated and encoded by the UPP and transmitted to the UEM for decoding. An external vibra alert control signals are generated by the UEM with separate PWM out­puts.
NPM-6/6X has two serial control interfaces: FBUS and MBUS. FBUS can be accessed through a test pad and the System Connector as described later. The MBUS can be accessed through the production test pattern as described in section MBUS Interface.
Note! NPM-6 uses 64Mbit flash memory and external 4MBit SRAM memory. NPM-6X uses COMBO memory including 64MBit flash memory and 4Mbit SRAM.
EMC shielding is implemented using a metallized plastic frame. On the other side, the engine is shielded with PWB grounding.
DC Characteristics
Regulators and Supply Voltage Ranges
Absolute Maximum Ratings
Signal Note
Battery Voltage (Idle) -0.3V - 5.5V
Battery Voltage (Call) Max 4.8V
Charger Input Voltage -0.3V - 16V
Battery Voltage Range
Signal Min. Nom Max Note
VBAT 3.1V 3.7V 4.2V (charging
high limit voltage)
3.1V SW cut off
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BB Regulators
Signal Min. Nom Max Note
VANA 2.70V 2.78V 2.86V I
VFLASH1 2.70V 2.78V 2.86V I
VFLASH2 2.70V 2.78V 2.86V I
VSIM 1.745V
2.91V
1.8V
3.0V
1.855V
3.09V
VIO 1.72V 1.8V 1.88V I
VCORE 1.0V
1.235V
1.425V
1.710V
1.053V
1.3V
1.5V
1.8V
1.106V
1.365V
1.575V
1.890V
Current Sources
Signal Min. Nom Max Note
= 80mA
max
= 70mA
max
I
= 1.5mA
sleep
= 40mA
max
I
= 25mA
max
= 0.5mA
I
sleep
= 150mA
max
I
= 0.5mA
sleep
I
= 200mA
max
= 0.2mA
I
sleep
Default value 1.5V
IPA1 and IPA2 0mA - 5mA Programmable, +/-6%
IPA3 and IPA4 0.5mA 1mA 1.5mA V
V
IPA1,VIPA1
IPA1
= 0V - 2.7V
= 0V - 2.7V
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Power Distribution diagram
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External and Internal Signals and Connections

This section describes the external and internal electrical connection and interface levels on the baseband. The electrical interface specifications are collected into tables that covers a connector or a defined interface.
Digital Signals
AC and DC Characteristics of RF-BB digital signals
Signal name From To Parameter Input Characteristics
Min. Typ Max Unit
TXP UPP
GenIO 5
RFBusEna1X UPP Helga ”1” 1.38 1.88 V RFbus enable
RFBusData UPP the
Helga ”1” 1.38 1.88 V Power ampli-
”0” 0 0.4 V
Load Resistance 10 220 kohm
Load Capacitance 20 pF
Timing Accuracy 1/4 sym-
bol
”0” 0 0.4 V
Current 50 uA
Load resistance 10 220 kohm
Load capacitance 20 pF
”1” 1.38 1.88 V RFbus data;
Helga
Function
fier enable
read/write
”0” 0 0.4 V
Load resistance 10 220 kohm
Load capacitance 20 pF
Data frequency 10 MHz
RFBusClk UPP the
Helga
”1” 1.38 1.88 V RFbus clock
”0” 0 0.4 V
Load resistance 10 220 kohm
Load capacitance 20 pF
Data frequency 10 MHz
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RESET
UPP GenIO 6
the Helga
”1” 1.38 1.85 V Reset to the
Helga
”0” 0 0.4 V
Load capacitance 20 pF
Load resistance 10 220 kohm
Analogue Signals
Signal name
VCTCXO VCTCXO UPP Frequency 13 26 MHz High stability
From To Parameter Min Typ Max Unit Function
Signal amplitude 0.2 1.32 Vpp
Input resistance 10 kohm
Input capaci­tance
Harmonic con­tent
10 pF
-8 dBc
clock signal for the logic circuits, AC coupled. Dis­torted sinewave eg. sawtooth.
Clear signal win­dow (no glitch)
Duty cycle 40 60 %
VCTCXOGnd VCTCXO UPP DC level 0 V Ground for refer-
RXI/RXQ Helga UEM Voltage swing
(static)
DC level 1.3 1.35 1.4 V
Input impedance 500 kohm
TXIP / TXIN UEM the
Helga
Differential volt­age swing (static)
DC level 1.17 1.20 1.23 V
Source imped­ance
200 mVpp
ence clock
1.35 1.4 1.45 Vpp Received demodu­lated I- and Q­signals
2.15 2.2 2.25 Vpp Programmable voltage swing. Programmable common mode
200 ohm
voltage. Between TXIP­TXIN
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TXQP / TXQN UEM Helga Same as TXIP / TXIN
AFC UEM VCTCXO Voltage Min.
Max
Source imped­ance
Load resistance capacitance
Resolution 11 bits
TXC UEM Helga Voltage Min.
Max
Source imped­ance
Load resistance capacitance
Resolution 10 bits
0.0
2.4
200 ohm
1
2.4
5
0.1
2.55
100
0.1 V Transmitter power
200 ohm
15
V Automatic fre-
kohm nF
kohm pF
quency control svoltage for the VCTCXO
level and ramping control
RFTemp Helga UEM Voltage at -20
deg.C
Voltage at +25 deg.C
Voltage at +60 deg.C
1,57
1,7
1,79
V Temperature sen-
sor of the RF.
Keyboard (board-to-board) Connector
Pin Signal Min. Nom Max Condition Note
1 VLED+ 7.2 V 0V
7.7 V
2 VLED-
(GND)
3 VLED+ 7.2 V 0V
4 KEYB2 0.293V 0.309V 0.324V 25°C Ambient temp. sensor on KU4
0.2 V 0V 0.35 V LED off
7.7 V
8.4 V LED off LED on
LED on
8.4V LED off LED on
Supply Voltage for Keyboard LEDs
LED Katode Voltage
Supply Voltage for Keyboard LEDs
5 Not connected
6 GND 0V
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7 ROW (4) 0.7xVIO
0
8 ROW(3) 0.7xVIO
0
9 COL(2) 0.7xVIO
0
10 ROW(1) 0.7xVIO
0
11 COL(1) 0.7xVIO
0
12 ROW (0) 0.7xVIO
0
13 ROW (1) 0.7xVIO VIO
14 COL (3) 0.7xVIO VIO
15 COL(4) 0.7xVIO
0
16 GND 0V
1.8 V
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
VIO
0.3xVIO
0.3xVIO
0.3xVIO
VIO
0.3xVIO
High Low
High Low
High Low
High Low
High Low
High Low
High Low
High Low
High Low
Keyboard matrix row 4
Keyboard matrix row 3
Keyboard matrix column 2
Keyboard matrix row 1
Keyboard matrix column 1
Keyboard matrix row 0
Keyboard matrix row 1
Keyboard matrix column 3
Keyboard matrix column 4
Note: VIO is specified in Table 3 ‘Baseband Regulators’
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LCD Connector (Board to Board)
Pin Signal Min Nom Max Condition Note
1 VDDI 1.72V 1.8V 1.88V Logic voltage supply
Connected to VIO
2 RESX 0.7*VDDI
0
1us t
3 SDA 0.7*VDDI
0
100ns t
100ns t
4 SCLK 0.7*VDDI
0
250ns t
100ns t
100ns t
5 CSX 0.7*VDDI
0
60ns t
VDDI
0.3*VDDI
VDDI
0.3*VDDI
VDDI
0.3*VDDI
6.5MHz
VDDI
0.3*VDDI
Logic ’1’ Logic ’0’
rw
Logic ’1’ Logic ’0’
sds
sdh
Logic ’1’ Logic ’0’ Max fre­quency
scyc
shw
slw
Logic ’1’ Logic ’0’
css
Reset Active low
Reset active
Serial data
Data setup time
Data hold time
Serial clock input
Clock cycle
Clock high
Clock low
Chip select Active low
CXS low before SCLK rising edge
100ns t
csh
CXS low after SCLK rising edge
6 VDD 2.70V 2.78V 2.86V Supply Voltage.
Connected to VFLASH1
7 NC Not Connected
8 GND 0V Ground
9 VLED-
0V Return current
(GND)
10 VLED
Display
7.2V
0V
7.7V
8.4V
LED off LED on
Supply Voltage for LEDs
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DC Connector
Pin Signal Min. Nom Max Condition Note
1 VCHAR 11 . 1V
7.0 V
RMS
2 CHGND 0 Charger ground
8.4 V
peak
RMS
16.9 V
7.9 V
1.0 A
9.2 V
850 mA
peak
RMS
peak
RMS
Standard charger
Fast charger
Charger positive input
Bottom Connector
Bottom connector is of type Pop-Port (TM)
Figure 3: Bottom connector pinout
1
Contacts, 14 pcs
14
Locking holes for accessories, 2 pcs
Bottom connector pins and signals:
Pin/Signal name
1 / Charge V Charge DC 0-9 V / 0.85 A
2 / GND Charge GND - 0.85 A 100 mOhm
3 / ACI ACI 1 kbit/s Digital 0 /
4 / Vout DC out DC 2.78V 70mA
Signal description
Spectral range
Voltage / Current levels
(PWB + conn.)
2.5V-2.78V
2.5V 90mA
Max or nominal serial impedance
47 Ohm (lowpass 50kHz)
500 mOhm (PWB + conn.)
Note
Insertion & removal detection
200mW
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5 / USB Vbus DC in DC 4.375-5.25V USB spec.
6 / USB D+ / FBUS RX
7 / USB D- / FBUS TX
8 / USB data GND
9 / XMIC N Audio in 300 - 8kHz 1Vpp & 2.5V-
10 / XMIC P Audio in 300 - 8kHz 1Vpp & 2.5V-
11 / HSEAR N Audio out 20 - 20kHz 1Vpp 10 Ohm
12 / HSEAR P Audio out 20 - 20kHz 1Vpp 10 Ohm
13 / HSEAR R N Audio out 20 - 20kHz 1Vpp 10 Ohm Not conn. In
14 / HSEAR R P Audio out 20 - 20kHz 1Vpp 10 Ohm Not conn. In
Data GND - ferrite USB spec.
FBUS nominal 115 k , fa s t F BUS
1.295M, USB 12M
FBUS nominal 115 k , fa s t F BUS
1.295M, USB 12M
USB 0-3.3V Fbus 0 / 2.5V-
2.78V
FBUS RX USB 0-3.3V Fbus 0 / 2.5V-
2.78V
2.78VDC
2.78VDC
33 Ohm USB spec.
33 Ohm USB spec.
mono
mono
Table 1: Board to board connector pinlist (for PopPort Assembly)
Pin Symbol Pop-Port pin Note Max
1 Shield GND
2 Charge 1 In current from charger 16V/2A
3 Charge GND 2 Return current 16V/2A
4 Shield GND
5 ACI 3 Digital input 2.8V
6 Vout 4 Voltage output 2.8V/0.5A
7 USB Vbus 5 Voltage supply input 5V/1A
8 USB D+ /Fbus RX 6 Digital input 2.8V
9 USB D- /Fbus TX 7 Digital output 2.8V
10 Data GND 8 Return current 1.5A
11 XMIC N 9 Audio input
12 XMIC P 10 Audio input
13 XEAR N 11 Audio output
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14 XEAR P 12 Audio output
15 XEAR LN 13 Audio output
16 XEAR LP 14 Audio output
17 Shield GND
SIM connector
Pin Name Parameter Min. Typ Max Unit Notes
1 VSIM 1.8V SIM Card 1.6 1.8 1.9 V Supply voltage
3V SIM Card 2.8 3.0 3.2 V
2 SIMRST 1.8V SIM Card 0.9xVSIM
0
3V SIM Card 0.9xVSIM
0
3 SIMCLK Frequency 3.25 MHz SIM clock
Trise/Tfall 50 ns
1.8V Voh
1.8V Vol
3V Voh 3V Vol
4 DATA 1.8V Voh
1.8V Vol
3V Voh 3V Vol
1.8V Vih
1.8V Vil
3V Vil 3V Vil
0.9xVSIM 0
0.9xVSIM 0
0.9xVSIM 0
0.9xVSIM 0
0.7xVSIM 0
0.7xVSIM 0
VSIM
0.15xVSIM
VSIM
0.15xVSIM
VSIM V
VSIM V
VSIM
0.15xVSIM
VSIM
0.15xVSIM
VSIM
0.15xVSIM
VSIM
0.15xVSIM
V SIM reset (output)
V
V SIM data (output)
V SIM data (input)
Trise/Tfall max 1us
5 NC Not connected
6 GND GND 0 0 V Ground
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Internal Signals and Connections
FM Radio Interface
BB Signal
FM Radio Signal
Min. Nom Max Condition Note
VFLASH2 Vcc1 2.7V 2.78V 2.86V max. Icc1 19mA
Vcc2 2.7V 2.78V 2.86V max. Icc2 800uA
VDD 2.7V 2.78V 2.86V max. IDD 3mA
GenIO(3) FMClk 1.4V
0
1.8V 1.88V
0.4V
High Low
Reference clock for FM radio module
75581 kHz Frequency In GSM
30ppm Stability
GenIO(8) FMWrEn 1.4V
0V
20µst
2 µs
1.8V 1.88V
0.4V
t
rise
High Low
wd
rise / fall time
FMWrEn high before rising edge of FMC- trlClk (write opera tion)
GenIO(11) FMCtrlClk 1.4V
0
1.8V 1.88V
0.4V
High Low
max. 300kHz
50 ms t
GenIO(12) FMCtrlDa 1.4V
0
10 µst
1.5 µst
GenIO(27) FMTuneX 1.4V
0
1 µst
1.8V 1.88V
0.4V
14us t
1.8V 1.88V
0.4V
/ t
r
start
High Low
da
shift
hold
High Low
f
rise / fall time
FMCtrlClk delay after switching on the VFLASH2 (oscillator running)
Bidirectional
shift register availa­ble after "search ready"
data available after FMCtrlClk rising edge (read opera­tion)
FMCtrlDa stable after FMCtrlClk ris­ing edge (write opera tion)
from FM module to UPP (FMCtrlClk = '1')
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MIC3P FMAudio 228mV
326mV
pp
460mV
pp
pp
50dB S/N
2% Harmonic
distortion
Internal microphone
Signal Min. Nom Max Condition Note
MICP 200mV
AC 2.2k to
pp
2.0 V 2.1 V 2.25 V DC
MICN 2.0V 2.1V 2.25V DC
Internal speaker
Signal Min. Nom Max Condition Note
EARP 0.75V 0.8V 2.0 V
0.85V
EARN 0.75V 0.8V 2.0 V
0.85V
pp
pp
AC DC
AC DC
MIC1B
Differential output (V
= 4.0 Vpp)
diff
Headset connector
Pin Signal Min. Nom Max Condition Note
5XMICP 1V
pp
100 mV
pp
2.0 V 2.1 V 2.25 V DC
3XMICN 1V
pp
100 mV
pp
4 XEARN 0.75V 0.8V 0.85V DC
1V
pp
7 XEARP 0.75V 0.8V 0.85V DC
1V
pp
5 HookInt 0V 2.86V
(VFLASH1)
6 HeadInt 0V 2.86V
(VANA)
G = 0dB 1k to MIC2B
G = 20dB
G = 0 dB 1k to GND
G = 20dB
AC
AC
Connected to UEM AD-con­verter
Accessory detec­tion
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Functional Description

Modes of Operation

AK4 baseband has six different functional modes:
- No supply
- Back-up
-Acting Dead
-Active
- Sleep
- Charging
No Supply
In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to disconnection of main battery and backup battery or low battery voltage level in both of the batteries.
Phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is detected. Battery voltage can rise either by connecting a new battery with VBAT > V
connecting charger and charging the battery above V
Back-up
In BACK_UP mode the backup battery has sufficient charge but the main battery can be disconnected or empty (VBAT < V
VRTC regulator is disabled in BACK_UP mode. VRTC output is supplied without regulation from backup battery (VBACK). All the other regulators are disabled in BACK_UP mode.
Acting Dead
If the phone is off when the charger is connected, the phone is powered on but enters a state called ”Acting Dead”. To the user, the phone acts as if it was switched off. A battery charging alert is given and/or a battery charging indication on the display is shown to acknowledge the user that the battery is being charged.
and VBACK > VBU
MSTR
MSTR+
COFF
or by
MSTR+
.
).
Active
In the Active mode the phone is in normal operation, scanning for channels, listening to a base station, transmitting and processing information. There are several sub-states in the active mode depending on if the phone is in burst reception, burst transmission, if DSP is working etc.
One of the sub-states of the active mode is FM radio on state. In that case, Audio Ampli­fier and FM radio are powered on. FM radio circuitry is controlled by the MCU and
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13MHz-reference clock is generated in the UPP. VFLASH2 regulator is operating.
In Active mode the RF regulators are controlled by SW writing into EM’s registers wanted settings: VR1A can be enabled or disabled. VR2 can be enabled or disabled and its output voltage can be programmed to be 2.78V or 3.3V. VR4 -VR7 can be enabled, disabled, or forced into low quiescent current mode. VR3 is always enabled in Active mode.
Sleep Mode
Sleep mode is entered when both MCU and DSP are in stand–by mode. Sleep is con­trolled by both processors. When SLEEPX low signal is detected UEM enters SLEEP mode. VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All the RF regulators are disabled in SLEEP. When SLEEPX=1 detected UEM enters ACTIVE mode and all functions are activated.
The sleep mode is exited either by the expiration of a sleep clock counter in the UEM or by some external interrupt, generated by a charger connection, key press, headset con­nection etc.
In sleep mode VCTCXOr is shut down and 32 kHz sleep clock oscillator is used as refer­ence clock for the baseband.
Charging
Charging can be performed in any operating mode.
NPM-6/6X supports the standard NMP charger interface.
Supported chargers are ACP-7, ACP-8, ACP-9, ACP-12, LCH-8 and LCH-9.
Charging is controlled by the UEM ASIC and external components are needed for EMC, reverse polarity and transient protection of the input to the baseband module. The charger connection is through the system connector interface. The NPM-6/6X baseband is designed to support DCT3 chargers from an electrical point of view. Both 2- and 3-wire type chargers are supported.
The operation of the charging circuit has been specified in such a way as to limit the power dissipation across the charge switch and to ensure safe operation in all modes.
Battery
720 mAh Li-ion battery pack BL-4C is used in NPM-6/6X.
Nominal discharge cut-off voltage 3.1V
Nominal battery voltage 3.7V
Nominal charging voltage 4.2V
Maximum charger output current 850 mA
Minimum charger output current 200 mA
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Pin numbering of battery pack
Signal name Pin number Function
VBAT 1 Positive battery terminal
BSI 2 Battery capacity measurement (fixed resistor inside the battery
pack)
GND 3 Ground/negative/common battery terminal
BL-4C battery pack pin order
Figure 4: Battery Pack Contents
4(GND)
3(BTEMP)
2(BSI)
1 (+)
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Power Up and Reset

Power up and reset is controlled by the UEM ASIC. NPM-6/6X baseband can be powered up in following ways:
Press power button which means grounding the PWRONX pin on UEM
Connect the charger to the charger input
Supply battery voltage to the battery pin.
RTC Alarm, the RTC has been programmed to give an alarm
After receiving one of the above signals, the UEM counts a 20ms delay and then enters its reset mode. The watchdog starts up, and if the battery voltage is greater than Vcoff+ a 200ms delay is started to allow references etc. to settle. After this delay elapses the VFLASH1 regulator is enabled.
500us later VR3, VANA, VIO and VCORE are enabled. Finally the PURX line is held low for 20 ms. This reset, PURX, is fed to the baseband ASIC UPP, resets are generated for the DSP and the MCU. During this reset phase the UEM forces the VCXO regulator on regard­less of the status of the sleep control input signal to the UEM. The sleep signal from the ASIC is used to reset the flash during power up and to put the flash in power down dur­ing sleep. All baseband regulators are switched on at the UEM power on except for the SIM regulator that is controlled by the MCU. The UEM internal watchdog is running dur­ing the UEM reset state, with the longest watchdog time selected. If the watchdog expires, the UEM returns to power off state. The UEM watchdog is internally acknowl­edged at the rising edge of the PURX signal in order to always give the same watchdog response time to the MCU.

A/D Channels

The UEM contains the following A/D converter channels that are used for several mea­surement purpose. The general slow A/D converter is a 10 bit converter using the UEM interface clock for the conversion. An interrupt will be given at the end of the measure­ment.
The UEM’s 11-channel analog to digital converter is used to monitor charging functions, battery functions, user interface and RF functions.
When the conversion is started the converter input is selected. Then the signal process­ing block creates a data with MSB set to’1’ and others to’0’. In the D/A converter this data controls the switches which connect the input reference voltage (VrefADC) to the resistor network. The generated output voltage is compared with the input voltage under measurement and if the latter is greater, MSB remains’1’ else it is set’0’. The following step is to test the next bit and the next…until LSB is reached. The result is then stored to ADCR register for UPP to read.
The monitored battery functions are battery voltage (VBATADC), battery type (BSI) and
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battery temperature (BTEMP) indication.
The battery type is recognized through a resistive voltage divider. In phone there is a 100k pull up resistor in the BSI line and the battery has a pull down resistor in the same line. Depending on the battery type the pull down resistor value is changed. The battery temperature is measured equivalently except that the systemboard has an NTC pull down resistor in the BTEMP line.
KEYB1&2 inputs are used for ambient temperature sensor. These inputs are also routed internally to the miscellaneous block.
The monitored RF function is PATEMP detection. PATEMP input is used to measure tem­perature of the RFIC, the Helga.
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FM Radio

FM radio circuitry is implemented using the integrated radio IC, TEA5767. Only a few external components like filters, discriminator and capacitors are needed.
TEA5767 is an integrated AM/FM stereo radio circuit including digital tuning and control functions. NPM-6/6X radio is implemented as FM stereo receiver.
Figure 5: FM radio
HSE ARN HSE ARP HSE ARR N HSE ARR P
IR Module
The IR interface when using transceiver with 1.8V I/O is designed into the UPP. The IR link supports speeds from 9600 bit/s to 1.152 MBit/s up to distance of 80 cm. Transmis­sion over the IR if half-duplex.
UEM
Audio Amp.
Antenna connect i on
Vf l a s h 2
Mi c3 P
Li n
Ri n
VDI G
VCC
VCCVCO
VAFL
VAFR
FM Radi o
RF IN 1
RFI N2
Xt a l 2
SDA
SCL
W/R
UPP 8 Mv2.X
FMCl k
Genio( 3)
FMCt r l Da
Genio( 12)
FMCtr lCl k
Genio( 11)
FMWrEn
Genio( 8)
Backup Battery
Backup battery is used in case when main battery is either removed or discharged. Backup battery is used for keeping real-time clock running for minimum of 30 minutes.
Rechargeable backup battery is connected between UEM VBACK and GND. In UEM backup battery charging high limit is set to 3.2V. The cut–off limit voltage (V BUCoff–) for backup battery is 2.0V. Backup battery charging is controlled by MCU by writing into UEM register.
Li-Ion SMD battery type is used. The nominal capacity of the battery is 0.01 mAh.
SIM Interface
UEM contains the SIM interface logic level shifting. SIM interface can be programmed to support 3V and 1.8V SIMs. SIM supply voltage is selected by a register in the UEM. It is only allowed to change the SIM supply voltage when the SIM IF is powered down.
The SIM power up/down sequence is generated in the UEM. This means that the UEM
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generates the RST signal to the SIM. Also the SIMCardDet signal is connected to UEM. The card detection is taken from the BSI signal, which detects the removal of the battery.
The SIM interface is powered up when the SIMCardDet signal indicates "card in". This signal is derived from the BSI signal.
Parameter Variable Min. Typ Max Unit
SIMCARDet, BSI comparator Threshold Vkey 1.94 2.1 2.26 V
SIMCARDet, BSI comparator Hysteresis (1) Vsimhyst 50 75 100 mV
The entire SIM interface locates in two chips: UPP and UEM.
The SIM interface in the UEM contains power up/down, port gating, card detect, data receiving, ATR-counter, registers and level shifting buffers logic. The SIM interface is the electrical interface between the Subscriber Identity Module Card (SIM Card) and mobile phone (via UEM device).
The data communication between the card and the phone is asynchronous half duplex. The clock supplied to the card is in GSM system 1.083 MHz or 3.25 MHz.
Figure 6: SIM interface NPM-6/6X
GND
UPP
SIM
C5 C6 C7
C1C2C3
From Battery Type contact
C8
C4
BSI
SIMDATA
SIMCLK
SIMRST
VSIM
GND
UEM
SIMIF register
SIMIO
SIMClk
Data
UEM digital logic
SIMIO
SIMClk
Data
UIF Block
UEMInt
CBusDa
CBusEnX
CBusClk
ACI
ACI is a point-to-point, bi-directional serial bus. ACI has two main features: 1)The inser­tion and removal detection of an accessory device 2) acting as a data bus, intended mainly for control purposes. A third function provided by ACI is to identify and authenti­cate the specific accessory which is connected to the System interface.
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External Accessory Regulator
An external LDO Regulator exists for accessory power supply purposes. All ACI-accesso­ries require this power supply. Regulator input is connected to battery voltage VBAT and output is connected to Vout pin in the system connector. Regulator is controlled via UPP (On/Off-function).
Accessory Regulator Signals
Signal Min. Nom Max Note
Vout 2.70V 2.78 2.86V I
GenIO(0) 1.4 1.8 1.88
0.6
Figure 7: External Accessory regulation
UPP
Genio(0)
VBAT
Accessory Regulator
System Connector

External Audio

NPM-6/6X is designed to support fully differential external audio accessory connection. A headset can be directly connected to the system connector. With NPM-6/6X, two dif­ferent kinds of headsets can be used; Stereo and Mono headset. Headset is also used as antenna input for the FM radio.
max
High (ON) Low (OFF)
Vout
= 150mA
Headset implementation uses separate microphone and earpiece signals. The accessory is detected by the HeadInt signal when the plug is inserted. Normally when no plug is present the internal pull-down on the HF pin pulls down the HeadInt signal.
Due to the that the comparator level is 1.9V the HeadInt signal will not change state even if the HF output is biased to 0.8V. When the plug is inserted the switch is opened and the HeadInt signal is pulled up by the internal pull-up. The 1.9V threshold level is reached and the comparator output changes to low state causing an interrupt.
The hook signal is generated by creating a short circuit between the headset microphone signals. When no accessory is present, the HookInt signal is pulled up by the UEM resis­tor.
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Figure 8: External audio connection
MIC ASIP
MIC BIAS
BIAS ground
14V/46V varistors
Antenna signal
22pF
100nF
2* 33nF
UEM
Stereo audio Amplifier
1nF
FM radio
SYSTEM CONNECTOR
3 * EXC24CB102U 1kΩ @ 100MHz
XMIC N
XMIC P
HSEARN
HSEARP
HSEARRN
HSEARRP
When the accessory is inserted and the microphone path is biased the HookInt signal decreases to 1.8V due to the microphone bias current flowing through the resistor. When the button is pressed the microphone signals are connected together, and the HookInt input will get half of micbias dc value 1.1 V. This change in DC level will cause the Hook­Int comparator output to change state, in this case from 0 to 1. The button can be used for answering incoming calls but not to initiate outgoing calls.
PhoneAudio
Stereo Radio
Audio

internal Audio

IHF Speaker & Stereo Audio Amplifier
Integrated HandsFree Speaker is used to generate alerting and warning tones in NPM-6/ 6X. IHF Speaker is controlled by an Audio amplifier . Speaker capsule is mounted in the C-cover. Spring contacts are used to connect the IHF Speaker contacts to the main PWB.
Figure 9: IHF speaker and amplifier
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Internal Microphone
The internal microphone is connected to the UEM microphone input. The microphone input is symmetric and microphone bias is provided by the UEM. The microphone input on the UEM is ESD protected. Microphone capsule is mounted in the System Connector Assembly. Spring contacts are used to connect the microphone contacts to the main PWB.
Figure 10: Internal microphone
Internal Speaker
The internal earpiece is a dynamic earpiece with impedance of 32 ohms. The earpiece must be low impedance one since the sound pressure is to be generated using current and not voltage as the supply voltage is restricted to 2.7V. The earpiece is driven directly by the UEM and the earpiece driver in UEM is a bridge amplifier. In NPM-6/6X 8mm PICO type earpiece is used.
UEM
EARP
EARN
Figure 11: Internal speaker
22W
22W
18V
1000W@100MHz
18V
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Memory Block

For the MCU the UPP includes 2 kbytes ROM, that is used mainly for boot code of MCU. To speed up the MCU operation small 64 byte cache is also integrated as a part of the MCU memory interface. For program memory 8Mbit (512 x 16bit) PDRAM is integrated. RAM is mainly for MCU purposes but also DSP has also access to it if needed.
MCU code is stored into external flash memory. Size of the flash is 64Mbit (4096 x 16bit).
Security
The phone flash program and IMEI codes are software protected using an external secu­rity device that is connected between the phone and a PC.

Clock distribution

32 kHz
UEM
Figure 12: Clock Distribution Diagram
VR3
VCTCXO
26MHz
32 kHz
26 MHz
UPP
SLEEPX
MCU
DSP
CTSI
PLL
SLICER
HELGA
26 MHz
RFBUSCLK 13MHz
CBUSCLK 1MHz
DBUSCLK 13MHz
LCDCLK max. 6.5MHz
SIMCLK max. 3.25MHz
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Audio Control
Figure 13: Audio block diagram NPM-6/6X
earpiece
Tomahawk
Pop-Port
bottom connector
bottom connector
TM
Mic ACI
Lout
Rout
IHF­Speaker
SPKR
Lout
Rout
microfone
PA
Phs
Pihf
Lin
Rin
UEM
earp
mic1
mic2
headint
xear
mic3
Control Bus
ear data
mic data
Radio
L
R
antenna
UPP
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Accessory identification and Power Supply
Figure 14: Accessory identification and Power supply
UEM
Tomahawk
Pop-port
TM
Vhead
Vflash1
4.7k
Vflash1
headint=
HEADINT
ACI switch
MBUS
UPP
Vflash1
100k
Enable
VBatt
Accessory Regulator
2.8V/70mA
ACI-line
Vout
56k
ACI
Chip
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RF Module

The RF module comprises all RF functions of the NPM-6/6X engine. it is a triple band EGSM900 / GSM1800 / GSM1900 transceiver
It is supporting GGSM1800PRS, EGPRS and HSCSD protocols and multislot classes 1 to 6.
Transmitter and receiver have been implemented by using direct conversion architecture which means that the modulator and demodulator operate at the channel frequency.
The core of the RF is the Helga RF ASIC. Other main components include
- the power amplifier module which includes two amplifier chains, one for EGSM900 and the other for GSM1800/GSM1900.
- 26 MHz VCTCXO for frequency reference,
- 3420-3980 MHz SHF VCO (super high frequency voltage controlled oscillator),
- front end module with a RX/TX switch and
two RF bandpass SAW filters inside, and three additional SAW filters. EGSM900 and GSM1800 LNA’s (low noise amplifier) for the receiver front-end are integrated in the Helga while GSM1900 LNA is external.
The RF module includes metal shields for PA, the Helga and FM Radio.
Internal antenna is based on the PIFA concept (planar inverted F-antenna).
The RF is controlled by the baseband section of the engine through a serial bus, referred later on as RFBus. This serial bus is used to pass the information about the frequency band, mode of operation, and synthesizer channel for the RF. In addition, exact timing information and receiver gain settings are transferred through the RFBus.
Physically, the bus is located between the baseband ASIC called UPP and the Helga. Using the information obtained from UPP the Helga controls itself to the required mode of operation and further sends control signals to the front end and power amplifier mod­ules. In addition to the RFBus there are other interface signals for the power control loop and VCTCXO control and for the modulated waveforms.
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RF Frequency Plan

Figure 15: RF Frequency plan
925-960 MHz
1805-1990 MHz
1710-1910 MHz
f/4
HELGA
I-signal
I-signalI-signalI-signal
Q-signal
f
f
RX
f/2f/4
f
f
f/2
3420-
PLL
3980 MHz
26 MHz
VCTCXO
880-915 MHz
I-signal
Q-signal
TX
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DC characteristics

Regulators
The transceiver baseband section has a multi function analog ASIC, UEM, which contains among other functions six pieces of 2.78 V linear regulators and a 4.8 V switching regu­lator. All the regulators can be controlled individually by the 2.78 V logic directly or through a control register. Normally, direct control is needed because of switching speed requirement: the regulators are used to enable the RF-functions which means that the controls must be fast enough.
The seven regulators are named VR1 to VR7. VrefRF01 is used as the reference voltages for the Helga, VrefRF01 (1.35V) for the bias reference and for the RX ADC (analog-to­digital converter) reference.
The regulators (except for VR7) are connected to the Helga. Different modes of operation can be selected inside the Helga according to the control information coming through the RFBus.
List of the needed supply voltages
Volt. source Load
VR1 PLL charge pump (4.8 V)
VR2 TX modulators, ALCs, driver
VR3 VCTCXO, synthesizer digital parts
VR4 Helga pre-amps, mixers, DtoS
VR5 dividers, LO-buffers, prescaler
VR6 LNAs, Helga baseband (Vdd_bb)
VR7 VCO
VrefRF01 ref. voltage for Helga
Vbatt PA
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Power Distribution
Figure 16: Power distribution diagram
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RF characteristics

Parameter Unit and value
Cellular System EGSM900, GSM1800 and GSM1900
RX Frequency Band EGSM900: 925 - 960 MHz
GSM1800: 1805 - 1880 MHz GSM1900: 1930 - 1990 MHz
TX Frequency Band EGSM900: 880 - 915 MHz
GSM1800: 1710 - 1785 MHz GSM1900: 1850 - 1910 MHz
Output Power EGSM900: +5...+33 dBm / 3.2 mW... 2 W
GSM1800: +0...+30 dBm / 1.0 mW... 1 W GSM1900: +0...+30 dBm / 1.0 mW... 1 W
Number of RF Channels EGSM900: 174
GSM1800: 374 GSM1900: 300
Channel Spacing 200 kHz
Number of TX Power Levels EGSM900 : 15
Transmitter characteristics
Item Values EGSM900/GSM1800/GSM1900
Type Direct conversion, nonlinear, FDMA/TDMA
LO frequency range 3520...3660 MHz / 3420...3570 MHz/
Output power 2 W / 1 W/1W peak
Gain control range min. 30 dB
Maximum phase error (RMS/peak) max 5 deg./20 deg.
GSM1800: 16 GSM1900: 16
3700...3820 MHz
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Receiver characteristics
Item Values EGSM900/GSM1800/GSM1900
Type Direct conversion, Linear, FDMA/TDMA
LO frequencies 3700...3840 MHz / 3610...3760 MHz/3860...3980
MHz
Typical 3 dB bandwidth +/- 91 kHz
Sensitivity min. - 102 dBm (GSM1800/GSM1900 norm.cond.
only)
Total typical receiver voltage gain (from antenna to RX ADC)
Receiver output level (RF level -95 dBm) 230 mVpp, single-ended I/Q signals to RX ADCs
Typical AGC dynamic range 83 dB
Accurate AGC control range 60 dB
Typical AGC step in LNA 30 dB GSM1800/GSM1900, 25 dB EGSM900
Usable input dynamic range -102... -10 dBm
RSSI dynamic range -110... -48 dBm
Compensated gain variation in receiving band +/- 1.0 dB
86 dB
RF Block Diagram
The block diagram of the RF module can be seen in Chapter on “RF Block Diagram”. The detailed functional description is given in the following sections
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RF Block Diagram NPM-6/6X
Figure 17: RF Block Diagram
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Frequency synthesizers
The VCO frequency is locked by a phase locked loop (PLL) and VCTCXO which is running at 26 MHz.
The frequency of the VCTCXO is in turn locked into the frequency of the base station with the help of an AFC voltage which is generated in UEM by an 11 bit D/A (digital-to-ana­log) converter.
The PLL is located in the Helga and is controlled through the RFBus.
Loop filter filters out the comparison pulses of the phase detector and generates a DC control voltage to the VCO.
The dividers are controlled via the RFBus. RFBusData is for the data, RFBusClk is a serial clock for the bus and RFBusEna1X is a latch enable, which stores the new data into the dividers.
Receiver
Each receiver path is a direct conversion linear receiver.
From the antenna the received RF-signal is fed to the front end module where a diplexer first divides the signal to two separate paths according to the band of operation: either lower, EGSM900 or upper, GSM1800/GSM1900 path.
At each of the paths a pin-diode switch is used to select either receive or transmit mode. At the upper band in receive mode either GSM1800 or GSM1900 path is further selected by another pin-diode switch.
The selections are controlled by the Helga which obtains the mode/band and timing information through the RFBus. After the switches there is a bandpass filter at each of the receiver paths. These filters are included in the front end module, except for GSM1900 where it is external.
Then the signal is fed to the LNAs which are integrated in the Helga in EGSM900 and GSM1800 while in GSM1900 the LNA is external.
In GSM1900 the amplified signal is fed to a balun and thereafter to a pregain stage of the mixer while in EGSM900 and GSM1800 the LNA’s are directly connected to the pre­gain stages without having SAW filters in between. The pregain stages as well as all the following receiver blocks are integrated in the Helga. The LNAs have three gain levels. The first one is the maximum gain, the second one is about 30 dB below the maximum, and the last one is the off state.
After the pregain stages there are demodulator mixers at each signal path to convert the RF signal directly down to baseband I and Q signals. Local oscillator signals for the mix­ers are generated by an external VCO the frequency of which is divided by two in GSM1800 and GSM1900 and by four in EGSM900. Those frequency dividers are inte­grated in the Helga and in addition to the division they also provide accurate phase
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shifting by 90 degrees which is needed for the demodulator mixers.
The demodulator output signals are all differential. After the demodulators the amplifiers convert the differential signals to single ended. Before that, they combine the signals from the three demodulators to a single path which means that from the output of the demodulators to the baseband interface there are just two signal paths (I and Q) which are common to all the frequency bands of operation.
In addition, the amplifiers perform the first part of the channel filtering and AGC: they have two gain stages, the first one with a constant gain of 12 dB and 85 kHz -3 dB bandwidth and the second one with a switchable gain of 6 dB and -4 dB. The filters in the amplifier blocks are active RC filters. The rest of the analog channel filtering is pro­vided by blocks called BIQUAD.
After the amplifier and BIQUAD blocks there is another AGC-amplifier which provides a gain control range of 42 dB in 6 dB steps.
In addition to the AGC steps, the last AGC stage also performs the real time DC offset compensation which is needed in a direct conversion receiver.
DC offset compensation is performed during the operations called DCN1 and DCN2. DCN1 is carried out by charging off-chip capacitors in the last AGC stages to a voltage which causes a zero DC offset. DCN2 is used to set the signal offset to a constant value, VrefRF_02 which is 1.35 V. That voltage level is then used as a zero level for RX ADCs which are located in UEM.
After the last AGC and DC offset compensation stages the single ended and filtered I­and Q-signals are finally fed to the RX ADCs. The maximum peak-to-peak voltage swing for the ADCs is 1.45 V.
In the Helga there is a port called RF-temp which can be used for compensation of RX SAW filters thermal behavior. The temperature information to the Helga comes from a voltage over two diodes when the diodes are fed with temperature independent, con­stant current.
Transmitter
The transmitter consists of two final frequency IQ-modulators and power amplifiers, for the lower and upper bands separately, and a power control loop. The IQ-modulators are integrated in the Helga, as well as the operational amplifiers of the power control loop. The two power amplifiers are located in a single module which also includes the power detector and the directional coupler. Loop filter parts of the power control loop are implemented as discrete components on the PWB. In the GMSK mode the power is con­trolled by adjusting the DC bias levels of the power amplifiers.
The modulated waveforms, i.e. the I- and Q-signals, are generated by the baseband part of the engine module. After post filtering, implemented as RC-networks, they go into the IQ-modulator. Local oscillator signals for the modulator mixers are generated by an external VCO the frequency of which is divided by two in GSM1800 and in GSM1900 and
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by four in EGSM900. Those frequency dividers are integrated in the Helga and in addition to the division they also provide accurate phase shifting by 90 degrees which is needed for the modulator mixers.
At the upper band there is a dual mode buffer amplifier at the output of the IQ-modula­tor. The final amplification is realized by a three stage power amplifier.
There are two different amplifier chains in a single amplifier module, one for EGSM900 and one for GSM1800/GSM1900. The lower band power amplifier is able to deliver over 2 W of RF power, while the capability of the upper band amplifier is over 1 W.
In the GMSK mode the gain control is implemented by adjusting the bias voltages of the first two transistor stages thereby reaching the dynamic range of over 70 dB.
After the power amplifier the signal goes through a low pass filter and a pin-diode switch which is used to select between the reception and transmission. Finally, the two signal paths, lower and upper band, are combined in a diplexer after which the signal is routed through the antenna.
Power control circuitry consists of a power amplifier and an error amplifier. The power amplifier produces a voltage level related to the value of the RF voltage. It is fed to the negative input of the error amplifier where it is compared to the level of the reference signal, TXC, obtained from UEM. Depending on the difference between the two signals the biases of the power amplifier stages are either increased or decreased to get the cor­rect power level out of the power amplifier.
Front End
The front end module includes:
- Antenna 50 ohm input
- RX GSM1900 single output, RX EGSM900 and GSM1800 balanced output
- TXs EGSM900 and GSM1800/GSM1900 single 50 ohm input
-3 control lines from the Helga
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Figure 18: Front End
Ant
TX EGSM
TX
900
DCS/PCS
GSM1800/1900
RX
RX
GSM1900
PCS
RX
RX
GSM1800
DCS
RX EGSM
900
Power Amplifier
The power amplifier features include:
- 50 ohm input and output, EGSM900 and GSM1800/GSM1900
- internal power detector
- low and high power mode (EGSM900)
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Figure 19: Power amplifier
EGSM out
DCS/
GSM1800/1900 GSM1800/1900
PCS out
EGSM900 GSM1800/1900
EGSM Power control
DCS/PCS Power control
EGSM in
DCS/ PCS in
Power detector
Mode
900900
RF ASIC Helga
The RF ASIC module includes:
- Package uBGA108
- Balanced I/Q demodulator and balanced I/Q modulator
- Power control operational amplifier, acts as an error amplifier
- The signal from VCO is balanced, frequencies 3420 to 3980 MHz
- EGSM900 and GSM1800 low noise amplifier (LNA) are integrated.
The Helga can be tested by test points only.
AFC function
AFC is used to lock the transceiver’s clock to the frequency of the base station.
Antenna
The NPM-6/6X EGSM900/GSM1800/GSM1900 transceiver features an internal antenna.
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