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The availability of particular products may vary by region.
IMPORTANT
This document is intended for use by qualified service personnel only.
• IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED
WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT
CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/
MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.
• THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES,
FOR EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.
• OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE
WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE
MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY
ALSO BE SUBJECT TO INTERFERENCE.
• BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.
Cautions
• Servicing and alignment must be undertaken by qualified personnel only.
• Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.
• Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.
• Use only approved components as specified in the parts list.
• Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and
alignment.
• Ensure all cables and wires are repositioned correctly.
• Never test a mobile phone WCDMA transmitter with full Tx power, if there is no possibility to perform the
measurements in a good performance RF-shielded room. Even low power WCDMA transmitters may disturb
nearby WCDMA networks and cause problems to 3G cellular phone communication in a wide area.
• During testing never activate the GSM or WCDMA transmitter without a proper antenna load, otherwise
GSM or WCDMA PA may be damaged.
This product is of superior design and craftsmanship and should be treated with care. The suggestions below
will help you to fulfil any warranty obligations and to enjoy this product for many years.
• Keep the phone and all its parts and accessories out of the reach of small children.
• Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that
will corrode electronic circuits.
• Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged.
• Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage
batteries, and warp or melt certain plastics.
• Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form
inside, which may damage electronic circuit boards.
• Do not drop, knock or shake the phone. Rough handling can break internal circuit boards.
• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone.
• Do not paint the phone. Paint can clog the moving parts and prevent proper operation.
• Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or
attachments could damage the phone and may violate regulations governing radio devices.
All of the above suggestions apply equally to the product, battery, charger or any accessory.
Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing
the phone.
Any product of which the covers are removed must be handled with ESD protection. The SIM card can be
replaced without ESD protection if the product is otherwise ready for use.
To replace the covers ESD protection must be applied.
All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity
discharge.
All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside
any ESD Protected Area (EPA).
Every repair action involving opening the product or handling the product components must be done under
ESD protection.
ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area.
For more information and local requirements about ESD protection and ESD Protected Area, contact your local
Note: A new battery's full performance is achieved only after two or three complete charge and
discharge cycles!
The battery can be charged and discharged hundreds of times but it will eventually wear out. When the
operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery.
Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers
approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to
a charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged
battery will discharge itself over time.
Temperature extremes can affect the ability of your battery to charge.
For good operation times with Ni-Cd/NiMh batteries, discharge the battery from time to time by leaving the
product switched on until it turns itself off (or by using the battery discharge facility of any approved accessory
available for the product). Do not attempt to discharge the battery by any other means.
Use the battery only for its intended purpose.
Never use any charger or battery which is damaged.
Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or
pen) causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example
when you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery
or the connecting object.
Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce
the capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77°
F). A phone with a hot or cold battery may temporarily not work, even when the battery is fully charged.
Batteries' performance is particularly limited in temperatures well below freezing.
Do not dispose of batteries in a fire!
Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.
Our policy is of continuous development; details of all technical modifications will be included with service
bulletins.
While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If
any errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing/email.
Please state:
• Title of the Document + Issue Number/Date of publication
• Latest Amendment Number (if applicable)
• Page(s) and/or Figure(s) in error
Please send to:
NOKIA CORPORATION
Nokia Mobile Phones Business Group
Nokia Customer Care
PO Box 86
FIN-24101 SALO
Finland
E-mail: Service.Manuals@nokia.com
RM-362; RM-363
Nokia 5000 Service Manual Structure
Nokia 5000 Service Manual Structure
1 General Information
2 Service Devices and Service Concepts
3 Baseband Troubleshooting Instructions
4 RF Troubleshooting Instructions
5 Camera Module Troubleshooting
6 System Module
Glossary
Hardware features ............................................................................................................................................1–5
Mobile enhancements.......................................................................................................................................1–6
HS-38WNokia bluetooth headset BH-202
HS-40Headset
HS-47Stereo headset
HS-50WNokia bluetooth headset BH-300
HS-51WNokia bluetooth headset BH-301
HS-52WNokia bluetooth headset BH-201
HS-58WNokia bluetooth headset BH-200
HS-68WNokia bluetooth headset BH-203
HS-73WNokia bluetooth headset BH-302
HS-78WNokia bluetooth headset BH-100
HS-79WNokia bluetooth headset BH-303
HS-80WNokia bluetooth headset BH-208
HS-84W/88WNokia bluetooth headset BH-204
HS-85WNokia bluetooth headset BH-206
HS-86WNokia bluetooth headset BH-207
MD-4Mini speakers
RM-362; RM-363
Service Devices and Service Concepts
Table of Contents
Service devices........................................................................................................................................................2–5
Service concepts .................................................................................................................................................. 2–13
POS flash concept with FLS-4S....................................................................................................................... 2–13
POS flash concept with FLS-5 ........................................................................................................................ 2–14
Flash concept with FPS-10............................................................................................................................. 2–15
RF-test/BB-tune concept with JBV-1............................................................................................................. 2–16
EM calibration concept with JBV-1................................................................................................................ 2–17
RF-test/BB-tune & flash concept with JBV-1, FPS-10................................................................................... 2–18
RF/BB tune& flash concept with MJ-137, FPS-10......................................................................................... 2–19
List of Figures
Figure 2 POS flash concept with FLS-4S............................................................................................................. 2–13
Figure 3 POS flash concept with FLS-5............................................................................................................... 2–14
Figure 4 Flash concept with FPS-10................................................................................................................... 2–15
Figure 5 RF-test/BB-tune concept with JBV-1................................................................................................... 2–16
Figure 6 EM calibration concept with JBV-1...................................................................................................... 2–17
Figure 7 RF-test/BB-tune & flash concept with JBV-1, FPS-10......................................................................... 2–18
RM-362; RM-363
Service Devices and Service Concepts
Service devices
The table below gives a short overview of service devices that can be used for testing, error analysis, and
repair of product RM-362; RM-363. For the correct use of the service devices, and the best effort of workbench
setup, please refer to various concepts.
CA-106DSEasy flash II cable
The cable is used for connecting phone DC port to the flash prommer
FPS-10.
CA-111DSEasy flash II cable
The cable is used for connecting phone DC port to either POS flashing
device FLS-4S or to the PROMMER box FPS-11.
CA-112DSEasy flash II cable
The CA-112DS easy flash II cable is used for connecting phone DC port
• Vusb output switchable by PC command
FPS-10 sales package includes:
• FPS-10 prommer
• Power Supply with 5 country specific cords
• USB cable
Note: FPS-21 is substitute FPS-10 if FPS-10 has not been set
up.
RM-362; RM-363
JBV-1Docking station
The JBV-1 docking station is a general tool that has been designed for
calibration and software update use. The JBV-1 is used together with
a docking station adapter as one unit
In calibration mode the JBV-1 is powered by an external power supply:
11-16V DC. When flashing the power for the phone must be taken from
the flash prommer.
Note: JBV-1 main electrical functions are:
• adjustable VBATT calibration voltage, current
measurement limit voltage: VCHAR, current measurement:
ICHAR
• adjustable ADC calibration voltage via BTEM and the BSI
signal
• BTEMP and BSI calibration resistor
• signal from FBUS to the phone via the parallel jig
General baseband troubleshooting......................................................................................................................3–5
Power supply test points..................................................................................................................................3–5
Phone cannot be powered on (I).....................................................................................................................3–6
Phone cannot be powered on (II)....................................................................................................................3–8
Phone cannot be flashed..................................................................................................................................3–9
Easy flash programming does not work...................................................................................................... 3–11
The phone does not register to the networks, or the phone cannot make a call................................... 3–14
SIM related faults................................................................................................................................................. 3–16
User interface....................................................................................................................................................... 3–17
Dead keys ........................................................................................................................................................ 3–18
No backlight for display or/and keys ........................................................................................................... 3–19
IHF/ringing tone fault.................................................................................................................................... 3–25
Figure 13 Troubleshooting when the "Contact Service" message is seen .................................................... 3–14
Figure 14 No registering or call ......................................................................................................................... 3–15
This means that the phone does not use any current at all when the supply is connected and/or power key
is pressed. It is assumed that the voltage supplied is 3.6VDC. The UEMCLite will prevent any functionality at
battery/supply levels below 2.9VDC.
If this kind of failure is presenting itself immediately after FLALI, it is most likely caused by ASIC's missing
contact with PWB.
If the MCU doesn’t service the watchdog register within the UEMCLite, the operations watchdog will run out
after approximately 32 seconds. Unfortunately, the service routine can not be measured.
Troubleshooting flow
Figure 10 Troubleshooting when phone does not stay on or phone is jammed
The flash programming can be done via the pads on the PWB (J2060). If failed, then follow up the trouble
shooting flow chart.
In case of flash failure in the FLALI station, swap the phone and send it back to the care program for further
analysis. Possible failures could be short-circuit of balls under µBGAs (UEMCLite, UPP4M, FLASH), or missing
or misaligned components.
In flash programming error cases, the flash prommer can give some information about a fault. The fault
information messages could be:
Phone doesn't set FBUS_TX line low
Because of the use of uBGA components, it is not possible to verify if there is a short circuit in the control and
address lines of MCU (UPP8M) and the memory (flash).
The flash programming can be done via the easy flash connector. If failed, then follow up the trouble shooting
below.
It is not possible to verify if there is a short circuit in control and address lines of MCU (UPP8M) and memory
(flash) because BGA package is used in RM-362/363.
This error can only happen at power up where several self-tests are run. If any of these test cases fails the
display will show the message: "Contact Service".
They are individual test cases, so the below lineup of error hunting's has no chronological order. Use common
sense and experience to decide which test case to start error hunting at.
Figure 13 Troubleshooting when the "Contact Service" message is seen
The phone does not register to the networks, or the phone cannot make a call
Context
If the phone doesn't register to the network, the fault can be in either BB or RF. Only few signals can be tested
since several signals are 'buried' in one or more of the inner layers of the PWB.
First, check that SIM LOCK is not causing the error by using a Test-SIM card and connect the phone to a tester.
The hardware of the SIM interface from UEMCLite (D2200) to the SIM connector (X2700) can be tested without
a SIM card. When the power is switched on the phone first check for a 1.8V SIM card and then a 3V SIM card.
The phone will try this four times, where after it will display ”Insert SIM card”.
The error ”SIM card rejected” means that the ATR message received from SIM card is corrupted, e.g. data
signal levels are wrong. The first data is always ATR and it is sent from card to phone.
For reference a picture with normal SIM power-up is shown below.
Figure 17 Signal diagram
User interface
Blank display
Context
The display does not show any information at all. For display blank, refer to troubleshooting flow below.
General RF troubleshooting ..................................................................................................................................4–7
General RF troubleshooting .............................................................................................................................4–7
Auto tuning........................................................................................................................................................4–9
Troubleshooting diagram for FM radio........................................................................................................ 4–50
Bluetooth and FM radio test points.............................................................................................................. 4–51
Introduction to Bluetooth troubleshooting ................................................................................................ 4–51
Bluetooth settings for Phoenix..................................................................................................................... 4–52
Bluetooth self tests in Phoenix..................................................................................................................... 4–53
Bluetooth BER failure troubleshooting........................................................................................................ 4–54
Figure 29 RF key components on PWB.................................................................................................................4–7
Figure 30 Supply points at UEM (D2200)..............................................................................................................4–8
Figure 31 Supply point at RF IC (N7600) ..............................................................................................................4–8
Figure 86 FM module output signal................................................................................................................... 4–51
Figure 87 BER test result..................................................................................................................................... 4–53
Figure 88 Bluetooth self tests in Phoenix......................................................................................................... 4–54
Most RF semiconductors are static discharge sensitive
Two types of measurements are used in the following. It will be specified if the measurement type is "RF" or
"LF".
• RF measurements are done with a Spectrum Analyzer and a high-frequency 500 ohm passive probe, for
example HP54006A. (Note that when measuring with the 500ohm probe the signal will be around 20dB
attenuated. The values in the following will have these 20dB subtracted and represent the real value seen
on the spectrum analyzer). Note that the testing have some losses which must be taken into consideration
when calibrating the test system.
• LF (Low frequency) and DC measurements should be done with a 10:1 probe and an oscilloscope. The probe
used in the following is 10Mohm/8pF passive probe. If using another probe then bear in mind that the
voltages displayed may be slightly different. Always make sure the measurement set-up is calibrated when
measuring RF parameters on the antenna pad. Remember to include the loss in the module repair jig when
realigning the phone.
So ESD protection must be applied during repair (ground straps and ESD soldering irons). Mjoelner and Bifrost
are moisture sensitive so parts must be pre-baked prior to soldering. Apart from key-components described
in this document there are a lot of discrete components (resistors, inductors and capacitors) for which
troubleshooting is done by checking if soldering of the component is done properly and checking if the
component is missing from PWB. Capacitors can be checked for short-circuiting and resistors for value by
means of an ohmmeter, but be aware in-circuit measurements should be evaluated carefully. In the following
both the name EGSM and GSM850 will be used for the lower band and both PCN and GSM1900 will be used
for the upper band.
By measuring with an oscilloscope at RXIP or RXQP on a working GSM900 receiver this picture should be seen.
Signal amplitude peak-peak 108mV. DC offset 1.0V.
By measuring with an oscilloscope at RXIP or RXQP on a working GSM1800 receiver this picture should be
seen. Signal amplitude peak-peak 114mV. DC offset 1.0V.
General instructions for GSM1800 TX troubleshooting
Steps
1. Apply a RF-cable to the RF-connector to allow the transmitted signal act as normal. RF-cable should be
connected to an attenuator at least 10dB before connected to the measurement equipment, otherwise
the PA may be damaged.
2. Start
3. Select File and Scan product.
4. Wait a while for the PC to read the information from the phone.
5. Select Testing and RF Controls.
6. Set the parameters as follows:
Phoenix
iBand: GSM 1800
iiActive Unit: TX
iii TX Power Level: 0
iv TX Data Type: Random
and establish a connection to the phone with the data cable e.g. FBUS.