Nokia 434 System Module 03

PAMS Technical Documentation
NHN–5NT Transceiver
Chapter 3
System Module JF5
Originat 05/98
Copyright 1998 Nokia Mobile Phones. All rights reserved.
PAMS
System Module JF5
Amendment Number
Technical Documentation
AMENDMENT RECORD SHEET
Date Inserted By Comments
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Originat 05/98
PAMS
Technical Documentation
CONTENTS
Transceiver NHN–5N – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baseband – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baseband Technical Summary – 6. . . . . . . . . . . . . . . . . . . . . . .
Modes of Operation – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Ratings – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signals – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UIF Connector – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Connector – 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Connections – 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CTRLU Control Block – 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description – 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Main Components – 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PWRU – 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction – 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Specifications – 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description – 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram of MUUMI ASIC – 22. . . . . . . . . . . . . . . . . . . . . .
Main components – 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AUDIO – 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction – 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Main features – 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical specifications – 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block description, Audio Processor – 28. . . . . . . . . . . . . . . . . .
Main components – 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Module JF5
RF Section – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Summary – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
List of Submodules – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Specification and Functional Description – 31. . . . . . . . . . . . . . . . .
Characteristics of the Module – 32. . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics – 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Connections – 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Antenna – 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional description , RF section – 38. . . . . . . . . . . . . . . . . . . . . .
Block Diagram – 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Key components – 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver – 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RX Synthesizer – 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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System Module JF5
RF Characteristics – 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver – 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RX Synthesizer – 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RX loop filter – 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TX Synthesizer – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TX Loop Filter – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Regulators – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AFC function – 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parts List of JF5 system module – 45. . . . . . . . . . . . . . . . . . . . . . . .
Technical Documentation
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Technical Documentation
Transceiver NHN–5N

Introduction

Functional Description
The NHN–5N transceiver electronics consists of the UI module PCB and
the RF/system PCB. The UI module is connected to the system module
with a connector. The system and RF submodules are interconnected
with PCB wiring. The phone can be connected to accessories with a bot-
tom system connector, which includes charging and accessory control.
Block Diagram
The NHN–5N consist of 2 PCB’s: JF5 system module and GN4 user inter-
face module.
System Module JF5
The JF5 consists of 2 submodules, BASEBAND and RF. BASEBAND
consist of 3 functional blocks: PWRU, CTRLU and AUDIO; RF also con-
sists of 3 modules: RX, SYNT, TX; while the GN4 is the User Interface
module (UIF–module, kindly refer to section 4.).
RX
PWRU
CTRLU
BASEBAND–submodule
UIF–module
LCDLCD
LCD Driver
AUDIO
SYNT
TX
RF–submodule
BUZZER MIC,EAR
DUP
ANT
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System Module JF5

Baseband

Introduction

The baseband submodule controls the internal operation of the phone. It
controls the user interface, i.e. LCD driver, keyboard and audio interface
functions. The module performs all signalling towards the system and car-
ries out audio–frequency signal processing. In addition, it controls the op-
eration of the transceiver and stores tuning data for the phone.
Baseband Technical Summary
All functional blocks of the baseband are mounted on a single multi layer
printed circuit board. This PCB contains also the RF–parts. The chassis
of the radio unit contains separating walls for baseband and RF. All com-
ponents of the baseband are surface mounted and soldered by reflow.
The connections to accessories are fed through the CAP (Common Ac-
cessory Platform) bottom connector of the radio unit. The connections to
User Interface –module (UIF) are fed through a board to board connector.
There is no physical connector between RF and baseband.
Technical Documentation
Modes of Operation
The module has three operating modes: stand–by, listening and con-
versation mode.
Standby mode:
MCU clock is switched off, only NIPA timer is running to enable battery
save timings.
If a charger is connected, the MCU doesn‘t go to standby mode.
Listening mode:
In the listening mode some blocks of the audio IC (NIPA) are in standby
state.
Conversation mode:
In the conversation mode all ICs are active.
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bits/s
Technical Documentation
Maximum Ratings
Parameter Value
Operating temperature range –25 ... +55 deg. C Storage temperature range –40 ... +85 °C VBAT max. 8.8 V (TX off) VBAT max. 7.5 V (TX on) VC max. 16 V. Battery charging is enabled +5 ... +45 °C
DC Characteristics
Pin / Conn. Line Symbol Minimum Typical /
Nominal
VCS
11.0V 12.0V 16.0V Slow charger
Maximum Unit / Notes
System Module JF5
VBA T 5.3V 6.0V 8.8V VRF 5.3V 6.0V 8.8V VBAT for RF mod-
VA 3.2V 3.3V 3.42V Imax = 40mA VL 3.2V 3.3V 3.42V Imax = 40mA VL3 4.5V 4.75V 5.0V Imax = 180mA VREF 3.2V 3.3V 3.42V Imax = 5mA
Signals
Pin /
Line Symbol Mini-
Conn.
6/system M2BUS
9.8V 10.3V 10.8V Fast charger
ule
mum
Typi-
cal /
Nomi-
Max-
i-
mum
Notes
nal
0V 0.7V Input low level
2.3V 5.25VInput high level
Isink<5m ABaud rate 9600
0V 0.2V 0.35VOutput low level
.
10/sys-
HOOK
tem
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4.1V 4.5V 5.0V Output high level 0V 0.5V Input low level
2.4V 3.2V Input high level
Hook
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detection
detection resistor in
g
F
key ad
PAMS
System Module JF5
Line SymbolPin /
Conn.
2/system VOUT
5/system BOOST0
11/sys­tem
BOOST1
Technical Documentation
Mini­mum
0V 0.2V 0.4V Output low, power
4.1V 4.5V 5.0V Output high, power
Typi-
cal /
Nomi-
nal
0V booster detect /
3.3V booster detect /
0V booster detect /
i-
mum
off
on
power control ”0”
power control ”1”
power control ”0”
NotesMax-
HDA de­vice pow­er on/off
RF booster
/ power select
RF booster
3.3V booster detect / power control ”1”
12/sys­tem
2/battery BSI
3/battery BTEMP 1.0V 47k, B=4050 NTC between
3,4/UIF BACKLIGHT
VCS
9.8V 16V Isink < 730mA
1.95V 400mAh Li–ION
0.45V 550mAh NiMH
1.95V 1500mAh Li–ION
BTEMP and ground in battery pack.
A 47k pull–up resistor in HP. Vibrator control output (AC– controlled)
0mA backlights off
40mA backlights on
/ power select
A 47k pull–up
HP.
Back­light– ing for keymat
17–24/UI
7–9/UIF ROW(0:2)
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LD(0:7)
0V 0.7V Output/Input low
2.3V 3.3V Output/Input high 0V 0.7V Input low
2.8V 3.3V Input high
LCD I/O,
p
output Keypad
input
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data/con
ON but
Technical Documentation
Line SymbolPin /
Conn.
25/UIF LCDREG
26/UIF LCDCS
27/UIF LCDRESET
11/UIF XNWR
Mini­mum
0V 0.7V Output low
2.8V 3.3V Output high 0V 0.7V Output low
2.8V 3.3V Output high 0V 0.7V Output low
2.8V 3.3V Output high 0V 0.7V Output low
2.8V 3.3V Output high
Typi-
cal /
Nomi-
nal
i-
mum
System Module JF5
NotesMax-
LCD
-
trol LCD chip
select LCD re-
set
LCD write
28/UIF XNRD
10/UIF LCDCLK
12/UIF XPWRON
0V 0.7V Output low
2.8V 3.3V Output high 0V 0.7V Output low
2.8V 3.3V Output high 0V 0.7V Input low
2.8V 3.3V Input high
LCD read
LCD clock
Power ton
UIF Connector
Signal Name Pin Notes
VL 1 Logic supply voltage 3.3V CALLLED 2 Call LED BACKLIGHT 3,4 Backlights on/off VNEG 6 Negative voltage for LCD module ROW0,1,2 7–9 Lines for keyboard read
-
LCDCLK 10 LCD Driver clock XNWR 11 LCD Driver write selection input XPWRON 12 Power on control from keyboard GND 13,14,15,16 Ground LD(0:7) 17–24 Parallel data for LCD driver LCDREG 25 LCD Driver control/data select
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System Module JF5
LCDCS 26 LCD Driver chip select LCDRESET 27 LCD Driver reset XNRD 28 LCD Driver read selection input
Technical Documentation
NotesPinSignal Name
System Connector
Signal Name Pin Notes
GND 1, 8 Power supply ground. XMIC 3 External audio input from accessories
or handsfree microphone. There is a pull–down resistor in accessory for identification
M2BUS 6 Serial bidirectional data and control be-
tween the handphone and accessories. A 10k pull–up resistor in HP.
BOOST0,1 5,11 RF booster detection lines / RF power-
level control.
HOOK 10 HOOK–indication. The phone has a
47k pull–up resistor. VOUT 2 Hand–free device power on/off. XEAR 9 External audio output to accessories or
handsfree speaker. There is a DC volt-
age control for HF unit mute control. BGND BGND Battery connector BTEMP BTEMP Battery connector, Battery temperature BSI BSI Battery connector VBAT B+ Battery connector VCS 12,CH+,
DC+
Battery charging voltage
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Technical Documentation
Connections
Battery Connector
4
+
34
Charging Connectors
3
12 7 1 6
12
Locking
System Module JF5
1
2
RF–connector
(not used)
System Connector
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System Module JF5
Technical Documentation
CTRLU Control Block
The Control block controls all phones functions and it includes modem and SIS–processor too.
CTRLU internal signals, input
Signal Name Notes From
VL Logic supply voltage, 3.3V. PWRU VL3 Logic supply voltage, 4.75V. PWRU VREF Reference voltage 3.3V 3%. Max. PWRU XRES Reset line from MUUMI PWRU PWRON Power on signal from MUUMI PWRU VCHARG Charger voltage to A/D converter PWRU VBATSW Battery voltage to A/D converter. VCHARG CLKMCU Clock signal from NIP A. AUDIO NMI No maskable Interrupt reques from NIPA AUDIO XINT Interrupt reques from NIPA. AUDIO HOOK HOOK–indication SYSTEM BTEMP Battery temperature SYSTEM BSI Battery size indication SYSTEM M2BUS Serial interface SYSTEM RFTEMP RF temperature SYNT RSSI Received signal strenght indication RX TXI Transmitter output power level indication TX XPWRON Power buttom from UIF. UIF ROW0 Line for keyboard read. UIF ROW1 Line for keyboard read. UIF ROW2 Line for keyboard read. UIF ACCDET Accessory detection line SYSTEM
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Technical Documentation
System Module JF5
CTRLU internal signals, output
Signal Name Notes To
CSW Charger control PWRU VOUT Headset–adapter powersupply SYSTEM M2BUS Common serial clock (NIPA,sis) SYSTEM AGC Gain control RX RXE RX Circuit power on/off RX SCLK Synchronous data clock for synthesizers SYNT SDAT Synchronous data for synthesizers /
TX duplex filter current control 2 (option) SLE Synthesizer data latch enable SYNT TXE Transmitter control (on/off) TX TXC Transmitter Power Control TX XNCS NIPA chip select signal AUDIO XNWR NIPA/LCD write control signal AUDIO.UIF
SYNT, TX
XNRD NIPA/LCD read control signal AUDIO,UIF NA0–3 NIPA/LCD address bus AUDIO,UIF ND0–7 NIPA/LCD data bus AUDIO,UIF EARENA Ear amplifier enable AUDIO KBINT Keyboard interrupt AUDIO MBUSINT MBUS interrupt AUDIO MBUSOUT MBUS out PWRU LIGHTS Backlights on/off UIF LCDCS LCD Driver chip select UIF LCDRESET LCD Driver reset UIF XEARON External ear amplifier enable SYSTEM XEARDC PHF5 DC mute control SYSTEM
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System Module JF5
Block Description
– CTRLU – PWRU
MCU controls the watchdog timer in the MUUMI ASIC. It sends a positive pulse approximately once every 1 s to the XPWROFF pin of the MUUMI to keep the power on. If the CTRLU fails to deliver this pulse, the MUUMI will remove power from the system. The CTRLU controls also the char­ger on/off switching in the PWRU block. When power off is requested, the CTRLU leaves the MUUMI watchdog without reset. After the watch­dog has elapsed the MUUMI cuts off the supply voltages from the phone. Battery charging is controlled by CSW line.
VBATSW , Battery voltage measurement
Battery voltage can be measured from 5.4 V to 10.3 V nominal with 3.3 V reference voltage. The absolute accuracy is low because of the refer­ence 3 % accuracy and A/D–converter +/– 8 LSB accuracy . This battery voltage measurement offset error must be calibrated with input voltage
6.0 V and 8.2 V. The A/D conversion result can be calculated from the following equation:
Technical Documentation
A/D readout = 1024 * (VBATSW* ( 47/147)) / VREF
VREF=3.3 V
For example:
8.2 V results 814 = 32EH
6.0 V results 595 = 253H
VCHARG , Charger voltage measurement
Charger voltage can be measured up to 18.3 V nominal. The A/D–con­version result can be calculated from equation :
A/D readout = 1024 * (VCSW*(22/122)) / VREF VREF=3.3 V For example:
12.0 V gives 671 = 29FH
6.0 V gives 336 = 150H
BSI , Battery size indication
Battery type can be defined with the BSI resistor value. A NiMH battery has a different BSI resistor compared with a Li–ION battery. Different sizes of the Li–ION batteries cannot be identified.
BTEMP , Battery temperature measurement
Battery temperature measurement is implemented with a 47 kohm NTC with N value of 4050 and 47 kohm pullup resistor. The A/D conversion readout can be calculated from equation:
Page 3 – 14
A/D readout= 1024* ( R
For example:
45 C gives ? 25 C gives ? 5 C gives ? 0 C gives ?
NTC
/( R
NTC
+47k))
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Technical Documentation
Battery voltage is measured over the VBATSW and charging voltage over the VCHARG. Battery temperature is measured over the BTEMP line. Battery size is determined by reading the BSI line. This is pulled to +3,3V by a 47kohm resistor. In the battery pack a ”size” resistor is connected between BSI and GND. Battery charging is controlled by the CSW line. Muumi watchdog is refreshed by controlling XPWROFF line.
– CTRLU – AUDIO
Interface between the MCU and the NIPA circuit is a bidirectional 8–bit data bus with 4 address lines. Address, data and control lines are used in the MCU as I/O–port pins. The data lines direction is controlled with the MCU data direction register. The interface includes address outputs NA0–3, data inputs (read) / outputs (write) ND0–7, chip select control out­put XCS , read control output XRD, write control output XWR and inter­rupt input XINT. When the MCU is in sleep state, the control signals XRD and XCS must be in ’0’ state and the address output NA0–3 and NWR in ’1’ state and data lines ND0–7 must be in ‘0‘ state.
– CTRLU – UIF
System Module JF5
The keyboard is connected directly to the controller. ND0–6 are the out­put lines and ROW0–2 are the input lines. Keyboard scanning is done by driving one ND line to 0 V at the time. If any key is pressed, then the cor­responding ROW line goes to 0V and the phone knows which key is pressed.
Data to the LCD Driver is written and read by ND(0:7) lines. XNRD/ XNWT are the read / write selection lines and NA0 is the instruction / data register selection line. LCDCS line enables the LCD driver.
ND(0:7) lines are in 0 V state when phone is in sleep mode so that any key pressing can be indicated.
Keyboard and LCD lights are controlled by LIGHTS signal.
– CTRLU – RX
RX circuit power is switched on/off by RXE signal. The received signal strength is measured over the RSSI and the inter-
mediate frequency is measured over the IF.
– CTRLU – SYNT
RF temperature is measured over the RFTEMP. Frequency is controlled by the AFC signal. The synthesizer is controlled via the synchronous se­rial bus SDAT/SCLK. The data is latched to the synthesizer by the posi­tive edge of SLE line. The TX synthesizer power on/off (TXS/port P3) line is controlled via PLL circuit.
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System Module JF5
– CTRLU – TX
The transmitter output power level is measured over the TXI. TXE line activates the power module. The power is controlled via TXC line which is a PWM–controlled output port.
Technical Documentation
Main Components
– MCU
The phone MCU H8/3092 is a CMOS MCU. All the memory needed (128 kB ROM, 4 kB RAM) except the EEPROM, is located in the controller. MCU operating clock (7.3728 MHz) is generated on the NIPA.
MCU Pins are listed in the table:
Pin No Port Signal Description
1 PB0 SISCLK Clock for SIS prosessor 2 PB1 SISDATA Serialdata to SIS prosessor 3 PB2 EDATA Serial data to EEPROM 4 PB3 RXD Serial interface (M2BUS) 5 PB4 SCLK Serial clock for synthesiz 6 PB5 HOOK Handset hook signal 7 PB6 PWRON Power button 8 PB7 SLE RX/TX synthesizer latch 9 P90 TXD Serial interface (M2BUS) 10 P92 RXD M2BUS net free timer input 11 P94 ECLK Clock to EEPROM 12 Vss GND MCU Ground 13–20 P30–P37 ND0–7 Paraller data bus for NIPA,LCD & keys 21 Vcc VL Power supply for processor 22 P10 NA0 Address line for NIPA and LCD regis-
ter 23 P11 NA1 Address line for NIPA 24 P12 NA2 Address line for NIPA 25 P13 NA3 Address line for NIPA 26 P14 XNCS NIPA chip select 27 P15 XNWR Read/write control to NIPA 28 P16 XNRD Read/write control to NIPA 29 P17 LCDCD LCD chip select 30 GND MCU Ground
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Technical Documentation
31 32–35 P21–P24 ROW0–3 Keypad inputs 36 P25 protoseries indicator, pull–down if pro-
37 P26 38 P27 CALLCNT Call continue during battery change 39 P50 XPWROFF Muumi watchdog refresh 40 P51 EARENA EAR amplifier enable 41 P52 42 P53 LCDRESET Reset to LCD 43 P60 44 MD0 45 MD1 46
P20 LIGHTS Backlight control
to
System Module JF5
47 STBY 48 RES XRES Reset from MUUMI 49 NMI NMI Interrupt request from NIPA 50 Vss GND Ground 51 EXTAL EXTAL External system clock from NIPA 52 XTAL 53 Vcc VL 54 P63 TXE Transmitter on/off 55 P64 AGC Gain control 56 P65 RXE RX circuit power on/off 57 RESO 58 AVcc 59 P70 VBATSW Battery voltage 60 P71 VCHARG Charger voltage 61 P72 RSSI Received signal strength 62 P73 TXI Transmitter power monitor 63 P74 BTEMP Battery temperature 64 P75 BSI Battery size indication 65 P76 RFTEMP RF temperature 66 P77 ACCDET Accessory detection 67 Vref Vref Reference voltage for processor 68 AVcc Vref Reference voltage for processor
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