• CSYNC comparator
4 levels (programmable), vector interrupt, macro service, context switching
9 (including NMI)
19 (including software interrupt)
HALT/STOP mode/low power dissipation mode/low power dissipation HALT mode
STOP mode can be released by input of valid edge of NMI pin, watch interrupt (INTW), or
3.5Real-time Output Port ...........................................................................................................................29
3.6Super Timer Unit ...................................................................................................................................33
3.9VCR Analog Circuits .............................................................................................................................41
3.10 Watch Function .....................................................................................................................................47
3.11 Clock Output Function .........................................................................................................................48
4. INTERNAL/EXTERNAL CONTROL FUNCTION............................................................................ 49
4.1Interrupt Function .................................................................................................................................49
4.4Reset Function ......................................................................................................................................60
APPENDIX A. DEVELOPMENT TOOLS ............................................................................................... 79
APPENDIX B. RELATED DOCUMENTS ............................................................................................... 81
10
µ
PD784915B, 784916B
1. DIFFERENCES AMONG µPD784915 SUBSERIES PRODUCTS
The µPD784915 Subseries consists of the six products listed in Table 1-1. The µPD784915A is a low-cost process-
shrinked version of the µPD784915. The µPD784916A expands the internal ROM capacity of the µPD784915 to 62
µ
Kbytes. The
and 784916A.
The µPD78P4916 features writable one-time PROM instead of the mask ROM of the µPD784915, 784915A,
784916A, 784915B, and 784916B. Except for this substitution of PROM for ROM and the fact that PROM capacity
differs from the ROM capacities offered in the other products, the
products.
In switching from the PROM product, used for debugging and testing application systems, to the mask ROM
products for mass production, be careful to check the differences among these products.
For details on the CPU functions and the internal hardware, refer to
Hardware (U10444E).
PD784915B and 784916B feature improved electrical characteristics compared to the µPD784915A
and the µPD78P4916 differ with respect to the items listed below.
• P40 to P47, P50 to P57: Low-level input voltage
• VDD supply current
• Data hold current
• CTL amplifier: Phase signal elimination ratio
• CFG amplifier: CFGAMPO low-level output current
For details, refer to the data sheet of each product.
• µPD784915A/784916AData Sheet (U11022J)
• µPD784915B/784916BData Sheet (This document)
• µPD78P4916Data Sheet (U11045J)
µ
PD784916A
µ
PD784915B
µ
PD784916B
µ
PD78P4916
Note
Note
Note The internal PROM and internal RAM capacities can be changed using the internal memory selection register
(IMS).
CautionThe PROM version and mask ROM version differ in noise immunity and noise radiation, etc. When
considering replacing a PROM version with a mask ROM version when switching from preproduction
to volume production, perform sufficient evaluation using a CS version (not ES version) of the
mask ROM version.
11
2. PIN FUNCTIONS
2.1 Port Pins
µ
PD784915B, 784916B
Pin NameI/O
P00 to P07I/OReal-time8-bit I/O port (port 0).
P40 to P47I/O
P50 to P57I/O
P60I/OSTRB/CLO8-bit I/O port (port 6).
P61SCK1/BUZ• Can be set in input or output mode in 1-bit units.
P62SO1• Can be connected with software pull-up resistors.
P63SI1
P64
P65HWIN
P66PWM4
P67PWM5
P70 to P77InputANI0 to ANI78-bit input port (port 7)
P80I/OReal-timePseudo VSYNC output7-bit I/O port (port 8).
P82output portHASW output• Can be set in input or output mode in
P83ROTC output• Can be connected with software pull-
P84PWM2
P85PWM3
P86PTO10
P87PTO11
P90I/OENV7-bit I/O port (port 9).
P91 to P95KEY0 to KEY4• Can be set in input or output mode in 1-bit units.
P96
Alternate Function
output port• Can be set in input or output mode in 1-bit units.
• Can be connected with software pull-up resistors.
-
-
-
-
8-bit I/O port (port 4).
• Can be set in input or output mode in 1-bit units.
• Can be connected with software pull-up resistors.
8-bit I/O port (port 5).
• Can be set in input or output mode in 1-bit units.
• Can be connected with software pull-up resistors.
• Can be connected with software pull-up resistors.
Function
1-bit units.
up resistors.
12
2.2 Non-Port Pins (1/2)
µ
PD784915B, 784916B
Pin NameI/O
REEL0INInputINTP3Reel FG input
REEL1IN
DFGIN
DPGIN
CFGIN
CSYNCIN
CFGCPIN
CFGAMPOOutput
PTO00Output
PTO01
PTO02
PTO10P86
PTO11P87
PWM0Output
PWM1
PWM2P84
PWM3P85
PWM4P66
PWM5P67
HASWOutputP82Head amplifier switch signal output
ROTCOutputP83Chroma rotation signal output
ENVInputP90Envelope signal input
SI1InputP63Serial data input (serial interface channel 1)
SO1OutputP62Serial data output (serial interface channel 1)
SCK1I/OP61/BUZSerial clock I/O (serial interface channel 1)
SI2InputBUSYSerial data input (serial interface channel 2)
SO2Output
SCK2I/O
BUSYInputSI2Serial busy signal input (serial interface channel 2)
STRBOutputP60/CLOSerial strobe signal output (serial interface channel 2)
ANI0 to ANI7Analog inputP70 to P77Analog signal input of A/D converter
ANI8 to ANI11
CTLIN
CTLOUT1Output
CTLOUT2I/O
RECCTL+, RECCTL–I/O
CTLDLY
VREFC
NMIInput
INTP0 to INTP2Input
INTP3InputREEL0IN
KEY0 to KEY4InputP91 to P95Key input signal input
CLOOutputP60/STRBClock output
BUZOutputP61/SCK1Buzzer output
--
--
--
Alternate Function
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Function
Drum FG, PFG input (ternary)
Drum PG input
Capstan FG input
Composite SYNC input
CFG comparator input
CFG amplifier output
Programmable timer output of super timer unit
PWM output of super timer unit
Serial data output (serial interface channel 2)
Serial clock I/O (serial interface channel 2)
CTL amplifier input capacitor connection
CTL amplifier output
Logic signal input/CTL amplifier output
RECCTL signal output/PBCTL signal input
External time constant connection (for RECCTL rewriting)
VREF amplifier AC connection
Non-maskable interrupt request input
External interrupt request input
Reset input
Crystal connection for main system clock oscillation
Crystal connection for subsystem clock oscillation.
Crystal connection for watch clock oscillation
Positive power supply to analog circuits
GND of analog circuits
Reference voltage input to A/D converter
Positive power supply to digital circuits
GND of digital circuits
Internally connected. Directly connect to VSS.
14
µ
PD784915B, 784916B
2.3 I/O Circuits and Connection of Unused Pins
Table 2-1 shows the I/O circuit type of each pin and the recommended connection of unused pins. For the
configuration of each type of I/O circuit, refer to Figure 2-1.
Table 2-1. I/O Circuit Type of each Pin and Recommended Connection of Unused Pins (1/2)
PinI/O Circuit TypeI/ORecommended Connection of Unused Pins
P00 to P075-AI/OInput: Connect to VDD
P40 to P47
P50 to P57
P60/STRB/CLO
P61/SCK1/BUZ8-A
P62/SO15-A
P63/SI18-A
P645-A
P65/HWIN8-A
P66/PWM45-A
P67/PWM5
P70/ANI0 to P77/ANI79InputConnect to VSS
P805-AI/OInput: Connect to VDD
P82/HASW
P83/ROTC
P84/PWM2
P85/PWM3
P86/PTO10
P87/PTO11
P90/ENV
P91/KEY0 to P95/KEY48-A
P965-A
SI2/BUSY2-AInputConnect to VDD
SO24OutputHi-Z: Connect to VSS via a pull-down resistor
SCK28-AI/OInput: Connect to VDD
ANI8 to ANI117InputConnect to VSS
RECCTL+, RECCTL–—I/OWhen ENCTL = 0 and ENREC = 0: Connect to VSS
Output: Leave open
Output: Leave open
Others: Leave open
Output: Leave open
Remark ENCTL : bit 1 of amplifier control register (AMPC)
ENREC: bit 7 of amplifier mode register 0 (AMPM0)
15
µ
PD784915B, 784916B
Table 2-1. I/O Circuit Type of each Pin and Recommended Connection of Unused Pins (2/2)
PinI/O Circuit TypeI/ORecommended Connection of Unused Pins
DFGIN—InputWhen ENDRUM = 0: Connect to VSS
DPGINWhen ENDRUM = 0 or ENDRUM = 1 and SELPGSEPA
= 0: Connect to VSS
CFGIN, CFGCPINWhen ENCAP = 0: Connect to VSS
CSYNCINWhen ENCSYN = 0: Connect to VSS
REEL0IN/INTP3, REEL1INWhen ENREEL = 0: Connect to VSS
CTLOUT1—OutputLeave open
CTLOUT2—I/OWhen ENCTL = 0 and ENCOMP = 0: Connect to VSS
When ENCTL = 1: Leave open
CFGAMPO—OutputLeave open
CTLIN——When ENCTL = 0: Leave open
VREFCWhen ENCTL = 0 and ENCAP = 0 and ENCOMP = 0:
Leave open
CTLDLYLeave open
PWM0, PWM13OutputLeave open
PTO00 to PTO02
NMI2InputConnect to VDD
INTP0Connect to VDD or VSS
INTP1, INTP22-AInputConnect to VDD
AVDD1, AVDD2——Connect to VDD
AVREF, AVSS1, AVSS2Connect to VSS
RESET2——
XT1——Connect to VSS
XT2Leave open
ICDirectly connect to VSS
Remark ENDRUM: bit 2 of amplifier control register (AMPC)
SELPGSEPA : bit 2 of amplifier mode register 0 (AMPM0)
ENCAP: bit 3 of amplifier control register (AMPC)
ENCSYN: bit 5 of amplifier control register (AMPC)
ENREEL: bit 6 of amplifier control register (AMPC)
ENCTL: bit 1 of amplifier control register (AMPC)
ENCOMP: bit 4 of amplifier control register (AMPC)
16
Figure 2-1. I/O Circuits of Pins (1/2)
µ
PD784915B, 784916B
Type 2
IN
Schmitt trigger input with hysteresis characteristics
Type 2-A
V
DD
P-ch
pullup
enable
IN
Schmitt trigger input with hysteresis characteristics
Type 3
DD
V
P-ch
data
N-ch
OUT
Type 5-A
pullup
enable
data
output
disable
input
enable
Type 7
IN
P-ch
N-ch
DD
V
P-ch
N-ch
Comparator
+
-
V
P-ch
DD
IN/
OUT
Type 4
DD
data
output
disable
Push-pull output that can make output high
impedance (both P-ch and N-ch are off)
V
P-ch
N-ch
OUT
Type 8-A
pullup
enable
data
output
disable
V
REF
(threshold voltage)
DD
V
P-ch
N-ch
V
P-ch
DD
IN/
OUT
17
Type 9
Figure 2-1. I/O Circuits of Pins (2/2)
µ
PD784915B, 784916B
P-ch
IN
N-ch
V
Comparator
+
-
REF
(threshold voltage)
input enable
18
µ
PD784915B, 784916B
3. INTERNAL BLOCK FUNCTIONS
3.1 CPU Registers
3.1.1 General-purpose registers
µ
PD784916B has eight banks of general-purpose registers. One bank consists of sixteen 8-bit general-
The
purpose registers. Two of these 8-bit registers can be used in pairs as a 16-bit register. Four of the 16-bit generalpurpose registers can be used to specify a 24-bit address in combination with an 8-bit address expansion register.
These eight banks of general-purpose registers can be selected by software or context switching function.
The general-purpose registers, except for the address expansion registers V, U, T, and W, are mapped to the
internal RAM.
Figure 3-1. Configuration of General-Purpose Registers
A (R1)X (R0)
AX (RP0)
B (R3)C (R2)
BC (RP1)
R5R4
RP2
R7R6
RP3
R9R8V
VP (RP4)
VVP (RG4)
R11R10U
UP (RP5)
UUP (RG5)
D (R13)E (R12)T
DE (RP6)
TDE (RG6)
H (R15)L (R14)W
HL (RP7)
WHL (RG7)
( ): absolute name
8 banks
Caution Although R4, R5, R6, R7, RP2, and RP3 can be used as X, A, C, B, AX, and BC registers,
respectively, by setting the RSS bit of PSW to 1, do not use this function. The function of the
RSS bit is planned to be deleted from the future models in the 78K/IV Series.
19
µ
PD784915B, 784916B
3.1.2 Other CPU registers
(1) Program counter
µ
The program counter of the
PD784916B is 20 bits wide. The value of the program counter is automatically
updated as the program is executed.
190
PC
(2) Program status word
This is a register that holds the various statuses of the CPU. Its contents are automatically updated as the program
is executed.
12111098
PSWH UF15RBS214RBS113RBS0
PSW
PSWLS7Z
6
RSS
5AC4IE3
Note
0
P/V201CY
Note The RSS flag is provided to maintain compatibility with the microcontrollers in the 78K/III Series. Always
set this flag to 0 except when the software of the 78K/III Series is used.
(3) Stack pointer
This is a 24-bit pointer that holds the first address of the stack.
Be sure to write 0 to the high-order 4 bits.
230
SP
000200
3.2 Memory Space
The µPD784916B can access a 64 Kbyte memory space.
Table 3-1 shows the addresses of the internal ROM and internal data areas.
Table 3-1. Memory Space
Part NumberInternal ROM Area Internal Data Area
µ
PD784915B0000H-BFFFHFA00H-FFFFH
µ
PD784916B0000H-F7FFH
Caution Some products in the 78K/IV Series can access up to 1 Mbyte of memory space in an address
expansion mode which is set by the LOCATION instruction. However, the memory space of the
µ
PD784916B is 64 Kbytes (0000H to FFFFH). Therefore, be sure to execute the LOCATION 0
instruction immediately after reset to set the memory space to 64 Kbytes (the LOCATION
instruction cannot be used more than twice).
20
µ
Figure 3-2. Memory Map of µPD784915B
FEFFH
FE80H
FE7FH
PD784915B, 784916B
General-purpose
registers (128 bytes)
FFFFH
FF00H
FEFFH
Data
memory
FA00H
F9FFH
Memory space (64 Kbytes)
C000H
BFFFH
data memory
Program memory/
Special function register
(SFR) (256 bytes)
Internal RAM
(1280 bytes)
Cannot be used
Internal ROM
(49152 bytes)
0000H
FE3BH
FE06H
FD00H
FCFFH
FA00H
BFFFH
1000H
0FFFH
0800H
07FFH
0080H
007FH
0040H
003FH
0000H
Macro service control
word area (54 bytes)
Data area (512 bytes)
Program/data area
(768 bytes)
Program/data area
(49152 bytes)
CALLF entry area
(2048 bytes)
CALLT table area
(64 bytes)
Vector table area
(64 bytes)
21
Figure 3-3. Memory Map of µPD784916B
FEFFH
FE80H
FE7FH
µ
PD784915B, 784916B
General-purpose
registers (128 bytes)
FFFFH
FEFFH
Data
memory
FA00H
F9FFH
F7FFH
Memory space (64 Kbytes)
data memory
Program memory/
Special function register
FF00H
F800H
0000H
(SFR) (256 bytes)
Internal RAM
(1280 bytes)
Cannot be used
Internal ROM
(63488 bytes)
FE3BH
FE06H
FD00H
FCFFH
FA00H
F7FFH
1000H
0FFFH
0800H
07FFH
0080H
007FH
0040H
003FH
0000H
Macro service control
word area (54 bytes)
Data area (512 bytes)
Program/data area
(768 bytes)
Program/data area
(63488 bytes)
CALLF entry area
(2048 bytes)
CALLT table area
(64 bytes)
Vector table area
(64 bytes)
22
µ
PD784915B, 784916B
3.3 Special Function Registers (SFRs)
Special function registers are assigned special functions and mapped to a 256-byte space from addresses FF00H
through FFFFH. These registers include mode registers and control registers that control the internal peripheral
hardware units.
Caution Do not access an address to which no SFR is assigned. If such an address is accessed by
µ
mistake, the
Table 3-2 lists the special function registers (SFRs). The meanings of the symbols in this table are as follows:
• Abbreviation............................ Abbreviation of an SFR. This abbreviation is reserved for NEC’s assembler
• R/W ......................................... Indicates whether the SFR in question can be read or written.
PD784916B may be deadlocked. This deadlock can be cleared only by reset input.
(RA78K4). With a C compiler (CC78K4), the abbreviation can be used as an sfr
variable by the #pragma sfr instruction.
R/W : Read/write
R: Read only
W: Write only
• Bit length ................................. Indicates the bit length (word length) of the SFR.
• Bit units for manipulation ....... Indicates bit units in which the SFR in question can be manipulated. An SFR that
can be manipulated in 16-bit units can be described as the operand sfrp of an
instruction. Specify an even address to manipulate this SFR.
An SFR that can be manipulated in 1-bit units can be described for a bit
manipulation instruction.
• After reset ............................... Indicates the status of each register after the RESET signal has been input.
23
µ
PD784915B, 784916B
Table 3-2. Special Function Registers (1/4)
BitBit Units forAfter
AddressSpecial Function Register (SFR) NameSymbolR/W LengthManipulationReleasing
1 bit8 bits 16 bitsReset
FF00H Port 0P0R/W8√√
FF04H Port 4P48√√
FF05H Port 5P58√√
FF06H Port 6P68√√
FF07H Port 7P7R8√√
FF08H Port 8P8R/W8√√
FF09H Port 9P98√√
FF0EH Port 0 buffer register LP0L8√√
FF0FH Port 0 buffer register HP0H8√√
FF10H Timer 0 compare register 0CR0016
FF11H Event counter compare register 0ECC0W8
FF12H Timer 0 compare register 1CR01R/W16
FF13H Event counter compare register 1ECC1W8
FF14H Timer 0 compare register 2CR02R/W16
FF15H Event counter compare register 2ECC2W8
FF16H Timer 1 compare register 0CR10R/W16
FF17H Event counter compare register 3ECC3W8
FF18H Timer 1 compare register 1CR11R/W16
FF1AH Timer 1 compare register 2CR12R16
FF1CH Timer 1 compare register 3CR13R/W16
FF1EH Timer 2 compare register 0CR2016
FF20H Port 0 mode registerPM0W8
FF24H Port 4 mode registerPM48
FF25H Port 5 mode registerPM58
FF26H Port 6 mode registerPM68
FF28H Port 8 mode registerPM88
FF29H Port 9 mode registerPM98
FF2EH Real-time output port 0 control registerRTPCR/W8√√
FF30H Timer register 0TM0R16
FF31H Event counterECR/W8
FF32H Timer register 1TM1R16
FF34H Free running counter (bits 0 to 15)FRCL16
FF35H Free running counter (bits 16 to 21)FRCH8
FF36H Timer register 2TM216
FF38H Timer control register 0TMC0R/W8√√
FF39H Timer control register 1TMC18√√
FF3AH Timer control register 2TMC28√√
FF3BH Timer control register 3TMC38√√
--
-
--
-
--
-
--
-
--
--
--
--
-
-
-
-
-
-
--
-
--
--
-
--
√
√
√
√
√
√
√
√
√
√
√
√
-
Undefined
-
-
-
-
-
-
-
√ Cleared to 0
-
√
-
√
-
√
-
√
√
√
√
-
-
-
-
-
-
√ Cleared to 0
-
√
√0000H
√ Cleared to 0
-
-
-
-
FFH
FDH
7FH
00H
00H
00H
00×00000
Remark Cleared to 0: Counter is initialized to 0 within 16 clocks after the reset signal has been deasserted (the
contents before initialization are undefined).
24
µ
PD784915B, 784916B
Table 3-2. Special Function Registers (2/4)
BitBit Units forAfter
AddressSpecial Function Register (SFR) NameSymbolR/W LengthManipulationReleasing
Remark Cleared to 0: Counter is initialized to 0 within 16 clocks after the reset signal has been deasserted (the
contents before initialization are undefined).
26
µ
PD784915B, 784916B
Table 3-2. Special Function Registers (4/4)
BitBit Units forAfter
AddressSpecial Function Register (SFR) NameSymbolR/W LengthManipulationReleasing
1 bit8 bits 16 bitsReset
FFB9H FRC capture register 4HCPT4HR8
FFBAH FRC capture register 5LCPT5L16
FFBBH FRC capture register 5HCPT5H8
FFC0H Standby control registerSTBCR/W8
FFC4H Execution speed select registerMMW8
FFCEH CPU clock status registerPCSR8√√
FFCFH
FFE0H Interrupt control register (INTP0)PIC0R/W8√√
FFE1H Interrupt control register (INTCPT3)CPTIC38√√
FFE2H Interrupt control register (INTCPT2)CPTIC28√√
FFE3H Interrupt control register (INTCR12)CRIC128√√
FFE4H Interrupt control register (INTCR00)CRIC008√√
FFE5H Interrupt control register (INTCLR1)CLRIC18√√
FFE6H Interrupt control register (INTCR10)CRIC108√√
FFE7H Interrupt control register (INTCR01)CRIC018√√
FFE8H Interrupt control register (INTCR02)CRIC028√√
FFE9H Interrupt control register (INTCR11)CRIC118√√
FFEAH Interrupt control register (INTCPT1)CPTIC18√√
FFEBH Interrupt control register (INTCR20)CRIC208√√
FFEDH Interrupt control register (INTTB)TBIC8√√
FFEEH Interrupt control register (INTAD)ADIC8√√
FFEFH Interrupt control register (INTP2)
FFF0H Interrupt control register (INTUDC)UDCIC8√√
FFF1H Interrupt control register (INTCR30)CRIC308√√
FFF2H Interrupt control register (INTCR50)CRIC508√√
FFF3H Interrupt control register (INTCR13)CRIC138√√
FFF4H Interrupt control register (INTCSI1)CSIIC18√√
FFF5H Interrupt control register (INTW)WIC8√√
FFF7H Interrupt control register (INTP1)PIC18√√
FFF8H Interrupt control register (INTP3)PIC38√√
FFFAH Interrupt control register (INTCSI2)CSIIC28√√
Oscillation stabilization time specification register
Note
Interrupt control register (INTCR40)
Note
OSTSW8
PIC28√√
CRIC40
-
--
-
-
-
-
√
√
√
√
√
-
√
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Cleared to 0
0000×000
20H
00H
43H
Note PIC2 and CRIC40 are at the same address (register).
Remark Cleared to 0: Counter is initialized to 0 within 16 clocks after the reset signal has been deasserted (the
contents before initialization are undefined).
27
µ
PD784915B, 784916B
3.4 PORTS
The µPD784916B is provided with the ports shown in Figure 3-4. Table 3-3 shows the function of each port.
Figure 3-4. Port Configuration
P00
Port 0
P07
P40
Port 4
P47
P50
Port 5
P57
P60
P67
P70-P77
P80
P82
P87
P90
P96
Port 6
8
Port 7
Port 8
Port 9
Table 3-3. Port Function
NamePin NameFunctionSpecification of Pull-up Resistor
Port 0P00 to P07
Port 4P40 to P47
Port 5P50 to P57
Port 6P60 to P67
Port 7P70 to P77
Port 8P80, P82 to P87
Port 9P90 to P96
Can be set in input or output mode in 1bit units.
Input port
Can be set in input or output mode in 1-
bit units.
Pull-up resistors are connected to all
pins in input mode.
Pull-up resistor is not provided.
Pull-up resistors are connected to all
pins in input mode.
28
µ
PD784915B, 784916B
3.5 Real-time Output Port
A real-time output port consists of a port output latch and a buffer register (refer to Figure 3-5).
The function to transfer the data prepared in advance in the buffer register to the output latch when a trigger such
as a timer interrupt occurs, and output the data to an external device is called a real-time output function. A port used
in this way is called a real-time output port (RTP).
2. When the real-time output port mode is set by the port mode control register 8 (PMC8), the HASW and
ROT-C signals that are set by the head amplifier switch output control register (HAPC) are directly output.
The HASW and ROT-C signals are synchronized with HSW output (TM0-CR00 coincidence signal).
However, the set signal is output immediately when the HAPC register is rewritten.
29
Figures 3-6 and 3-7 show the block diagrams of RTP0 and RTP8.
Figure 3-8 shows the types of RTP output trigger sources.
Figure 3-6. Block Diagram of RTP0
Internal bus
844
µ
PD784915B, 784916B
Real-time output port 0
control register
INTP0
INTCR01
INTCR02
Output trigger
Control circuit
Remark INTCR01: TM0-CR01 coincidence signal
INTCR02: TM0-CR02 coincidence signal
Figure 3-7. Block Diagram of RPT8
8
Head amplifier output control register (HAPC)
SEL
SEL
SEL
00
ROTC
ENV
HASW
PB
MOD2PBMOD1PBMOD0
Buffer register
P0HP0L
44
Output latch (P0)
P07P00
Internal bus
8
Port 8 buffer register L (P8L)
0
P8L4
SEL
P8L20P8L0
MD80
00
8
8
30
TM0-CR00
coincidence signal
PMC80
0
PMC82
PMC83
PMC8
TRG
P80
HASW, ROT-C
control circuit
Output latch (P8)
HSYNC
superimposition
circuit
P83P82P80
Pseudo V
SYNC
control circuit
output
INTP0
µ
PD784915B, 784916B
Figure 3-8. Types of RTP Output Trigger Sources
Real-time output port 0
control register (RTPC)
Capture
TM0
CR00
CR01
CR02
TM1
CR10
CR11
CR12
CR13
TM5
Interrupt and
timer output
Interrupt and
timer output
Interrupt
Selector
Selector
Trigger source select
register 0 (TRGS0)
Trigger of P0H
Trigger of P0L
Trigger of P82 and P83
Trigger of P80
CR50
Interrupt
31
µ
PD784915B, 784916B
RTP80 can output low-level, high-level, and high-impedance values real-time.
Because RTP80 can superimpose a horizontal sync signal, it can be used to create a pseudo vertical sync signal.
When RTP80 is set in the pseudo V
SYNC output mode, it repeatedly outputs a specific pattern when an output trigger
occurs.
Figure 3-9 shows the operation timing of RTP80.
Figure 3-9. Example of Operation Timing of RTP80
High impedance
P80
Trigger signal
High impedance
P80
Trigger signal
High level
Low level
High level
Low level
(a) When H
SYNC signal is superimposed
(b) Pseudo VSYNC output mode
32
µ
PD784915B, 784916B
3.6 Super Timer Unit
The µPD784916B is provided with a super timer unit that consists of the timers shown in Table 3-6.
Controls delay of video head switching signal
Controls delay of audio head switching signal
Controls pseudo VSYNC output timing
Creates internal head switching signal
Detects reference phase (to control drum phase)
Detects phase of drum motor (to control drum
phase)
Detects speed of drum motor (to control drum
speed)
Detects speed of capstan motor (to control
speed of capstan motor)
Detects remaining tape for reel FG
Playback: Creates internal reference signal
Recording: Buffer oscillator in case VSYNC is
missing
Controls RECCTL output timing
Detects phase of capstan motor (to control
capstan phase)
Controls VSYNC mask as noise prevention
measures
Controls duty detection timing of PBCTL signal
Measures cycle of PBCTL signal
Divides CFG signal frequency
Can be used as interval timer (to control system)
Detects duty of remote controller signal (to
decode remote controller signal)
Measures cycle of remote controller signal (to
decode remote controller signal)
Can be used as interval timer (to control system)
Creates linear tape counter
16-bit resolution (carrier frequency: 62.5 kHz)
8-bit resolution (carrier frequency: 62.5 kHz)
33
µ
PD784915B, 784916B
(1) Timer 0 unit
Timer 0 unit creates head switching signal and pseudo VSYNC output timing from the PG and FG signals of the
drum motor.
This unit consists of an event counter (EC: 8 bits), four compare registers (ECC0 to ECC3), a timer (TM0: 16
bits), and three compare registers (CR00 to CR02).
A signal indicating coincidence between the value of timer 0 and the value of a compare register can be used
as the output trigger of the real-time output port.
(2) Free running counter unit
The free running counter unit detects the speed and phase of the drum motor, and the speed and reel speed
of the capstan motor.
This unit consists of a free running counter (FRC), six capture registers (CPT0 to CPT5), a V
and a HSYNC separation circuit.
(3) Timer 1 unit
Timer 1 unit is a reference timer unit synchronized with the frame cycle and creates the RECCTL signal, detects
the phase of the capstan motor, and detects the duty factor of the PBCTL signal. This unit consists of the following
three groups.
SYNC separation circuit,
• Timer 1 (TM1), compare registers (CR10, CR11, and CR13), and capture register (CR12)
• Timer 3 (TM3), compare registers (CR30 and CR31), and capture register (CPT30)
• Event divider counter (EDV) and compare register (EDVC)
The TM1-CR13 coincidence signal can be used for automatic unmasking of V
real-time output port.
SYNC or as the output trigger of the
34
PTO00
PTO01
PTO02
µ
PD784915B, 784916B
PTO10
PTO11
To PBCTL signal
input block
INTCR00
INTCR01
INTCR02
RTP
RTP, A/D
RTP, A/D
Output control circuit
Mask
Divider
Clear
TM0
Selector
Writes
00H to EC
SelectorSelector
Selector
Figure 3-10. Block Diagram of Super Timer Unit (TM0, FRC, TM1)
Output control circuit
Output control circuit
(Superimposition)(Superimposition)
CR00
CR01
CR02
Selector
Selector
F/F
F/F
Clear
EC
ECC3
ECC2
ECC1
ECC0
INTCLR1
To P80
separation
SYNC
circuit
H
separation
SYNC
circuit
V
INTCPT1
FRC
CPT0
CPT1
Capture
Selector
Selector
Mask
Selector
Analog circuit
INTCPT2
INTCPT3
CPT2
CPT3
Capture
Capture
Capture
Selector
CPT4
CPT5
Capture
Capture
INTP3
SelectorSelector
INTCR10
Output control circuit
Selector
Clear
TM1
EDV
EDVC
Clear
INTCR11
INTCR12
INTCR13
INTCR30
Output control circuit
CR10
CR11
CR12
CR13
Selector
Capture
Clear
Selector
TM3
Selector
CR30
CR31
FFLVL
F/F
CTL
CPT30
Capture
DPGIN
DFGIN
CSYNCIN
REEL0IN
REEL1IN
CFGIN
PTO10
PBCTL
PTO11
35
µ
PD784915B, 784916B
(4) Timer 2 unit
Timer 2 unit is a general-purpose 16-bit timer unit.
This unit consists of a timer 2 (TM2) and a compare register (CR20).
The timer is cleared when the TM2-CR20 coincidence signal occurs, and at the same time, an interrupt request
is generated.
Figure 3-11. Block Diagram of Timer 2 Unit
Clear
TM2
CR20
INTCR20
(5) Timer 4 unit
Timer 4 unit is a general-purpose 16-bit timer unit.
This unit consists of a timer 4 (TM4), a capture/compare register (CR40), and a capture register (CR41).
The value of the timer is captured to CR40/CR41 when the INTP2 signal is input. This timer can be used to decode
a remote controller signal.
Figure 3-12. Block Diagram of Timer 4 Unit
Mask
Clear
TM4
INTP2
Selector
CR40
CR41
INTCR40
(6) Timer 5 unit
Timer 5 unit is a general-purpose 16-bit timer unit.
This unit consists of a timer 5 (TM5) and a compare register (CR50).
The timer is cleared by the TM5-CR50 coincidence signal, and at the same time, an interrupt request is generated.
36
Figure 3-13. Block Diagram of Timer 5 Unit
Clear
TM5
CR50
INTCR50
RTP, A/D
µ
PD784915B, 784916B
(7) Up/down counter unit
The up/down counter unit is a counter that realizes a linear time counter.
This unit consists of an up/down counter (UDC) and a compare register (UDCC).
The up/down counter counts up the rising edges of PBCTL and counts down the falling edges of PBCTL. When
the value of the up/down counter coincides with the value of the compare register, or when the counter underflows,
an interrupt request is generated.
Figure 3-14. Block Diagram of Up/Down Counter Unit
SELUD
PTO10
PTO11
PBCTL
Selector
P77
EDVC output
Selector
SelectorSelector
UP/DOWN
UDC
UDCC
INTUDC
(8) PWM output unit
The PWM output unit has three 16-bit accuracy output lines (PWM0, PWM1, and PWM5) and 8-bit accuracy
output lines (PWM2 to PWM4). The carrier frequency of all the output lines is 62.5 kHz (f
CLK = 8 MHz).
PWM0 and PWM1 can be used to control the drum motor and capstan motor.
Figure 3-15. Block Diagram of 16-Bit PWM Output Unit
(n = 0, 1, 5)
Internal bus
168
PWMn
158 70
88
Reload
Reload
Reload control
PWMC0
To selector
16 MHz
8-bit down counter
1/256
PWM pulse
generation circuit
8-bit counter
Output control
circuit
PWMn
RESET
37
µ
Figure 3-16. Block Diagram of 8-Bit PWM Output Unit
Internal bus
PD784915B, 784916B
PWM2
8-bit comparator
16 MHz
PWM3
8-bit comparator
PWM counter
PWM4
8-bit comparator
PWMC1
Output control
circuit
Output control
circuit
Output control
circuit
PWM4
PWM3
PWM2
3.7 Serial Interface
µ
PD784916B is provided with the serial interfaces shown in Table 3-7.
The
Data can be automatically transmitted or received through these serial interfaces, when the macro service is used.
Table 3-7. Types of Serial Interfaces
NameFunction
Serial interface channel 1• Clocked serial interface (3-wire)
Figure 3-17. Block Diagram of Serial Interface Channel n (n = 1 or 2)
Internal bus
SIOn registerCSIMn register
Selector
Serial clock counter
INTCSIn
SCKn
f
CLK
/8
f
CLK
/16
CLK
/32
f
f
CLK
/64
f
CLK
/128
CLK
/256
f
STRB
Busy detection circuit
Strobe generation circuit
Selector
CSIC2 register
Internal bus
Remark The circuits enclosed in the broken line are provided for serial interface channel 2 only.
39
µ
PD784915B, 784916B
3.8 A/D Converter
The µPD784916B has an analog-to-digital (A/D) converter with 12 multiplexed analog inputs (ANI0 to ANI11).
This A/D converter is of successive approximation type, and the conversion result is held by an 8-bit A/D conversion
µ
result register (ADCR) (conversion time: 10
A/D conversion can be started in the following two modes:
• Hardware start : Conversion is started by a hardware trigger
• Software start : Conversion is started by setting the A/D conversion mode register (ADM).
After conversion has been started, the A/D converter operates in the following modes:
• Scan mode : Sequentially selects more than one analog input to obtain data to be converted from all the pins.
• Select mode: Use only one pin for analog input to obtain successive data.
When the conversion result is transferred to ADCR, interrupt request INTAD is generated. By processing this
interrupt with the macro service, the conversion result can be successively transferred to memory.
A mode in which starting A/D conversion of the next pin is kept pending until the value of ADCR is read is also
available. When this mode is used, reading the conversion result by mistake when timing is shifted because an
interrupt is disabled can be prevented.
s at fCLK = 8 MHz).
Note
.
Note A hardware trigger can be one of the following coincidence signals, one of which is selected by the trigger
The CTL amplifier is used to amplify the playback control (PBCTL) signal that is reproduced from the CTL signal
recorded on a VCR tape.
The gain of the CTL amplifier is set by the gain control register (CTLM). Thirty-two types of gains can be set
in increments of about 1.78 dB.
µ
PD784195 is also provided with a gain control signal generation circuit that monitors the status of the
The
amplifier output to perform optimum gain control by program. The gain control signal generation circuit generates
a CTL detection flag that identifies the amplitude status of the CTL amplifier output. By using this CTL detection
flag, the gain of the CTL amplifier can be optimized.
The RECCTL driver writes a control signal onto a VCR tape.
This driver operates in two modes: REC mode that is used for recording, and rewrite mode used to rewrite the
VISS signal. The output status of the RECCTL± pin is changed by hardware, by using the timer output from the
super timer unit as a trigger.
Figure 3-19. Block Diagram of CTL Amplifier and RECCTL Driver
ANI11
CTLDLY
TOM1.4-TOM1.6
CTL head
CTLOUT1
CTLOUT2
RECCTL+
RECCTL
CTLIN
TM1-CR11 coincidence signal
RECCTL driver
-
VREF
AMPC. 1
+
-
AMPC. 1
+
-
CTLM. 0-CTLM. 4
Gain control signal
generation circuit
Waveform
shaping circuit
TM1-CR13 coincidence signal
TM3-CR30 coincidence signal
Selector
CTL detection flag L (AMPM0. 1)
CTL detection flag S (AMPM0. 3)
CTL detection flag clear (1 write to AMPM0. 6)
PBCTL signal (to timer unit)
42
µ
PD784915B, 784916B
(2) DPG comparator, DFG amplifier, and DPFG separation circuit
The DPG comparator converts the drum PG (DPG) signal that indicates the phase information of the drum motor
into a logic signal.
The DFG amplifier amplifies the drum FG (DFG) signal that indicates the speed information of the drum motor.
The DPFG separation circuit (ternary separation circuit) separates a drum PFG (DPFG) signal having speed and
phase information into a DFG and DPG signals.
Figure 3-20. Block Diagram of DPG Comparator, DFG Amplifier, and DPFG Separation Circuit
The CFG amplifier amplifies the capstan FG (CFG) signal that indicates the speed information of the capstan
motor. This amplifier consists of an operational amplifier and a comparator. The gain of the operational amplifier
is set by using an external resistor.
When the gain of the operational amplifier is set to 50 dB, the output duty accuracy of the CFG signal can be
improved to 50.0 ± 0.3%.
Figure 3-21. Block Diagram of CFG Amplifier
V
REF
AMPC.3
+
CFG amplifier
Capstan FG signal
CFGIN
CFGAMPO
CFGCPIN
AMPM0.0
-
V
REF
AMPC.3
+
CFG
comparator
AMPC.3
1
Selector
0
CFG signal
(to timer unit)
44
µ
PD784915B, 784916B
(4) Reel FG comparators
The reel FG comparator converts a reel FG signal that indicates the speed information of the reel motor into a
logic signal. Two comparators, one for take-up and the other for supply, are provided.
Figure 3-22. Block Diagram of Reel FG Comparators
V
REF
AMPC.6
AMPM0.0
Supply reel signal
Take-up reel signal
REEL0IN
AMPM0.0
REEL1IN
Reel FG comparator
V
REF
AMPC.6
Reel FG comparator
1
SelectorSelector
0
AMPC.6
1
0
Reel FG0 signal
(to timer unit)
Reel FG1 signal
(to timer unit)
(5) CSYNC comparator
The CSYNC comparator converts the COMPSYNC signal into a logic signal.
Figure 3-23. Block Diagram of COMPSYNC Comparator
V
REF
AMPM1.7
AMPC.5
AMPM0.0
COMP
SYNC
signal
CSYNCIN
CSYNC comparator
AMPC.5
1
0
Selector
SYNC
signal
C
(to timer unit)
45
µ
PD784915B, 784916B
(6) Reference amplifier
The reference amplifier generates a reference voltage (VREF) to be supplied to the internal amplifiers and
µ
comparators of the
PD784916B.
Figure 3-24. Block Diagram of Reference Amplifier
ENCAP (AMPC.3)
V
REF
(CFG amplifier)
V
REF
(CFG amplifier)
ENCTL (AMPC.1)
V
REF
(CTL amplifier)
ENDRUM (AMPC.2)
ENREEL (AMPC.6)
ENCSYN (AMPC.5)
V
REF
DFG amplifier, DPG comparator,
reel FG comparator, and CSYNC
comparator)
VREFC
AV
AV
DD1
SS1
+
+
+
+
Remark Multiple reference amplifiers are provided to assure the accuracy of the amplifiers and comparators.
46
µ
PD784915B, 784916B
3.10 Watch Function
The µPD784916B has a watch function that counts the overflow signals of the watch timer by hardware. As the
clock, the subsystem clock (32.768 kHz) is used.
Because this watch function is independent from the CPU, it can be used even while the CPU is in the standby
mode (STOP mode) or is reset. In addition, this function can be used at a low voltage of V
DD = 2.7 V (MIN.).
Therefore, by using only the watch function with the CPU set in the standby mode or reset, a watch operation can
be performed at a low voltage and low current dissipation.
In addition, the watch function can also be used while the CPU is in the normal operation mode, because a dedicated
counter is provided.
The watch function can be used to count up to about 17 years of data.
The hardware watch counters (HW0 and HW1) are shared with external input counters. These counters execute
counting at the falling edge of input to the P65 pin, and can be used to count the H
SYNC signals.
Figure 3-25. Block Diagram of Watch Counter
PM65
P65
(32.768 kHz)
f
P65
WM.2
(enables/disables operation)
XT
013
Watch timer
Normal
Fast
forward
0
1
WM.1
WM.5
WM.4
1
0
SelectorSelector
WM.7
PMC65
015013
Selector
Edge detection
Pin level read
HW0HW1
BUZ signal
WM.6
WM.2
Selector
WM.2
(enables/disables operation)
To NMI generation block
INTW
47
µ
PD784915B, 784916B
3.11 Clock Output Function
The µPD784916A can output a square wave (with a duty factor of 50%) to the P60/CLO pin as the operating clock
for the peripheral devices or other microccontrollers. To enable or disable the clock output, and to set the frequency
of the clock, the clock output mode register (CLOM) is used.
When setting the frequency, the division ratio can be set to f
CLK/n (where n = 2, 4, 8, or 16) (fCLK = fOSC/2: fOSC is
the oscillation frequency of the oscillator).
Figure 3-26 shows the configuration of the clock output circuit.
The clock output (CLO) pin is shared with P60.
Figure 3-26. Block Diagram of Clock Output Circuit
Remark f
CLOM
fCLK
fCLK/2
fCLK/4
fCLK/8
CLK: internal system clock
Selector
000
circuit
Output control
1/2
P60
ENCLO
00
SELFRQ1 SELFRQ0
P60/CLO
RESET
Caution Do not use the clock output function in the STOP mode. Clear ENCLO (CLOM.4) to 0 in the STOP
mode.
Figure 3-27 Application Example of Clock Output Function
PD784916B
µ
System clock
CLO
SCK1
SI1
SO1
PD75356
µ
CL1
SCK
SO
SI
LCD
24
48
µ
PD784915B, 784916B
4. INTERNAL/EXTERNAL CONTROL FUNCTION
4.1 Interrupt Function
The µPD784916B has as many as 30 interrupt sources, including internal and external sources. For 26 sources,
a high-speed interrupt processing mode such as context switching or macro service can be specified by software.
INTP0 pin input edge
EDVC output signal (CPT3 capture)
DFGIN pin input edge (CPT2 capture)
PBCTL signal input edge/EDVC output
signal (CR12 capture)
TM0-CR00 coincidence signal
CSYNCIN pin input edge
TM1-CR10 coincidence signal
TM0-CR01 coincidence signal
TM0-CR02 coincidence signal
TM1-CR11 coincidence signal
Pin input edge/EC output signal (CPT1
capture)
TM2-CR20 coincidence signal
Time base from FRC
A/D converter conversion end
INTP2 pin input edge
TM4-CR40 coincidence signal
UDC-UDCC coincidence/UDC underflow
TM3-CR30 coincidence signal
TM5-CR50 coincidence signal
TM1-CR13 coincidence signal
End of serial transfer (channel 1)
Overflow of watch timer
INTP1 pin input edge
INTP3 pin input edge
End of serial transfer (channel 2)
Illegal operand of MOV STBC, #byte or
LOCATION instruction
Execution of BRK instruction
Execution of BRKCS instruction
Figure 4-1. Differences in Operation Depending on Interrupt Processing Mode
Macro service
Context
switching
Vector interrupt
Vector
interrupt
Note 1
Note 2
Main
routine
Main
routine
Main
routine
Main
routine
Interrupt request generated
Macro service
processing
Note 2
Note 4
Note 4
SEL
RBn
Saving
general
register
Main routine
Interrupt
processing
Interrupt
processing
Initializing
general
register
Note 3
Interrupt
processing
Main routine
Restoring
PC and
PSW
Main routine
Restoring
general
register
Restoring
PC and
PSW
Main
routine
Notes 1. When the register bank switching function is used and when initial values are set in advance to the
registers
2. Selecting a register bank and saving PC and PSW by context switching
3. Restoring register bank, PC, and PSW by context switching
4. Saves PC and PSW to stack and loads vector address to PC
50
µ
PD784915B, 784916B
4.1.1 Vector interrupt
When an interrupt request is acknowledged, an interrupt processing program is executed according to the data
stored in the vector table area (the first address of the interrupt processing program created by the user).
µ
Four levels of priorities can be specified by software for the vector interrupts of the
PD784916B.
4.1.2 Context switching
When an interrupt request is generated or when the BRKCS instruction is executed, a specific register bank is
selected by hardware, and execution branches to a vector address set in advance in the register bank. At the same
time, the current contents of the program counter (PC) and program status word (PSW) are saved to the registers
in the register bank. Because the contents of PC and PSW are not saved to the stack area, execution can be branched
to an interrupt processing routine more quickly than the vector interrupt.
Figure 4-2. Context Switching Operation When Interrupt Request Is Generated
<7> 0H
PC19-16PC15-0
<2> Save
Bits 8-11 of temporary
register
<1> Save
PSW
<6> Exchange
<5> Save
Temporary register
Register bank n (n = 0-7)
A
B
R5
R7
V
U
T
W
VP
UP
D
H
R4
R6
Register bank
(0-7)
X
C
<3>
Switching register bank
(RBS0 – RBS2 ← n)
<4>
RSS
← 0
IE
E
L
← 0
51
µ
PD784915B, 784916B
4.1.3 Macro service
The macro service is a function to transfer data between the memory and a special function register (SFR) without
intervention by the CPU. A macro service controller accesses the memory and SFR and directly transfers the data.
Because the status of the CPU is not saved or restored, data can be transferred more quickly than context switching.
The processing that can be executed with the macro service is described below.
Figure 4-3. Macro Service
CPUMemorySFR
Internal bus
Read
Write
Macro service
controller
Write
Read
(1) Counter mode
In this mode, the value of the macro service counter (MSC) is decremented when an interrupt request occurs.
This mode can be used to execute the division operation of an interrupt or count the number of times an interrupt
has occurred.
When the value of the macro service counter has been decremented to 0, a vector interrupt occurs.
MSC
-
1
(2) Compound data transfer mode
When an interrupt request occurs, data are simultaneously transferred from an 8-bit SFR to memory, a 16-bit
SFR to memory (word), memory (byte) to an 8-bit SFR, and memory (word) to a 16-bit SFR (3 points MAX. for
each transfer).
This mode can also be used to exchange data, instead of transferring data.
This mode can be used for automatic transfer/reception by the serial interface or automatic updating of data/timing
by the serial output port.
When the value of the macro service counter reaches to 0, a vector interrupt request occurs.
52
SFR<4>-1
SFR<2>-1
SFR<4>-2 SFR<4>-3SFR<3>-1SFR<3>-2SFR<3>-3
Internal bus
SFR<2>-2 SFR<2>-3SFR<1>-1SFR<1>-2SFR<1>-3
Internal bus
Memory
.
.
.
µ
PD784915B, 784916B
(3) Macro service type A
When an interrupt request occurs, data is transferred from an 8-/16-bit SFR to memory (byte/word) or from
memory (byte/word) to an 8-/16-bit SFR.
Data is transferred the number of times set in advance by the macro service counter.
This mode can be used to store the result of A/D conversion or for automatic transfer (or reception) by the serial
interface.
Because transfer data is stored at an address FE00H to FEFFH, if only a small quantity of data is to be transferred,
the data can be transferred at high speeds.
When the value of the macro service counter is decremented to 0, a vector interrupt request occurs.
Data storage buffer (memory)
Data n
-
Data n
Internal bus
1
Data 2
Data 1
SFR
Data storage buffer (memory)
Data n
-
Data n
Internal bus
1
Data 2
Data 1
SFR
(4) Data pattern identification mode (VISS detection mode)
This mode of macro service is for detection of the VISS signal and is used in combination with a pulse width
detection circuit.
When an interrupt request occurs, the content of bit 7 of an SFR (usually, TMC3) specified by SFR pointer 1 is
shifted into the buffer area. At the same time, the data in the buffer area is compared with the data in the compare
area. If the two data coincide, an interrupt request is generated. When the value of the macro service counter
is decremented to 0, a vector interrupt request occurs.
It can be specified by option that the value of an SFR (usually, CPT30) specified by SFR pointer 2 be multiplied
by a coefficient and the result of this multiplication be stored to an SFR (usually, CR30) specified by SFR pointer
3 (this operation is to automatically update an identification threshold value when the tape speed fluctuates).
Coefficient (memory)
Multiplier
CPT30
TM3
CR30
Buffer area (memory)Compare area (memory)
CTL F/F
(bit 7 of TMC3)
Coincidence
Vector interrupt
53
4.1.4 Application example of macro service
(1) Automatic transfer/reception of serial interface
Automatic transfer/reception of 3-byte data by serial interface channel 1
Setting of macro service register: compound data transfer mode (exchange mode)
Transfer of receive data by serial interface channel 1 (16 bytes)
Setting of macro service mode register: macro service type A (1-byte transfer from SFR to memory)
Internal RAM
FE7FH
FE2EH
MSC 0FH
SFR pointer 85H
Channel pointer (= 7FH)
Mode register (= 00010001B)
Setting of number of transfers
Low-order 8 bits of address of SIO1 register
Starts macro service when INTCSI1 occurs
SI1
SIO1
(FF85H)
55
µ
PD784915B, 784916B
(3) VISS detection operation
Setting of macro service mode register: data pattern identification mode (with multiplication, 8-byte comparison)
11111110
Compare area pointer (high): 10H
Compare area pointer (low): 50H
Coincidence (vector interrupt)
Multiplier
Bit 7
0
TM3
CR30
TMC3
00000000
00000000
1050H
8 bytes
FE0CH
Lower address
Mode register (= 00010100B)
Channel pointer (= 50H)
(CTL signal input edge detection interrupt)
56
µ
PD784915B, 784916B
4.2 Standby Function
The standby function serves to reduce the power dissipation of the chip and is used in the following modes:
ModeFunction
HALT modeStops operating clock of CPU. Reduces average power dissipation when
used in combination with normal mode for intermittent operation
STOP modeStops oscillator. Stops all internal operations of chip to minimize current
dissipation to leakage current only
Low power dissipation modeStops main system clock with subsystem clock used as system clock. CPU
can operate with subsystem clock to reduce power dissipation
Low power dissipation HALT modeStandby function in low power dissipation mode. Stops operating clock of
CPU. Reduces power dissipation of overall system
These modes are programmable.
The macro service can be started in the HALT mode.
Figure 4-4. Status Transition of Standby Mode
Macro service request
End of one processing
End of macro service
Sets HALT
Interrupt request
Note 2
Macro service request
End of one processing
HALT mode
(standby)
NMI input
INTW, INTP2 interrupt request
Low power
dissipation
HALT mode
(standby)
Low power
dissipation mode
(subsystem
clock operation)
Note 1
Sets low power dissipation HALT mode
Sets low power dissipation mode
Restores normal operation
Waits for
stabilization
of oscillation
Normal
operation
RESET input
End of oscillation stabilization period
RESET input
NMI input
Note 1
STOP mode
(standby)
Sets STOP
Unmasked
interrupt request
Notes 1. NMI input means starting NMI by NMI pin input, watch interrupt, or key interrupt input.
2. Unmasked interrupt request
Macro
service
57
µ
PD784915B, 784916B
Figure 4-5. Relations among NMI, Watch Interrupt, and Key Interrupt When STOP Mode Is Released
NMI
INTP1
INTP2
KEY0
KEY1
KEY2
KEY3
KEY4
INTM0.0
Selector
Mask
Mask
Mask
KEYC.6
KEYC.5
KEYC.4
Latch
Clear
SRQKEYC.7
Cleared when "0" is
written to KEYC.7
SRQKEYC.0
Cleared when "0" is
written to KEYC.0
Mask
WM.3
WM.6
Selector
Standby control
block
Interrupt control
block
Watch timer
INTW (OVF)
Divides INTW
by 128 (HW0L.7)
58
Figure 4-6. Block Diagram of Clock Generator Circuit
4.3 Clock Generator Circuit
peripheral circuits. Figure 4-6 shows the configuration of this circuit.
The clock generator circuit generates and controls the internal system clock (CLK) to be supplied to the CPU and
CC.7
Selector
Oscillation Stabilization Timer
1/2
Watch interrupt
1/2
1/2
fXX/16 (fXX/8)
fXX/8
(fXX/4)
fXX/4
(fXX/2)
fXX/2
X1
16 MHz or 8 MHz
32.768 kHz
X2
XT1
XT2
µ
PD784916B
Main
system
clock
oscillation
circuit
From standby control block
Subsystem
clock
oscillator
circuit
STBC.7
fXX
Oscillation stop
f
Oscillation stop
Low-frequency
oscillation mode
Normal mode
XT
1/2
Watch timerHardware watch function
Notes 1. Oscillation frequency, values in parentheses indicate the low frequency oscillation mode.
2. The peripheral hardware units that can operate with the subsystem clock have some restrictions. For details, refer to 14.6 Low Power
Dissipation Mode in
µ
PD784915 Subseries User’s Manual.
(fXX)
STBC.4, 5
Note 1
Note 1
Note 1
Note 1
Selector
STBC.6
Selector
CPU
fCLK
Peripheral hardware
operation clock
Note 2
µ
PD784915B, 784916B
59
µ
PD784915B, 784916B
4.4 Reset Function
When a low-level signal is input to the RESET pin, the system is reset, and each hardware unit is initialized (reset
status). During the reset period, oscillation of the system clock is unconditionally stopped, so that the current
dissipation of the overall system can be reduced.
When the RESET pin goes high, the reset status is cleared. After the count time of the oscillation stabilization timer
(32.8 ms at 16 MHz or 65.6 ms at 8 MHz) has elapsed, the contents of the reset vector table are set to the program
counter (PC), and execution branches to the address set to the PC, and the program is executed starting from the
branch destination address. Therefore, execution can be reset and started from any address.
Figure 4-7. Oscillation of Main System Clock during Reset Period
Main system clock
oscillation circuit
During reset, oscillation
is unconditionally stopped.
f
CLT
RESET input
Oscillation stabilization
timer count time
The RESET pin is provided with an analog delay noise elimination circuit to prevent malfunctioning due to noise.
Figure 4-8. Accepting Reset Signal
delay
Oscillation
stabilization
time
Analog delayAnalog delay
Analog
RESET input
Internal reset signal
Internal clock
60
µ
PD784915B, 784916B
5. INSTRUCTION SETS
(1) 8-bit instructions (( ): combination realized by describing A as r)
AVSS2–0.5 to +0.5V
Input voltageVI–0.5 to VDD + 0.5V
Analog input voltageVIANVDD≥ AVDD2–0.5 to AVDD2 + 0.5V
(ANI0 to ANI11)
Output voltageVO–0.5 to VDD + 0.5V
Low-level output currentIOLPin 115mA
High-level output currentIOHPin 1–10mA
Operating ambient temperatureTA–10 to +70°C
Storage temperatureTstg–65 to +150°C
| VDD – AVDD2 | ≤ 0.5 V
| AVDD1 – AVDD2 | ≤ 0.5 V
VDD < AVDD2–0.5 to VDD + 0.5V
Total of all pins100mA
Total of all pins–50mA
–0.5 to +7.0V
–0.5 to +7.0V
Caution If the rated value of even one of the above parameters is exceeded even momentarily, the quality
of the product may be degraded. Absolute maximum ratings therefore specify the values
exceeding which the product may be physically damaged. Never exceed these values when
using the product.
Operating Conditions
Clock FrequencyOperating Temperature (TA)Operating ConditionsSupply Voltage (VDD)
4 MHz ≤ fXX≤ 16 MHz–10 to +70°CAll functions+4.5 to +5.5 V
CPU function only+4.0 to +5.5 V
32 kHz ≤ fXT≤ 35 kHzSubclock operation+2.7 to +5.5 V
Crystal oscillatorOscillation frequency (fXT)3235kHz
XT1XT2 V
C1C2
SS
Caution When using the main system clock and subsystem clock oscillation circuits, wire the portion
enclosed by the broken line in the above figures as follows to avoid the adverse influence of
wiring capacitance:
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines. Do not route the wiring in the
neighborhood of a signal line through which a high alternating current flows.
• Always keep the ground point of the capacitor of the oscillator circuit to the same potential
SS. Do not ground the capacitor to a ground pattern to which a high current flows.
as V
• Do not extract signals from the oscillation circuit.
Exercise particular care in using the subsystem clock oscillation circuit because the amplification factor of this circuit is kept low to reduce the power dissipation.
66
µ
PD784915B, 784916B
DC Characteristics (TA = –10 to +70°C, VDD = AVDD = 4.5 to 5.5 V, VSS = AVSS = 0 V)
ParameterSymbolConditionsMIN.TYP.MAX.Unit
Low-level input voltageVIL1
High-level input voltageVIH1Pins other than those listed in Note 1 below0.7 VDDVDDV
Low-level output voltageVOL1IOL = 5.0 mA (pins in Note 2)0.6V
Serial clock high- and low-level widthstWSKHInputExternal clock420ns
tWSKLOutput Internal clocktCYSK/2 – 50ns
SIn setup time (to SCKn ↑)tSSSK100ns
SIn hold time (from SCKn ↑ )tHSSK400ns
SOn output delay time (to SCKn ↓ )tDSSK0300ns
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
Remarks 1. fCLK1: operating clock of peripheral circuit (8 MHz)
ParameterSymbolConditionMIN.TYP.MAX.Unit
CTL+, – input resistanceRICTL2510kΩ
Feedback resistanceRFCTL2050100kΩ
Bias resistanceRBCTL2050100kΩ
Minimum voltage gainGCTLMIN172022dB
Maximum voltage gainGCTLMAX7175dB
Gain selecting stepSGAIN1.77dB
In-phase elimination ratioCMRDC, voltage gain: 20 dB50dB
High comparator set voltage of waveform shaping
High comparator reset voltage of waveform shaping
Low comparator set voltage of waveform shaping
Low comparator reset voltage of waveform shaping
Waveform shaping comparator Schmit width
High comparator voltage of CTL flag SVFSH
Low comparator voltage of CLT flag SVFSL
High comparator voltage of CTL flag LVFLH
Low comparator voltage of CTL flag LVFLL
ParameterSymbolConditionMIN.TYP.MAX.Unit
Voltage gain 1GCFG1 fi = 2 kHz, open loop50dB
Voltage gain 2GCFG2 fi = 30 kHz, open loop34dB
CFGAMPO High-level output currentIOHCFG DC–1mA
CFGAMPO Low-level output currentIOLCFG DC0.1mA
High comparator voltageVCFGH
Low comparator voltageVCFGL
Duty accuracyPDUTY Note49.750.050.3%
VREF + 0.09 VREF + 0.12 VREF + 0.15
VREF – 0.15 VREF – 0.12 VREF – 0.09
Note The conditions include the following circuit and input signal.
Caution When an external clock is selected as the serial clock, do not use the busy control or strobe
control.
74
Super timer unit input timing
When DFGIN, CFGIN, DPGIN,
REEL0IN, or REEL1IN logic
level is input
When CSYNCIN logic level
is input
Interrupt input timing
NMI
0.8 V
0.8 V
0.8 V
µ
PD784915B, 784916B
t
WCTH
DD
t
WCTL
0.8 V
t
WCR1H
DD
t
WCR1L
0.8 V
t
WNIH
DD
t
WNIL
0.8 V
Reset input timing
INTP0, INTP3
INTP1, KEY0-KEY4
INTP2
RESET
0.8 V
0.8 V
0.8 V
t
WIPH0
DD
t
WIPL0
0.8 V
t
WIPH1
DD
t
WIPL1
0.8 V
t
WIPH2
DD
t
WIPL2
0.8 V
t
WRSL
0.8 V
75
Clock output timing
CLO
0.8 V
0.8 V
µ
PD784915B, 784916B
t
CLH
DD
t
t
CYCL
CLF
t
CLL
t
CLR
76
7. PACKAGE DRAWING
100 PIN PLASTIC QFP (14 × 20)
µ
PD784915B, 784916B
A
B
80
81
100
F
1
G
H
M
I
P
N
NOTE
Each lead centerline is located within 0.15
mm (0.006 inch) of its true position (T.P.) at
maximum material condition.
Remark
External Dimensions of the ES version are the
same as those of the mass-produced version.
51
50
C
D
detail of lead end
S
Q
31
30
J
K
M
L
P100GF-65-3BA1-2
ITEMMILLIMETERSINCHES
A
B
C
D
F
G
H
I
J
K
L
M
N
23.6±0.4
20.0±0.2
14.0±0.2
17.6±0.4
0.8
0.6
0.30±0.10
0.15
0.65 (T.P.)
1.8±0.2
0.8±0.2
+0.10
0.15
–0.05
0.10
0.929±0.016
+0.009
0.795
–0.008
+0.009
0.551
–0.008
0.693±0.016
0.031
0.024
+0.004
0.012
–0.005
0.006
0.026 (T.P.)
+0.008
0.071
–0.009
+0.009
0.031
–0.008
+0.004
0.006
–0.003
0.004
P2.70.106
Q
0.1±0.1
0.004±0.004
S3.0 MAX.0.119 MAX.
5°
±
5°
77
µ
PD784915B, 784916B
8. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the µPD784915B and 784916B.
For details of the recommended soldering conditions, refer to the NEC document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 18-1. Soldering Conditions for Surface-Mount Type
Infrared reflowPackage peak temperature: 235°C, Duration: 30 sec. max.IR35-00-3
(at 210°C or above), Number of times: 3 times max.
VPSPackage peak temperature: 215°C, Duration: 40 sec. max.VP15-00-3
(at 200°C or above), Number of times: 3 times max.
Wave solderingSolder bath temperature: 260°C max. Duration: 10 sec. max.WS60-00-1
Number of times: Once
Preliminary heat temperature: 120°C max.
(Package surface temperature)
Partial heatingPin temperature: 300°C max.,–
Duration: 3 sec. max. (per pin row)
Recommended
Condition Symbol
Caution Using more than one soldering method should be avoided (except in the case of partial heating).
78
µ
PD784915B, 784916B
APPENDIX A. DEVELOPMENT TOOLS
The following development tools are available for system development using the µPD784916B.
Also refer to (5) Cautions on Using Development Tools.
(1) Language Processing Software
RA78K4Assembler package common to 78K/IV Series
CC78K/4C compiler package common to 78K/IV Series
DF784915Device file for µPD784915 Subseries
CC78K/4-LC compiler library source file common to 78K/IV Series
(2) PROM Programming Tools
PG-1500PROM programmer
PA-78P4916GFProgram adapter connected to PG-1500.
PG-1500 controllerControl program for PG-1500
(3) Debugging Tools
IE-784000-RIn-circuit emulator common to 78K/IV Series
IE-784000-R-EMEmulation board common to 78K/IV Series
IE-70000-98-IF-BInterface adapter required when using PC-9800 series (except notebook PCs) as
IE-70000-98-IF-C
IE-70000-98N-IF-BInterface adapter and cable required when using PC-9800 series
IE-70000-PC-IF-BInterface adapter required when using IBM PC/AT or compatible as host machine.
IE-70000-PC-IF-C
IE-78000-R-SV3Interface adapter and cable required when using EWS as host machine.
IE-784915-R-EM1Emulation board for emulating µPD784915 Subseries
EP-784915GF-REmulation probe for µPD784915 Subseries
EV-9200GF-100Socket to be mounted on target system board manufactured for 100-pin plastic
NQPACK100RBSocket to be mounted on target system board manufactured for 100-pin plastic
ID78K4Integrated debugger for IE-784000-R.
SM78K4System simulator common to 78K/IV Series
DF784915Device file for µPD784915 Subseries
Note
Note
host machine
(except notebook PCs) as host machine.
QFP (GF-3BA type). Used for LCC packages.
QFP (GF-3BA type). Used for QFP packages.
Note Under development
79
µ
PD784915B, 784916B
(4) Real-Time OS
RX78K/IVReal-time OS for 78K/IV Series
MX78K4OS for 78/IV Series
(5) Cautions on Using Development Tools
• Use the ID78K4, SM78K4 in combination with the DF784915.
• Use the CC78K4, RX78K/IV in combination with the RA78K4 and DF784915.
• The NQPACK100RB is a product made by TOKYO ELETECH CORPORATION.
Tokyo Electronic Components Division (TEL(03)3820-7112)
Osaka Electronic Components Division (TEL(06)244-6672)
• The host machines and OS supported by each software product are as follows.
Host MachinePCEWS
[OS]PC-9800 series [WindowsTM]HP9000 series 700TM [HP-UXTM]
IBM PC/AT and CompatiblesSPARCstationTM [SunOSTM]
Software[Japanese/English Windows]NEWSTM (RISC) [NEWS-OSTM]
RA78K4√
CC78K4√
PG-1500 controller√
ID78K4√√
SM78K4√–
RX78K/IV√
MX78K4√
PD784915 Subseries Special function register tableU10976J—
78K/IV Series User’s manual — InstructionU10905JU10905E
78K/IV Series Instruction tableU10594J—
78K/IV Series Instruction setU10595J—
78K/IV Series Application note — Software basicsU10095JU10095E
Document Number
JapaneseEnglish
Documents related to development tools (user’s manual)
Document Name
RA78K4 Series Assembler packageLanguageU11162JU11162E
OperationU11334JU11334E
RA78K4 Series Structured assembler preprocessorU11743JU11743E
CC78K4 C compilerLanguageU11571JU11571E
OperationU11572JU11572E
CC78K Series Library source fileU12322J—
PG-1500 PROM ProgrammerU11940JEEU-1335
PG-1500 Controller PC-9800 series (MS-DOSTM) basedEEU-704EEU-1291
PG-1500 Controller IBM PC series (PC DOSTM) basedEEU-5008U10540E
IE-784000-RU12903JEEU-1534
IE-784915-R-EMI, EP-784915-GF-RU10931JU10931E
SM78K4 System Simulator Windows basedReferenceU10093JU10093E
SM78K Series System SimulatorExternal parts U10092JU10092E
Caution The above related documents are subject to change without notice. Be sure to read the latest
version of documents before designing.
81
Documents related to embedded software (user’s manual)
µ
PD784915B, 784916B
Document Name
RX78K/IV Real-time OSBasicsU10603JU10603E
InstallationU10604JU10604E
DebuggerU10364J—
78K/IV Series OS MX78K4FundamentalU11779J—
Document Number
JapaneseEnglish
Other related documents
Document Name
IC package manualC10943X
Semiconductor Device Mounting Technology ManualC10535JC10535E
Quality Grades on NEC Semiconductor DevicesC11531JC11531E
NEC Semiconductor Device Reliability/Quality Control SystemC10983JC10983E
Guide to prevent damage for Semiconductor Devices by Electrostatic Discharge (ESD) C11892JC11892E
Guide to Quality Assurance for Semiconductor Devices—MEI-1202
Microcomputer Product Series GuideU11416J—
Document Number
JapaneseEnglish
Caution The above related documents are subject to change without notice. Be sure to read the latest
version of documents before designing.
82
[MEMO]
µ
PD784915B, 784916B
83
µ
PD784915B, 784916B
NOTES FOR CMOS DEVICES
1PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction
of the gate oxide and ultimately degrade the device operation. Steps must
be taken to stop generation of static electricity as much as possible, and
quickly dissipate it once, when it has occurred. Environmental control must
be adequate. When it is dry, humidifier should be used. It is recommended
to avoid using insulators that easily build static electricity. Semiconductor
devices must be stored and transported in an anti-static container, static
shielding bag or conductive material. All test and measurement tools
including work bench and floor should be grounded. The operator should
be grounded using wrist strap. Semiconductor devices must not be touched
with bare hands. Similar precautions need to be taken for PW boards with
semiconductor devices on it.
2HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input
level may be generated due to noise, etc., hence causing malfunction. CMOS
device behave differently than Bipolar or NMOS devices. Input levels of
CMOS devices must be fixed high or low by using a pull-up or pull-down
circuitry. Each unused pin should be connected to VDD or GND with a
resistor, if it is considered to have a possibility of being an output pin. All
handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Produc-
tion process of MOS does not define the initial operation status of the device.
Immediately after the power source is turned ON, the devices with reset
function have not yet been initialized. Hence, power-on does not guarantee
out-pin levels, I/O settings or contents of registers. Device is not initialized
until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
84
µ
PD784915B, 784916B
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, please contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
• Device availability
• Ordering information
• Product release schedule
• Availability of related technical literature
• Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
• Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
Cumbica-Guarulhos-SP, Brasil
Tel: 011-6465-6810
Fax: 011-6465-6829
J97. 8
85
µ
PD784915B, 784916B
The documents referred to in this publication may include preliminary versions. However, preliminary versions are not
marked as such.
FIP is a registered trademark of NEC Corporation.
MS-DOS and Windows are either trademarks or registered trademarks of Microsoft Corporation
in the United States and/or other countries.
PC/AT, and PC-DOS are trademarks of International Business Machines Corporation.
HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
SunOS ia a trademark of Sun Microsystems, Inc.
NEWS and NEW-OS are trademarks of Sony Corporation.
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited
without governmental license, the need for which must be judged by the customer. The export or re-export of this product
from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.
The application circuits and their parameters are for reference only and are not intended for use in actual design-in's.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special:Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
84
M4 96.5
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