Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
DD
pin should be connected to V
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
or GND with a resistor, if it is considered to have a possibility of
3STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
EEPROM is a trademark of NEC Corporation.
Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the
United States and/or other countries.
PC/AT is a trademark of International Business Machines Corporation.
HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
Solaris and SunOS are trademarks of Sun Microsystems, Inc.
OSF/Motif is a trademark of Open Software Foundation, Inc.
NEWS and NEWS-OS are trademarks of Sony Corporation.
TRON is an abbreviation of The Realtime Operating system Nucleus.
ITRON is an abbreviation of Industrial TRON.
User’s Manual U15075EJ1V0UM00
3
The export of these products from Japan is regulated by the Japanese government. The export of some or all of these
products may be prohibited without governmental license. To export or re-export some or all of these products from a
country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.
License not needed:
The customer must judge the need for license:
PD78F9436, 78F9456
µ
PD789425, 789426, 789435, 789436, 789445,
µ
789446, 789455, 789456
•
The information in this document is current as of September, 2000. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
•
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
•
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
•
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00.4
4
User’s Manual U15075EJ1V0UM00
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, pIease contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
•
Device availability
•
Ordering information
•
Product release schedule
•
Availability of related technical literature
•
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
•
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
Electron Devices Division
Guarulhos-SP Brasil
Tel: 55-11-6462-6810
Fax: 55-11-6462-6829
User’s Manual U15075EJ1V0UM00
J00.7
5
[MEMO]
6
User’s Manual U15075EJ1V0UM00
INTRODUCTION
Target Readers
Purpose
Organization
This manual is intended to give user engineers an understanding of the functions of
PD789426, 789436, 789446, and 789456 Subseries to design and develop its
the
µ
application systems and programs.
Target products:
PD789426 Subseries:µPD789425, 789426
•
µ
PD789436 Subseries:µPD789435, 789436
•
µ
PD789446 Subseries:µPD789445, 789446
•
µ
PD789456 Subseries:µPD789455, 789456
•
µ
This manual is designed to deepen your understanding of the following functions
using the following organization.
Two manuals are available for the µPD789426, 789436, 789446, and 789456
Subseries:
This manual and the instruction manual (common to the 78K/0S Series).
PD789426, 789436, 789446,
µ
and 789456 Subseries
User’s Manual
Pin functions
•
Internal block functions
•
Interrupts
•
Other internal peripheral functions
•
78K/0S Series
User’s Manual
Instructions
CPU function
•
Instruction set
•
Instruction description
•
How to Use This Manual
It is assumed that the readers of this manual have general knowledge of electrical
engineering, logic circuits, and microcontrollers.
To understand the overall functions of the
•
789456 Subser ies
Read this manual in the order of the
→
How to read register formats
•
The name of a bit whose number is enclosed in brackets is reserved for the
→
assembler and is defined for the C compiler by the header file sfrbit.h.
To learn the detailed functions of a register whose register name is known
•
See
→
To learn the details of the instruction functions of the 78K/0S series
•
→
APPENDIX C REGISTER INDEX
Refer to
available.
78K/0S Series Instructions User’s Manual (U11047E)
CONTENTS
PD789426, 789436, 789446, and
µ
.
.
separately
User’s Manual U15075EJ1V0UM007
Conventions
Data significance:Higher digits on the left and lower digits on the right
Active low representation:xxx (overscore over pin or signal name)
:Footnote for item marked with
Note
Caution
Remark
:Information requiring particular attention
:Supplementary information
Note
in the text
Numerical representation:Binary ... xxxx or xxxxB
Decimal ... xxxx
Hexadecimal ... xxxxH
Related Documents
The related documents indicated in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
PD78F9436, 78F9456 Preliminary Product InformationTo be preparedTo be prepared
µ
PD789426, 789436, 789446, 789456 Subseries Us er’ s ManualU15075JThis manual
78K/0S Series Inst ructions User’s ManualU11047JU11047E
78K/0, 78K/0S Series Fl as h Memory Write Application NoteU14458JU14458E
U14493JU14493E
Document No.
JapaneseEnglish
Documents Related to Development Tools (User’s Manuals)
Document Name
RA78K0S Assembler Package
SM78K0S, SM78K0 System Simulator Ver. 2.10 or Later
Windows
SM78K Series System SimulatorExternal P art User Open
or Later Windows Based
IE-78K0S-NSU13549JU13549E
IE-789456-NS-EM1To be preparedTo be prepared
TM
Based
OperationU11622JU11622E
Assembly LanguageU11599JU11599E
Structured Assembl y
Language
OperationU11816JU11816ECC78K/0S C Compiler
LanguageU11817JU11817E
OperationU14611JTo be prepared
Interface Specifi c ations
OperationU14910JTo be prepared
U11623JU11623E
U10092JU10092E
Document No.
JapaneseEnglish
Caution The related documents listed above are subject to change without notice. Be sure to use the
latest version of each document for designing.
8User’s Manual U15075EJ1V0UM00
Document Related to Embedded Software (User’s Manual)
Document Name
78K/0S Series OS MX78K 0SFundamentalU12938JU12938E
Document No.
JapaneseEnglish
Other Related Documents
Document Name
SEMICONDUCTOR SELECTION GUI DE Products & Packages (CD-ROM)X13769X
Semiconductor Device Mounting Technology ManualC10535JC10535E
Quality Grades on NEC Semic onductor DevicesC11531JC11531E
NEC Semiconductor Device Reliability /Quality Control SystemC10983JC10983E
Guide to Prevent Damage for Semi conductor Devices by El ec trostatic Discharge (E S D)C11892JC11892E
Guide to Microcomputer-Relat ed P roducts by Third PartiesU11416J—
Document No.
JapaneseEnglish
Caution The related documents listed above are subject to change without notice. Be sure to use the
2.2.9P90 to P97 (Port 9)....................................................................................................................... 42
2.2.10S0 to S14...................................................................................................................................... 42
2.2.11COM0 to COM3............................................................................................................................ 42
4-3Block Diagram of P00 to P03........................................................................................................................81
4-4Block Diagram of P10 and P11.....................................................................................................................82
4-5Block Diagram of P20....................................................................................................................................83
4-6Block Diagram of P21 and P26.....................................................................................................................84
4-7Block Diagram of P22....................................................................................................................................85
4-8Block Diagram of P23....................................................................................................................................86
4-9Block Diagram of P24....................................................................................................................................87
4-10Block Diagram of P25....................................................................................................................................88
4-11Block Diagram of P30....................................................................................................................................89
4-12Block Diagram of P31 to P33........................................................................................................................ 90
4-13Block Diagram of P50 to P53........................................................................................................................ 91
4-14Block Diagram of Port 6 ................................................................................................................................92
4-15Block Diagram of P70 to P72........................................................................................................................ 93
4-16Block Diagram of P80, P81........................................................................................................................... 94
4-17Block Diagram of P90 to P97........................................................................................................................ 95
4-18Format of Port Mode Register.......................................................................................................................97
4-19Format of Pull-Up Resistor Option Register 0...............................................................................................98
4-20Format of Pull-Up Resistor Option Register B2............................................................................................. 99
4-21Format of Pull-Up Resistor Option Register B3............................................................................................. 99
User’s Manual U15075EJ1V0UM0017
LIST OF FIGURES (2/5)
Figure No.TitlePage
4-22Format of Pull-Up Resistor Option Register B7...........................................................................................100
4-23Format of Pull-Up Resistor Option Register B8...........................................................................................100
4-24Format of Pull-Up Resistor Option Register B9...........................................................................................101
5-1Block Diagram of Clock Generator..............................................................................................................104
5-2Format of Processor Clock Control Register...............................................................................................105
5-3Format of Suboscillation Mode Register .....................................................................................................106
5-4Format of Subclock Control Register ..........................................................................................................107
5-5External Circuit of Main System Clock Oscillator........................................................................................108
5-6External Circuit of Subsystem Clock Oscillator...........................................................................................109
5-7Examples of Incorrect Resonator Connection.............................................................................................110
5-8Switching Between System Clock and CPU Clock......................................................................................114
6-1Block Diagram of 16-Bit Timer.....................................................................................................................117
6-2Format of 16-Bit Timer Mode Control Register 90.......................................................................................120
6-3Format of Buzzer Output Control Register 90.............................................................................................121
6-4Format of Port Mode Register 2..................................................................................................................122
6-5Settings of 16-Bit Timer Mode Control Register 90 for Timer Interrupt Operation ......................................123
6-6Timing of Timer Interrupt Operation............................................................................................................124
6-7Settings of 16-Bit Timer Mode Control Register 90 for Timer Output Operation.........................................125
6-12Settings of Buzzer Output Control Register 90 for Buzzer Output Operation..............................................128
7-1Block Diagram of Timer 50..........................................................................................................................133
7-2Block Diagram of Timer 60..........................................................................................................................134
7-3Block Diagram of Output Controller (Timer 60)...........................................................................................135
7-4Format of 8-Bit Timer Mode Control Register 50.........................................................................................139
7-5Format of 8-Bit Timer Mode Control Register 60.........................................................................................141
7-6Format of Carrier Generator Output Control Register 60............................................................................142
7-7Format of Port Mode Register 3..................................................................................................................142
7-8Timing of Interval Timer Operation with 8-Bit Resolution (Basic Operation)...............................................145
7-9Timing of Interval Timer Operation with 8-Bit Resolution (When CRn0 Is Set to 00H) ...............................145
7-10Timing of Interval Timer Operation with 8-Bit Resolution (When CRn0 Is Set to FFH)...............................146
7-11Timing of Interval Timer Operation with 8-Bit Resolution (When CRn0 Changes from N to M (N < M)) .....146
7-12Timing of Interval Timer Operation with 8-Bit Resolution (When CRn0 Changes from N to M (N > M)) .....147
7-13Timing of Interval Timer Operation with 8-Bit Resolution (When Timer 60 Match Signal Is
Selected for Timer 50 Count Clock)............................................................................................................148
7-14Timing of Operation of External Event Counter with 8-Bit Resolution........................................................150
7-15Timing of Square-Wave Output with 8-Bit Resolution.................................................................................152
18User’s Manual U15075EJ1V0UM00
LIST OF FIGURES (3/5)
Figure No.TitlePage
7-16Timing of Interval Timer Operation with 16-Bit Resolution..........................................................................155
7-17Timing of External Event Counter Operation with 16-Bit Resolution...........................................................157
7-18Timing of Square-Wave Output with 16-Bit Resolution...............................................................................159
7-19Timing of Carrier Generator Operation (When CR60 = N, CRH60 = M (M > N)) ........................................161
7-20Timing of Carrier Generator Operation (When CR60 = N, CRH60 = M (M < N),
Phases of Carrier Clock and NRZ60 Are Asynchronous) ...........................................................................162
12-113-Wire Serial I/O Mode Timing....................................................................................................................240
13-1Block Diagram of LCD Controller/Driver......................................................................................................248
13-2Format of LCD Display Mode Register 0.....................................................................................................250
13-3Format of LCD Clock Control Register 0.....................................................................................................251
13-4Format of LCD Voltage Amplification Control Register 0 ............................................................................252
13-5Relationship Between LCD Display Data Memory Contents and Segment/Common Outputs
14-12Interrupt Request Acknowledgment Program Algorithm .............................................................................274
14-13Interrupt Request Acknowledgment Timing (Example: MOV A, r) ..............................................................275
14-14Interrupt Request Acknowledgment Timing (When Interrupt Request Flag Is
Generated in Final Clock Under Execution)................................................................................................275
14-15Example of Multiple Interrupts .....................................................................................................................276
15-1Format of Oscillation Stabilization Time Select Register.............................................................................280
15-2Releasing HALT Mode by Interrupt.............................................................................................................282
15-3Releasing HALT Mode by RESET Input .....................................................................................................283
15-4Releasing STOP Mode by Interrupt ............................................................................................................285
15-5Releasing STOP Mode by RESET Input.....................................................................................................286
16-1Block Diagram of Reset Function................................................................................................................287
16-2Reset Timing by RESET Input ....................................................................................................................288
16-3Reset Timing by Overflow in Watchdog Timer............................................................................................288
16-4Reset Timing by RESET Input in STOP Mode............................................................................................288
2-1Types of Pin Input/Output Circuits.................................................................................................................44
3-1Internal ROM Capacity..................................................................................................................................53
3-4Special Function Register List.......................................................................................................................66
4-2Configuration of Port .....................................................................................................................................80
4-3Port Mode Register and Output Latch Settings When Using Alternate Functions ........................................98
5-1Configuration of Clock Generator................................................................................................................103
5-2Maximum Time Required for Switching CPU Clock....................................................................................113
6-2Interval Time of 16-Bit Timer.......................................................................................................................123
6-3Settings of Capture Edge............................................................................................................................126
6-4Buzzer Frequency of 16-Bit Timer...............................................................................................................128
7-3Interval Time of Timer 50 ............................................................................................................................144
7-4Interval Time of Timer 60 ............................................................................................................................144
7-5Square-Wave Output Range of Timer 50 (During fX = 5.0 MHz Operation)................................................151
7-6Square-Wave Output Range of Timer 60 (During fX = 5.0 MHz Operation)................................................152
7-7Interval Time with 16-Bit Resolution (During fX = 5.0 MHz Operation)........................................................154
7-8Square-Wave Output Range with 16-Bit Resolution (During fX = 5.0 MHz Operation)................................158
8-1Interval Generated Using the Interval Timer ...............................................................................................172
8-3Interval Time of Interval Timer.....................................................................................................................174
9-5Interval Time of Interval Timer.....................................................................................................................182
10-1Configuration of 8-Bit A/D Converter...........................................................................................................183
11-1Configuration of 10-Bit A/D Converter......................................................................................................... 197
22User’s Manual U15075EJ1V0UM00
LIST OF TABLES (2/2)
Table No.TitlePage
12-1Configuration of Serial Interface 20.............................................................................................................211
15-4Operation After Releasing STOP Mode...................................................................................................... 286
16-1Hardware Status After Reset....................................................................................................................... 289
17-1Differences Between µPD78F9436, 78F9456 and Mask ROM Versions.................................................... 291
17-3Functions of Flash Memory Programming ..................................................................................................293
17-4Example of Settings for PG-FP3.................................................................................................................295
18-1Selection of Mask Option for Pins...............................................................................................................297
19-1Operand Identifiers and Description Methods.............................................................................................299
User’s Manual U15075EJ1V0UM0023
[MEMO]
24User’s Manual U15075EJ1V0UM00
1.1 Features
• ROM and RAM capacities
CHAPTER 1 GENERAL
ItemData Memory
Part Number
µ
PD789425, 7894358 KB
µ
PD789426, 789436
µ
PD78F9436Flash memory16 KB
µ
PD789445, 78945512 KB
µ
PD789446, 789456
µ
PD78F9456Flash memory
Program Memory
Mask ROM
Mask ROM
(ROM)
16 KB
16 KB
Internal High-Speed
RAM
512 bytes
LCD Display RAM
5 bytes
15 bytes
• Minimum instruction execution time can be changed from high-speed (0.4 µs: @ 5.0 MHz operation with main
system clock) to ultra-low-speed (122 µs: @ 32.768 kHz operation with subsystem clock)
PD789488 with added remote control receiver and resistance division type LCD
For remote controller, with A/D converter and on-chip voltage booster type LCD
For remote controller, with SIO and resistance division type LCD
For PC keyboard, on-chip USB HUB function
For PC keyboard, on-chip USB function
For keypad, on-chip POC
RC oscillation version of the PD789860
For keyless entry, on-chip POC and key return circuit
User’s Manual U15075EJ1V0UM00
µ
Loading...
+ 291 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.