NEC ED2, EF2 Technical data
Information
MINIATURE SIGNAL RELAYS
ED2 SERIES (DIP TYPE)
EF2 SERIES (SMD TYPE)
TECHNICAL DATA
Document No. 0172EMDD03VOL01E
Date Published July 2002 P
Printed in Japan
[MEMO]
2
The information in this document is based on documents issued in July, 1999 at the latest.
The information is subject to change without notice. For actual design-in refer to the latest publications
of data sheet, etc., for the most up-date specifications of the device.
No part of this document may be copied or reproduced in any form or by any means without the
prior written consent of NEC/TOKIN Corporation. NEC/TOKIN Corporation assumes no responsibility
for any errors which may appear in this document.
NEC/TOKIN Corporation does not assume any liability for infringement of patents, copyrights or
other intellectual property rights of third parties by or arising from use of a device described herein
or any other liability arising from use of such device. No license, either express, implied or
otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC
/TOKIN Corporation or others.
While NEC/TOKIN Corporation has been making continuous effort to enhance the reliability of its
electronic components, the possibility of defects cannot be eliminated entirely. To minimize risks
of damage or injury to persons or property arising from a defect in an NEC/TOKIN electronic component,
customers must incorporate sufficient safety measures in its design, such as redundancy, firecontainment, and anti-failure features. NEC/TOKIN devices are classified into the following three
quality grades:
"Standard," "Special," and "Specific". The Specific quality grade applies only to devices
developed based on a customer designated "Quality assurance program" for a specific
application. The recommended applications of a device depend on its quality grade, as indicated
below. Customers must check the quality grade of each device before using it in a particular
application.
Standard: Computers, office equipment, communications equipment, test and measurement
equipment, audio and visual equipment, home electronic appliances, machine tools,
personal electronic equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems,
anti-disaster systems, anti-crime systems, safety equipment and medical
equipment (not specifically designed for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control
systems, life support systems or medical equipment for life support, etc.
The quality grade of NEC/TOKIN devices is "Standard" unless otherwise specified in NEC/TOKIN’s
Data Sheets or Data Books. If customers intend to use NEC/TOKIN devices for applications other
than those specified for Standard quality grade, they should contact an NEC/TOKIN sales representative
in advance.
(Note)
(1) "NEC/TOKIN" as used in this statement means NEC/TOKIN Corporation and also includes
its majority-owned subsidiaries.
(2) "NEC/TOKIN electronic component products" means any electronic component product developed
or manufactured by or for NEC/TOKIN (as defined above).
DE0102
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[MEMO]
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CONTENTS
1. Preface........................................................................................................................................... 7
2. Structure........................................................................................................................................ 8
3. Basic Characteristics ................................................................................................................... 9
3.1 Switching power ..................................................................................................................................... 9
3.2 Maximum coil voltage ............................................................................................................................. 9
3.3 Coil temperature rise .............................................................................................................................. 10
3.4 Driving power vs. timing ......................................................................................................................... 11
3.5 Thermal characteristics .......................................................................................................................... 12
3.6 Magnetic interference ............................................................................................................................. 13
3.7 High-frequency characteristics ............................................................................................................... 14
3.8 Coil inductance ....................................................................................................................................... 15
3.8.1 Measurement by LCR meter ...................................................................................................... 15
3.8.2 Measurement by coil current waveform ..................................................................................... 15
3.9 Capacitance ........................................................................................................................................... 16
3.10 Resistance to surge voltage ................................................................................................................... 17
3.11 Resistance to carrying current................................................................................................................ 18
4. Distribution of Characteristics..................................................................................................... 19
4.1 Operate & release voltages (set & reset voltages) ................................................................................. 19
4.2 Operate & release times (set & reset times) .......................................................................................... 20
4.3 Transfer time .......................................................................................................................................... 21
4.4 Timing and details .................................................................................................................................. 22
4.5 Contact resistance.................................................................................................................................. 26
4.6 Breakdown voltage ................................................................................................................................. 27
4.7 Thermal Electromotive Force (EMF) (offset voltage between contacts) ................................................ 27
5. Test Data ....................................................................................................................................... 28
5.1 Environmental tests ................................................................................................................................ 29
5.1.1 High-temperature test ................................................................................................................. 29
5.1.2 Low-temperature test ................................................................................................................. 31
5.1.3 Moisture resistance test ............................................................................................................. 32
5.1.4 Heat shock test ........................................................................................................................... 33
5.1.5 Vibration test .............................................................................................................................. 34
5.1.6 Shock test ................................................................................................................................... 35
5.1.7 Resistance to solder heat test (only ED2 series) ....................................................................... 36
5.1.8 Resistance to reflow solder heat test (only EF2 series) ............................................................. 37
5.1.9 Terminal strength test (only ED2 series) .................................................................................... 39
5.2 Contact life tests ..................................................................................................................................... 40
5.2.1 Non-load test (Mechanical life test, T
5.2.2 Resistive load test A (10 vdc, 10 mA, Ta = 85°C) ....................................................................... 41
5.2.3 Resistive load test B (50 vdc, 110 mA, Ta = 25°C) ..................................................................... 41
5.2.4 Resistive load test C (30 vdc, 1 A, Ta = 25°C) ........................................................................... 42
a = 25°C) .......................................................................... 40
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[MEMO]71. Preface
6
Miniature signal relays are used in a wide range of application fields including communication, measurement, and
factory automation. This document gives the basic characteristics and test data of NEC’s ED2 and EF2 series
miniature signal relays.
Notes 1. The symbo
Likewise,
shown in the graphs throughout this document indicates the maximum value of the data.
indicates the minimum value, and indicates the mean value.
2. When a relay is driven by an IC, a protective element such as a diode may be connected in parallel
with the relay coil to protect the IC from damage caused by the counter-electromotive force (EMF) due
to the inductance of the coil. However, unless otherwise specified, the operate time and release time
(set and reset times) shown in this document are measured without such a protective element.
Relay Coil
Tr
Diode
Power Supply
For Right Use of Miniature Relays
DO NOT EXCEED MAXIMUM RATINGS.
Do not use relays under exceeding conditions such as over ambient temperature, over voltage and over
current. Incorrect use could result in abnormal heating, damage to related parts or cause burning.
READ CAUTIONS IN THE SELECTION GUIDE.
Read the cautions described in NEC/TOKIN’s “Miniature Relays” (0123EMDD03VOL01E) when you choose
relays for your application.
2. Structure
Figure 2.1 shows the structures of the ED2 and the EF2 series relays. ED2 series relay has a terminal configuration
called dual in-line leads (DIL), and EF2 series relay has a resistibility to solder heat, and a terminal configuration that
conforms to surface mounting. Table 2.1 lists the parts constituting relay.
ED2 series and EF2 series relays have a common structure except difference of a terminal configuration and some
parts.
11
[ED2 series]
12
10
13
7
5
3
14
[EF2 series]
14
1
1
8
9
2
4
6
Figure 2.1 Structure of the ED2/EF2 Series Relay
Table 2.1 Parts of ED2/EF2 Series Relay
No. Parts
1 Cover Liquid crystalline polymer
2 Base Liquid crystalline polymer
3 Base pad Liquid crystalline polymer
4 Coil wire Polyurethane copper wire
5 Coil spool Polyphenylene sulfide
#
6 Core Pure iron
7 Terminal Phosphor bronze (surface is treated with preparatory solder)
8 Moving contact Au-alloy + Ag-alloy
9 Stationary contact Au-alloy + Ag-alloy
*
*
10 Contact spring Phosphor bronze
11 Armature Pure iron
12 Armature block mold Liquid crystalline polymer
13 Magnet Cobalt magnet
14 Sealing material Epoxy resin
Material
ED2/EF2 Series
#
#
#
#
Note: *: Standard type
#: Conforms to UL94V-0
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3. Basic Characteristics
)
This section provides data necessary for designing an external circuit that uses the relay.
ED2 and EF2 series relays are designed with common specifications. So, this section shows common
characteristics of ED2 and EF2 series.
3.1 Switching power
If the contact load voltage and current of the relay are in the region enclosed by the solid and dotted lines in the
figure below, the relay can perform stable switching operation. If the relay is used at a voltage or current exceeding
this region, the life of the contacts may be significantly shortened.
2.0
1.0
0.5
Load Current (A)
0.2
62.5 V
20 30 50 100 200 250
Load Voltage (V
DC Resistive Load
AC Resistive Load
0.25 A
0.136 A
220 V
Figure 3.1 Switching Power
3.2 Maximum coil voltage
Figure 3.2 shows the ratio of maximum voltage that can be continuously applied to the coil of the relay to the nominal
voltage. As long as the relay is used in the enclosed region in this figure, the coil is not damaged due to burning
and the coil temperature does not rise to an abnormally high level.
(* Rated Coil Voltage: 1.5 to 24 Vdc)
*1 Rated of decrease in maximum voltage: 50%/30°C
*2 Rated of decrease in maximum voltage: 50%/45°C
150
100
Ratio of maximum applied voltage
to nominal voltage (%)
0 –40 –200 20406080100
Ambient temperature (°C)
70°C
*1
Figure 3.2 Maximum Voltage Applied to Coil
85°C
*2
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3.3 Coil temperature rise
Figure 3.3 shows the relation between the rise in coil temperature and the power (product of the coil voltage and
current) dissipated by the coil. This figure shows the difference between the temperature before the power is applied
to the coil and the saturated temperature after application of power to the coil.
60
50
40
30
20
Temperature Rise (°C)
10
0 100 200 300 400
Applied Power (mW)
2 A
0 A
Figure 3.3 Coil Temperature Rise
Carrying
Current
10
3.4 Driving power vs. timing
Figure 3.4 (1) shows the relations among the power applied to drive the relay, the operate time, and the bounce
time. Figure 3.4 (2) shows the relations among the supplied power, the release time, and the bounce time, and Figure
3.4 (3) shows the relations among the supplied power, the release time, and the bounce time when a diode is not
connected to the coil to absorb surges.
(1) Operate time
Operate time
4
3
2
1
Operate Time
Operate Bounce Time (ms)
0 50 100 150
(2) Release time (with diode)
Applied Power (mW)
Operate bounce time
(3) Release time
Release time
4
3
2
1
Release Bounce Time (ms)
(with diode)
Release Time
0 50 100 150
Applied Power (mW)
Release time
4
3
2
1
Release Time
Release Bounce Time (ms)
0 50 100 150
Applied Power (mW)
Release bounce time
Release bounce time
Figure 3.4 Driving Power vs. Timing
11
3.5 Thermal characteristics
p
)
The general characteristics of a relay gradually change with the ambient temperature. Figure 3.5 shows the typical
characteristics of the ED2 series relay.
(1) Operate & release voltages
130
120
Operate
Release
110
100
90
80
70
Change in Must Operate and Must
Release Voltages (%)
–40 –20 0 20406080100
Ambient Temprature T
a
(°C)
(2) Contact resistance* (4) Transfer times
130
120
110
100
90
80
70
Changes in Contact Resistance (%)
–40 –20 0 20406080100
Ambient Temprature T
a
(°C)
130
120
110
100
90
80
Cange in Transfer Time (%)
70
–40 –20 0 20406080100
Operate
Release
Ambient Temprature T
a (°C)
(3) Operate & release times (5) Coil resistance
130
120
110
100
90
80
70
Change in Must Operate and Must
Release Times (%)
–40 –20 0 20406080100
Operate
Release
Ambient Temprature T
a
(°C)
130
120
110
100
90
80
70
Change in Coil Resistance (%)
–40 –20 0 20406080100
Ambient Tem
rature Ta (°C
Figure 3.5 Temperature Characteristics
* The contact resistance includes the conductive resistance of the terminals. It is this conductive resistance
component that can change with the temperature.
12
3.6 Magnetic interference
This section describes changes in the operate voltage caused by mutual magnetic interference when several relays
are closely mounted on a printed circuit board (PCB). Figure 3.6 (1) shows the distance among the relays mounted
on the PCB. As shown, the pin pitch of each relay is 2.54 mm. Figure 3.6 (2) shows the relay that is subject to
interference. In this figure, the hatched relay shown in the center of each relay arrangement is subject to interference,
and the surrounding relays influence the center relay. The condition under which the center relay suffers interference
and the surrounding relays affect the center relay differs depending on whether power is supplied to each relay. Figure
3.6 (3) shows the deviation in percent of the operate and release voltages of the center relays in Figure 3.6 (2).
(1) Mounting pitch (mm) (2) Relay arrangement
[ED2 series]
6 × 2.54
[EF2 series]
3 × 2.54
2.54
10.16
2.54
ON
Condition1 Condition2
Condition5 Condition6
ON OFF OFF
ON
ON
ON
ON
ON
Condition3 Condition4
OFF
OFF
OFF
OFF
OFF
(3) Deviation of must operate and must release voltages
+20
+10
0
6 × 2.54
2.54
2.54
–10
Deviation of Must
Operate Voltage (%)
–20
+20
+10
0
–10
Deviation of Must
Release Voltage (%)
–20
Figure 3.6 Magnetic Interference
123456
Condition
123456
Condition
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3.7 High-frequency characteristics
Figure 3.7 shows the performance of the ED2 and the EF2 series relays when a high-frequency signal is switched
by the contacts of the relay. Figure 3.7 (1) shows the test circuit. Figure 3.7 (2) shows the isolation loss of the relay.
Figure 3.7 (3) and Figure 3.7 (4) respectively show the insertion loss and return loss.
(1) Test circuit
Test equipment: HP8753B Network Analyzer (characteristic impedance: 50 Ω)
50 Ω
(2) Isolation loss
Isolation Loss
Network Analyzer
Test Set
IN
OUT
50 Ω
70
60
50
40
30
Isolation Loss (dB)
20
10
0
Insertion Loss
Network Analyzer
OUT
Test Set
IN
50 Ω
10 100 1000
Frequency (MHz)
Return Loss
Network Analyzer
IN
Bridge
OUT
50 Ω
(3) Insertion loss (4) Return loss
1.5
1.0
0.5
Insertion Loss (dB)
0
10 100 1000
Frequency (MHz)
70
60
50
40
30
Return Loss (dB)
20
10
0
Figure 3.7 High-frequency characteristics
14
Return Loss
V. S. W. R.
10 100 1000
Frequency (MHz)
3
2
V. S. W. R.
1
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