MM54HC175/MM74HC175
Quad D-Type Flip-Flop With Clear
General Description
This high speed D-TYPE FLIP-FLOP with complementary
outputs utilizes advanced silicon-gate CMOS technology to
achieve the high noise immunity and low power consumption of standard CMOS integrated circuits, along with the
ability to drive 10 LS-TTL loads.
Information at the D inputs of the MM54HC175/
MM74HC175 is transferred to the Q and Q
outputs on the
positive going edge of the clock pulse. Both true and complement outputs from each flip flop are externally available.
All four flip flops are controlled by a common clock and a
common CLEAR. Clearing is accomplished by a negative
pulse at the CLEAR input. All four Q outputs are cleared to a
logical ‘‘0’’ and all four Q
outputs to a logical ‘‘1.’’
The 54HC/74HC logic family is functionally as well as pinout compatible with the standard 54LS/74LS logic family.
All inputs are protected from damage due to static discharge by internal diode clamps to V
Features
Y
Typical propagation delay: 15 ns
Y
Wide operating supply voltage range: 2 –6V
Y
Low input current: 1 mA maximum
Y
Low quiescent supply current: 80 mA maximum (74HC)
Y
High output drive current: 4 mA minimum (74HC)
and ground.
CC
MM54HC175/MM74HC175 Quad D-Type Flip-Flop With Clear
January 1988
Connection Diagram
Truth Table
(Each Flip-Flop)
Dual-In-Line Package
Top View
Order Number MM54HC175 or MM74HC175
InputsOutputs
ClearClockDQQ
LXXLH
H
H
HLXQ
e
H
high level (steady state)
e
low level (steady state)
L
e
irrelevant
X
e
transition from low to high level
u
e
the level of Q before the indicated
Q
0
steady-state input conditions were established
HH L
u
LL H
u
Q
0
0
TL/F/5319– 1
C
1995 National Semiconductor CorporationRRD-B30M105/Printed in U. S. A.
TL/F/5319
Page 2
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
b
b
)
b
0.5 toa7.0V
1.5 to V
CC
0.5 to V
CC
g
g
b
g
65§Ctoa150§C
a
1.5V
a
0.5V
20 mA
25 mA
50 mA
Power Dissipation (PD)
(Note 3)600 mW
Supply Voltage (V
)26V
CC
DC Input or Output Voltage0V
(V
IN,VOUT
)
Operating Temp. Range (T
MM74HC
MM54HC
Input Rise or Fall Times
e
2.0V(tr,tf)1000ns
V
CC
e
V
4.5V500ns
CC
e
V
6.0V400ns
CC
S.O. Package only500 mW
Lead Temperature (T
)
L
(Soldering 10 seconds)260§C
DC Electrical Characteristics (Note 4)
SymbolParameterConditionsV
CC
A
e
T
25§C
TypGuaranteed Limits
V
IH
Minimum High Level2.0V1.51.51.5V
Input Voltage4.5V3.153.153.15V
6.0V4.24.24.2V
V
IL
Maximum Low Level2.0V0.50.50.5V
Input Voltage**4.5V1.351.351.35V
6.0V1.81.81.8V
V
OH
Minimum High LevelV
Output Voltage
e
VIHor V
l
I
IN
OUT
IL
s
20 mA2.0V2.01.91.91.9V
l
4.5V4.54.44.44.4V
6.0V6.05.95.95.9V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
I
IN
OUT
e
V
OL
Maximum Low LevelV
Output Voltage
IL
s
4.0 mA4.5V4.23.983.843.7V
l
s
5.2 mA6.0V5.75.485.345.2V
l
VIHor V
IL
s
20 mA2.0V00.10.10.1V
l
4.5V00.10.10.1V
6.0V00.10.10.1V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
CC
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
with this supply. Worst case V
I
**V
Maximum InputV
Current
Maximum QuiescentV
Supply CurrentI
g
and VILoccur at V
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
OZ
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
IH
e
IN
e
IN
OUT
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
IL
s
4.0 mA4.5V0.20.260.330.4V
l
s
5.2 mA6.0V0.20.260.330.4V
l
VCCor GND6.0V
g
0.1
VCCor GND6.0V880160mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,ICC, and
CC
74HC54HC
eb
T
40 to 85§CT
A
g
1.0
MinMaxUnits
)
A
b
b
40
55
eb
A
55 to 125§C
g
a
a
1.0mA
CC
85
125
V
C
§
C
§
Units
2
Page 3
e
AC Electrical Characteristics V
CC
5V, T
e
A
SymbolParameterConditions Typ
f
MAX
t
PHL,tPLH
t
PHL,tPLH
t
REC
t
S
t
H
t
W
Maximum Operating6035MHz
Frequency
Maximum Propagation1525ns
Delay, Clock to Q or Q
Maximum Propagation1321ns
Delay, Reset to Q or Q
Minimum Removal20ns
Time, Clear to Clock
Minimum Setup Time, Data to Clock20ns
Minimum Hold Time, Data from Clock0ns
Minimum Pulse Width, Clock or Clear1016ns
25§C, C
e
15 pF, t
L
Guaranteed
Limit
e
e
t
6ns
r
f
Units
AC Electrical Characteristics V
CC
SymbolParameterConditionsV
f
MAX
t
PHL,tPLH
t
PHL,tPLH
t
REM
t
S
t
H
t
W
tr,t
f
t
TLH,tTHL
C
PD
C
IN
Note 5: CPDdetermines the no load dynamic power consumption, P
Maximum Operating2.0V12654MHz
Frequency4.5V60302420MHz
Maximum Propagation2.0V80150190225ns
Delay, Clock to Q or Q4.5V15303845ns
Maximum Propagation2.0V64125158186ns
Delay, Reset to Q or Q
Minimum Removal Time2.0V100125150ns
Clear to Clock4.5V202530ns
Minimum Setup Time2.0V100125150ns
Data to Clock4.5V202530ns
Minimum Hold Time2.0V000ns
Data from Clock4.5V000ns
Minimum Pulse Width2.0V3080100120ns
Clear or Clock4.5V9162024ns
Maximum Input Rise and2.0V100010001000ns
Fall Time4.5V500500500ns
Maximum2.0V307595110ns
Output Rise and4.5V9151922ns
Fall Time6.0V8131619ns
Power Dissipation(per150pF
Capacitance (Note 5)package)
Maximum Input5101010pF
Capacitance
e
2.0V to 6.0V, C
CC
e
L
e
T
25§C
A
50 pF, t
e
e
t
6 ns (unless otherwise specified)
r
f
74HC54HC
eb
T
40 to 85§CT
A
eb
A
55 to 125§C
TypGuaranteed Limits
6.0V70352824MHz
6.0V13263238ns
4.5V14253237ns
6.0V12212732ns
6.0V172125ns
6.0V172125ns
6.0V000ns
6.0V8141720ns
6.0V400400400ns
2
e
CPDV
D
faICCVCC, and the no load dynamic current consumption, I
MM54HC175/MM74HC175 Quad D-Type Flip-Flop With Clear
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
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systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
be reasonably expected to result in a significant injury
to the user.
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