MM54HC76/MM74HC76 Dual J-K Flip-Flops
with Preset and Clear
General Description
These high speed (30 MHz minimum) J-K Flip-Flops utilize
advanced silicon-gate CMOS technology to achieve, the low
power consumption and high noise immunity of standard
CMOS integrated circuits, along with the ability to drive 10
LS-TTL loads.
Each flip-flop has independent J, K, PRESET, CLEAR, and
CLOCK inputs and Q and Q
edge sensitive to the clock input and change state on the
negative going transition of the clock pulse. Clear and preset are independent of the clock and accomplished by a low
logic level on the corresponding input.
outputs. These devices are
January 1988
The 54HC/74HC logic family is functionally as well as pinout compatible with the standard 54LS/74LS logic family.
All inputs are protected from damage due to static discharge by internal diode clamps to V
and ground.
CC
Features
Y
Typical propagation delay: 16 ns
Y
Wide operating voltage range
Y
Low input current: 1 mA maximum
Y
Low quiescent current: 40 mA maximum (74HC Series)
Y
High output drive: 10 LS-TTL loads
MM54HC76/MM74HC76 Dual J-K Flip-Flops with Preset and Clear
*This is an unstable condition, and is not guaranteed
LLQ0Q0
v
HL H L
v
LH L H
v
HHTOGGLE
v
0
(1 of 2)
C
1995 National Semiconductor CorporationRRD-B30M105/Printed in U. S. A.
TL/F/5074
TL/F/5074– 2
TL/F/5074– 3
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
b
b
)
b
0.5 toa7.0V
1.5 to V
CC
0.5 to V
CC
g
g
b
g
65§Ctoa150§C
a
1.5V
a
0.5V
20 mA
25 mA
50 mA
Power Dissipation (PD)
(Note 3)600 mW
Supply Voltage (V
)26V
CC
DC Input or Output Voltage0V
(V
IN,VOUT
)
Operating Temp. Range (T
MM74HC
MM54HC
Input Rise or Fall Times
e
2.0V(tr,tf)1000ns
V
CC
e
V
4.5V500ns
CC
e
V
6.0V400ns
CC
S.O. Package only500 mW
Lead Temp. (T
) (Soldering 10 seconds)260§C
L
DC Electrical Characteristics (Note 4)
SymbolParameterConditionsV
CC
A
e
T
25§C
TypGuaranteed Limits
V
IH
Minimum High Level2.0V1.51.51.5V
Input Voltage4.5V3.153.153.15V
6.0V4.24.24.2V
V
IL
Maximum Low Level2.0V0.50.50.5V
Input Voltage**4.5V1.351.351.35V
6.0V1.81.81.8V
V
OH
Minimum High LevelV
Output Voltage
e
VIHor V
l
I
IN
OUT
IL
s
20 mA2.0V2.01.91.91.9V
l
4.5V4.54.44.44.4V
6.0V6.05.95.95.9V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
I
IN
OUT
e
V
OL
Maximum Low LevelV
Output Voltage
IL
s
4.0 mA4.5V4.23.983.843.7V
l
s
5.2 mA6.0V5.75.485.345.2V
l
VIHor V
IL
s
20 mA2.0V00.10.10.1V
l
4.5V00.10.10.1V
6.0V00.10.10.1V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
CC
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
with this supply. Worst case V
I
**V
Maximum InputV
Current
Maximum QuiescentV
Supply CurrentI
g
and VILoccur at V
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
OZ
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
IH
e
IN
e
IN
OUT
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
IL
s
4.0 mA4.5V0.20.260.330.4V
l
s
5.2 mA6.0V0.20.260.330.4V
l
VCCor GND6.0V
g
0.1
VCCor GND6.0V44080mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,ICC, and
CC
74HC54HC
eb
T
40 to 85§CT
A
g
1.0
MinMaxUnits
)
A
b
b
40
55
eb
A
55 to 125§C
g
a
a
1.0mA
CC
85
125
V
C
§
C
§
Units
2
AC Electrical Characteristics V
CC
5V, T
e
A
25§C, C
e
L
15 pF, t
e
e
t
6ns
r
f
e
SymbolParameterConditionsTypGuaranteed LimitUnits
f
MAX
t
PHL,tPLH
t
PHL,tPLH
t
PHL,tPLH
t
REM
t
s
t
H
t
W
Maximum Operating Frequency5030MHz
Maximum Propagation Delay Clock to Q or Q1621ns
Maximum Propagation Delay Clear to Q or Q2126ns
Maximum Propagation Delay Preset to Q or Q2328ns
Minimum Removal Time1020ns
Minimum Setup Time J or K to Clock1420ns
Minimum Hold Time J or K to Clock
b
30 ns
Minimum Pulse Width Preset, Clear or Clock1016ns
AC Electrical Characteristics C
e
L
SymbolParameterConditionsV
f
MAX
t
PHL,tPLH
t
PHL,tPLH
t
PHL,tPLH
t
REM
Maximum Operating2.0V9543MHz
Frequency4.5V45272118MHz
Maximum Propagation2.0V100126160183ns
Delay Clock to Q or Q4.5V20253137ns
Maximum Propagation2.0V126155191250ns
Delay Clear to Q or Q4.5V25313947ns
Maximum Propagation2.0V137165210240ns
Delay, Preset to Q or Q
Minimum Removal Time2.0V55100125150ns
Preset or Clear4.5V11202530ns
to Clock6.0V9172125ns
t
s
t
H
t
W
t
TLH,tTHL
tr,t
f
C
PD
C
IN
Note 5: CPDdetermines the no load dynamic power consumption, P
Minimum Setup Time2.0V77100125150ns
J or K to Clock4.5V15202530ns
Minimum Hold Time2.0Vb3000ns
J or K from Clock4.5V
Minimum, Pulse Width,2.0V5580100120ns
Preset, Clear or Clock4.5V11162024ns
Maximum Output Rise2.0V307595110ns
and Fall Time4.5V8151922ns
Maximum Input Rise and2.0V100010001000ns
Fall Time4.5V500500500ns
Power Dissipation(per flip-flop)80pF
Capacitance (Note 5)
Maximum Input5101010pF
Capacitance
e
CC
e
t
6 ns (unless otherwise specified)
r
f
e
T
25§C
A
eb
T
A
74HC54HC
40 to 85§CT
A
eb
55 to 125§C
50 pF, t
TypGuaranteed Limits
6.0V53312420MHz
6.0V17212732ns
6.0V21263340ns
4.5V27334150ns
6.0V23283540ns
6.0V13172125ns
b
3000ns
b
6.0V
3000ns
6.0V9141821ns
6.0V7131619ns
6.0V400400400ns
2
e
CPDV
D
faICCVCC, and the no load dynamic current consumption, I
CC
e
CPDVCCfaICC.
S
Units
3
Typical Applications
N Bit Presettable Ripple Counter with Enable and Reset
TL/F/5074– 4
N Bit Parallel Load/Serial Load Shift Register with Clear
MM54HC76/MM74HC76 Dual J-K Flip-Flops with Preset and Clear
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
be reasonably expected to result in a significant injury
to the user.
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