MX23L6410
64M-BIT (8M x 8 / 4M x 16) Mask ROM
FEA TURES
• Bit organization
- 8M x 8 (byte mode)
- 4M x 16 (word mode)
• Fast access time
- Random access: 100ns (max.)
• Current
- Operating: 50mA (max.)
- Standby: 15uA (max.)
• Supply voltage
- 2.7V~3.6V
• Package
- 44 pin SOP (500 mil)
- 48 pin TSOP (12mm x 20mm)
PIN CONFIGURATION
44 SOP
A21
A18
A17
CE
VSS
OE
D0
D8
D1
D9
D2
D10
D3
D11
2
3
4
A7
5
A6
6
A5
7
A4
8
A3
9
A2
10
A1
11
A0
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
MX23L6410
31
30
29
28
27
26
25
24
23
A20
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE
VSS
D15/A-1
D7
D14
D6
D13
D5
D12
D4
VCC
ORDER INFORMATION
Part No. Access Time Package
MX23L6410MC-10 100ns 44 pin SOP
MX23L6410MC-12 120ns 44 pin SOP
MX23L6410MC-15 150ns 44 pin SOP
MX23L6410TC-10 100ns 48 pin TSOP
MX23L6410TC-12 120ns 48 pin TSOP
MX23L6410TC-15 150ns 48 pin TSOP
MX23L6410RC-10 100ns 48 pin TSOP
(Reverse type)
MX23L6410RC-12 120ns 48 pin TSOP
(Reverse type)
MX23L6410RC-15 150ns 48 pin TSOP
(Reverse type)
PIN DESCRIPTION
Symbol Pin Function
A0~A21 Address Inputs
D0~D14 Data Outputs
D15/A-1 D15 (Word Mode) / LSB Address (Byte
Mode)
CE Chip Enable Input
OE Output Enable Input
Byte Word / Byte Mode Selection
VC C Power Supply Pin
VSS Ground Pin
N C No Connection
MODE SELECTION
CE OE Byte D15/A-1 D0~D7 D8~D15 Mode Power
H X X X High Z High Z - Stand-by
L H X X High Z High Z - Active
L L H Output D0~D7 D8~D15 Word Active
L L L Input D0~D7 High Z Byte Active
P/N:PM0408
1
REV. 2.8, JAN. 15, 2002
48 TSOP (NORMAL TYPE)
1
BYTE
2
A16
3
A15
4
A14
5
A13
6
A12
7
A11
8
A10
9
A9
10
A8
11
A19
12
A21
13
A20
14
A18
15
A17
16
A7
17
A6
18
A5
19
A4
20
A3
21
A2
22
A1
23
A0
24
CE
48 TSOP (REVERSE TYPE)
48
VSS
47
VSS
D7
D14
D6
D13
D5
D12
D4
VCC
VCC
NC
D11
D3
D10
D2
D9
D1
D8
D0
OE
VSS
VSS
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
D15/A-1
MX23L6410
(Normal T ype)
MX23L6410
(Reverse Type)
MX23L6410
48
VSS
47
VSS
46
D15/A-1
45
D7
44
D14
43
D6
42
D13
41
D5
40
D12
39
D4
38
VCC
37
VCC
36
NC
35
D11
34
D3
33
D10
32
D2
31
D9
30
D1
29
D8
28
D0
27
OE
26
VSS
25
VSS
1
BYTE
2
A16
3
A15
4
A14
5
A13
6
A12
7
A11
8
A10
9
A9
10
A8
11
A19
12
A21
13
A20
14
A18
15
A17
16
A7
17
A6
18
A5
19
A4
20
A3
21
A2
22
A1
23
A0
24
CE
BLOCK DIAGRAM
A0/(A-1)
A21
CE
BYTE
OE
P/N:PM0408
Address
Buffer
Memory
Array
Page
Buffer
2
Word/
Byte
Output
Buffer
D0
D15/(D7)
REV. 2.8, JAN. 15, 2002
MX23L6410
ABSOLUTE MAXIMUM RATINGS
Item Symbol Ratings
V oltage on any Pin Relativ e to VSS VIN -1.3V to VCC+2.0V (Note)
Ambient Operating Temperature Topr 0°C to 70°C
Storage T emperature Tstg -65°C to 125°C
Note: Minimum DC v oltage on input or I/O pins is -0.5V.
During voltage transitions, inputs may undershoot VSS
to -0.8V for periods of up to 20ns. Maximum DC voltage
on input or I/O pins is VCC+0.5V. During v oltage transitions, input may overshoot VCC to VCC+2.0V for periods of up to 20ns.
DC CHARACTERISTICS (Ta = 0°C ~ 70°C, VCC = 2.7V~3.6V)
Item Symbol MIN. MAX. Conditions
Output High Voltage VOH 2.4V - IOH = -0.4mA
Output Low Voltage VOL - 0.4V IOL = 1.6mA
Input High Voltage VIH 2.2V VCC+0.3V
Input Low Voltage VIL -0.3V 0.8V
Input Leakage Current ILI - 5uA 0V, VCC
Output Leakage Current ILO - 5uA 0V , VCC
Operating Current ICC1 - 50mA f=5MHz, all output open
Standby Current (TTL) ISTB1 - 1mA CE = VIH
Standby Current (CMOS) ISTB2 - 15uA CE>VCC-0.2V
Input Capacitance CIN - 10pF Ta = 25°C, f = 1MHZ
Output Capacitance COUT - 10pF Ta = 25°C, f = 1MHZ
AC CHARACTERISTICS (Ta = 0 °C ~ 70°C, VCC = 2.7V~3.6V)
Item Symbol 23L6410-10 23L6410-12 23L6410-15
MIN. MAX. MIN. MAX. MIN. MAX.
Read Cycle Time tR C 100ns - 120ns - 150ns Address Access Time tAA - 100ns - 120ns - 150ns
Chip Enable Access Time tACE - 100ns - 120ns - 150ns
Output Enable Time tOE - 30ns - 60ns - 70ns
Output Hold After Address tOH 0ns - 0ns - 0ns Output High Z Delay tH Z - 20ns - 20ns - 20ns
Note:Output high-impedance delay (tHZ) is measured
from OE or CE going high, and this parameter guaranteed by design over the full voltage and temperature operating range - not tested.
P/N:PM0408
3
REV. 2.8, JAN. 15, 2002