Motorola MTH500 Service Manual

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Page 1

MTH500

TETRA Portable Radio

R1:380-400 MHz (PT811F)

Detailed Service Manual

Part Number: 6802963C70

@6802963C70@

Printed on recycled paper. Environmentally friendly cover and spiral bound. European Publications Department .

68P02963C70-O, Issued: 05.02.

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ii 68P02963C70-O

Scope of this Manual

This manual contains information necessary to identify and troubleshoot the MTH500 Portable radio at the component level. It also contains information on radio assembling, disassembling, and maintenance. Accordingly, information in this manual is divided into four sections:

•Overview

• Theory of Operation

• Troubleshooting

• Radio Programming

• Maintenance

Manual Revisions

Changes which occur after this manual is printed are described in Manual Revisions. These Manual Revisions provide complete information on changes including pertinent parts listing data.

Related Publications

• 68P02963C30-O MTH500 User Guide

• 68P02963C65-O MTH500 Basic Service Manual

• 68P02956C20-F CPS User’s Guide

• IFR-Operational Manual Supplement 46882-324

• IFR-Operational Manual 46882-274T

Computer Software Copyrights

The Motorola products described in this manual may include copyrighted Motorola computer programs stored in semiconductor memories or other media. Laws in the United States and other countries preserve for Motorola certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Motorola computer programs contained in the Motorola products described in this manual may not be copied or reproduced in any manner without the express written permission of Motorola. Furthermore, the purchase of Motorola products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Motorola, except for the normal non-exclusive royalty free license to use that arises by operation of law in the sale of a product.

Trademarks

MOTOROLA and the Stylized M Logo are registered in the U.S.Patent and Trademark Office. All other product or service names are the property of their respective owners.

Safety And General Information

Important Information on Safe and Efficient

Operation

Read this Information before Using your

handset

The information provided in this document supersedes the general safety information contained in service manuals published prior to June 2001. For information regarding handset use in a hazardous atmosphere please refer to the Factory Mutual (FM) Approval Manual Supplement or Instruction Card which is included with handset models that offer this capability.

Radio Frequency (RF) Operational Characteristics

Your handset contains a radio frequency transmitter to convey the information you wish to send as well as occasional automatic signals used to sustain connection with the wireless network, and a receiver which enables you to receive communication and connection information from the network.

Handset Operation And EME Exposure

Your Motorola handset is designed to comply with the following national and international standards and guidelines regarding exposure of human beings to radio frequency electromagnetic energy:

• United States Federal Communications Commission, Code of Federal Regulations; 47 CFR part 2 sub-part J

• American National Standards Institute (ANSI) / Institute of Electrical and Electronic Engineers (IEEE) C95. 1-1992

• Institute of Electrical and Electronic Engineers (IEEE) C95.1-1999 Edition

• National Council on Radiation Protection and Measurements (NCRP) of the United States, Report 86, 1986

• International Commission on Non-Ionizing Radiation Protection (ICNIRP) 1998

• Ministry of Health (Canada) Safety Code 6. Limits of Human Exposure to Radiofrequency Electromagnetic Fields in the Frequency Range from 3 kHz to 300 GHz, 1999

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68P02963C70-O iii

• Australian Communications Authority Radiocommunications (Electromagnetic Radiation – Human Exposure) Standard 1999 (applicable to wireless phones only)

• Anatel, Brasil Regulatory Authority “This equipment is in compliance with the limits of Specific Absorption Rate which refer to the exposal to electric, magnetic and electromagnetic fields adopted by ANATEL.”

To assure optimal handset performance and make sure human exposure to radio frequency electromagnetic energy is within the guidelines set forth in the above standards, always adhere to the following procedures:

Phone Operation

When placing or receiving a phone call, hold your handset as you would a wireline telephone. Speak directly into

the microphone.

Two-way radio Operation

When using your handset, hold the handset in a vertical position with the microphone 2.5 to 5 cm away from your mouth.

Body-worn Operation

To maintain compliance with these RF exposure guidelines, if you wear a handset on your body when transmitting, always place the handset in a Motorola approved belt clip or leather case for this product. Use of non-Motorola-approved accessories may exceed these RF exposure guidelines. If you do not use a Motorola

approved body-worn accessory and are not using the handset in the intended use positions along side of the head in the phone mode or in front of the face in the two-way radio mode, then ensure the antenna and handset is kept the following minimum distances from the body when transmitting:

• Phone or Two-way radio mode: 2.5 cm

• Data operation using any data feature with or without an accessory cable: 2.5 cm

Antenna Care

Use only the supplied or an approved replacement antenna. Unauthorized antennas, modifications, or

attachments could damage the handset and may violate FCC regulations.

DO NOT hold the antenna when the radio is “IN USE”. Holding the antenna affects call quality and may

cause the radio to operate at a higher power level than needed.

Approved Accessories

For a list of Approved Motorola accessories, please see “REPLACEMENT PARTS AND KITS” on page 45.

Electromagnetic Interference/Compatibility

NOTE: Nearly every electronic device is susceptible to

electromagnetic interference (EMI) if inadequately shielded, designed or otherwise configured for electromagnetic compatibility.

Facilities

To avoid electromagnetic interference and/or compatibility conflicts, turn off your handset in any facility where posted notices instruct you to do so. Hospitals or health care facilities may be using equipment that is sensitive to external RF energy.

Aircraft

When instructed to do so, turn off your handset when on board an aircraft. Any use of a handset must be in accordance with applicable regulations per airline crew instructions.

Medical Devices

Pacemakers

The Health Industry Manufacturers Association recommends that a minimum separation of 15 centimetres be maintained between a handheld wireless handset and a pacemaker. These recommendations are consistent with those of the U.S Food and Drug Administration.

Persons with pacemakers should:

• ALWAYS keep the handset more than 15 centimetres from their pacemaker when the handset is turned ON.

• not carry the handset in the breast pocket.

• use the ear opposite the pacemaker to minimise the potential for interference.

• turn the handset OFF immediately if you have any reason to suspect that interference is taking place.

Hearing Aids

Some digital wireless handsets may interfere with some hearing aids. In the event of such interference, you may want to consult your hearing aid manufacturer to discuss alternatives.

Other Medical Devices

If you use any other personal medical device, consult the manufacturer of your device to determine if it is adequately shielded from RF energy. Your physician may be able to assist you in obtaining this information.

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Safety and General

Use While Driving

Check the laws and regulations on the use of radios in the area where you drive. Always obey them.

When using the handset while driving, please:

• Give full attention to driving and to the road.

• Use hands-free operation, if available.

• Pull off the road and park before making or answering a call if driving conditions so require.

Operational Warnings

For Vehicles Equipped with an Air Bag

Do Not place a handset or install a Vehicular Adapter in the area over an air bag or in the air bag deployment area. Air bags inflate with great force. If a radio is placed in the air bag deployment area and the air bag inflates, the radio may be propelled with great force and cause serious injury to occupants of the vehicle.

Potentially Explosive Atmospheres

Turn off your handset prior to entering any area with a potentially explosive atmosphere, unless it is a handset type especially qualified for use in such areas as “Intrinsically Safe” (for example, Factory Mutual, CSA, UL, or CENELEC Approved). Do not remove, install, or charge batteries in such areas. Sparks in a potentially explosive atmosphere can cause an explosion or fire

resulting in bodily injury or even death

NOTE: The areas with potentially explosive atmos-

pheres referred to above include fuelling areas such as below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust, or metal powders, and any other area where you would normally be advised to turn off your vehicle engine. Areas with potentially explosive atmospheres are often, but not always, posted.

Blasting Caps and Areas

To avoid possible interference with blasting operations, turn off your handset when you are near electrical blasting caps, in a blasting area, or in areas posted: “Turn off two-way radio.” Obey all signs and instructions.

W A R N I N G

Operational Cautions

Antennas

Do not use any handset that has a damaged antenna. If

a damaged antenna comes into contact with your skin, a minor burn can result.

Batteries

All batteries can cause property damage and/or bodily injury such as burns if a conductive material such as jewellery, keys, or beaded chains touch exposed terminals. The conductive material may complete an electrical circuit (short circuit) and become quite hot. Exercise care in handling any charged battery, particularly when placing it inside a pocket, purse, or other container with metal objects.

European Union Directives Conformance

Statement

This product is in conformance with the TETRA (TErrestrial Trunked RAdio) standard.

This product is in conformance with the requirements of the applicable EU Council Directives.

Declarations of Conformance with the requirements are located at:

Motorola a/s

Midtager 20

DK-2605 Brondby

C a u t i o n

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Contents

68P02963C70-O v

MTH500 Portable Radio Model Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi

MTH500 Model Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xii

MTH500 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiii

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

Digital Modulation Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

Voice Compression Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

Transceiver Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

Digital Section Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

Transmitter Path Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

Receiver Path Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

Frequency Generating Section Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Section Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Block Diagram Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Receiver Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

Transmitter Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

Digital Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

Frequency Generating Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4

Block Diagrams Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5

Receiver Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5

Transmitter Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6

Digital Mode of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

Frequency Generating Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8

Main Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

RX Second Local Oscillator (LO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

Offset VCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

Detailed Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10

Receiver Path, Detailed Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10

Antenna Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10

Limiter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

Front Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

Second Pre-selector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

Attenuator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

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Contents

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Mixer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

IF Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12

BALUN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12

WPIC (receiver section) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12

Transmitter Path, Detailed Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13

Forward Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13

WPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13

LO LINE-UP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14

LNODCT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14

BALUN - FILTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14

RF Power Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15

Coupler and Feedback Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15

Isolator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15

Antenna Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15

Harmonic Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16

Digital Section, Detailed Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17

Host Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17

Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17

SRAM Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18

Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18

DC Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20

V1 Linear Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20

V2 Linear Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20

V3 Linear Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20

V4 Linear Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20

Switcher #1 (Synchronous Buck Mode Converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20

Switcher #2 (Boost Mode Converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-21

DSC Linear Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-21

TS_REF Linear Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-21

VREF1 Linear Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-21

VREF2 Linear Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-21

Current Limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-21

RS232, SB9600 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-23

Battery ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-23

Radio Audio System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-23

Tx Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-23

Rx Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-23

Frequency Generating Section Detailed Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-25

REF. Oscillator - TCXO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26

Main VCO and Main Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26

WPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26

LMX - Dual Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-27

Second LO VCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-27

Offset VCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-27

Display and Keypad Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-28

Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-28

Keypad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-28

Backlight and LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-29

Backlight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-29

Top LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-29

Radio Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-29

Accessory Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-29

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Mode Select (OPTION1 and OPTION2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-30

Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

Test Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

Troubleshooting Flowcharts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2

DMO Troubleshooting Charts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2

TMO Troubleshooting Charts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2

Digital Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

Digital Analysis Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

Digital Analysis Test (Cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4

Digital Analysis Test (Cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5

Digital Analysis Test (Cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6

DC Distribution (V2_2.775V) Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7

DC Distribution (V2_2.775V) Test (Cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8

DC Distribution (V2_2.775V) Test (Cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9

DC Distribution (V2_2.775V) Test (Cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10

DC Distribution (SWB+) Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11

DC Distribution (V4_2.775V) Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12

DC Distribution (V3_2.775V/PWM2_1.8V) Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13

DC Distribution (V5_RF/PWM1/VSIMI _5.6V) Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14

Transmitter Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15

Standby Current Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15

Open Loop Power Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16

Open Loop Power Test (Cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17

Open Loop Power Test (Cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18

WPIC Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-19

Closed Loop Power Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-20

Transmitter Current Consumption Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21

Receiver Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22

Synthesizer Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23

Synthesizer Troubleshooting (Cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-24

Second LO VCO Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25

Offset VCO Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26

Audio Troubleshooting (External Mic to External Out) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-27

Programming the Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

Programming The Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

Codeplug Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

Application Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2

Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Preventive Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Safe Handling of CMOS Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2

Disassembling and Reassembling the MTH500 Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2

Protecting Static-Sensitive Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3

To create a proper ground: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3

To store or transport a circuit board: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3

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Removing and Installing the Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

To remove the antenna from the unit: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

To install the antenna in the unit: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

Removing and Installing Battery Door and Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

To remove the battery door from the unit: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

To remove the battery: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5

To install the battery: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6

To install the battery door: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6

Removing and Installing the Back Housing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6

Removing the back housing from the unit: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6

Installing the back housing: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7

Removing and Installing the Vibrator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7

Removing the vibrator: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8

Installing the vibrator: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8

Removing and Installing the Main Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9

Removing the main board from the unit: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9

Installing the main board: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9

Removing and Installing the Keypad and LCD Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10

Removing the keypad and LCD boards from the unit: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10

Installing the keypad and LCD boards: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11

Removing and Installing the LCD Module Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12

To remove the LCD module assembly from the unit: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12

To install the LCD module assembly: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13

Removing and Installing the Keypad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14

Removing the keypad: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14

Installing the keypad: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14

Removing and Installing the Microphone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15

Removing the microphone: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15

Installing the microphone: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15

Removing and Installing the Earphone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15

Removing the earphone: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15

Installing the earphone: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15

MTH500 Components List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17

Component Board Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1

Schematic Diagrams and Parts Lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7

Appendix 1 Replacement

Parts and Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A1-1

Ordering Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A1-1

Level 3 Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A1-1

EMEA Region . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A1-1

Latin America Region . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A1-2

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Contents

68P02963C70-O ix

Appendix 2 Test Equipment, Service Aids &

Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A2-1

Appendix 3 Self Check

Error/Fail Code Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3-1

General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A3-1

Self Check Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A3-1

Appendix 4 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A4-1

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Page 11

Foreword

68P02963C70-O xi

MTH500 Portable Radio Model Information

This manual applies to the following MTH500, 1W, Hand-Held Portable Radio Models:

Black H39PCN6TZ5AZ, 380-400MHz

Blue H39PCN6TZ5AR, 380-400MHz

Typical Model Numbering: M 1 2 P C N 6 T Z 5 A Z

Position:

MODEL NUMBERING SYSTEM

23145 7

109

Position 1 - Type of Unit

H = Hand-Held Portable M = Mobile Product

Positions 2 and 3 - Model Series

02=Motorola Digital Communicator 06=Motorola Advanced Feature Digital 07=Motorola i370 Products 08=Motorola i1000 Products 12=Motorola 3:1 Mobile 13=Motorola Ruggedized Digital 39=Motorola MTH500 Family

Position 4 - Frequency Band

P=380 to 400 MHz Q=410 to 430 MHz *Values given represent range only; they are not absolute.

Position 5 - Power Level

A=0 to 0.7 Watts B=0.7 to 0.9 Watts C=1.0 to 3.9 Watts D=4.0 to 5.0 Watts E=5.1 to 6.0 Watts F=6.1 to 10.0 Watts

Position 6 - Physical Packages

F=Limited Keypad - With Display H=Full Keypad - With Display K= Limited Controls - Basic Display N=Enhanced Controls - Enhanced Display

Position 7 - Channel Spacing

1=5 kHz 2=6.25 kHz 3=10 kHz 4=12.5 kHz

5=15 kHz 6=25 kHz 7=30 kHz

Position 12 - Unique

Model Variations N=Standard Package R=Blue Housing Z=Black Housing

Position 11 - Version

Version Letter (Alpha) Major Change Version Lette r (Beta) Major Change

Position 10 - Feature Level

1=Basic 2=Limited Pkg 3=Limited Plus 4=Intermediate 5=Standard Pkg

6=Standard Plus 7=Expanded Pkg 8=Expanded Plus 9=Full Feature/ Programmable

Position 9 - Primary System Type

R=iDEN Basic S= iDen AFU Z= Dimetra

Position 8 - Primary Operation

N=Digital Front Q=Low Profile -Basic Display R=Digital Multi-Service T=TDMA Digita l Dual Mode

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Foreword

xii 68P02963C70-O

MTH500 Model Specifications

Specifications subject to change without notice.

GENERAL RECEIVER TRANSMITTER

ETSI ETS 300 394-1 Receiver Type: Class A and B Modulation Type: p/4DQPSK

Type Number: Frequenc y Range: R1:380-400 MHz

Temperature Range for Transceiver: Channel Spacing: 25 kHz RF Power

Operating: -20°C to +60°C Sensitivity (4%) BER: -112 dBm

Storage: -40°C to +85°C Intermodulation:

Interfering Signal Level:

(4%) BER

-47 dBm

Frequency Range: R1: 380-400 MHz

Selectivity Blocking: (50-100 kHz) Interfering Signal Level:

(4%) BER

-40 dBm

Frequency Stability:

Locked to Base Not Locked to Base

± 100 Hz

± 2 ppm

Battery Types:

Standard SNN5705B 800mAH (LiIon), Standard SNN5705C 800mAH (LiIon),

High Capacity SNN5706A 1100mAH (LiIon)

Spurious Rejection: Interfering Signal Level:

(4%) BER

-45 dBm

Spurious Emissions

Conducted 30MHz-1GHz 1G Hz- 4GH z Radiated 30MHz-1GHz 1GHz-4GHz

-36dBm

-30dBm

-36dBm

-30dBm

Frequency Stability:

Locked to Base Not Locked to Base

± 100 Hz

± 2 ppm

Adjacent Channel Power (at

± 25kHz) – 60 dB

Battery Voltage: Audio Rated: 0.5 W

Minimum: 3.4 Vdc Distortion at Rated Audio: 5% Max.

Nominal: 3.8 Vdc

Portable Dimensions HxW xD in MMs:

140x55x31 mm

Weight:

155gr, without battery

R1:380-400 MHz: PT811F

1Watt

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Foreword

68P02963C70-O xiii

MTH500 Accessories

Kit Number MTH500 Model Description

Batteries

FTN6030A Extended battery, 1100mAh, LiIon, Black (with battery door)

FTN6037A Extended battery, 1100mAh, LiIon, Blue (with battery door)

FTN6031A Standard battery, 800mAh, LiIon, Black (with battery door)

FTN6038A Standard battery, 800mAh, LiIon, Blue (with battery door)

Chargers

FLN9468A Dual Pocket Desktop Charger

SPN4716B Travel charger

SYN7455A Plug Adapter UK for travel Charger

SYN7456A Plug Adapter EU for travel Charger

FLN9469A Vehicular battery charger

Vehicular Adapters

FLN2850A Car Kit

FLN9569A Stand alone car cradle

Audio accessories

WADN4184A Headset with Boom mic and in line PTT

FLN9470A Headset with Boom mic (On Hold)

FLN9568A PHF

Carrying Accessories

FLN9476A Soft leather carry case

FHN6246A Belt clip

Others

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Foreword

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Page 15

68P02963C70-O 1- 1

Overview

General

To achieve a high spectrum efficiency, the MTH500 uses digital modulation technology and sophisticated voice-compression algorithm. The voice of the person speaking into the microphone is converted into a digital bit stream consisting of zeros (0) and ones (1). This stream is then modulated into a radio-frequency (RF) signal, which is transmitted over the air to another radio. The process is called digital modulation.

Digital Modulation Technology

The MTH500 is a 380-400 MHz portable radio that can operate in dispatch and phone mode. This radio can also operate in TMO (Trunked Mode Operation) and DMO (Direct Mode Operation). It uses two digital technologies: p/4DQPSK and Time Division Multiple Access (TDMA).

p/4DQPSK is a modulation technique that transmits information by altering the phase of the radio frequency (RF) signal. Data is converted into complex symbols, which alter the RF signal and transmit the information. When the signal is received, the change in phase is converted back into symbols and then into the original data.

The system can accommodate 4-voice channels in the standard 25 kHz channel as used in the two-way radio.

Time Division Multiple Access (TDMA) is used to allocate portions of the RF signal by dividing time into four slots, one for each unit.

Time allocation enables each unit to transmit its voice information without interference from other transmitting units. Transmission from a unit or base station is accommodated in time-slot lengths of 15 milliseconds and frame lengths of 60 milliseconds. The TDMA technique requires sophisticated algorithms and a digital signal processor (DSP) to perform voice compressions/decompressions and RF modulation/demodulation.

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Overview

1 - 2 68P02963C70-O

Voice Compression Technology

Voice is converted into a digital bit stream by sampling the voice at high rate and converting the samples into numbers, which are represented by bits.

Voice compression reduces the number of bits per second while maintaining the voice at an acceptable quality level. The

MTH500 uses a coding technique called

ACELP (Algebraic Code Excited Linear Prediction). The compressed voice-data bits modulate the RF signal.

Description

Transceiver Description

All the radio circuitry is contained in the Digital/RF Board and the keypad board. The Digital/RF board is divided into the following sections: digital, frequency generating, transmitter, and receiver.

Digital Section Description

The digital section includes the Redcap 2 that consists of the Mcore risk machine and the Digital Signal Processor (DSP).

The Mcore is the controller of the Digital/RF Board. It controls the operation of the transmitter, receiver, audio, and synthesizer integrated circuits located in the RF section. It communicates with the keypad and display.

The Digital Signal Processor (DSP) which performs modulation and de-modulation functions for the radio. It also performs Forward Error Correction and other correction algorithms for overcoming channel errors and ACELP speech coding. It carries out linear 16-bit analog to digital conversions, audio filtering, and level amplification for the microphone audio input and the received audio output.

The power and audio section is based on the GCAP III and includes power supplies, 13-bit CODEC, audio routing, microphone and ear piece amplifiers. A audio power amplifier is used for the loud speaker.

Transmitter Path Description

The transmitter circuitry includes a linear class AB Power Amplifier (PA) for the linear modulation of the

MTH500. It also includes a novel cartesian feedback

loop to enhance its transmitter linearity and reduced splattering power into adjacent channels.

Page 17

Overview

68P02963C70-O 1 - 3

The transmitter path consists of a novel cartesian feedback loop that contains the forward and loop feedback paths. The forward path includes the low noise ODCT (Offset Direct Conversion Transmitter), Balun, Attenuator, and Power Amplifier. The loop feedback path includes the directional coupler, attenuator, and LNODCT (Low Noise Offset Direct Conversion Transmitter) ASIC.

The cartesian Feedback output power passes to the antenna through the Isolator, Antenna Switch, and Harmonic Filter.

Receiver Path Description

The receiver path includes the Antenna Switch, SAW, LNA, ceramic filter, mixer, Crystal Filter, and WPIC (World Phone IC). The first IF consists of the Crystal Filter and WPIC ASIC.

Frequency Generating Section Description

The frequency generating section provides description of the following main components: Fractional-N Synthesizer, REF. oscillator, Main VCO, WPIC ASIC Synthesizers, LNODCT ASIC Synthesizer, External Offset and second LO Synthesizer, DSP PLL, and Host PLL.

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Overview

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Page 19

68P02963C70-O 2 - 1

Theory of Operation

Section Introduction

This section provides a block diagram overview of the main Digital/RF Board. This is supplemented by the detailed block diagram and detailed circuit description.

Block Diagram Overview

The main Digital/RF Block contains the following four sections (see Figure 1). An overview of these four sections is provided in the following paragraphs:

• Receiver Section

• Transmitter Section

• Digital & Audio Section

• Frequency Generating Section (Synthesizer)

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Theory of Operation

2 - 2 68P02963C70-O

Figure 1 General Block Diagram

Receiver Section

The receiver section includes the following main components:

• Antenna Switch

• Limiter

• Front Filter

• Low Noise Amplifier (LNA)

• Second Pre-selector

• Attenuator

•Mixer

• IF Filter

•Balun

•WPIC

Digital

Block

Transmitter

Receiever

Synthesizer

LCD KeyPad

Audio

Battery

Antenna

Switch

Main Board

Page 21

Theory of Operation

68P02963C70-O 2 - 3

The Receiver Path implements an Automatic Gain Control (AGC). It is required to maintain a good receiver linearity over a wide range of incoming signals and prevents clipping of high level signals.

The first Intermediate frequency (IF) circuit consists of the Mixer, IF Filter, and WPIC. The second IF consists of an analog IF and a digital mixer that converts to base band. They are located in the WPIC. The WPIC performs the following functions:

• Carries out amplification and quadrature down conversion of the signal into the second IF.

• Performs IF AGC.

• Converts the second IF analog signal into digital I & Q formats.

• Synthesizes the second VCO frequency.

• Synthesizes the Sigma-Delta clock.

• Synthesizes the receive and data transmit data clock.

• Transmits the received data to the DSP.

Transmitter Section

The transmitter circuitry includes a linear class AB Power Amplifier (PA) for the linear modulation of the MTH500. It also includes a novel cartesian feedback loop to enhance its transmitter linearity and reduced splattering power into adjacent channels.

The transmitter path consists of a novel cartesian feedback loop that contains the forward and feedback paths. The forward path includes the low noise ODCT (Offset Direct Conversion Transmitter), Balun, Attenuator, and Power Amplifier. The loop feedback path includes the directional coupler, attenuator, and LNODCT (Low Noise Offset Direct Conversion Transmitter) ASIC.

The cartesian Feedback output power passes to the antenna through the Isolator, Antenna Switch, and Harmonic Filter.

Digital Section

This section includes the REDCAP2, which controls the transmit, receive, and synthesize operations of the integrated circuits located in the RF section. Within the REDCAP2 is the DSP and the serial communication interface.

The digital section contains the following:

•REDCAP2

• Power On/Off circuitry

• Serial peripheral interface (SPI)

• Host memories (flash and SRAM)

• Bottom connector signal MUX

• Keypad block and connector

• LCD (liquid-crystal display) circuit and connector

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Theory of Operation

2 - 4 68P02963C70-O

Frequency Generating Section

The frequency generating section contains the following components:

• REF. Oscillator - TCXO

• Main Synthesizer - consists of the WPIC’s PLL and the Main Voltage Controlled Oscillator (VCO).

• 2nd Local Oscillator (LO) VCO together with the LMX Dual Synthesizer.

• Offset VCO together with the LMX Dual Synthesizer.

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Theory of Operation

68P02963C70-O 2 - 5

Block Diagrams Descriptions

The block diagrams descriptions cover Receiver Path, Transmitter Path, Digital Section, and Frequency Generation Section.

Receiver Path

The received signal (see Figure 2) from the antenna is directed by the Antenna Switch to the Front Filter.

Figure 2 Receive Path Block Diagram

This block-type filter, which defines the receive frequency range, blocks the half IF and image frequency entry, and reduces the RF oscillator leakage. The signal is mixed with the local oscillator to create the first IF at 109.65 MHz. The signal is filtered by the crystal filter and sent to the WPIC ASIC.

The WPIC performs down conversion to the second IF at baseband frequency (0 Hz) and converts the second IF analog signals into digital-in-phase (I) and Quadrature (Q) formats. This

(DSP)

LC Front Filter IL=2.5dB

WPIC

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Theory of Operation

2 - 6 68P02963C70-O

data is sent for further processing to the Digital Signal Processor (DSP) (part of RedCap2) over the Synchronous Serial Interface (SSI) data links.

The DSP performs: the demodulation, Forward Error Correction (FEC) and other correction algorithms for overcoming channel errors, and the GCAP decoder procedure for digital speech data decompression.

Transmitter Path

When the radio is transmitting (see Figure 3), the microphone audio is sent to the GCAP (CODEC). The CODEC performs analog-to-digital conversion and the digital signal is routed to the DSP. The DSP performs coding, Error Correction and modulation. From the DSP, the signal is sent to the WPIC+.

Figure 3 Transmit Path Block Diagram

In the WPIC+ data is converted into analog signal. This signal is also filtered. From the WPIC+, the data is injected to the LNODCT. In the LNODCT the data is mixed with RF signal.

From the differential output of the LNODCT the modulated RF signal is injected to the Balun-Filter, that transforms the differential input into single output, and then it is routed to the antenna via the Antenna Switch.

The feedback signal is used for power control.

Harmonic

Filter

Antenna

Switch

-0.8dB

-1dB

4dB

-8dB

-3.5dB

36 - 39dB

RF PA

Balun-Filter

LNODCT

WPIC+

REDCAP2

GCAP

Isolator

Attenuator

Power at Antenna:30dBm ± 2dB

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Theory of Operation

68P02963C70-O 2 - 7

Digital Mode of Operation

The digital section (see Figure 4) contains the radio's Redcap Risk-processor with its external memory and DSP, including its memory, within. GCAP III includes switching regulator and linear regulators, audio preamplifiers, CODEC 13-bit, 8channel 8-bit A/D Converter, Regulators, Audio Amplifier.

The Redcap controls the receive/transmit frequencies, power levels, display, keypad, accessories, MMI, and other radio functions. This microprocessor can be operated through the RS232 interface by a personal computer to program the FLASH.

The codec distribution is supported by the Global Control Audio Power (GCAP III) IC. This IC supplies power to the radio using step-down PWM regulator supplying 1.88 VDC to the Redcap core, V3 linear regulator 2.775VDC to the external memories, display and Redcap peripheral modules, supplying V2 to the A/D converter, GCAP internal logic, and audio amplifier. The regulator's power-down mode is controlled by the redcap, which senses the ON or OFF condition.

The DSP performs signalling, and voice encoding and decoding. The audio filtering and volume control, and analog-to-digital and digital-to-analog conversions on audio signals, are performed in the GCAP's Codec.

Figure 4 Digital Section Block Diagram

CS2

EB1

CS0

SPI

CE W EOE

FLAS H

U403

DATA ADR

UB LB O E

SRAM

U402

DATA ADR

Display

Address

Bus

Data Bus

REDCAP2

U401

Chip Selects

SPI Bus

Bus

Keypress

Detect

Column Lines (5)

Row

Lines (5)

Keypad

Board

Control Bus

To Radio

Bottom

Connector

RS232

EB0

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Theory of Operation

2 - 8 68P02963C70-O

Frequency Generating Section

The frequency generating section contains the following components (see Figure 5):

• REF. Oscillator - TCXO

• Main Synthesizer - consists of the WPIC’s PLL and the Main Voltage Controlled Oscillator (VCO).

• 2nd Local Oscillator (LO) VCO together with the LMX Dual Synthesizer.

• Offset VCO together with the LMX Dual Synthesizer.

Figure 5 Frequency Generation - Block Diagram

Of fset VCO

Second LO

Dual Synthesizer (U808)

Main VCO

Main Synthesizer

493.65-513.65 MHz to RX Mixe

113.65 MHz to Offset Mixer

493.65-513.65 MHz to TX Mixer

Reference

Oscillator - TCXO

Divider

OSC_IN

DOI F

IF Section

RF Section

DORF

219.3MHz

FINIF

FINRF

50kHz

100kH z

OSC_IN

WPI C

XTALBASE

PRSCI N

CPGITR

Data

LOIN

LPF

Osc.

Buffer

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Theory of Operation

68P02963C70-O 2 - 9

All frequencies originate from the REF. oscillator -TCXO. This is a digital temperature compensated crystal oscillator producing an accurate and stable 16.8 MHz reference frequency. The 16.8 MHz reference frequency is divided in the WPIC and in the Dual Synthesizer to produce required reference frequency for the other synthesizers.

Main Synthesizer

The Main Synthesizer consists of the WPIC internal PLL modules, and Main VCO on board. It produces the LO signal to down-convert the receive signal to the first IF 109.65 MHz frequency and to up-convert the 113.65 MHz transmitter IF frequency to produce the RF carrier frequency.

RX Second Local Oscillator (LO)

The second LO synthesizer supplies the second IF local oscillator frequency to the receiver. It produces 219.3 MHz that is divided by two in the WPIC in order to down-convert the received signal to the baseband.

Offset VCO

The Offset VCO consists of the LMX Dual Synthesizer and the VCO on board. It produces the output of the offset VCO 113.65 MHz.

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Theory of Operation

2 - 10 68P02963C70-O

Detailed Circuit Description

Receiver Path, Detailed Circuit Description

See Figure 6.

Figure 6 Receiver Path Circuit Diagram

Antenna Switch

The signal coming from the antenna is routed to the receiver section via the harmonic filter, which is comprised of L890 and C1012. The signal continues to flow through image filter (equivalent quarter wave) transformer C1015 and L817 to the Rx section toward limiter diode D500. The antenna switch attenuates the image

(DSP)

Baseband Filters

Baseband Amplifiers

LC Front Filter IL=2.5dB

GCAP

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Theory of Operation

68P02963C70-O 2 - 11

frequency by approximately 38dB. The attenuation of wanted signal is typically

0.7dB.

Limiter

The limiter (D500) function is to prevent entering of signal with power higher then 30dBm, which may damage the receiver front-end.

Front Filter

The signal arrived from the limiter is flowing via the front filter (FL500) and routed to the Low Noise Amplifier (LNA) (U500) via C576.

The front filter is also called -1st pre-selector and is used to attenuate the incoming parasitic RF frequencies, especially the image frequency (25dB). The Insertion Loss (IL) is typically 2dB.

LNA

The LNA module is the RF signal amplifier. The LNA gain (U500) including output matching circuit, C1048, L518, C521, R965, L500, C532, R580 and C507, is typically 23dB. Because the LNA is the first amplifier in the line, it is important that it will maintain large gain and small Noise Figure - 1.8dB.

The LNA has an “enable” pin (pin 3) which is called VPD. When this pin receives a supply of 1.8 V from DC switch (Q504) - the amplifier is enabled. From the LNA the signal passes to second pre-selector, LC filter (FL501). The IIP3 of the LNA is between -5dBm to -2.5dBm.

Second Pre-selector

The 2nd Pre-selector (FL501) attenuates the non-linear products of the LNA and also the image product by 25dB. Its IL is typically 2.5 dB. From the output of the LC filter the received signal is routed via a Pi-attenuator to the Mixer RF input.

Attenuator

The purpose of the resistor Pi-attenuator (R519, R517, R945), is to protect the mixer (U504) input from saturation. The pad attenuates RF power by 2.5dB

Mixer

The Mixer (U504) function is to down convert the incoming RF signal into IF signal (109.65 MHz). The Conversion Loss (CL) is typically 6.2dB and its IIP3 is typically 20dBm.

The RF signal enters the Mixer at pin 1, and the IF is produced at pin 6. The LO (from the main VCO) signal passes via the matching circuit (C522, L505, R943

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Theory of Operation

2 - 12 68P02963C70-O

and C984), enters the Mixer at pin 3. The LO power at the LO mixer input is 2dBm. The 2.7V DC is supplied by switch Q500 to pin.4.

The mixer conversion Loss is 7dB.

An impedance matching net is placed between the mixer and the IF filter (FL502). It consists of L512, C525, C531, C524, L504 and C539.

IF Filter

The IF signal is routed via the IF filter (FL502), which has IL of 2.5dB and attenuates parasitic products of the Mixer, and via an impedance matching network that consist of C546, C536 and L501 to the BALUN.

BALUN

The Balun transforms the single ended input RF signal to a differential doubleended output. It consists of L519, C526, C527, L520, C530 and C534.

The differential signal is routed to the WPIC (Word Phone IC) at pin A4 and B4.

WPIC (receiver section)

The differential IF signal is amplified and transferred into the WPIC and mixed with 2nd LO signal. The 2nd LO signal is routed to the WPIC at pin D1 and divided by 2 in to the quadrature generator block of the WPIC. The baseband signal from the mixer passes via a Baseband filters and amplifiers arrays that gives lower noise and better I & Q balance, to the WPIC A/D block and than to the DSP.

An internal AGC that is controlled by a control unit, establishes an appropriate attenuation for unwanted signals as well as an appropriate gain for wanted signals. The voltage at external capacitor C557 indicates the AGC attenuation level for the different input signal levels. The voltage at the capacitor varies from 1.4V to 2.7V as a function of the power of the received signal.

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Theory of Operation

68P02963C70-O 2 - 13

Transmitter Path, Detailed Circuit Description

See Figure 7.

Figure 7 Transmit Path Circuit Diagram

Forward Path

WPIC

The WPIC (World Phone IC) U503 receives serial data that is transmitted by the REDCAP2 at a 48 kbps rate to the SSI port (pin K10, STD). Data is transmitted as a 16-bit ‘I’ word followed by a 16-bit ‘Q’ word. The WPIC provides a serial clock of 4.8MHz to the REDCAP2 (pin K11, TXCLK) and sends a frame sync signal (pin L11, RXFS/SFS) at the beginning of every ‘I’ word transmission, to instruct the REDCAP2 to send data. In the WPIC, the received serial I & Q words from the REDCAP2 are converted into parallel I & Q words, and transferred to an interpolating filter. The interpolating filter increases the sampling rate to reduce in-band quantization noise, as well as to reduce image at multiples of the input data. The interpolated samples are rounded to 8 bits, and run through the 8-bit D/A converters. The D/A converters take the digital I & Q words and convert them into analog signals, which are filtered and amplified. The output is comprised of two separate low-level differential signals, I & Q (pins A8, OUTQ; C8, OUTQB; D8, OUTI; A9, OUTIB). A differential output is used to minimize the noise pick-up, due to its inherent common mode rejection. The output signals are routed to the LNODCT IC where the transmitting loop is closed. The WPIC sends a 2.4MHz

LNODCT

BalunFilter

Att.

+30

Att.

-3dB

37±2

-5dB

-10dB

I/Q Split

Image Filter

Att.

-3

Main VCO

Mixer

WPIC (ADDAG part)

REDCAP2

Power Amp. (FET)

Coupler

Isolator

Ant. Switch +Harm. Filter

Offset VCO

Dual Synthesizer

-0.1dB

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Theory of Operation

2 - 14 68P02963C70-O

low-level differential reference clock signal (pins B11, TCLCK; C10, TCLCKB) to the LNODCT. It also sends a differential signal (pins A11, TSLOT; A10, TSLOTB) that marks the beginning and the end of each transmission time slot of the REDCAP2 (whenever a TXE signal (pin H8 TXE) is received from the REDCAP2). After receiving the TSLOT signal, the LNOCDT toggles the ASW line (pin J5, ASW) which signals the WPIC to set VCNTO signal LOW (pin J6, VCNTO) which enables the Antenna Switch during transmit time. WPIC starts to receive data from REDCAP2 after TXE signal (pin H8, TXE).

LO LINE-UP

LO LINE-UP includes MIXER U800, Attenuator (R800, R819, R808), Image Filter FL800, LO Driver Q808, and I - Q Splitter Q801. Offset VCO is based on Dual Synthesizer IC U808 that receives data from REDCAP2 that defines Offset VCO parameters. The Offset VCO signal 113.65MHz is mixed with the Main VCO signal (493.65 - 513.65MHz) in the Mixer U800. The output of the Mixer is the RF carrier frequency. The signal passes through the P-attenuator and image filter FL800. The image filter attenuates the VCO and image frequencies and any outof-band spurs that may be present. The signal is amplified by LO FET Driver Q808 and routed to I-Q splitter U801 that converts the single input signal into two quadrature (90 degrees phase shift) ‘I’ and ‘Q’ signals and then routs them to the LNODCT LO input (pins 46, LOQ; 45, LOQB; 57, LOI; 56, LOIB). RF signal is sampled at the I-Q splitter input and applied to the LNODCT LO feedback (pin 24, MVCO).

LNODCT

The LNODCT (Low Noise Offset Direct Conversion Transmitter) U803 is the heart of the transmitter.

The differential base-band signals from the WPIC are inputted into the LNODCT on pins 58 – 61 (BINQB, BINQ, BINIB and BINI). They pass through a variable attenuator and then they are summed with the down converted I & Q feedback. The base-band signal is then amplified and sent to the up-mixer.

The up-mixer consists of two mixers, one for the I channel and the other for the Q channel. The split I & Q LO signal is mixed with the base-band I & Q signals to produce an I and Q modulated signals at RF frequency. The signal is then output differentially on pins 51 and 52 (RFOUTB, RFOUT).

BALUN - FILTER

The differential RF signal is converted to a single-ended (unbalanced) signal by passing the BALUN-Filter FL801 (balanced-unbalanced filter). The BALUN-Filter has a 200 Ohm input and 50 Ohm single-ended output, the BALUN-Filter output voltage amplitude is two times higher than the differential voltages amplitudes. Thus the LNODCT output signal is increased by 6dB in compare to each of the differential signals.

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Theory of Operation

68P02963C70-O 2 - 15

Another function of the BALUN-Filter is to attenuate the image frequencies and other unwanted out-of-band spurs present in the output signal. The insertion loss of the BALUN-Filter is 3dB. The output signal from the BALUN-Filter is applied to the RF PA through -1.8dB attenuator (R836, R833, R834).

RF Power Amplifier

The signal is then routed through DC coupling capacitor C823 to the RF Power Amplifier (PA). The PA IC consist of two amplifying stages. The PA output is matched with 50 Ohm coupler by the P-LC-circuit (C1028, C1029, L921). LC notch filter (L923, C1030) rejects the second harmonic of the RF signal. The PA gain is set by PA_BIAS voltage from the REDCAP2, L1T 3 (pin C6, TOUT3). The bias voltage is applied to the dual-transistor switch Q807, Q911 and then to PA (pins 8,VREG; 16, VBIAS respectively).

Coupler and Feedback Path

A coupler U806 exists at the RF PA output, it is used to pass the signal to Isolator FL801 and sample the signal thus providing the necessary feedback for the linearization and feedback correction. The sampled signal is routed via attenuator R815, R818, R825 to the LNODCT (pin 37, RFIN). The feedback signal is then mixed down to base-band in a quadrature down mixer, amplified and summed with the base-band input signal. The loop is closed.

Isolator

The signal in the forward path is fed to pin 2 of the isolator (FL801). The isolator is placed at the PA output to decrease the influence of the antenna impedance variation on the PA performance. The reflected power returned from the antenna, is absorbed in a 50 Ohms resistor inside the isolator. The isolator also protects the Cartesian loop from sudden VSWR variations that could lead to loop instability.

Antenna Switch

The RF signal from the Isolator is applied to the PIN DIODES U802. The PIN diodes are turned on during the transmission time slot, and the DC current flows through the Isolator to the ground. The RF signal is routed through 2 P-LC-cir- cuits (C848/L818/C838 and C1010/L817/C852) and the Harmonic Filter to the Antenna. L817/C1015 circuit provides the image rejection of the output RF signal. In the Receiving mode the PIN diodes are turned off, the input RF signal is directed to the receiver path via p/4 LC equivalent circuit (C1010/L817/C852). The condition of the PIN diodes is controlled by the voltage switch Q806 by applying the ANT_EN signal to the switch. The resistor R832 determines the DC current through PIN diodes; diode D801 provides the additional capacitance during the Transmission mode, capacitors C835 and C832 compensate the parasitic inductance of the D801. The VCNTO signal applied to the voltage switch Q806 is set LOW during the Receiving and Transmission modes.

The RF output signal is disabled during the CLCH (Training) mode by setting the VCNTO signal HIGH thus providing the low output power during the training slot.

Page 34

Theory of Operation

2 - 16 68P02963C70-O

Harmonic Filter

From the antenna switch the signal is routed to a one section of LC filter, consisting of the coil L890 and capacitors C1010, C1011 and C1012. The filter is required to attenuate the harmonics of the amplifying stages at the transmission path, and the Local Oscillator leakage at the receiver path.

Page 35

Theory of Operation

68P02963C70-O 2 - 17

Digital Section, Detailed Circuit Description

See Figure 8.

Figure 8 Digital Section - Detailed Circuit Diagram

Host Memories

The RedCap2 Address bus is a 22-bit wide (0:21) and RedCap2 Data Bus is a 16bit wide (0:15).

RedCap2 uses two types of memories:

Flash Memory

The Flash Memory is dedicated to the application software. This memory has a 16-bit wide data bus. The Flash memory location has a 32M Bit of memory; When addressing the Flash memory location, the processor reads into its 16-bit wide data bus.

RF Section

GCAP3

CE Accessory Conn.

Keypad

Vibracall

Power Supplies

Radio Off

ESSI

UART

OPT SEL

ESSI SPIB Reset

OPT B+

USB/8-RS232

USB_PWR

BAT_FDBK

Ext Audio

ON3

Control

BBP

SPIA

REDCAP2

4 MB flashmemory

1MB

SRAM

Graphic Display

SPIB

Page 36

Theory of Operation

2 - 18 68P02963C70-O

The Flash also stores the Radio CodePlug (Customer related information) such as telephone numbers, addresses, etc.

SRAM Memory

This 512 x 16 Static Ram is used for Data storage.

Serial Peripheral Interface (SPI)

The RedCap2 uses the SPI protocol (Serial Peripheral Interface) to communicate with RF IC's (WPIC, ODCT, Synthesizer/LMX), GCAP3 IC and the display driver.

The RF IC's are connected to SPIA module, while GCAP3 and the display are connected via SPIB module.

The protocol is built upon 4 lines [MOSI(Tx), MISO(Rx), CS, CLK)].

The Display Module, based on the display driver (i.e. Samsung KS0741) uses a serial interface.

Figure 9 is a block diagram of the RedCap2 and its interfaces.

Page 37

Theory of Operation

68P02963C70-O 2 - 19

Figure 9 REDCAP2 Block Diagram

Encr yption

Accelerator

DSP Peripheral

DMA

PR OM 2Kx24

PRAM 40Kx24

YROM 0Kx16

YRAM 15Kx16

DSP Core

Viterbi

Acceler ator

MCU/DSP

Interface

MDI

XROM 0Kx16

XRAM 12Kx16

Shared X/VIA C

RAM 2Kx16

Shared X/MCU

RAM 2Kx16

Clocks/PLL

MCU Debug

Laye r 1

Timer

JTAG/OnCE

UARTB

M U X

UARTA

Audio CODEC Ser ial Port SAP

BRM

External Inteface

Module

QSPIB

QSPIA

SIM

Reset

Ke ypad

Interface

GPIO

MCU Core

ROM 4Kx32

RAM 512x32

PIG

Pe ripheral I/F

Gask et

GPReg

MCU Timers/

PWM/PIT/ Watchdog

Baseband CODEC Ser ial P o rt BBP

Counter

DSP Timer

DSP_IRQ

STDB

SRDB

SFSB(2)

SCKB(2)

STD A

SRD A

SFSA(2)

SCKA(2)

ADRS(22)

DATA( 16)

R/W

EB0,EB1

CS(6)

MOD

INT(6) INT6/DSRA/ STD

A/TRST

INT7/DTRA/SCLK/

SRD

A/TMS

MOSIB MISOB

QSCKB

SPICSB(5)

MOSIA

MISO A

QSCKA

SPICSA(5)

RST_OUT

RST_IN

COLUMN(5)

ROW(5)

COLUMN5/GPIO

ROW5/IC2B/GPIO

COLUMN6/OC1

COLUMN7/PWM

ROW6/DCDA/SC2A/DSP_DE

ROW7/RIA/ISCKA//TCK

XYA(16)

XYRW, XYSEL,XYSTB

XYD(16)/TXA/RXA/GI

CKIH,CKIL CKOH,CKO

DEBUG(6)

TOUT(16)

DSP_DE JTAG(5) MCU_DE TEST RTSB CTSB

TXB

RXB

MUX_CTL

RTSA/IC2A/ RESET_IN

CTSA/MCU_DE

TXA/TDO

RXA/IC1/TDI

Page 38

Theory of Operation

2 - 20 68P02963C70-O

DC Power Distribution

(See Figure 10).

V1 Linear Regulator

V1 is a programmable linear regulator. It is programmed using the Redcap SPI bus from 0.975V to 3.0V in 8 steps. This regulator is active during Power Reset (POR) and its initial value is 0.95V. For this radio, V1 (programmed to 1.875V) is the supply for the vibrator motor. This regulator is active whenever the radio is turned ON.

V2 Linear Regulator

V2 is a selectable linear regulator. It is selectable using the GCAP UV_SEL pin between either 2.5V and 2.775V. This regulator is active during POR and its initial output value is set by GCAP3 UV_SEL pin. Connecting UV_SEL pin to B+ sets V2 output value to 2.775V, connecting UV_SEL pin to Ground sets V2 output value to 2.5V. For this radio, V2 is selected to 2.775V. This regulator is supplied by B+ and it is active whenever the radio is turned ON. V2 is the supply for internal and external audio circuits, CLK_IN input driver and TS interface.

V3 Linear Regulator

V3 is a selectable linear regulator. It is selectable using the Redcap SPI bus from

1.875V to 2.775V in 4 steps. This regulator is active during POR and its initial output value is 2.775V. For this radio, V3 is selected to 2.775V. The regulator is supplied by B+ and it is active whenever the radio is turned ON. V3 is V3_2.775V, which is the supply for the SRAM, FLASH, Redcap, CE bus and Display.

V4 Linear Regulator

V4 is a selectable linear regulator with external pass transistor. It is selectable using the Redcap SPI bus from 1.875V to 2.775V in 4 steps. It is set to 2.775V. V4 is always powered from B+ and it is active whenever the radio is turned ON. This regulator is active during POR. V4 is V4_2.775V_RF, which is the supply for the WPIC, ODCT and LMX.

Switcher #1 (Synchronous Buck Mode Converter)

Switcher #1 is a selectable step down switching regulator. It is selectable using the Redcap SPI bus from 1.2V to 2.45V in 6 steps, Pass Through and Power down modes. The switcher is active during POR in 1.86V mode. It is set to 1.86V. Switching regulator is PWM#1_1.86V, which is the supply for the internal core, emulation port and clock output drivers of the Redcap. The switcher is supplied from B+ and it is active whenever the radio is turned ON.

Page 39

Theory of Operation

68P02963C70-O 2 - 21

Switcher #2 (Boost Mode Converter)

Switcher #2 is a selectable step up switching regulator. It is selectable using the Redcap SPI bus to 5.6/5.0/3.35 Volt and Power down mode. The switcher is supplied from B+ and it is active whenever the radio is turned ON. The switcher is inherently in 5.6V mode at POR. The radio uses the switcher at 5.6 V to supply 5V_RF and VSIM linear regulators.

DSC Linear Regulator

DSC is a fixed output linear regulator. This regulator is active during POR in the 5V mode. DSC is supplied from PWM#2_5.6V, which is used to supply the WPIC and ODCT charge pump circuits.

TS_REF Linear Regulator

TS_REF is a fixed output linear regulator. It is supplied internally from the V2 linear regulator. It is set to 2.3V. The radio uses TS_REF for the AD voltage dividers. It is not active at POR.

VREF1 Linear Regulator

VREF1 is a programmable linear regulator. It is programmed using the Redcap SPI bus from 1.875V to 2.775V in 4 steps. This regulator is active during POR and its initial value is 2.775V. For this radio, VREF1 is programmed to 2.775V and is battery supplied. VREF1 is VREF1_2.775V, which is the supply for TCXO.

VREF2 Linear Regulator

VREF1 is a programmable linear regulator. It is programmed using the Redcap SPI bus from 1.875V to 2.775V in 4 steps. This regulator is active during POR and its initial value is 2.775V. For this radio, VREF2 is programmed to 2.775V and is battery supplied. VREF2 is VREF2_2.775V, which is the supply for the keypad and display backlight circuits. This regulator is On whenever the radio is turned ON.

Current Limit

The SWB+ current limit regulator provides power from the phone battery to clipon accessories. It is enabled only when the phone is powered up and an accessory which requires power from the phone is connected.

Several sections of the radio are connected directly to the battery, which supplies Raw_B+ and Fused_B+. The radio operates with a low-level battery voltage of

3.15Vdc, nominal-level voltage of 3.6Vdc, and high-level voltage of 4.2Vdc. The battery is connected to P1 - 4 (+) and P1 - 1 (-). These pins supply the Raw_B+ to the RF TX power amplifier. The SWB+ output of the U104 regulator supplies the accessories through the bottom connector. Raw_B+ is routed via F600 (Fuse)

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Theory of Operation

2 - 22 68P02963C70-O

becoming Fused_B+, which goes via the main FET and provides power to the GCAP III IC.

Figure 10 MTH500 DC Distribution

Battery

Filter

3.6VDC

RF PA Tetra

Filter

PWM2 (Boost)

5.6V @ 100mA

2.775V @ 150mA

PWM1(Buck)

1.86V @ 100mA

EXT_VSIM1

3.0V @ 50mA

CurrentLimit

800mA

VREF1

2.775V @ 5 mA

2.775V @ 200mA

1.875V @ 150mA

VREF2

2.775V @ 100mA

2.775V @ 250mA

DSC

5V @ 60mA

2.3V @ 5mA

VIB

1.3V @ 200mA

USB

3.3V @ 40mA

OFF

0.9V OFF

0.95V OFF

1.875V ON

FILT_B+

V4_2.775V_RF

FILT_B+

VREF2_2.775V_RF

WPICSFOUT:

2.5V, 40mA

MainVCO& Buffer OffsetVCO

: 10mA

7mA

VCO& Buffer 2ndLOVCO

: 10mA

7mA

5V_RF

TETRATX

WPICCP

Driver&mixer

TETRARX

WPIC: 20 LNODCT: 130 Mixer:2.5 AntSW: 8 LO_DRV: 40

TETRA_TX:202

TCXO: 2

WPIC: 30 Mixer:2.7 LNA:7.5

TETRA_RX:62

Dedicated:2.5

VBLIN:3 ODCTCP: 1 PABias: <1

REDCAP

AVDD-AddressBus DVDD-Data Bus CVDD-Bus C ontrol BVDD-SIM EVDD-AudioESSI

HVDD-SPIA/B,BBESSL,L1T LVDD-DSPAddress BusVisibility MVDD-DSPDataBus Visibility

FVDD-ClockOutputDriver KVDD-EMULPort

OVCCH-I/Opre driversvoltage

OVCC-Internalcore

GVDD-GPIO,JTAG, Debug

STO, DATA, Bottom

FLASHVCC

SRAM

AUDIOPA

Vibrator

Accessory VCC

Audio C ircuits

USB Drivers

BL_SNKGCAP III

SWB+ EN

UV_SEL

USBDETECT

ThermBatt,RF_PA Term,

HW_ID

Keypad/Display

Backlight

Display

R_G_LED

MAIN - BOARDKEYPAD

LEDR/LEDG

GCAP III

LNODCT:

Upmixer40mA

TCXO: 2mA

NotUsed

Page 41

Theory of Operation

68P02963C70-O 2 - 23

RS232, SB9600

The REDCAP processor (RCE) uses the three serial protocols: UART and SB9600 to communicate with external devices via the bottom connector of the unit. There is no external hardware for switching from one protocol to another because the REDCAP2 handles the switching and line multiplexing functions internally.

Battery ID

The battery is equipped with a Dallas 2502 EPROM. A one-wire serial bus allows the radio or the battery charger to communicate with the battery and identify whether or not the battery is compatible. If the battery is determined to be incompatible, the unit automatically shuts off, and the charger does not enter charging mode.

Besides compatibility data, the EPROM also stores the following information: battery type, capacity, fuel-gauging parameters, and voltage threshold.

Radio Audio System

See Figure 11.

The audio system consists of the GCAP 3 IC (U600) and the DSP (U401), both are located on the main board.

The GCAP 3 perform the analog task and part of the digital task of the audio system.

Tx Path

Audio speech is fed either to the internal microphone, or to a Phone Hands Free (PHF) microphone. The signals reach the GCAP 3 IC. In the GCAP 3 IC, a fix gain amplifier (A3 or A5) provides the signal amplification, the multiplexer (MUX) selects the active input, and the programmable Gain Amplifier (TxPGA) adjust the path gain according to the radio mode of operation. Finally, the A/D converts the analog signal into digital format and transfers it to the DSP. The DSP performs the functions of audio filtering, ACELP speech compression, digital modulation, and transfers the data to the RF section. When the radio is operating in the telephone interconnect mode, the DSP performs the required tasks such as echo and noise reduction.

Rx Path

The digital output signal from the receiver is fed to the DSP which performs the functions of digital de-modulation, ACELP speech de-compression, and audio filtering. It transfers the data to the GCAP3 IC. In this IC, the D/A converts the digital audio format to an analog signal, the Programmable Gain Amplifier (RxPGA)

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Theory of Operation

2 - 24 68P02963C70-O

GCAPIII

adjusts the path gain according to the setting of the volume control, and the multiplexer routes the audio to the active receive path. When the internal speaker is active, the audio is fed to A2, double-ended audio power amplifier. Otherwise, the audio is fed to A1, output amplifier, that drives the Internal Earpiece or the PHF earpiece.

Figure 11 Audio Path Block Diagram

Page 43

Theory of Operation

68P02963C70-O 2 - 25

Frequency Generating Section Detailed Circuit Description

See Figure 12.

This section describes the generating circuits that supply all the required frequencies for the required transmitter and receiver functions. These circuits are described as follows:

• REF. Oscillator - TCXO.

• Main VCO and Main Synthesizer.

• Second IF VCO and Dual Synthesizer RF section.

• Offset VCO and Dual Synthesizer IF section.

Figure 12 Frequency Generating Section - Block Diagram

Of fset VCO

Second LO

Dual Synthesizer (U808)

Main VCO

Main Synthesizer

493.65-513.65 MHz to RX Mixe

113.65 MHz to Offset Mixer

493.65-513.65 MHz to TX Mixe

Reference

Oscillator - TCXO

Divider

OSC_IN

DOI F

IF Section

RF Section

DORF

219.3MHz

FINIF

FINRF

50kHz

100kH z

OSC_IN

WPIC

XTALBASE

PRSCI N

CPGITR

Data

LOIN

LPF

Osc.

Buffer

Page 44

Theory of Operation

2 - 26 68P02963C70-O

REF. Oscillator - TCXO

The TCXO is the reference frequency source for all the radio synthesizers. The output of the oscillator is a 16.8 MHz stable temperature compensated reference clock. This signal is present at pin 3 of the TCXO. This oscillator’s centre frequency is programmed (256 steps of approximately 0.1 ppm). It drives the TCXO buffer to split the 16.8 MHz signal to the WPIC, LMX Dual Synthesizer and GCAP III.

The 16.8 MHz signal from pin 3 of the TCXO is routed into the following:

1. The WPIC via C580 to pin K6 XTALBASE. The signal is divided by 4 to produce the 4.2 MHz reference signal, which is used for the Main PLL synthesizer.

2. The LMX Dual Synthesizer via C946 to pin OSC_IN. The signal is divided to produce the 100 KHz reference signal for the second LO and to 50 KHz reference signal for the Offset VCO.

Main VCO and Main Synthesizer

The synthesizer components are WPIC, Loop Filter, VCO and buffer. It produces the LO signal.

The synthesizer functions are as follows:

• To serve as the local oscillator for the mixer of the receiver. It is used to

down-mix the RF frequency (109.65 MHz).

• To serve as the LO for mixing the transmitter IF frequency (generated by the

Offset VCO) into the transmit RF band. The transmitter Offset VCO frequency is 113.65 MHz. This conversion is performed in the Tx Mixer.

• To serve as the WPIC feedback signal for locking the main synthesizer.

The WPIC is programmed by the DSP through the SPI bus.

WPIC

The WPIC contain internal synthesizer loops:

1. The main PLL is a three accumulators, fractional N system with a 24-bit resolution. The 16.8 MHz signal from pin 3 of the TCXO is routed via C580 to pin K6 of XTALBASE input of the WPIC. In the synthesizer, the signal is divided by 4 to produce the 4.2 MHz reference signal used for the main PLL synthesizer.

2. The second LO generator, which has a single ended signal at twice the desired IF frequency. The signal is routed as a differential signal (I, Q) to a quadrature phase splitter at the WPIC. The quadrature generator is a single master-slave flip-flop configured in a divide by two toggle mode.

Page 45

Theory of Operation

68P02963C70-O 2 - 27

LMX - Dual Synthesizer

The LMX233XL is an integrated dual frequency synthesizer that includes prescalers. It is used with the second LO at the RF section and with the Offset VCO at the IF section.

The LMX uses the 16.8 MHz from the TCXO for both synthesizers and divides the TCXO frequency as follows:

• The reference frequency for the second LO is 100 KHz.

• The reference frequency for the Offset VCO is 50 KHz

Second LO VCO

The Second LO VCO is a discrete VCO that is controlled by the LMX Dual Synthesizer RF section. The VCO produces a frequency of 219.3 MHz.

The internal phase detector is of the charged pump type.

The output signal of the of the VCO is routed via the phase detector at U808, pin 5 (FINRF).

The output of the phase detector is present at U808, pin3 (DORF) and than via the loop filter R915, C903, C948.

Offset VCO

The Offset VCO is a discrete VCO that is controlled by the LMX Dual Synthesizer (U808) IF section. The Offset VCO produces frequency of 113.65 MHz.

The internal phase detector is of a charged pump type. The output signal of the VCO is routed via the phase detector at U808, pin 18 (FINIF).

The output of the phase detector is present at U808, pin 20 (DOIF) and than via the loop filter R829, C895, C860.

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Theory of Operation

2 - 28 68P02963C70-O

Display and Keypad Description

Display

The LCD (Liquid Crystal Display) Module is a Graphic Display based upon the KS0741TB-01 display driver.

It consist of LCD Holographic Glass, LED backlight and a 22 pin flex cable connected to the Keypad board.

The Communication to the RedCap2 IC is performed using a SPI protocol (Serial Peripheral Interface). The Operation of the LCD is determined upon the RS line configuration (Data/Command).

The Display is 128X100 (Columns X Rows respectively).

Keypad

The RCE is responsible for decoding key presses and displaying them properly on the LCD. The keys are arranged into a matrix of five rows and five columns, which includes the Volume and PTT keys.

The PWR key is not decoded by the RCE; it directly drives the GCAP III, which sends a signal to RCE through INT1. The five row lines are pulled high via five internal 22 Kohm resistors. The five row lines and five column lines are fed to REDCAP2 I/O pins. Pressing any key also generates the keypad internal interrupt. The REDCAP2 debounces the keys by reading them 25 milliseconds later.

The keypad-decoding scheme works as follows:

1. REDCAP2 sets rows to inputs; all columns are set as outputs and driven logic low.

2. Rows are pulled logic high. When a key is pressed, one row goes low, which indicates a key press and sends an internal interrupt.

3. REDCAP2 reads rows. A low on that row indicates a key press. All others are high.

4. REDCAP2 sets all columns to output logic high.

5. One column at a time is set to output logic low. REDCAP2 reads the rows to see which one is now at a logic low level. (A low seen on a row indicates the correct column and row.)

All keypad circuitry is located on the keypad board. Refer to the keypad board schematics.

Page 47

Theory of Operation

68P02963C70-O 2 - 29

Backlight and LEDs

Backlight

The keypad backlight consists of 10 green LEDs. There are two more LEDs in the LCD module that are connected in parallel to the keypad LEDs.

Top LEDs

There are one Green and one Red LEDs, both located on the LCD board. These LEDs are used as indicators to the radio operation.

Radio Programming

The radio is entered into programming mode by setting the MOD pin high level, and applying a preamble sequence to the radio via the RS232 lines.

The MOD pin assertion is encountered at least 4 CKIH cycles before the negation of the Reset pin.

Accessory Connector

The CE bus is intended to support connection to accessories, personal computers, and test systems. The bus connector has a total of 17 pins, 9 of which have multiple functions. The bus has six basic modes of operation: Normal (also No Accessory Connected), USB Mode, Analog Audio Mode, Phone Powered USB Mode, RS-232 Mode, and RS-232/SSI Mode (there is also two additional non-standard modes, DSC and FLASH which are used only for development, factory programming, and debugging). Eight of the 17 pins have different functions depending on which mode is selected. The other 9 pins always have the same function regardless of mode.

The mode is selected by applying appropriate logic levels to the Option Select pins, named OPTION1 and OPTION2. Some of the modes listed above are selected by the additional application of a level on the USB POWER and AUDIO-IN pins as well.

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Theory of Operation

2 - 30 68P02963C70-O

Mode Select (OPTION1 and OPTION2)

Logic levels applied to the OPTION1, OPTION2, USB POWER, and AUDIO IN lines are used to select the CE Bus mode. The modes will be set as follows:

MODE OPTION_1 OPTION_2 USB_PWR AUDIO_IN

NORMAL (no accessory) 1 1 0 X

USB Accessory/Computer 1 1 >4.0V X

Dumb Accessory 1 0 X 1

Phone Powered USB Accessory 1 0 X 0

RS-232 (8 wire)/IDB Smart Cable 0 1 X 1

RS-232 (4 wire)/SSI 0 1 X 0

PTT 0 0 X X

SB9600 X X

Pin No.

Signal Name (Short Form)

Power/

Default

States

USB Dumb

RS232/

SSI

RS232

wire)

1 Power Ground (GND) GND GND GND GND GND

2 Battery Feedback (BATT_FDBK) BATT_

FDBK

BATT_ FDBK

3 External Power (EXTB+) EXTB+ EXTB+ EXTB+ EXTB+ EXTB+

4 USB+/TXD (D+) D+ TXD TXD TXD

5 USB-/RXD (D-) D- RXD RXD RXD

6 USB Power/Ignition/RTS

(USB_PWR)

USB_PWRIGN RTS RTS

7 Switched Battery (SWB+) SWB+ SWB+ SWB+ SWB+ SWB+

8 Hook Switch/CTS (HKSW) HKSW HKSW CTS CTS

9 MUTE/FS/DCD (MUTE) MUTE FS DCD

10 DUMB_SEL2/SCK/RI (DSEL2)

DSCEN

DSEL2 SCK RI

11 DUMB_SEL1/SRDA/DTR

(DSEL1)

DSEL1 SRDA DTR

Page 49

Theory of Operation

68P02963C70-O 2 - 31

12 DUMB_SEL0/STDA/DSR

(DSEL0)

DSEL0 STDA DSR

13 Option 1 (OPT1) UPLink UPLink OPT1 OPT1 OPT1

14 Option 2 (OPT2)

DNLink

OPT2 OPT2 OPT2

15 Audio Out On/Off (AUDIO_OUT)

AUDIO _OUT

16 Audio In (AUDIO_IN)

AUDIO _IN

17 Audio Ground (AUDIO_GND)

AUDIO _GND

Pin No.

Signal Name (Short Form)

Power/

Default

States

USB Dumb

RS232/

SSI

RS232

wire)

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Theory of Operation

2 - 32 68P02963C70-O

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Page 51

68P02963C70-O 3 - 1

Troubleshooting

General

Troubleshooting faults in the radio require proper understanding of the different circuitry contained in the radio. Since the radio contains a highly integrated system, the software and hardware functions can not be separated easily. Thus, it is also necessary to understand the functioning of different ICs and the role of the software in the operation of the radio.

This service manual includes schematic diagrams, circuit board layouts, block diagrams, and troubleshooting procedures, which help a technician to troubleshoot a malfunctioning circuit and detect a defective component.

NOTE: The CPS has no capability to tune the radio. Tuning the

radio can only be performed at the factory or at the appropriate Motorola Repair Centre. Components replacement can affect the radio tuning and must only be performed by the appropriate Motorola Repair Centre.

The radio is tuned and tested at the factory. The results of the tuning procedures are stored in a special EEPROM. This information includes tuning and other system parameters. The area of the memory in the radio where the tuning information stored is called the “codeplug”. A radio codeplug can be read using the CPS programme.

Test Procedures

This section explains the procedures required to troubleshoot a MTH500 radio.

The digital tests should be performed using the GoNoGo PATS test and TetraCom SW. To use the TetraCom you must go to test mode by using the command <Test Enter>.

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Troubleshooting

3 - 2 68P02963C70-O

Troubleshooting Flowcharts

Use the following flowcharts to troubleshoot the radio. These flowcharts contain procedures using TetraCom SW application, GoNoGo PATS test and factory test modes for troubleshooting radios having digital, receiver, transmitter, or frequency generation test failures.

DMO Troubleshooting Charts

The troubleshooting flowcharts for the DMO mode are same like the TMO mode. If a problem occurs in the DMO mode, then refer to the respective flowchart given under TMO mode. When a problem is found and fixed according to the TMO troublshooting charts, then it is automatically fixed in the DMO. However, if the problem still remains in the DMO mode and not in the TMO mode, then the software should be fixed.

TMO Troubleshooting Charts

The following flowcharts are included for the TMO mode:

* Digital Troubleshooting

* Transmitter Troubleshooting

* Receiver Troublshooting

* Synthesizer Troubleshooting

* Audio Troubleshooting

Page 53

Troubleshooting

68P02963C70-O 3 - 3

Digital Troubleshooting

Digital Analysis Test

Use this test for troubleshooting the main board.

After completing the

setup procedure, power

on the unit.

Does the

power supply show

current of 0.05 to

0.1A?

Replace the Main Board.

Is the

power supply

current correct

now?

Check for a defective

REDCAP2 (U401)

Refer to the Main

Board DC Flowchart

Use the GoNoGo

PATS test for

“Bootload”

Did

the unit pass

the “Bootload”

test?

Replace the Main Board.

Is the

Power Supply

current OK?

Check for a defective

REDCAP2

(U401)

Is the

32kHz clock

From GCAP3

Tp600 OK?

Is the

8.4kHz clock From WPIC

correct?

2. Refer to the RF WPIC flowchart

2. Check for a defective REDCAP2 (U401)

3. Check assembly of the RC filters U105, U106, U107

Yes

Refer to the

DC distribution (V2-2.775 V)

Test flowchart

1. Refer to the DC distribution (V2-2.775 V) Test flowchart

Page 54

Troubleshooting

3 - 4 68P02963C70-O

Digital Analysis Test (Cont.)

Did the “I/O_Loop”

test pass?

Did the

backlight

turn on?

Check beads E007,

E005, E006 and

40 pin connector

Use the GoNoGo

PAT S test “IO_Loop”

(40 pin connector)

Test the backlight

by turning it on

Replace the

Keypad and LCD

Boards

Ye s

Note: This test will be perform by TetraCom SW application. Command: <BackL EN/DIS>.

Did the

unit pass the

“Flash_up” test?

The Flash (U403)

is defective.

Use the GoNoGo

PAT S test for

“Flash_up”

(U403)

Ye s

Page 55

Troubleshooting

68P02963C70-O 3 - 5

Digital Analysis Test (Cont.)

Does text appear

on LCD?

Is J2 OK?

Contacts via 22

pin Flex OK?

Visually check J2

connector

on LCD board

Check 22

pin Flex

Replace LCD

Replace Flex

Replace J2 on

LCD board

Check the LCD

Yes

Page 56

Troubleshooting

3 - 6 68P02963C70-O

Digital Analysis Test (Cont.)

Did the

vibrator

vibrate?

Is the

Voltage

OK?

Are the

Voltages

OK?

Check the Power Supply

V1, 1.875V on C611

when “VIBR EN” TetraCom

command has been entered

Check 1.875V on D001

and <0.4V on Q002

pin 1, 4

Replace the Vibrator

Check for defective

Q002 or D001

The Main Board

successfully passed

all tests

Refer to the

DC distribution (V2_2.775V)

Test flowchart

Test the vibrator

Yes

Note: This test will be perform by TetraCom SW application. Command: <VIBR EN/DIS>.

Page 57

Troubleshooting

68P02963C70-O 3 - 7

DC Distribution (V2_2.775V) Test

Use this test on a unit with the following symptoms: no power, no V2_2.775V, V1_1.875V, V3_2.775V, VREF1_2.775V, VREF2_2.775V.

Note: The following are the DC power distribution voltages with their correct values and appropriate location to check the voltages:

• Fused_B+ (3.6 Vdc) @ F600

• Filt_B+ (3.6 Vdc) @ C640

• V1_1.875V (1.875 Vdc) @ C611

• V2_2.775V (2.775 Vdc) @ C610, C613, C657

• V3_2.775V (2.775 Vdc) @ C609, C658, C659

• VREF1_2.775V (2.775 Vdc) @ C628

• VREF2_2.775V (2.775 Vdc) @ C612, C660, C661

• V4_2.775V (2.775 Vdc) @ C625, C644, C647

• VSIM1 (3 Vdc) @ C653

• 5V_RF (5 Vdc) @ C615, C651

• PWM2_1.8V (1.8 Vdc) @ C624, C648

• PWM1_5.6V (5.6 Vdc) @ C623

Page 58

Troubleshooting

3 - 8 68P02963C70-O

DC Distribution (V2_2.775V) Test (Cont.)

Is the voltage OK?

Is resistance OK?

Check the bench

Power Supply

Replace Fuse

F600

Check junction of F600 and VR601

for 0 (ground)W

Check traces to Fused_B+

for oepens.

Check Q600 pin 4

circuitry for shorts.

Repair, as necessary.

Replace E600

Check junction of

F600 and Vr601 pin 2

for 3.6Vdc (Fused_B+)

Check Q600 pin 3

for 3.6 Vdc

Check all Fused_B+

circuit components.

Repair, as necessary.

Check C640

for 3.6 Vdc (Filt_B+)

Check

battery contact P1-4

for 3.6 Vdc

Yes

Page 59

Troubleshooting

68P02963C70-O 3 - 9

DC Distribution (V2_2.775V) Test (Cont.)

Is the voltage OK?

Are frequency

and amplitude OK?

Is Reset

high?

Replace U600 (GCAP III)

Replace

U600 (GCAP III)

Check TP600 for

32 kHz clock with 2.775V

amplitude

Check TP603

for the Reset high

Check Filt_B+ at

C640 or C652

for 3.6 Vdc

Yes

Page 60

Troubleshooting

3 - 10 68P02963C70-O

DC Distribution (V2_2.775V) Test (Cont.)

Is the voltage OK?

Replace U600 (GCAP III)

Check C610, C613, C657

for 2.775 Vdc

(V2_2.775V)

Refer to other

DC Distribution

Test Flowcharts

Yes

Page 61

Troubleshooting

68P02963C70-O 3 - 11

DC Distribution (SWB+) Test

Use this test on a unit with the following symptoms: no SWB+.

Note: This test will be performed using TetraCom SW application commands <SWB EN/Dis>.

Is the voltage OK?

Is the voltage

0.3V?<

Are voltages OK?

Is the voltage OK?

TetraCom command

“SWB Dis”

SWB+

current limit

test OK

TetraCom command “SWB EN”

Check R119

Refer to the

DC distribution (V2-2.775 V)

Test flowchart

Check If U104 pin 5 is

shorted to ground.

Repair, as necessary.

Check U104 pin 3 Voltages >2.0V for “SWB EN”

<0.4V for “SWB Dis”

(SPICS4A-Redcap)

Check U104.

Replace if necessary

Check U104 pin 1

for 3.6 Vdc (Filt_B+)

Check U104 pin 6

for 3.6 Vdc

Yes

Page 62

Troubleshooting

3 - 12 68P02963C70-O

DC Distribution (V4_2.775V) Test

Use this test on a unit with the following symptoms: no V4_2.775V.

Is the voltage OK?

Check traces

to the RX section,

Freq. Gen. section,

and TX section

Refer to the

DC distribution (V2-2.775 V)

Test flowchart

Replace U600

(GCAP III)

Replace E200

Check Q602 pin 1

for 3.0 Vdc

reference voltage

(V4DRV)

Check Q602,

replace if required

Check Q602 pin 3

for 3.6 Vdc

(Filt_B+)

Check Q602 pin 2

for 2.775 Vdc

Yes

Page 63

Troubleshooting

68P02963C70-O 3 - 13

DC Distribution (V3_2.775V/PWM2_1.8V) Test

Use this test on a unit with the following symptoms: no V3_2.775V, no PWM2_1.8V.

Is the voltage OK?

Check C624 for 1.88 Vdc

(PWM2_1.8V)

Check E401 ferrite

beads by REDCAP2

for opens

Check C609, C658, C659

for 2.7 Vdc

(V3_2.775 V)

Yes

Refer to the

DC distribution (V2_2.775 V)

Test flowchart

Refer to the

DC distribution (V2_2.775 V)

Test flowchart

Page 64

Troubleshooting

3 - 14 68P02963C70-O

DC Distribution (V5_RF/PWM1/VSIM1 _5.6V) Test and (VSIM1) Test

Use these tests on a unit with the following symptoms: no V5_RF, no PWM1_5.6V, or no VSIM1_5.6V.

Is the voltage OK?

ageIs the volt OK?

Is the voltage OK?

Check E201

for opening

Refer to the

DC distribution (V2_2.775 V)

Test flowchart

Replace L600

Replace U600

(GCAP III)

Disconnect E201

Check

3.6 Vdc

L600, C601

for

Check C623

for 5.6 Vdc

Check C615, C651

for 5 Vdc

Yes

(

)

Check VSIMI C652 for 3.0 Vdc

Is the voltage OK ?

Check trace till C24, C406, C403

Yes

Check U601 pin 3 for 2.775 Vdc

Is the voltage OK?

(

)

Check U601 pin 1 for 5.6 Vdc

Is the voltage OK?

Replace L601

VSIMI

Yes

PWMI

Page 65

Troubleshooting

68P02963C70-O 3 - 15

Transmitter Troubleshooting

Standby Current Troubleshooting

This test should be carried out only after the successful completion of the previous tests.

Measure the radio

standby current

by using PATS station

Is standby

current above

upper current

limit?

Ye s

Check if there are shorts on the board:

- check if RF PA U809 is shorted to the ground

- check voltage regulator VR601, R640, current U104, VR102, elements o n FLT_B+

supply lines. Replace parts i f faulty. Repeat the St andby Current test. Also see "GCAP" section

switch

Is standby

current below

minimum current

limit?

Check: Radio Fuse F600, Switch Q600, bead E600, CR601. Replace damaged part. Repeat the St andby Current test. Also see "GCAP" section.

Note: The standby upper current limit

is 100mA and lower limit is 4mA

Page 66

Troubleshooting

3 - 16 68P02963C70-O

Open Loop Power Test

This test should be carried out only after the successful completion of the previous tests.

Yes

Measure the

Open Loop power

by using PATS

Is the

output power

less than

120mW (20.8dBm)?

Is the

output power

above 0.5W (27dBm) ?

Is the radio

in oscillation?

Check the bias voltages

on pins 8,16 of RF PA U809.

Check resistors R827

and R828, regulators Q807 and Q911, replace parts if faulty.

Perform the Open loop

power test again

Check RF PA U809, Isolator FL801, Coupler U806,

components: E801, E808, E809, L916, L917, L920, L921,

L923, L918, L919, C1030,C1028,C1029, C822,C867. Replace damaged parts. Perform the Open loop power test again.

Are voltages

2.775V_RF, 5V_RF,

RAW_B+_RF and 2.5V_TX

supplied to the Transmitter

components?

Check the battery,

regulators Q800, Q805, Q806, Q807, Q911,

elements on 2.5V_TX lines. Replace if faulty. Perform the Open loop

power test again.

Is there

~ 2.5Vdc of ANT_EN

signal on Q806 pin

(or C830) during

Tx slot?

Check E810. Perform REDCAP2 test. Repeat Open Loop

Power Test.

Using a Power Probe, measure RF power at the RF PA U809 input (pin 6).

Is power < -20 dBm?

Using a Power Probe test TX line-up (starting from RF PA U809 output: pins 12,13) by measuring output power after every component of Transmitter till Antenna. It should be as specified in the spread sheet, otherwise replace the damaged components. Perform the Open loop power test again.

Using a Power Probe, measure RF power at the LNODCT U803 outputs (pins 51,52).

Page 67

Troubleshooting

68P02963C70-O 3 - 17

Open Loop Power Test (Cont.)

Yes

Is power < -4 dBm?

Check Tx line-up from LNODCT U803 output till RF PA U809 input, replace damaged parts. Perform the Open loop power test again.

Perform the following:

1. Visually check all components and solder connections around LN ODCT.

2. Check L926 and ODCT pins 34,40,53,63 for 2.775Vdc_ODCT, check pins 51, 52 for 5Vdc during Tx slot; check ODCT pins 45,46,56,57 for 2.3Vdc during Tx slot.

Are all checks OK?

Replace damaged components. Perform the Open loop power tuning and test again.

Using a

easure the RF level at pin 6 of Mixer (U800)

power high

impedance probe m

Is the

power < -6.5 dBm?

Yes

Check the power at pin 1 of U800 mixer.

Is the

signal at U800

pin 1 stable and its power

1 dBm?>

Check L809, C844. Perform Offset VCO test. Perform the Open loop power test again.

Check the power at pin 3 of U800 mixer

Is the

signal at U800 pin 3 stable and its power -0.5 dBm?>

Replace the mixer U800. Perform the Open loop power test again.

Check C800, L800, R805, C833. Perform Main VCO Buffer test. Perform the Open loop power test again.

Measure the RF power at input and output of Image filter (FL800). Calculate the difference between Image filter input and output.

Yes

Is the

difference > 3.5 dB?

Check FL800, Q808 (LO Driver), replace if faulty. Perform the Open loop power test again.

Page 68

Troubleshooting

3 - 18 68P02963C70-O

Open Loop Power Test (Cont.)

Yes

Measure the RF power at the input of LO Driver (Q808) and input of I/Q splitter U801. Calculate the LO Driver Gain.

Is the Gain < 22 dBm?

Check for 2.5Vdc during Tx slot, if voltage is OK, check L813, if L813 is OK replace Q808. If there is no voltage, check Q805 and L811. Replace damaged parts. Perform the Open loop power test again.

Measure the RF power at input and output of I/Q splitter (U801). Calculate the difference between I/Q splitter input and output.

Is the

difference > 3.5 dB?

Check I/Q splitter U801, C851, C849. Replace faulty parts. Perform the Open loop power test again.

Measure the

ASW level on pin 28

of LNODCT U803 during

Tx slot by using scope. Does the

ASW level go low (about 0V dc)

during Tx slot?

Replace LNODCT U803 Perform the Open loop power test again

Replace LNODCT U803. Perform the Open loop power test again.

Perform "WPIC Test" Perform the Open loop power test again

Was any

data detected?

Verify by using scope that there is an input data on pins 58-61 of the LNODCT U803. (AC voltage 300-400mV peak)

Does the

two condition exist?

Verify by using scope that:

1. There is 2.4MHz clock (1.8 0.3Vdc) on pins 11,12 of U803 during Tx slot.

2. SLT and SLTB go low on pins 9,10 of U803.

Page 69

Troubleshooting

68P02963C70-O 3 - 19

WPIC Test

This test should be started in accordance to Open Loop Power test.

Ye s

Perform the following:

1. Set the unit to the Open loop test at a frequency of 390MHz.

2. Read the value of WPIC1 9 register by using TetraCom. It has 8 b its. Change the hexadecimal value of WPIC 1 9 t o switch the 5-th bit from 0 to 1.

3. U bserve output data voltage on Test Points 500,501.sing a scope o

Is data

voltage (0.4-0.8Vp-p)

observed during

Tx slot?

Replace WPIC U503. If the Open Loop Power problem exists replace LNODCT U803. Repeat the Open Loop power test.

TetraCom Commands: WPIC 1 9 Read the register value

Measure:

1. 2.775_WPIC dc voltage on C572 (C516, C519, C555, C552, C549, C573, C547, C535, C502, C542.

2. V3_2.775V on C515.

Are voltages (2.6-2.9Vdc)

OK?

Perform the GCAP test. If the problem still exists replace WPIC U503.

Measure TXE signal (0.5-2.3Vdc) during Tx slot on R514.

Is the TXE signal OK?

Verify the REDCAP2 U401 functionality, replace if faulty, repeat WPIC test, if the problem still exists replace WPIC U503.

Page 70

Troubleshooting

3 - 20 68P02963C70-O

Closed Loop Power Test

This test should be carried out only after the successful completion of the previous tests.

Yes

Tune the radio on PATS.

Is the

radio close loop

output power <28dBm

or >31 dBm?

Check the elements: coupler U806, R815, R818, R825, R826, C817. Replace if faulty and repeat the Close Loop test.

Does the

close loop power

problem still

exists?

Measure the LO power on pin 24 MVCO of the LNODCT U803 (800-400 mVp-p (single ended) swing into a 50Ohm load).

Is the LO power OK?

Replace LNODCT, perform Open Loop Power test and Close Loop Power test.

Check R838, C814 replace if faulty, repeat Close Loop Power test. If the problem still exists replace LNODCT U803 and repeat Open Loop Power test and Close Loop Power test.

Page 71

Troubleshooting

68P02963C70-O 3 - 21

Transmitter Current Consumption Test

This test should be carried out only after the successful completion of the previous tests.

Yes

Start TX current test.

Is TX

current > 2.2A

(average TX current?)

1. Measure RF PA bias voltages on pins 8 and 16 of U809.

2. Measure supply votage on pin 12 of U809.

Are supply

or (and) bias voltages

high?

Repeat Open loop power test and Close loop power test. If the problem still exists replace U809. Repeat Transmitter current consumption test.

1. Check power supplies;

2. Repeat tuning of the radio. Repeat Transmitter current consumption test.

Page 72

Troubleshooting

3 - 22 68P02963C70-O

Receiver Troubleshooting

Ye s

Is the

gain below

4dB?

Is the

Gain still below

4db?

Is the

Gain still below

4db?

Check with all power Input s/Output s o f Ant. SW ., Front Filter (Fl500), LN A (U500), Second Filter (Fl501), Mixer (U504), Xt al Filter (Fl502). Replace if necessary . Check Front Gain again.

Check second LO .

-16dBm<Power<-10dBm Freq.=219.3MHz Re pa ir if necessary (See Synth. T roubleshooting)

Wa s that the

problem ?

Check 2.775V suppl y t o LN A & Mixer and check control lones (Q504, Q500). Rep air if necessary . Check Front Gain again.

Check Main Synth. Power level (>-5dBm) and frequency . F F +109.65MHz). Rep ai r i f necessary . (See Synth. Troubleshooting)

main = r x

TetraCom Commands (TD M Mode): >Freq. RX 390.0125 >Mode RXTDM/Mode RSSI >LIMITER ON >BER Rout WPIC BaseBand signal to test point s: >WPI C 2 0 7 2 NOW Activating control lines at continuos mode: WPI C 3 9 1 b NOW

Run RX_BER -112dBm & ULTIMA TE_BER

Check BaseBand Output at WPIC (U503) TP500/TP501.

Passed?

Return to first test.

Check Front Gain, using

a R F probe on C536,

Frequency 109.65MHz

Replace if necessary.

Page 73

Troubleshooting

68P02963C70-O 3 - 23

Synthesizer Troubleshooting

Use this test on a unit with the following symptom: no Tx or Rx

Using a 50-ohm probe on the

spectrum analyzer,check the LO

output at the buffer output at

R927 and R944.

Is the frequency

at 503.65MHz?

Is the buffer

output between

-5 and -3dBm ?

The unit tested successfully

check the VCO

output at R937 ,Is

the freq 529. 65MHz

Test the VCO control

voltage at R917.The typical

range is 0.5 t o 4.5 V.

Check for opens,shorts,or

missing components in the

buffer circuits.

Also check for 2.3 Vdc on

L907.

Is the control

voltage railed to

<0.5V or >4.5V

Possible prescaler feedback problem:

1.check solderin of C933,C915.

2.Probe to determine if LO is reaching the prescaler input.

YES

Note:This is

the abnormal

condition.

YES

TetraCom Commands:

MAIN_VCO ON WPIC 3 1 c0 NOW WPIC 2 4 17 NOW WPIC 2 5 F4 NOW WPIC 2 6 9e NOW WPIC 2 7 79 NOW WPIC 0 5 30 NOW WPIC 0 8 0 NOW

Page 74

Troubleshooting

3 - 24 68P02963C70-O

Synthesizer Troubleshooting (Cont.)

Possible VCO problem: Check for opens or shorts in the VCO circuit.

Whether the

problem found

and fixed ?

Check for the following:

2.4Vdc on R934 and on R923. Confirm that the resonator tab is prperly soldered. Confirm that the Varicap is in the right direction.

Unit testing is complete

Yes

Check Loop filter:

Check for opens

or shorts .

Whether the

problem found

and fixed ?

Unit testing is complete

Yes

Check buffer:

Check for opens

or shorts .

Whether the

problem found

and fixed ?

Unit testing is complete

Yes

WPIC Problem

Page 75

Troubleshooting

68P02963C70-O 3 - 25

Second LO VCO Test

Perform the followi ng:

1.Remove the 2nd_LO shield.

2.Set the Unit to continuous Recieve mode (Rxndc ).

3.Measure the 2nd_LO control voltage at C761.

Measure the RF power level at

C959 at 219.3 MHz.

The 2nd_LO VCO/s ynthesize r

is O.K.

Chek for feedback problem:

1.check soldering of C262,R951,C970.

2.Measure the RF power level at Pin 5 of the LMX

at 219.3MHz.

Check Q905,

R939 for soldering

problems and for

the right values.

(compare with BOM)

Check DC supply for the VCO:

1.Check for SF_OUT on C902, R939,R906.

2.Check for TETRA_2nd_LO_En on Q910.

Check DC Block

Check DC supply for the LMX:

1.Check for 5V_RF on C954 or on Pin 22 of the LMX.

2.Check 2.775V_RF on Pin 23 and Pi n 24 of the LMX.

Yes

Check DC Block

Perform VCO_ONLY TEST:

1.connect an external 0.5 to 4 .5V power supply to R9016.

2.Measure the RF freq at C959.

3.Adjust the external supply voltage until the frequency is219.3MHz.

The VCO is working properly.

the problem is with the LMX.

Replace the LMX.

Yes

Check R915,C903,

C948,R916,D902,

C960,L905,C940, C920,R909,R906, C922,C921,R922, R939,R906,C953, C959 for soldering

problems and

compare with BOM

values.

IsthecontrolVoltageatR916and

C948

between 0.5 and 4.5Vdc

Is the power level at 0

dBm

and stable on frequency.

Does the VCO has

its DC Suppl y?

Does the LMX has its

DC Supply?

Can the frequency

be set to

219.3MHz?

Yes

TetraCom Commands:

WPIC391bNOW dual RF 0202a2 004447

Yes

Page 76

Troubleshooting

3 - 26 68P02963C70-O

Offset VCO Test

Page 77

Troubleshooting

68P02963C70-O 3 - 27

Audio Troubleshooting (External Mic to External Out)

Set the audio input to the external mic to 1.02KHz @ 44mV RMS. Test sequence is controlled by TetraCom commands to the external mic-to-external out loopback.

Check R110, C103 & continuity to connector.

Check R108, C104 & continuity to connector.

No trouble found

Connect a scope or DVM to the following points and measure ac levels in Vrms.

Start AUDIO_LOOPBACK (1)

Is voltage at

C103 =

44mVRMS?

Yes

Tetracom Routine

MIC VA MICGA 0 DSP_LOOP ON DSP_VOL 0 Vol 0 SPKR VA

Is voltage at

C104=

66mVRMS?

Page 78

Troubleshooting

3 - 28 68P02963C70-O

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Page 79

68P02963C70-O 4 - 1

Programming the Radio

Programming The Radio

1. Verify that the radio is turned off.

2. Run the Customer Programming Software (CPS) on your computer.

Codeplug Programming

1. On the menu bar, click “File” “Open”.

2. Browse for the required Codeplug file and open the file.

3. The CodePlug window appears on the screen.

4. Click the Toolbar “Tools” icon and select “Write Entire Codeplug”.

5. Press the “Yes” icon.

Page 80

Programming the Radio

4 - 2 68P02963C70-O

NOTE: The Codeplug is now being written into the radio. A

progress bar is displayed on the computer screen showing the writing status. The following display is shown on the radio screen:

After a successful writing, the message “The Operation Was Successful” appear on the computer screen.

6. Press the OK button.

Application Programming

1. On the menu bar click “Tools”, “Write Software”.

NOTE: The CPS is trying to reads data from the radio. A “Please

Wait” message is displayed on the computer screen. After the process ends, a “Operation Results” window appears on the computer screen.

2. Press the “Write” button.

Diag. SW Ver. 01.01

HW ID Code: XXX

Flash: TE28F320C3BA

Command WRITE REQ.

00:00:00

--Done--

Elapsed Time

Indication

Appears at the

end of the process

Page 81

Programming the Radio

68P02963C70-O 4 - 3

NOTE: The application is now being written into the radio. A

progress bar is displayed on the computer screen showing the writing status. The following display is shown on the radio screen:

After a successful writing, the message “The Operation Was Successful” appear on the computer screen.

3. Press the “Ok” button.

4. Click the toolbar “R” (Reset) icon.

Diag. SW Ver. 01.01

HW ID Code: XXX

Flash: TE28F320C3BA

Command WRITE REQ.

00:00:00

--Done--

Elapsed Time

Indication

Appears at the

end of the process

Page 82

Programming the Radio

4 - 4 68P02963C70-O

This page left blank intentionally

Page 83

68P02963C70-O 5 - 1

Preventive Maintenance

This portable radio does not require a scheduled preventive maintenance program. However, periodic visual inspection is recommended.

Inspection

Inspect the radio’s external surfaces. A detailed inspection of interior circuitry is not needed or recommended.

Cleaning

The following procedures describe the recommended cleaning agents and methods to be used when cleaning the external and internal surfaces of the radio. External surfaces should be cleaned whenever a periodic visual inspection reveals the presence of smudges, compound, or grime. Internal surfaces (circuit boards and components) should be cleaned only when the radio is disassembled for servicing or repair.

The only recommended agent for cleaning external radio surfaces is a 0.5% solution (one teaspoon of detergent per gallon or four litres of water) of mild dishwashing detergent in water. The internal surfaces should be cleaned only with isopropyl alcohol (70% by volume).

Maintenance

Page 84

Maintenance

5 - 2 68P02963C70-O

Safe Handling of CMOS Devices

Complementary metal-oxide semiconductor (CMOS) devices are used in the radio. While the attributes of CMOS devices are many, their characteristics make them susceptible to damage by electrostatic or high voltage charges. Damage can be latent, resulting in failure occurring weeks or months later. Therefore, special precautions must be taken to prevent device damage during disassembly, troubleshooting, and repair. The following handling precautions are mandatory for CMOS circuits, and are especially important in low humidity conditions.

• All CMOS devices must be stored or transported in conductive material so that all exposed leads are shorted together. CMOS devices must not be inserted into conventional plastic “snow” or plastic trays of the type that are used for storage or transportation of other semiconductor devices.

• All CMOS devices must be placed on a grounded bench surface and the technician must also be grounded before handling the devices. This is done most effectively by having the technician wear a conductive wrist strap in series with a 100kW resistor to ground.

• Do not wear nylon clothing while handling CMOS circuits.

• Do not insert or remove CMOS devices with power applied. Check all power supplies to be used for testing CMOS devices and be certain there are no voltage transients present.

• When straightening CMOS device leads, provide ground straps for the apparatus used.

• When soldering, use a grounded soldering iron.

• All power must be turned off in a system before printed circuit boards containing CMOS devices are inserted, removed, or soldered.

Disassembling and Reassembling the MTH500 Unit

Mechanical checks and self tests should be performed on the unit at the basic level of service. To perform testing at the field level, it is sometimes necessary to remove the antenna and the housing from the unit. Procedures for disassembling and reassembling the unit are described in the sections that follow.

NOTE: Read each procedure thoroughly before performing the actual task.

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Protecting Static-Sensitive Devices

This unit contains static-sensitive devices that must be protected when opening the unit, or storing and transporting any printed-circuit board.

To create a proper ground:

• Ground the working surface of your service bench.

If possible, use the Motorola Static Protection Assembly (part #0180386A82) to ground your service bench. This assembly contains a wrist strap, two ground cords, a table mat, and a floor mat.

• Wear a conductive wrist strap in series with a 1Mg ohm resistor to ground.

• Do not wear nylon clothing when handling any printed-circuit board.

• Prior to touching any printed-circuit board, touch an electrical ground to remove any static charge that might have accumulated.

To store or transport a circuit board:

• Place the printed-circuit board in conductive, anti-static material.

• Do not insert the printed-circuit board into conventional plastic “snow” trays used for transporting other devices.

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Removing and Installing the Antenna

The antenna must be removed each time the back housing is removed.

Recommended tools: no tools are required

To remove the antenna from the unit:

(See Figure 13)

• Unscrew the antenna counter clockwise until it is detached from the handset.

To install the antenna in the unit:

• Screw the antenna clockwise to the handset.

Figure 13 Antenna Removal and Installation

Removing and Installing Battery Door and Battery

Recommended tools: no tools are required

To remove the battery door from the unit:

(See Figure 14)

1. Place the unit facing down on the work area.

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2. Press the battery door release button, slide the door towards the bottom of the unit and

lift it up from the unit.

Figure 14 Battery Door Removal

To remove the battery:

(See Figure 15)

1. Press the battery fastening bridge toward the upper side of the unit.

2. Simultaneously, using other hand, release the battery from its chamber.

Figure 15 Battery Removal

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To install the battery:

1. Locate the battery so that the lower part (coloured silver) is touching the lower wall of the battery chamber.

2. Carefully press the battery down until it snaps into location.

To install the battery door:

1. Position the door on the unit over the battery so that the door release button is just above the battery fastening bridge.

2. Slide the door upward until the door snaps into location.

3. Verify that the door is aligned with the handset back housing.

Removing and Installing the Back Housing

Recommended tools: T-8 Torx bit, Torx driver, mini flat-tip screwdriver

Removing the back housing from the unit:

(See Figure 16)

1. Remove the antenna, refer to “Removing and Installing the Antenna”.

2. Remove the battery door and the battery, refer to “Removing and Installing Battery Door and Battery”.

3. Place the unit facing down on the work area.

4. Using the screwdriver remove the oval label at the top of the unit and the tamper evident label in the center to enable access to all six screws fastening the back housing. Clean the adhesive remains of the tamper evident label using alcohol.

5. Using the Torx driver with the T-8 Torx bit, unscrew the six screws fastening the back housing.

6. Carefully remove the back housing from the unit.

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Installing the back housing:

1. Position the back housing over the unit.

2. Verify that the cover is positioned correctly, screw holes are aligned to the threads of the front housing, external antenna connector is inserted into its dedicated hole, and the styling groove of the back housing meets the styling groove of the front housing.

3. Set the Torx driver to 3.5 in-lb (0.4 Nm).

4. Screw the back housing screws in the following order: Upper left and right screws, center left and right screws and lower left and right screws.

5. Glue a new oval label over the holes of the two upper screws and a new tamper evident label (*only available to Motorola Services Centres) on the holes of the two center screws.

6. Install the battery and the battery door, refer to “Removing and Installing Battery Door and Battery”.

7. Install the antenna, refer to “Removing and Installing the Antenna”.

Figure 16 Back Housing Removal and Installation

Oval Label

External Antenna Connector

Back Housing

Fastening Screws

(X6)

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Removing and Installing the Vibrator

Recommended tools: mini flat-tip screwdriver

Removing the vibrator:

(See Figure 17)

1. Remove the back housing, refer to “Removing and Installing the Back Housing”.

2. Turn the back housing up side down and, using the screwdriver, remove the vibrator from its chamber inside the back housing.

Installing the vibrator:

1. Carefully push the vibrator into its chamber in the back housing.

2. Install the back housing, refer to “Removing and Installing the Back Housing”.

Figure 17 Vibrator Removal and Installation

Back Housing

Vibrator

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Removing and Installing the Main Board

Recommended tools: no tools are required

Removing the main board from the unit:

(See Figure 18)

1. Remove the back housing, refer to “Removing and Installing the Back Housing”.

2. Gently lift the main board, I/O connector side at the bottom of the board first, and remove it from the unit.

3. Gently remove the rubber seal from the I/O connector, verify that the seal is not damaged (retain the seal for reinstallation).

Installing the main board:

1. Gently install the rubber seal over the I/O connector.

2. Position the main board in location. Verify that the two guide pins are inserted into the holes in the main board.

3. Gently push the main board down and verify that the Board-to-Board connector is properly connected to the keypad board.

4. Verify that the I/O rubber seal is properly located in the unit.

5. Install the back housing, refer to “Removing and Installing the Back Housing”.

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Figure 18 Main Board Removal and Installation

Removing and Installing the Keypad and LCD Boards

Recommended tools: mini flat-tip screwdriver

Removing the keypad and LCD boards from the unit:

(See Figure 19)

1. Remove the back housing, refer to “Removing and Installing the Back Housing”.

2. Place the unit facing down on the work area.

3. Open the Personal Hands-Free Kit (PHF) jack cover (See Figure 18).

4. Using the screwdriver, remove the chassis assembly including the main board, keypad board and LCD board, out from the unit.

5. Place the chassis assembly, with the keypad and LCD boards facing down, on the work area.

6. Remove the main board from the chassis assembly.

7. Insert the screwdriver into one of the slots in the upper side of the chassis assembly, above the LCD board, and gently push the boards out from the chassis assembly.

8. According to the board to be replaced, open the required Zero Insertion Force (ZIF) connector, release the flat cable and the board.

Main Board

PHF Cover

I/O Connector

Rubber Seal

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Installing the keypad and LCD boards:

1. Place the keypad and LCD boards on the work area so that the ZIF connectors are facing up.

CAUTION: Care must be taken when installing the keypad and LCD boards on the chassis. Failure to comply may result in tear of the flat cable between the two boards.

2. Insert the flat cable into the ZIF connectors and close the connectors doors until a click is heard.

3. Insert the LCD board between the two snags at the sides of the chassis assembly.

4. Push the LCD board down until it snaps into location.

5. Verify that the chassis center guide pin is properly located inside the hole in the LCD board and that the snag at the top of the chassis is inserted into the slot of the board.

6. Install the keypad board on the chassis assembly.

7. Verify that the keypad board is sited parallel to the chassis assembly.

8. Verify that the main board is fully installed with the rubber seal.

9. Turn the chassis assembly up side down.

10. Install the main board on the chassis assembly. Verify that the two guide pins are inserted to the holes in the main board.

11. Verify that the guide pins are properly located and that the Board-to-Board connector is properly connected to the main board.

12. Install the chassis assembly with the boards into the unit. Verify that the I/O connector rubber seal is properly located in the unit.

13. Install the back housing, refer to “Removing and Installing the Back Housing”.

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Figure 19 Keypad and LCD Boards Removal and Installation

Removing and Installing the LCD Module Assembly

Recommended tools: no tools are required

To remove the LCD module assembly from the unit:

(See Figure 20)

1. Remove the LCD board, refer to “Removing and Installing the Keypad and LCD Boards”

NOTE: Do not touch the LCD module assembly in the active viewing area;

fingerprints on this surface cannot be easily removed.

2. Using your hand, gently disengage the right two snaps and rotate the LCD module assembly to the left until it disengaged from the LCD board.

Chassis Assembly

LCD Board

Release Slot

LCD Board

Keypad Board

ZIF Connectors

Board-to-Board

Connector

Flat Cable

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To install the LCD module assembly:

NOTE: Do not touch the LCD module assembly in the active viewing area;

fingerprints on this surface cannot be easily removed.

1. Locate the LCD module above the LCD board so that the two guide pins are aligned with the holes in the LCD board.

2. Gently push the module down, right snaps first and then left snaps.

3. Verify that the snaps are located correctly inside the board slots.

4. Remove the protective film from the LCD glass. Verify that no damage exists on the LCD glass.

5. Install the LCD board, refer to “Removing and Installing the Keypad and LCD Boards”.

Figure 20 LCD Module Removal and Installation

LCD Board

LCD Module

Snaps

(X4)

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Removing and Installing the Keypad

Recommended tools: no tools are required

Removing the keypad:

(See Figure 21)

1. Remove the chassis assembly, refer to “Removing the keypad and LCD boards from the unit:”, steps 1 through 3.

2. Remove the keypad from the unit.

Installing the keypad:

1. Install the keypad inside the front housing.

2. Verify that all the keys are properly inserted into their dedicated holes.

3. Install the chassis assembly, refer to “Installing the keypad and LCD boards:”, steps 1 and 2.

Figure 21 Keypad Removal and Installation

Front Housing

Chassis Assembly

Including Main Board

And

LCD and Keypad

Boards

Keypad

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Removing and Installing the Microphone

Recommended tools: no tools are required

Removing the microphone:

(See Figure 22)

1. Remove the chassis assembly, refer to “Removing the keypad and LCD boards from the unit:”, steps 1 through 3.

2. Remove the microphone.

Installing the microphone:

1. Insert a microphone into location.

2. Install the chassis assembly, refer to “Installing the keypad and LCD boards:”, steps 1 and 2.

Removing and Installing the Earphone

Recommended tools: mini flat-tip screwdriver

Removing the earphone:

(See Figure 22)

1. Remove the Acoustic Safety Rubber.

2. Remove the chassis assembly, refer to “Removing the keypad and LCD boards from the unit:”, steps 1 through 3.

3. Using the screwdriver, remove the earphone from the unit. If the earphone was detached from its bottom plate, remove the plate as well.

Installing the earphone:

1. Install the Acoustic Safety Rubber.

2. Using the screwdriver, remove the protective film from the adhesive layer at the earphone bottom plate.

3. Insert the earphone into location. Verify that the two snags at the earphone sides are properly located in their dedicated slots.

4. Gently push the earphone until it is firmly glued inside the front housing.

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5. Install the chassis assembly, refer to “Installing the keypad and LCD boards:”, steps 1 and 2.

Figure 22 Microphone and Earphone Removal and Installation

Microphone

Earphone

Acoustic Safety Rubber

Front Housing

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MTH500 Unit - Exploded View

MTH500 components are listed in the “MTH500 Components List”. The first column marked with an # sign provides you with the call out numbers of the components as marked in Figure 23 and Figure 24.

MTH500 Components List

# Description Part/Kit

Front Housing Assembly (Black) Front Housing Assembly (Blue)

0186163T07 0186163T08

Keypad Assembly 0186630T01

Chassis Assembly See Figure 23

Back Housing Assembly (Black) Back Housing Assembly (Blue)

0186396T04 0186396T05

Antenna 380-400 M Hz (R1) 8586381J02

Screw, Self Forming 0304637P17

Label, Back 5486278T01

Standard Battery Door Assembly (Black) Standard Battery Door Assembly (Blue)

Extended Battery Door Assembly (Black) Extended Battery Door Assembly (Blue)

0186613T01 0186613T02

0186239T01 0186239T02

LCD Module 7287702M01

Keypad Kit FCN9090A

Flex LCD to Keypad 8486498T01

LCD Kit FCN9797A

Chassis 2786168T01

Main Board (R2 ) See Service

Replacement Kit Ma tr ix i n Appendix A

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Figure 23 Exploded View

6 (X6)