Motorola MPX2300DT1 Datasheet
SEMICONDUCTOR TECHNICAL DATA
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Motorola has developed a low cost, high volume, miniature pressure sensor package
which is ideal as a sub–module component or a disposable unit. The unique concept of
the Chip Pak allows great flexibility in system design while allowing an economic solution
for the designer. This new chip carrier package uses Motorola’ s unique sensor die with its
patented, piezoresistive implant technology, along with the added feature of on–chip,
thin–film temperature compensation and calibration.
Features:
• Low Cost
• Patented piezoresistive strain gauge implant, temperature compensation and
calibration all integrated on a single, monolithic sensor die.
• Pressure Range Available: 0–300 mmHg
• Polysulfone (Mindell S–1000) Case Material (Medical, Class VI Approved)
Motorola is offering the Chip Pak option package. Application–specific parts will have
an “SPX” prefix, followed by a four digit number, unique to the specific customer . Devices
will be shipped in a tape and reel packaging.
NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure
is applied to the backside of the device). Front side die and wire protection must be
provided in the customer’s housing. Use caution when handling the devices during all
processes.
MAXIMUM RATINGS
Rating Symbol Value Unit
Overpressure (Backside) P
Burst Pressure P
Supply Voltage V
Storage Temperature T
Operating Temperature T
max
burst
Smax
stg
A
PRESSURE SENSORS
CHIP PAK ELEMENT
CASE 423A–02
PIN NUMBER
1
2
125 PSI
1000 kPa
10 Vdc
–25 to +85 °C
+15 to +40 °C
V
S+
S
3
4
S–
Gnd
Motorola’s MPX2300DT1 Pressure Sensors. Motorola’s
MPX2300DT1 pressure sensor has been designed for
medical usage by combining the performance of Motorola’s
shear stress pressure sensor design and the use of
biomedically approved materials. Materials with a proven
history in medical situations have been chosen to provide a
sensor that can be used with confidence in applications,
such as invasive blood pressure monitoring. It can be
sterilized using ethylene oxide. The portions of the pressure
sensor that are required to be biomedically approved are the
rigid housing and the gel coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: tissue culture test, rabbit implant, hemolysis,
intracutaneous test in rabbits, and system toxicity, USP.
Senseon and X–ducer are trademarks of Motorola, Inc.
Motorola Sensor Device Data
Motorola, Inc. 1997
A silicone dielectric gel that has been used extensively in
implants covers the silicon piezoresistive sensing element.
The gel is a nontoxic, nonallergenic polymer system which
passes pyrogen testing, as well as meeting all USP XX Biological Testing Class VI requirements. The properties of the
gel allow it to transmit pressure uniformly to the diaphragm
surface, while isolating the internal electrical connections
from the corrosive effects of fluids, such as saline solution.
The gel provides electrical isolation sufficient to withstand
defibrillation testing, as specified in the proposed Association
for the Advancement of Medical Instrumentation (AAMI)
Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room
lights from affecting the performance of the sensor .
1
MPX2300DT1
OPERATING CHARACTERISTICS
Characteristics Symbol Min Typ Max Unit
Pressure Range P
Supply Voltage
Supply Current I
Zero Pressure Offset V
Sensitivity — 4.95 5.0 5.05 µV/V/mmHg
Full Scale Span
Linearity + Hysteresis
Temperature Effect on Sensitivity TCS –0.1 — +0.1 %/°C
Temperature Effect on Full Scale Span
Temperature Effect on Offset
Input Impedance Z
Output Impedance Z
R
(150 kΩ)
CAL
Response Time
(10% to 90%)
Temperature Error Band — 0 — 85 °C
Stability
(8)
(1)
(2)
(4)
(9)
(5)
(6)
(VS = 6 Vdc, TA = 25°C unless otherwise noted)
OP
V
S
o
off
V
FSS
— – 2.0 — 2.0
(3)
TCV
FSS
TCV
off
in
out
R
CAL
t
R
— — ±0.5 — %V
0 — 300 mmHg
— 6.0 10 Vdc
— 1.0 — mAdc
–0.75 — 0.75 mV
2.976 3.006 3.036 mV
–0.1 — +0.1 %/°C
–9.0 — +9.0 µV/°C
1800 — 4500 Ω
270 — 330 Ω
97 100 103 mmHg
— 1.0 — ms
FSS
MECHANICAL CHARACTERISTICS
Characteristics Symbol Min Typ Max Unit
Weight (Case 423) — — 170 — mg
Warm–Up — — 15 — Sec
NOTES:
1. Measured at 6.0 Vdc excitation for 100 mmHg pressure differential. V
tween full scale output and zero pressure offset.
2. Maximum deviation from end–point straight line fit at 0 and 300 mmHg.
3. Slope of end–point straight line fit to full scale span at 15°C and +40°C relative to +25°C.
4. Slope of end–point straight line fit to zero pressure offset at 15°C and +40°C relative to +25°C.
5. For a 0 to 300 mmHg pressure step change.
6. Stability is defined as the maximum difference in output at any pressure within POP and temperature within +10°C to +85°C after:
a. 1000 temperature cycles, –40°C to +125°C.
b. 1.5 million pressure cycles, 0 to 300 mmHg.
7. Operating characteristics based on positive pressure differential relative to the vacuum side (gauge/differential).
8. Recommended voltage supply: 6 V ± 0.2 V , regulated. Sensor output is ratiometric to the voltage supply . Supply voltages above +10 V may
induce additional error due to device self–heating.
9. Offset measurement with respect to the measured sensitivity when a 150k ohm resistor is connected to VS and S+ output.
and FSS are like terms representing the algebraic difference be-
FSS
ORDERING INFORMATION
The MPXS4115A series MAP silicon pressure sensors are available shipped in sleeves.
Device T ype Options Case No. MPX Series Order No. Marking
Tape and Reel 423A–02
Device Reel Size Tape Width Quantity
MPX2300DT1 330 mm 24 mm 1000 pc/reel
2
Motorola Sensor Device Data
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