Motorola MPX200GVSX, MPX200D, MPX200DP, MPX200GP, MPX200GS Datasheet
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SEMICONDUCTOR TECHNICAL DATA
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by MPX200/D
The MPX200 series device is a silicon piezoresistive pressure sensors provide a very
accurate and linear voltage output — directly proportional to the applied pressure. This
standard, low cost, uncompensated sensor permits manufacturers to design and add
their own external temperature compensating and signal conditioning networks.
Compensation techniques are simplified because of the predictability of Motorola’s single
element strain gauge design.
Features
• Low Cost
• Patented Silicon Shear Stress Strain Gauge
•±0.25% (Max) Linearity
• Full Scale Span 60 mV (Typ)
• Easy to Use Chip Carrier Package Options
• Ratiometric to Supply Voltage
• Absolute, Differential and Gauge Options
Application Examples
• Pump/Motor Controllers
• Robotics
• Level Indicators
• Medical Diagnostics
• Pressure Switching
• Barometers
• Altimeters
Figure 1 illustrates a schematic of the internal circuitry on the stand–alone pressure
sensor chip.
PIN 3
+ V
S
PIN 2
+ V
PIN 4
– V
out
out
X–ducer
0 to 200 kPa (0–29 psi)
60 mV FULL SCALE SPAN
(TYPICAL)
BASIC CHIP
CARRIER ELEMENT
CASE 344–15, STYLE 1
DIFFERENTIAL
PORT OPTION
CASE 344C–01, STYLE 1
NOTE: Pin 1 is the notched pin.
PIN NUMBER
1
Gnd
2
+V
out
3
V
4
–V
S
out
PIN 1
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X–ducer is directly proportional to the differential
pressure applied.
The absolute sensor has a built–in reference vacuum. The output voltage will decrease
as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly,
output voltage increases as increasing vacuum is applied to the vacuum (P2) side
relative to the pressure (P1) side.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 7
Motorola, Inc. 1997
1Motorola Sensor Device Data
MAXIMUM RATINGS
Rating Symbol Value Unit
Overpressure
Burst Pressure
Storage Temperature T
Operating Temperature T
(8)
(P1 > P2) P
(8)
(P1 > P2) P
max
burst
stg
A
400 kPa
2000 kPa
–40 to +125 °C
–40 to +125 °C
OPERATING CHARACTERISTICS (V
Characteristic
(5)
(1)
(2)
(3)
(5)
(0 to 200 kPa) — — ±0.1 — %V
(5)
(–40°C to +125°C) — — ±0.5 — %V
(5)
(6)
(10% to 90%) t
(9)
Pressure Range
Supply Voltage
Supply Current I
Full Scale Span
(4)
Offset
Sensitivity ∆V/∆P — 0.3 — mV/kPa
Linearity
Pressure Hysteresis
Temperature Hysteresis
Temperature Coefficient of Full Scale Span
Temperature Coefficient of Offset
Temperature Coefficient of Resistance
Input Impedance Z
Output Impedance Z
Response Time
Warm–Up — — 20 — ms
Offset Stability
= 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
S
Symbol Min Typ Max Unit
P
OP
V
S
o
V
FSS
V
off
— –0.25 — 0.25 %V
(5)
(5)
TCV
FSS
TCV
off
TC
R
in
out
R
— — ±0.5 — %V
0 — 200 kPa
— 3.0 6.0 Vdc
— 6.0 — mAdc
45 60 90 mV
0 20 35 mV
–0.22 — –0.16 %V
— ±15 — µV/°C
0.21 — 0.27 %Zin/°C
400 — 550 Ω
750 — 1800 Ω
— 1.0 — ms
MECHANICAL CHARACTERISTICS
Characteristic Symbol Min Typ Max Unit
Weight (Basic Element Case 344–15) — — 2.0 — Grams
Common Mode Line Pressure
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (V
minimum rated pressure.
4. Offset (V
5. Accuracy (error budget) consists of the following:
• Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
• TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
• TCR: Zin deviation with minimum rated pressure applied, over the temperature range of –40°C to +125°C,
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
) is defined as the output voltage at the minimum rated pressure.
off
(7)
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
pressure range.
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
minimum or maximum rated pressure, at 25°C.
to 25°C.
relative to 25°C.
— — — 690 kPa
FSS
FSS
FSS
FSS
FSS
/°C
2 Motorola Sensor Device Data
LINEARITY
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Linearity refers to how well a transducer’s output follows
the equation: V
out
= V
+ sensitivity x P over the operating
off
pressure range (see Figure 2). There are two basic methods
for calculating nonlinearity: (1) end point straight line fit or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worse case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’ s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
TEMPERATURE COMPENSATION
Figure 3 shows the typical output characteristics of the
MPX200 series over temperature. The output is directly proportional to the pressure and is essentially a straight line.
The X–ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
70
ACTUAL
PRESSURE (kPA)
LINEARITY
THEORETICAL
SPAN
(V
)
FSS
OFFSET
(V
)
OFF
P
OP
60
50
40
30
OUTPUT (mVdc)
20
10
0
0 MAX
proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components
or by designing your system using the MPX2200 series
sensors.
Several approaches to external temperature compensation over both – 40 to +125°C and 0 to + 80°C ranges are
presented in Motorola Applications Note AN840.
70
VS = 3.0 Vdc
60
50
40
30
OUTPUT (mVdc)
20
10
0
PSI
kPa
P1 > P2
0
4.0 8.0 12 16 20 24 28 30
20 40 60 80 100 120 140 160 180 200
PRESSURE DIFFERENTIAL
–40°C
+25°C
+125
°
C
SPAN
RANGE
(TYP)
OFFSET
(TYP)
Figure 2. Linearity Specification Comparison Figure 3. Output versus Pressure Differential
SILICONE GEL
DIE COAT
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344–15). A silicone gel isolates the die
surface and wire bond from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm. The MPX200 series pressure sensor operating
DIFFERENTIAL/GAUGE
DIE
P1
P2
STAINLESS STEEL
Figure 4. Cross–Sectional Diagrams (Not to Scale)
METAL COVER
EPOXY
CASE
DIE
BOND
SILICONE GEL
DIE COAT
WIRE BOND
LEAD FRAME
ABSOLUTE
DIE
P1
ABSOLUTE ELEMENT
P2
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIE
BOND
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
3Motorola Sensor Device Data
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