Motorola MPC2605ZP66, MPC2605ZP66R Datasheet

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Product Preview
Integrated Secondary Cache for PowerPC Microprocessors
The MPC2605 is a single chip, 256KB integrated look–aside cache with copy–back capability designed for PowerPC applications (MPC603 and MPC604). Using 0.38 µm technology along with standard cell logic technology , the MPC2605 integrates data, tag, host interface, and least recently used (LRU) memory with a cache controller to provide a 256KB, 512KB, or 1 MB Level 2 cache with one, two, or four chips on a 64–bit PowerPC bus.
Single Chip L2 Cache for PowerPC
66 MHz Zero Wait State Performance (2–1–1–1 Burst)
Four–Way Set Associative Cache Design
32K x 72 Data Memory Array
8K x 18 Tag Array
Address Parity Support
LRU Cache Control Logic
Copy–Back or Write–Through Modes of Operation
Copy–Back Buffer for Improved Performance
Single 3.3 V Power Supply
5 V Tolerant I/O
One, Two, or Four Chip Cache Solution (256KB, 512KB, or 1MB)
Single Clock Operation
Compliant with IEEE Standard 1 149.1 Test Access Port (JTAG)
Supports up to Four Processors in a Shared Cache Configuration
High Board Density 25 mm 241 PBGA Package
BLOCK DIAGRAM
Order this document
by MPC2605/D
MPC2605
ZP PACKAGE
PBGA
CASE 1138–01
COPY–BACK
BUFFER
CONTROL
RD/WR
60X BUS
INTERFACE
A0 – A31
The PowerPC name is a trademark of IBM Corp., used under license therefrom.
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
REV 6 2/26/98
CONTROLLER
AND
BUS INTERFACE
2K x 8 LRU
A27, A28
RD/WR
8K x 72 x 4 DATA RAM
2K x 18 x 4
TAG RAM
WAY SELECT
COMPARE
DH0 – DH31 DL0 – DL31 DP0 – DP7
Motorola, Inc. 1998
MOTOROLA
MPC2605
1
PIN ASSIGNMENT
67
A
B
C
D
L2 BR
E
F
G
ARTRY
H
J
HRESET
K
L
M
ABB
L2 BG
CPU3BGCFG4 L2
FDN
TA
CPU DBG
TEA
TT1
TT4
TT3
MISS INH
CPU3
BR
CPU2
BR
L2 DBG
L2 CLAIM
CI AACK
CPU
BR
DBB
TT0
TT2
CPU BG
CPU3
DBG
CPU2
DBG
CPU2
BG NC
WT
PWRDN
TBST
CLK
TS
DH19 DH29
DH20
DH23
V
DD
V
SS
V
SS
DD
DD
DD
SS
DH17
DH18
DH21
DH22
DP2 DP3
DH31
DH16
8543219
DH27
DH28
DH30
V
SS
V
SS
V
SS
V
V
SS
DD
V
V
DD
DD
V
V
DD
DD
V
V
DD
SS
V
V
SS
SS
V
V
SS
SS
DL16 DL19 DP6
DH25 DL17 DL20 DL23
DH24
DL18 DL21 V
V
V
DD
DD
V
V
DD
SS
V
V
SS
SS
V
V
SS
SS
V
V
SS
DD
V
V
DD
DD
DL22DH26
V
SS
V
V
SS
SS
V
SS
V
SS
V
DD
V
DD
V
DD
DL24
SS
15 16
DL25
DL26
V
DD
DL27
DL28
V
DD
V
SS
V
SS
V
DD
V
DD
V
DD
V
SS
171413121110 18
DL29 DL30
DL31
DP7
AP2
AP3
L2
AP0
FLUSH
APEN
CFG3
TSIZ1
TSIZ0
V
V
SS
SS
A14
A15
A18A19 A17V
A22A20 A21V
A24A25 A23V
A27A28 A26V
19
APE
AP1
L2 CI
GBL
TSIZ2
A13
A16
N
P
R
T
U
V
W
SRESET
TDI
TDO
CPU4
BG
CPU4
BR
CFG2
L2 UPDATE
L2
TAG CLR
TCK
TMS
TRST
CPU4
DBG
CFG0
CFG1
DP0 DH6 DL13
INH
NC
V
DD
V
DD
DH7
V
SS
V
V
V
SS
VSSVSSVSSDH14 DH10 DL1 DL4 V
V
DD
DH3
DH5
DH4
DH0 DH15 DH12 DH9 DH8 DL2 DL5 DL7 DL8 DL9 DL11DH2
SS
DD
V
DD
DD
SS
SS
SSVSSVSSVDD
V
V
V
V
SS
DP5
TOP VIEW (X–RAY VIEW)
V
DD
V
DD
DL15DH1 DP1 DH13 DH11 DL0 DL3 DL6 DP4 DL10 DL12 DL14
A30A31 A29
A11A10 A12
A8A7 A9
A5
A6
A3
A4
A2
A1
A0
MPC2605
2
MOTOROLA
PIN DESCRIPTIONS
Pin Locations Pin Name Type Description
19G, 17H – 19H, 17J – 19J,
17K – 19K, 17L – 19L,
17M – 19M, 17N – 19N,
17P – 19P, 17R – 19R,
18T, 19T, 18U, 19U,
18V, 19V, 18W
3G AACK I/O Address acknowledge input/output.
2A ABB I/O Used as an input to qualify bus grants. Driven as an output during address tenure
17C – 19C, 17D *
A0 – A31 I/O Address inputs from processor. Can also be outputs for processor snoop
addresses. A0 is the MSB. A31 is the LSB.
*
initiated by the MPC2605.
AP0 – AP3 I/O Address parity.
19B APE O Address parity error. When an address parity error is detected, APE will be driven
18E APEN I Address parity enable. When tied low, enables address parity bits and the
1G ARTRY I/O Address retry status I/O. Generated when a read or write snoop to a dirty
2U 2V 1V
17E
2B
2G CI I/O Cache inhibit I/O. 3M CLK I Clock input. This must be the same as the processor clock input. 2M CPU BG I CPU bus grant input.
3E CPU2 BG I MPC2605 logically ORs this signal with CPU BG. Used in multiprocessor
1B CPU3 BG I MPC2605 logically ORs this signal with CPU BG. Used in multiprocessor
1T CPU4 BG I MPC2605 logically ORs this signal with CPU BG. Used in multiprocessor
2H CPU BR I CPU bus request input. 2D CPU2 BR I MPC2605 logically ORs this signal with CPU BR. Used in multiprocessor
2C CPU3 BR I MPC2605 logically ORs this signal with CPU BR. Used in multiprocessor
1U CPU4 BR I MPC2605 logically ORs this signal with CPU BR. Used in multiprocessor
1F CPU DBG I CPU data bus grant input from arbiter. 3D CPU2 DBG I MPC2605 logically ORs this signal with CPU DBG. Used in multiprocessor
3C CPU3 DBG I MPC2605 logically ORs this signal with CPU DBG. Used in multiprocessor
*See pin diagram (page 2) for specific pin assignment of these bus signals.
CFG0 CFG1 CFG2 CFG3 CFG4
low one clock cycle after the assertion of TS
address parity error bit.
processor cache line has occurred.
I Configuration inputs. These must be tied to either VDD or VSS.
CFG0
0 0 0 256KB 0 1 0 512KB; A26 = 0 0 1 1 512KB; A26 = 1 1 0 0 1MB; A25 – A26 = 00 1 0 1 1MB; A25 – A26 = 01 1 1 0 1MB; A25 – A26 = 10 1 1 1 1MB; A25 – A26 = 11
CFG3 Snoop Data Tenure Selector
CFG4 AACK
configuration as the second CPU BG
configuration as the third CPU BG
configuration as the fourth CPU BG
configuration as the second CPU BR
configuration as the third CPU BR
configuration as the fourth CPU BR
configuration as the second CPU DBG
configuration as the third CPU DBG
then High–Z following clock cycle.
CFG1 CFG2
0 Supports snoop data tenure 1 Does not support snoop data tenure
Driver Enable 0 Disable AACK 1 Enable AACK
driver
driver
.
.
.
.
.
.
.
.
MOTOROLA
MPC2605
3
Pin Locations Pin Name
2T CPU4 DBG I MPC2605 logically ORs this signal with CPU DBG. Used in multiprocessor
11A – 13A, 15A – 18A,
11B – 17B, 11C, 12C, 10U,
11U, 10V – 12V, 14V – 17V,
11W – 17W
4A – 10A, 4B – 10B, 6C,
10C, 8U, 9U, 3V – 6V,
8V, 9V, 3W –10W *
14A, 18B, 5C, 8C,
16U, 7V , 13V, 2W
*See pin diagram (page 2) for specific pin assignment of these bus signals.
*
2J DBB I/O Data bus busy. Used as input when processor is master , driven as an output after
*
1C FDN I/O Flush done I/O used for communication between other MPC2605 devices. Must
19E GBL O Global transaction. Always negated when MPC2604 is bus master.
1J HRESET I Hard reset input from processor bus. This is an asynchronous input that must be
3A L2 BG I Bus grant input from arbiter. 1D L2 BR I/O Bus request I/O. Normally used as an output.
19D L2 CI I Secondary cache inhibit sampled, after assertion of TS. Assertion prevents
2F L2 CLAIM O L2 cache claim output. Used to claim the bus for processor initiated memory
2E L2 DBG I Data bus grant input. Comes from system arbiter, used to start data tenure for
18D L2 FLUSH I Causes cache to write back dirty lines and clears all tag valid bits.
3B L2 MISS INH I Prevents line fills on misses when asserted. 2N L2 TAG CLR I Invalidates all tags and holds cache in a reset condition. 3N L2 UPDATE
3J PWRDN I Provides low power mode. Prevents address and data transitions into the RAM
1N SRESET I Soft reset input from processor bus. 1E TA I/O Transfer acknowledge status I/O from processor bus. 3K TBST I/O Transfer burst status I/O from processor bus. Used to distinguish between
2P TCK I T est clock input for IEEE 1149.1 boundary scan (JTAG). 1P TDI I Test data input for IEEE 1 149.1 boundary scan (JTAG). 1R TDO O Test data output for IEEE 1149.1 boundary scan (JTAG). 1H TEA I Transfer error acknowledge status input from processor bus. 3P TMS I Test mode select for IEEE 1149.1 boundary scan (JTAG).
DL0 – DL31 I/O Data bus low input and output. DL0 is the MSB. DL31 is the LSB.
DH0 – DH31 I/O Data bus high input and output. DH0 is the MSB. DH31 is the LSB.
DP0 – DP7 I/O Data bus parity input and output.
INH
Type Description
configuration as the fourth CPU DBG
a qualified L2 DBG L2 mode, this pin must be tied high.
be tied together between all MPC2605 parts along with a pullup resistor.
low for at least 16 clock cycles to ensure the MPC2605 is properly reset. For proper initialization, TRST
linefill.
operations that hit the L2 cache. L2 CLAIM of CLK following TS resistor may be necessary to ensure proper system functioning.
bus operations where MPC2605 is the bus master.
I Cache disable. When asserted, the MPC2605 will not respond to signals on the
local bus and internal states do not change.
array. MPC2605 becomes active 4 µs after deassertion. Clock must be externally disabled.
burstable and non–burstable memory operations.
.
when MPC2605 is the bus master. Note: To operate in Fast
must be asserted before HRESET is asserted.
goes true (low) before the rising edge
true. Because this output is not always driven, a pullup
MPC2605
4
MOTOROLA
Pin Locations Pin Name
2R TRST I T est reset input for IEEE 1 149.1 boundary scan (JT AG). If JTAG will not be used,
3L TS I/O Transfer start I/O from processor bus (can also come from any bus master on the
17F – 19F *
1K, 2K, 1L, 2L, 1M *
3H WT I/O Write through status input from processor bus. When tied to ground, the
4C, 15C, 16C, 9D – 11D,
8H – 10H, 4J, 8J, 9J, 16J, 4K,
8K, 12K, 16K, 4L, 11L, 12L,
16L, 10M – 12M, 3T, 9T – 11T,
17T, 3U, 4U, 15U, 17U
7C, 9C, 13C, 14C, 7D, 8D, 12D, 13D, 4G, 16G – 18G,
4H, 11H, 12H, 16H, 10J – 12J,
9K – 11K, 8L – 10L, 4M, 8M, 9M, 16M, 4N, 16N, 7T, 8T, 12T, 13T, 5U – 7U, 12U – 14U
3F, 3R NC No connection: There is no connection to the chip.
*See pin diagram (page 2) for specific pin assignment of these bus signals.
TSIZ0–TSIZ2 I/O Transfer size I/O from processor bus.
TT0–TT4 I/O Transfer type I/O from processor bus.
V
DD
V
SS
Type Description
TRST
should be tied low.
processor bus). Signals the start of either a processor or bus master cycle.
MPC2605 will operate in write–through mode only (no copy–back).
Supply Power supply: 3.3 V ± 5%.
Supply Ground.
ABSOLUTE MAXIMUM RATINGS (See Note 1)
Rating Symbol Value Unit
Power Supply Voltage V Voltage Relative to V Output Current (per I/O) I Power Dissipation (Note 2) P Temperature Under Bias T Operating Temperature T Storage Temperature T
NOTES:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to RECOMMENDED OPER­ATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
2. Power dissipation capability is dependent upon package characteristics and use environment. See Package Thermal Characteristics.
SS
DD
Vin, V
out
bias
stg
out
D
J
– 0.5 to + 4.6 V
– 0.5 to VDD + 0.5 V
± 20 mA
W
– 10 to + 85 °C
0 to + 125 °C
– 55 to + 125 °C
This device contains circuitry to protect the inputs against damage due to high static volt­ages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maxi­mum rated voltages to this high–impedance circuit.
This BiCMOS memory circuit has been de­signed to meet the dc and ac specifications shown in the tables, after thermal equilibrium has been established.
MOTOROLA
MPC2605
5
DC OPERA TING CONDITIONS AND CHARACTERISTICS
(TJ = 20 to + 1 10 °C, Unless Otherwise Noted)
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage (Operating Voltage Range) V Input High Voltage V Input Low Voltage V
*VIL(min) = – 2.0 V ac (pulse width 20 ns).
(Voltages Referenced to VSS = 0 V)
Symbol Min Typ Max Unit
DD
IH
IL
DC CHARACTERISTICS
Parameter Symbol Min Max Unit
Input Leakage Current (All Inputs, Vin = 0 to VDD) I Output Leakage Current (High–Z State, V AC Supply Current (I
Cycle Time = 15 ns, max value assumes a constant burst read hit, with 100% bus utilization, and 100% hit rate)
AC Quiescent Current (I Cycle Time = 15 ns, All Other Inputs DC)
Output Low Voltage (IOL = + 8.0 mA) V Output High Voltage (IOH = – 4.0 mA) V
= 0 mA, All inputs = VIL or VIH, VIL = 0 V, and VIH≥ 3.0 V,
out
= 0 mA, All inputs = VIL or VIH, VIL = 0 V and VIH 3.0 V ,
out
CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, T
Input Capacitance C Output Capacitance C Input/Output Capacitance C
= 0 to VDD) I
out
= 25°C, Periodically Sampled Rather Than 100% Tested)
A
Parameter Symbol Typ Max Unit
3.135 3.3 3.465 V
2.0 5.5 V
– 0.5* 0.8 V
lkg(I)
lkg(O)
I
CCA
I
Q
OL OH
in
out
I/O
± 1.0 µA — ± 1.0 µA — 720 mA
195 mA
0.4 V
2.4 V
4 6 pF 6 8 pF 8 10 pF
PACKAGE THERMAL CHARACTERISTICS
Rating Symbol Max Unit
Thermal Resistance Junction to Ambient (Still Air, Test Board with Two Internal Planes) R Thermal Resistance Junction to Ambient (200 lfpm, Test Board with Two Internal Planes) R Thermal Resistance Junction to Board (Bottom) R Thermal Resistance Junction to Case (Top) R
θJA θJA θJB θJC
26.5 °C/W
23.2 °C/W
15.9 °C/W
6.6 °C/W
MPC2605
6
MOTOROLA
AC OPERA TING CONDITIONS AND CHARACTERISTICS
Timing
(TJ = 20 to + 1 10 °C, Unless Otherwise Noted)
Input Timing Measurement Reference Level 1.5 V. . . . . . . . . . . . . . .
Input Pulse Levels 0 to 3.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Rise/Fall Time 2 ns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Measurement Timing Level 1.5 V. . . . . . . . . . . . . . . . . . . . . . .
Output Load 50 T ermination to 1.5 V. . . . . . . . . . . . . . . . . . . . . . . .
AC CLOCK SPECIFICATIONS
Timing
Parameter
Frequency of Operation 66.67 MHz Clock Cycle Time Clock Rise and Fall Time Clock Duty Cycle Measured at 1.5 V 40 60 % Clock Short–Term Jitter (Cycle to Cycle) ± 150 ps 1
NOTES:
1. This parameter is sampled and not 100% tested.
2. Rise and fall times for the clock input are measured from 0.4 to 2.4 V .
Reference
,
MPC2605–66
Min Max
15 ns
1.0 2.0 ns 1, 2
Unit Notes
CLOCK INPUT TIMING DIAGRAM
VM
VM = Midpoint Voltage (1.5 V)
V
IH
V
IL
MOTOROLA
MPC2605
7
AC SPECIFICATIONS
Timing
Timing
Parameter
Clock Cycle Time Input Setup Time Clock to Input Invalid (Input Hold) Clock to Output Driven Clock to Output Valid Clock to Output Invalid Clock to Output High–Z PWRDN Disable to Recovery 4 µs 2
NOTES:
1. All input specifications are measured from the TTL level (0.8 or 2.0 V) of the signal in question to the 1.4 V level of the rising edge of the input clock. Both input and output timings are measured at the pin.
2. This parameter is sampled and not 100% tested.
CLK
INPUTS
Reference
MPC2605–66
Min Max
15 ns
4.5 ns 1 2 ns 1 2 9 ns 2 2 9 ns 2 ns 2 2 12 ns 2
Unit Notes
OUTPUTS
MPC2605
8
MOTOROLA
MPC2605 RESPONSE TO 60X TRANSFER ATTRIBUTES
TT0 – TT4 TBST CI WT Tag Status MPC2605 Response Notes
X1X10 0 1 X Miss Line–fill (processor read miss) 1, 2, 3 X1X10 0 1 X Hit L2 CLAIM, AACK, TA (processor read hit) 4 X1010 1 0 X Hit Clean Paradox — Invalidate the line (processor n–cacheable read hit
X1010 1 0 X Hit Dirty Paradox — ARTRY, L2 BR, then write back data, invalidate the line
00110 0 1 X Miss Line–fill except right after a snoop hit to processor (processor write
00110 0 1 1 Hit L2 CLAIM, AACK, TA except after a snoop hit to processor
00X10 X 1 0 Hit Clean Cache update (processor write through WT hit clean) 00110 0 1 0 Hit Dirty Cache update, clear dirty bit 00010 1 1 0 Hit Dirty Paradox — ARTRY, L2 BR, write back data, keep valid, clear dirty
X0010 1 0 X Hit Clean Paradox — Invalidate the line (processor n–cacheable write hit
X0010 1 0 X Hit Dirty Paradox — ARTRY, L2 BR, then write back data, invalidate the line
00100 X X X Hit Clean Invalidate tag (flush block address–only) 00100 X X X Hit Dirty ARTRY, L2 BR, write back data, invalidate tag (flush block
00000 X X X Hit Clean No action (clean block address–only) 00000 X X X Hit Dirty ARTRY, L2 BR, write back data, reset dirty bit (clean block
01100 X X X Hit Invalidate tag (kill block address–only)
NOTES:
1. If a line fill is going to replace a dirty line and the cast out buffer (COB) is full, the line fill will be cancelled. (Unless the line fill is a write which hits in the COB. In this case, the line fill will occur.)
2. If a burst read misses the cache but hits the COB, the MPC2605 will supply the data from the COB, but not perform a line fill.
3. If ARTRY dirty, tag field), and the COB goes back to an invalid condition, even if the line fill is a burst write to the line in the COB.
4. If ARTRY
5. If a processor burst write occurs right after a snoop write that was a cache hit, the MPC2605 will invalidate the line. If the snoop was a cache miss, the MPC2605 will not perform a write allocate.
6. If a processor burst write occurs right after a snoop read that was a cache hit, the MPC2605 will update the cache and clear the dirty bit. If the snoop was a cache miss, the MPC2605 will perform a write allocate.
is asserted during a line fill to replace a dirty line, the line fill will be cancelled, the to–be–replaced line will recover its old tag (valid,
is asserted during a read hit, the MPC2605 will abort the process.
clean line)
(processor n–cacheable read hit dirty line)
1, 3, 5, 6
miss)
(processor write hit)
bit
clean line)
(processor n–cacheable SB write hit dirty line)
address–only)
address–only)
5, 6
MPC2605 RESPONSE TO CHIPSET TRANSFER ATTRIBUTES
TT0 – TT4 Tag Status MPC2605 Response
00100 X0010 X1110
00100 X0010 X1110
00000 X1010
00000 X1010
0110X 00110
NOTE: In all snoop push cases, BR is sampled the cycle after the ARTRY window. If BR is asserted in this cycle, L2 BR will be immediately negated
and an assertion of L2 BG
Hit Clean Invalidate line
Hit Dirty ARTRY and L2 BR write back data, invalidate line (see Note)
Hit Clean No action
Hit Dirty ARTRY and L2 BR, write back data, reset dirty bit (see Note)
Hit Invalidate (kill block)
will be ignored.
TRANSFER ATTRIBUTES GENERATED FOR L2 COPYBACK
TT0 – TT4 TBST CI WT
00010 0 1 1
MOTOROLA
MPC2605
9
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