MCM6926A
2
MOTOROLA FAST SRAM
TRUTH TABLE (X = Don’t Care)
E G W Mode VDD Current Output Cycle
H X X Not Selected I
SB1
, I
SB2
High–Z —
L H H Output Disabled I
DDA
High–Z —
L L H Read I
DDA
D
out
Read Cycle
L X L Write I
DDA
High–Z Write Cycle
ABSOLUTE MAXIMUM RATINGS (See Note)
Rating
Symbol Value Unit
Power Supply Voltage V
DD
– 0.5 to + 4.6 V
Voltage Relative to VSS for Any Pin
Except V
DD
Vin, V
out
– 0.5 to VDD + 0.5 V
Output Current I
out
± 30 mA
Power Dissipation P
D
0.6 W
Temperature Under Bias T
bias
– 10 to + 85 °C
Operating Temperature T
A
0 to + 70 °C
Storage Temperature — Plastic T
stg
– 55 to + 125 °C
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPERATING CONDITIONS. Exposure to higher than recommended voltages for
extended periods of time could affect device reliability.
DC OPERA TING CONDITIONS AND CHARACTERISTICS
(VDD = 3.3 V + 10%, – 5%, TA = 0 to 70°C, Unless Otherwise Noted)
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Min Typ Max Unit
Supply Voltage (Operating Voltage Range) V
DD
3.135 3.3 3.6 V
Input High Voltage V
IH
2.2 —
VDD + 0.3**
V
Input Low Voltage V
IL
– 0.5*
— 0.8 V
*VIL (min) = – 0.5 V dc; VIL (min) = – 2.0 V ac (pulse width ≤ 2.0 ns) for I ≤ 20.0 mA.
**VIH (max) = VDD + 0.3 V dc; VIH (max) = VDD + 2 V ac (pulse width ≤ 2.0 ns) for I ≤ 20.0 mA.
DC CHARACTERISTICS
Parameter Symbol Min Max Unit
Input Leakage Current (All Inputs, Vin = 0 to VDD) I
lkg(I)
— ± 1.0 µA
Output Leakage Current (E = VIH, V
out
= 0 to VDD) I
lkg(O)
— ± 1.0 µA
Output Low Voltage (IOL = + 8.0 mA) V
OL
— 0.4 V
Output High Voltage (IOH = – 4.0 mA) V
OH
2.4 — V
This device contains circuitry to protect the
inputs against damage due to high static voltages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maximum rated voltages to these high–impedance
circuits.
This BiCMOS memory circuit has been designed to meet the dc and ac specifications
shown in the tables, after thermal equilibrium
has been established. The circuit is in a test
socket or mounted on a printed circuit board
and transverse air flow of at least 500 linear feet
per minute is maintained.