Motorola MC74HC14AN, MC74HC14ADT, MC54HC14AJ Datasheet


SEMICONDUCTOR TECHNICAL DATA
1
REV 7
Motorola, Inc. 1995
10/95
  
The MC54/74HC14A is identical in pinout to the LS14, LS04 and the HC04. The device inputs are compatible with Standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
The HC14A is useful to “square up” slow input rise and fall times. Due to hysteresis voltage of the Schmitt trigger, the HC14A finds applications in noisy environments.
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS and TTL
Operating Voltage Range: 2 to 6V
Low Input Current: 1µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance With the JEDEC Standard No. 7A Requirements
Chip Complexity: 60 FETs or 15 Equivalent Gates
LOGIC DIAGRAM
Y1A1
A2
A3
A4
A5
A6
Y2
Y3
Y4
Y5
Y6
1
3
5
9
11
13
2
4
6
8
10
12
Y = A
Pin 14 = V
CC
Pin 7 = GND
Pinout: 14–Lead Packages (Top View)
1314 12 11 10 9 8
21 3 4 5 6 7
V
CC
A6 Y6 A5 Y5 A4 Y4
A1 Y1 A2 Y2 A3 Y3 GND
L
H

FUNCTION TABLE
Inputs Outputs
A
H
L
Y
D SUFFIX
SOIC PACKAGE
CASE 751A–03
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
ORDERING INFORMATION
MC54HCXXAJ MC74HCXXAN MC74HCXXAD MC74HCXXADT
Ceramic Plastic SOIC TSSOP
1
14
1
14
1
14
DT SUFFIX
TSSOP PACKAGE
CASE 948G–01
J SUFFIX
CERAMIC PACKAGE
CASE 632–08
1
14
MC54/74HC14A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V
in
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
V
out
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
I
in
DC Input Current, per Pin
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 50
mA
P
D
Power Dissipation in Still Air,Plastic or Ceramic DIP†
SOIC Package†
TSSOP Package†
750 500 450
mW
T
stg
Storage Temperature Range
– 65 to + 150
_
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
Ceramic DIP
260 300
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
Ceramic DIP: – 10 mW/_C from 100_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, V
out
DC Input Voltage, Output Voltage (Referenced to GND)
0
V
CC
V
T
A
Operating Temperature Range, All Package Types
– 55
+ 125
_
C
tr, t
f
Input Rise/Fall Time VCC = 2.0 V
(Figure 1) VCC = 4.5 V
VCC = 6.0 V
0 0 0
No Limit* No Limit* No Limit*
ns
*When Vin = 50% VCC, ICC > 1mA
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance cir­cuit. For proper operation, Vin and V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
MC54/74HC14A
High–Speed CMOS Logic Data DL129 — Rev 6
3 MOTOROLA
DC CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol Parameter Condition
V
CC V
–55 to 25°C 85°C 125°C Unit
VT+ max Maximum Positive–Going Input
Threshold Voltage (Figure 3)
V
out
= 0.1V
|I
out
| 20µA
2.0
3.0
4.5
6.0
1.50
2.15
3.15
4.20
1.50
2.15
3.15
4.20
1.50
2.15
3.15
4.20
V
VT+ min Minimum Positive–Going Input
Threshold Voltage (Figure 3)
V
out
= 0.1V
|I
out
| 20µA
2.0
3.0
4.5
6.0
1.0
1.5
2.3
3.0
0.95
1.45
2.25
2.95
0.95
1.45
2.25
2.95
V
VT– max Maximum Negative–Going Input
Threshold Voltage (Figure 3)
V
out
= VCC – 0.1V
|I
out
| 20µA
2.0
3.0
4.5
6.0
0.9
1.4
2.0
2.6
0.95
1.45
2.05
2.65
0.95
1.45
2.05
2.65
V
VT– min Minimum Negative–Going Input
Threshold Voltage (Figure 3)
V
out
= VCC – 0.1V
|I
out
| 20µA
2.0
3.0
4.5
6.0
0.3
0.5
0.9
1.2
0.3
0.5
0.9
1.2
0.3
0.5
0.9
1.2
V
VHmax
Note 2
Maximum Hysteresis Voltage (Figure 3)
V
out
= 0.1V or VCC – 0.1V
|I
out
| 20µA
2.0
3.0
4.5
6.0
1.20
1.65
2.25
3.00
1.20
1.65
2.25
3.00
1.20
1.65
2.25
3.00
V
VHmin Note 2
Minimum Hysteresis Voltage (Figure 3)
V
out
= 0.1V or VCC – 0.1V
|I
out
| 20µA
2.0
3.0
4.5
6.0
0.20
0.25
0.40
0.50
0.20
0.25
0.40
0.50
0.20
0.25
0.40
0.50
V
V
OH
Minimum High–Level Output Voltage
Vin VT– min |I
out
| 20µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin VT– min |I
out
| 2.4mA
|I
out
| 4.0mA
|I
out
| 5.2mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
V
OL
Maximum Low–Level Output Voltage
Vin VT+ max |I
out
| 20µA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin VT+ max |I
out
| 2.4mA
|I
out
| 4.0mA
|I
out
| 5.2mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
I
in
Maximum Input Leakage Current Vin = VCC or GND 6.0 ±0.1 ±1.0 ±1.0 µA
I
CC
Maximum Quiescent Supply Current (per Package)
Vin = VCC or GND I
out
= 0µA
6.0 1.0 10 40 µA
1. Information on typical parametric values along with frequency or heavy load considerations can be found in Chapter 2 of the Motorola High– Speed CMOS Data Book (DL129/D).
2. VHmin > (VT+ min) – (VT– max); VHmax = (VT+ max) – (VT– min).
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