SEMICONDUCTOR TECHNICAL DATA
3–1
REV 6
Motorola, Inc. 1995
10/95
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High–Performance Silicon–Gate CMOS
The MC54/74HCT14A may be used as a level converter for interfacing
TTL or NMOS outputs to high–speed CMOS inputs.
The HCT14A is identical in pinout to the LS14.
The HCT14A is useful to “square up” slow input rise and fall times. Due to
the hysteresis voltage of the Schmitt trigger, the HCT14A finds applications
in noisy environments.
• Output Drive Capability: 10 LSTTL Loads
• TTL/NMOS–Compatible Input Levels
• Outputs Directly Interface to CMOS, NMOS and TTL
• Operating Voltage Range: 4.5 to 5.5 V
• Low Input Current: 1.0 µA
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 72 FETs or 18 Equivalent Gates
LOGIC DIAGRAM
PIN 14 = V
CC
PIN 7 = GND
Y = A
A1
1
2
Y1
A2
3 4
Y2
A3
5 6
Y3
A4
9
8
Y4
A5
11
10
Y5
A6
13
12
Y6
FUNCTION TABLE
PIN ASSIGNMENT
Input
A
L
H
11
12
13
14
8
9
105
4
3
2
1
7
6
Y5
A5
Y6
A6
V
CC
Y4
A4
Y2
A2
Y1
A1
GND
Y3
A3
Output
Y
H
L
D SUFFIX
SOIC PACKAGE
CASE 751A–03
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
ORDERING INFORMATION
MC54HCTXXAJ
MC74HCTXXAN
MC74HCTXXAD
Ceramic
Plastic
SOIC
1
14
1
14
J SUFFIX
CERAMIC PACKAGE
CASE 632–08
1
14
MC54/74HCT14A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
3–2
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air,Plastic or Ceramic DIP†
SOIC Package†
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
(Ceramic DIP)
_
C
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
Ceramic DIP: – 10 mW/_C from 100_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time (Figure 1)
ns
*No Limit when Vin [ 50% VCC, ICC > 1 mA.
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Maximum Positive–Going
Input Threshold Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Minimum Positive–Going
Input Threshold Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Maximum Positive–Going
Input Threshold Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Minimum Positive–Going
Input Threshold Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Maximum Hysteresis
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Minimum Hysteresis
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Minimum High–Level
Output Voltage
Vin < VT–min
|I
out
| v 20 µA
Vin < VT–min
|I
out
| v 4.0 mA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
(continued)
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.