pp y
SEMICONDUCTOR TECHNICAL DATA
The MC10H352 is a quad translator for interfacing data between a
CMOS logic section and the PECL section of digital systems when only a
+5.0 Vdc power supply is available. The MC10H352 has CMOS
compatible inputs and PECL complementary open–emitter outputs that
allow use as an inverting/non–inverting translator or as a differential line
driver. When the common strobe input is at a low logic level, it forces all
true outputs to the PECL low logic state (≈ +3.2 V) and all inverting
outputs to the PECL high logic state (≈ +4.1 V).
The MC10H352 can also be used with the MC10H350 to transmit and
receive CMOS information differentially via balanced twisted pair lines.
• Single +5.0 V Power Supply
• All VCC Pins Isolated On Chip
• Differentially Drive Balanced Lines
• tpd = 1.3 nsec Typical
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply V
Input Voltage (VCC = 5.0 V) V
Output Current— Continuous
Operating Temperature Range T
Storage Temperature Range— Plastic
— Surge
— Ceramic
ELECTRICAL CHARACTERISTICS (VCC = V
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply
Current
Reverse Current
Pins 7, 8, 12, 14
Pin 9
Forward Current
Pins 7, 8, 12, 14
Pin 9
Input Voltage
Breakdown
Input Clamp Voltage
(Iin = –18 mA)
High Output
Voltage (1)
Low Output
Voltage (1)
High Input Voltage V
Low Input Voltage V
(1) With VCC at 5.0 V. VOH/VOL change 1:1 with VCC.
*Positive Emitter Coupled Logic
ECL — 50 — 45 — 50 mA
TTL — 20 — 15 — 20 mA
I
V
(BR)in
V
V
R
I
F
V
OH
OL
IH
——25
——–0.8
5.5 — 5.5 — 5.5 — Vdc
— –1.5 — –1.5 — –1.5 Vdc
I
3.98 4.16 4.02 4.19 4.08 4.27 Vdc
3.05 3.37 3.05 3.37 3.05 3.37 Vdc
3.15 — 3.15 — 3.15 — Vdc
— 1.5 — 1.5 — 1.5 Vdc
IL
CC
I
I
out
A
T
stg
CC1
100——2080——25100
–3.2——
0 to +7.0 Vdc
0 to V
50
100
0 to +75 °C
–55 to +150
–55 to +165
= V
= 5.0 V ± 5.0%)
CC2
–0.6
–2.4——
CC
–0.8
–3.2
Vdc
mA
°C
µA
mA
L SUFFIX
CERAMIC PACKAGE
CASE 732–03
P SUFFIX
PLASTIC PACKAGE
CASE 738–03
FN SUFFIX
PLCC
CASE 775–02
LOGIC DIAGRAM
71
B IN
8
A IN
12
D IN
14 19
C IN
COMMON
STROBE
9
VCC (+5.0 VDC) = PINS 6, 11, 15, 20
GND = PIN 10
DIP
PIN ASSIGNMENT
B OUT
B OUT
N.C.
A OUT
A OUT
V
CC
B IN
A IN
COMMON
STROBE
GND
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–36 of the Motorola MECL Data
1
2
3
4
5
6
7
8
9
10
Book (DL122/D).
20
19
18
17
16
15
14
13
12
11
B OUT
B OUT
2
5
A OUT
A OUT
4
16
D OUT
D OUT
17
C OUT
18
C OUT
ECL V
CC
C OUT
C OUT
D OUT
D OUT
VCC 2
C IN
N.C.
D IN
CMOS V
CC
3/93
Motorola, Inc. 1996
2–96
REV 5
MC10H352
AC PARAMETERS
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Propagation Delay (1) t
Rise Time (20% to 80%) t
Fall Time (80% to 20%) t
Maximum Operating Frequency f
(1) Propagation delay is measured on this circuit from VCC/2 on the input waveform to the 50% point on the output waveform.
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Outputs are terminated through
a 50–ohm resistor to VCC – 2.0 Vdc.
pd
r
f
max
0.4 1.9 0.4 2.0 0.4 2.1 ns
0.4 1.9 0.4 2.0 0.4 2.1 ns
0.4 1.9 0.4 2.0 0.4 2.1 ns
150 — 150 — 150 — MHz
DL122 — Rev 6
2–97 MOTOROLAMECL Data
MC10H352
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
S
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
–T–
VIEW S
S
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L–M
T
M
S
S
L–M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L–M
T
S
VIEW D–D
M
M
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
MOTOROLA MECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
2–98
MILLIMETERSINCHES
DL122 — Rev 6
–T–
SEATING
PLANE
OUTLINE DIMENSIONS
CERAMIC DIP PACKAGE
20
110
A
F
H
D
SEATING
PLANE
–A–
20
1
E
FG
11
B
C
G
D
20 PL
N
K
PLASTIC DIP PACKAGE
11
B
10
K
N
0.25 (0.010) T
J
M
L SUFFIX
CASE 732–03
ISSUE E
L
M
P SUFFIX
CASE 738–03
ISSUE E
C
M
A
L
J 20 PL
0.25 (0.010) T
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
INCHES
DIM MIN MAX
A 0.940 0.990
B 0.260 0.295
C 0.150 0.200
D 0.015 0.022
F 0.055 0.065
G 0.100 BSC
H 0.020 0.050
J 0.008 0.012
K 0.125 0.160
L 0.300 BSC
M 0 15
__
N 0.010 0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
DIM MIN MAX MIN MAX
A 25.66 27.171.010 1.070
B 6.10 6.600.240 0.260
C 3.81 4.570.150 0.180
D 0.39 0.550.015 0.022
M
M
B
E
F
G 2.54 BSC0.100 BSC
J 0.21 0.380.008 0.015
K 2.80 3.550.110 0.140
L 7.62 BSC0.300 BSC
M
M 0 15 0 15
N 0.51 1.010.020 0.040
MC10H352
MILLIMETERSINCHES
1.27 BSC0.050 BSC
1.27 1.770.050 0.070
____
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Affirmative Action Employer.
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MC10H352/D
DL122 — Rev 6
◊
2–99 MOTOROLAMECL Data
*MC10H352/D*
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