SEMICONDUCTOR TECHNICAL DATA
The MC10H189 is a Hex Inverter with a common Enable input. The hex
inverting function is provided when Enable is in the low–state. When Enable is
in the high–state, all outputs are low.
This MECL 10H part is a functional/pinout duplication of the standard MECL
10K family part, with 100% improvement in propagation delay and no increase
in power–supply current.
• Propagation Delay, 1.3 ns Typical Data–to–Output
• Power Dissipation 180 mW Typ/Pkg (No Load)
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V
Input Voltage (VCC = 0) V
Output Current— Continuous
— Surge
Operating Temperature Range T
Storage Temperature Range— Plastic
— Ceramic
T
I
EE
I
out
A
stg
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current I
Input Current High I
Input Current Low I
High Output Voltage V
Low Output Voltage V
High Input Voltage V
Low Input Voltage V
E
inH
inL
OH
OL
IH
— 46 — 42 — 46 mA
— 495 — 310 — 310 µA
0.5 — 0.5 — 0.3 — µA
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
IL
AC PARAMETERS
Propagation Delay
Enable
Data
Rise Time t
Fall Time t
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed
circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.
t
pd
0.7
2.2
1.9
0.7
0.7
0.7
0.7 2.4 0.7 2.4 0.7 2.4 ns
r
0.7 2.4 0.7 2.4 0.7 2.4 ns
f
–8.0 to 0 Vdc
0 to V
EE
50
100
0 to +75 °C
–55 to +150
–55 to +165
2.2
0.7
1.9
0.7
Vdc
mA
°C
°C
2.3
1.9
ns
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
LOGIC DIAGRAM
X
9
Y
5
6
7
10
11
12
V
= Pin 1
CC1
V
= Pin 16
CC2
VEE = Pin 8
PIN ASSIGNMENT
V
A
OUT
B
OUT
C
OUT
CC1
A
B
C
V
EE
1
2
3
4
5
IN
6
IN
7
IN
8
OUT
TRUTH TABLE
Inputs Output
X Y OUT
L
L
H
H
DIP
16
15
14
13
12
11
10
9
L
H
L
H
2
3
4
13
14
15
H
L
L
L
V
CC2
F
OUT
E
OUT
D
OUT
F
IN
E
IN
D
IN
COMMON
9/96
Motorola, Inc. 1996
2–287
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
REV 6
MC10H189
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
S
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
–T–
VIEW S
S
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L–M
T
M
S
S
L–M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L–M
T
S
VIEW D–D
M
M
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
MOTOROLA MECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
2–288
MILLIMETERSINCHES
DL122 — Rev 6
OUTLINE DIMENSIONS
CERAMIC DIP PACKAGE
–A–
16 9
–B–
18
C
–T–
SEATING
PLANE
E
F
G
16 PLD
0.25 (0.010) T
M
–A–
916
B
18
F
C
S
H
G
D
16 PL
0.25 (0.010) T
K
M
K
N
S
A
PLASTIC DIP PACKAGE
SEATING
–T–
PLANE
M
A
L SUFFIX
CASE 620–10
ISSUE V
L
M
16 PLJ
0.25 (0.010) T
P SUFFIX
CASE 648–08
ISSUE R
L
J
MC10H189
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
M
S
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
M
L 0.300 BSC 7.62 BSC
M 0 15 0 15
____
N 0.020 0.040 0.51 1.01
Y14.5M, 1982.
FORMED PARALLEL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
MILLIMETERSINCHES
____
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Affirmative Action Employer.
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MC10H189/D
DL122 — Rev 6
◊
2–289 MOTOROLAMECL Data
*MC10H189/D*
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