MOTOROLA MC10H188P, MC10H188MEL, MC10H188ML1, MC10H188ML2, MC10H188MR1 Datasheet



SEMICONDUCTOR TECHNICAL DATA

2–284

REV 5

 Motorola, Inc. 1996

3/93

   

The MC10H188 is a high–speed Hex Buffer with a common Enable input.
When Enable is in the high–state, all outputs are in the low–state. When Enable
is in the low–state, the outputs take the same state as the inputs.

This MECL 10H part is a functional/pinout duplication of the standard MECL
10K family part, with 100% improvement in propagation delay and no increase
in power–supply current.

• Propagation Delay, 1.3 ns Typical Data–to–Output

• Power Dissipation 180 mW Typ/Pkg (No Load)

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 0) V

EE

–8.0 to 0 Vdc

Input Voltage (VCC = 0) V

I

0 to V

EE

Vdc

Output Current— Continuous

— Surge

I

out

50

100

mA

Operating Temperature Range T

A

0 to +75 °C

Storage Temperature Range— Plastic

— Ceramic

T

stg

–55 to +150
–55 to +165

°C
°C

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I

E

— 46 — 42 — 46 mA

Input Current High I

inH

— 495 — 310 — 310 µA

Input Current Low I

inL

0.5 — 0.5 — 0.3 — µA

High Output Voltage V

OH

–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc

Low Output Voltage V

OL

–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc

High Input Voltage V

IH

–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc

Low Input Voltage V

IL

–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

AC PARAMETERS

Propagation Delay

Enable
Data

t

pd

0.7

0.7

2.2

1.9

0.7

0.7

2.2

1.9

0.7

0.7

2.2

1.9

ns

Rise Time t

r

0.7 2.4 0.7 2.4 0.7 2.4 ns

Fall Time t

f

0.7 2.4 0.7 2.4 0.7 2.4 ns

NOTE:

Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a
50–ohm resistor to –2.0 volts.

X Y OUT

Inputs Output



LOGIC DIAGRAM

DIP

PIN ASSIGNMENT

V

CC1

A

OUT

B

OUT

C

OUT

A

IN

B

IN

C

IN

V

EE

V

CC2

F

OUT

E

OUT

D

OUT

F

IN

E

IN

D

IN

COMMON

16
15
14
13
12
11
10

9

1
2
3
4
5
6
7
8

V

CC1

= Pin 1

V

CC2

= Pin 16

VEE = Pin 8

TRUTH TABLE

12

15

11

14

10

13

7

4

6

3

5

2

9

X
Y

OUT

L
L
H
H

L
H
L
H

L
H
L
L

L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

Book (DL122/D).

MC10H188

2–285 MOTOROLAMECL Data

DL122 — Rev 6

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

–M–

–N–

–L–

Y BRK

W

V

D

D

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

X

G1

B

U

Z

VIEW D–D

20 1

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

C

G

VIEW S

E

J

R

Z

A

0.004 (0.100)

–T–

SEATING
PLANE

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

H

VIEW S

K

K1

F

G1

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79

F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

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