Motorola MC10H188L, MC10H188FN Datasheet



SEMICONDUCTOR TECHNICAL DATA

   

The MC10H188 is a high–speed Hex Buffer with a common Enable input.
When Enable is in the high–state, all outputs are in the low–state. When Enable
is in the low–state, the outputs take the same state as the inputs.

This MECL 10H part is a functional/pinout duplication of the standard MECL
10K family part, with 100% improvement in propagation delay and no increase
in power–supply current.

• Propagation Delay, 1.3 ns Typical Data–to–Output

• Power Dissipation 180 mW Typ/Pkg (No Load)

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 0) V
Input Voltage (VCC = 0) V
Output Current— Continuous

— Surge
Operating Temperature Range T
Storage Temperature Range— Plastic

— Ceramic

T

I

EE

I

out

A

stg

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I
Input Current High I
Input Current Low I
High Output Voltage V
Low Output Voltage V
High Input Voltage V
Low Input Voltage V

E

inH

inL

OH
OL

IH

— 46 — 42 — 46 mA
— 495 — 310 — 310 µA

0.5 — 0.5 — 0.3 — µA
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

IL

AC PARAMETERS

Propagation Delay

Enable

Data
Rise Time t
Fall Time t

NOTE:

Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a
50–ohm resistor to –2.0 volts.

t

pd

0.7

2.2

1.9

0.7

0.7

0.7

0.7 2.4 0.7 2.4 0.7 2.4 ns

r

0.7 2.4 0.7 2.4 0.7 2.4 ns

f

–8.0 to 0 Vdc
0 to V

EE

50

100

0 to +75 °C

–55 to +150
–55 to +165

2.2

0.7

1.9

0.7

Vdc

mA

°C
°C

2.2

1.9

ns



L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

FN SUFFIX

CASE 775–02

LOGIC DIAGRAM

X

9

Y

5

6

7

10

11

12

TRUTH TABLE

Inputs Output

V

= Pin 1

CC1

V

= Pin 16

CC2

VEE = Pin 8

PIN ASSIGNMENT

V

CC1

A

OUT

B

OUT

C

OUT

A

IN

B

IN

C

IN

V

EE

DIP

1
2
3
4
5
6
7
8

X Y OUT
L

L
H
H

16

15

14

13

12

11

10

9

PLCC

OUT

L

H

L

H

2

3

4

13

14

15

L

H

L
L

V

CC2

F

OUT

E

OUT

D

OUT

F

IN

E

IN

D

IN

COMMON

3/93

 Motorola, Inc. 1996

2–284

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

Book (DL122/D).

REV 5

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

MC10H188

–L–

20 1

Z

C

G

G1

0.010 (0.250) N

S

T

–N–

L–M

S

Y BRK

–M–

W

V

A

0.007 (0.180) N

0.007 (0.180) N

R

E

0.004 (0.100)

J

PLANE

SEATING

–T–

VIEW S

S

0.007 (0.180) N

B

0.007 (0.180) N

U

M

S

L–M

T

M

S

S

L–M

T

S

D

Z

D

X

0.010 (0.250) N

G1

S

S

L–M

T

S

VIEW D–D

M

M

S

L–M

T

L–M

T

S

S

S

0.007 (0.180) N

H

M

S

L–M

T

S

K1

K

0.007 (0.180) N

F

M

S

L–M

T

S

VIEW S

DL122 — Rev 6

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

2–285 MOTOROLAMECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79

F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

MILLIMETERSINCHES