SEMICONDUCTOR TECHNICAL DATA
2–249
REV 5
Motorola, Inc. 1996
3/93
The MC10H161 provides parallel decoding of a three bit binary word to one
of eight lines. The MC10H161 is useful in high–speed multiplexer/demultiplexer
applications.
The MC10H161 is designed to decode a three bit input word to one of eight
output lines. The MC10H161 output will be low when selected while all other
output are high. The enable inputs, when either or both are high, force all
outputs high.
The MC10H161 is a true parallel decoder. This eliminates unequal parallel
path delay times found in other decoder designs. These devices are ideally
suited for multiplexer/demultiplexer applications.
• Propagation Delay, 1.0 ns Typical
• Power Dissipation, 315 mW Typical (same as MECL 10K)
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V
EE
–8.0 to 0 Vdc
Input Voltage (VCC = 0) V
I
0 to V
EE
Vdc
Output Current— Continuous
— Surge
I
out
50
100
mA
Operating Temperature Range T
A
0 to +75 °C
Storage Temperature Range— Plastic
— Ceramic
T
stg
–55 to +150
–55 to +165
°C
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current I
E
— 84 — 76 — 84 mA
Input Current High I
inH
— 465 — 275 — 275 µA
Input Current Low I
inL
0.5 — 0.5 — 0.3 — µA
High Output Voltage V
OH
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
Low Output Voltage V
OL
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
High Input Voltage V
IH
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
Low Input Voltage V
IL
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
AC PARAMETERS
Propagation Delay
Data
Enable
t
pd
0.6
0.8
2.0
2.3
0.65
0.8
2.1
2.4
0.7
0.9
2.2
2.5
ns
Rise Time t
r
0.55 1.7 0.65 1.8 0.7 1.9 ns
Fall Time t
f
0.55 1.7 0.65 1.8 0.7 1.9 ns
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.
LOGIC DIAGRAM
DIP
PIN ASSIGNMENT
V
CC1
E0
Q3
Q2
Q1
Q0
A
V
EE
V
CC2
E1
C
Q4
Q5
Q6
Q7
B
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
V
CC1
= Pin 1
V
CC2
= Pin 16
VEE= Pin 8
E02
E115
A7
B9
C14
6Q0
5Q1
4Q2
3Q3
13 Q4
12 Q5
11 Q6
10 Q7
H
H
H
H
L
H
H
H
H
H
L
L
L
L
L
L
L
L
X
H
TRUTH TABLE
ENABLE
INPUTS
INPUTS OUTPUTS
L
L
L
L
L
L
L
L
H
X
L
L
L
L
H
H
H
H
X
X
L
L
H
H
L
L
H
H
X
X
L
H
L
H
L
H
L
H
X
X
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
Q4E0E1 C B A Q0 Q1 Q2 Q3 Q5 Q6 Q7
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
MC10H161
MOTOROLA MECL Data
DL122 — Rev 6
2–250
D
out
D
out
D
out
D
out
D
out
D
out
ABC
E
MC10H164
ABC
E
MC10H164
D
out
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
ABC
E
MC10H164
FIGURE 2 — 1–OF–64 LINE MULTIPLEXER
FIGURE 1 — HIGH SPEED 16–BIT MULTIPLEXER/DEMULTIPLEXER
TYPICAL APPLICATIONS
The Bit chosen is dependent on six–bit
code present on inputs 7, 9, 14 of the
MC10H161 and the A, B, C inputs of the
MC10H164.
MC10H161
D
out
ABC
MSB
LSB
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
14
9
7
E
MC10H164
MC10H161
E1
C
B
A
MC10H136
MC10H161
S0
S1
C
R
ABCD
E
1
C
B
A
E
0
MC10H164
765432
1
0
E
1
C
B
A
D0
Control Selection
MC10H136
MC10H164
S0
S1
C
R
ABCD
15 14 13 12 11 10 9 8
76543210
E1
C
B
A
D0
Start/Stop
S0
15 141312 11 10 9 8
E0
S1
C
R
MC10H161
2–251 MOTOROLAMECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
X
G1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING
PLANE
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
MC10H161
MOTOROLA MECL Data
DL122 — Rev 6
2–252
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING
PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01
____
16 9
18
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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MC10H161/D
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