SEMICONDUCTOR TECHNICAL DATA
2–233
REV 5
Motorola, Inc. 1996
3/93
The MC10H145 is a 16 x 4 bit register file. The active-low chip select allows
easy expansion.
The operating mode of the register file is controlled by the WE
input. When
WE
is “low” the device is in the write mode, the outputs are “low” and the data
present at Dn input is stored at the selected address, when WE
is “high,” the
device is in the read mode — the data state at the selected location is present
at the Qn outputs.
• Address Access Time, 4.5 ns Typical
• Power Dissipation, 700 mW Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K-Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V
EE
–8.0 to 0 Vdc
Input Voltage (VCC = 0) V
I
0 to V
EE
Vdc
Output Current— Continuous
— Surge
I
out
50
100
mA
Operating Temperature Range T
A
0 to +75 °C
Storage Temperature Range— Plastic
— Ceramic
T
stg
–55 to +150
–55 to +165
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0° 25° 75°
Ch
aracteristic
Symbol
Min Max Min Max Min Max
Unit
Power Supply Current I
E
— 160 — 163 — 165 mA
Input Current High I
inH
— 375 — 220 — 220 µA
Input Current Low I
inL
0.5 — 0.5 — 0.3 — µA
High Output Voltage V
OH
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
Low Output Voltage V
OL
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
High Input Voltage V
IH
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
Low Input Voltage V
IL
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed
circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through
a 50-ohm resistor to –2.0 volts.
DIP
PIN ASSIGNMENT
Q1
Q0
CS
D1
D0
A3
A2
V
EE
V
CC
Q2
Q3
WE
D3
D2
A0
A1
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
TRUTH TABLE
MODE INPUT OUTPUT
CS
WE D
n
Write “0” L
X
Q
n
Write “1”
Read
Disabled
L
L
H
LLL
H
X
X
L
LH
L
Q
Q-State of Addressed Cell
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
MC10H145
MOTOROLA MECL Data
DL122 — Rev 6
2–234
AC PARAMETERS
MC10H145
TA = 0 to +75°C,
VEE = –5.2 Vdc ±5%
Characteristics Symbol Min Max Unit Conditions
Read Mode
Chip Select Access Time
Chip Select Recovery Time
Address Access Time
t
ACS
t
RCS
t
AA
0
0
0
4.0
4.0
6.0
ns Measured from 50% of input to 50%
of output. See Note 2.
Write Mode
Write Pulse Width
Data Setup Time Prior to Write
Data Hold Time After Write
Address Setup Time Prior to Write
Address Hold Time After Write
Chip Select Setup Time Prior to Write
Chip Select Hold Time After Write
Write Disable Time
Write Recovery Time
t
W
t
WSD
t
WHD
t
WSA
t
WHA
t
WSCS
t
WHCS
t
WS
t
WR
6.0
0
1.5
3.5
1.5
0
1.5
1.0
1.0
—
—
—
—
—
—
—
4.0
4.0
ns t
WSA
= 3.5 ns
Measured at 50% of input to 50% of
output. tW = 6.0 ns.
Chip Enable Strobe Mode
Data Setup Prior to Chip Select
Write Enable Setup Prior to Chip Select
Address Setup Prior to Chip Select
Data Hold Time After Chip Select
Write Enable Hold Time After Chip Select
Address Hold Time After Chip Select
Chip Select Minimum Pulse Width
t
CSD
t
CSW
t
CSA
t
CHD
t
CHW
t
CHA
t
CS
0
0
0
1.0
0
2.0
4.0
—
—
—
—
—
—
—
ns Guaranteed but not tested on
standard product. See Figure 1.
Rise and Fall Time
Address to Output
CS to Output
tr, t
f
0.6
0.6
2.5
2.5
ns Measured between 20% and 80%
points.
Capacitance
Input Capacitance
Output Capacitance
C
in
C
out
—
—
6.0
8.0
pF Measured with a pulse technique.
NOTES: 1. T est circuit characteristics: RT = 50 Ω, MC10H145. CL p 5.0 pF (including jig and Stray Capacitance). Delay should be derated 30 ps/pF for
capacitive loads up to 50 pF.
2. The maximum Address Access Time is guaranteed to be the worst-case bit in the memory .
3. For proper use of MECL in a system environment, consult MECL System Design Handbook.
FIGURE 1 — CHIP ENABLE STROBE MODE
A
D
IN
WE
CS
T
CSA
T
CSW
T
CSD
T
CS
T
CHA
T
CHD
T
CHW
MC10H145
2–235 MOTOROLAMECL Data
DL122 — Rev 6
CSQ2Q1
BLOCK DIAGRAM
DATA
OUT
BUFFER
SENSE
16 X 4 MEMORY
CELL ARRAY
WRITE AND
DATA IN BUFFER
Address Buffer/
1/16 Decoder
2
Q0
5
D1
13
WE
10
9
7
6
A1
Q3
11514 3
DATA
OUT
BUFFER
DATA
OUT
BUFFER
DATA
OUT
BUFFER
SENSE SENSE SENSE
41112
D2 D3D0
A2
A3
A0
CHIP
SELECT
BUFFER
MC10H145
MOTOROLA MECL Data
DL122 — Rev 6
2–236
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
X
G1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING
PLANE
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
MC10H145
2–237 MOTOROLAMECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING
PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01
____
16 9
18
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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MC10H145/D
*MC10H145/D*
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