MOTOROLA MC10H135FN, MC10H135FNR2, MC10H135M, MC10H135ML1 Datasheet
SEMICONDUCTOR TECHNICAL DATA
2–89
REV 6
Motorola, Inc. 1996
9/96
The MC10H135 is a dual J–K master–slave flip–flop. The device is provided
with an asynchronous set(s) and reset(R). These set and reset inputs overide
the clock.
A common clock is provided with separate J
–K inputs. When the clock is
static, the JK
inputs do not effect the output. The output states of the flip flop
change on the positive transition of the clock.
• Propagation delay, 1.5 ns Typical • Improved Noise Margin 150
• Power Dissipation, 280 mW mV (Over Operating Voltage
Typical/Pkg. (No Load) and Temperature Range)
• f
tog
250 MHz Max• Voltage Compensated
• MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V
EE
–8.0 to 0 Vdc
Input Voltage (VCC = 0) V
I
0 to V
EE
Vdc
Output Current— Continuous
— Surge
I
out
50
100
mA
Operating Temperature Range T
A
0 to +75 °C
Storage Temperature Range— Plastic
— Ceramic
T
stg
–55 to +150
–55 to +165
°C
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current I
E
— 75 — 68 — 75 mA
Input Current High
Pins 6, 7, 10, 11
Pins 4, 5, 12, 13
Pin 9
I
inH
—
—
—
460
800
675
—
—
—
285
500
420
—
—
—
285
500
420
µA
Input Current Low Ii
nL
0.5 — 0.5 — 0.3 — µA
High Output Voltage V
OH
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
Low Output Voltage V
OL
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
High Input Voltage V
IH
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
Low Input Voltage V
IL
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
AC PARAMETERS
Propagation Delay
Set, Reset, Clock
t
pd
0.7 2.6 0.7 2.6 0.7 2.6 ns
Rise Time t
r
0.7 2.2 0.7 2.2 0.7 2.2 ns
Fall Time t
f
0.7 2.2 0.7 2.2 0.7 2.2 ns
Set–up Time t
set
1.5 — 1.5 — 1.5 — ns
Hold Time t
hold
1.0 — 1.0 — 1.0 — ns
Toggle Frequency f
tog
250 — 250 — 250 — MHz
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a
50–ohm resistor to –2.0 volts.
LOGIC DIAGRAM
DIP PIN ASSIGNMENT
V
CC1
Q1
Q
1
R1
S1
K
1
J
1
V
EE
V
CC2
Q2
Q2
R2
S2
K2
J2
C
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
V
CC1
= PIN 1
V
CC2
= PIN 16
VEE= PIN 8
S1 5
J
1 7
K
1 6
R1 4
C 9
S2 12
J2 10
K
2 11
R2 13
Q1
Q1
Q2
Q
2
2
3
15
14
N.D. = Not Defined
RS TRUTH TABLE
RSQ
n
+
1
L
L
L
H
L
H
Q
n
H
L
N.D.
H
H
*Output states change on
positive transition of clock
for J
–K input condition
present.
CLOCK J–K TRUTH TABLE*
J K Qn +
1
L
HLL
H
H
Q
n
L
H
Q
n
L
H
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
MC10H135
MOTOROLA MECL Data
DL122 — Rev 6
2–90
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
X
G1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING
PLANE
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
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