1
Motorola Small–Signal Transistors, FETs and Diodes Device Data
PNP Silicon
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector–Emitter Voltage V
CEO
–45 Vdc
Collector–Base Voltage V
CBO
–60 Vdc
Emitter–Base Voltage V
EBO
–5.0 Vdc
Collector Current — Continuous I
C
–800 mAdc
DEVICE MARKING
BCW68GLT1 = DH
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board
(1)
TA = 25°C
Derate above 25°C
P
D
225
1.8
mW
mW/°C
Thermal Resistance, Junction to Ambient R
θJA
556 °C/W
Total Device Dissipation
Alumina Substrate,
(2)
TA = 25°C
Derate above 25°C
P
D
300
2.4
mW
mW/°C
Thermal Resistance, Junction to Ambient R
θJA
417 °C/W
Junction and Storage Temperature TJ, T
stg
–55 to +150 °C
ELECTRICAL CHARACTERISTICS (T
A
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = –10 mAdc, IB = 0) V
(BR)CEO
–45 — — Vdc
Collector–Emitter Breakdown Voltage (IC = –10 µAdc, VEB = 0) V
(BR)CES
–60 — — Vdc
Emitter–Base Breakdown Voltage (IE = –10 µAdc, IC = 0) V
(BR)EBO
–5.0 — — Vdc
Collector Cutoff Current
(VCE= –45 Vdc, IE = 0)
(VCE= –45 Vdc, IB = 0, TA = 150°C)
I
CES
—
—
—
—
–20
–10
nAdc
µAdc
Emitter Cutoff Current (VEB = –4.0 Vdc, IC = 0) I
EBO
— — –20 nAdc
1. FR–5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina
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