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MITSUBISHI LSIs
M5M4V64S30ATP-8, -10, -12
64M (4-BANK x 2097152-WORD x 8-BIT) Synchronous DRAM
DESCRIPTION
The M5M4V64S30ATP is a 4-bank x 2097152-word x 8-bit
Synchronous DRAM, with LVTTL interface. All inputs and
outputs are referenced to the rising edge of CLK. The
M5M4V64S30ATP achieves very high speed data rate up to
125MHz, and is suitable for main memory or graphic memory
in computer systems.
FEATURES
- Single 3.3v±0.3v power supply
- Clock frequency 125MHz / 100MHz / 83MHz
- Fully synchronous operation referenced to clock rising edge
- 4 bank operation controlled by BA0, BA1 (Bank Address)
/WE: Write Enable
DQ0-7: Data I/O
DQM: Output Disable/ Write Mask
A0-11: Address Input
BA0,1: Bank Address
Vdd: Power Supply
VddQ: Power Supply for Output
Vss: Ground
VssQ: Ground for Output
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SDRAM (Rev.0.2)
Jan'97 Preliminary
MITSUBISHI LSIs
M5M4V64S30ATP-8, -10, -12
64M (4-BANK x 2097152-WORD x 8-BIT) Synchronous DRAM
BLOCK DIAGRAM
Memory Array
Bank #0
Mode
Register
Address Buffer
Memory Array
I/O Buffer
Bank #1
Control Circuitry
DQ0-7(0-3)
Memory Array
Bank #2
Memory Array
Bank #3
Control Signal Buffer
A0-11 BA0,1
Type Designation Code
M 5M 4 V 64 S 3 0 A TP - 8
MITSUBISHI ELECTRIC
Clock Buffer
CLK CKE
This rule is applied to only Synchronous DRAM family.
/CS /RAS /CAS /WE DQM
Cycle Time (min.) 8: 8ns, 10: 10ns, 12: 12ns
Package Type TP: TSOP(II)
Process Generation
Function 0: Random Column, 1: 2N-rule
Organization 2n 2: x4, 3: x8, 4: x16
Synchronous DRAM
Density 64:64M bits
Interface S: SSTL, V:LVTTL
Memory Style (DRAM)
Use, Recommended Operating Conditions, etc
Mitsubishi Main Designation
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SDRAM (Rev.0.2)
MITSUBISHI LSIs
Jan'97 Preliminary
M5M4V64S30ATP-8, -10, -12
64M (4-BANK x 2097152-WORD x 8-BIT) Synchronous DRAM
PIN FUNCTION
CLKInputMaster Clock: All other inputs are referenced to the rising edge of CLK.
Clock Enable: CKE controls internal clock. When CKE is low, internal clock
CKEInput
/CSInputChip Select: When /CS is high, any command means No Operation.
/RAS, /CAS, /WEInputCombination of /RAS, /CAS, /WE defines basic commands.
A0-11Input
for the following cycle is ceased. CKE is also used to select auto / self
refresh. After self refresh mode is started, CKE becomes asynchronous
input. Self refresh is maintained as long as CKE is low.
A0-11 specify the Row / Column Address in conjunction with BA0,1. The
Row Address is specified by A0-11. The Column Address is specified by
A0-9 (x4), A0-8 (x8). A10 is also used to indicate precharge option. When
A10 is high at a read / write command, an auto precharge is performed.
When A10 is high at a precharge command, all banks are precharged.
BA0,1Input
DQ0-7 (0-3)Input / OutputData In and Data out are referenced to the rising edge of CLK.
DQMInput
Vdd, VssPower SupplyPower Supply for the memory array and peripheral circuitry.
VddQ, VssQPower SupplyVddQ and VssQ are supplied to the Output Buffers only.
Bank Address: BA0,1 specifies one of four banks to which a command is
applied. BA0,1 must be set with ACT, PRE, READ, WRITE commands.
Din Mask / Output Disable: When DQM is high in burst write, Din for the
current cycle is masked. When DQM is high in burst read, Dout is disabled
at the next but one cycle.
MITSUBISHI ELECTRIC
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SDRAM (Rev.0.2)
MITSUBISHI LSIs
Jan'97 Preliminary
M5M4V64S30ATP-8, -10, -12
64M (4-BANK x 2097152-WORD x 8-BIT) Synchronous DRAM
BASIC FUNCTIONS
The M5M4V64S30ATP provides basic functions, bank (row) activate, burst read / write, bank (row)
precharge, and auto / self refresh.
Each command is defined by control signals of /RAS, /CAS and /WE at CLK rising edge. In addition to 3
signals, /CS ,CKE and A10 are used as chip select, refresh option, and precharge option, respectively.
To know the detailed definition of commands, please see the command truth table.
1. All entries assume that CKE was High during the preceding clock cycle and the current clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA, depending on the state of
that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state. May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
ILLEGAL = Device operation and/or data-integrity are not guaranteed.
MITSUBISHI ELECTRIC
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SDRAM (Rev.0.2)
Jan'97 Preliminary
64M (4-BANK x 2097152-WORD x 8-BIT) Synchronous DRAM
FUNCTION TRUTH TABLE for CKE
CKE
Current State
SELF-
REFRESH*1
POWER
DOWN
ALL BANKS
IDLE*2
ANY STATE
other than
listed above
CKE
n-1
HXXXXXXINVALID
LHHXXXXExit Self-Refresh (Idle after tRC)
LHLHHHXExit Self-Refresh (Idle after tRC)
LHLHHLXILLEGAL
LHLHLXXILLEGAL
LHLLXXXILLEGAL
LLXXXXXNOP (Maintain Self-Refresh)
HXXXXXXINVALID
LHXXXXXExit Power Down to Idle
LLXXXXXNOP (Maintain Self-Refresh)
HHXXXXXRefer to Function Truth Table
HLLLLHXEnter Self-Refresh
HLHXXXXEnter Power Down
HLLHHHXEnter Power Down
HLLHHLXILLEGAL
HLLHLXXILLEGAL
HLLLXXXILLEGAL
LXXXXXXRefer to Current State =Power Down
HHXXXXXRefer to Function Truth Table
HLXXXXXBegin CLK Suspend at Next Cycle*3
LHXXXXXExit CLK Suspend at Next Cycle*3
LLXXXXXMaintain CLK Suspend
/CS/RAS /CAS /WEAddAction
n
MITSUBISHI LSIs
M5M4V64S30ATP-8, -10, -12
ABBREVIATIONS:
H=High Level, L=Low Level, X=Don't Care
NOTES:
1. CKE Low to High transition will re-enable CLK and other inputsasynchronously. A minimum setup time must be
satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only from the All Banks Idle State.
3. Must be legal command.
MITSUBISHI ELECTRIC
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SDRAM (Rev.0.2)
Jan'97 Preliminary
64M (4-BANK x 2097152-WORD x 8-BIT) Synchronous DRAM
SIMPLIFIED STATE DIAGRAM
MITSUBISHI LSIs
M5M4V64S30ATP-8, -10, -12
SELF
REFRESH
REFS
REFSX
WRITE
SUSPEND
MODE
REGISTER
MRS
IDLE
REFA
SET
CKEL
CLK
SUSPEND
CKEH
ACT
POWER
CKEL
CKEH
ROW
ACTIVE
WRITEREAD
CKEL
WRITE
CKEH
WRITEAREADA
WRITEA
WRITE
WRITEA
READA
READ
READA
READ
AUTO
REFRESH
DOWN
CKEL
CKEH
READ
SUSPEND
WRITEA
SUSPEND
POWER
APPLIED
CKEL
CKEH
POWER
ON
WRITEA
PRE
PREPRE
PRE
PRE
CHARGE
MITSUBISHI ELECTRIC
READA
CKEL
READA
SUSPEND
CKEH
Automatic Sequence
Command Sequence
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SDRAM (Rev.0.2)
MITSUBISHI LSIs
Jan'97 Preliminary
M5M4V64S30ATP-8, -10, -12
64M (4-BANK x 2097152-WORD x 8-BIT) Synchronous DRAM
POWER ON SEQUENCE
Before starting normal operation, the following power on sequence is necessary to prevent a SDRAM
from damaged or malfunctioning.
1. Apply power and start clock. Attempt to maintain CKE high, DQM high and NOP condition at the inputs.
2. Maintain stable power, stable clock, and NOP input conditions for a minimum of 500µs.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
Burst Length, Burst Type and /CAS Latency can be programmed by
setting the mode register (MRS). The mode register stores these data
until the next MRS command, which may be issued when both banks
are inÅ@idle state. After tRSC from a MRS command, the SDRAM is
ready for new command.
64M (4-BANK x 2097152-WORD x 8-BIT) Synchronous DRAM
OPERATIONAL DESCRIPTION
BANK ACTIVATE
The SDRAM has four independent banks. Each bank is activated by the ACT command with the bank
addresses (BA0,1). A row is indicated by the row addresses A11-0. The minimum activation interval between one bank and the other bank is tRRD.Maximum 2 ACT commands are allowed within tRC, although
the number of banks which are active concurrently is not limited.
PRECHARGE
The PRE command deactivates the bank indicated by BA0,1. When multiple banks are active, the precharge
all command (PREA, PRE + A10=H) is available to deactivate them at the same time. After tRP from the
precharge, an ACT command to the same bank can be issued.
Bank Activation and Precharge All (BL=4, CL=3)
CLK
2 ACT command / tRCmin
tRCmin
Command
A0-9
A10
A11XaXbXb
BA0,1
DQ
READ
ACT
Xa
Xa
00
tRRD
tRCD
ACT
Xb
Xb
01
READ
Y
0
00
PRE
tRAStRP
1
Qa0Qa1Qa2 Qa3
Precharge all
ACT
Xb
Xb
01
After tRCD from the bank activation, a READ command can be issued. 1st output data is available after
the /CAS Latency from the READ, followed by (BL -1) consecutive data when the Burst Length is BL. The
start address is specified by A8-0 (x 8) / A9-0 (x 4), and the address sequence of burst data is defined by the
Burst Type. A READ command may be applied to any active bank, so the row precharge time (tRP) can be
hidden behind continuous output data by interleaving the multiple banks. When A10 is high at a READ
command, the auto-precharge (READA) is performed. Any command (READ, WRITE, PRE, ACT) to the
same bank is inhibited till the internal precharge is complete. The internal precharge starts at BL after
READA. The next ACT command can be issued after (BL + tRP) from the previous READA.
MITSUBISHI ELECTRIC
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SDRAM (Rev.0.2)
Jan'97 Preliminary
CLK
MITSUBISHI LSIs
M5M4V64S30ATP-8, -10, -12
64M (4-BANK x 2097152-WORD x 8-BIT) Synchronous DRAM
Multi Bank Interleaving READ (BL=4, CL=3)
Command
A0-9
A10
ACT
tRCD
Xa
Xa
A11XaXb
BA0,1
00
DQ
READ with Auto-Precharge (BL=4, CL=3)
CLK
Command
A0-9
A10
ACT
tRCDtRP
Xa
Xa
READ
Y
0
00
READ
Y
1
ACT
Xb
Xb
10
/CAS latency
BL
READ
PRE
Y
0
0
10
00
Qa0Qa1Qa2 Qa3Qb0Qb1 Qb2
Burst Length
BL + tRP
ACT
Xa
Xa
A11
BA0,1
DQ
CLK
Command
CL=3
CL=2
DQ
DQ
XaXa
00
00
Qa0 Qa1Qa2 Qa3
Internal precharge start
READ Auto-Precharge Timing (BL=4)
ACTREAD
BL
Qa1 Qa2Qa3Qa0
Qa1Qa2Qa3Qa0
Internal Precharge Start Timing
MITSUBISHI ELECTRIC
00
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