Mitsubishi Electric Corporation Semiconductor Group CM50E3U-24H Datasheet

MITSUBISHI IGBT MODULES
CM50E3U-24H
MEDIUM POWER SWITCHING USE
INSULA TED TYPE
TC Measured
Point
E
CM
D
C
3-M5 Nuts
O
R
C2E1
Outline Drawing and Circuit Diagram
Dimensions Inches Millimeters
A 3.7 94.0 B 3.15±0.01 80.0±0.25 C 1.89 48.0 D 0.94 24.0 E 0.28 7.0 F 0.67 17.0 G 0.91 23.0 H 0.91 23.0
J 0.43 11.0
L 0.16 4.0
GF
P PQ
E2
A B
H
J
E2 C1C2E1
G2 G2
L
2 - Mounting Holes (6.5 Dia.)
V
U
Description:
M
N
O
TAB#110 t=0.5
S
Mitsubishi IGBT Modules are de­signed for use in switching applica­tions. Each module consists of one IGBT having a reverse-connected super-fast recovery free-wheel di-
T
ode and an anode-collector con­nected super-fast recovery free­wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and
E2 G2
thermal management.
Features:
u Low Drive Power
C1
u Low V
CE(sat)
u Discrete Super-Fast Recovery
Free-Wheel Diode
u High Frequency Operation u Isolated Baseplate for Easy
Heat Sinking
Application:
Dimensions Inches Millimeters
M 0.47 12.0 N 0.53 13.5 O 0.1 2.5
P 0.63 16.0 Q 0.98 25.0 R 1.18 +0.04/-0.02 30.0 +1.0/-0.5
S 0.3 7.5
T 0.83 21.2 U 0.16 4.0
V 0.51 13.0
u Brake
Ordering Information:
Example: Select the complete module number you desire from the table - i.e. CM50E3U-24H is a 1200V (V
), 50 Ampere IGBT
CES
Module.
Current Rating V
Type Amperes Volts (x 50) CM 50 24
CES
Sep.1998
MITSUBISHI IGBT MODULES
CM50E3U-24H
MEDIUM POWER SWITCHING USE
INSULA TED TYPE
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified
Ratings Symbol CM50E3U-24H Units Junction T emperature T Storage T emperature T Collector-Emitter Voltage (G-E SHORT) V Gate-Emitter Voltage (C-E SHORT) V Collector Current (Tc = 25°C) I Peak Collector Current I Emitter Current** (Tc = 25°C) I Peak Emitter Current** I Maximum Collector Dissipation (Tc = 25°C, Tj 150°C) P
j
stg CES GES
C
CM
E
EM
c
Mounting Torque, M5 Main Terminal 2.5~3.5 N · m Mounting Torque, M6 Mounting 3.5~4.5 N · m Weight 310 Grams Isolation Voltage (Main Terminal to Baseplate, AC 1 min.) V
* Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed T **Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
iso
-40 to 150 °C
-40 to 125 °C 1200 Volts
±20 Volts
50 Amperes
100* Amperes
50 Amperes
100* Amperes
400 Watts
2500 Vrms
rating.
j(max)
Static Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units Collector-Cutoff Current I Gate Leakage Voltage I Gate-Emitter Threshold Voltage V Collector-Emitter Saturation Voltage V
CES GES
GE(th)
CE(sat)
VCE = V VGE = V
, VGE = 0V 1 mA
CES
, VCE = 0V 0.5 µA
GES
IC = 5mA, VCE = 10V 4.5 6 7.5 Volts
IC = 50A, VGE = 15V, Tj = 25°C 2.9 3.7 Volts
IC = 50A, VGE = 15V, Tj = 125°C 2.85 Volts Total Gate Charge Q Emitter-Collector Voltage** V Emitter-Collector Voltage V
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
G EC FM
VCC = 600V, IC = 50A, VGE = 15V 187 nC
IE = 50A, VGE = 0V 3.2 Volts
IF = 50A, Clamp Diode Part 3.2 Volts
Dynamic Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Resistive Turn-on Delay Time t Load Rise Time t Switch Turn-off Delay Time t Times Fall Time t Diode Reverse Recovery Time** t Diode Reverse Recovery Charge** Q Diode Reverse Recovery Time t Diode Reverse Recovery Charge Q
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
ies oes res
d(on)
r
d(off)
f
rr
rr
rr
rr
VCE = 10V, VGE = 0V 2.6 nF
VCC = 600V, IC = 50A, 80 ns
V
= V
GE1
GE2
RG = 6.3, Resistive 150 ns
Load Switching Operation 350 ns IE = 50A, diE/dt = -100A/µs 300 ns IE = 50A, diE/dt = -100A/µs 0.28 µC
IF = 50A, Clamp Diode Part, 300 ns
diF/dt = -100A/µs 0.28 µC
= 15V, 200 ns
7.5 nF
1.5 nF
Sep.1998
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