Microchip Technology Inc PIC16C62B-20I-SO, PIC16C62B-20I-SP, PIC16C72A-04I-SO, PIC16C72A-20-SO, PIC16C72A-20I-SO Datasheet

...
1998 Microchip Technology Inc.
Preliminary
DS35008A-page 1
Microcontroller Core Features:
• High-performance RISC CPU
• Only 35 single word instructions to learn
• All single cycle instructions except for program branches which are two cycle
• Operating speed: DC - 20 MHz clock input
DC - 200 ns instruction cycle
• 2K x 14 words of Program Memory, 128 x 8 bytes of Data Memory (RAM)
• Interrupt capability (up to 7 internal/external interrupt sources)
• Eight level deep hardware stack
• Direct, indirect, and relative addressing modes
• Power-on Reset (POR)
• Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
• Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation
• Brown-out detection circuitry for Brown-out Reset (BOR)
• Programmable code-protection
• Power saving SLEEP mode
• Selectable oscillator options
• Low-power, high-speed CMOS EPROM technology
• Fully static design
• In-Circuit Serial Programming 
• Wide operating voltage range: 2.5V to 5.5V
• High Sink/Source Current 25/25 mA
• Commercial, Industrial and Extended temperature ranges
• Low-power consumption:
- < 2 mA @ 5V, 4 MHz
- 22.5 µ A typical @ 3V, 32 kHz
- < 1 µ A typical standby current
Pin Diagram
Peripheral Features:
• Timer0: 8-bit timer/counter with 8-bit prescaler
• Timer1: 16-bit timer/counter with prescaler, can be incremented during sleep via external crystal/clock
• Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler
• Capture, Compare, PWM module
• Capture is 16-bit, max. resolution is 12.5 ns, Compare is 16-bit, max. resolution is 200 ns, PWM maximum resolution is 10-bit
• 8-bit multi-channel Analog-to-Digital converter
• Synchronous Serial Port (SSP) with Enhanced SPI
and I
2
C
PIC16C72A
MCLR/VPP
RA0/AN0 RA1/AN1 RA2/AN2
RA3/AN3/VREF
RA4/T0CKI
RA5/SS/AN4
V
SS
OSC1/CLKIN
OSC2/CLKOUT
RC0/T1OSO/T1CKI
RC1/T1OSI RC2/CCP1
RC3/SCK/SCL
RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0/INT VDD VSS RC7 RC6 RC5/SDO RC4/SDI/SDA
• 1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
SDIP, SOIC, SSOP, Windowed CERDIP
PIC16C62B/72A
28-Pin 8-Bit CMOS Microcontrollers
PIC16C62B/72A
DS35008A-page 2
Preliminary
1998 Microchip Technology Inc.
Pin Diagrams
PIC16C62B
MCLR/VPP
RA0 RA1 RA2 RA3
RA4/T0CKI
RA5/SS
VSS
OSC1/CLKIN
OSC2/CLKOUT
RC0/T1OSO/T1CKI
RC1/T1OSI
RC2/CCP1
RC3/SCK/SCL
RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0/INT VDD VSS RC7 RC6 RC5/SDO RC4/SDI/SDA
• 1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
SDIP, SOIC, SSOP, Windowed CERDIP
Key Features
PICmicro™ Mid-Range Reference Manual
(DS33023)
PIC16C62B PIC16C72A
Operating Frequency DC - 20 MHz DC - 20 MHz Resets (and Delays) POR, BOR (PWRT, OST) POR, BOR (PWRT, OST) Program Memory (14-bit words) 2K 2K Data Memory (bytes) 128 128 Interrupts 6 7 I/O Ports Ports A,B,C Ports A,B,C Timers 3 3 Capture/Compare/PWM modules 1 1 Serial Communications SSP SSP 8-bit Analog-to-Digital Module 5 input channels
PIC16C62B/72A
1998 Microchip Technology Inc.
Preliminary
DS35008A-page 3
Table of Contents
1.0 Device Overview....................................................................................................................................................5
2.0 Memory Organization............................................................................................................................................7
3.0 I/O Ports .............................................................................................................................................................. 19
4.0 Timer0 Module.....................................................................................................................................................25
5.0 Timer1 Module.....................................................................................................................................................27
6.0 Timer2 Module.....................................................................................................................................................31
7.0 Capture/Compare/PWM (CCP) Module(s)..........................................................................................................33
8.0 Synchronous Serial Port (SSP) Module .............................................................................................................. 39
9.0 Analog-to-Digital Converter (A/D) Module...........................................................................................................49
10.0 Special Features of the CPU...............................................................................................................................55
11.0 Instruction Set Summary .....................................................................................................................................69
12.0 Development Support..........................................................................................................................................71
13.0 Electrical Characteristics .....................................................................................................................................75
14.0 DC and AC Characteristics Graphs and Tables..................................................................................................95
15.0 Packaging Information.........................................................................................................................................97
Appendix A: Revision History.....................................................................................................................................103
Appendix B: Conversion Considerations...................................................................................................................103
Appendix C: Migration from Base-line to Mid-Range Devices...................................................................................104
Index ........................................................................................................................................................................... 105
On-Line Support.......................................................................................................................................................... 109
Reader Response.......................................................................................................................................................110
PIC16C62B/72A Product Identification System..........................................................................................................111
To Our Valued Customers
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please check our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its liter ature number found on the bottom outside corner of any page. The last character of the literature number is the version number. e.g., DS30000A is version A of document DS30000.
Errata
An errata sheet may exist for current devices, describing minor operational differences (from the data sheet) and recommended workarounds. As de vice/documentation issues become known to us , we will publish an err ata sheet. The err ata will specify the revi­sion of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip .com
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Corrections to this Data Sheet
We constantly strive to improve the quality of all our products and documentation. We have spent a great deal of time to ensure that this document is correct. However, w e realize that w e may have missed a fe w things . If you find any information that is missing or appears in error, please:
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PIC16C62B/72A
DS35008A-page 4
Preliminary
1998 Microchip Technology Inc.
NOTES:
PIC16C62B/72A
1998 Microchip Technology Inc.
Preliminary
DS35008A-page 5
1.0 DEVICE OVERVIEW
This document contains device-specific information. Additional information may be found in the PICmicro™ Mid-Range Reference Manual, (DS33023), which may be obtained from your local Microchip Sales Represen­tative or downloaded from the Microchip website. The Reference Manual should be considered a comple­mentary document to this data sheet, and is highly rec-
ommended reading for a better understanding of the device architecture and operation of the peripheral modules.
There are two devices (PIC16C62B, PIC16C72A) cov­ered by this datasheet. The PIC16C62B does not have the A/D module implemented.
Figure 1-1 is the block diagram for both devices. The pinouts are listed in Table 1-1.
FIGURE 1-1: PIC16C62B/PIC16C72A BLOCK DIAGRAM
EPROM
Program Memory
13
Data Bus
8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
RAM
File
Registers
Direct Addr
7
RAM Addr
(1)
9
Addr MUX
Indirect
Addr
FSR reg
STATUS reg
MUX
ALU
W reg
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
MCLR
VDD, VSS
PORTA
PORTB
PORTC
RB0/INT
RB7:RB1
RC0/T1OSO/T1CKI RC1/T1OSI RC2/CCP1 RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6 RC7
8
8
Brown-out
Reset
Note 1: Higher order bits are from the STATUS register.
2: The A/D module is not available on the PIC16C62B.
CCP1
Synchronous
A/D
(2)
Timer0 Timer1 Timer2
Serial Port
RA4/T0CKI RA5/SS
/AN4
(2)
RA3/AN3/VREF
(2)
RA2/AN2
(2)
RA1/AN1
(2)
RA0/AN0
(2)
8
3
2K x 14
128 x 8
PIC16C62B/72A
DS35008A-page 6
Preliminary
1998 Microchip Technology Inc.
TABLE 1-1 PIC16C62B/PIC16C72A PINOUT DESCRIPTION
Pin Name
DIP
Pin#
SOIC
Pin#
I/O/P Type
Buffer
Type
Description
OSC1/CLKIN 9 9 I
ST/CMOS
(3)
Oscillator crystal input/external clock source input.
OSC2/CLKOUT 10 10 O Oscillator crystal output. Connects to crystal or resonator in
crystal oscillator mode. In RC mode, the OSC2 pin outputs CLKOUT which has 1/4 the frequency of OSC1, and denotes the instruction cycle rate.
MCLR
/V
PP
1 1 I/P ST Master clear (reset) input or programming voltage input. This
pin is an active low reset to the device. PORTA is a bi-directional I/O port.
RA0/AN0
(4)
2 2 I/O TTL RA0 can also be analog input0
RA1/AN1
(4)
3 3 I/O TTL RA1 can also be analog input1
RA2/AN2
(4)
4 4 I/O TTL RA2 can also be analog input2
RA3/AN3/V
REF
(4)
5 5 I/O TTL RA3 can also be analog input3 or analog reference voltage
RA4/T0CKI 6 6 I/O ST RA4 can also be the clock input to the Timer0 module.
Output is open drain type.
RA5/SS/AN4
(4)
7 7 I/O TTL RA5 can also be analog input4 or the slave select for the
synchronous serial port.
PORTB is a bi-directional I/O port. PORTB can be software programmed for internal weak pull-up on all inputs.
RB0/INT 21 21 I/O TTL/ST
(1)
RB0 can also be the external interrupt pin. RB1 22 22 I/O TTL RB2 23 23 I/O TTL RB3 24 24 I/O TTL RB4 25 25 I/O TTL Interrupt on change pin. RB5 26 26 I/O TTL Interrupt on change pin. RB6 27 27 I/O TTL/ST
(2)
Interrupt on change pin. Serial programming clock. RB7 28 28 I/O TTL/ST
(2)
Interrupt on change pin. Serial programming data.
PORTC is a bi-directional I/O port.
RC0/T1OSO/T1CKI 11 11 I/O ST RC0 can also be the Timer1 oscillator output or Timer1
clock input. RC1/T1OSI 12 12 I/O ST RC1 can also be the Timer1 oscillator input. RC2/CCP1 13 13 I/O ST RC2 can also be the Capture1 input/Compare1 out-
put/PWM1 output. RC3/SCK/SCL 14 14 I/O ST RC3 can also be the synchronous serial clock input/output
for both SPI and I
2
C modes.
RC4/SDI/SDA 15 15 I/O ST RC4 can also be the SPI Data In (SPI mode) or
data I/O (I
2
C mode). RC5/SDO 16 16 I/O ST RC5 can also be the SPI Data Out (SPI mode). RC6 17 17 I/O ST RC7 18 18 I/O ST V
SS
8, 19 8, 19 P Ground reference for logic and I/O pins.
V
DD
20 20 P Positive supply for logic and I/O pins.
Legend: I = input O = output I/O = input/output P = power
— = Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt.
2: This buffer is a Schmitt Trigger input when used in serial programming mode. 3: This buffer is a Schmitt Trigger input when configured in RC oscillator mode and a CMOS input otherwise. 4: The A/D module is not available on the PIC16C62B.
PIC16C62B/72A
1998 Microchip Technology Inc.
Preliminary
DS35008A-page 7
2.0 MEMORY ORGANIZATION
There are two memory blocks in each of these PICmicros. Each block (Program Memory and Data Memory) has its own bus so that concurrent access can occur.
Additional information on device memory may be found in the PICmicro  Mid-Range Reference Manual, (DS33023).
2.1 Pr
ogram Memory Organization
The PIC16C62B/72A PICmicros have a 13-bit program counter capable of addressing an 8K x 14 program memory space. Each device has 2K x 14 w ords of pro­gram memory. Accessing a location above the physi­cally implemented address will cause a wraparound.
The reset vector is at 0000h and the interrupt vector is at 0004h.
FIGURE 2-1: PROGRAM MEMORY MAP
AND STACK
PC<12:0>
13
0000h
0004h 0005h
07FFh 0800h
1FFFh
Stack Level 1
Stack Level 8
Reset V ector
Interrupt Vector
On-chip Program
Memory
CALL, RETURN RETFIE, RETLW
User Memory
Space
PIC16C62B/72A
DS35008A-page 8
Preliminary
1998 Microchip Technology Inc.
2.2 Data Memory Organization
The data memory is partitioned into multiple banks which contain the General Purpose Registers and the Special Function Registers. Bits RP1 and RP0 are the bank select bits.
= 00 → Bank0 = 01 → Bank1 = 10 → Bank2 (not implemented) = 11 → Bank3 (not implemented)
Each bank extends up to 7Fh (128 bytes). The lower locations of each bank are reserved for the Special Function Registers. Abo ve the Special Function Regis­ters are General Purpose Registers, implemented as static RAM. All implemented banks contain special function registers. Some “high use” special function registers from one bank may be mirrored in another bank for code reduction and quicker access.
2.2.1 GENERAL PURPOSE REGISTER FILE The register file can be accessed either directly , or indi-
rectly through the File Select Register FSR (Section 2.5).
FIGURE 2-2: REGISTER FILE MAP
RP1
(1)
RP0 (STATUS<6:5>)
Note 1: Maintain this bit clear to ensure upward compati-
bility with future products.
Unimplemented data memory locations,
read as '0'.
Note 1: Not a physical register.
2: These registers are not implemented on the
PIC16C62B, read as '0'.
File
Address
File
Address
00h INDF
(1)
INDF
(1)
80h
01h TMR0
OPTION_REG
81h 02h PCL PCL 82h 03h STATUS STATUS 83h 04h FSR FSR 84h 05h PORTA TRISA 85h 06h PORTB TRISB 86h 07h PORTC TRISC 87h 08h 88h 09h 89h
0Ah PCLATH PCLATH 8Ah 0Bh INTCON INTCON 8Bh 0Ch PIR1 PIE1 8Ch 0Dh
8Dh
0Eh TMR1L PCON 8Eh 0Fh TRM1H 8Fh
10h T1CON 90h 11h TRM2 91h 12h T2CON PR2 92h 13h SSPBUF SSPADD 93h 14h SSPCON SSPSTAT 94h 15h CCPR1L 95h 16h CCPR1H 96h 17h CCP1CON 97h 18h 98h 19h 99h
1Ah 9Ah 1Bh 9Bh 1Ch 9Ch 1Dh 9Dh 1Eh ADRES
(2)
9Eh
1Fh ADCON0
(2)
ADCON1
(2)
9Fh 20h
General
Purpose
Registers
General
Purpose
Registers
A0h
BFh
C0h
7Fh FFh
Bank 0 Bank 1
PIC16C62B/72A
1998 Microchip Technology Inc.
Preliminary
DS35008A-page 9
2.2.2 SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by
the CPU and Peripheral Modules for controlling the desired operation of the device. These registers are implemented as static RAM. A list of these registers is give in Table 2-1.
The special function registers can be classified into two sets; core (CPU) and peripheral. Those registers asso­ciated with the core functions are described in detail in this section. Those related to the operation of the peripheral features are described in detail in that peripheral feature section.
TABLE 2-1 SPECIAL FUNCTION REGISTER SUMMARY
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all other resets
(4)
Bank 0
00h INDF
(1)
Addressing this location uses contents of FSR to address data memory (not a physical register)
0000 0000 0000 0000
01h TMR0 Timer0 module’s register
xxxx xxxx uuuu uuuu
02h PCL
(1)
Program Counter's (PC) Least Significant Byte
0000 0000 0000 0000
03h STATUS
(1)
IRP
(5)
RP1
(5)
RP0 T
O PD ZDCC
rr01 1xxx rr0q quuu
04h FSR
(1)
Indirect data memory address pointer
xxxx xxxx uuuu uuuu
05h PORTA
(6)
PORTA Data Latch when written: PORTA pins when read
--0x 0000 --0u 0000
06h PORTB
(7)
PORTB Data Latch when written: PORTB pins when read
xxxx xxxx uuuu uuuu
07h PORTC
(7)
PORTC Data Latch when written: PORTC pins when read xxxx xxxx uuuu uuuu 08h-09h Unimplemented — 0Ah PCLATH
(1,2)
Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
0Bh INTCON
(1)
GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 ADIF
(3)
SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000 0Dh Unimplemented — 0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu 0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu 10h T1CON T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu 11h TMR2 Timer2 module’s register 0000 0000 0000 0000 12h T2CON TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000 13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu 14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000 15h CCPR1L Capture/Compare/PWM Register1 (LSB) xxxx xxxx uuuu uuuu 16h CCPR1H Capture/Compare/PWM Register1 (MSB) xxxx xxxx uuuu uuuu 17h CCP1CON CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000 18h-1Dh Unimplemented — 1Eh ADRES
(3)
A/D Result Register xxxx xxxx uuuu uuuu
1Fh ADCON0
(3)
ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE ADON 0000 00-0 0000 00-0
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as '0',
Shaded locations are unimplemented, read as '0'.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for PC<12:8> whose contents
are transferred to the upper byte of the program counter.
3: A/D not implemented on the PIC16C62B, maintain as ’0’. 4: Other (non power-up) resets include: external reset through MCLR and the Watchdog Timer Reset. 5: The IRP and RP1 bits are reserved. Always maintain these bits clear. 6: On any device reset, these pins are configured as inputs. 7: This is the value that will be in the port output latch.
PIC16C62B/72A
DS35008A-page 10 Preliminary 1998 Microchip Technology Inc.
Bank 1
80h INDF
(1)
Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
81h
OPTION_ REG
RBPU
INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
82h PCL
(1)
Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
83h STATUS
(1)
IRP
(5)
RP1
(5)
RP0 TO PD ZDCCrr01 1xxx rr0q quuu
84h FSR
(1)
Indirect data memory address pointer xxxx xxxx uuuu uuuu 85h TRISA PORTA Data Direction Register --11 1111 --11 1111 86h TRISB PORTB Data Direction Register 1111 1111 1111 1111 87h TRISC PORTC Data Direction Register 1111 1111 1111 1111 88h-89h Unimplemented — 8Ah PCLATH
(1,2)
Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
8Bh INTCON
(1)
GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
8Ch PIE1 ADIE
(3)
SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000 8Dh Unimplemented — 8Eh PCON POR BOR ---- --qq ---- --uu 8Fh-91h Unimplemented — 92h PR2 Timer2 Period Register 1111 1111 1111 1111 93h SSPADD Synchronous Serial Port (I2C mode) Address Register 0000 0000 0000 0000 94h SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000 95h-9Eh Unimplemented — 9Fh ADCON1
(3)
PCFG2 PCFG1 PCFG0 ---- -000 ---- -000
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as '0',
Shaded locations are unimplemented, read as '0'.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for PC<12:8> whose contents
are transferred to the upper byte of the program counter.
3: A/D not implemented on the PIC16C62B, maintain as ’0’. 4: Other (non power-up) resets include: external reset through MCLR and the Watchdog Timer Reset. 5: The IRP and RP1 bits are reserved. Always maintain these bits clear. 6: On any device reset, these pins are configured as inputs. 7: This is the value that will be in the port output latch.
TABLE 2-1 SPECIAL FUNCTION REGISTER SUMMARY (Cont.’d)
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all
other resets
(4)
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 11
2.2.2.1 STATUS REGISTER The STATUS register, shown in Figure 2-3, contains
the arithmetic status of the ALU, the RESET status and the bank select bits for data memory.
The STATUS register can be the destination for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the T
O and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended.
For example, CLRF STATUS will clear the upper-three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged).
It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register because these instructions do not affect the Z, C or DC bits from the STATUS register. For other instructions, not affecting any status bits, see the "Instruction Set Summary."
FIGURE 2-3: STATUS REGISTER (ADDRESS 03h, 83h)
Note 1: These devices do not use bits IRP and
RP1 (STATUS<7:6>). Maintain these bits clear to ensure upward compatibility with future products.
Note 2: The C and DC bits operate as a borro
w and digit borrow bit, respectively, in sub­traction. See the SUBLW and SUBWF instructions for examples.
R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x
IRP RP1 RP0 TO PD Z DC C R = Readable bit
W = Writable bit U = Unimplemented bit, read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: IRP: Register Bank Select bit (used for indirect addressing)
1 = Bank 2, 3 (100h - 1FFh) - not implemented, maintain clear 0 = Bank 0, 1 (00h - FFh) - not implemented, maintain clear
bit 6-5: RP1:RP0: Register Bank Select bits (used for direct addressing)
01 = Bank 1 (80h - FFh) 00 = Bank 0 (00h - 7Fh)
Each bank is 128 bytes Note: RP1 = not implemented, maintain clear
bit 4: T
O: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred
bit 3: PD
: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction
bit 2: Z: Zero bit
1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero
bit 1: DC: Digit carry/borro
w bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) (for borrow the polarity is reversed) 1 = A carry-out from the 4th low order bit of the result occurred 0 = No carry-out from the 4th low order bit of the result
bit 0: C: Carry/borro
w bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) 1 = A carry-out from the most significant bit of the result occurred 0 = No carry-out from the most significant bit of the result occurred Note: F or borro
w the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low order bit of the source register.
PIC16C62B/72A
DS35008A-page 12 Preliminary 1998 Microchip Technology Inc.
2.2.2.2 OPTION_REG REGISTER The OPTION_REG register is a readable and writable
register which contains various control bits to configure the TMR0 prescaler/WDT postscaler (single assign­able register known also as the prescaler), the External INT Interrupt, TMR0, and the weak pull-ups on PORTB .
FIGURE 2-4: OPTION_REG REGISTER (ADDRESS 81h)
Note: To achieve a 1:1 prescaler assignment for
the TMR0 register, assign the prescaler to the Watchdog Timer .
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 R = Readable bit
W = Writable bit U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: RBPU: PORTB Pull-up Enable bit
1 = PORTB pull-ups are disabled 0 = PORTB pull-ups are enabled by individual port latch values
bit 6: INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of RB0/INT pin 0 = Interrupt on falling edge of RB0/INT pin
bit 5: T0CS: TMR0 Clock Source Select bit
1 = Transition on RA4/T0CKI pin 0 = Internal instruction cycle clock (CLKOUT)
bit 4: T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on RA4/T0CKI pin 0 = Increment on low-to-high transition on RA4/T0CKI pin
bit 3: PSA: Prescaler Assignment bit
1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module
bit 2-0: PS2:PS0: Prescaler Rate Select bits
000 001 010 011 100 101 110 111
1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256
1 : 1 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128
Bit Value TMR0 Rate WDT Rate
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 13
2.2.2.3 INTCON REGISTER The INTCON Register is a readable and writable regis-
ter which contains various enable and flag bits for the TMR0 register overflow, RB Port change and External RB0/INT pin interrupts.
FIGURE 2-5: INTCON REGISTER (ADDRESS 0Bh, 8Bh)
Note: Interrupt flag bits get set when an interrupt
condition occurs regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User soft­ware should ensure the appropriate inter­rupt flag bits are clear prior to enabling an interrupt.
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x
GIE PEIE T0IE INTE RBIE T0IF INTF RBIF R = Readable bit
W = Writable bit U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: GIE: Global Interrupt Enable bit
1 = Enables all un-masked interrupts 0 = Disables all interrupts
bit 6: PEIE: Peripheral Interrupt Enable bit
1 = Enables all un-masked peripheral interrupts 0 = Disables all peripheral interrupts
bit 5: T0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 interrupt 0 = Disables the TMR0 interrupt
bit 4: IINTE: RB0/INT External Interrupt Enable bit
1 = Enables the RB0/INT external interrupt 0 = Disables the RB0/INT external interrupt
bit 3: RBIE: RB Port Change Interrupt Enable bit
1 = Enables the RB port change interrupt 0 = Disables the RB port change interrupt
bit 2: T0IF: TMR0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow
bit 1: INTF: RB0/INT External Interrupt Flag bit
1 = The RB0/INT external interrupt occurred (must be cleared in software) 0 = The RB0/INT external interrupt did not occur
bit 0: RBIF: RB Port Change Interrupt Flag bit
1 = At least one of the RB7:RB4 pins changed state (must be cleared in software) 0 = None of the RB7:RB4 pins have changed state
PIC16C62B/72A
DS35008A-page 14 Preliminary 1998 Microchip Technology Inc.
2.2.2.4 PIE1 REGISTER This register contains the individual enable bits for the
peripheral interrupts.
FIGURE 2-6: PIE1 REGISTER (ADDRESS 8Ch)
Note: Bit PEIE (INTCON<6>) must be set to
enable any peripheral interrupt.
U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
ADIE
(1)
SSPIE CCP1IE TMR2IE TMR1IE R = Readable bit
W = Writable bit U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: Unimplemented: Read as ‘0’ bit 6: ADIE
(1)
: A/D Converter Interrupt Enable bit 1 = Enables the A/D interrupt 0 = Disables the A/D interrupt
bit 5-4: Unimplemented: Read as ‘0’ bit 3: SSPIE: Synchronous Serial Port Interrupt Enable bit
1 = Enables the SSP interrupt 0 = Disables the SSP interrupt
bit 2: CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt
bit 1: TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the TMR2 to PR2 match interrupt 0 = Disables the TMR2 to PR2 match interrupt
bit 0: TMR1IE: TMR1 Overflow Interrupt Enable bit
1 = Enables the TMR1 overflow interrupt 0 = Disables the TMR1 overflow interrupt
Note 1: The PIC16C62B does not have an A/D module. This bit location is reserved on these devices. Always maintain this
bit clear.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 15
2.2.2.5 PIR1 REGISTER This register contains the individual flag bits for the
Peripheral interrupts.
FIGURE 2-7: PIR1 REGISTER (ADDRESS 0Ch)
Note: Interrupt flag bits get set when an interrupt
condition occurs regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User soft­ware should ensure the appropriate inter­rupt flag bits are clear prior to enabling an interrupt.
U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
ADIF
(1)
SSPIF CCP1IF TMR2IF TMR1IF R = Readable bit
W = Writable bit U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: Unimplemented: Read as ‘0’ bit 6: ADIF
(1)
: A/D Converter Interrupt Flag bit 1 = An A/D conversion completed (must be cleared in software) 0 = The A/D conversion is not complete
bit 5-4: Unimplemented: Read as ‘0’ bit 3: SSPIF: Synchronous Serial Port Interrupt Flag bit
1 = The transmission/reception is complete (must be cleared in software) 0 = Waiting to transmit/receive
bit 2: CCP1IF: CCP1 Interrupt Flag bit
Capture Mode 1 = A TMR1 register capture occurred (must be cleared in software) 0 = No TMR1 register capture occurred Compare Mode 1 = A TMR1 register compare match occurred (must be cleared in software) 0 = No TMR1 register compare match occurred PWM Mode Unused in this mode
bit 1: TMR2IF: TMR2 to PR2 Match Interrupt Flag bit
1 = TMR2 to PR2 match occurred (must be cleared in software) 0 = No TMR2 to PR2 match occurred
bit 0: TMR1IF: TMR1 Overflow Interrupt Flag bit
1 = TMR1 register overflowed (must be cleared in software) 0 = TMR1 register did not overflow
Note 1: The PIC16C62B does not have an A/D module. This bit location is reserved on these devices. Always maintain this
bit clear.
PIC16C62B/72A
DS35008A-page 16 Preliminary 1998 Microchip Technology Inc.
2.2.2.6 PCON REGISTER The Power Control (PCON) register contains a flag bit
to allow differentiation between a Power-on Reset (POR) to an external MCLR
Reset or WDT Reset. Those devices with brown-out detection circuitry con­tain an additional bit to differentiate a Brown-out Reset condition from a Power-on Reset condition.
FIGURE 2-8: PCON REGISTER (ADDRESS 8Eh)
Note: If the BODEN configuration bit is set, BOR
is ’1’ on Power-on Reset. If the BODEN configuration bit is clear, BOR
is unknown
on Power-on Reset. The BOR
status bit is a "don't care" and is not necessarily predictable if the brown-out circuit is disabled (the BODEN configura­tion bit is clear). BOR
must then be set by the user and checked on subsequent resets to see if it
is clear, indicating a
brown-out has occurred.
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-q
POR BOR R = Readable bit
W = Writable bit U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-2: Unimplemented: Read as '0' bit 1: POR
: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0: BOR
: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 17
2.3 PCL and PCLATH
The program counter (PC) specifies the address of the instruction to fetch for execution. The PC is 13 bits wide. The low byte is called the PCL register. This reg­ister is readable and writable. The high byte is called the PCH register. This register contains the PC<12:8> bits and is not directly readable or writable. All updates to the PCH register go through the PCLATH register.
2.3.1 STACK The stack allows a combination of up to 8 program calls
and interrupts to occur. The stack contains the return address from this branch in program execution.
Midrange devices have an 8 level deep x 13-bit wide hardware stack. The stack space is not part of either program or data space and the stack pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not modified when the stack is PUSHed or POPed.
After the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on).
2.4 Program Memory Paging
The CALL and GOTO instructions provide 11 bits of address to allow branching within any 2K program memory page. When doing a CALL or GOTO instruction the upper bit of the address is provided by PCLATH<3>. When doing a CALL or GOTO instruction, the user must ensure that the page select bit is pro­grammed so that the desired program memory page is addressed. If a return from a CALL instruction (or inter­rupt) is executed, the entire 13-bit PC is pushed onto the stack. Therefore, manipulation of the PCLATH<3> bit is not required for the return instructions (which POPs the address from the stack).
PIC16C62B/72A
DS35008A-page 18 Preliminary 1998 Microchip Technology Inc.
2.5 Indirect Addressing, INDF and FSR Registers
The INDF register is not a physical register. Address­ing INDF actually addresses the register whose address is contained in the FSR register (FSR is a
pointer
). This is indirect addressing.
EXAMPLE 2-1: INDIRECT ADDRESSING
• Register file 05 contains the value 10h
• Register file 06 contains the value 0Ah
• Load the value 05 into the FSR register
• A read of the INDF register will return the value of
10h
• Increment the value of the FSR register by one
(FSR = 06)
• A read of the INDR register now will return the
value of 0Ah.
Reading INDF itself indirectly (FSR = 0) will produce 00h. Writing to the INDF register indirectly results in a no-operation (although STATUS bits may be affected).
A simple program to clear RAM locations 20h-2Fh using indirect addressing is shown in Example 2-2.
EXAMPLE 2-2: HOW TO CLEAR RAM
USING INDIRECT ADDRESSING
movlw 0x20 ;initialize pointer movwf FSR ; to RAM NEXT clrf INDF ;clear INDF register incf FSR ;inc pointer btfss FSR,4 ;all done? goto NEXT ;NO, clear next CONTINUE : ;YES, continue
An effective 9-bit address is obtained by concatenating the 8-bit FSR register and the IRP bit (STATUS<7>), as shown in Figure 2-9. However, IRP is not used in the PIC16C62B/72A.
FIGURE 2-9: DIRECT/INDIRECT ADDRESSING
Note 1: For register file map detail see Figure 2-2.
2: Maintain clear for upward compatibility with future products. 3: Not implemented.
Data Memory(1)
Indirect AddressingDirect Addressing
bank select location select
RP1:RP0 6
0
from opcode
IRP FSR register
7
0
bank select
location select
00 01 10 11
Bank 0 Bank 1 Bank 2 Bank 3
not used
FFh
80h
7Fh
00h
17Fh
100h
1FFh
180h
(2)
(2)
(3) (3)
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 19
3.0 I/O PORTS
Some pins for these I/O ports are multiplexed with an alternate function for the peripheral features on the device. In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin.
Additional information on I/O ports may be found in the PICmicro™ Mid-Range Reference Manual, (DS33023).
3.1 PORTA and the TRISA Register
PORTA is a 6-bit wide bi-directional por t. The corre­sponding data direction register is TRISA. Setting a TRISA bit (=1) will make the corresponding PORTA pin an input, i.e., put the corresponding output driver in a hi-impedance mode. Clearing a TRISA bit (=0) will make the corresponding PORTA pin an output, i.e., put the contents of the output latch on the selected pin.
Reading the PORTA register reads the status of the pins whereas writing to it will write to the port latch. All write operations are read-modify-write operations. Therefore a write to a port implies that the port pins are read, this value is modified, and then written to the port data latch.
Pin RA4 is multiplexed with the Timer0 module clock input to become the RA4/T0CKI pin. The RA4/T0CKI pin is a Schmitt Trigger input and an open drain output. All other RA port pins have TTL input levels and full CMOS output drivers.
On the PIC16C72A device, other PORTA pins are mul­tiplexed with analog inputs and analog V
REF input. The
operation of each pin is selected by clearing/setting the control bits in the ADCON1 register (A/D Control Register1).
The TRISA register controls the direction of the RA pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISA register are maintained set when using them as analog inputs.
EXAMPLE 3-1: INITIALIZING PORTA
BCF STATUS, RP0 ; CLRF PORTA ; Initialize PORTA by ; clearing output ; data latches BSF STATUS, RP0 ; Select Bank 1 MOVLW 0xCF ; Value used to ; initialize data ; direction MOVWF TRISA ; Set RA<3:0> as inputs ; RA<5:4> as outputs ; TRISA<7:6> are always ; read as '0'.
FIGURE 3-1: BLOCK DIAGRAM OF
RA3:RA0 AND RA5 PINS
FIGURE 3-2: BLOCK DIAGRAM OF
RA4/T0CKI PIN
Note: On a Power-on Reset, these pins are con-
figured as analog inputs and read as '0'.
Data bus
QD
Q
CK
QD
Q
CK
QD
EN
P
N
WR Port
WR TRIS
Data Latch
TRIS Latch
RD TRIS
RD PORT
V
SS
VDD
I/O pin
(1)
Note 1: I/O pins have protection diodes to VDD
and V
SS.
Analog input mode
TTL input buffer
To A/D Converter (72A only)
(72B
only)
Data bus
WR PORT
WR TRIS
RD PORT
Data Latch
TRIS Latch
RD TRIS
Schmitt T rigger input buffer
N
V
SS
I/O pin
(1)
TMR0 clock input
QD
Q
CK
QD
Q
CK
EN
QD
EN
Note 1: Note 1: I/O pin has protection diodes to
V
SS only.
PIC16C62B/72A
DS35008A-page 20 Preliminary 1998 Microchip Technology Inc.
TABLE 3-1 PORTA FUNCTIONS
TABLE 3-2 SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
Name Bit# Buffer Function
RA0/AN0 bit0 TTL Input/output or analog input
(1)
RA1/AN1 bit1 TTL Input/output or analog input
(1)
RA2/AN2 bit2 TTL Input/output or analog input
(1)
RA3/AN3/VREF bit3 TTL Input/output or analog input
(1)
or VREF
(1)
RA4/T0CKI bit4 ST
Input/output or external clock input for Timer0 Output is open drain type
RA5/SS/AN4 bit5 TTL Input/output or slave select input for synchronous serial port or analog input
(1)
Legend: TTL = TTL input, ST = Schmitt Trigger input
Note 1: On PIC16C72A only.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on all
other resets
05h PORTA
(for PIC16C72A only)
RA5 RA4 RA3 RA2 RA1 RA0 --0x 0000 --0u 0000
05h PORTA
(for PIC16C62B only)
RA5 RA4 RA3 RA2 RA1 RA0 --xx xxxx --uu uuuu
85h TRISA
PORTA Data Direction Register --11 1111 --11 1111
9Fh ADCON1
(1)
PCFG2 PCFG1 PCFG0 ---- -000 ---- -000
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by PORTA.
Note 1: On PIC16C72A only.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 21
3.2 PORTB and the TRISB Register
PORTB is an 8-bit wide bi-directional port. The corre­sponding data direction register is TRISB. Setting a TRISB bit (=1) will make the corresponding PORTB pin an input, i.e., put the corresponding output driver in a hi-impedance mode. Clearing a TRISB bit (=0) will make the corresponding PORTB pin an output, i.e., put the contents of the output latch on the selected pin.
EXAMPLE 3-1: INITIALIZING PORTB
BCF STATUS, RP0 ; CLRF PORTB ; Initialize PORTB by ; clearing output ; data latches BSF STATUS, RP0 ; Select Bank 1 MOVLW 0xCF ; Value used to ; initialize data ; direction MOVWF TRISB ; Set RB<3:0> as inputs ; RB<5:4> as outputs ; RB<7:6> as inputs
Each of the PORTB pins has a weak internal pull-up. A single control bit can turn on all the pull-ups. This is per­formed by clearing bit RBPU
(OPTION_REG<7>). The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are dis­abled on a Power-on Reset.
FIGURE 3-3: BLOCK DIAGRAM OF
RB3:RB0 PINS
Four of PORTB’s pins, RB7:RB4, have an interrupt on change feature. Only pins configured as inputs can cause this interrupt to occur (i.e. any RB7:RB4 pin con­figured as an output is excluded from the interrupt on change comparison). The input pins (of RB7:RB4) are compared with the old value latched on the last read of PORTB. The “mismatch” outputs of RB7:RB4 are OR’ed together to generate the RB Port Change Inter­rupt with flag bit RBIF (INTCON<0>).
This interrupt can wake the device from SLEEP. The user, in the interrupt service routine, can clear the inter­rupt in the following manner:
a) Any read or write of PORTB. This will end the
mismatch condition.
b) Clear flag bit RBIF. A mismatch condition will continue to set flag bit RBIF.
Reading PORTB will end the mismatch condition, and allow flag bit RBIF to be cleared.
The interrupt on change feature is recommended for wake-up on key depression operation and operations where PORTB is only used for the interrupt on change feature. Polling of PORTB is not recommended while using the interrupt on change feature.
FIGURE 3-4: BLOCK DIAGRAM OF
RB7:RB4 PINS
Data Latch
RBPU
(2)
P
V
DD
QD
CK
QD
CK
QD
EN
Data bus
WR Port
WR TRIS
RD TRIS
RD Port
weak pull-up
RD Port
RB0/INT
I/O pin
(1)
TTL Input Buffer
Note 1: I/O pins have diode protection to V
DD and VSS.
2: To enable weak pull-ups, set the appropriate TRIS bit(s)
and clear the RBPU
bit (OPTION_REG<7>).
Schmitt T rigger Buffer
TRIS Latch
Data Latch
From other
RBPU
(2)
P
V
DD
I/O
QD
CK
QD
CK
QD
EN
QD
EN
Data bus
WR Port
WR TRIS
Set RBIF
TRIS Latch
RD TRIS
RD Port
RB7:RB4 pins
weak pull-up
RD Port
Latch
TTL Input Buffer
pin
(1)
Note 1: I/O pins have diode protection to VDD and VSS.
ST
Buffer
RB7:RB6 in serial programming mode
Q3
Q1
2: To enable weak pull-ups, set the appropriate TRIS bit(s)
and clear the RBPU bit (OPTION_REG<7>).
PIC16C62B/72A
DS35008A-page 22 Preliminary 1998 Microchip Technology Inc.
TABLE 3-3 PORTB FUNCTIONS
TABLE 3-4 SUMMARY OF REGISTERS ASSOCIATED WITH PORTB
Name Bit# Buffer Function
RB0/INT bit0 TTL/ST
(1)
Input/output pin or external interrupt input. Internal software
programmable weak pull-up. RB1 bit1 TTL Input/output pin. Internal software programmable weak pull-up. RB2 bit2 TTL Input/output pin. Internal software programmable weak pull-up. RB3 bit3 TTL Input/output pin. Internal software programmable weak pull-up. RB4 bit4 TTL Input/output pin (with interrupt on change). Internal software programmable
weak pull-up. RB5 bit5 TTL Input/output pin (with interrupt on change). Internal software programmable
weak pull-up. RB6 bit6 TTL/ST
(2)
Input/output pin (with interrupt on change). Internal software programmable
weak pull-up. Serial programming clock. RB7 bit7 TTL/ST
(2)
Input/output pin (with interrupt on change). Internal software programmable
weak pull-up. Serial programming data. Legend: TTL = TTL input, ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt.
2: This buffer is a Schmitt Trigger input when used in serial programming mode.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all other resets
06h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu 86h TRISB PORTB Data Direction Register 1111 1111 1111 1111 81h OPTION_
REG
RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
Legend: x = unknown, u = unchanged. Shaded cells are not used by PORTB.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 23
3.3 PORTC and the TRISC Register
PORTC is an 8-bit wide bi-directional port. The corre­sponding data direction register is TRISC. Setting a TRISC bit (=1) will make the corresponding PORTC pin an input, i.e., put the corresponding output driver in a hi-impedance mode. Clearing a TRISC bit (=0) will make the corresponding PORTC pin an output, i.e., put the contents of the output latch on the selected pin.
PORTC is multiplex ed with se v eral peripheral functions (Table 3-5). PORTC pins have Schmitt Trigger input buffers.
When enabling peripheral functions, care should be taken in defining TRIS bits for each PORTC pin. Some peripherals override the TRIS bit to make a pin an out­put, while other peripherals override the TRIS bit to make a pin an input. Since the TRIS bit override is in effect while the peripheral is enabled, read-modify­write instructions (BSF, BCF, XORWF) with TRISC as destination should be avoided. The user should ref er to the corresponding peripheral section for the correct TRIS bit settings.
EXAMPLE 3-1: INITIALIZING PORTC
BCF STATUS, RP0 ; Select Bank 0 CLRF PORTC ; Initialize PORTC by ; clearing output ; data latches BSF STATUS, RP0 ; Select Bank 1 MOVLW 0xCF ; Value used to ; initialize data ; direction MOVWF TRISC ; Set RC<3:0> as inputs ; RC<5:4> as outputs ; RC<7:6> as inputs
FIGURE 3-5: PORTC BLOCK DIAGRAM
(PERIPHERAL OUTPUT OVERRIDE)
PORT/PERIPHERAL Select
(2)
Data bus
WR PORT
WR TRIS
RD
Data Latch
TRIS Latch
RD TRIS
Schmitt T rigger
QD Q
CK
QD
EN
Peripheral Data Out
0 1
QD
Q
CK
P
N
VDD
VSS
PORT
Peripheral OE
(3)
Peripheral input
I/O pin
(1)
Note 1: I/O pins have diode protection to VDD and VSS.
2: Port/Peripheral select signal selects between port
data and peripheral output.
3: Peripheral OE (output enable) is only activated if
peripheral select is active.
PIC16C62B/72A
DS35008A-page 24 Preliminary 1998 Microchip Technology Inc.
TABLE 3-5 PORTC FUNCTIONS
TABLE 3-6 SUMMARY OF REGISTERS ASSOCIATED WITH PORTC
Name Bit# Buffer Type Function
RC0/T1OSO/T1CKI
bit0
ST Input/output port pin or Timer1 oscillator output/Timer1 clock input RC1/T1OSI bit1 ST Input/output port pin or Timer1 oscillator input RC2/CCP1 bit2 ST Input/output port pin or Capture1 input/Compare1 output/PWM1
output
RC3/SCK/SCL bit3 ST
RC3 can also be the synchronous serial clock for both SPI and I
2
C
modes.
RC4/SDI/SDA bit4 ST
RC4 can also be the SPI Data In (SPI mode) or data I/O (I
2
C mode). RC5/SDO bit5 ST Input/output port pin or Synchronous Serial Port data output RC6 bit6 ST Input/output port pin RC7 bit7 ST Input/output port pin Legend: ST = Schmitt Trigger input
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all other resets
07h PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx uuuu uuuu 87h TRISC PORTC Data Direction Register 1111 1111 1111 1111
Legend: x = unknown, u = unchanged.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 25
4.0 TIMER0 MODULE
The Timer0 module timer/counter has the following fea­tures:
• 8-bit timer/counter
• Readable and writable
• Internal or external clock select
• Edge select for external clock
• 8-bit software programmable prescaler
• Interrupt on overflow from FFh to 00h Figure 4-1 is a simplified block diagram of the Timer0
module. Additional information on timer modules is available in
the PICmicro™ Mid-Range Reference Manual, (DS33023).
4.1 Timer0 Operation
Timer0 can operate as a timer or as a counter. Timer mode is selected by clearing bit T0CS
(OPTION_REG<5>). In timer mode, the Timer0 mod­ule will increment every instruction cycle (without pres­caler). If the TMR0 register is written, the increment is inhibited for the following two instruction cycles. The user can work around this by writing an adjusted value to the TMR0 register.
Counter mode is selected by setting bit T0CS (OPTION_REG<5>). In counter mode, Timer0 will increment either on every rising or falling edge of pin RA4/T0CKI. The incrementing edge is determined by the Timer0 Source Edge Select bit T0SE (OPTION_REG<4>). Clearing bit T0SE selects the ris­ing edge. Restrictions on the external clock input are discussed below.
When an external clock input is used for Timer0, it must meet certain requirements. The requirements ensure the external clock can be synchronized with the internal phase clock (T
OSC). Also, there is a delay in the actual
incrementing of Timer0 after synchronization.
Additional information on external clock requirements is available in the PICmicro™ Mid-Range Reference Manual, (DS33023).
4.2 Prescaler
An 8-bit counter is available as a prescaler for the Timer0 module, or as a postscaler for the Watchdog Timer, respectively (Figure 4-2). For simplicity, this counter is being referred to as “prescaler” throughout this data sheet. Note that there is only one prescaler available which is mutually exclusively shared between the Timer0 module and the Watchdog Timer. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the Watchdog Timer, and vice-versa.
The prescaler is not readable or writable. The PSA and PS2:PS0 bits (OPTION_REG<3:0>)
determine the prescaler assignment and prescale ratio. Clearing bit PSA will assign the prescaler to the Timer0
module. When the prescaler is assigned to the Timer0 module, prescale values of 1:2, 1:4, ..., 1:256 are selectable.
Setting bit PSA will assign the prescaler to the Watch­dog Timer (WDT). When the prescaler is assigned to the WDT, prescale values of 1:1, 1:2, ..., 1:128 are selectable.
When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g. CLRF 1, MOVWF 1,
BSF 1,x....etc.) will clear the prescaler. When
assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT.
FIGURE 4-1: TIMER0 BLOCK DIAGRAM
Note: Writing to TMR0 when the prescaler is
assigned to Timer0 will clear the prescaler count, but will not change the prescaler assignment.
Note 1: T0CS, T0SE, PSA, PS2:PS0 (OPTION_REG<5:0>).
2: The prescaler is shared with Watchdog Timer (refer to Figure 4-2 for detailed block diagram).
RA4/T0CKI
T0SE
0
1
1
0
pin
T0CS
FOSC/4
Programmable
Prescaler
Sync with
Internal
clocks
TMR0
PSout
(2 cycle delay)
PSout
Data bus
8
PSA
PS2, PS1, PS0
Set interrupt flag bit T0IF
on overflow
3
PIC16C62B/72A
DS35008A-page 26 Preliminary 1998 Microchip Technology Inc.
4.2.1 SWITCHING PRESCALER ASSIGNMENT The prescaler assignment is fully under software con-
trol, i.e., it can be changed “on the fly” during program execution.
4.3 Timer0 Interrupt
The TMR0 interrupt is generated when the TMR0 reg­ister overflows from FFh to 00h. This overflow sets bit T0IF (INTCON<2>). The interrupt can be masked by clearing bit T0IE (INTCON<5>). Bit T0IF must be cleared in software by the Timer0 module interrupt ser­vice routine before re-enabling this interrupt. The TMR0 interrupt cannot awaken the processor from SLEEP since the timer is shut off during SLEEP.
FIGURE 4-2: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
TABLE 4-1 REGISTERS ASSOCIATED WITH TIMER0
Note: To avoid an unintended device RESET, a
specific instruction sequence (shown in the PICmicro Mid-Range Reference Manual, DS33023) must be executed when chang­ing the prescaler assignment from Timer0 to the WDT. This sequence must be followed even if the WDT is disabled.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all
other resets
01h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu 0Bh,8Bh INTCON GIE
PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u 81h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 85h TRISA PORTA Data Direction Register --11 1111 --11 1111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by Timer0.
RA4/T0CKI
T0SE
pin
M
U X
CLKOUT (=Fosc/4)
SYNC
2
Cycles
TMR0 reg
8-bit Prescaler
8 - to - 1MUX
M
U X
M U X
Watchdog
Timer
PSA
0
1
0
1
WDT
Time-out
PS2:PS0
8
Note: T0CS, T0SE, PSA, PS2:PS0 are (OPTION_REG<5:0>).
PSA
WDT Enable bit
M U
X
0
1
0
1
Data Bus
Set flag bit T0IF
on Overflow
8
PSA
T0CS
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 27
5.0 TIMER1 MODULE
The Timer1 module timer/counter has the f ollowing fea­tures:
• 16-bit timer/counter (Two 8-bit registers; TMR1H and TMR1L)
• Readable and writable (Both registers)
• Internal or external clock select
• Interrupt on overflow from FFFFh to 0000h
• Reset from CCP module trigger
Timer1 has a control register, shown in Figure 5-1. Timer1 can be enabled/disabled by setting/clearing control bit TMR1ON (T1CON<0>).
Figure 5-2 is a simplified block diagram of the Timer1 module.
Additional information on timer modules is available in the PICmicro™ Mid-Range Reference Manual, (DS33023).
5.1 Timer1 Operation
Timer1 can operate in one of these modes:
• As a timer
• As a synchronous counter
• As an asynchronous counter The operating mode is determined by the clock select
bit, TMR1CS (T1CON<1>). In timer mode, Timer1 increments every instruction
cycle. In counter mode, it increments on every rising edge of the external clock input.
When the Timer1 oscillator is enabled (T1OSCEN is set), the RC1/T1OSI and RC0/T1OSO/T1CKI pins become inputs. That is, the TRISC<1:0> value is ignored.
Timer1 also has an internal “reset input”. This reset can be generated by the CCP module (Section 7.0).
FIGURE 5-1: T1CON: TIMER1 CONTROL REGISTER (ADDRESS 10h)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON
R = Readable bit W = Writable bit U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-6: Unimplemented: Read as '0' bit 5-4: T1CKPS1:T1CKPS0: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value
bit 3: T1OSCEN: Timer1 Oscillator Enable Control bit
1 = Oscillator is enabled 0 = Oscillator is shut off Note: The oscillator inverter and feedback resistor are turned off to eliminate power drain
bit 2: T1SYNC
: Timer1 External Clock Input Synchronization Control bit
TMR1CS = 1 1 = Do not synchronize external clock input 0 = Synchronize external clock input
TMR1CS = 0 This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0.
bit 1: TMR1CS: Timer1 Clock Source Select bit
1 = External clock from pin RC0/T1OSO/T1CKI (on the rising edge) 0 = Internal clock (F
OSC/4)
bit 0: TMR1ON: Timer1 On bit
1 = Enables Timer1 0 = Stops Timer1
PIC16C62B/72A
DS35008A-page 28 Preliminary 1998 Microchip Technology Inc.
FIGURE 5-2: TIMER1 BLOCK DIAGRAM
TMR1H
TMR1L
T1OSC
T1SYNC
TMR1CS
T1CKPS1:T1CKPS0
SLEEP input
T1OSCEN Enable Oscillator
(1)
FOSC/4
Internal Clock
TMR1ON
on/off
Prescaler
1, 2, 4, 8
Synchronize
det
1
0
0
1
Synchronized
clock input
2
RC0/T1OSO/T1CKI
RC1/T1OSI
Note 1: When the T1OSCEN bit is cleared, the inverter and feedback resistor are turned off. This eliminates power drain.
Set flag bit TMR1IF on Overflow
TMR1
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 29
5.2 Timer1 Oscillator
A crystal oscillator circuit is built in between pins T1OSI (input) and T1OSO (amplifier output). It is enabled by setting control bit T1OSCEN (T1CON<3>). The oscilla­tor is a low power oscillator rated up to 200 kHz. It will continue to run during SLEEP. It is primarily intended for a 32 kHz crystal. Table 5-1 shows the capacitor selection for the Timer1 oscillator.
The Timer1 oscillator is identical to the LP oscillator. The user must provide a software time delay to ensure proper oscillator start-up.
TABLE 5-1 CAPACITOR SELECTION
FOR THE TIMER1 OSCILLATOR
5.3 Timer1 Interrupt
The TMR1 Register pair (TMR1H:TMR1L) increments from 0000h to FFFFh and rolls over to 0000h. The TMR1 Interrupt, if enabled, is generated on overflow which is latched in interrupt flag bit TMR1IF (PIR1<0>). This interrupt can be enabled/disabled by setting/clear­ing TMR1 interrupt enable bit TMR1IE (PIE1<0>).
5.4 Resetting Timer1 using a CCP Trigger Output
If the CCP module is configured in compare mode to generate a “special event trigger" (CCP1M3:CCP1M0 = 1011), this signal will reset Timer1 and start an A/D conversion (if the A/D module is enabled).
Timer1 must be configured for either timer or synchro­nized counter mode to take advantage of this f eature. If Timer1 is running in asynchronous counter mode, this reset operation may not work.
In the event that a write to Timer1 coincides with a spe­cial event trigger from CCP1, the write will take prece­dence.
In this mode of operation, the CCPR1H:CCPR1L regis­ters pair effectively becomes the period register for Timer1.
TABLE 5-2 REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER
Osc Type Freq C1 C2
LP 32 kHz 33 pF 33 pF
100 kHz 15 pF 15 pF 200 kHz 15 pF 15 pF
These values are for design guidance only.
Crystals Tested:
32.768 kHz Epson C-001R32.768K-A ± 20 PPM 100 kHz Epson C-2 100.00 KC-P ± 20 PPM 200 kHz STD XTL 200.000 kHz ± 20 PPM Note 1: Higher capacitance increases the stability
of oscillator but also increases the start-up time.
2: Since each resonator/crystal has its own
characteristics, the user should consult the resonator/crystal manufacturer for appropri­ate values of external components.
Note: The special event triggers from the CCP1
module will not set interrupt flag bit TMR1IF (PIR1<0>).
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on
all other
resets
0Bh,8Bh INTCON GIE PEIE
T0IE INTE RBIE T0IF INTF RBIF
0000 000x 0000 000u
0Ch PIR1 ADIF SSPIF CCP1IF TMR2IF TMR1IF
-0-- 0000 -0-- 0000
8Ch PIE1 ADIE SSPIE CCP1IE TMR2IE TMR1IE
-0-- 0000 -0-- 0000
0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register
xxxx xxxx uuuu uuuu
0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register
xxxx xxxx uuuu uuuu
10h T1CON T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON
--00 0000 --uu uuuu
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used by the Timer1 module.
PIC16C62B/72A
DS35008A-page 30 Preliminary 1998 Microchip Technology Inc.
NOTES:
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 31
6.0 TIMER2 MODULE
The Timer2 module timer has the following features:
• 8-bit timer (TMR2 register)
• 8-bit period register (PR2)
• Readable and writable (Both registers)
• Software programmable prescaler (1:1, 1:4, 1:16)
• Software programmable postscaler (1:1 to 1:16)
• Interrupt on TMR2 match of PR2
• SSP module optional use of TMR2 output to gen­erate clock shift
Timer2 has a control register, shown in Figure 6-1. Timer2 can be shut off by clearing control bit TMR2ON (T2CON<2>) to minimize power consumption.
Figure 6-2 is a simplified block diagram of the Timer2 module.
Additional information on timer modules is available in the PICmicro™ Mid-Range Reference Manual, (DS33023).
FIGURE 6-1: T2CON: TIMER2 CONTROL REGISTER (ADDRESS 12h)
FIGURE 6-2: TIMER2 BLOCK DIAGRAM
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 R = Readable bit
W = Writable bit U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: Unimplemented: Read as '0' bit 6-3: TOUTPS3:TOUTPS0: Timer2 Output Postscale Select bits
0000 = 1:1 Postscale 0001 = 1:2 Postscale
1111 = 1:16 Postscale
bit 2: TMR2ON: Timer2 On bit
1 = Timer2 is on 0 = Timer2 is off
bit 1-0: T2CKPS1:T2CKPS0: Timer2 Clock Prescale Select bits
00 = Prescaler is 1 01 = Prescaler is 4 1x = Prescaler is 16
Comparator
TMR2
Sets flag
TMR2 reg
output
(1)
Reset
Postscaler
Prescaler
PR2 reg
2
F
OSC/4
1:1 1:16
1:1, 1:4, 1:16
EQ
4
bit TMR2IF
Note 1: TMR2 register output can be software selected
by the SSP Module as a baud clock.
to
PIC16C62B/72A
DS35008A-page 32 Preliminary 1998 Microchip Technology Inc.
6.1 Timer2 Operation
Timer2 can be used as the PWM time-base for PWM mode of the CCP module.
The TMR2 register is readable and writable, and is cleared on any device reset.
The input clock (F
OSC/4) has a prescale option of 1:1,
1:4 or 1:16, selected by control bits T2CKPS1:T2CKPS0 (T2CON<1:0>).
The match output of TMR2 goes through a 4-bit postscaler (which gives a 1:1 to 1:16 scaling inclusive) to generate a TMR2 interrupt (latched in flag bit TMR2IF, (PIR1<1>)).
The prescaler and postscaler counters are cleared when any of the following occurs:
• a write to the TMR2 register
• a write to the T2CON register
• any device reset (Power-on Reset, MCLR
reset,
Watchdog Timer reset, or Brown-out Reset)
TMR2 is not cleared when T2CON is written.
6.2 Timer2 Interrupt
The Timer2 module has an 8-bit period register PR2. Timer2 increments from 00h until it matches PR2 and then resets to 00h on the next increment cycle. PR2 is a readable and writable register. The PR2 register is ini­tialized to FFh upon reset.
6.3 Output of TMR2
The output of TMR2 (bef ore the postscaler) is fed to the Synchronous Serial Port module which optionally uses it to generate shift clock.
TABLE 6-1 REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on all other
resets
0Bh,8Bh INTCON GIE PEIE
T0IE INTE RBIE T0IF INTF RBIF
0000 000x 0000 000u
0Ch PIR1
ADIF SSPIF CCP1IF TMR2IF TMR1IF
-00- 0000 0000 0000
8Ch PIE1
ADIE SSPIE CCP1IE TMR2IE TMR1IE
-0-- 0000 0000 0000
11h TMR2 Timer2 module’s register
0000 0000 0000 0000
12h T2CON
TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0
-000 0000 -000 0000
92h PR2 Timer2 Period Register
1111 1111 1111 1111
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used by the Timer2 module.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 33
7.0 CAPTURE/COMPARE/PWM
(CCP) MODULE(S)
Each CCP (Capture/Compare/PWM) module contains a 16-bit register which can operate as a 16-bit capture register, as a 16-bit compare register or as a PWM master/slave Duty Cycle register. Table 7-1 shows the timer resources of the CCP module modes.
Capture/Compare/PWM Register 1 (CCPR1) is com­prised of two 8-bit registers: CCPR1L (low byte) and CCPR1H (high byte). The CCP1CON register controls the operation of CCP1. All are readable and writable.
Additional information on the CCP module is available in the PICmicro™ Mid-Range Reference Manual, (DS33023).
TABLE 7-1 CCP MODE - TIMER
RESOURCE
FIGURE 7-1: CCP1CON REGISTER (ADDRESS 17h)
CCP Mode Timer Resource
Capture
Compare
PWM
Timer1 Timer1 Timer2
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 R = Readable bit
W =Writable bit U = Unimplemented bit,
read as ‘0’
- n =Value at POR reset
bit7 bit0
bit 7-6: Unimplemented: Read as '0' bit 5-4: CCP1X:CCP1Y: PWM Least Significant bits
Capture Mode: Unused Compare Mode: Unused PWM Mode: These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L.
bit 3-0: CCP1M3:CCP1M0: CCP1 Mode Select bits
0000 = Capture/Compare/PWM off (resets CCP1 module) 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode, set output on match (CCP1IF bit is set) 1001 = Compare mode, clear output on match (CCP1IF bit is set) 1010 = Compare mode, generate software interrupt on match (CCP1IF bit is set, CCP1 pin is unaffected) 1011 = Compare mode, trigger special event (CCP1IF bit is set; CCP1 resets TMR1 and starts an A/D
conversion (if A/D module is enabled))
11xx = PWM mode
PIC16C62B/72A
DS35008A-page 34 Preliminary 1998 Microchip Technology Inc.
7.1 Capture Mode
In Capture mode, CCPR1H:CCPR1L captures the 16-bit value of the TMR1 register when an e v ent occurs on pin RC2/CCP1. An event is defined as:
• every falling edge
• every rising edge
• every 4th rising edge
• every 16th rising edge An event is selected by control bits CCP1M3:CCP1M0
(CCP1CON<3:0>). When a capture is made, the inter­rupt request flag bit CCP1IF (PIR1<2>) is set. It must be cleared in software. If another capture occurs before the value in register CCPR1 is read, the old captured value will be lost.
FIGURE 7-2: CAPTURE MODE
OPERATION BLOCK DIAGRAM
7.1.1 CCP PIN CONFIGURATION In Capture mode, the RC2/CCP1 pin should be config-
ured as an input by setting the TRISC<2> bit.
7.1.2 TIMER1 MODE SELECTION Timer1 must be running in timer mode or synchronized
counter mode for the CCP module to use the capture feature. In asynchronous counter mode, the capture operation may not work.
7.1.3 SOFTWARE INTERRUPT When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep bit CCP1IE (PIE1<2>) clear to avoid false interrupts and should clear the flag bit CCP1IF following any such change in operating mode.
7.1.4 CCP PRESCALER There are four prescaler settings, specified by bits
CCP1M3:CCP1M0. Whenever the CCP module is turned off, or the CCP module is not in capture mode, the prescaler counter is cleared. This means that any reset will clear the prescaler counter.
Switching from one capture prescaler to another may generate an interrupt. Also, the prescaler counter will not be cleared, therefore the first capture may be from a non-zero prescaler. Example 7-1 shows the recom­mended method for switching between capture pres­calers. This example also clears the prescaler counter and will not generate the “false” interrupt.
EXAMPLE 7-1: CHANGING BETWEEN
CAPTURE PRESCALERS
CLRF CCP1CON ;Turn CCP module off MOVLW NEW_CAPT_PS ;Load the W reg with ; the new prescaler ; mode value and CCP ON MOVWF CCP1CON ;Load CCP1CON with this ; value
Note: If the RC2/CCP1 is configured as an out-
put, a write to the port can cause a capture condition.
CCPR1H CCPR1L
TMR1H TMR1L
Set flag bit CCP1IF
(PIR1<2>)
Capture Enable
Q’s
CCP1CON<3:0>
RC2/CCP1
Prescaler
÷ 1, 4, 16
and
edge detect
Pin
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 35
7.2 Compare Mode
In Compare mode, the 16-bit CCPR1 register value is constantly compared against the TMR1 register pair value. When a match occurs, the RC2/CCP1 pin is:
• driven High
• driven Low
• remains Unchanged
The action on the pin is based on the value of control bits CCP1M3:CCP1M0 (CCP1CON<3:0>). At the same time, interrupt flag bit CCP1IF is set.
FIGURE 7-3: COMPARE MODE
OPERATION BLOCK DIAGRAM
7.2.1 CCP PIN CONFIGURATION The user must configure the RC2/CCP1 pin as an out-
put by clearing the TRISC<2> bit.
7.2.2 TIMER1 MODE SELECTION Timer1 must be running in Timer mode or Synchro-
nized Counter mode if the CCP module is using the compare feature. In Asynchronous Counter mode, the compare operation may not work.
7.2.3 SOFTWARE INTERRUPT MODE When generate software interrupt is chosen the CCP1
pin is not affected. Only a CCP interrupt is generated (if enabled).
7.2.4 SPECIAL EVENT TRIGGER In this mode, an internal hardware trigger is generated
which may be used to initiate an action. The special event trigger output of CCP1 resets the
TMR1 register pair. This allows the CCPR1 register to effectively be a 16-bit programmab le period register f or Timer1.
The special trigger output of CCP2 resets the TMR1 register pair, and starts an A/D conversion (if the A/D module is enabled).
TABLE 7-2 REGISTERS ASSOCIATED WITH CAPTURE, COMPARE, AND TIMER1
CCPR1H CCPR1L
TMR1H TMR1L
Comparator
QS
R
Output
Logic
Special Event Trigger
Set flag bit CCP1IF
(PIR1<2>)
match
RC2/CCP1
TRISC<2>
CCP1CON<3:0> Mode Select
Output Enable
Pin
Special event trigger will: reset Timer1, but not set interrupt flag bit TMR1IF (PIR1<0>), and set bit GO/DONE
(ADCON0<2>)
which starts an A/D conversion
Note: Clearing the CCP1CON register will force
the RC2/CCP1 compare output latch to the default low level. This is not the data latch.
Note: The special event trigger from the CCP2
module will not set interrupt flag bit TMR1IF (PIR1<0>).
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR, BOR
Value on
all other
resets
0Bh,8Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1
ADIF SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch PIE1
ADIE SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000 87h TRISC PORTC Data Direction Register 1111 1111 1111 1111 0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu 0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1register xxxx xxxx uuuu uuuu 10h T1CON
T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu 15h CCPR1L Capture/Compare/PWM register1 (LSB) xxxx xxxx uuuu uuuu 16h CCPR1H Capture/Compare/PWM register1 (MSB) xxxx xxxx uuuu uuuu 17h CCP1CON
CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used by Capture and Timer1.
PIC16C62B/72A
DS35008A-page 36 Preliminary 1998 Microchip Technology Inc.
7.3 PWM Mode
In Pulse Width Modulation (PWM) mode, the CCP1 pin produces up to a 10-bit resolution PWM output. Since the CCP1 pin is multiplexed with the POR TC data latch, the TRISC<2> bit must be cleared to make the CCP1 pin an output.
Figure 7-4 shows a simplified block diagram of the CCP module in PWM mode.
For a step by step procedure on how to set up the CCP module for PWM operation, see Section 7.3.3.
FIGURE 7-4: SIMPLIFIED PWM BLOCK
DIAGRAM
A PWM output (Figure 7-5) has a time base (per iod) and a time that the output stays high (duty cycle). The frequency of the PWM is the inverse of the period (1/period).
FIGURE 7-5: PWM OUTPUT
7.3.1 PWM PERIOD The PWM period is specified by writing to the PR2 reg-
ister. The PWM period can be calculated using the fol­lowing formula:
PWM period = [(PR2) + 1] 4 T
OSC
(TMR2 prescale value)
PWM frequency is defined as 1 / [PWM period]. When TMR2 is equal to PR2, the following three ev ents
occur on the next increment cycle:
• TMR2 is cleared
• The CCP1 pin is set (exception: if PWM duty cycle = 0%, the CCP1 pin will not be set)
• The PWM duty cycle is latched from CCPR1L into CCPR1H
7.3.2 PWM DUTY CYCLE
The PWM duty cycle is specified by writing to the CCPR1L register and to the CCP1CON<5:4> bits. Up to 10-bit resolution is available: the CCPR1L contains the eight MSbs and the CCP1CON<5:4> contains the two LSbs. This 10-bit value is represented by CCPR1L:CCP1CON<5:4>. The following equation is used to calculate the PWM duty cycle in time:
PWM duty cycle = (CCPR1L:CCP1CON<5:4>) Tosc (TMR2 prescale value)
CCPR1L and CCP1CON<5:4> can be written to at any time, but the duty cycle value is not latched into CCPR1H until after a match between PR2 and TMR2 occurs (i.e., the period is complete). In PWM mode, CCPR1H is a read-only register.
The CCPR1H register and a 2-bit internal latch are used to double buffer the PWM duty cycle. This double buffering is essential for glitchless PWM operation.
When the CCPR1H and 2-bit latch match TMR2 con­catenated with an internal 2-bit Q clock or 2 bits of the TMR2 prescaler, the CCP1 pin is cleared.
Maximum PWM resolution (bits) for a given PWM frequency:
For an example PWM period and duty cycle calcula­tion, see the PICmicro™ Mid-Range Reference Manual, (DS33023).
Note: Clearing the CCP1CON register will force
the CCP1 PWM output latch to the default low level. This is not the PORTC I/O data latch.
CCPR1L
CCPR1H (Slave)
Comparator
TMR2
Comparator
PR2
(Note 1)
R
Q
S
Duty cycle registers
CCP1CON<5:4>
Clear Timer, CCP1 pin and latch D.C.
TRISC<2>
RC2/CCP1
Note 1: 8-bit timer is concatenated with 2-bit internal Q clock
or 2 bits of the prescaler to create 10-bit time-base.
Period
Duty Cycle
TMR2 = PR2
TMR2 = Duty Cycle
TMR2 = PR2
Note: The Timer2 postscaler (see Section 6.0) is
not used in the determination of the PWM frequency . The postscaler could be used to have a servo update rate at a different fre­quency than the PWM output.
Note: If the PWM duty cycle value is longer than
the PWM period the CCP1 pin will not be cleared.
log(
F
PWM
log(2)
F
OSC
)
bits
=
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 37
7.3.3 SET-UP FOR PWM OPERATION The following steps should be taken when configuring
the CCP module for PWM operation:
1. Set the PWM period by writing to the PR2 regis­ter.
2. Set the PWM duty cycle by writing to the CCPR1L register and CCP1CON<5:4> bits.
3. Make the CCP1 pin an output by clearing the TRISC<2> bit.
4. Set the TMR2 prescale value and enab le Timer2 by writing to T2CON.
5. Configure the CCP1 module for PWM operation.
TABLE 7-3 EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 20 MHz
TABLE 7-4 REGISTERS ASSOCIATED WITH PWM AND TIMER2
PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescaler (1, 4, 16) 16 4 1111 PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 Maximum Resolution (bits) 10 10 10 8 7 5.5
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on
all other
resets
0Bh,8Bh INTCON GIE PEIE
T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1
ADIF SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch PIE1
ADIE SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000
87h TRISC PORTC Data Direction Register 1111 1111 1111 1111
11h TMR2 Timer2 module’s register 0000 0000 0000 0000 92h PR2 Timer2 module’s period register 1111 1111 1111 1111 12h T2CON
TOUTPS3 T OUTPS2 TOUTPS1 T OUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000 15h CCPR1L Capture/Compare/PWM register1 (LSB) xxxx xxxx uuuu uuuu 16h CCPR1H Capture/Compare/PWM register1 (MSB) xxxx xxxx uuuu uuuu 17h CCP1CON
CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000 Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used by PWM and Timer2.
PIC16C62B/72A
DS35008A-page 38 Preliminary 1998 Microchip Technology Inc.
NOTES:
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 39
8.0 SYNCHRONOUS SERIAL PORT (SSP) MODULE
8.1 SSP Module Overview
The Synchronous Serial Port (SSP) module is a serial interface useful for communicating with other periph­eral or microcontroller devices. These peripheral devices may be Serial EEPROMs, shift registers, dis­play drivers, A/D converters, etc. The SSP module can operate in one of two modes:
• Serial Peripheral Interface (SPI)
• Inter-Integrated Circuit (I
2
C)
For more information on SSP operation (including an I
2
C Overview), refer to the PICmicro™ Mid-Range Ref­erence Manual, (DS33023). Also, refer to Application Note AN578,
“Use of the SSP Module in the I2C Multi-
Master Environment.”
PIC16C62B/72A
DS35008A-page 40 Preliminary 1998 Microchip Technology Inc.
FIGURE 8-1: SSPSTAT: SYNC SERIAL PORT STATUS REGISTER (ADDRESS 94h)
R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0
SMP CKE D/A
P S R/W UA BF R = Readable bit
W =Writable bit U = Unimplemented bit,
read as ‘0’
- n =Value at POR reset
bit7 bit0
bit 7: SMP: SPI data input sample phase
SPI Master Oper
ation 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time SPI Sla
ve Mode
SMP must be cleared when SPI is used in slave mode
bit 6: CKE: SPI Clock Edge Select
CKP = 0 1 = Data transmitted on rising edge of SCK 0 = Data transmitted on falling edge of SCK CKP = 1 1 = Data transmitted on falling edge of SCK 0 = Data transmitted on rising edge of SCK
bit 5: D/A
: Data/Address bit (I2C mode only) 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address
bit 4: P: Stop bit (I
2
C mode only. This bit is cleared when the SSP module is disabled, or when the Start bit is detected last, SSPEN is cleared) 1 = Indicates that a stop bit has been detected last (this bit is '0' on RESET) 0 = Stop bit was not detected last
bit 3: S: Start bit (I
2
C mode only. This bit is cleared when the SSP module is disabled, or when the Stop bit is detected last, SSPEN is cleared) 1 = Indicates that a start bit has been detected last (this bit is '0' on RESET) 0 = Start bit was not detected last
bit 2: R/W
: Read/Write bit information (I2C mode only) This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next start bit, stop bit, or A
CK bit. 1 = Read 0 = Write
bit 1: UA: Update Address (10-bit I
2
C mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated
bit 0: BF: Buffer Full Status bit
Receiv
e (SPI and I2C modes) 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty
T
ransmit (I2C mode only) 1 = Transmit in progress, SSPBUF is full 0 = Transmit complete, SSPBUF is empty
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 41
FIGURE 8-2: SSPCON: SYNC SERIAL PORT CONTROL REGISTER (ADDRESS 14h)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1
SSPM0 R = Readable bit
W =Writable bit U = Unimplemented bit,
read as ‘0’
- n =Value at POR reset
bit7 bit0
bit 7: WCOL: Write Collision Detect bit
1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision
bit 6: SSPOV: Receive Overflow Indicator bit
In SPI mode 1 = A new byte is received while the SSPBUF register is still holding the pre vious data. In case of ov erflow , the data in SSPSR is lost. Ov erflow can only occur in sla v e mode. The user must read the SSPBUF, even if only transmitting data, to avoid setting overflow. In master operation, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. 0 = No overflow
In I
2
C mode 1 = A byte is received while the SSPBUF register is still holding the pre vious byte. SSPO V is a "don’t care" in transmit mode. SSPOV must be cleared in software in either mode. 0 = No overflow
bit 5: SSPEN: Synchronous Serial Port Enable bit
In SPI mode 1 = Enables serial port and configures SCK, SDO, and SDI as serial port pins 0 = Disables serial port and configures these pins as I/O port pins
In I
2
C mode 1 = Enables the serial port and configures the SDA and SCL pins as serial port pins 0 = Disables serial port and configures these pins as I/O port pins In both modes, when enabled, these pins must be properly configured as input or output.
bit 4: CKP: Clock Polarity Select bit
In SPI mode 1 = Idle state for clock is a high level 0 = Idle state for clock is a low level In I
2
C mode SCK release control 1 = Enable clock 0 = Holds clock low (clock stretch) (Used to ensure data setup time)
bit 3-0: SSPM3:SSPM0: Synchronous Serial Port Mode Select bits
0000 = SPI master operation, clock = F
OSC/4
0001 = SPI master operation, clock = F
OSC/16
0010 = SPI master operation, clock = F
OSC/64
0011 = SPI master operation, clock = TMR2 output/2 0100 = SPI slave mode, clock = SCK pin. SS
pin control enabled.
0101 = SPI slave mode, clock = SCK pin. SS
pin control disabled. SS can be used as I/O pin
0110 = I
2
C slave mode, 7-bit address
0111 = I
2
C slave mode, 10-bit address
1011 = I
2
C firmware controlled master operation (slave idle)
1110 = I
2
C slave mode, 7-bit address with start and stop bit interrupts enabled
1111 = I
2
C slave mode, 10-bit address with start and stop bit interrupts enabled
PIC16C62B/72A
DS35008A-page 42 Preliminary 1998 Microchip Technology Inc.
8.2 SPI Mode
This section contains register definitions and opera­tional characteristics of the SPI module.
Additional information on SPI operation may be found in the PICmicro™ Mid-Range Reference Manual, (DS33023).
8.2.1 OPERATION OF SSP MODULE IN SPI MODE
A block diagram of the SSP Module in SPI Mode is shown in Figure 8-3.
The SPI mode allows 8-bits of data to be synchro­nously transmitted and received simultaneously. To accomplish communication, typically three pins are used:
• Serial Data Out (SDO)RC5/SDO
• Serial Data In (SDI)RC4/SDI/SDA
• Serial Clock (SCK)RC3/SCK/SCL
Additionally a fourth pin may be used when in a slave mode of operation:
• Slave Select (SS
)RA5/SS/AN4
When initializing the SPI, several options need to be specified. This is done b y programming the appropriate control bits in the SSPCON register (SSPCON<5:0>) and SSPSTAT<7:6>. These control bits allow the fol­lowing to be specified:
• Master Operation (SCK is the clock output)
• Slave Mode (SCK is the clock input)
• Clock Polarity (Idle state of SCK)
• Clock Edge (Output data on rising/falling edge of
SCK)
• Clock Rate (master operation only)
• Slave Select Mode (Slave mode only)
To enable the serial port, SSP Enable bit, SSPEN (SSPCON<5>) must be set. To reset or reconfigure SPI mode, clear bit SSPEN, re-initialize the SSPCON reg­ister, and then set bit SSPEN. This configures the SDI, SDO, SCK, and SS
pins as serial port pins. For the pins to behave as the serial port function, they must have their data direction bits (in the TRISC register) appro­priately programmed. That is:
• SDI must have TRISC<4> set
• SDO must have TRISC<5> cleared
• SCK (master operation) must have TRISC<3>
cleared
• SCK (Slave mode) must have TRISC<3> set
•SS
must have TRISA<5> set
FIGURE 8-3: SSP BLOCK DIAGRAM
(SPI MODE)
Note: When the SPI is in Slave Mode with SS pin
control enabled, (SSPCON<3:0> = 0100) the SPI module will reset if the SS
pin is set
to V
DD.
Note: If the SPI is used in Slave Mode with
CKE = '1', then the SS
pin control must be
enabled.
Read Write
Internal
data bus
RC4/SDI/SDA
RC5/SDO
RA5/SS
/AN4
RC3/SCK/
SSPSR reg
SSPBUF reg
SSPM3:SSPM0
bit0
shift
clock
SS
Control Enable
Edge
Select
Clock Select
TMR2 output
TCY
Prescaler
4, 16, 64
TRISC<3>
2
Edge
Select
2
4
SCL
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 43
TABLE 8-1 REGISTERS ASSOCIATED WITH SPI OPERATION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on
all other
resets
0Bh,8Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1
ADIF SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch PIE1
ADIE SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000
87h TRISC PORTC Data Direction Register 1111 1111 1111 1111 13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu 14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000 85h TRISA PORTA Data Direction Register --11 1111 --11 1111 94h SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used by the SSP in SPI mode.
PIC16C62B/72A
DS35008A-page 44 Preliminary 1998 Microchip Technology Inc.
8.3 SSP I2C Operation
The SSP module in I2C mode fully implements all slave functions, except general call support, and provides interrupts on start and stop bits in hardware to facilitate firmware implementations of the master functions. The SSP module implements the standard mode specifica­tions as well as 7-bit and 10-bit addressing.
Two pins are used for data transfer. These are the RC3/SCK/SCL pin, which is the clock (SCL), and the RC4/SDI/SDA pin, which is the data (SDA). The user must configure these pins as inputs or outputs through the TRISC<4:3> bits.
The SSP module functions are enabled by setting SSP Enable bit SSPEN (SSPCON<5>).
FIGURE 8-4: SSP BLOCK DIAGRAM
(I2C MODE)
The SSP module has five registers for I2C operation. These are the:
• SSP Control Register (SSPCON)
• SSP Status Register (SSPSTAT)
• Serial Receive/Transmit Buffer (SSPBUF)
• SSP Shift Register (SSPSR) - Not directly acces-
sible
• SSP Address Register (SSPADD)
The SSPCON register allows control of the I
2
C opera­tion. Four mode selection bits (SSPCON<3:0>) allow one of the following I
2
C modes to be selected:
•I
2
C Slave mode (7-bit address)
•I
2
C Slave mode (10-bit address)
•I
2
C Slave mode (7-bit address), with start and
stop bit interrupts enabled
•I
2
C Slave mode (10-bit address), with start and
stop bit interrupts enabled
•I
2
C Firmware controlled master operation, slave
is idle
Selection of any I
2
C mode, with the SSPEN bit set, forces the SCL and SDA pins to be open drain, pro­vided these pins are programmed to inputs by setting the appropriate TRISC bits.
Additional information on SSP I
2
C operation may be found in the PICmicro™ Mid-Range Reference Manual, (DS33023).
8.3.1 SLAVE MODE In slave mode, the SCL and SDA pins must be config-
ured as inputs (TRISC<4:3> set). The SSP module will override the input state with the output data when required (slave-transmitter).
When an address is matched or the data transfer after an address match is received, the hardware automati­cally will generate the acknowledge (A
CK) pulse, and then load the SSPBUF register with the received value currently in the SSPSR register.
There are certain conditions that will cause the SSP module not to give this A
CK pulse. These are if either
(or both): a) The buffer full bit BF (SSPSTAT<0>) was set
before the transfer was received.
b) The overflow bit SSPOV (SSPCON<6>) was set
before the transfer was received.
In this case, the SSPSR register value is not loaded into the SSPBUF, but bit SSPIF (PIR1<3>) is set. Table 8-2 shows what happens when a data transfer byte is received, given the status of bits BF and SSPO V. The shaded cells show the condition where user soft­ware did not properly clear the overflow condition. Flag bit BF is cleared by reading the SSPBUF register while bit SSPOV is cleared through software.
The SCL clock input must have a minimum high and low for proper operation. The high and low times of the I
2
C specification as well as the requirement of the SSP module is shown in timing parameter #100 and param­eter #101.
Read Write
SSPSR reg
Match detect
SSPADD reg
Start and
Stop bit detect
SSPBUF reg
Internal
data bus
Addr Match
Set, Reset S, P bits
(SSPSTAT reg)
RC3/SCK/SCL
RC4/
shift
clock
MSb
SDI/
LSb
SDA
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 45
8.3.1.1 ADDRESSING Once the SSP module has been enabled, it waits for a
START condition to occur. Following the START condi­tion, the 8-bits are shifted into the SSPSR register. All incoming bits are sampled with the rising edge of the clock (SCL) line. The value of register SSPSR<7:1> is compared to the value of the SSPADD register. The address is compared on the falling edge of the eighth clock (SCL) pulse. If the addresses match, and the BF and SSPOV bits are clear, the following events occur:
a) The SSPSR register value is loaded into the
SSPBUF register. b) The buffer full bit, BF is set. c) An A
CK pulse is generated.
d) SSP interr upt flag bit, SSPIF (PIR1<3>) is set
(interrupt is generated if enabled) - on the falling
edge of the ninth SCL pulse. In 10-bit address mode, two address bytes need to be
received by the slave. The five Most Significant bits (MSbs) of the first address byte specify if this is a 10-bit address. Bit R/W
(SSPSTAT<2>) must specify a write so the slave device will receive the second address byte. For a 10-bit address the first byte would equal
1111 0 A9 A8 0’, where A9 and A8 are the two MSbs of the address. The sequence of events for 10-bit address is as follows, with steps 7- 9 f or slav e-transmit­ter:
1. Receive first (high) byte of Address (bits SSPIF, BF, and bit UA (SSPSTAT<1>) are set).
2. Update the SSPADD register with second (low) byte of Address (clears bit UA and releases the SCL line).
3. Read the SSPBUF register (clears bit BF) and clear flag bit SSPIF.
4. Receive second (low) byte of Address (bits SSPIF, BF, and UA are set).
5. Update the SSPADD register with the first (high) byte of Address, if match releases SCL line, this will clear bit UA.
6. Read the SSPBUF register (clears bit BF) and clear flag bit SSPIF.
7. Receive repeated START condition.
8. Receive first (high) byte of Address (bits SSPIF and BF are set).
9. Read the SSPBUF register (clears bit BF) and clear flag bit SSPIF.
TABLE 8-2 DATA TRANSFER RECEIVED BYTE ACTIONS
Status Bits as Data
Transfer is Received
SSPSR
SSPBUF
Generate A
CK
Pulse
Set bit SSPIF
(SSP Interrupt occurs
if enabled)
BF SSPOV
00 Yes Ye s Yes 10 No No Yes 11 No No Yes 0 1 Yes No Yes
Note:Shaded cells show the conditions where the user software did not properly clear the overflow condition.
PIC16C62B/72A
DS35008A-page 46 Preliminary 1998 Microchip Technology Inc.
8.3.1.2 RECEPTION When the R/W
bit of the address byte is clear and an
address match occurs, the R/W
bit of the SSPSTAT register is cleared. The received address is loaded into the SSPBUF register.
When the address byte overflow condition exists, then no acknowledge (A
CK) pulse is given. An ov erflow con­dition is defined as either bit BF (SSPSTAT<0>) is set or bit SSPOV (SSPCON<6>) is set.
An SSP interrupt is generated for each data transfer byte. Flag bit SSPIF (PIR1<3>) must be cleared in soft­ware. The SSPSTAT register is used to determine the status of the byte.
FIGURE 8-5: I2C WAVEFORMS FOR RECEPTION (7-BIT ADDRESS)
P
9
8
7
6
5
D0
D1
D2
D3D4
D5
D6D7
S
A7 A6 A5 A4
A3 A2 A1SDA
SCL
1234
5
6
7
8
9
1234
56
7
89
123
4
Bus Master terminates transfer
Bit SSPOV is set because the SSPBUF register is still full.
Cleared in software
SSPBUF register is read
A
CK
Receiving Data
Receiving Data
D0
D1
D2
D3D4
D5
D6D7
A
CK
R/W=0
Receiving Address
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
SSPOV (SSPCON<6>)
A
CK
ACK is not sent.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 47
8.3.1.3 TRANSMISSION When the R/W
bit of the incoming address byte is set
and an address match occurs, the R/W
bit of the SSPSTAT register is set. The received address is loaded into the SSPBUF register. The A
CK pulse will be sent on the ninth bit, and pin RC3/SCK/SCL is held low. The transmit data must be loaded into the SSP­BUF register, which also loads the SSPSR register. Then pin RC3/SCK/SCL should be enabled by setting bit CKP (SSPCON<4>). The master must monitor the SCL pin prior to asserting another clock pulse. The slave devices ma y be holding off the master b y stretch­ing the clock. The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time (Figure 8-6).
An SSP interrupt is generated for each data transfer byte. Flag bit SSPIF must be cleared in software, and the SSPSTAT register is used to determine the status of the byte. Flag bit SSPIF is set on the falling edge of the ninth clock pulse.
As a slave-transmitter, the A
CK pulse from the master­receiver is latched on the rising edge of the ninth SCL input pulse. If the SD A line was high (not A
CK), then the
data transfer is complete. When the A
CK is latched by the slave, the sla ve logic is reset (resets SSPSTAT reg­ister) and the slave then monitors for another occur­rence of the START bit. If the SDA line was low (A
CK), the transmit data must be loaded into the SSPBUF reg­ister, which also loads the SSPSR register. Then pin RC3/SCK/SCL should be enabled by setting bit CKP.
FIGURE 8-6: I2C WAVEFORMS FOR TRANSMISSION (7-BIT ADDRESS)
SDA
SCL
SSPIF (PIR1<3>) BF (SSPSTAT<0>)
CKP (SSPCON<4>)
A7 A6 A5 A4 A3 A2 A1 ACK D7 D6 D5 D4 D3 D2 D1 D0
A
CKTransmitting DataR/W = 1Receiving Address
123456789 123456789
P
cleared in software
SSPBUF is written in software
From SSP interrupt
service routine
Set bit after writing to SSPBUF
S
Data in sampled
SCL held low while CPU
responds to SSPIF
(the SSPBUF must be written-to before the CKP bit can be set)
PIC16C62B/72A
DS35008A-page 48 Preliminary 1998 Microchip Technology Inc.
8.3.2 MASTER OPERATION Master operation is supported in firmware using inter-
rupt generation on the detection of the START and STOP conditions. The STOP (P) and START (S) bits are cleared from a reset or when the SSP module is disabled. The STOP (P) and START (S) bits will toggle based on the START and STOP conditions. Control of the I
2
C bus may be taken when the P bit is set, or the
bus is idle and both the S and P bits are clear. In master operation, the SCL and SDA lines are manip-
ulated in firmware by clearing the corresponding TRISC<4:3> bit(s). The output level is always low, irre­spective of the value(s) in PORTC<4:3>. So when transmitting data, a '1' data bit must have the TRISC<4> bit set (input) and a '0' data bit must have the TRISC<4> bit cleared (output). The same scenario is true for the SCL line with the TRISC<3> bit.
The following events will cause SSP Interrupt Flag bit, SSPIF, to be set (SSP Interrupt if enabled):
• START condition
• STOP condition
• Data transfer byte transmitted/received Master operation can be done with either the slave
mode idle (SSPM3:SSPM0 = 1011) or with the slave active. When both master operation and slave modes are used, the software needs to differentiate the source(s) of the interrupt.
For more information on master operation, see
AN554
- Software Implementation of I
2
C Bus Master
.
8.3.3 MULTI-MASTER OPERATION In multi-master operation, the interrupt generation on
the detection of the START and STOP conditions allows the determination of when the bus is free. The STOP (P) and START (S) bits are cleared from a reset or when the SSP module is disabled. The STOP (P) and ST AR T (S) bits will toggle based on the START and STOP conditions. Control of the I
2
C bus may be taken when bit P (SSPSTAT<4>) is set, or the bus is idle and both the S and P bits clear. When the bus is busy, enabling the SSP Interrupt will generate the interrupt when the STOP condition occurs.
In multi-master operation, the SDA line must be moni­tored to see if the signal level is the expected output level. This check only needs to be done when a high level is output. If a high le v el is expected and a lo w lev el is present, the device needs to release the SDA and SCL lines (set TRISC<4:3>). There are two stages where this arbitration can be lost, these are:
• Address T r ansfer
• Data T r ansfer When the slave logic is enabled, the sla v e contin ues to
receive. If arbitr ation was lost during the address trans­fer stage, communication to the device may be in progress. If addressed an A
CK pulse will be generated. If arbitration was lost during the data transfer stage, the device will need to re-transfer the data at a later time.
For more information on master operation, see
AN578
- Use of the SSP Module in the of I
2
C Multi-Master
Environment
.
TABLE 8-3 REGISTERS ASSOCIATED WITH I2C OPERATION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on
all other
resets
0Bh, 8Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF
0000 000x 0000 000u
0Ch
PIR1
ADIF
SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch
PIE1
ADIE
SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register
xxxx xxxx uuuu uuuu
93h SSPADD Synchronous Serial Port (I2C mode) Address Register
0000 0000 0000 0000
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0
0000 0000 0000 0000
94h SSPSTAT SMP CKE D/A P S R/W UA BF
0000 0000 0000 0000
87h TRISC
PORTC Data Direction register
1111 1111 1111 1111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'.
Shaded cells are not used by SSP module in SPI mode.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 49
9.0 ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE
This section applies to the PIC16C72A only. The
analog-to-digital (A/D) converter module has five inputs.
The A/D allows conversion of an analog input signal to a corresponding 8-bit digital number (refer to Applica­tion Note AN546 for use of A/D Converter). The output of the sample and hold is the input into the converter, which generates the result via successive approxima­tion. The analog reference voltage is software select­able to either the device’ s positiv e supply v oltage (V
DD)
or the voltage level on the RA3/AN3/V
REF pin.
The A/D converter has a unique feature of being able to operate while the device is in SLEEP mode. To operate in sleep, the A/D conv ersion clock must be derived from the A/D’s internal RC oscillator.
Additional information on the A/D module is available in the PICmicro™ Mid-Range Reference Manual, (DS33023).
The A/D module has three registers. These registers are:
• A/D Result Register (ADRES)
• A/D Control Register 0 (ADCON0)
• A/D Control Register 1 (ADCON1)
A device reset forces all registers to their reset state. This forces the A/D module to be turned off, and any conversion is aborted.
The ADCON0 register, shown in Figure 9-1, controls the operation of the A/D module. The ADCON1 regis­ter, shown in Figure 9-2, configures the functions of the port pins. The port pins can be configured as analog inputs (RA3 can also be a voltage reference) or as dig­ital I/O.
FIGURE 9-1: ADCON0 REGISTER (ADDRESS 1Fh)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0
ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE
ADON R =Readable bit
W =Writable bit U =Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-6: ADCS1:ADCS0: A/D Conversion Clock Select bits
00 = F
OSC/2
01 = F
OSC/8
10 = F
OSC/32
11 = F
RC (clock derived from an internal RC oscillator)
bit 5-3: CHS2:CHS0: Analog Channel Select bits
000 = channel 0, (RA0/AN0) 001 = channel 1, (RA1/AN1) 010 = channel 2, (RA2/AN2) 011 = channel 3, (RA3/AN3) 100 = channel 4, (RA5/AN4)
bit 2: GO/DONE
: A/D Conversion Status bit
If ADON = 1 1 = A/D conversion in progress (setting this bit starts the A/D conversion) 0 = A/D conversion not in progress (This bit is automatically cleared by hardw are when the A/D conversion
is complete) bit 1: Unimplemented: Read as '0' bit 0: ADON: A/D On bit
1 = A/D converter module is operating
0 = A/D converter module is shutoff and consumes no operating current
PIC16C62B/72A
DS35008A-page 50 Preliminary 1998 Microchip Technology Inc.
FIGURE 9-2: ADCON1 REGISTER (ADDRESS 9Fh)
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
PCFG2 PCFG1 PCFG0 R =Readable bit
W =Writable bit U =Unimplemented
bit, read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-3: Unimplemented: Read as '0' bit 2-0: PCFG2:PCFG0: A/D Port Configuration Control bits
A = Analog input D = Digital I/O
PCFG2:PCFG0 RA0 RA1 RA2 RA5 RA3 VREF
000 AAAAA VDD 001 AAAAVREF RA3 010 AAAAA V
DD
011 AAAAVREF RA3 100 AADDA V
DD
101 AADDVREF RA3 11x DDDDD V
DD
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 51
The ADRES register contains the result of the A/D con­version. When the A/D conversion is complete, the result is loaded into the ADRES register, the GO/DONE bit (ADCON0<2>) is cleared, and A/D interrupt flag bit ADIF is set. The block diagram of the A/D module is shown in Figure 9-3.
The value that is in the ADRES register is not modified for a Power-on Reset. The ADRES register will contain unknown data after a Power-on Reset.
After the A/D module has been configured as desired, the selected channel must be acquired before the con­version is started. The analog input channels must have their corresponding TRIS bits selected as an input. To deter mine acquisition time, see Section 9.1. After this acquisition time has elapsed the A/D conver­sion can be started. The following steps should be fol­lowed for doing an A/D conversion:
1. Configure the A/D module:
• Configure analog pins / voltage reference / and digital I/O (ADCON1)
• Select A/D input channel (ADCON0)
• Select A/D conversion clock (ADCON0)
• Turn on A/D module (ADCON0)
2. Configure A/D interrupt (if desired):
• Clear ADIF bit
• Set ADIE bit
• Set GIE bit
3. Wait the required acquisition time.
4. Start conversion:
• Set GO/DONE
bit (ADCON0)
5. Wait for A/D conversion to complete, by either:
• Polling for the GO/DONE
bit to be cleared
OR
• Waiting for the A/D interrupt
6. Read A/D Result register (ADRES), clear bit ADIF if required.
7. For next conversion, go to step 1 or step 2 as required. The A/D conversion time per bit is defined as T
AD. A minimum wait of 2TAD is
required before next acquisition starts.
FIGURE 9-3: A/D BLOCK DIAGRAM
(Input voltage)
V
IN
VREF
(Reference
voltage)
V
DD
PCFG2:PCFG0
CHS2:CHS0
000 or 010 or 100
001 or 011 or 101
RA5/AN4
RA3/AN3/V
REF
RA2/AN2
RA1/AN1
RA0/AN0
100
011
010
001
000
A/D
Converter
PIC16C62B/72A
DS35008A-page 52 Preliminary 1998 Microchip Technology Inc.
9.1 A/D Acquisition Requirements
For the A/D converter to meet its specified accuracy, the charge holding capacitor (C
HOLD) must be allowed
to fully charge to the input channel voltage level. The analog input model is shown in Figure 9-4. The source impedance (R
S) and the internal sampling switch (RSS)
impedance directly affect the time required to charge the capacitor C
HOLD. The sampling switch (RSS)
impedance varies over the device voltage (V
DD). The
source impedance affects the offset voltage at the ana­log input (due to pin leakage current). The maximum
recommended impedance for analog sources is 10 k. After the analog input channel is selected
(changed) this acquisition must be done before the conversion can be started.
To calculate the minimum acquisition time, T
ACQ, see
the PICmicro™ Mid-Range Reference Manual, (DS33023). This equation calculates the acquisition time to within 1/2 LSb error (512 steps for the A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified accuracy.
FIGURE 9-4: ANALOG INPUT MODEL
Note: When the conversion is started, the hold-
ing capacitor is disconnected from the input pin.
CPIN
VA
Rs
ANx
5 pF
V
DD
VT = 0.6V
V
T = 0.6V
I leakage
R
IC 1k
Sampling Switch
SS
R
SS
CHOLD = DAC capacitance
V
SS
6V
Sampling Switch
5V 4V 3V 2V
5 6 7 8 9 10 11
(k)
VDD
= 51.2 pF
± 500 nA
Legend CPIN
VT I leakage
RIC SS C
HOLD
= input capacitance = threshold voltage
= leakage current at the pin due to
= interconnect resistance = sampling switch = sample/hold capacitance (from DAC)
various junctions
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 53
9.2 Selecting the A/D Conversion Clock
The A/D conversion time per bit is defined as TAD. The A/D conversion requires 9.5T
AD per 8-bit conversion.
The source of the A/D conversion clock is software selectable. The four possible options for T
AD are:
•2T
OSC
•8TOSC
• 32TOSC
• Internal RC oscillator
For correct A/D conversions, the A/D conversion clock (T
AD) must be selected to ensure a minimum TAD time
of 1.6 µs. Table 9-1 shows the resultant T
AD times derived from
the device operating frequencies and the A/D clock source selected.
9.3 Configuring Analog Port Pins
The ADCON1 and TRISA registers control the opera­tion of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bits set (input). If the TRIS bit is cleared (output), the digital output level (V
OH or VOL) will be converted.
The A/D operation is independent of the state of the CHS2:CHS0 bits and the TRIS bits.
TABLE 9-1 TAD vs. DEVICE OPERATING FREQUENCIES
Note 1: When reading the port register, all pins
configured as analog input channels will read as cleared (a low level). Pins config­ured as digital inputs, will convert an ana­log input. Analog levels on a digitally configured input will not affect the conver­sion accuracy.
Note 2: Analog levels on any pin that is defined as
a digital input (including the AN4:AN0 pins), may cause the input buffer to con­sume current that is out of the devices specification.
AD Clock Source (TAD) Device Frequency
Operation ADCS1:ADCS0 20 MHz 5 MHz 1.25 MHz 333.33 kHz
2T
OSC 00
100 ns
(2)
400 ns
(2)
1.6 µs6 µs
8TOSC 01
400 ns
(2)
1.6 µs 6.4 µs
24 µs
(3)
32TOSC 10 1.6 µs 6.4 µs
25.6 µs
(3)
96 µs
(3)
RC
(5)
11
2 - 6 µs
(1,4)
2 - 6 µs
(1,4)
2 - 6 µs
(1,4)
2 - 6 µs
(1)
Legend: Shaded cells are outside of recommended range. Note 1: The RC source has a typical T
AD time of 4 µs.
2: These values violate the minimum required T
AD time.
3: For faster conversion times, the selection of another clock source is recommended. 4: When device frequency is greater than 1 MHz, the RC A/D conversion clock source is recommended for
sleep operation only.
5: For extended voltage devices (LC), please refer to Electrical Specifications section.
PIC16C62B/72A
DS35008A-page 54 Preliminary 1998 Microchip Technology Inc.
9.4 A/D Conversions
9.5 Use of the CCP Trigger
An A/D conversion can be started by the “special ev ent trigger” of the CCP2 module. This requires that the CCP2M3:CCP2M0 bits (CCP2CON<3:0>) be pro­grammed as 1011 and that the A/D module is enabled (ADON bit is set). When the trigger occurs, the
GO/DONE
bit will be set, starting the A/D conversion, and the Timer1 counter will be reset to zero. Timer1 is reset to automatically repeat the A/D acquisition period with minimal software overhead (moving the ADRES to the desired location). The appropriate analog input channel must be selected and the minimum acquisition done before the “special event trigger” sets the GO/DONE
bit (starts a conversion). If the A/D module is not enabled (ADON is cleared),
then the “special event trigger” will be ignored by the A/D module, but will still reset the Timer1 counter.
TABLE 9-2 SUMMARY OF A/D REGISTERS
Note: The GO/DONE bit should NOT be set in
the same instruction that turns on the A/D.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on all
other Resets
0Bh,8Bh
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch
PIR1
ADIF SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch
PIE1
ADIE SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000
1Eh
ADRES A/D Result Register xxxx xxxx uuuu uuuu
1Fh
ADCON0 ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE ADON 0000 00-0 0000 00-0
9Fh
ADCON1 PCFG2 PCFG1 PCFG0 ---- -000 ---- -000
05h PORTA RA5 RA4 RA3 RA2 RA1 RA0
--0x 0000 --0u 0000
85h TRISA PORTA Data Direction Register
--11 1111 --11 1111
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used for A/D conversion.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 55
10.0 SPECIAL FEATURES OF THE CPU
The PIC16C62B/72A devices have a host of features intended to maximize system reliability, minimize cost through elimination of external components, provide power saving operating modes and offer code protec­tion. These are:
• OSC Selection
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Brown-out Reset (BOR)
• Interrupts
• Watchdog Timer (WDT)
• SLEEP
• Code protection
• ID locations
• In-circuit serial programming™
These devices have a Watchdog Timer which can be shut off only through configuration bits. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in reset until the crystal oscillator is stable. The
other is the Power-up Timer (PWRT), which provides a fixed delay on pow er-up only, designed to keep the part in reset while the power supply stabilizes. With these two timers on-chip, most applications need no external reset circuitry.
SLEEP mode is designed to offer a very low current power-down mode. The user can w ake-up from SLEEP through external reset, Watchdog Timer Wake-up, or through an interrupt. Several oscillator options are also made available to allow the part to fit the application. The RC oscillator option saves system cost while the LP crystal option saves power. A set of configuration bits are used to select various options.
Additional information on special features is av ailable in the PICmicro™ Mid-Range Reference Manual, (DS33023).
10.1 Configuration Bits
The configuration bits can be programmed (read as '0') or left unprogrammed (read as '1') to select various device configurations. These bits are mapped in pro­gram memory location 2007h.
The user will note that address 2007h is beyond the user program memory space. In fact, it belongs to the special test/configuration memory space (2000h ­3FFFh), which can be accessed only during program­ming.
FIGURE 10-1: CONFIGURATION WORD
CP1 CP0 CP1 CP0 CP1 CP0 BODEN CP1 CP0 PWRTE WDTE FOSC1 FOSC0
Register:CONFIG Address2007h
bit13 bit0
bit 13-8 CP1:CP0: Code Protection bits
(2)
5-4: 11 = Code protection off
10 = Upper half of program memory code protected 01 = Upper 3/4th of program memory code protected 00 = All memory is code protected
bit 7: Unimplemented: Read as '1' bit 6: BODEN: Brown-out Reset Enable bit
(1)
1 = BOR enabled 0 = BOR disabled
bit 3: PWRTE: Power-up Timer Enable bit
(1)
1 = PWRT disabled 0 = PWRT enabled
bit 2: WDTE: Watchdog Timer Enable bit
1 = WDT enabled 0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator Selection bits
11 = RC oscillator 10 = HS oscillator 01 = XT oscillator 00 = LP oscillator
Note 1: Enabling Brown-out Reset automatically enables Power-up Timer (PWRT) regardless of the value of bit PWRTE.
Ensure the Power-up Timer is enabled anytime Brown-out Reset is enabled.
2: All of the CP1:CP0 pairs have to be given the same value to enable the code protection scheme listed.
PIC16C62B/72A
DS35008A-page 56 Preliminary 1998 Microchip Technology Inc.
10.2 Oscillator Configurations
10.2.1 OSCILLATOR TYPES The PIC16CXXX can be operated in four different oscil-
lator modes. The user can program two configuration bits (FOSC1 and FOSC0) to select one of these four modes:
• LP Low Power Crystal
• XT Crystal/Resonator
• HS High Speed Crystal/Resonator
• RC Resistor/Capacitor
10.2.2 CRYSTAL OSCILLATOR/CERAMIC RESONATORS
In XT, LP or HS modes a cr ystal or ceramic resonator is connected to the OSC1/CLKIN and OSC2/CLKOUT pins to establish oscillation (Figure 10-2). The PIC16CXXX Oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specifica­tions. When in XT, LP or HS modes, the device can have an external clock source to drive the OSC1/CLKIN pin (Figure 10-3).
FIGURE 10-2: CRYSTAL/CERAMIC
RESONATOR OPERATION (HS, XT OR LP OSC CONFIGURATION)
FIGURE 10-3: EXTERNAL CLOCK INPUT
OPERATION (HS, XT OR LP OSC CONFIGURATION)
TABLE 10-1 CERAMIC RESONATORS
TABLE 10-2 CAPACITOR SELECTION
FOR CRYSTAL OSCILLATOR
Note1: See Table 10-1 and Table 10-2 for recom-
mended values of C1 and C2.
2: A series resistor (RS) may be required for
AT strip cut crystals.
3: RF varies with the crystal chosen.
C1
(1)
C2
(1)
XTAL
OSC2
OSC1
RF
(3)
SLEEP
To
logic
PIC16CXXX
RS
(2)
internal
OSC1
OSC2
Open
Clock from ext. system
PIC16CXXX
Ranges Tested:
Mode Freq OSC1 OSC2
XT 455 kHz
2.0 MHz
4.0 MHz
68 - 100 pF 15 - 68 pF 15 - 68 pF
68 - 100 pF 15 - 68 pF 15 - 68 pF
HS 8.0 MHz
16.0 MHz
10 - 68 pF 10 - 22 pF
10 - 68 pF 10 - 22 pF
These values are for design guidance only. See notes at bottom of page.
Resonators Used:
455 kHz Panasonic EFO-A455K04B ± 0.3%
2.0 MHz Murata Erie CSA2.00MG ± 0.5%
4.0 MHz Murata Erie CSA4.00MG ± 0.5%
8.0 MHz Murata Erie CSA8.00MT ± 0.5%
16.0 MHz Murata Erie CSA16.00MX ± 0.5%
All resonators used did not have built-in capacitors.
Osc Type
Crystal
Freq
Cap. Range C1Cap. Range
C2
LP 32 kHz 33 pF 33 pF
200 kHz 15 pF 15 pF
XT 200 kHz 47-68 pF 47-68 pF
1 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF
HS 4 MHz 15 pF 15 pF
8 MHz 15-33 pF 15-33 pF
20 MHz 15-33 pF 15-33 pF
These values are for design guidance only. See notes at bottom of page.
Crystals Used
32 kHz Epson C-001R32.768K-A ± 20 PPM
200 kHz STD XTL 200.000KHz ± 20 PPM
1 MHz ECS ECS-10-13-1 ± 50 PPM 4 MHz ECS ECS-40-20-1 ± 50 PPM 8 MHz EPSON CA-301 8.000M-C ± 30 PPM
20 MHz EPSON CA-301 20.000M-C ± 30 PPM
Note 1: Recommended values of C1 and C2 are
identical to the ranges tested (Table 10-1).
2: Higher capacitance increases the stability
of oscillator but also increases the start-up time.
3: Since each resonator/crystal has its own
characteristics, the user should consult the resonator/crystal manufacturer for appropri­ate values of external components.
4: Rs may be required in HS mode as well as
XT mode to avoid overdriving crystals with low drive level specification.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 57
10.2.3 RC OSCILLATOR For timing insensitive applications the “RC” device
option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resis­tor (R
EXT) and capacitor (CEXT) values, and the operat-
ing temperature. In addition to this, the oscillator frequency will vary from unit to unit due to normal pro­cess parameter variation. Further more, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low C
EXT values. The user also needs to take into account
variation due to tolerance of external R and C compo­nents used. Figure 10-4 shows how the R/C combina­tion is connected to the PIC16CXXX.
FIGURE 10-4: RC OSCILLATOR MODE
10.3 Reset
The PIC16CXXX differentiates between various kinds of reset:
• Power-on Reset (POR)
• MCLR
reset during normal operation
• MCLR
reset during SLEEP
• WDT Reset (during normal operation)
• WDT Wake-up (during SLEEP)
• Brown-out Reset (BOR) Some registers are not affected in any reset condition;
their status is unknown on POR and unchanged in any other reset. Most other registers are reset to a “reset state” on Power-on Reset (POR), on the MCLR
and
WDT Reset, on MCLR
reset during SLEEP, and Brown­out Reset (BOR). They are not affected by a WDT Wake-up, which is viewed as the resumption of normal operation. The T
O and PD bits are set or cleared differ­ently in different reset situations as indicated in Table 10-4. These bits are used in software to deter­mine the nature of the reset. See Table 10-6 for a full description of reset states of all registers.
A simplified block diagram of the on-chip reset circuit is shown in Figure 10-5.
The PICmicros have a MCLR
noise filter in the MCLR
reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset
does not drive
MCLR
pin low.
OSC2/CLKOUT
Cext
Rext
PIC16CXX
OSC1
Fosc/4
Internal
clock
VDD
VSS
Recommended values: 3 k Rext 100 k
Cext > 20pF
PIC16C62B/72A
DS35008A-page 58 Preliminary 1998 Microchip Technology Inc.
FIGURE 10-5: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
R
Q
External
Reset
MCLR
VDD
OSC1
WDT
Module
V
DD rise
detect
OST/PWRT
On-chip RC OSC
WDT
Time-out
Power-on Reset
OST
10-bit Ripple counter
PWRT
Chip_Reset
10-bit Ripple counter
Reset
Enable OST
Enable PWRT
SLEEP
Note 1: This is a separate oscillator from the RC oscillator of the CLKIN pin.
Brown-out
Reset
BODEN
(1)
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 59
10.4 Power-On Reset (POR)
A Power-on Reset pulse is generated on-chip when V
DD rise is detected (in the range of 1.5V - 2.1V). To
take advantage of the POR, just tie the MCLR
pin
directly (or through a resistor) to V
DD. This will elimi-
nate external RC components usually needed to create a Power-on Reset. A maximum rise time for V
DD is
specified (parameter D004). For a slow rise time, see Figure 10-6.
When the device starts normal operation (exits the reset condition), device operating parameters (voltage , frequency , temperature,...) must be met to ensure oper­ation. If these conditions are not met, the device must be held in reset until the operating conditions are met. Brown-out Reset may be used to meet the start-up con­ditions.
FIGURE 10-6: EXTERNAL POWER-ON
RESET CIRCUIT (FOR SLOW VDD POWER-UP)
10.5 Power-up Timer (PWRT)
The Power-up Timer provides a fixed nominal time-out (parameter #33), on power-up only, from the POR. The Power-up Timer operates on an inter nal RC oscillator. The chip is kept in reset as long as the PWRT is active . The PWRT’ s time delay allows V
DD to rise to an accept-
able level. A configuration bit is provided to enable/dis­able the PWRT.
The power-up time delay will v ary from chip to chip due to V
DD, temperature, and process variation. See DC
parameters for details.
10.6 Oscillator Start-up Timer (OST)
The Oscillator Start-up Timer (OST) provides 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is ov er (parameter #32). This ensures that the crystal oscillator or resonator has started and stabi­lized.
The OST time-out is invoked only for XT, LP and HS modes and only on Power-on Reset or wake-up from SLEEP.
10.7 Brown-Out Reset (BOR)
A configuration bit, BODEN, can disable (if clear/pro­grammed) or enable (if set) the Brown-out Reset cir­cuitry. If V
DD falls below parameter D005 for greater
than parameter #35, the brown-out situation will reset the chip. A reset may not occur if V
DD falls below
parameter D005 for less than parameter #35. The chip will remain in Brown-out Reset until V
DD rises above
BV
DD. The P ow er-up Timer will then be invok ed and will
keep the chip in RESET an additional time delay (parameter #33). If V
DD drops below BVDD while the
Power-up Timer is r unning, the chip will go back into a Brown-out Reset and the Po wer-up Timer will be initial­ized. Once V
DD rises above BVDD, the P o w er-up Timer
will execute the additional time delay. The Power-up Timer should always be enabled when Brown-out Reset is enabled.
Note 1: External Power-on Reset circuit is required
only if V
DD power-up slope is too slow . The
diode D helps discharge the capacitor quickly when V
DD powers down.
2: R < 40 k is recommended to make sure
that voltage drop across R does not violate the device’s electrical specification.
3: R1 = 100 to 1 k will limit any current
flowing into MCLR from external capacitor C in the event of MCLR/
VPP pin break­down due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS).
C
R1
R
D
V
DD
MCLR
PIC16CXXX
PIC16C62B/72A
DS35008A-page 60 Preliminary 1998 Microchip Technology Inc.
10.8 Time-out Sequence
On power-up the time-out sequence is as follows: First PWRT time-out is invok ed after the POR time delay has expired. Then OST is activated. The total time-out will vary based on oscillator configuration and the status of the PWRT. For example, in RC mode with the PWRT disabled, there will be no time-out at all. Figure 10-7, Figure 10-8, Figure 10-9 and Figure 10-10 depict time­out sequences on power-up.
Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire . Then bringing MCLR
high will begin execution immediately (Figure 10-9). This is useful for testing purposes or to synchronize more than one PIC16CXXX device operat­ing in parallel.
Table 10-5 shows the reset conditions for some special function registers, while Table 10-6 shows the reset conditions for all the registers.
10.9 Power Control/Status Register (PCON)
The Power Control/Status Register, PCON has up to two bits, depending upon the device.
Bit0 is Brown-out Reset Status bit, BOR
. If the BODEN
configuration bit is set, BOR
is ’1’ on Power-on Reset.
If the BODEN configuration bit is clear, BOR
is
unknown on Power-on Reset. The BOR
status bit is a "don't care" and is not neces­sarily predictable if the brown-out circuit is disabled (the BODEN configuration bit is clear). BOR
must then be set by the user and checked on subsequent resets to see if it
is clear, indicating a brown-out has occurred.
Bit1 is POR
(Power-on Reset Status bit). It is cleared on a Power-on Reset and unaffected otherwise. The user must set this bit following a Power-on Reset.
TABLE 10-3 TIME-OUT IN VARIOUS SITUATIONS
TABLE 10-4 STATUS BITS AND THEIR SIGNIFICANCE
TABLE 10-5 RESET CONDITION FOR SPECIAL REGISTERS
Oscillator Configuration
Power-up
Brown-out
Wake-up from
SLEEP
PWR
TE = 0 PWRTE = 1
XT, HS, LP 72 ms + 1024T
OSC 1024TOSC 72 ms + 1024TOSC 1024TOSC
RC 72 ms 72 ms
POR
BOR TO PD
0x11Power-on Reset 0x0xIllegal, T
O is set on POR
0xx0Illegal, PD is set on POR 1011Brown-out Reset 1101WDT Reset 1100WDT Wake-up 11uuMCLR
Reset during normal operation
1110MCLR
Reset during SLEEP or interrupt wake-up from SLEEP
Condition
Program
Counter
STATUS
Register
PCON
Register
Power-on Reset 000h 0001 1xxx ---- --0x MCLR
Reset during normal operation 000h 000u uuuu ---- --uu
MCLR
Reset during SLEEP 000h 0001 0uuu ---- --uu WDT Reset 000h 0000 1uuu ---- --uu WDT Wake-up PC + 1 uuu0 0uuu ---- --uu Brown-out Reset 000h 0001 1uuu ---- --u0 Interrupt wake-up from SLEEP PC + 1
(1)
uuu1 0uuu ---- --uu
Legend: u = unchanged, x = unknown, - = unimplemented bit read as '0'.
Note 1: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h).
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 61
TABLE 10-6 INITIALIZATION CONDITIONS FOR ALL REGISTERS
Register Applicable
Devices
Power-on Reset,
Brown-out Reset
MCLR Resets
WDT Reset
Wake-up via WDT or
Interrupt
W 62B 72A xxxx xxxx uuuu uuuu uuuu uuuu INDF 62B 72A N/A N/A N/A TMR0 62B 72A xxxx xxxx uuuu uuuu uuuu uuuu PCL 62B 72A 0000h 0000h
PC + 1
(2)
STATUS 62B 72A 0001 1xxx
000q quuu
(3)
uuuq quuu
(3)
FSR 62B 72A xxxx xxxx uuuu uuuu uuuu uuuu PORTA
(4)
62B 72A --0x 0000 --0u 0000 --uu uuuu
PORTB
(5)
62B 72A xxxx xxxx uuuu uuuu uuuu uuuu
PORTC
(5)
62B 72A xxxx xxxx uuuu uuuu uuuu uuuu
PCLATH 62B 72A ---0 0000 ---0 0000 ---u uuuu INTCON 62B 72A 0000 000x 0000 000u
uuuu uuuu
(1)
PIR1
62B
72A ---- 0000 ---- 0000
---- uuuu
(1)
62B 72A -0-- 0000 -0-- 0000
-u-- uuuu
(1)
TMR1L 62B 72A xxxx xxxx uuuu uuuu uuuu uuuu TMR1H 62B 72A xxxx xxxx uuuu uuuu uuuu uuuu T1CON 62B 72A --00 0000 --uu uuuu --uu uuuu TMR2 62B 72A 0000 0000 0000 0000 uuuu uuuu T2CON 62B 72A -000 0000 -000 0000 -uuu uuuu SSPBUF 62B 72A xxxx xxxx uuuu uuuu uuuu uuuu SSPCON 62B 72A 0000 0000 0000 0000 uuuu uuuu CCPR1L 62B 72A xxxx xxxx uuuu uuuu uuuu uuuu CCPR1H 62B 72A xxxx xxxx uuuu uuuu uuuu uuuu CCP1CON 62B 72A --00 0000 --00 0000 --uu uuuu ADRES
62B 72A xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0
62B 72A 0000 00-0 0000 00-0 uuuu uu-u OPTION_REG 62B 72A 1111 1111 1111 1111 uuuu uuuu TRISA 62B 72A --11 1111 --11 1111 --uu uuuu TRISB 62B 72A 1111 1111 1111 1111 uuuu uuuu TRISC 62B 72A 1111 1111 1111 1111 uuuu uuuu
PIE1
62B
72A ---- 0000 ---- 0000 ---- uuuu
62B 72A -0-- 0000 -0-- 0000 -u-- uuuu PCON 62B 72A ---- --0q ---- --uq ---- --uq PR2 62B 72A 1111 1111 1111 1111 1111 1111 SSPADD 62B 72A 0000 0000 0000 0000 uuuu uuuu SSPSTAT 62B 72A 0000 0000 0000 0000 uuuu uuuu ADCON1
62B 72A ---- -000 ---- -000 ---- -uuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as '0', q = value depends on condition Note 1: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). 3: See Table 10-5 for reset value for specific condition.
4: On any device reset, these pins are configured as inputs. 5: This is the value that will be in the port output latch.
PIC16C62B/72A
DS35008A-page 62 Preliminary 1998 Microchip Technology Inc.
FIGURE 10-7: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)
FIGURE 10-8: TIME-OUT SEQUENCE ON POWER-UP (MCLR
NOT TIED TO VDD): CASE 1
FIGURE 10-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
TPWRT
TOST
VDD
MCLR
INTERNAL POR
PWR
T TIME-OUT
OST TIME-OUT
INTERNAL RESET
TPWRT
TOST
VDD
MCLR
INTERNAL POR
PWR
T TIME-OUT
OST TIME-OUT
INTERNAL RESET
VDD
MCLR
INTERNAL POR
PWR
T TIME-OUT
OST TIME-OUT
INTERNAL RESET
TPWRT
TOST
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 63
FIGURE 10-10: SLOW RISE TIME (MCLR TIED TO VDD)
VDD
MCLR
INTERNAL POR
PWR
T TIME-OUT
OST TIME-OUT
INTERNAL RESET
0V
1V
5V
TPWRT
TOST
PIC16C62B/72A
DS35008A-page 64 Preliminary 1998 Microchip Technology Inc.
10.10 Interrupts
The PIC16C62B/72A devices have up to 7 sources of interrupt. The interrupt control register (INTCON) records individual interrupt requests in flag bits. It also has individual and global interrupt enable bits.
A global interrupt enable bit, GIE (INTCON<7>) enables (if set) all un-masked interrupts or disables (if cleared) all interrupts. When bit GIE is enabled, and an interrupt’s flag bit and mask bit are set, the interrupt will vector immediately. Individual interrupts can be dis­abled through their corresponding enable bits in vari­ous registers. Individual interrupt bits are set regardless of the status of the GIE bit. The GIE bit is cleared on reset.
The “return from interrupt” instruction, RETFIE, exits the interrupt routine as well as sets the GIE bit, which re-enables interrupts.
The RB0/INT pin interrupt, the RB port change interrupt and the TMR0 overflow interrupt flags are contained in the INTCON register.
The peripheral interrupt flags are contained in the spe­cial function registers PIR1 and PIR2. The correspond­ing interrupt enable bits are contained in special function registers PIE1 and PIE2, and the peripheral interrupt enable bit is contained in special function reg­ister INTCON.
When an interrupt is responded to, the GIE bit is cleared to disable any further interrupt, the return address is pushed onto the stack and the PC is loaded with 0004h. Once in the interrupt service routine the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid recursive interrupts.
For external interrupt events, such as the INT pin or PORTB change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends when the interrupt event occurs. The latency is the same for one or two cycle instructions. Individual interrupt flag bits are set regardless of the status of their corresponding mask bit or the GIE bit
FIGURE 10-11: INTERRUPT LOGIC
Note: Individual interrupt flag bits are set regard-
less of the status of their corresponding mask bit or the GIE bit.
ADIF
(1)
ADIE
(1)
SSPIF SSPIE
CCP1IF CCP1IE
TMR2IF TMR2IE
TMR1IF TMR1IE
T0IF T0IE
INTF INTE
RBIF RBIE
GIE
PEIE
Wake-up (If in SLEEP mode)
Interrupt to CPU
Note 1: A/D not implemented on the PIC16C62B.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 65
10.10.1 INT INTERRUPT External interrupt on RB0/INT pin is edge triggered:
either rising if bit INTEDG (OPTION_REG<6>) is set, or falling, if the INTEDG bit is clear. When a valid edge appears on the RB0/INT pin, flag bit INTF (INTCON<1>) is set. This interrupt can be disabled by clearing enable bit INTE (INTCON<4>). Flag bit INTF must be cleared in software in the interrupt service rou­tine before re-enabling this interrupt. The INT interrupt can wake-up the processor from SLEEP, if bit INTE was set prior to going into SLEEP. The status of global inter­rupt enable bit GIE decides whether or not the proces­sor branches to the interrupt vector following wake-up. See Section 10.13 for details on SLEEP mode.
10.10.2 TMR0 INTERRUPT An overflow (FFh 00h) in the TMR0 register will set
flag bit T0IF (INTCON<2>). The interrupt can be enabled/disabled by setting/clearing enable bit T0IE (INTCON<5>). (Section 4.0)
10.10.3 PORTB INTCON CHANGE An input change on PORTB<7:4> sets flag bit RBIF
(INTCON<0>). The interrupt can be enabled/disabled by setting/clearing enable bit RBIE (INTCON<4>). (Section 3.2)
10.11 Context Saving During Interrupts
During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to sa v e k e y reg­isters during an interrupt, i.e., W register and STATUS register. This will have to be implemented in software.
Example 10-1 stores and restores the W and STATUS registers. The register, W_TEMP, must be defined in each bank and must be defined at the same offset from the bank base address (i.e., if W_TEMP is defined at 0x20 in bank 0, it must also be defined at 0xA0 in bank
1). The example: a) Stores the W register.
b) Stores the STATUS register in bank 0. c) Stores the PCLATH register. d) Executes the interrupt service routine code
(User-generated).
e) Restores the STATUS register (and bank select
bit).
f) Restores the W and PCLATH registers.
EXAMPLE 10-1: SAVING STATUS, W, AND PCLATH REGISTERS IN RAM
MOVWF W_TEMP ;Copy W to TEMP register, could be bank one or zero SWAPF STATUS,W ;Swap status to be saved into W CLRF STATUS ;bank 0, regardless of current bank, Clears IRP,RP1,RP0 MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register MOVF PCLATH, W ;Only required if using pages 1, 2 and/or 3 MOVWF PCLATH_TEMP ;Save PCLATH into W CLRF PCLATH ;Page zero, regardless of current page BCF STATUS, IRP ;Return to Bank 0 MOVF FSR, W ;Copy FSR to W MOVWF FSR_TEMP ;Copy FSR from W to FSR_TEMP : :(ISR) : MOVF PCLATH_TEMP, W ;Restore PCLATH MOVWF PCLATH ;Move W into PCLATH SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W ;(sets bank to original state) MOVWF STATUS ;Move W into STATUS register SWAPF W_TEMP,F ;Swap W_TEMP SWAPF W_TEMP,W ;Swap W_TEMP into W
PIC16C62B/72A
DS35008A-page 66 Preliminary 1998 Microchip Technology Inc.
10.12 Watchdog Timer (WDT)
The Watchdog Timer is as a free running on-chip RC oscillator which does not require any external compo­nents. This RC oscillator is separate from the RC oscil­lator of the OSC1/CLKIN pin. That means that the WDT will run, even if the clock on the OSC1/CLKIN and OSC2/CLKOUT pins of the device has been stopped, for example, by execution of a SLEEP instruction.
During normal operation, a WDT time-out generates a device RESET (Watchdog Timer Reset). If the device is in SLEEP mode, a WDT time-out causes the device to wake-up and continue with normal operation (Watch­dog Timer Wake-up). The T
O bit in the STATUS register
will be cleared upon a Watchdog Timer time-out. The WDT can be permanently disabled by clearing
configuration bit WDTE (Section 10.1).
WDT time-out period values may be found in the Elec­trical Specifications section under parameter #31. Val­ues for the WDT prescaler (actually a postscaler, but shared with the Timer0 prescaler) may be assigned using the OPTION_REG register.
.
FIGURE 10-12: WATCHDOG TIMER BLOCK DIAGRAM
FIGURE 10-13: SUMMARY OF WATCHDOG TIMER REGISTERS
Note: The CLRWDT and SLEEP instructions clear
the WDT and the postscaler, if assigned to the WDT, and prevent it from timing out and generating a device RESET condition.
Note: When a CLRWDT instruction is executed
and the prescaler is assigned to the WDT, the prescaler count will be cleared, but the prescaler assignment is not changed.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
2007h Config. bits
(1)
BODEN
(1)
CP1 CP0
PWRTE
(1)
WDTE FOSC1 FOSC0
81h
OPTION_REG
RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
Legend: Shaded cells are not used by the Watchdog Timer. Note 1: See Figure 10-1 for operation of these bits.
From TMR0 Clock Source (Figure 4-2)
To TMR0 (Figure 4-2)
Postscaler
WDT Timer
WDT
Enable Bit
0 1
M U X
PSA
8 - to - 1 MUX
PS2:PS0
0
1
MUX
PSA
WDT
Time-out
Note: PSA and PS2:PS0 are bits in the OPTION_REG register.
8
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 67
10.13 Power-down Mode (SLEEP)
Power-down mode is entered by executing a SLEEP instruction.
If enabled, the Watchdog Timer will be cleared but keeps running, the PD
bit (STATUS<3>) is cleared, the
T
O (STATUS<4>) bit is set, and the oscillator driver is turned off. The I/O ports maintain the status they had, before the SLEEP instruction was executed (driving high, low, or hi-impedance).
For lowest current consumption in this mode, place all I/O pins at either V
DD, or VSS, ensure no external cir-
cuitry is drawing current from the I/O pin, power-down the A/D, disable external clocks. Pull all I/O pins, that are hi-impedance inputs, high or low externally to av oid switching currents caused by floating inputs. The T0CKI input should also be at V
DD or VSS for lowest
current consumption. The contribution from on-chip pull-ups on PORTB should be considered.
The MCLR
pin must be at a logic high level (VIHMC).
10.13.1 WAKE-UP FROM SLEEP The device can wake up from SLEEP through one of
the following events:
1. External reset input on MCLR
pin.
2. Watchdog Timer Wake-up (if WDT was
enabled).
3. Interrupt from INT pin, RB port change, or some
Peripheral Interrupts.
External MCLR
Reset will cause a device reset. All other events are considered a continuation of program execution and cause a "wake-up". The T
O and PD bits in the STATUS register can be used to determine the cause of device reset. The PD
bit, which is set on
power-up, is cleared when SLEEP is invoked. The T
O bit is cleared if a WDT time-out occurred (and caused wake-up).
The following peripheral interrupts can wake the de vice from SLEEP:
1. TMR1 interrupt. Timer1 must be operating as
an asynchronous counter.
2. CCP capture mode interrupt.
3. Special event trigger (Timer1 in asynchronous
mode using an external clock).
4. SSP (Start/Stop) bit detect interrupt.
5. SSP transmit or receive in slave mode (SPI/I
2
C).
6. USART RX or TX (synchronous slave mode).
Other peripherals cannot generate interrupts since dur­ing SLEEP, no on-chip clocks are present.
When the SLEEP instruction is being executed, the ne xt instruction (PC + 1) is pre-fetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be set (enabled). Wake-up is regardless of the state of the GIE bit. If the GIE bit is clear (disabled), the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is set (enabled), the device executes the instruction after the SLEEP instr uction and then branches to the inter­rupt address (0004h). In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction.
10.13.2 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a SLEEP instruction, the SLEEP instruction will com­plete as a NOP. Therefore, the WDT and WDT postscaler will not be cleared, the T
O bit will not
be set and PD
bits will not be cleared.
• If the interrupt occurs during or after the execu­tion of a SLEEP instruction, the device will imme­diately wake up from sleep. The SLEEP instruction will be completely executed before the wake-up. Therefore, the WDT and WDT postscaler will be cleared, the T
O bit will be set and the PD bit will
be cleared.
Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD
bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP. To ensure that the WDT is cleared, a CLRWDT instruc-
tion should be executed before a SLEEP instruction.
PIC16C62B/72A
DS35008A-page 68 Preliminary 1998 Microchip Technology Inc.
FIGURE 10-14: WAKE-UP FROM SLEEP THROUGH INTERRUPT
10.14 Pr
ogram Verification/Code Protection
If the code protection bit(s) have not been pro­grammed, the on-chip program memory can be read out for verification purposes.
10.15 ID Locations
Four memory locations (2000h - 2003h) are designated as ID locations where the user can store checksum or other code-identification numbers. These locations are not accessible during normal execution but are read­able and writable during program/verify. It is recom­mended that only the 4 least significant bits of the ID location are used.
For ROM devices, these values are submitted along with the ROM code.
10.16 In-Circuit Serial Programming
PIC16CXXX microcontrollers can be serially pro­grammed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground, and the programming voltage. This allows customers to manufacture boards with unprogrammed devices, and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firm­ware to be programmed.
For complete details of serial programming, please refer to the In-Circuit Serial Programming (ICSP™) Guide, DS30277.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT(4)
INT pin
INTF flag (INTCON<1>)
GIE bit (INTCON<7>)
INSTR
UCTION FLOW
PC
Instruction fetched
Instruction executed
PC PC+1 PC+2
Inst(PC) = SLEEP
Inst(PC - 1)
Inst(PC + 1)
SLEEP
Processor in
SLEEP
Interrupt Latency
(Note 2)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h)
Inst(0005h)
Inst(0004h)
Dummy cycle
PC + 2 0004h 0005h
Dummy cycle
T
OST(2)
PC+2
Note 1: XT, HS or LP oscillator mode assumed.
2: T
OST = 1024TOSC (drawing not to scale) This delay will not be there for RC osc mode.
3: GIE = '1' assumed. In this case after wake- up, the processor jumps to the interrupt routine. If GIE = '0', execution will continue in-line. 4: CLKOUT is not available in these osc modes, but shown here for timing reference.
Note: Microchip does not recommend code pro-
tecting windowed devices.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 69
11.0 INSTRUCTION SET SUMMARY
Each PIC16CXXX instruction is a 14-bit word divided into an OPCODE which specifies the instruction type and one or more operands which further specify the operation of the instruction. The PIC16CXX instruction set summary in Table 11-2 lists byte-oriented, bit-ori- ented, and literal and control operations. Table 11-1 shows the opcode field descriptions.
For byte-oriented instructions, 'f' represents a file reg­ister designator and 'd' represents a destination desig­nator. The file register designator specifies which file register is to be used by the instruction.
The destination designator specifies where the result of the operation is to be placed. If 'd' is zero, the result is placed in the W register . If 'd' is one , the result is placed in the file register specified in the instruction.
For bit-oriented instructions, 'b' represents a bit field designator which selects the number of the bit affected by the operation, while 'f' represents the number of the file in which the bit is located.
For literal and control operations, 'k' represents an eight or eleven bit constant or literal value.
TABLE 11-1 OPCODE FIELD
DESCRIPTIONS
The instruction set is highly orthogonal and is grouped into three basic categories:
Byte-oriented operations
Bit-oriented operations
Literal and control operations All instructions are executed within one single instruc-
tion cycle, unless a conditional test is true or the pro­gram counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles with the second cycle executed as a NOP. One instruc­tion cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction
execution time is 1 µs. If a conditional test is true or the program counter is changed as a result of an instruc­tion, the instruction execution time is 2 µs.
Table 11-2 lists the instructions recognized by the MPASM assembler.
Figure 11-1 shows the general formats that the instruc­tions can have.
All examples use the following format to represent a hexadecimal number:
0xhh
where h signifies a hexadecimal digit.
FIGURE 11-1: GENERAL FORMAT FOR
INSTRUCTIONS
A description of each instruction is available in the PIC­micro™ Mid-Range Reference Manual, (DS33023).
Field Description
f Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don't care location (= 0 or 1)
The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools.
d Destination select; d = 0: store result in W,
d = 1: store result in file register f. Default is d = 1
PC Program Counter TO
Time-out bit
PD Power-down bit Z Zero bit DC Digit Carry bit C Carry bit
Note: To maintain upward compatibility with
future PIC16CXXX products, do not use the OPTION and TRIS instructions.
Byte-oriented file register operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f f = 7-bit file register address
Bit-oriented file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
PIC16C62B/72A
DS35008A-page 70 Preliminary 1998 Microchip Technology Inc.
TABLE 11-2 PIC16CXXX INSTRUCTION SET
Mnemonic, Operands
Description Cycles 14-Bit Opcode Status
Affected
Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF
ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF
f, d f, d f
­f, d f, d f, d f, d f, d f, d f, d f
­f, d f, d f, d f, d f, d
Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f
1 1 1 1 1 1
1(2)
1
1(2)
1 1 1 1 1 1 1 1 1
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110
dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff
ffff ffff ffff xxxx ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff
C,DC,Z Z Z Z Z Z
Z
Z Z
C C C,DC,Z
Z
1,2 1,2 2
1,2 1,2 1,2,3 1,2 1,2,3 1,2 1,2
1,2 1,2 1,2 1,2 1,2
BIT-ORIENTED FILE REGISTER OPERATIONS BCF
BSF BTFSC BTFSS
f, b f, b f, b f, b
Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set
1
1 1 (2) 1 (2)
01 01 01 01
00bb 01bb 10bb 11bb
bfff bfff bfff bfff
ffff ffff ffff ffff
1,2 1,2 3 3
LITERAL AND CONTROL OPERATIONS ADDLW
ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW
k k k
­k k k
­k
-
­k k
Add literal and W AND literal with W Call subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into standby mode Subtract W from literal Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11 11 10 00 10 11 11 00 11 00 00 11 11
111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010
kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk
kkkk kkkk kkkk 0100 kkkk kkkk kkkk 1001 kkkk 1000 0011 kkkk kkkk
C,DC,Z Z
T
O,PD
Z
TO,PD C,DC,Z Z
Note 1: When an I/O register is modified as a function of itself ( e.g., MOVF PORTB, 1), the value used will be that value present
on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external device, the data will be written back with a '0'.
2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned
to the Timer0 Module.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
1998 Microchip Technology Inc. DS35008A-page 71
PIC16C62B/72A
12.0 DEVELOPMENT SUPPORT
12.1 Development Tools
The PICmicrο microcontrollers are supported with a full range of hardware and software dev elopment tools:
• MPLAB™-ICE Real-Time In-Circuit Emulator
• ICEPIC Low-Cost PIC16C5X and PIC16CXXX In-Circuit Emulator
• PRO MATE
II Universal Programmer
• PICSTART
Plus Entry-Level Prototype
Programmer
• SIMICE
• PICDEM-1 Low-Cost Demonstration Board
• PICDEM-2 Low-Cost Demonstration Board
• PICDEM-3 Low-Cost Demonstration Board
• MPASM Assembler
• MPLABSIM Software Simulator
• MPLAB-C17 (C Compiler)
• Fuzzy Logic Development System (
fuzzy
TECH−MP)
•K
EELOQ
®
Evaluation Kits and Programmer
12.2 MPLAB-ICE: High Performance
Universal In-Circuit Emulator with MPLAB IDE
The MPLAB-ICE Universal In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PICmicro microcontrollers (MCUs). MPLAB-ICE is sup­plied with the MPLAB Integrated Development Envi­ronment (IDE), which allows editing, “make” and download, and source debugging from a single envi­ronment.
Interchangeable processor modules allow the system to be easily reconfigured for emulation of different pro­cessors. The universal architecture of the MPLAB-ICE allows expansion to support all new Microchip micro­controllers.
The MPLAB-ICE Emulator System has been designed as a real-time emulation system with advanced fea­tures that are generally found on more expensive development tools. The PC compatible 386 (and higher) machine platform and Microsoft Windows
3.x or Windows 95 environment were chosen to best make these features available to you, the end user.
MPLAB-ICE is available in two versions. MPLAB-ICE 1000 is a basic, low-cost emulator system with simple trace capabilities. It shares processor mod­ules with the MPLAB-ICE 2000. This is a full-featured emulator system with enhanced trace, trigger, and data monitoring features. Both systems will operate across the entire operating speed reange of the PICmicro MCU.
12.3 ICEPIC: Low-Cost PICmicro™ In-Circuit Emulator
ICEPIC is a low-cost in-circuit emulator solution for the Microchip PIC12CXXX, PIC16C5X and PIC16CXXX families of 8-bit OTP microcontrollers.
ICEPIC is designed to operate on PC-compatible machines ranging from 386 through Pentium based machines under Windows 3.x, Windows 95, or Win­dows NT environment. ICEPIC features real time, non­intrusive emulation.
12.4 PRO MATE II: Universal Programmer
The PRO MATE II Universal Programmer is a full-fea­tured programmer capable of operating in stand-alone mode as well as PC-hosted mode. PRO MATE II is CE compliant.
The PRO MATE II has programmable V
DD and VPP
supplies which allows it to verify programmed memory at V
DD min and VDD max for maximum reliability. It has
an LCD display for displaying error messages, keys to enter commands and a modular detachable socket assembly to support various package types. In stand­alone mode the PRO MATE II can read, verify or pro­gram PIC12CXXX, PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX devices. It can also set configuration and code-protect bits in this mode.
12.5 PICSTART Plus Entry Level Development System
The PICSTART programmer is an easy-to-use, low­cost prototype programmer. It connects to the PC via one of the COM (RS-232) ports. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. PICSTART Plus is not recommended for production programming.
PICST AR T Plus supports all PIC12CXXX, PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX devices with up to 40 pins. Larger pin count devices such as the PIC16C923, PIC16C924 and PIC17C756 may be sup­ported with an adapter socket. PICSTART Plus is CE compliant.
12.6 SIMICE Entry-Level Hardware Simulator
SIMICE is an entry-level hardware development sys­tem designed to operate in a PC-based environment with Microchip’s simulator MPLAB™-SIM. Both SIM­ICE and MPLAB-SIM run under Microchip Technol­ogy’s MPLAB Integrated Development Environment (IDE) software. Specifically, SIMICE provides hardware simulation for Microchip’s PIC12C5XX, PIC12CE5XX, and PIC16C5X families of PICmicro™ 8-bit microcon­trollers. SIMICE works in conjunction with MPLAB-SIM to provide non-real-time I/O port emulation. SIMICE enables a developer to run simulator code for driving the target system. In addition, the target system can
PIC16C62B/72A
DS35008A-page 72 1998 Microchip Technology Inc.
provide input to the simulator code. This capability allows for simple and interactive debugging without having to manually generate MPLAB-SIM stimulus files. SIMICE is a valuable debugging tool for entry­level system development.
12.7 PICDEM-1 Low-Cost PICmicro Demonstration Board
The PICDEM-1 is a simple board which demonstrates the capabilities of several of Microchip’s microcontrol­lers. The microcontrollers supported are: PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The users can program the sample microcontrollers provided with the PICDEM-1 board, on a PRO MATE II or PICSTART-Plus programmer, and easily test firm­ware. The user can also connect the PICDEM-1 board to the MPLAB-ICE emulator and download the firmware to the emulator for testing. Additional proto­type area is available for the user to build some addi­tional hardware and connect it to the microcontroller socket(s). Some of the features include an RS-232 interface, a potentiometer for simulated analog input, push-button switches and eight LEDs connected to PORTB.
12.8 PICDEM-2 Low-Cost PIC16CXX Demonstration Board
The PICDEM-2 is a simple demonstration board that supports the PIC16C62, PIC16C64, PIC16C65, PIC16C73 and PIC16C74 microcontrollers. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers provided with the PICDEM-2 board, on a PRO MATE II pro­grammer or PICSTART-Plus, and easily test firmware. The MPLAB-ICE emulator may also be used with the PICDEM-2 board to test firmware. Additional prototype area has been provided to the user for adding addi­tional hardware and connecting it to the microcontroller socket(s). Some of the f eatures include a RS-232 inter­face, push-button switches, a potentiometer for simu­lated analog input, a Serial EEPROM to demonstrate usage of the I
2
C bus and separate headers for connec-
tion to an LCD module and a keypad.
12.9 PICDEM-3 Low-Cost PIC16CXXX Demonstration Board
The PICDEM-3 is a simple demonstration board that supports the PIC16C923 and PIC16C924 in the PLCC package. It will also support future 44-pin PLCC microcontrollers with a LCD Module. All the neces­sary hardware and software is included to run the basic demonstration programs. The user can pro­gram the sample microcontrollers provided with the PICDEM-3 board, on a PRO MATE II program­mer or PICSTART Plus with an adapter socket, and easily test firmware. The MPLAB-ICE emulator may also be used with the PICDEM-3 board to test firm­ware. Additional prototype area has been provided to the user for adding hardware and connecting it to the microcontroller socket(s). Some of the features include an RS-232 interface, push-button switches, a potenti­ometer for simulated analog input, a thermistor and separate headers for connection to an external LCD module and a keypad. Also provided on the PICDEM-3 board is an LCD panel, with 4 commons and 12 seg­ments, that is capable of displaying time, temperature and day of the week. The PICDEM-3 provides an addi­tional RS-232 interface and Windows 3.1 software for showing the demultiplexed LCD signals on a PC. A simple serial interface allows the user to construct a hardware demultiplexer for the LCD signals.
12.10 MPLAB Integrated Development Environment Software
The MPLAB IDE Software brings an ease of software development previously unseen in the 8-bit microcon­troller market. MPLAB is a windows based application which contains:
• A full featured editor
• Three operating modes
- editor
- emulator
- simulator
• A project manager
• Customizable tool bar and key mapping
• A status bar with project information
• Extensive on-line help
MPLAB allows you to:
• Edit your source files (either assembly or ‘C’)
• One touch assemble (or compile) and download
to PICmicro tools (automatically updates all project information)
• Debug using:
- source files
- absolute listing file
The ability to use MPLAB with Microchip’s simulator allows a consistent platform and the ability to easily switch from the low cost simulator to the full featured emulator with minimal retraining due to development tools.
1998 Microchip Technology Inc. DS35008A-page 73
PIC16C62B/72A
12.11 Assembler (MPASM)
The MPASM Universal Macro Assembler is a PC­hosted symbolic assembler. It suppor ts all microcon­troller series including the PIC12C5XX, PIC14000, PIC16C5X, PIC16CXXX, and PIC17CXX families.
MPASM offers full featured Macro capabilities, condi­tional assembly , and se ver al source and listing formats. It generates various object code formats to support Microchip's development tools as well as third party programmers.
MPASM allows full symbolic debugging from MPLAB­ICE, Microchip’s Universal Emulator System.
MPASM has the following features to assist in develop­ing software for specific use applications.
• Provides translation of Assembler source code to object code for all Microchip microcontrollers.
• Macro assembly capability.
• Produces all the files (Object, Listing, Symbol, and special) required for symbolic debug with Microchip’s emulator systems.
• Supports Hex (default), Decimal and Octal source and listing formats.
MPASM provides a rich directive language to suppor t programming of the PICmicro. Directives are helpful in making the development of your assemb le source code shorter and more maintainable.
12.12 Software Simulator (MPLAB-SIM)
The MPLAB-SIM Software Simulator allows code development in a PC host environment. It allows the user to simulate the PICmicro series microcontrollers on an instruction level. On any given instruction, the user may examine or modify any of the data areas or provide external stimulus to any of the pins. The input/ output radix can be set by the user and the execution can be performed in; single step , ex ecute until break, or in a trace mode.
MPLAB-SIM fully supports symbolic debugging using MPLAB-C17 and MPASM. The Software Simulator offers the low cost flexibility to de v elop and deb ug code outside of the laboratory environment making it an excellent multi-project software development tool.
12.13 MPLAB-C17 Compiler
The MPLAB-C17 Code Development System is a complete ANSI ‘C’ compiler and integrated develop­ment environment for Microchip’s PIC17CXXX family of microcontrollers. The compiler provides powerful integration capabilities and ease of use not found with other compilers.
For easier source level debugging, the compiler pro­vides symbol information that is compatible with the MPLAB IDE memory display.
12.14 Fuzzy Logic Development System (
fuzzy
TECH-MP)
fuzzy
TECH-MP fuzzy logic development tool is avail­able in two versions - a low cost introductory version, MP Explorer, for designers to gain a comprehensive working knowledge of fuzzy logic system design; and a full-featured version,
fuzzy
TECH-MP, Edition for imple-
menting more complex systems. Both versions include Microchip’s
fuzzy
LAB demon­stration board for hands-on experience with fuzzy logic systems implementation.
12.15 SEEVAL Evaluation and
Programming System
The SEEVAL SEEPROM Designer’s Kit supports all Microchip 2-wire and 3-wire Serial EEPROMs. The kit includes everything necessary to read, write, erase or program special features of any Microchip SEEPROM product including Smart Serials and secure serials. The Total Endurance Disk is included to aid in trade­off analysis and reliability calculations. The total kit can significantly reduce time-to-market and result in an optimized system.
12.16 KEELOQ Evaluation and
Programming Tools
KEELOQ evaluation and programming tools support Microchips HCS Secure Data Products. The HCS eval­uation kit includes an LCD display to show changing codes, a decoder to decode transmissions, and a pro­gramming interface to program test transmitters.
PIC16C62B/72A
DS35008A-page 74 1998 Microchip Technology Inc.
TABLE 12-1: DEVELOPMENT TOOLS FROM MICROCHIP
PIC12C5XX PIC14000 PIC16C5X PIC16CXXX PIC16C6X PIC16C7XX PIC16C8X PIC16C9XX PIC17C4X PIC17C7XX
24CXX
25CXX
93CXX
HCS200
HCS300
HCS301
Emulator Products
MPLAB™-ICE
ьььььььььь
ICEPIC Low-Cost
In-Circuit Emulator
ьььььь
Software Tools
MPLAB
Integrated
Development
Environment
ьььььььььь
MPLAB C17*
Compiler
üü
fuzzy
TECH
-MP
Explorer/Edition
Fuzzy Logic
Dev. Tool
ььььььььь
Total Endurance
Software Model
ü
Programmers
PICSTART
Plus
Low-Cost
Universal Dev. Kit
ьььььььььь
PRO MATE
II
Universal
Programmer
ьььььььььььь
KEELOQ
Programmer
ü
Demo Boards
SEEVAL
Designers Kit
ü
SIMICE
üü
PICDEM-14A
ü
PICDEM-1
üü ü ü
PICDEM-2
üü
PICDEM-3
ü
K
EELOQ
®
Evaluation Kit
ü
K
EELOQ
Transponder Kit
ü
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 75
13.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(†)
Ambient temperature under bias............................................................................................................ .-55˚C to +125˚C
Storage temperature.............................................................................................................................. -65˚C to +150˚C
Voltage on any pin with respect to V
SS (except VDD, MCLR, and RA4)..........................................-0.3V to (VDD + 0.3V)
Voltage on V
DD with respect to VSS ......................................................................................................... -0.3V to +7.5V
Voltage on MCLR
with respect to VSS (Note 2)..........................................................................................0V to +13.25V
Voltage on RA4 with respect to Vss...............................................................................................................0V to +8.5V
Total power dissipation (Note 1)................................................................................................................................1.0W
Maximum current out of V
SS pin ...........................................................................................................................300 mA
Maximum current into V
DD pin..............................................................................................................................250 mA
Input clamp current, I
IK (VI < 0 or VI > VDD)......................................................................................................................±20 mA
Output clamp current, I
OK (VO < 0 or VO > VDD)..............................................................................................................±20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by PORTA and PORTB (combined).................................................................................200 mA
Maximum current sourced by PORTA and PORTB (combined)............................................................................200 mA
Maximum current sunk by PORTC........................................................................................................................200 mA
Maximum current sourced by PORTC..................................................................................................................200 mA
Note 1: Power dissipation is calculated as follows: Pdis = V
DD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL)
Note 2: Voltage spikes below V
SS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up .
Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR
/VPP pin rather
than pulling this pin directly to V
SS.
TABLE 13-1 CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR MODES AND
FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
OSC
PIC16C62B-04 PIC16C72A-04
PIC16C62B-20 PIC16C72A-20
PIC16LC62B-04 PIC16LC72A-04
Windowed (JW) Devices
RC
VDD: 4.0V to 5.5V IDD: 5 mA max. at 5.5V I
PD: 16 µA max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V IDD: 2.7 mA typ. at 5.5V I
PD: 1.5 µA typ. at 4V
Freq: 4 MHz max.
V
DD: 2.5V to 5.5V
IDD: 3.8 mA max. at 3V I
PD: 5 µA max. at 3V
Freq: 4 MHz max.
V
DD: 2.5V to 5.5V
IDD: 3.8 mA max. at 3V I
PD: 5 µA max. at 3V
Freq: 4 MHz max.
XT
VDD: 4.0V to 5.5V IDD: 5 mA max. at 5.5V IPD: 16 µA max. at 4V Freq: 4 MHz max.
VDD: 4.5V to 5.5V IDD: 2.7 mA typ. at 5.5V IPD: 1.5 µA typ. at 4V Freq: 4 MHz max.
VDD: 2.5V to 5.5V IDD: 3.8 mA max. at 3V IPD: 5 µA max. at 3V Freq: 4 MHz max.
VDD: 2.5V to 5.5V IDD: 3.8 mA max. at 3V IPD: 5 µA max. at 3V Freq: 4 MHz max.
HS
VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
Not recommended for use in
HS mode
VDD: 4.5V to 5.5V IDD: 13.5 mA typ. at 5.5V IDD: 20 mA max. at 5.5V IDD: 20 mA max. at 5.5V IPD: 1.5 µA typ. at 4.5V IPD: 1.5 µA typ. at 4.5V IPD: 1.5 µA typ. at 4.5V Freq: 4 MHz max. Freq: 20 MHz max. Freq: 20 MHz max.
LP
VDD: 4.0V to 5.5V IDD: 52.5 µA typ.
at 32 kHz, 4.0V IPD: 0.9 µA typ. at 4.0V Freq: 200 kHz max.
Not recommended for use in
LP mode
VDD: 2.5V to 5.5V IDD: 48 µA max. at 32 kHz,
3.0V IPD: 5 µA max. at 3.0V Freq: 200 kHz max.
VDD: 2.5V to 5.5V IDD: 48 µA max. at 32 kHz,
3.0V IPD: 5 µA max. at 3.0V Freq: 200 kHz max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recom­mended that the user select the device type that ensures the specifications required.
PIC16C62B/72A
DS35008A-page 76 Preliminary 1998 Microchip Technology Inc.
13.1 DC Characteristics: PIC16C62B/72A-04 (Commercial, Industrial, Extended) PIC16C62B/72A-20 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C T
A +70˚C for commercial
-40˚C T
A +85˚C for industrial
-40˚C T
A +125˚C for extended
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
D001 D001A
V
DD Supply V oltage 4.0
4.5
V
BOR*
-
-
-
5.5
5.5
5.5
V V V
XT, RC and LP osc mode HS osc mode BOR enabled (Note 7)
D002* V
DR RAM Data Retention
Voltage (Note 1)
- 1.5 - V
D003 V
POR VDD Start Voltage to
ensure internal Power-on Reset signal
-VSS - V See section on Power-on Reset for details
D004* D004A*
S
VDD VDD Rise Rate to
ensure internal Power-on Reset signal
0.05 TBD--
--V/ms PWRT enabled (PWRTE bit clear) PWRT disabled (PWR
TE bit set)
See section on Power-on Reset for details
D005 V
BOR Brown-out Reset
voltage trip point
3.65 - 4.35 V BODEN bit set
D010
D013
I
DD Supply Current
(Note 2, 5)
-
-
2.710520mAmAXT, RC osc modes F
OSC = 4 MHz, VDD = 5.5V (Note 4)
HS osc mode F
OSC = 20 MHz, VDD = 5.5V
D020 D021
D021B
I
PD Power-down Current
(Note 3, 5)
-
-
-
-
10.5
1.5
1.5
2.5
42 16 19 19
µA µA µA µA
V
DD = 4.0V, WDT enabled,-40°C to +85°C
V
DD = 4.0V, WDT disabled, 0°C to +70°C
V
DD = 4.0V, WDT disabled,-40°C to +85°C
V
DD = 4.0V, WDT disabled,-40°C to +125°C
D022* D022A*
I
WDT
IBOR
Module Differential Current (Note 6)
Watchdog Timer Brown-out Reset
-
-
6.0
TBD20200µAµA
WDTE bit set, V
DD = 4.0V
BODEN bit set, V
DD = 5.0V
* These parameters are characterized but not tested. † Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
DD,
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD and VSS.
4: For RC osc mode, current through Rext is not included. The current through the resistor can be estimated by
the formula Ir = V
DD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from charac-
terization and is for design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD or IPD measurement.
7: This is the voltage where the device enters the Brown-out Reset. When BOR is enabled, the device will
operate correctly to this trip point.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 77
13.2 DC Characteristics: PIC16LC62B/72A-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C TA +70˚C for commercial
-40˚C T
A +85˚C for industrial
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
D001 V
DD Supply V oltage 2.5
V
BOR*
-
-
5.5
5.5VV
LP, XT, RC osc modes (DC - 4 MHz) BOR enabled (Note 7)
D002* V
DR RAM Data Retention
Voltage (Note 1)
- 1.5 - V
D003 V
POR VDD Start Voltage to
ensure internal Power-on Reset signal
-VSS - V See section on Power-on Reset for details
D004* D004A*
S
VDD VDD Rise Rate to
ensure internal Power-on Reset signal
0.05
TBD--
--V/ms PWRT enabled (PWRTE bit clear) PWRT disabled (PWR
TE bit set)
See section on Power-on Reset for details
D005 V
BOR Brown-out Reset
voltage trip point
3.65 - 4.35 V BODEN bit set
D010
D010A
I
DD Supply Current
(Note 2, 5)
-
-
2.0
22.5
3.848mAµAXT, RC osc modes F
OSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc mode F
OSC = 32 kHz, VDD = 3.0V, WDT disabled
D020 D021 D021A
I
PD Power-down Current
(Note 3, 5)
-
-
-
7.5
0.9
0.9
30
5 5
µA µA µA
VDD = 3.0V, WDT enabled, -40°C to +85°C V
DD = 3.0V, WDT disabled, 0°C to +70°C
V
DD = 3.0V, WDT disabled, -40°C to +85°C
D022* D022A*
I
WDT
IBOR
Module Differential Current (Note 6)
Watchdog Timer Brown-out Reset
-
-
6.0
TBD20200µAµA
WDTE bit set, V
DD = 4.0V
BODEN bit set, V
DD = 5.0V
* These parameters are characterized but not tested. † Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
DD,
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD and VSS.
4: For RC osc mode, current through Rext is not included. The current through the resistor can be estimated by
the formula Ir = V
DD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from charac-
terization and is for design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD or IPD measurement.
7: This is the voltage where the device enters the Brown-out Reset. When BOR is enabled, the device will
operate correctly to this trip point.
PIC16C62B/72A
DS35008A-page 78 Preliminary 1998 Microchip Technology Inc.
13.3 DC Characteristics: PIC16C62B/72A-04 (Commercial, Industrial, Extended) PIC16C62B/72A-20 (Commercial, Industrial, Extended) PIC16LC62B/72A-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C T
A +70˚C for commercial
-40˚C T
A +85˚C for industrial
-40˚C T
A +125˚C for extended
Operating voltage V
DD range as described in DC spec Section 13.1
and Section 13.2
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
Input Low Voltage
V
IL I/O ports
D030 D030A
with TTL buffer V
SS
VSS
--0.15VDD
0.8V
VVFor entire V
DD range
4.5V V
DD 5.5V
D031 with Schmitt Trigger buffer V
SS - 0.2VDD V
D032 MCLR
, OSC1 (in RC mode) Vss - 0.2VDD V
D033 OSC1 (in XT, HS and LP
modes)
Vss - 0.3V
DD V Note1
Input High Voltage
V
IH I/O ports -
D040 with TTL buffer 2.0 - V
DD V 4.5V VDD 5.5V
D040A 0.25V
DD
+ 0.8V
-VDD V For entire VDD range
D041 with Schmitt Trigger buffer 0.8V
DD -VDD V For entire VDD range
D042 MCLR
0.8VDD -VDD V
D042A OSC1 (XT, HS and LP modes) 0.7V
DD -VDD V Note1
D043 OSC1 (in RC mode) 0.9V
DD -VDD V
Input Leakage Current (Notes 2, 3)
D060 I
IL I/O ports - - ±1 µA Vss VPIN VDD,
Pin at hi-impedance
D061 MCLR
, RA4/T0CKI - - ±5 µA Vss VPIN VDD
D063 OSC1 - - ±5 µA Vss VPIN VDD,
XT, HS and LP osc modes
D070 I
PURB PORTB weak pull-up current 50 250 400 µAVDD = 5V, VPIN = VSS
Output Low Voltage
D080 V
OL I/O ports - - 0.6 V IOL = 8.5 mA, VDD = 4.5V,
-40°C to +85°C
- - 0.6 V I
OL = 7.0 mA, VDD = 4.5V,
-40°C to +125°C
D083 OSC2/CLKOUT
(RC osc mode)
- - 0.6 V I
OL = 1.6 mA, VDD = 4.5V,
-40°C to +85°C
- - 0.6 V I
OL = 1.2 mA, VDD = 4.5V,
-40°C to +125°C * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note1: In RC oscillator mode, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PICmi-
cro be driven with external clock in RC mode.
2: The leakage current on the MCLR
/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input volt­ages.
3: Negative current is defined as current sourced by the pin.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 79
Output High Voltage
D090 V
OH I/O ports (Note 3) VDD-0.7 - - V IOH = -3.0 mA, VDD = 4.5V,
-40°C to +85°C
V
DD-0.7 - - V IOH = -2.5 mA, VDD = 4.5V,
-40°C to +125°C
D092 OSC2/CLKOUT (RC osc
mode)
V
DD-0.7 - - V IOH = -1.3 mA, VDD = 4.5V,
-40°C to +85°C
V
DD-0.7 - - V IOH = -1.0 mA, VDD = 4.5V,
-40°C to +125°C
D150* V
OD Open-Drain High Voltage - - 8.5 V RA4 pin
Capacitive Loading Specs on Output Pins
D100 C
OSC2 OSC2 pin - - 15 pF In XT, HS and LP modes when
external clock is used to drive OSC1.
D101 C
IO All I/O pins and OSC2 (in RC
mode)
- - 50 pF
D102 Cb
SCL, SDA in I
2
C mode
- - 400 pF
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C T
A +70˚C for commercial
-40˚C T
A +85˚C for industrial
-40˚C T
A +125˚C for extended
Operating voltage V
DD range as described in DC spec Section 13.1
and Section 13.2
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
* These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note1: In RC oscillator mode, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PICmi-
cro be driven with external clock in RC mode.
2: The leakage current on the MCLR
/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input volt­ages.
3: Negative current is defined as current sourced by the pin.
PIC16C62B/72A
DS35008A-page 80 Preliminary 1998 Microchip Technology Inc.
13.4 AC (Timing) Characteristics
13.4.1 TIMING PARAMETER SYMBOLOGY The timing parameter symbols have been created fol-
lowing one of the following formats:
1. TppS2ppS
3. T
CC:ST (I
2
C specifications only)
2. TppS
4. Ts (I
2
C specifications only)
T
F Frequency T Time Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1 ck CLKOUT rd RD cs CS rw RD or WR di SDI sc SCK do SDO ss SS dt Data in t0 T0CKI io I/O port t1 T1CKI mc MCLR
wr WR
Uppercase letters and their meanings:
S
F Fall P Period H High R Rise I Invalid (Hi-impedance) V Valid L Low Z Hi-impedance
I
2
C only
AA output access High High BUF Bus free Low Low
T
CC:ST (I
2
C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO STOP condition STA START condition
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 81
13.4.2 TIMING CONDITIONS The temperature and voltages specified in Table 13-1
apply to all timing specifications unless otherwise noted. Figure 13-1 specifies the load conditions for the timing specifications.
TABLE 13-1 TEMPERATURE AND VOLTAGE SPECIFICATIONS - AC
FIGURE 13-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
AC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0˚C TA +70˚C for commercial
-40˚C TA +85˚C for industrial
-40˚C TA +125˚C for extended
Operating voltage V
DD range as described in DC spec Section 13.1 and Section 13.2.
LC parts operate for commercial/industrial temp’s only.
VDD/2
C
L
RL
Pin
Pin
V
SS
VSS
CL
RL = 464 C
L = 50 pF for all pins except OSC2/CLKOUT
15 pF for OSC2 output
Load condition 1
Load condition 2
PIC16C62B/72A
DS35008A-page 82 Preliminary 1998 Microchip Technology Inc.
13.4.3 TIMING DIAGRAMS AND SPECIFICATIONS
FIGURE 13-2: EXTERNAL CLOCK TIMING
TABLE 13-2 EXTERNAL CLOCK TIMING REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
1A Fosc External CLKIN Frequency
(Note 1)
DC 4 MHz RC and XT osc modes DC 4 MHz HS osc mode (-04) DC 20 MHz HS osc mode (-20) DC 200 kHz LP osc mode
Oscillator Frequency
(Note 1)
DC 4 MHz RC osc mode
0.1 4 MHz XT osc mode 4 20 MHz HS osc mode 5 200 kHz LP osc mode
1 Tosc External CLKIN Period
(Note 1)
250 ns RC and XT osc modes 250 ns HS osc mode (-04)
50 ns HS osc mode (-20)
5— —µs LP osc mode
Oscillator Period
(Note 1)
250 ns RC osc mode 250 10,000 ns XT osc mode 250 250 ns HS osc mode (-04)
50 250 ns HS osc mode (-20)
5— —µs LP osc mode
2TCY Instruction Cycle Time (Note 1) 200 DC ns TCY = 4/FOSC
3* TosL,
TosH
External Clock in (OSC1) High or Low Time
100 ns XT oscillator
2.5 µs LP oscillator
15 ns HS oscillator
4* TosR,
TosF
External Clock in (OSC1) Rise or Fall Time
25 ns XT oscillator — 50 ns LP oscillator — 15 ns HS oscillator
* These parameters are characterized but not tested. † Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note1: Instruction cycle period (T
CY) equals four times the input oscillator time-base period. All specified values are
based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All de vices are tested to oper ate at "min." v alues with an e xternal clock applied to the OSC1/CLKIN pin. When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices.
3
3
4
4
1
2
Q4
Q1 Q2 Q3 Q4
Q1
OSC1
CLKOUT
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 83
FIGURE 13-3: CLKOUT AND I/O TIMING
TABLE 13-3 CLKOUT AND I/O TIMING REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
10* TosH2ckL OSC1 to CLKOUT 75 200 ns Note 1 11* TosH2ckH OSC1 to CLKOUT 75 200 ns Note 1 12* TckR CLKOUT rise time 35 100 ns Note 1 13* TckF CLKOUT fall time 35 100 ns Note 1 14* TckL2ioV CLKOUT to Port out valid 0.5T
CY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT Tosc + 200 ns Note 1 16* TckH2ioI Port in hold after CLKOUT 0 ns Note 1 17* TosH2ioV OSC1 (Q1 cycle) to Port out valid 50 150 ns 18* TosH2ioI OSC1 (Q2 cycle) to Port input
invalid (I/O in hold time)
Standard 100 ns
18A* Extended (LC) 200 ns
19* TioV2osH Port input valid to OSC1(I/O in setup time) 0 ns 20* TioR Port output rise time Standard 10 40 ns
20A* Extended (LC) 80 ns
21* TioF Port output fall time Standard 10 40 ns
21A* Extended (LC) 80 ns 22††* Tinp INT pin high or low time TCY ——ns 23††* Trbp RB7:RB4 change INT high or low time TCY ——ns
* These parameters are characterized but not tested. † Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
†† These parameters are asynchronous events not related to any internal clock edge.
Note1: Measurements are taken in RC Mode where CLKOUT output is 4 x T
OSC.
Note: Refer to Figure 13-1 for load conditions.
OSC1
CLKOUT
I/O Pin (input)
I/O Pin (output)
Q4
Q1
Q2 Q3
10
13
14
17
20, 21
19
18
15
11
12
16
old value
new value
PIC16C62B/72A
DS35008A-page 84 Preliminary 1998 Microchip Technology Inc.
FIGURE 13-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
FIGURE 13-5: BROWN-OUT RESET TIMING
TABLE 13-4 RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER,
AND BROWN-OUT RESET REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
30 TmcL MCLR Pulse Width (low) 2
µs VDD = 5V, -40˚C to +125˚C
31* T wdt Watchdog Timer Time-out Period
(No Prescaler)
71833ms
VDD = 5V, -40˚C to +125˚C
32 Tost Oscillation Start-up Timer Period 1024 T
OSC ——
TOSC = OSC1 period
33* Tpwrt Power-up Timer Period 28 72 132 ms
VDD = 5V, -40˚C to +125˚C
34 T
IOZ I/O Hi-impedance from MCLR
Low or WDT reset
2.1
µs
35 T
BOR Brown-out Reset Pulse Width 100
µs
V
DD BVDD (D005)
* These parameters are characterized but not tested. † Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
Note: Refer to Figure 13-1 for load conditions.
VDD
BVDD
35
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 85
FIGURE 13-6: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 13-5 TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
40* Tt0H T0CKI High Pulse Width No Prescaler 0.5T
CY + 20 ns Must also meet
parameter 42
With Prescaler 10 ns
41* Tt0L T0CKI Low Pulse Width No Prescaler 0.5T
CY + 20 ns Must also meet
parameter 42
With Prescaler 10 ns
42* Tt0P T0CKI Period
No Prescaler
TCY + 40 ns
With Prescaler
Greater of: 20 or T
CY + 40
N
ns N = prescale value
(2, 4,..., 256)
45* Tt1H T1CKI High Time Synchronous, Prescaler = 1 0.5T
CY + 20 ns Must also meet
parameter 47
Synchronous, Prescaler = 2,4,8
Standard
15 ns
Extended (LC)
25 ns
Asynchronous
Standard
30 ns
Extended (LC)
50 ns
46* Tt1L T1CKI Low Time Synchronous, Prescaler = 1 0.5T
CY + 20 ns Must also meet
parameter 47
Synchronous, Prescaler = 2,4,8
Standard
15 ns
Extended (LC)
25 ns
Asynchronous
Standard
30 ns
Extended (LC)
50 ns
47* Tt1P T1CKI input period Synchronous
Standard
Greater of:
30 OR TCY + 40
N
ns N = prescale value
(1, 2, 4, 8)
Extended (LC)
Greater of:
50 OR TCY + 40
N
N = prescale value (1, 2, 4, 8)
Asynchronous
Standard
60 ns
Extended (LC)
100 ns
Ft1 Timer1 oscillator input frequency range
(oscillator enabled by setting bit T1OSCEN)
DC — 200 kHz
48 TCKEZtmr1 Delay from external clock edge to timer increment 2Tosc 7Tosc
* These parameters are characterized but not tested. † Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 13-1 for load conditions.
46
47
45
48
41
42
40
T0CKI
T1OSO/T1CKI
TMR0 or TMR1
PIC16C62B/72A
DS35008A-page 86 Preliminary 1998 Microchip Technology Inc.
FIGURE 13-7: CAPTURE/COMPARE/PWM TIMINGS
TABLE 13-6 CAPTURE/COMPARE/PWM REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
50*
TccL CCP1 input low
time
No Prescaler 0.5TCY + 20 ns With Prescaler Standard 10 ns
Extended (LC) 20 ns
51* TccH
CCP1 input high time
No Prescaler 0.5TCY + 20 ns With Prescaler Standard 10 ns
Extended (LC) 20 ns
52* TccP
CCP1 input period
3TCY + 40N— ns N = prescale value
(1,4, or 16)
53* TccR CCP1 output rise time Standard 10 25 ns
Extended (LC) 25 45 ns
54* TccF CCP1 output fall time Standard 10 25 ns
Extended (LC) 25 45 ns
* These parameters are characterized but not tested. † Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 13-1 for load conditions.
CCP1
(Capture Mode)
50 51
52
CCP1
53
54
(Compare or PWM Mode)
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 87
FIGURE 13-8: EXAMPLE SPI MASTER MODE TIMING (CKE = 0)
TABLE 13-7 EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0)
Param.
No.
Symbol Characteristic Min Typ† Max Units Conditions
70
TssL2scH, TssL2scL
SS to SCK or SCK input TCY ——ns
71
TscH SCK input high time
(slave mode)
Continuous 1.25TCY + 30 ns
71A
Single Byte 40 ns Note 1
72
TscL SCK input low time
(slave mode)
Continuous 1.25TCY + 30 ns
72A
Single Byte 40 ns Note 1
73
TdiV2scH, TdiV2scL
Setup time of SDI data input to SCK edge 100 ns
73A
TB2B Last clock edge of Byte1 to the 1st clock
edge of Byte2
1.5TCY + 40 ns Note 1
74
TscH2diL, TscL2diL
Hold time of SDI data input to SCK edge 100 ns
75
TdoR SDO data output rise time Standard 10 25 ns
Extended (LC) 20 45 ns
76
TdoF SDO data output fall time 10 25 ns
78
TscR SCK output rise time
(master mode)
Standard 10 25 ns Extended (LC) 20 45 ns
79
TscF SCK output fall time (master mode) 10 25 ns
80
TscH2doV, TscL2doV
SDO data output valid after SCK edge
Standard 50 ns Extended (LC) 100 ns
† Data in “Typ” column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note1: Specification 73A is only required if specifications 71A and 72A are used.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76
78
79
80
79
78
MSb LSb
BIT6 - - - - - -1
MSb IN
LSb IN
BIT6 - - - -1
Refer to Figure 13-1 for load conditions.
PIC16C62B/72A
DS35008A-page 88 Preliminary 1998 Microchip Technology Inc.
FIGURE 13-9: EXAMPLE SPI MASTER MODE TIMING (CKE = 1)
TABLE 13-8 EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1)
Param.
No.
Symbol Characteristic Min Typ† Max Units Conditions
71
TscH SCK input high time
(slave mode)
Continuous 1.25TCY + 30 ns
71A
Single Byte 40 ns Note 1
72
TscL SCK input low time
(slave mode)
Continuous 1.25TCY + 30 ns
72A
Single Byte 40 ns Note 1
73
TdiV2scH, TdiV2scL
Setup time of SDI data input to SCK edge
100 ns
73A
TB2B Last clock edge of Byte1 to the 1st clock
edge of Byte2
1.5TCY + 40 ns Note 1
74
TscH2diL, TscL2diL
Hold time of SDI data input to SCK edge 100 ns
75
TdoR SDO data output rise
time
Standard 10 25 ns Extended (LC) 20 45 ns
76
TdoF SDO data output fall time 10 25 ns
78
TscR SCK output rise time
(master mode)
Standard 10 25 ns Extended (LC) 20 45 ns
79
TscF SCK output fall time (master mode) 10 25 ns
80
TscH2doV, TscL2doV
SDO data output valid after SCK edge
Standard 50 ns Extended (LC) 100 ns
81
TdoV2scH, TdoV2scL
SDO data output setup to SCK edge TCY ——ns
† Data in “Typ” column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note1: Specification 73A is only required if specifications 71A and 72A are used.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
81
71 72
74
75, 76
78
80
MSb
79
73
MSb IN
BIT6 - - - - - -1
LSb IN
BIT6 - - - -1
LSb
Refer to Figure 13-1 for load conditions.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 89
FIGURE 13-10: EXAMPLE SPI SLAVE MODE TIMING (CKE = 0)
TABLE 13-9 EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING (CKE = 0)
Param.
No.
Symbol Characteristic Min Typ† Max Units Conditions
70
TssL2scH, TssL2scL
SS to SCK or SCK input TCY ——ns
71
TscH SCK input high time
(slave mode)
Continuous 1.25TCY + 30 ns
71A
Single Byte 40 ns Note 1
72
TscL SCK input low time
(slave mode)
Continuous 1.25TCY + 30 ns
72A
Single Byte 40 ns Note 1
73
TdiV2scH, TdiV2scL
Setup time of SDI data input to SCK edge 100 ns
73A
TB2B Last clock edge of Byte1 to the 1st clock
edge of Byte2
1.5TCY + 40 ns Note 1
74
TscH2diL, TscL2diL
Hold time of SDI data input to SCK edge 100 ns
75
TdoR SDO data output rise time Standard 10 25 ns
Extended (LC) 20 45 ns
76
TdoF SDO data output fall time 10 25 ns
77
TssH2doZ SS to SDO output hi-impedance 10 50 ns
78
TscR SCK output rise time
(master mode)
Standard 10 25 ns Extended (LC) 20 45 ns
79
TscF SCK output fall time (master mode) 10 25 ns
80
TscH2doV, TscL2doV
SDO data output valid after SCK edge
Standard 50 ns Extended (LC) 100 ns
83
TscH2ssH, TscL2ssH
SS after SCK edge 1.5TCY + 40 ns
† Data in “Typ” column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note1: Specification 73A is only required if specifications 71A and 72A are used.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76
77
78
79
80
79
78
SDI
MSb LSb
BIT6 - - - - - -1
MSb IN BIT6 - - - -1 LSb IN
83
Refer to Figure 13-1 for load conditions.
PIC16C62B/72A
DS35008A-page 90 Preliminary 1998 Microchip Technology Inc.
FIGURE 13-11: EXAMPLE SPI SLAVE MODE TIMING (CKE = 1)
TABLE 13-10 EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1)
Param.
No.
Symbol Characteristic Min Typ† Max Units Conditions
70
TssL2scH, TssL2scL
SS to SCK or SCK input TCY ——ns
71
TscH SCK input high time
(slave mode)
Continuous 1.25TCY + 30 ns
71A
Single Byte 40 ns Note 1
72
TscL SCK input low time
(slave mode)
Continuous 1.25TCY + 30 ns
72A
Single Byte 40 ns Note 1
73A
TB2B Last clock edge of Byte1 to the 1st clock
edge of Byte2
1.5TCY + 40 ns Note 1
74
TscH2diL, TscL2diL
Hold time of SDI data input to SCK edge 100 ns
75
TdoR SDO data output rise
time
Standard 10 25 ns Extended (LC) 20 45 ns
76
TdoF SDO data output fall time 10 25 ns
77
TssH2doZ SS to SDO output hi-impedance 10 50 ns
78
TscR SCK output rise time
(master mode)
Standard 10 25 ns Extended (LC) 20 45 ns
79
TscF SCK output fall time (master mode) 10 25 ns
80
TscH2doV, TscL2doV
SDO data output valid after SCK edge
Standard 50 ns Extended (LC) 100 ns
82
TssL2doV SDO data output valid
after SS
edge
Standard 50 ns Extended (LC) 100 ns
83
TscH2ssH, TscL2ssH
SS after SCK edge 1.5TCY + 40 ns
† Data in “Typ” column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note1: Specification 73A is only required if specifications 71A and 72A are used.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
82
SDI
74
75, 76
MSb BIT6 - - - - - -1 LSb
77
MSb IN BIT6 - - - -1 LSb IN
80
83
Refer to Figure 13-1 for load conditions.
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 91
FIGURE 13-12: I2C BUS START/STOP BITS TIMING
TABLE 13-11 I2C BUS START/STOP BITS REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ Max Units Conditions
90* TSU:STA START condition 100 kHz mode 4700
ns
Only relevant for repeated START condition
Setup time 400 kHz mode 600
91* THD:STA START condition 100 kHz mode 4000
ns
After this period the first clock pulse is generated
Hold time 400 kHz mode 600
92* TSU:STO STOP condition 100 kHz mode 4700
ns
Setup time 400 kHz mode 600
93 THD:STO STOP condition 100 kHz mode 4000
ns
Hold time 400 kHz mode 600
* These parameters are characterized but not tested.
Note: Refer to Figure 13-1 for load conditions.
91
92
93
SCL
SDA
START
Condition
STOP
Condition
90
PIC16C62B/72A
DS35008A-page 92 Preliminary 1998 Microchip Technology Inc.
FIGURE 13-13: I2C BUS DATA TIMING
TABLE 13-12 I
2
C BUS DATA REQUIREMENTS
Parameter
No.
Sym Characteristic Min Max Units Conditions
100* THIGH Clock high time 100 kHz mode 4.0 µs Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 0.6 µs Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY
101* TLOW Clock low time 100 kHz mode 4.7 µs Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 1.3 µs Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY
102* TR SDA and SCL rise
time
100 kHz mode 1000 ns 400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
103* TF SDA and SCL fall time 100 kHz mode 300 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
90* TSU:STA START condition
setup time
100 kHz mode 4.7 µs Only relevant for repeated
START condition
400 kHz mode 0.6 µs
91* THD:STA START condition hold
time
100 kHz mode 4.0 µs After this period the first clock
pulse is generated
400 kHz mode 0.6 µs
106* THD:DAT Data input hold time 100 kHz mode 0 ns
400 kHz mode 0 0.9 µs
107* TSU:DAT Data input setup time 100 kHz mode 250 ns Note 2
400 kHz mode 100 ns
92* TSU:STO STOP condition setup
time
100 kHz mode 4.7 µs 400 kHz mode 0.6 µs
109* TAA Output valid from
clock
100 kHz mode 3500 ns Note 1 400 kHz mode ns
110* TBUF Bus free time 100 kHz mode 4.7 µs Time the bus must be free
before a new transmission can start
400 kHz mode 1.3 µs
Cb Bus capacitive loading 400 pF
* These parameters are characterized but not tested.
Note1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of
the falling edge of SCL to avoid unintended generation of START or STOP conditions.
2: A fast-mode (400 kHz) I
2
C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the requirement Tsu:DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a de vice does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line TR max.+tsu;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before the SCL line is released.
Note: Refer to Figure 13-1 for load conditions.
90
91 92
100
101
103
106
107
109
109
110
102
SCL
SDA In
SDA Out
PIC16C62B/72A
1998 Microchip Technology Inc.
Preliminary
DS35008A-page 93
TABLE 13-13 A/D CONVERTER CHARACTERISTICS:
PIC16C72A-04 (COMMERCIAL, INDUSTRIAL, EXTENDED) PIC16C72A-20 (COMMERCIAL, INDUSTRIAL, EXTENDED) PIC16LC72A-04 (COMMERCIAL, INDUSTRIAL)
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
A01 N
R
Resolution 8-bits bit V
REF
= V
DD
= 5.12V,
V
SS
V
AIN
V
REF
A02 E
ABS
Total Absolute error
——
< ± 1 LSb
V
REF
= V
DD
= 5.12V,
V
SS
V
AIN
V
REF
A03 E
IL
Integral linearity error
< ± 1 LSb
V
REF
= V
DD
= 5.12V,
V
SS
V
AIN
V
REF
A04 E
DL
Differential linearity error
< ± 1 LSb
V
REF
= V
DD
= 5.12V,
V
SS
V
AIN
V
REF
A05 E
FS
Full scale error
< ± 1 LSb
V
REF
= V
DD
= 5.12V,
V
SS
V
AIN
V
REF
A06 E
OFF
Offset error
< ± 1 LSb
V
REF
= V
DD
= 5.12V,
V
SS
V
AIN
V
REF
A10 Monotonicity guaranteed
(Note 3)
——V
SS
V
AIN
V
REF
A20 V
REF
Reference voltage 2.5V V
DD
+ 0.3 V
A25 V
AIN
Analog input voltage V
SS
- 0.3 V
REF
+ 0.3 V
A30 Z
AIN
Recommended impedance of analog voltage source
10.0 k Ω
A40 I
AD
A/D conversion current (V
DD
)
Standard 180
µ
A Average current consump-
tion when A/D is on. (Note 1)
Extended (LC) 90
µ
A
A50 I
REF
V
REF
input current (Note 2) 10
1000
10
µ A µ
A
During V
AIN
acquisition. Based on differential of V
HOLD
to V
AIN
to charge
C
HOLD
, see Section 9.1.
During A/D Conversion cycle
* These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25 ° C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note1: When A/D is off, it will not consume any current other than minor leakage current.
The power-down current spec includes any such leakage from the A/D module.
2: V
REF
current is from RA3 pin or V
DD
pin, whichever is selected as reference input.
3: The A/D conversion result never decreases with an increase in the Input V oltage , and has no missing codes.
PIC16C62B/72A
DS35008A-page 94 Preliminary 1998 Microchip Technology Inc.
FIGURE 13-14: A/D CONVERSION TIMING
TABLE 13-14 A/D CONVERSION REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
130 TAD A/D clock period
Standard
1.6 µsTOSC based, VREF 3.0V Extended (LC) 2.0 µsTOSC based, VREF full range Standard 2.0 4.0 6.0 µs A/D RC Mode Extended (LC) 3.0 6.0 9.0 µs A/D RC Mode
131 TCNV Conversion time (not including S/H time)
(Note 1)
11 11 TAD
132 TACQ Acquisition time Note 25*20
µs
µs The minimum time is the amplifier
settling time. This may be used if the "new" input voltage has not changed by more than 1 LSb (i.e.,
20.0 mV @ 5.12V) from the last sampled voltage (as stated on C
HOLD).
134 TGO Q4 to A/D clock start TOSC/2 § If the A/D clock source is selected
as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed.
135 TSWC Switching from convert sample time 1.5 § TAD
* These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
§ This specification ensured by design.
Note1: ADRES register may be read on the following TCY cycle.
2: See Section 9.1 for min conditions.
131
130
132
BSF ADCON0, GO
Q4
A/D CLK
A/D DATA
ADRES
ADIF
GO
SAMPLE
OLD_DATA
SAMPLING STOPPED
DONE
NEW_DATA
(T
OSC/2)
(1)
7 6543210
Note1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This
allows the SLEEP instruction to be executed.
1 Tcy
134
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 95
14.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES
The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified V
DD
range). This is for information only and devices are guaranteed to operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period
of time and matrix samples. 'Typical' represents the mean of the distribution at 25°C. 'Max' or 'min' represents (mean + 3σ) or (mean - 3σ) respectively, where σ is standard deviation, over the whole temperature range.
Graphs and Tables not available at this time.
Data is not available at this time but you may reference the
PIC16C72 Series Data Sheet
(DS39016) DC and AC char-
acteristic section which contains data similar to what is expected.
PIC16C62B/72A
DS35008A-page 96 Preliminary 1998 Microchip Technology Inc.
NOTES:
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 97
15.0 PACKAGING INFORMATION
15.1 Package Marking Information
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
AABBCDE
MMMMMMMMMMMMMMMM
Example
PIC16C62B-20/SO
XXXXXXXXXXXXXXX
AABBCDE
28-Lead PDIP (Skinny DIP)
MMMMMMMMMMMM
Example
PIC16C72A-04/SP
Example28-Lead CERDIP Windowed
XXXXXXXXXXX XXXXXXXXXXX
AABBCDE
PIC16C72A/JW
AABBCDE
XXXXXXXXXXXX
XXXXXXXXXXXX
28-Lead SSOP
20I/SS025
PIC16C62B
Example
Legend: MM...M Microchip part number information
XX...X Customer specific information* AA Year code (last 2 digits of calendar year) BB Week code (week of January 1 is week ‘01’) C Facility code of the plant at which wafer is manufactured
O = Outside Vendor C = 5” Line S = 6” Line
H = 8” Line D Mask revision number E Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available characters for customer specific information.
9817HAT
9817CAT
9810/SAA
9817SBP
* Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
XXXXXXXXXXX
PIC16C62B/72A
DS35008A-page 98 Preliminary 1998 Microchip Technology Inc.
15.2 K04-070 28-Lead Skinny Plastic Dual In-line (SP) – 300 mil
* Controlling Parameter.
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
0.320
0.270
0.280
1.345
0.125
0.015
0.070
0.140
0.008
0.000
0.040
0.016
Mold Draft Angle Bottom
Mold Draft Angle Top
Overall Row Spacing
Radius to Radius Width
Molded Package Width
Tip to Seating Plane
Base to Seating Plane
Top of Lead to Seating Plane
Top to Seating Plane
Upper Lead Width
Lower Lead Width
PCB Row Spacing
Package Length
Lead Thickness
Shoulder Radius
Number of Pins
Dimension Limits
Pitch
Units
E
β
eB
E1
α
A1 A2 L D
A
c
R
n
B1
B
p
MIN MIN
0.2950.288
5
5
10
0.350
0.283
10
0.380
0.295
15
15
0.090
1.365
0.130
0.020
0.150
0.010
0.005
NOM
INCHES*
28
0.053
0.019
0.100
0.300
1.385
0.135
0.025
0.110
0.160
0.012
0.010
0.065
0.022
MAX
7.497.307.11
8.89
7.18
5
8.13
6.86
5
10
10
15
15
9.65
7.49
34.67
3.30
0.51
2.29
3.81
0.25
0.13
1.33
0.48
2.54
7.62
MILLIMETERS
1.78
34.16
3.18
0.38
3.56
0.20
0.00
1.02
0.41
NOM
2.79
35.18
3.43
0.64
4.06
0.30
0.25
MAX
28
1.65
0.56
n 1
2
R
D
E
c
eB
β
E1
α
p
L
A1
B
B1
A
A2
PIC16C62B/72A
1998 Microchip Technology Inc. Preliminary DS35008A-page 99
15.3 K04-080 28-Lead Ceramic Dual In-line with Window (JW) – 300 mil
* Controlling Parameter.
n 1
2
R
Overall Row Spacing
Radius to Radius Width
Package Length
Tip to Seating Plane
Base to Seating Plane
Top of Lead to Seating Plane
Top to Seating Plane
Shoulder Radius
Upper Lead Width
Lower Lead Width
PCB Row Spacing
Dimension Limits
Window Width Window Length
Package Width
Lead Thickness
Pitch
Number of Pins
Units
0.170A
0.130W1
W2 0.290
D
E1 eB
E
A2 L
A1
1.430
0.345
0.255
0.285
0.135
0.015
0.107
B
R c
B1
n p
0.016
0.008
0.010
0.050
0.098
MIN
MILLIMETERS
4.320.1950.183
0.310
0.150
0.425
0.285
0.295
1.485
0.145
0.030
0.143
0.140
0.300
0.385
0.270
0.290
1.458
0.140
0.023
0.125
0.13
0.29
36.32
8.76
6.48
7.24
3.43
0.00
2.72
0.012
0.015
0.065
0.021
0.102
MAXNOM
0.010
0.013
0.058
0.019
0.100
0.300 28
INCHES*
0.41
0.20
0.25
1.27
2.49
MIN
4.954.64
0.31
0.15
10.80
7.24
7.49
37.72
3.68
0.76
3.63
0.14
0.3
37.02
6.86
9.78
7.37
0.57
3.56
3.18
0.30
0.38
1.65
0.53
2.59
NOM
28
0.47
0.32
0.25
1.46
2.54
7.62
MAX
D
W2
W1
E
c
E1
eB
p
A1
L
B1
B
A2
A
PIC16C62B/72A
DS35008A-page 100 Preliminary 1998 Microchip Technology Inc.
15.4 K04-052 28-Lead Plastic Small Outline (SO) – Wide, 300 mil
MIN
pPitch
Mold Draft Angle Bottom
Mold Draft Angle Top
Lower Lead Width
Radius Centerline
Gull Wing Radius
Shoulder Radius
Chamfer Distance
Outside Dimension
Molded Package Width
Molded Package Length
Shoulder Height
Overall Pack. Height
Lead Thickness
Foot Angle
Foot Length
Standoff
Number of Pins
β
α
B
c
φ
X
A2
A1
A
n
E1
L
L1
R1 R2
E
D
Dimension Limits
Units
1.270.050
8
12
12
0.017
0
0.014 0
0.019
15
15
0.011
0.015
0.016
0.005
0.005
0.020
0.407
0.296
0.706
0.008
0.058
0.099
28
0.394
0.011
0.009
0.010
0
0.005
0.005
0.010
0.292
0.700
0.004
0.048
0.093
0.419
0.012
0.020
0.021
0.010
0.010
0.029
48
0.299
0.712
0.011
0.068
0.104
0.36
0
0
12
12
0.42
15
15
0.48
10.33
17.93
10.01
0.23
0.25
0.28
0.13
0.13
0.25
0
7.42
0.10
1.22
2.36
17.78
10.64
0.41 4
0.27
0.38
0.13
0.13
0.50
0.53
0.30
0.51
0.25
0.25
0.74
7.51
0.19
28
2.50
1.47
18.08
7.59
0.28
2.64
1.73
NOM
INCHES*
MAX NOM
MILLIMETERS
MIN MAX
n
1
2
R1
R2
D
p
B
E1
E
L1
L
c
β
45
°
X
φ
A1
α
A
A2
*
Controlling Parameter.
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
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