LOGITECH DH300 User Manual

Introduction

The single station DH300 precision polishing machine provides both
research and production oriented establishments with a high quality,
automated polishing facility. Wafers, lenses, mirrors, prisms or
components consisting of a wide variety of different materials (up to a
maximum of 300mm) can be polished with ease using the Logitech range
of polishing cloths, plates and solutions.

Description

The process area consists of a 560mm (22”) diameter polishing plate, a
single motor driven, sweeping polishing head with a detachable wafer /
component carrier and an integral polishing fluid feed system.

Polishing process parameters such as the plate speed, carrier speed,
direction, down pressure and polishing fluid fow rate can all be set using
the automated control panel. Each of these parameters can be selected,
changed and saved using the control panel joystick. Situated to the front
of the DH300, the control panel unit can be swivelled to either the left or
right hand sides of the machine as desired. An umbilical link also allows
the panel to be detached from the main body of the DH300 and moved to
a distance of 2m (6.56ft) away.

The polishing plate and wafer / component carrier can both be
programmed to rotate in clockwise or anti-clockwise directions
independently and at speeds of up to 160rpm and 125rpm respectively.
This allows a wide variety of individual polishing techniques to be catered
for whilst making use of the Logitech polishing plate, cloth and fluid range

to produce repeatable process results.
The polishing arm can also be programmed to sweep the wafer /

component carrier across the polishing plate surface. The level of sweep
can be controlled from the control panel, as can the level of down force
exerted on the carrier (1-5psi sample pressure). This combination of
sweep and down force allows particularly hard optical materials such as
sapphire and silicon carbide, to be polished with ease.

Loading and unloading of the carrier arm is again controlled from the
control panel and no heavy lifting is required as the carrier simply clicks
into place.

The polishing solution feed system is regulated from the automated
control panel and brings fluid through a peristaltic pump to the polishing
plate. This system ensures a continuous supply of polishing fluid
throughout the polishing process.

Applications

The DH300 can be used for polishing wafers, prisms, mirrors, lenses or
components of virtually any optical or semiconductor material. Automated
controls and independently adjustable process parameters make this
single station unit ideal for those seeking to quickly polish wafers to an
epitaxy ready surface. This versatility is heightened by the unit’s ability to
work with wafers / components of differing diameters and up to a
maximum of 300mm.

DH300

• Single motor driven sweeping polishing
head

• Variable plate speed (0-160rpm)

• Plate diameter of 560mm (22”)

• Process 1 x 300mm or 12 x 2”Ø wafers

• SiC, GaN, AlN, Sapphire, Nd:YAG

Driven Head Precision Polishing Machine

Technical Data

Specifications:

Power supply:
Fuse rating:
Plate speed:
Plate direction:
Plate size:
Carrier speed:
Carrier direction:
Machine capacity:
Height:
Width:
Depth:

Single Phase 220-230V
13A
0-160rpm
Clockwise & counter clockwise
560mm (22”)
125rpm
Clockwise & counter clockwise
12 x 2” wafers per run
1800mm
700mm
950mm

Logitech Limited

Erskine Ferry Road, Old Kilpatrick, Glasgow G60 5EU, Scotland, U.K.
Tel: [phone]

Fax: [phone]
e-mail: [e-mail]

www.logitech.uk.com

Distributed by:

Due to a continuous programme of development, Logitech reserves the right to change specifications without prior notice.

Certificate No. FM12025

Ordering Data:

1DH31
1DHS1-0100
1DHS1-0200
1DHS1-0300

DH300 Driven Head Precision Polishing Machine (220-230V)
Standard complete wafer / component carrier
Carrier plate for the wafer / component carrier
Standard sample polishing template (12 x 2ӯ wafers)

DH300/7/04

The Automated Control Panel:

From this control screen it is
possible to set the following
process parameters:

• Plate & carrier rotation speed

• Polishing solution feed rate

• Carrier Sweep

• Start / stop the polishing
process

From the second control screen
it is possible to set the following
process parameters:

• Plate rotational direction

• Carrier rotational direction

• Carrier down pressure

Polishing Templates:

Avariety of different templates
are available to suit individual
requirements. The carrier head
has a lightweight removable
baseplate for fixing templates to
as shown on the right.

Each template allows wafers /
components to be held securely
throughout the polishing process
and work equally well with
multiple groupings of wafers /
components (see right) or single
large diameter wafers up to
300mm.

Polishing plate

Polishing arm

Wafer /

component

carrier

Emergency
stop button

Joystick
control

Perspex

spray shield

Lockable wheels

Access to

motor

1/4 VGA
Graphical
interface

MANUAL CONTROL
Timer: 00:00 mm:ss

RESET START STOP

Carrier

021 rpm

FlushONSlurry

400 ml/m

Plate

003 rpm

40

80

120

160

40

80

120

160

50%Sweep Frequency:
50%Sweep Amplitude:

PAGE EXIT

MANUAL CONTROL
Timer: 00:26 mm:ss

Plate Direction:

Carrier Direction:

Pressure Units:

CW

CCW

PSI

EXITPAGE

Movable
arm