Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transfo rmer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Good Earth Ground
such as WATER PIPE,
To Instrument's
exposed
METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unl ess sp ecified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" compon ents. The following techniques
should be used to help reduce the incide nce of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alter natively, obtain and wear a comme rcially availab le
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most re pla cem ent ES dev ice s are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motions w hen h an dl ing u np ac kaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carp eted floor can ge ner ate st atic electricit y
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only un til the solder fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of the circuit board. (Use this techniq ue onl y on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break an d loc ate the nearest component that is dir ect ly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
6) Updating Completed, The TV will restart automatically.
7) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a
DTV/ATV test on production line.
LGE Internal Use Only
3.1. ADC Process
3.1.1. ADC
1) Press the “ADJ” KEY on R/C and enter EZ ADJUST.
2) Enter ADC Calibration mode by pushing “►” key at “7.
ADC Calibration”.
3) Push the “Start” button.
4) ADC Calibration is executed automatically.
5) Press “EXIT” key on R/C.
lGhkq|z{G
WUG{GvXGG G
XUG{GvYGG G
YUG{GvZGG G
ZUG{Gv[GG G
[UG{Gv\GG G
\UGjGnGG G
]UGhGvGG G
^UGhkjGjGG ඖG
_UG~GiGG G
`UGXWGwG~iGG G
XWUG{GwGG G
XXUGlkpkGkVsGG G
XYUGzGiVjG
XZUG{GzGzG
X[UGlUpGhG
G
G G
* ADC Calibration Protocol (RS232)
NOItemCMD 1CMD 2Data 0
hkjGjG
h
kjGjG[_WGvrG
hkjGjGXW_WGvrG
hkjGyniGvrG
G
G zGyG
G
3.2.2. RGB EDID Data
- M2252D(Product ID : 24747)
*(week), **(year), ***(Check sum) : Adjustable Data
3.2.3. HDMI EDID Data
- M2252D(Product ID : 24748)
Enter
Adjust MODE
ADC
adjust
Adjust
‘Mode In’
ADC
adjust
AA00When transfer the
AD10Automatically adjustment
‘Mode In’,
Carry the command.
(The use of a internal
pattern)
- Adjust Sequence
• aa 00 00 [Enter Adjust Mode]
• xb 00 40 [Component1 Input (480i)]
• ad 00 10 [Adjust 480i Comp1]
• xb 00 60 [RGB Input (1024*768)]
• ad 00 10 [Adjust 1024*768 RGB]
• aa 00 90 End Adjust mode
3.2. EDID Process
3.2.1. EDID download
1) Press "Power only" key of service remote control.
2) Press the ADJ KEY on R/C and enter EZ ADJUST
3) Enter EDID D/L mode by pushing "►" key at "EDID D/L".
4) EDID download is executed automatically.
5) Press EXIT key on R/C.
lGhkq|z{G
WUG{GvXGG G
XUG{GvYGG G
YUG{GvZGG G
ZUG{Gv[GG G
[UG{Gv\GG G
\UGjGnGG G
]UGhGvGG G
^UGhkjGjGG G
_UG~GiGG G
`UGXWGwG~iGG G
XWUG{GwGG G
XXUGlkpkGkVsGG ඖG
XYUGzGiVjG
XZUG{GzGzG
X[UGlUpGhG
G
G G
→ Caution: - Never connect HDMI & D-sub Cable when
1) Press "Power on" key of service remote control.
2) Connect RS232 to USB Signal Cable to USB Jack.
3) Check the 'Tool Option' (Refer to the BOM Comments or
Adjustment spec)
4) Check the ‘ADC’ is ok.
4.2. Model name & Serial number Download
4.2.1. Model name & Serial number D/L
1) Press "Power on" key of service remote control.
2) Connect RS232 Signal Cable to RS-232 Jack.
3) Write Serial number by use RS-232.
4) Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).
4.2.2. method & notice
1) Serial number D/L is using of scan equipment.
2) Setting of scan equipment operated by Manufacturing
Technology Group.
3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
4.3. Function Check
4.3.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
2) COMPONENT (480i)
3) RGB(PC : 1920 x 1080 @ 60Hz)
4) HDMI1/2
5) PC Audio In
* Display and Sound check is executed by Remote controller
* Caution : Not to push the INSTOP KEY after completion if the
function inspection.
4.3.2. PIP Check
1) Press “Power on” key of service remote control.
2) Input RGB & TV(ATV or DTV) signal.
3) Set Input mode to RGB.
4) Press ‘PIP” key of ADJ remote controller
5) Check TV Video & Audio signal of Sub picture.
*Manual Download (Model Name and Serial Number)
If the TV set is do wnloaded By OTA or Serv ice man ,
Sometimes model name or serial number is initialized.( Not
always) There is impossible to download by bar code scan, so
It need Manual download.
1) Press the 'Instart' key of ADJ remote controller.
2) Go to the menu 'Model Number D/L' like below photo.
3) Input the Factory model name(ex M2352D-PZN) or Serial
number like photo.
4) Check the model name Instart menu -→ Factory name
displayed (ex M2352D-PZN)
5) Check the Diagnostics (DTV country only) -→ Buyer model
displayed (ex M2352D-PZ)
4.3.3. 3D function Check(Model name: DM~)
■ Test equipment
1) Pattern Generator MSHG-600 or MSPG-6100 (HDMI 1.4
support)
RGB_Gains are fixed data for each model.
Insert RS-232C Jack which is connected with PC for White
Balance or equivalent device.
* Total Assembly line should be check whether the color
coordinate(x,y) data refer to below table were meet or not.
Color
Temperature
Luminance
(cd/m²)
*Note : x,y coordinates are drifted about 0.007 after 30 mins
*Note : Manual W/B process using adjusts Remote control.
1) After enter Service Mode by pushing "ADJ" key,
2) En ter "White Balance" by pushing "►" key at "White
G
G
WUG{GvXGGG
WUG{GvXG
XUG{GvYGGG
XUG{GvYG
YUG{GvZGGG
YUG{GvZG
ZUG{Gv[GGG
ZUG{Gv[G
[UG{Gv\GGG
[UG{Gv\G
\UGjGnGGG
\UGjGnG
]UGhGvG
]UGhGvG
^UGhkjGjGGGGGGGGG
UGhkjGjGGG GG GG GG
^
_UG~GiGGGGGGGGGGඖGGG
_UG~GiGGG GG GG GG GඖG
`UGXWGwG~iGGGG
`UGXWGwG~iGG
XWUG{GwGGGGG
XWUG{GwGG G
XXUGlkpkGkVsGGGGGGGGGGGGGGGG
XXUGlkpkGkVsGG GG GG GG GG GG GG
XYUGzGiVjG
XYUGzGiVjG
X
XZUG{GzGzG
ZUG{GzGzG
X[GlUGpGhG
[GlUGpGhG
X
GG G
G
Cool9,300k°K X=0.285 (±0.03)
Medium8,000k°K X=0.295 (±0.03)
Warm6,500k°K X=0.313 (±0.03)
Y=0.293 (±0.03)
Y=0.305 (±0.03)
Y=0.329 (±0.03)
CoolMin : 80Typ : 110<Test Signal>
MediumMin : 80Typ : 110
<Test Signal>
Inner pattern
(204gray,80IRE)
Inner pattern
(204gray,80IRE)
WarmMin : 80Typ : 110
heat-run. So checking color coordinate within 5-min at
total assembly line, consider x,y coordinates might be
up to 0.007 than x,y target of each color temperature.
Balance".
~GiG
~GiG
jG{UGඔGjGඖG
jG{UGඔG jG ඖG
GG
yTnGGXWWGG
yTnGGXWWG G
nTnGGXW[GG
nTnGGXW[G G
iTnGGX`YGG
iTnGGX`YG G
yTjGG][GG
yTjGG][G G
nTjGG][GG
nTjGG][G G
iTjGG][GG
iTjGG][G G
GG
{TwGGvuGG
{TwGGvuG G
iGGXWWGG
iGGXWWG G
yGG{GzGG
yGG{GzG G
4.5. DPM Operation check
■ Measurement Condition: 100~240V@ 50/60Hz
1) Set Input to RGB-PC and connect D-sub cable to set –
RGB Mode. Set Input to HDMI1/2(with Input Label set to
PC) and connect HDMI1/2 cable to set – HDMI Mode
2) Cut off H sync or V sync of signal.
3) Check DPM operation refer to the below table.
Operating ConditionSync
Power S/W On Sleep mode -
RGB,HDMI
(H/V)
Off/OffOffAmber1
VideoLED
(SET)
Wattage
(W)
4.6. Model Name & SW Version & Adjust check.
* Press the ‘Instart’ key of ADJ remote controller
4.6.1. Model Name& SW Version Check
1) Check ‘Model Name’.
2) Check ‘S/W Version’ (Refer to the IC Ver. in the BOM)
4.6.2. Adjust Check
1) Check ‘Country Group’
2) Check ‘Area Option’
3) Check ‘Tool Option’ (Refer to the BOM Comments)
4) Check ‘Adjust ADC[Comp&RGB]’ is OK.
5) Check ‘EDID[RGB&HDMI1/2]’ is OK.
* After check all, Press the 'EXIT' key of ADJ remote controller
to go out SVC menu.
* When doing Adjustment, Please make circumstance as
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
/F_RB
/PF_OE
/PF_CE0
+3.3V_AVDD
10K
OPT
R104
/PF_WP
SYSTEM EEPROM
2011.08.20 1M > 256K
C105
8
7
6
5
+3.3V_ST
OPT
R158
10K
0.1uF
VCC
WP
SCL
SDA
/SPI_CS
SPI_SDO
IC104
AT24C256C-SSHL-T
A0
1
A1
2
A2
A0’h
3
GND
4
2011.08.20 DELETE HDCP EEPROM
SERIAL FLASH MEMORY
/FLASH_WP
/PF_CE1
PF_ALE
/PF_WE
+3.3V_AVDD
C104
8pF
OPT
+3.3V_ST
OPT
R105
1K
OPT
R159
SO/SIO1
C106
8pF
OPT
4.7K
+3.3V_AVDD
1K
R109 3.9K
R107
C101
OPT
R1081K
0.1uF
R106
1K
R11122
R11222
IC100
MX25L8006EM2I-12G
CS#
1
2
WP#
3
GND
4
I2C_SCL
I2C_SDA
8
7
6
5
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
VCC
HOLD#
SCLK
SI/SIO0
R/B
RE
CE
CLE
ALE
WE
WP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
+3.3V_ST
R177
33
R176
33
C111
IC102
H27U1G8F2BTR-BC
EAN35669102
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
NC_29
NC_28
NC_27
NC_26
I/O7
I/O6
I/O5
I/O4
NC_25
NC_24
NC_23
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
+3.3V_AVDD
C102
10uF
10V
C103
0.1uF
22
AR101
AR102
U02
{PAD_PM_PWM}
Boot from SPI_CS1N(EXT_FLASH) 1’b0
Boot from SPI_CS0N(INT_LASH) 1’b1
{I2C_OUT_BCK, I2S_OUT_MCK, PAD_PWM1, PAD_PWM0}
B51_NO_EJ 4’b0000 Boot from 8051 with SPI flash
SB51_WOS 4’b0001 Secure B51 without scramble
SB51_WS 4’b0010 Secure B51 with scramble
MIPS_SPI_NO_EJ 4’b0100 Boot from MIPS with SPI falsh
MIPS_SPI_EJ_1 4’b0101 Boot from MIPS with SPI flash
MIPS_SPI_EJ_2 4’b0110 Boot from MIPS with SPI flash
MIPS_WOS 4’b1001 Secure MIPS without scramble
MIPS_WS 4’b1010 Secure MIPS with scramble
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64559004
DMxx52/Mxx522012.03.08
SCALER/MEMORY/EEPROM
1 11
MODEL OPTION
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64559004
DMxx52/Mxx522012.03.08
SCALER
2 11
CVBS & COMPONENT
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11.11.07
Component Jack change
EAG60968202->EAG60968207
[GN]E-LUG
6A
[GN]O-SPRING
5A
[GN]CONTACT
4A
[BL]E-LUG-S
7B
[BL]O-SPRING
5B
[RD]E-LUG-S
7C
[RD]O-SPRING_1
5C
[RD]CONTACT_1
12.01.12
4C
L-mono wiring
5D
[WH]O-SPRING
4E
[RD]CONTACT_2
5E
[RD]O-SPRING_2
6E
JK400
[RD]E-LUG
PPJ234-05
DSUB RGB
2:E18
DSUB_VSYNC
DSUB_HSYNC
2:E18
L401
DSUB_B
DSUB_G
DSUB_R
11.10.31
To Improve EMI
C419
47pF
50V
BLM15BD121SN1
R400
75
C420
47pF
50V
11.10.12
Varistor
Audio line->DEL
Video line->OPT
OPT
VA400
20V
L402
BLM15BD121SN1
R401
75
BLM15BD121SN1
C421
R402
47pF
75
50V
To Improve Ringing issue
LOW capacitance Part apply
L403
11.10.27
VA401
VA402
PC AUDIO
R444
C418
0.1uF
16V
IR_OUT
R443
15K
R442
470K
OPT
R441
470K
OPT
R445
15K
JP413
JP414
JP415
R446
10K
R447
10K
SHIELD
4
C
GND
B
VCC
Fib er Op tic
A
VIN
2F11TC1-EM52-4F
JK402
OPT(SPDIF Jack)
RS232C
4P RS232C wafer(EAG58732903)
DEL (111129)->ADD (111220)
+3.3V_ST
IR_OUT
0
6 M6
+3.3V_AVDD
R406
10K
R409
C402
0.1uF
16V
L404
CM2012FR10KT
L405
L406 CM2012FR10KT
C408
1000pF
50V
OPT
R422
10K
C407
1000pF
50V
OPT
MMBD6100
C
R413
R408
10K
10K
OPT
C403
18pF
50V
VA415
20V
OPT
JP407
JP405
GND_2
RED_G ND
6
1K
C423
47pF
50V
CM2012FR10KT
C425
47pF
50V
C427
47pF
50V
R423
10K
R425
12K
R424
12K
D416
A2
A1
JP408
V_SYN C
H_SYN C
NC10SYNC_ GND
DDC_D ATA
BLUE_ GND
RED2GREEN3BLUE4GND_15DDC_G ND
GREEN _GND
14
13
12
11
9
8
7
1
P400
SPG09-DB-010
R404
R405
JP409
DDC_C LOCK
15
0
0
+3.3V_ST
OPT
R431
0
OPT
16
R420
VA417
SHILE D
OPT
VA408
20V
VA407
20V
R407
75
C422
47pF
R41 0
R426
75
R41 2
75
5.5V
R415
470K
OPT
R414
470K
OPT
JP400
JP401
R427 0
0
VA406
C401
18pF
R429 0
5.5V
50V
C424
47pF
50V
C426
47pF
50V
OPT
50V
JP406
VA412
20V
VA413
20V
OPT
20V
5.5V
VA403
+5V_GENERAL
0
20V
OPT
JP410
AV_CVBS_IN
COMP_Y
COMP_Pb
COMP_Pr
R421
+3.3V_ST
VA418
20V
OPT
AV_CVBS_DET
0
R434
47K
R435
10K
+3.3V_AVDD
COMP_L_IN
COMP_R_IN
B
R403
10K
R416
1K
OPT
D414
5.6V
RGB_DDC_SCL
RGB_DDC_SDA
R418
47K
C
Q400
MMBT3904(NXP)
E
111026
Can be deleted??
DSUB_DET
COMP_DET
KJA-PH-1-0177
Hotel_Model(RS232C apply)
PM_TXD
PM_RXD
VA427
VA428
20V
OPT
1 M1
3 M3_DETECT
4 M4
5 M5_GND
JK401
SPDIF OPTIC JACK
SPDIF_OUT
C409
0.33uF
16V
Hotel_Model(RS232C apply)
DOU T28RIN 2
6V-5
7
MAX3232CDR
Hotel_Model(RS232C apply)
11
9
10
DIN 1
DIN 2
ROU T2
NON_Hotel_Model(RS232C Bypass)
NON_Hotel_Model(RS232C Bypass)
20V
OPT
JP411
JP404
JP403
JP402
+5V_GENERAL
2:X18
Hotel_Model(RS232C apply)
C412
0.33uF
16V
C1-2V+
C2+
C2-
3
4
IC401
12
13
14
RIN 1
ROU T1
R440
100
DOU T1
JP412
R448
0
R449
0
R439
100
T_TERMINAL7B_TERMINAL5T_SPRING4R_SPRING8G_SPRING
6
C414
VA419
220pF
20V
50V
C413
VA420
220pF
20V
50V
+5V_GENERAL
R438
1K
OPT
OPT
VA421
20V
C415
0.1uF
16V
C416
0.33uF
16V
C417
0.1uF
16V
Hotel_Model(RS232C apply)
C1+
1
15
GND16VCC
Hotel_Model(RS232C apply)
VA422
20V
VA423
20V
JP416
E_SPRING
3
PEJ029-02
JK404
Hotel_Model(RS232C apply)
+3.3V_ST
PC_R_IN
PC_L_IN
1:C7
1:C7
P1104
12507WS-04L
1
2
3
4
5
USB
3AU04S-305-ZC-(LG)
JK403
1234
USB DOWN STR EAM
5
C400
0.1uF
JP429
JP428
JP427
VA424
OPT(USB Varistor)
20V
OPT(USB Varistor)
C404
10uF
10V
OPT
VA425
20V
ETHERNET
111026
LAN Jack deletion
111117
LAN Jack Addition for T2
LAN JACK(for UK DVB-T2)
JK405
XRJV-01V-0-D12-080
1
2
3
4
5
6
7
8
9
9
+3.3V_AVDD
R411
0
LAN JACK(for UK DVB-T2)
C410
0.01uF
50V
LAN JACK(for UK DVB-T2)
Jack Shield (HDMI1, HDMI2, RGB)
JackShield(for NonCKD)
MGJ63348201
IC400
AP2191DSG
NC
8
OUT_2
7
OUT_1
6
FLG
5
OPT
VA404
M1
GND
1
IN_1
2
IN_2
3
EN
4
USB_DM
USB_DP
111026
ESD diode deletion
EAH39491601 2EA
120103
ESD diode addition
EAF61530301 2EA
OPT
OPT
5.5V
5.5V
VA405
VA409
M1-*1
MGJ63348202
USB_CTL
R417
10K
R419
47
1:AL8
1:AL7
OPT
5.5V
5.5V
VA426
JackShield(for CKD)
+5V_USB
USB_OCD
EPHY_TP
EPHY_TN
EPHY_RP
EPHY_RN
C405
0.1uF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64559004
DMxx52/Mxx522012.03.08
INTERFACE
3 11
DVB-CI SLOT
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
PCMCIA
10K
EBK38029201(Rohm)
EBK61011501(Diode)
R509
22K
CI_SLOT
R510
2.2K
CI_SLOT
B
10K
R502
CI_SLOT
11.11.15
Maker:Diode->Rohm
11.12.22
Maker:Rohm->Diode
Supply issue
due to Typoon
CI_SLOT
C505
4.7uF
10V
C
CI_SLOT
Q500
MMBT3904(NXP)
E
$0.005
CI_SLOT
Q501
ZXMP3F30FHTA
S
G
D
CI_SLOT
C507
0.1uF
16V
R518
10K
AR509
CI_SLOT
CI_ADDR[8]
CI_ADDR[9]
CI_ADDR[10]
+5V_CI_ON
OPT
OPT
C513
0.1uF
16V
CI_ADDR[11]
CI_ADDR[12]
CI_ADDR[13]
CI_ADDR[14]
CI_OE
CI_WE
CI_IORD
CI_IOWR
REG
33
AR510
33
AR506
33
CI_SLOT
CI_SLOT
PCM_A[8]
PCM_A[9]
PCM_A[10]
PCM_A[11]
PCM_A[12]
PCM_A[13]
PCM_A[14]
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORD
/PCM_IOWR
EAX64559004
DMxx52/Mxx522012.03.08
PCMCIA
4 11
HDMI2
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
120216
EAG61491201->EAG59023302
SHIELD
20
DATA0-
DATA0_SHIELD
DATA0+
DATA1-
DATA1_SHIELD
DATA1+
DATA2-
DATA2_SHIELD
DATA2+
YKF45-7058V
JK601
HDMI JACK(JALCO)
HDMI JACK(FREEPORT)
JK601-*1
51V019S-35SN-CR2-B-LG
10
11
12
13
14
15
16
17
18
19
20
SHIELD
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
1
2
3
4
5
6
7
8
9
CLK+
DATA2+
DATA2_SHIELD
DATA2-
DATA1+
DATA1_SHIELD
DATA1-
DATA0+
DATA0_SHIELD
DATA0-
CLK+
CLK_SHIELD
CLK-
CEC
NC
SCL
SDA
DDC/CEC_GND
+5V_POWER
HPD
+3.3V_ST
HPD
+5V_POWER
DDC/CEC_GND
SDA
SCL
NC
CEC
CLK-
CLK_SHIELD
R668
47K
5V_HDMI2
R669
10K
MMBT3904(NXP)
R632
1K
R677
HDMI2_ARC
R635
47K
B
C606
0.1uF
16V
R659 2.2
R609 2.2
R655 2.2
R657 2.2
R658 2.2
R605 2.2
R606 2.2
R602 2.2
C
Q600
MMBT3904(NXP)
E
111026
Can be deleted??
C
Q601
E
0
5V_HDMI2
30V
D600
R607
10K
OPT
OPT
C607
C622
33pF
33pF
50V
50V
R634
10K
B
DDC_SDA_2
DDC_SCL_2
HDMI_ARC
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
+5V_GENERAL
OPT
D607
R608
10K
HDMI2_DET
30V
HPD2
DDC_SCL_2
DDC_SDA_2
2:E10;K7
2:E10;K7
HDMI1
111109
HDMI Jack Change
EAG59023301->EAG61491201
120216
EAG61491201->EAG59023302
SHIELD
20
19
18
17
16
15
14
13
12
11
10
DATA0-
DATA0_SHIELD
DATA0+
DATA1-
DATA1_SHIELD
DATA1+
DATA2-
DATA2_SHIELD
DATA2+
YKF45-7058V
JK600
HDMI JACK(JALCO)
HDMI JACK(FREEPORT)
JK600-*1
51V019S-35SN-CR2-B-LG
10
11
12
13
14
15
16
17
18
19
20
SHIELD
HPD
+5V_POWER
DDC/CEC_GND
SDA
SCL
NC
CEC
CLK-
CLK_SHIELD
CLK+
9
8
7
6
5
4
3
2
1
DATA2+
1
DATA2_SHIELD
2
DATA2-
3
DATA1+
4
DATA1_SHIELD
5
DATA1-
6
DATA0+
7
DATA0_SHIELD
8
DATA0-
9
CLK+
CLK_SHIELD
CLK-
CEC
NC
SCL
SDA
DDC/CEC_GND
+5V_POWER
HPD
R600
47K
+3.3V_ST
5V_HDMI1
R638
10K
MMBT3904(NXP)
R637
1K
R678
HDMI1_ARC
R660 2.2
R661 2.2
R662 2.2
R663 2.2
R648 2.2
R656 2.2
R643 2.2
R636
47K
C
B
E
C612
0.1uF
16V
R664 2.2
Q606
MMBT3904(NXP)
111026
Can be deleted??
C
Q605
E
0
5V_HDMI1
30V
D618
R665
10K
OPT
OPT
C628
C626
33pF
33pF
50V
50V
R667
10K
B
DDC_SDA_1
DDC_SCL_1
HDMI_ARC
HDMI_CEC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
+5V_GENERAL
OPT
D619
R666
10K
HDMI1_DET
30V
HPD1
DDC_SCL_1
DDC_SDA_1
2:E10;K7
2:E10;K7
SCART
22
AV_DET
21
COM_GND
20
JP612
SYNC_IN
19
SYNC_OUT
18
SYNC_GND2
17
SYNC_GND1
16
RGB_IO
15
R_OUT
14
RGB_GND
13
R_GND
12
D2B_OUT
11
G_OUT
.
10
.
9
8
SC_ID
B
7
6
LIN
5
GND
4
GND
3
L_OUT
2
R_IN
1
R_OUT
JK602
EU
111108
NonMetal shield
EAG60841502->EAG60841501
VA601
20V
OPT
JP609
JP601
JP602
JP603
JP611
JP610
JP604
JP605
JP606
JP607
OPT->
APPLY
OPT->
APPLY
VA602
VA603
OPT
VA604
20V
VA605
OPT->
APPLY
VA610
20V
20V
20V
VA606
OPT
EU
C610
1000pF
50V
SCART TV VOUT
+19V_SCART
+3.3V_AVDD
C625
C624
0.1uF
R642
4.7K
EU
R644
20V
OPT
C611
R628
47pF
75
50V
EU
GND
VA608
R626
20V
75
OPT
EU
EU
R641 22
R625
R622
75
EU
75
EU
R620
75
EU
VA609
20V
OPT->
APPLY
VA612
20V
OPT
VA611
R645
20V
470K
OPT
OPT
C609
1000pF
50V
20V
EU
C614
4700pF
OPT
1K
EU
EU
R621
R647
470K
OPT
75
EU
C617
220pF
50V
OPT
11.10.27
0CE107WF6DC
->EAE38362801
C615
4700pF
OPT
SCART1_DET
C613
100uF
16V
SC1_FB
SC1_CVBS_IN
EU
EU
EU
EU
EU
R651
10K
C621
330pF
50V
OPT
EU
R650
10K
C620
330pF
50V
OPT
L601
EU
CM2012FR10KT
C629
47pF
50V
L602
EU
C631
47pF
50V
L603
EU
C633
47pF
50V
R654
12K
EU
R653
12K
EU
DTV/MNT_LOUT
DTV/MNT_ROUT
C630
47pF
50V
CM2012FR10KT
C632
47pF
50V
CM2012FR10KT
C634
47pF
50V
SC1_L_IN
SC1_R_IN
002:P7
002:P7
MMBT3906(NXP)
EU
EU
EU
2:S14
Q609
EU
Gain=1+(Rf/Rg)
MMBT3904(NXP)
E
B
C
Rf
R604
200
R623
12.02.13
R604:200 R675:200
R623:0 R676:360
SC1_R
SC1_G
SC1_B
MMBT3904(NXP)
EU
R675
200
R676
0
360
EU
Q608
EU
EU
C
Q610
EU
E
1005->1608
R629
180
EU
Rg
11.11.14
180->470
11.12.02
470->180
R603
2K
EU
R646
62K
EU
VA613
20V
OPT
EU
R631
470
B
EU
Q611
MMBT3906(NXP)
3
R649
11K
10uF
25V
EU
EU
R633
47K
EU
R639
15K
EU
1
2
R673
10K
EU
EU
50V
EU
12.01.12
1000hr->2000hr
0CE476WF6DC->EAE61423901
EU
C600
47uF
25V
EU
R640
100
DTV/MNT_VOUT
SCART1_MUTE
C623
R674
0.1uF
10K
50V
EU
EU
SC1_ID
2:E16
For CEC
R670
HDMI_CEC
100
CEC_REMOTE_S7
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HDMI/SCART
Audio Out Amp
DTV/MNT_LOUT
C618
DTV/MNT_ROUT
330pF
C601
330pF
+19V_SCART
C602
0.1uF
50V
SCART1_Lout
EU
SCART1_Rout
EU
IC601
EU
R611
2.2K
EU
C603
R630
220K
R601
220K
10uF
10V
EU
R612
5.6K
R613
5.6K
EU
EU
R610
2.2K
C604
10uF
10V
EU
EU
EU
EU
R614
R615
EU
470K
470K
OPT
OPT
EU
R616
33K
EU
C605
33pF
EU
R617
33K
EU
C608 33pF
EU
R618
10K
NON_INV_IN2
EU
R619
10K
OUT1
INV_IN1
NON_INV_IN1
VCC
INV_IN2
OUT2
SN324
1
2
3
4
5
6
7
14
13
12
11
10
9
8
OUT4
INV_IN4
NON_INV_IN4
GND
NON_INV_IN3
INV_IN3
OUT3
Scart Audio Mute
DTV/MNT_LOUT
DTV/MNT_ROUT
OPT(EU_SCART mute)
Q602
MMBT3904(NXP)
OPT(EU_SCART mute)
Q603
MMBT3904(NXP)
OPT(EU_SCART mute)
R624
2K
OPT(EU_SCART mute)
R627
2K
OPT(EU_SCART mute)
Q604
MMBT3906(NXP)
3
1
R671
10K
2
OPT(EU_SCART mute)
R672
10K
OPT(EU_SCART mute)
OPT(EU_SCART mute)
D614
MMBD6100
A2
C
C616
0.1uF
OPT(EU_SCART mute)
A1
+3.3V_AVDD
OPT(EU_SCART mute)
R652
10K
SCART1_MUTE
SB_MUTE
EAX64559004
DMxx52/Mxx52
HDMI/SCART
2012.03.08
5 11
AUDIO AMP
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AMP
VA703
R710
HP_DET
1K
20V
OPT
Q703
VA701
VA70220V
MMBT3904(NXP)
E
C
E
C
Q701
MMBT3904(NXP)
B
B
B
B
C
Q705
MMBT3904(NXP)
E
C
Q704
MMBT3904(NXP)
E
20V
MUTE control
R711
R713
1K
C720
10uF
C719
1000pF
50V
OPT
1K
C721
10uF
C717
1000pF
50V
OPT
Q706
MMBT3906(NXP)
HP_LOUT
10V
HP_ROUT
10V
+3.3V_ST
E
C
B
11.11.15
OPTION
R714
3.3K
C
B
Q707
E
MMBT3904(NXP)
R733
10K
D709
MMBD6100
C
A2
SB_MUTE
A1
HP_MUTE
Pop-up noise killer
+19V
KDS226
AC
R734
220K
11.10.27
2.7K->220K
C742
4.7uF
50V
A
OPT
R735
220K
11.10.27
Apply->OPT
D710
C
R736
470
B
E
MMBT3906(NXP)
Q702
C
NON_EU
R737
12K
R738
12K
EU
R737-*1
3K
SB_MUTE
C724
47uF
25V
11.10.27
22K->12K
11.12.20
R737 3K(EU)
Countmeasure
of latch up
EAX64559004
DMxx52/Mxx522012.03.08
AUDIO IC
6 11
JK800
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11.12.22
Maker:Rohm->Diode
Supply issue
due to Typoon
EBK38029201(Rohm)
EBK61011501(Diode)
3.3V TO 1.5V LDO
IC807
9
THERMAL
8
7
6
5
[EP]GND
GND
ADJ/SENSE
VOUT
NC_2
C857
0.01uF
50V
R832
R833
+1.5V_DDR
1%
5%
10K
0
R844
R849
OPT
C864
1%
1K
1%
10K
10uF
10V
C867
0.1uF
50V
+19V_SCART
R887
0
+3.3V_AMP
+3.3V_ST
POWER_ON/OFF1
R817
4.7K
11.11.29
Diode DEL
0DSKE00048A
R879
0
R814
0
OPT
C817
0.1uF
TJ4220GDP-ADJ
NC_1
1
EN2
2
VIN3
50V
OPT
C805
10uF
10V
3
NC4
4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
POWER
EAX64559004
DMxx52/Mxx522012.03.08
POWER
7 11
Module
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+5V_PANEL_POWER
111116
100uF Ecap
Deletion
EAE38362801
C1001
0.1uF
50V
C1004
10uF
10V
LVA_3P
LVA_3M
LVA_CKP
LVA_CKM
LVA_2P
LVA_2M
LVA_1P
LVA_1M
LVA_0P
LVA_0M
LVB_3P
LVB_3M
LVB_CKP
LVB_CKM
LVB_2P
LVB_2M
LVB_1P
LVB_1M
LVB_0P
LVB_0M
C1002
1000pF
50V
R1000
1K
R1002
1K
R1004
1K
R1006
1K
JP1000
P1002
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
11.11.07
Harness LVDS wafer DEL
+3.3V_ST
11.12.01
19V->3.3V_ST
Resistor 4EA->1EA
12.01.12
100ohm->330ohm
Amber LED setting
KEY2
KEY1
KEY_SCL
KEY_SDA
+3.3V_ST
11.12.01
19V->3.3V_ST
Resistor 4EA->1EA
12.01.12
100ohm->330ohm
R1013
330
1%
LED_RED
RED LED setting
LED_AMBER
R1031
R1001
10K
R1003
330
1%
10K
B
C
Q1001
MMBT3904(NXP)
E
R1017
10K
R1018
10K
B
R1028
C
Q1005
MMBT3904(NXP)
E
+3.3V_ST
3.3K
R1021
100
R1027
100
OPT
50V
C1003
100pF
BLM18PG121SN1D
R1029
3.3K
50V
OPT
C1005
100pF
L1000
20V
VA1000
OPT
20V
VA1001
OPT
JP1001
JP1012
JP1011
JP1008
JP1002
JP1006
JP1007
JP1009
JP1010
JP1013
P1006
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
IR_OUT
+3.3V_ST
R1023
IR_OUT
R1022
22
IR_OUT
Q1002
MMBT3904(NXP)
IR_OUT
C
E
10K
IR_OUT
B
R1033
0
C1014
1000pF
IR_OUT
MMBT3904(NXP)
OPT
IR_OUT
R1024
10K
Q1003
IR_OUT
+3.3V_ST
R1025
10K
IR_OUT
C
E
R1026
47K
B
IR_OUT
IR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
12.01.02
100ohm Add
(IR Port protection against ESD)
R1034
50V
C1009
0.1uF
100
20V
VA1004
50V
C1013
1000pF
JP1003
JP1005
20V
VA1005
IR
+3.3V_ST
EAX64559004
DMxx52/Mxx522012.03.08
LVDS/CON/IR
8 11
WLED_DIM_ADJ
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LED Driver
12507WR-06L
P1101
Harness Wafer(L)
12507WR-06L
P1103
Harness Wafer(TOP)
21.5" LGD AH-IPS LM215WF3-SLE1
27" LGD 3D IPS LM270WF6-SLZ1
EAX64559004
DMxx52/Mxx522012.03.08
9 11LED DRIVER
AVDD_DDR0
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64559004
DMxx52/Mxx522012.03.08
10 11DDR MEMORY
GP4R_GLOBAL_TUNER_BLOCK
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
This was being applied to the only china demod,
so this has to be deleted in both main and ISDB sheet.
IF_AGC_SEL
C2611
22uF
10V
C2615
0.1uF
16V
FE_TS_VAL_ERR
C2619
0.1uF
16V
DTMB/PAL(Hongkong/China)
NTSC/ATSC(USA KOREA)
TU2602-*1
TDSS-H101F
NC
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
SIF
6
+B2[1.8V]
7
CVBS
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
12
SHIELD
Europe(NON_A_DEMODE)
NON_A_DEMODE(DVB-T/C)
TU2602-*2
TDSS-G201D
NC_1
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
NC_2
6
+B2[1.8V]
7
NC_3
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
12
SHIELD
USA/KR (NON_A_DEMODE)
NON_A_DEMODE(ATSC)
TU2602-*3
TDSS-H201F
NC_1
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
NC_2
6
+B2[1.8V]
7
NC_3
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
12
SHIELD
28
SHIELD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TU2601-*1
TDSN-C201D
RF_S/W_CTL
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
SIF
6
+B2[1.8V]
7
CVBS
8
NC_1
9
NC_2
10
NC_3
11
+B3[3.3V]
12
+B4[1.23V]
13
NC_4
14
GND
15
ERROR
16
SYNC
17
VALID
18
MCLK
19
D0
20
D1
21
D2
22
D3
23
D4
24
D5
25
D7
26
D8
27
DVB-T2(Europe)
TU2601-*2
TDSN-G301D
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
SHIELD
NC_1
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
NC_2
NC_3
NC_4
+B3[3.3V]
+B4[1.23V]
NC_5
GND
ERROR
SYNC
VALID
MCLK
D0
D1
D2
D3
D4
D5
D6
D7
EAX64559004
DMxx52/Mxx522012.03.08
TUNER
11 11
Copyright ⓒ 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.