LG M2252D Schematic

Internal Use Only
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LED LCD TV
SERVICE MANUAL
CHASSIS :
MODEL :
LD02M
M2252D M2252D-PSN
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
MFL63642179 (1205-REV00)
Printed in KoreaP/NO :
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ......................................................................... 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION .............................................................. 10
TROUBLE SHOOTING ........................................................................... 14
BLOCK DIAGRAM .................................................................................. 22
EXPLODED VIEW .................................................................................. 23
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 2 -
LGE Internal Use Only
AC Volt-meter
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transfo rmer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of th e circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1M and 5.2M. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Good Earth Ground such as WATER PIPE,
To Instrument's exposed METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
0.15µF
1.5 Kohm/10W
CONDUIT etc.
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 3 -
LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unl ess sp ecified othe rwise in this service manua l, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components com monly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" compon ents. The following techniques should be used to help reduce the incide nce of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter natively, obtain and wear a comme rcially availab le discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most re pla cem ent ES dev ice s are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motions w hen h an dl ing u np ac kaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carp eted floor can ge ner ate st atic electricit y sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 ˚F to 600 ˚F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only un til the solder fl ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 4 -
LGE Internal Use Only
IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern si de of the circuit board. (Use this techniq ue onl y on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break an d loc ate the nearest component that is dir ect ly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.
Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 5 -
LGE Internal Use Only
SPECIFICATION
1. Application Range
This spec sheet is applied all of the TV used LD02M chassis.
2. Specification
Each part is tested as below without special appointment
1) Temperature : 25 ˚C ± 5 ˚C (77 ˚F ± 9 ˚F), CST : 40 ˚C ± 5 ˚C
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage : Standard input voltage (100 V - 240 V ~, 50 / 60 Hz)
· Standard Voltage of each products is marked by models
4) Specification and performance of each parts are followed ea ch dra wing and spe cificat ion by part number in accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to the adjustment.
3.Test method
1) Performance : LGE TV test method followed
2) Demanded other specification
- Safety : CE,IEC specification
- EMC : CE,IEC specification
4. Module Specification
4.1. General Features
LGD/ LM215WF3-SLE1
No Item Specification Unit Remark
1 Panel Size 546.1mm(21.53 inches)
2 Panel Type AH-IPS
3 Operating Mode Normally White
4 Backlight Unit White LED
5 Max Resolution 1920 x 1080
6 Pixel Pitch 0.248(H)*0.248(V)
7 Interface LVDS 2Port Forward type
8 Color depth 16.7M (6bit+A FRC)
4.2. Optical Spec.
No. Item Specification Min. Typ. Max. Remark
1 Viewing Angle[CR>10] Right/Left
Up/Down
2 Luminance Luminance (cd/m2) 200 250 -
Variation(%) - - -
3 Contrst Ratio CR 600 1000
4 Color Coordinates RED R
Green
Blue
White
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
x
R
y
G
x
G
y
B
x
B
y
W
x
W
y
- 6 -
85/85
85/85
89/89
89/89
0.641
0.337
0.312
0.623
0.150
0.072
0.313
0.329
-
-
LGE Internal Use Only
5. General specification
5.1. TV
No Item Specification Remarks
1 Market Brazil
2 Broadcasting system ISDB-T/PAL-M/PAL-N
3 Component Input (1EA) Y/Cb/Cr , Y/Pb/Pr
4 RGB Input RGB-PC Analog (D-SUB 15Pin)
5 HDMI Input (2EA) HDMI1/2 Rear / HDMI version 1.4/ support PC
Support HDCP
6 Audio Input (2EA) RGB/DVI Audio
Component
7 Earphone out (1EA) Antenna, Component, HDMI1/2
8 USB (1EA) Picture, Music, Movie, SVC Software Update + Picture + Music + Move
L/R Input
9 Local Key (Touch)
5.2. RGB(PC)
No Item Specification Remarks
1 Supported Sync. Type Separate Sync., Digital
2 Operating Frequency Analog Horizontal 30 ~ 83kHz
Vertical 56 ~ 75 Hz
Digital Horizontal 30 ~ 83kHz
Vertical 56 ~ 75 Hz
3 Resolution Analog Max. 1920x1080 @ 60Hz
Recommend 1920x1080 @ 60Hz
Digital Max. 1920x1080 @ 60Hz
Recommend 1920x1080 @ 60Hz
4 Operating Environment Temp : 10 ˚C ~ 35 ˚C
Humidity : 20 % ~ 80 %
5 Storage Environment Temp : -10 ˚C ~ 60 ˚C non condensing
Humidity : 5 % ~ 90 % non condensing
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 7 -
LGE Internal Use Only
6. Timing
6.1. RGB/ HDMI (PC)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 720*400 31.468 70.080 28.321
2 640*480 31.469 59.940 25.175
3 640*480 37.500 75.000 31.500
4 800*600 37.879 60.317 40.000
5 800*600 46.875 75.000 49.500
6 1024*768 48.363 60.004 65.000
7 1024*768 60.023 75.029 78.750
8 1152*864 67.500 75.000 108.000
9 1280*720 45.000 60.000 74.250
10 1280*800 49.702 59.810 83.500
11 1280*1024 63.981 60.020 108.000
12 1280*1024 79.976 75.025 135.000
13 1400*1050 65.317 59.978 121.750
14 1440*900 55.935 59.887 106.500
15 1600*900 60.000 60.000 108.000
16 1680*1050 64.674 59.883 119.000
17 1680*1050 65.290 59.954 146.250
18 1920*1080 67.500 60.000 148.500
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 8 -
LGE Internal Use Only
6.2. HDMI (DTV)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 720* 480 31.469 / 31.5 59.94 / 60 27.00/ 27.03 SDTV 480P
2. 720*576 31.25 50.00 27.864 SDTV 576P
3. 1280*720 37.50 50.00 74.250 HDTV 720P
4 1280* 720 44.96 / 45 59.94 / 60 74.17/ 74.25 HDTV 720P
5 1920* 1080 33.72 / 33.75 59.94 / 60 74.17/ 74.25 HDTV 1080I
6 1920* 1080 28.125 50.00 74.25 HDTV 1080I
7 1920* 1080 27.00 24 74.25 HDTV 1080P
8 1920* 1080 33.75 30.00 74.25 HDTV 1080P
9 1920* 1080 56.250 50 148.5 HDTV 1080P
10 1920* 1080 67.43 / 67.5 59.94 / 60 148.35/ 148.50 HDTV 1080P
6.3. Component
No
1 720* 480 15.730 59.940 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.750 60.000 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.000 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.470 59.940 27.000 SDTV 480P
5 720* 480 31.500 60.000 27.027 SDTV 480P
6 720* 576 31.250 50.000 27.000 SDTV 576P 50Hz
7 1280* 720 44.960 59.940 74.176 HDTV 720P
8 1280* 720 45.000 60.000 74.250 HDTV 720P
9 1280* 720 37.500 50.000 74.250 HDTV 720P 50Hz
10 1920* 1080 33.720 59.940 74.176 HDTV 1080I
11 1920* 1080 33.750 60.000 74.250 HDTV 1080I
12 1920* 1080 28.125 50.000 74.250 HDTV 1080I 50Hz
13 1920* 1080 56.250 50 .000 148.500 HDTV 1080P
14. 1920* 1080 67.432 59.940 148.350 HDTV 1080P
15 1920* 1080 67.5 00 60.000 148.500 HDTV 1080P
Resolution H-freq(kHz) V-freq(Hz) Pixel clock( MHz)
Specification
Remark
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 9 -
LGE Internal Use Only
ADJUSTMENT INSTRUCTION
(2)
(6)
(5)
1. Application Range
This document is applied to LD02M chassis TV which is manufactured in TV (or Monitor) Factory or is produced on the basis of this data.
2. Designation
1) Th e adjust ment is a ccordin g to th e order w hich is
designated and which must be followed, according to the plan which can be changed only on agreeing.
2) Power adjustment : Free Voltage.
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard.
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C Relative humidity : 65 % ± 10 % Input voltage : 220V, 60Hz
6) Adjustm ent equipments : Color Analyzer (CA-2 10 or
CA-110), DDC Adjustment Jig equipment, SVC remote controller.
7) Push The "IN STOP KEY" – For memory initialization
Case1 : Software version up
1) After downloading S/W by USB , Multi-vision set will reboot automatically
2) Push "In-stop" key
3) Push "Power on" key
4) Function inspection
5) After function inspection, Push "In-stop" key.
Case2 : Function check at the assembly line
1) When TV set is entering on the assembly line, Push "In­stop" ke y at rst.
2) Push "Power on" key for turning it on.
→ If you push "Power on" key, TV set will recover channel
information by itself.
3) After function inspection, Push "In-stop" key.
4) Click “Read” tab, and then load download file(XXXX.bin) by clicking “Read”
(4)
filexxx.bin
5) Click “Auto” tab and set as below
6) Click “Run”.
7) After downloading, check “OK” message.
(5)
(7) ……….OK
* USB DOWNLOAD(*.epk file download)
1) Make New folder named “LG_DTV” and put ISP file(*.epk) in the folder.
2) Put the USB Stick to the USB socket.
3) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low, it didn’t work.
- Bu t your downloaded version is High, USB data is
automatically detecting
4) Show the message "Copying files from memory"
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot le Download
1) Execute ISP program “Mstar ISP Utility” and then click “Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK” message. If display “Error”, Check connect computer, jig, and set.
3) Click “Connect” tab. If display “Can’t ”, Check connect computer, jig, and set.
(1) (3)
Please Check the Speed :
Use the speed under
OK
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
200KHz.
- 10 -
5) Updating is staring.
6) Updating Completed, The TV will restart automatically.
7) If your TV is turned on, check your updated version and Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.
LGE Internal Use Only
3.1. ADC Process
3.1.1. ADC
1) Press the “ADJ” KEY on R/C and enter EZ ADJUST.
2) Enter ADC Calibration mode by pushing “►” key at “7. ADC Calibration”.
3) Push the “Start” button.
4) ADC Calibration is executed automatically.
5) Press “EXIT” key on R/C.
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NO Item CMD 1CMD 2Data 0
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3.2.2. RGB EDID Data
- M2252D(Product ID : 24747)
*(week), **(year), ***(Check sum) : Adjustable Data
3.2.3. HDMI EDID Data
- M2252D(Product ID : 24748)
Enter
Adjust MODE
ADC
adjust
Adjust
‘Mode In’
ADC
adjust
A A 0 0 When transfer the
A D 1 0 Automatically adjustment
‘Mode In’,
Carry the command.
(The use of a internal
pattern)
- Adjust Sequence
• aa 00 00 [Enter Adjust Mode]
• xb 00 40 [Component1 Input (480i)]
• ad 00 10 [Adjust 480i Comp1]
• xb 00 60 [RGB Input (1024*768)]
• ad 00 10 [Adjust 1024*768 RGB]
• aa 00 90 End Adjust mode
3.2. EDID Process
3.2.1. EDID download
1) Press "Power only" key of service remote control.
2) Press the ADJ KEY on R/C and enter EZ ADJUST
3) Enter EDID D/L mode by pushing "►" key at "EDID D/L".
4) EDID download is executed automatically.
5) Press EXIT key on R/C.
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XZUG{GzGzG
X[UGlUpGhG
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→ Caution: - Never connect HDMI & D-sub Cable when
- Download HDMI1, HDMI2 separately because
* Edid data and Model option download (RS232)
NO Item CMD 1CMD 2Data 0
lkpkGkVs G
oktpX
G vrG
oktpY G vrG
yni G vrG
G
G zG yG
G
download EDID.
HDMI1 is different from HDMI2.
*(week), **(year), ***(Check sum) : Adjustable Data **** (physical address) : (HDMI1 : 10, HDMI2 : 20), ****(Check sum) : (HDMI1 : CE, HDMI2 : BE)
3.3. Function Check
3.3.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
2) COMPONENT (480i)
3) RGB(PC : 1920 x 1080 @ 60Hz)
4) HDMI1/2
5) PC Audio In * Display and Sound check is executed by Remote controller.
→ Caution : Not to push the INSTOP KEY after completion if the
function inspection.
Enter
download
MODE
EDID data and
Model option
download
Download ‘Mode In’
Download A E 00 10 Automatically download
A A 0 0 When transfer the
‘Mode In’,
Carry the command.
(The use of a internal
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
Data)
- 11 -
LGE Internal Use Only
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