Page 1
Service Manual
Date: October, 2008 / Issue 1.0
Internal Use Only
Service Manual
KP500
Model : KP500
Page 2
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
* The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to
equipment design as advances in engineering and manufacturing methods warrant.
* This manual provides the information necessary to install, program, operate and maintain the KP500.
REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
S.J.CHOI 4/10 0.1
Page 3
- 4 -
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 4
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
1. INTRODUCTION .....................................7
1.1 Purpose .......................................................... 7
1.2 Regulatory Information.................................... 7
1.3 ABBREVIATION.............................................. 9
2. PERFORMANCE...................................11
2.1 H/W Features.................................................11
2.2 Technical specification...................................12
3. TECHNICAL BRIEF ..............................19
3.1 KP500 Functional Block diagram...................19
3.2 Baseband Processor (BBP) Introduction .......20
3.3 Power management IC ..................................32
3.4 Power ON/OFF ..............................................37
3.5 SIM & uSD interface.......................................39
3.6 Memory ..........................................................41
3.7 LCD Display ...................................................42
3.8 Keypad Switching & Scanning .......................43
3.9 Keypad back-light illumination........................44
3.10 LCD back-light illumination...........................45
3.11 JTAG & ETM interface connector ................47
3.12 Audio............................................................48
3.13 Charging circuit ............................................51
3.14 FM radio & BLUETOOTH.............................52
3.15 18pin Multi Media Interface connector .........55
3.16 Tri-axial, digital acceleration sensor..............57
3.17 General Description .....................................59
3.18 Receiver part................................................61
3.19 Transmitter part............................................62
3.20 RF synthesizer .............................................63
3.21 VCTCXO ......................................................63
3.22 Front End Module control.............................64
3.23 Power Amplifier Module ...............................65
3.24 PAM Schematic............................................66
4. PCB layout............................................67
4.1 Main PCB component placement...................67
5. Trouble shooting..................................69
5.1 Trouble shooting test setup............................69
5.2 Power on Trouble...........................................70
5.3 Charging trouble.............................................73
5.4 LCD display trouble........................................75
5.5 Camera Trouble .............................................77
5.6 Receiver & Speaker trouble ...........................79
5.7 Microphone trouble ........................................81
5.8 Vibrator trouble...............................................83
5.9 Keypad back light trouble...............................85
5.10 SIM & uSD trouble .......................................87
5.11 Touch pad trouble ........................................91
5.12 RTC trouble..................................................93
5.13 Tri-axial, digital acceleration sensor trouble.94
5.14 Trouble shooting of Receiver part................95
5.15 Trouble Shooting of Transmitter Part.........101
6. DOWNLOAD & S/W UPGRADE.............109
7. CIRCUIT DIAGRAM ............................121
8. BGM PIN MAP.....................................129
9. PCB LAYOUT......................................135
10. RF Calibration ..................................139
10.1 Test Equipment Setup................................139
10.2 Calibration Step..........................................139
11. Stand-alone Test ..............................144
11.1 Test Program Setting .................................144
11.2 Tx Test .......................................................146
11.3 Rx Test.......................................................147
12. EXPLODED VIEW & REPLACEMENT
PART LIST.........................................149
12.1 Exploded View ...........................................149
12.2 Replacement Parts.....................................151
12.3 Accessory.................................................. 169
Table Of Contents
Page 5
- 6 -
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 6
- 7 -
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KP500.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. LGE
does not warrant that this product is immune from the above case but will prevent unauthorized use of
common-carrier telecommunication service of facilities accessed through or connected to it. LGE will
not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure.
If these changes could reasonably be expected to affect the use of the KF600 or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the KP500 must be performed only at the LGE or its authorized agents.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 7
- 8 -
1. INTRODUCTION
E. Notice of Radiated Emissions
The KP500 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
An KP500 may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 8
- 9 -
1. INTRODUCTION
1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EGPRS Enhanced General Packet Radio Service
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
Page 9
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
- 10 -
LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
8PSK 8 Phase Shift Keying
Page 10
- 11 -
2. GENERAL PERFORMANCE
2.1 H/W Feature
2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Feature Comment
Standard Battery Li-ion, 900mAh
AVG TCVR Current 270mA typ @PL5
Standby Current 2.3 mA typ @PP9
Talk time 3 hours (GSM TX Level 7)
Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm)
Charging time Under 3 hours
RX Sensitivity EGSM/GSM850:-105dBm↓, DCS/PCS:-105dBm↓
TX output power EGSM/GSM850 : 33dBm (@PL 5)
DCS/PCS: 30dBm (@PL 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display Main 240 x 400 pixels, 3” WQVGA, 262K color
Status Indicator Send Key, Shortcut Key, Volume Up/Down Key,
PWR Key, Camera Key, Lock Key
ANT Built in antenna
EAR Phone Jack 18pin multi port Headset jack
PC Synchronization Yes
Speech coding HR/EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit
Page 11
- 12 -
2. GENERAL PERFORMANCE
2.2 Technical specification
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
TX: 890 + 0.2 x (n-1024) MHz
1Frequency Band
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
2 Phase Error
RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
12 19 dBm 3dB
4 Power Level DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
Page 12
- 13 -
2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
5
Output RF Spectrum 6,000 -71
(due to modulation) DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
GSM900/EGSM
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
Page 13
- 14 -
2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
DCS1800/PCS1900
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
EGSM
8 Bit Error Ratio
BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9 Rx Level Report accuracy
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500
*
-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*
Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
Page 14
- 15 -
2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
2.5ppm
(26 MHz) tolerance
19 32.768KHz tolerance 30ppm
Standby
20 Power consumption
- Normal 3 mA(@PP9)
21 Talk Time
EGSM/Lvl 7 (Battery Capacity 800mA):180 min
EGSM/Lvl12(Battery Capacity 800 mA):320min
Under conditions, at least 300 hours:
1. Brand new and full 800mAh battery
22 Standby Time
2. Full charge, no receive/send and keep GSM in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 65 dB under below conditions:
23 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Current
Fast Charge : < 400 mA
Slow Charge: < 120 mA
Antenna Bar Number Power
7 >-92 dBm ~
5 -97dBm ~ -93dBm
25 Antenna Display
4 -100dBm ~ -98dBm
2 -103dBm ~ -101dBm
1 -105dBm ~ -104dBm
0< -106 dBm
Off No Service
Page 15
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. GENERAL PERFORMANCE
- 16 -
Item Description Specification
Battery Bar Number Voltage( 0.05V)
3 3.69V ~ 4.2V
26 Battery Indicator 2 3.53V ~ 3.69V
1 3.43V ~ 3.53V
0 3.30V ~ 3.43V
27 Low Voltage Warning
3.53V↓ 0.05V (Call)
3.43V ↓ 0.05V (Standby)
28 Forced shut down Voltage 3.3 0.05 V
Li-ion Battery
29 Battery Type
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
30 Travel Charger Input: 150 ~ 240 V, 50/60Hz
Out put: 5.6, 0.4A
Page 16
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. GENERAL PERFORMANCE
- 17 -
* EDGE RF Specification (Option: is not serviced for “EDGE mode”)
Item Description Specification
1 RMS EVM 9%
2 Peak EVM 30%
395thPercentile EVM 15%
4Origin Offset Suppression ≥ 30dB
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 27dBm 3dB 13 17dBm 3dB
6 27dBm 3dB 14 15dBm 3dB
7 27dBm 3dB 15 13dBm 3dB
8 27dBm 3dB 16 11dBm 5dB
9 25dBm 3dB 17 9dBm 5dB
10 23dBm 3dB 18 7dBm 5dB
11 21dBm 3dB 19 5dBm 5dB
5 Power Level 12 19dBm 3dB
DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 26/25dBm 3dB 8 14 dBm 3dB
1 26/25dBm 3dB 9 12 dBm 4dB
2 26/25dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
6 Output RF Spectrum GSM900/EGSM
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
Page 17
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. GENERAL PERFORMANCE
- 18 -
Item Description Specification
6 Output RF Spectrum DCS1800/PCS1900
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
7 Output RF Spectrum GSM900/EGSM
(due to switching transient) Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 --30
DCS1800/PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30
Page 18
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
- 19 -
3.1 KP500 Functional Block diagram
The functional component arrangement is mentioned below diagram.
3. TECHNICAL BRIEF
Figure 1 KP500 Functional block diagram
PMB6821(PM IC)
BB IC(PMB8877)
(2G NAND +
1G DDR SDRAM)
Charging IC
-SD + SIM Socket
TRANSCEIVER
PMB6272
DGM1110M014
BT IC
BCM2048SB0
Vibrator
LCD, 3.0"
262K TFT WQVGA
KEY PAD
KEY Back Light
Charge Pump
(SC654ULTRT)
LED Matrix Module
SD1 (1.35V)
SD2(1.8V)
SD2(1.8V)
VAUX (2.9V)
VIO(2.62V)
VSIM(2.9V)
VMME (2.9V)
VUMTS(2.85V)
VUSB(3.1V) VLED (2.9V)
VAUDIOa(2.5V)
VAUDIOb(2.5V)
VRF1(2.85V)
VRF2(1.53V)
VRF3(2.70V)
VPLL(1.35V)
VRTC(2.0V)
VVIB(2.8V)
VBAT
DCS/PCS
GSM850/900
FEM PAM(SKY77340)
3M CAM
FE1 FE2
PA_MODE
PA_BAND
TXON_PA
PA_LEVEL
AFC
I/I_/Q/Q_
RF_EN
RF_CLK
RF_DA
26M_MCLK
26M_TCXO
ANT
BPF
BT ANT
FM ANT
UART
/
/
I2S
/
BT_CLK
ADD(0:29)
/
DATA(0:15)
/
32kHz
HEADSET MIC
HEADSET RECEIVER
MAIN MIC
FM
RADIO
FM
RADIO
AUIDO AMP(MAX9877)
EPN11
EPP11
EPPA11
EPPA21
RXINRXIN+
INA1
INA2
HPL
HPR
MAIN SPEAKER
OUT-
OUT+
MIC1(P/N)
MIC2(P/N)
VMICP/N
I2C
/
INB1/2
MIXER
BYPASS
PRE-AMP
Match
Match
Match
Match
Controller
Battery
CHG_EN
T_IN1
VCHG
VUSB_USB
I2C
/
(LED CTRL : 5 ea)
I2C
/
I2C
/
I2C
/
VBAT
END_KEY
COL
ROW
KEY_COL
KEY_ROW
2V11_RTC
2V11_RTC
B/UP BAT.
CAM_ I2C
/
I2C1
I2C1
I2C1
I2C1
CIF
MMC I/F
/
MMC I/F
VIB_EN
GPIO
PA_MODE
PA_BAND
TXON_PA
PA_LEVEL
UART
I2S
RF INTERFACE
Memory
Pin.01
FM_ANT
Pin.02
I/O CONNECTOR
Pin.03
Pin.04
Pin.05
Pin.06
Pin.07
Pin.08
Pin.11
Pin.12
Pin.13
Pin14
Pin.15
Pin.16
Pin.17
Pin.18
Pin.09
Pin.10
H/S MIC & HOOK_DET
H/S_LEFT
H/S_RIGHT
USB_M
USB_P
JACK_DETECT
VBAT
VBAT.
RPWRON
VCHG
DSR
VBUS_USB
UART_TX
UART_RX
DIF
/
DIF
Touch Window
3-Axis Accelerometer
CAM_I2C
CAM_I2C
I 2C
/
I 2C
KEY_EN
GPIO
KP500 Block Diagram
Page 19
- 20 -
3. TECHNICAL BRIEF
3.2 Baseband Processor (BBP) Introduction
3.2.1 General Description
S-GOLD3™ is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital
functionality of a cellular radio. Additionally S-GOLD3™ Provides multimedia extensions such as
camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and
mixed signal portions of the base band in 0.09um, 1.2V technology.
The chip will fully support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD3™ support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data
application (up to class 12) and EGPRS (up to class 12) without additional external hardware.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3 Top level block diagram of the S-GOLD3™ (PMB8877)
Page 20
- 21 -
3. TECHNICAL BRIEF
3.2.2 Block Description
• Processing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
• ARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
• DSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
• Shared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
• Controller Bus system
The processor cores and their peripherals are connected by powerful buses.
Multi-layer AHB for connecting the ARM and the other master capable building blocks with the
internal and external memories and with the peripheral buses.
• Clock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD3. Thus power consumption and performance can be optimized for each application.
• Functional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
- Advanced static and dynamic power management features including TDMA-Frame synchronous
low power mode and enhanced CPU modes(idle and sleep modes)
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 21
- 22 -
3. TECHNICAL BRIEF
- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
- Serial RF Control interface: support of direct conversion RF
- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial
data transmission
- 1 Serial Synchronous SPI compatible interfaces in the controller domain
- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain
- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller
supporting IrDA’s SIR standard (up to 115.2Kbps)
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD: SDIO capable)
3.2.3 External Devices connected to memory interface
Table 1. Memory interface
3.2.4 RF Interface (T_OUT)
S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF
ICs Periodically each TDMA frame.
Table 2. RF Interface Spec
.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Device Name Maker Remark
FLASH K5E1G12ACA-D075 Samsung Synchronous / A synchronous
DDR K5E1G12ACA-D075 Samsung Synchronous 133MHz
LCD IM200DST2A LGIT 8bit access 2 times transmission
Melody IC Not Used S/W Infineon Software CODEC
T_OUT
Resource Interconnection Description
T_OUT0 TXON_PA PAM Power on
T_OUT1 Other function -
T_OUT2 PA_BAND TX RF band select
T_OUT3 ANT_SW1 FEM control
T_OUT4 ANT_SW2 FEM control
T_OUT5 ANT_SW3 FEM control
T_OUT6 MODE PAM Mode select
Page 22
- 23 -
3. TECHNICAL BRIEF
3.2.5 USIF Interface
KF350 have three USIF Drivers as follow :
- USIF1 : Hardware Flow Control / SW upgrade / Calibration
- USIF2 : MON used Rx, Tx and CTS, RTS use BT Interface
- USIF3 : BT Interface
Table 3. USIF Interface Spec.
3.2.6 ADC channel
BBP ADC block is composed of 10 external ADC channel. This block operates charging process and
other related process by reading battery voltage and other analog values.
Table 4. S-Gold3 ADC channel usage
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Resource Name Remark
USIF1
USIF1_TXD UART_TX Transmit Data
USIF1_RXD UART_RX Receive Data
USIF1_CTS USB_DP
USIF1_RTS USB_DM
USIF2
USIF2_TXD NC NC
USIF2_RXD NC NC
USIF2_CTS BT_CTS
USIF2_RTS BT_RTS.
USIF3
USIF3_TXD BT_TX BT Transmit tx
USIF3_RXD BT_RX BT Receive rx
ADC channel
Resource Interconnection Description
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 N.C
M3 JACK_TYPE Accessory type detect
M4 N.C
M5 H/W VERSION S-Gold3 H/W version detect
M6 N.C
M7 ICLD
M8 VSUPPLY Battery supply voltage measure
M9 N.C
M10 N.C
Page 23
3.2.7 GPIO map
Over a hundred allowable resources, KF350 is using as follows except dedicated to SIM and Memory.
KF350 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,
is shown in below table
Table 5 S-Gold3 GPIO pin Map
- 24 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Port Function Net Name Description
KEY MATRIX
KP_IN0 N/A
KP_IN1 N/A
KP_IN2 N/A
KP_IN3 KP_IN3
KP_IN4 N/A
KP_IN5 KP_IN5
KP_OUT5 KP_IN6
KP_OUT0 KP_OUT0
KP_OUT1 LIN_INVERT
KP_OUT2 KP_OUT2
KP_OUT3 KP_OUT3
USIF1
USIF1_RXD UART_RX UART, RS232 Data
USIF1_TXD UART_TX UART, RS232 Data
USIF1_RTS_N USB_DAT_VP USB Data
USIF1_CTS_N USB_SE0_VM USB Data
USIF2
USIF2 _RXD ACCEL_INT
USIF2 _TXD N/A Not used
USIF2_RTS_N UART_BT_RTS Bluetooth RTS
USIF2_CTS_N UART_BT_CTS Bluetooth CTS
USIF3
USIF3 _RXD UART_BT_RX Bluetooth RX
USIF3 _TXD UART_BT_TX Bluetooth TX
GPIO_21 N/A
MMCI2
MMCI2_CMD PCB_VER1 PCB Version1
MMCI2_DAT[0] PCB_VER2 PCB Version2
MMCI2_CLK VIB_EN Vibrator LDO Enable
CAMERA I/F
CIF_D0 CIF_D(0) Camera DATA[0]
CIF_D1 CIF_D(1) Camera DATA[1]
Page 24
- 25 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
CIF_D2 CIF_DATA2 Camera DATA[2]
CIF_D3 CIF_DATA3 Camera DATA[3]
CIF_D4 CIF_DATA4 Camera DATA[4]
CIF_D5 CIF_DATA5 Camera DATA[5]
CIF_D6 CIF_DATA6 Camera DATA[6]
CIF_D7 CIF_DATA7 Camera DATA[7]
CIF_PCLK CIF_PCLK Camera pixel clock
CIF_HSYNC CIF_HSYNC Camera H sync
CIF_VSYNC CIF_VSYNC Camera V sync
CLKOUT CIF_MCLK Camera main clock
CIF_PD CIF_PD Camera power down(active high)
CIF_RESET CIF_RESET Camera reset
LCD I/F
DIF_D0 DIF_D0 LCD data[0]
DIF_D1 DIF_D1 LCD data[1]
DIF_D2 DIF_D2 LCD data[2]
DIF_D3 DIF_D3 LCD data[3]
DIF_D4 DIF_D4 LCD data[4]
DIF_D5 DIF_D5 LCD data[5]
DIF_D6 DIF_D6 LCD data[6]
DIF_D7 DIF_D7 LCD data[7]
DIF_D8 CAM_LDO_EN Camera LDO Enable
DIF_CS1 DIF_MAIN_CS MAIN LCD chip select
DIF_CS2 IF_MODE Interface mode
DIF_CD DIF_CD Command Data switch
DIF_WR DIF_WR LCD Write
DIF_RD DIF_RD LCD Read
EINT7 HOOK_DETECT Ear-Mic hook detection
GPIO_100 DIF_VSYNC LCD Sync
GPIO_27 _ DIF_RESET LCD Reset
EINT5 TOUCH_INT Touch Sensor INT
#I2C1
I2C_SCL I2C_SCL For Touch LDO/PMIC/Audio Amp
I2C_SDA I2C_SDA For Touch LDO/PMIC/Audio Amp
USIF2_RTS_N UART_BT_RTS Bluetooth RTS
USIF2_CTS_N UART_BT_CTS Bluetooth CTS
USIF3
USIF3 _RXD UART_BT_RX Bluetooth RX
USIF3 _TXD UART_BT_TX Bluetooth TX
GPIO_21 N/A
MMCI2
Page 25
- 26 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
MMCI2_CMD PCB_VER1 PCB Version1
MMCI2_DAT[0] PCB_VER2 PCB Version2
MMCI2_CLK VIB_EN Vibrator LDO Enable
CAMERA I/F
CIF_D0 CIF_DATA0 Camera DATA[0]
CIF_D1 CIF_DATA1 Camera DATA[1]
CIF_D2 CIF_DATA2 Camera DATA[2]
CIF_D3 CIF_DATA3 Camera DATA[3]
CIF_D4 CIF_DATA4 Camera DATA[4]
CIF_D5 CIF_DATA5 Camera DATA[5]
CIF_D6 CIF_DATA6 Camera DATA[6]
CIF_D7 CIF_DATA7 Camera DATA[7]
CIF_PCLK CIF_PCLK Camera pixel clock
CIF_HSYNC CIF_HSYNC Camera H sync
CIF_VSYNC CIF_VSYNC Camera V sync
CLKOUT CIF_MCLK Camera main clock
CIF_PD CIF_PD Camera power down(active high)
CIF_RESET CIF_RESET Camera reset
LCD I/F
DIF_D0 DIF_D0 LCD data[0]
DIF_D1 DIF_D1 LCD data[1]
DIF_D2 DIF_D2 LCD data[2]
DIF_D3 DIF_D3 LCD data[3]
DIF_D4 DIF_D4 LCD data[4]
DIF_D5 DIF_D5 LCD data[5]
DIF_D6 DIF_D6 LCD data[6]
DIF_D7 DIF_D7 LCD data[7]
DIF_D8 CAM_LDO_EN Camera LDO Enable
DIF_CS1 DIF_MAIN_CS MAIN LCD chip select
DIF_CS2 IF_MODE Interface mode
DIF_CD DIF_CD Command Data switch
DIF_WR DIF_WR LCD Write
DIF_RD DIF_RD LCD Read
EINT7 HOOK_DETECT Ear-Mic hook detection
GPIO_100 DIF_VSYNC LCD Sync
GPIO_27 _DIF_RESET LCD Reset
EINT5 TOUCH_INT Touch Sensor INT
#I2C1
I2C_SCL I2C_SCL For Touch LDO/PMIC/Audio Amp
I2C_SDA I2C_SDA For Touch LDO/PMIC/Audio Amp
PM_INT (EINT) PM_INT
Page 26
#I2C2
I2C2_SCL CIF_SCL For Camera
I2C2_SDA CIF_SDA For Camera
SIM I/F
CC_IO SIM_IO SIM CARD I/O
CC_CLK SIM_CLK SIM CARD CLOCK
CC_RST SIM_RST SIM CARD RESET
IrDA
USB_OEn USB_OEn
EINT3 N/A
External Memory
MMCI_CMD MMC_CMD T-flash
MMCI_DAT[0] MMC_D0 T-flash
MMCI_CLK MMC_CLK T-flash
MMCI1_DAT[1] MMC_D1 T-flash
MMCI1_DAT[2] MMC_D2 T-flash
MMCI1_DAT[3] MMC_D3 T-flash
I2S1
I2S2_CLK0 I2S1_CLK Bluetooth Clock
GPIO_102 MMC_DETECT T-flash Detect
I2S2_RX I2S1_RX Bluetooth PCM RX
I2S2_TX I2S1_TX Bluetooth PCM TX
I2S2_WA0 2S1_WA0 Bluetooth Clock
I2S2
EINT4 CHG_EOC Charger
GPIO_102 LCD_ID LCD ID
CC0CC1IO _PPR Charger
CC0CC7IO BT_INT Bluetooth INT
CC0CC3IO N/A
GPIO_103 KEY_EN
Audio I/F
EPN1 EAR_N For Receiver
EPP1 EAR_P For Receiver
EPPA1 BB_SND_L For Speaker
EPREF Reference
EPPA2 BB_SND_R For Speaker
MICN1 MAIN_MIC_N For Mic
MICP1 MAIN_MIC_P For Mic
MICN2 HS_MIC_N For Headset Mic
MICP2 HS_MIC_P For Headset Mic
VMICP VMIC_P Power for MIC
- 27 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 27
- 28 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
VMICN VMIC_N Power for MIC
#I/Q-Signale
PAOUT1 PA_LEVEL
BB_I I
BB_IX IX
BB_Q Q
BB_QX QX
ADC
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 PCB_VER
M3
M7
M8
M9 LOAD Current consumption measure
M10 N.C
Reference
VREFP VREFN
IREF
JTAG I/F
TDO TDO JTAG
TDI TDI JTAG
TMS TMS JTAG
TCK TCK JTAG
TRST_n TRSTn JTAG
RTCK RTCK JTAG
#Debug
TRIG_IN TRIG_IN ETM (Embedded Trace Macro Cell)
MON1 2V62_VIO ETM
MON2
TRACESYNC TRACESYNC ETM
TRACECLK TRACECLK ETM
PIPESTAT[2] PIPESTAT[2] ETM
PIPESTAT[1] PIPESTAT[1] ETM
PIPESTAT[0] PIPESTAT[0] ETM
TRACEPKT[0] TRACEPKT[0] ETM
TRACEPKT[1] TRACEPKT[1] ETM
TRACEPKT[2] TRACEPKT[2] ETM
TRACEPKT[3] TRACEPKT[3] ETM
TRACEPKT[4] TRACEPKT[4] ETM
TRACEPKT[5] TRACEPKT[5] ETM
Page 28
- 29 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
TRACEPKT[6] TRACEPKT[6] ETM
TRACEPKT[7] TRACEPKT[7] ETM
Memory
MEM_ADV_n BA1
MEM_RDN _RD Read
MEM_AD[0] DATA0
MEM _AD[1] DATA1
MEM _AD[2] DATA2
MEM _AD[3] DATA3
MEM _AD[4] DATA4
MEM _AD[5] DATA5
MEM _AD[6] DATA6
MEM _AD[7] DATA7
MEM _AD[8] DATA8
MEM _AD[9] DATA9
MEM _AD[10] DATA10
MEM _AD[11] DATA11
MEM _AD[12] DATA12
MEM _AD[13] DATA13
MEM _AD[14] DATA14
MEM _AD[15] DATA15
MEM_CS0_n _NAND_CS
MEM_CS1_n _RAM_CS
MEM_WRN _WR
MEM_A[16] ADD[16]
MEM_A[17] ADD[17]
MEM_A[18] ADD[18]
MEM_A[19] ADD[19]
MEM_A[20] ADD[20]
MEM_A[21] ADD[21]
MEM_A[22] ADD[22]
MEM_A[23] ADD[23]
MEM_A[24] ADD[24]
MEM_A[25] ADD[25]
MEM_A[26] ADD[26]
MEM_CSA0_n ADD[27]
MEM_CSA1_n ADD[28]
MEM_CSA2_n ADD[29]
MEM_CSA3_n BA0
MEM_BFCLKO1
MEM_BFCLKO2 SDCLKI
Page 29
- 30 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
MEM_SDCLKO SDCLKO
MEM_BC0_n _BC0
MEM_BC1_n _BC1
MEM_BC2_n LDQS
MEM_BC3_n UDQS
MEM _A[0] ADD[0]
MEM _A[1] ADD[1]
MEM _A[2] ADD[2]
MEM _A[3] ADD[3]
MEM _A[4] ADD[4]
MEM _A[5] ADD[5]
MEM _A[6] ADD[6]
MEM _A[7] ADD[7]
MEM _A[8] ADD[8]
MEM _A[9] ADD[9]
MEM _A[10] ADD[10]
MEM _A[11] ADD[11]
MEM _A[12] ADD[12]
MEM _A[13] ADD[13]
MEM _A[14] ADD[14]
MEM _A[15] ADD[15]
MEM_RAS_n _RAS
MEM_CAS_n _CAS
MEM_CKE CKE
FCDP_RBn FCDP
FWP _WP
T_OUT0 TXON_PA
T_OUT1 FE2
T_OUT2 PA_BAND
T_OUT3 FE1
GPIO_47 BT_WAKEUP Bluetooth wakeup
GPIO_48 VBUS_OVP
T_OUT6 PA_MODE
GPIO_50 For Vibrator
GPIO_51 DSR UART DSR
GPIO_52 LCD_BACKLIGHT_EN LCD Backlight Enable
CC1CC7IO JACK_DETECT Jack Detect
GPIO_54 BT_LDO_EN Bluetooth LDO Enable
#SPCU
SPCU_RQ_IN0
GPIO_118 BT_RESETn Bluetooth Reset
Page 30
- 31 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
SPCU_RC_OUT0 VCXO_EN VCXO Enable
SPCU_RQ_IN2 RESOURCE_CTRL
#RF Control Unit
RF_STR0 RF_EN
RF_STR1 LIN_PWM_MAG For Vibrator
RF_DATA RF_DA
RF_CLK RF_CLK
other
AFC
GPIO_58 RPWRON
F26M 26MHZ_MCLK 26MHz Clock
F32K F32K
OSC32K OSC32K
RESET_n _RESET
RTC_OUT RTC_OUT
#Extra I/Os
CLK32K CLK32K For FM Radio, BT CLK32K
DSPOUT1 WDOG
Page 31
- 32 -
3. TECHNICAL BRIEF
3.3 Power management IC
3.3.1 General Description
SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has
been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon S-
GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well.
It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the
Bluemoon Single, Infineon s single chip solution for Bluetooth. If used with S-GOLD3 it provides all
power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone
minimizing external device count.
Block Description
• Highly efficient step-down converter for main digital baseband supply including Core, DSP and
memory interface (External Bus Unit).
• Support of S-GOLD standby power-down concept
• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices
• Voltage independent switching of two SIM cards
• LDO regulators for baseband I/O supply
• LDO regulator for analog mixed-signal section of S-GOLD
• Low-noise LDO regulators for RF devices
• Supply for Bluemoon Single, Infineon s single chip solution for Bluetooth
• Audio amplifier 8 Ohms for handsfree operation and ringing
• Charge Control for charging Li-Ion/Polymer batteries under software control
• Pre-charge current generator with selectable current level
• RTC regulator with ultra-low quiescent current
• USB interface support for peripheral and mini-host mode
• Backlight LEDs driver with current selection and PWM dimming function
• Two single LED driver outputs for signaling
• Vibrator driver with adjustable voltage
• Fully controlable by software via I2C - Bus
• Temperature and battery voltage sensors
• Interrupt channels for peripherals
• System debug mode
• VQFN 48 package with heat sink and non-protruding leads
• Compatible with the Infineon E-GOLD+ V2 and V3
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 32
- 33 -
3. TECHNICAL BRIEF
SM-POWER is a further step on the successful E-Power product line with enhanced and optimized
functionality.
SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by two
linear regulators
- SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone
functions (e.g. organizer functions, games, MP3 decoding) possible.
- SDBB has high efficiency up to 95% and also a power save mode.
- Memory Interface is directly supported by the SDBB
- SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.
- For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.
SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the
linear regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase
the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up
withpower being supplied by the other linear regulator.
SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of
8 Ohm for usage in hands-free phones and for ringing
- 450 mW maximum output power
- adjustable gain
- mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries
- click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer
batteries
- Precharge current source with two current levels
- Constant current / constant voltage charging with 3 different termination voltages
- Programable charge current limitation for use with different batteries
- Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage
charging phase
- Top-off charge current sensing SM-POWER completes the USB interface of S-GOLD
- Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection
- Switch to supply USB pull-up resistor
- Mini-host pull down resistor functionality
- Charge pump with internal switching capacitor for USB host VBUS supply voltage SM-POWER fully
supports LED and Vibra Motor functionality
- no external components needed
- driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM
dimming
- two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour
- driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation SM-
POWER offers several control functions
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 33
- Power-on Reset Generator with logic state machine
- I2C bus interface
- I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN
(wake-up by Bluetooth) inputs
- Programable interrupt channels to handle peripherals like SIM, MMC and USB
- Monitoring of charging functions
- Undervoltage Shut-Down
- Errorflags (volatile or non-volatile) from many power-supply functions and thermal sensor in order to
debug system
- Overtemperature Shut-Down
- Overtemperature Warning
- Support of S-GOLD standby power-down concept
- Support of S-GOLD Power-Down Pad Tristate Function
Table 6. LDO Output Table of SM-Power
- 34 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LDO Net name Output Voltage Output Current Usage
SD1 1V35_Core 1.35V 600mA Core & for LDO
SD2 1V8_SD 1.8V 300mA Memory
VAUX 2V85_VAF 2.85V 100mA Cam Auto Focus
VIO 2V62_VIO 2.62V 100mA Peripherals
VSIM 2V9_SIM 2.9V 70mA SIM card
VMME 2V8_VMME 2.9V 150mA u-SD
VUMTS 2V85_AMP 2.85V 110mA Headset AMP
VUSB VUSB 3.1V 40mA Not used
VLED VLED 2.9V 10mA Not used
VAUDIOa 2V5_VAUDA 2.5V 200mA Stereo headset, Mono earpiece
VAUDIOb 2V5_VAUDB 2.5V 50mA Analog parts of S-Gold
VRF1 2V85_VRF 2.85V 150mA 2.85 V supply for SMARTi-PM RF transceiver
VRF2 1V5_VRF 1.53V 100mA 1.5 V supply for SMARTi-PM RF transceiver
VRF3 2V65_VBT 2.7V 150mA Bluetooth
VPLL 1V35_VPLL 1.35V 30mA S-GOLD3 PLL
VRTC 2V11_RTC 2.11V 4mA Real Time Clock
VAFC VAFC 2.65V 5mA Not used
VVIB 2V8_CAM_A 2.8V 140mA LCD
Page 34
- 35 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3. SM-Power Circuit Diagram of KP500
Figure 4 SM-Power Circuit Diagram with charging part
Am054 : mh
o K51 234R
OVP Charging IC
)%1(
K6.5
134R
)%1
(
10
USB_BYP
VDC
1
VDC_BYP
12
2
VUSB
4
_CHG
_EN
5
3
_PPR
EUS
Y03516 01
ISL9221
U401
11
BAT
8
GND
IMIN
6
IUSB
7
IVDC
9
13
PGND
K51
234R
V
IO_2V
62
Fu1.0
244C
K0
2
334R
144C
Fu
1.0
VBUS_OVP
K001
034R
624R
K001
u1
934C
Fu
1.0
044C
VBAT
I
ND
434R
TP401
VCHG_OVP
VCHG
VBUS_USB
K001
724R
TP4
00
RPP_
COE_GHC
NE_GHC
SD_1V8
VAUDA_2V
023C
u22
VAUDB_2V5
5
113C
u2.2
123C
u2.2
PMIC
VFM_2V9
213C
u2.2
713
C
u1.0
L
R
T
T
C
AG
N
VUSB VBAT
VBAT
103C
0
03C
u2.2
u1.0
503
C
323R
u2.2
u
K
1
nEO_BSU
U
PV_TAD_BS
MV_0ES_BSU
AP_NOXT
AT
0
0
3
B
F
313C
u1
813C
u01
4065000HCCE
U_PMIN
U_VMIN
VBAT
U_RCV
P
D_BSU
MD_BSU
PMRSTn
TSRMP
n
N
E_OXCV
NE_OXCV_TB
203D
DK
61S
E0
1B
2C
3D 11C
1C
2D
3E
1D
2E
1E
2F
1F
G
2
1G
2H
1H
1J
103L
2J
3H
Hu01
3J
1K
2L
223C
323C
423C
u2.2
u1.0
u2.2
K001
3
4
3
2
5
3
C
B
C
A
A2
A4
B
B
-
+
P
N
D
M
_
V
SB
SB
V
N
_
E
_
AC
AC
U
U
_
O
V
PE
AT
D
S
D
VCR
SE0
D
V
SU
NIPV
NIMV
+D
-D
N_TESER
N_2TESER
N_1PEELS
N_2PEELS
AOIDUAV
AOIDUADDV
DV
BOIDUAD
BOIDUAV
XUAV
XUADDV
TAG_1US
E
DNG_1US
BF_1US
ESNESI_1US
2DSDDV
BF_2DS
LBF_2DS
0
.
0
0
6
7
0
0
3
3
C
R
7
5
8
6
7
7
C
C
B
B
A
A5
A6
B
P
P
N
N
O
O
M
T
T
N
N
N
N
I
I
U
X_
U
_
_
O
O
E
O
O
O
O
M
M
_
_
_
N
N
EF
O
O
D
O
O
R
N
N
SS_
D
V
M
M
V
O
O
V
M
M
SS4
SS3
SS1
SS6
SS5
SS2
V
V
V
V
V
V
6
7
5
8
6
4
E4
D
D
D
D
C
D
VPLL_1V35
N
E
L
B
Y_
KEY_
KE
1
0
3
P
T
u
1
1
9
0
3
C
0
9
8
1
9
B
C
A
C
K
N
EF
EF
N
O
I
R
R
_
V
R
SH
_
ASH
L
F
ASH
L
F
2
1
0
SS1
SS9
SS1
SS8
SS7
SS1
V
V
V
V
V
V
7
E9
E6
E5
E8
E
IO_2V62
V
V
VBAT
BAT
u
u
K
K
2
2
u
7
7
.
.
.
.
1
2
2
4
4
4
3
2
0
0
0
3
3
3
C
2
3
C
C
0
0
3
3
R
R
1
0
1
4
1
9
1
B
B
B
A1
A1
L
L
2
O
O
I
I
S3
PA
L
V
PL
SD
N
M
V
V
PL
PU
XO
D
T
D
V
U300
PMB6821
EUSY0323901
8
7
6
5
4
3
1
0
9
SS1
SS1
SS1
SS1
SS1
SS1
SS2
SS2
SS1
V
V
V
V
V
V
V
V
V
7
6
5
4
3
5
4
3
9
8
F
F
F
F
F
F
F
G
G
G
I
M
E_
_
C
2
M
A
L
R
F
ER_
N
F
U
G
W
O
SC
SD
PW
O
O
_
_
R
D
W
PW
K
7
.
4
4
0
R3
T
P300
1
3
4
A
K3
J
K4
L
T
1
N
G
F
S1
S2
R
O
O
F
M
M
D
O
PO
_
W
T
ER_
PU
PU
N
U
W
O
O
PO
7
6
5
4
3
2
SS2
SS2
SS2
SS2
SS2
SS2
V
V
V
V
V
V
5
9
8
7
6
H
G
G
G
G
VIO_2V62
_
_
SO
C
C
N
N
E
I
SPO
2
2
I
R
I
L
O
5
4
5
J
L
L
L
T
2
T
F
U
F
R
O
C
O
_
_
F
E_
N
F
C
O
O
R
_
N
U
O
SO
E
R
9
8
0
SS2
SS2
SS3
V
V
V
6
6
7
J
H
H
VBAT
I
N
K
K
D
7
7
.
.
4
4
6
5
0
0
2
T
2
3
3
N
I
3
R
R
_
R
SP
6
7
8
7
L
J
K7
L
K8
J
K6
K5
L
T
K
M
M
M
L
R
AT
N
I
T
C
D
_
PW
PW
PW
_
_
N
C
_
_
_
C
C
C
2
2
1
3
I
2
_
2
L
L
L
I
I
H
B
B
B
C
1
2
SD
SD
VREF
SS_
SS_
SS_
V
V
V
9
4
8
D
H
H
CTR
VBAT
703C
u1
0
1
8
8
9
1
9
L
L
K1
K9
A
L
J
1
2
1
E
E
C
EF
N
N
ED
G
U
I
I
L
R
SD
RC
_
_
V
V
E_
AR
U
D
SE_
SE
G
H
D
N
SO
C
V
_
AR
_
SEN
SE
H
H
D
C
C
D
V
RV
RV
RV
UDDV
003R
TUO_
103R
IN
D
003L
Hu01
EMMV
01C
EMMDDV
01D
2FRDDV
11D
2FRV
01E
3F
11E
CFA_31FRDDV
01F
1F
11F
BIVV
11
G
BIVMISDDV
01G
M
ISV
11H
CFAV
01H
CT
9
H
STM
11J
STMUV
11K
1DSDDV
01
J
BF_1DS
01L2K
LBF_1DS
913C
u01
2FFO_NO
K72
003D
2
1
CAM_A_2V8
623C
u1
PVO_GHCV
PVO_SUBV
SIM_2V9
VBT_2V65
VRF_2V85
923C
u2.2
SD_1V8VB
MME_2V9
VRF_1V5
V
333C
033C
133C
233C
433C
u2.2
u2.2
u2.2
u2.2
u2.2
V
V11
RTC_2
723C
823C
u1
u1
3
C
803
V133RDK
u2.2
013C
0
u1.
CORE_1V35
103D
E061SDK
AM_2V85
VBAT
C
103BF
6
4
5
1
1
1
3
3
3
C
C
C
523C
u
u
u
0
0
0
1
1
1
u2.2
Battery Connector & Current Monitor
CN402
D1
1
2
3
D2
HSBC- 3P30- 18
ENZY0019401
VSUPPLY
14C
3
p001
414R
K1
514R
IND
VBAT
C
414
514C
u2.
2
p001
214R
U400
1
5
mhom74
B
DI_TA
914C
NC
LOAD
2
GND
4
3
VIN
IOUT
ZXCT1010 E5TA
EUSY0286901
714C
DAOL
614R
K2.2
u1
p001
Page 35
3.3.2 Charging
SM-POWER provides together with an external p-channel FET Siliconix Si3455 an external AC-
adapter a complete charge control function for charging of Li-Ion or Li-Ion-Polymer batteries. Either a
1-cell Li-Ion or Li-Ion-Polymer battery with 4.1, 4.2 or 4.4 Volts may be used.
1. Charging method : CC-CV
2. Charger detect voltage : 4.0 V
3. Charging time : 2h 40m
4. Charging current : 380 mA
5. CV voltage : 4.2 V
6. Cutoff current : 110 mA
7. Full charge indication current (icon stop current) : 110 mA
8. Recharge voltage : 4.16 V
9. Low battery alarm
a. Idle : 3.43 V ~ 3.3 V
b. Dedicated : 3.53 V ~ 3.3 V
10. Low battery alarm interval
a. Idle : 3 min
b. Dedicated : 1 min
11. Switch-off voltage : 3.3 V
12. Charging temperature adc range
a. ~ -5°C : low charging voltage operation (3.6 V ~ 3.9 V) .
b. -5°C ~ 50°C : standard charging (up to 4.2 V)
c. 50°C ~ : low charging voltage operation (3.6V ~ 3.9V)
- 36 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.69V~3.53V
3.53V~3.43V 3.43V~3.35V
Figure 5 Battery Block Indication
4.2V~3.69V
Page 36
- 37 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.4 Power ON/OFF
KP500 Power State : Defined 3cases as follow
] Power-ON : Power key detect (SM-Power’s ON port)
] Power-ON-charging : Charger detect.
Input ON is a power-on input for SM-POWER with 2 active high levels (see Figure 6). It might be
triggered by a push button or by the RTCOUT output of the S-GOLD device as well. To detect if the
push-button is pressed during system operation the logical level at pin ON or its change (if Bit 1 EION
in INTCTRL2 is asserted) is recorded in bit LON of the ISF register. If the high level of voltage at pin
ON does not reach VIHdet (Vbat-0.8 ~ Vbat-0.3) the above-mentioned bit won
t be set.
To support Remote power on function for factory mass production, applied an analog switch as
following figure. As monitoring the RPWRON and Key matrix KP_OUT(2) & KP_IN (0), KF350 system
recognize whether remote power on or End-key pushed
Figure 6 Power on application.
Page 37
- 38 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Power On
RTC_2V11
K2
512R
412R
K2
KTC4075E
Q200
3142
56
U203
EMX18
EQBN0013701
312R
K033
712R
M3.3
K001
022R
u01
132C
NE_NORWP
R
NORWPR
NORWP
N
I_YEK_DNE
Figure 7 Remote power on and End-key power on circuit
912R
K001
KTC4075E
Q200
812R
K01
NI_YEK_DNE
)6
(NI_PK
)2(TUO_PK
DNE
Page 38
- 39 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.5 SIM & uSD interface
KP500 supports 1.8V & 2.9V plug in SIM, SIM interface scheme is shown in (Figure 8).
SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-Gold3) and the SIM power
supply enabled by PMIC.
SIM Interface
SIM_CLK : SIM card reference clock
SIM_RST : SIM card Async /sync reset
SIM_IO : SIM card bidirectional reset
Figure 8 SIM & Micro SD Circuit
micro SD & SIM(Hybrid Socket)
VIO_2V62
702R
802R 622C
74
K001
MM
D_C
2
3D_CMM
M
DMC_CM
KLC_CMM
0D_CMM
1D_CMM
TCETED_CMM
K
902R
K74
K74
74212R
922C
VSIM_2V9
402R
K01
VMME_2V9
012R
112R602R
K74
K74
032C
u1
IND
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
BWS
01
AWS
3
5
2
6
7
C
C
C
C
C
3
5
2
7
6
C
C
C
C
C
U202
17
43733- 2
ENSY0017901
1
C
1
C
61
1DNG
51
2DNG
41
3DNG
31
4DNG
1
2
5DNG
11
6DNG
722C
p22
u1.0
OI_MIS
KLC_MIS
TSR_MIS
822C
p051
Page 39
- 40 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
The MicroSD Memory Module has eight exposed contacts on one side. The S-Gold3 is connected
to the module using a dedicated eight-pin connector
Table 7 Micro SD memory pad assign.
Micro SD Memory Card Detection Scheme
SD mode
Pin No. Name Type Description
1 DAT2 I/O Data bit [2]
2 CD/DAT3 I/O Data bit [3]
3 CMD I/O Command response
4 VDD Power Power supply
5 CLK I Clock
6 VSS Ground Power ground
7 DAT0 I/O Data bit [0]
8 DAT1 I/O Data bit [1]
Page 40
- 41 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.6 Memory
2Gbit NAND & 1Gbit DDRSDRAM employed on KF500 with 8 & 16 bit parallel data bus thru ADD(0) ~
ADD(29). The 1Gbit Nand Flash memory with DDRAM stacked device family offers multiple high-
performance solutions.
SD
_1V8
R2
0
2
0
.
1
u
SD_1V8
1
0
K
C
2
1
4
0
.
1
u
C
2
2
4
C
2
2
2
0
.
1
u
C
2
1
8
0
.
1
u
3
.
3
K
R
2
0
3
TP20
1
TP202
TP205
TP200
0
.
1
u
C
2
2
0
C
2
2
3
0
.
0
1
u
C
2
1
9
0
.
0
1
u
C
2
2
5
0
.
0
1
u
C
2
1
5
0
.
0
1
u
SD_1V8
TP204
N3
_WP
P
8
VDD
Q2
C5
VSS1
C9
VSS2
G2
VSS
3
H10
VSS4
P7
VSS5
VSS6
P9
P5
VSSQ
E
6
_CAS
G3
_CE
C6
_CLK
_CS
D
5
F6
_RAS
F3
_RE
D
6
_
WED
M3
_WEN
N
C
6
6
T
2
N
C
6
7
T
3
T
1
0
N
C
6
8
N
C
6
9
T
1
1
B
1
N
C
7
N
C
7
0
T
1
2
B
2
N
C
8
B
3
N
C
9
E
3
R__B
K
7
UDQM
L
7
UDQS
H2
VCCN1
C
4
VDD1
C8
VDD2
P6
VDD3
P4
VDDQ1
L
2
N
C
5
1
N
C
5
2
M
2
N
C
5
3
N
2
N
C
5
4
P1
P2
N
C
5
5
P3
N
C
5
6
N
C
5
7
P1
1
P1
2
N
C
5
8
Q
1
N
C
5
9
A
1
2
N
C
6
Q
2
N
C
6
0
N
C
6
1
Q
3
N
C
6
2
Q
1
0
N
C
6
3
Q
1
1
N
C
6
4
Q
1
2
N
C
6
5
T
1
N
C
3
7
J
4
J
5
N
C
3
8
N
C
3
9
J
6
N
C
4
A
1
0
N
C
4
0
J
7
N
C
4
1
J
8
J
9
N
C
4
2
J
1
0
N
C
4
3
J
1
1
N
C
4
4
K2
N
C
4
5
K4
N
C
4
6
K5
N
C
4
7
K8
N
C
4
8
N
C
4
9
K9
A
1
1
N
C
5
K1
0
N
C
5
0
N
C
2
2
H
1
1
F
2
N
C
2
3
N
C
2
4
F
9
N
C
2
5
G
6
N
C
2
6
G
9
N
C
2
7
G
1
0
N
C
2
8
H
3
N
C
2
9
H
4
A
3
N
C
3
N
C
3
0
H
5
H
6
N
C
3
1
H
7
N
C
3
2
H
8
N
C
3
3
N
C
3
4
H
9
J
2
N
C
3
5
N
C
3
6
J
3
K
6
LDQM
LDQS
L6
N
C
1
A
1
B
1
0
N
C
1
0
B
1
1
N
C
1
1
N
C
1
2
B
1
2
N
C
1
3
C
1
N
C
1
4
C
2
C
3
N
C
1
5
N
C
1
6
C
1
1
N
C
1
7
C
1
2
D
1
N
C
1
8
D
2
N
C
1
9
A
2
N
C
2
D
3
N
C
2
0
N
C
2
1
E2
P10
I_O0
N10
I_O1
L11
I_O10
I_
O11
K11
I
_O12
G11
I_O13
F11
E11
I_O14
D11
I_O15
M10
I_O2
L10
I_O3
F10
I_O4
E10
I_O5
D10
I_O6
I_
O7
C10
I
_O8
N11
I_O9
M11
DQ0
L4
DQ1
M4
DQ10
L8
M8
DQ11
N8
DQ12
L9
DQ13
M9
DQ14
N9
DQ
15
DQ2
N4
DQ3
L5
M5
DQ4
DQ5
N5
DQ6
M6
N6
DQ7
DQ8
M7
DQ9
N7
A12
E
7
A13
E9
A2
F4
A3
G4
A4
G8
A5
F8
A6
E8
D8
A7
A8
D9
A9
G7
L3
ALE
BA
0
E5
BA1
F
5
C
KE
D
7
K3
CLE
CL
K
C
7
U201
H8BCS0SI0MAP_56M
EUSY0347503
A0
D4
A1
E4
A10
G5
A11
F7
0
.
1
u
C
2
1
6
0
.
0
1
u
C
2
1
7
TP203
0
.
0
1
u
C
2
2
1
)71(DDA
1AB
)7(ATAD
)6(ATAD
)5(ATAD
)4(ATAD
)3(ATAD
)2(ATAD
)1(ATAD
)0(ATAD
)92:61(DDA
)51(ATAD
)41
(ATAD
)31(ATAD
)21
(ATAD
)11(ATAD
)01(ATA
D
)9(ATAD
)8
(ATAD
PDCF
1CB_
SQDU
SAC_
SC_DNAN_
I
KLCDS
SC_MAR_
SAR_
D
R_
RW_
RW_
PW_
)8(DDA
)
9(DDA
)01(DDA
)11(DDA
)21(DDA
)31(DDA
)41(DDA
)51(DDA
)51:0(ATAD
)61(DDA
0AB
EK
C
OKLC
DS
0CB_
SQDL
)62(D
DA
)72(DDA
)82(DDA
)9
2(DDA
)61(DDA
)71(DDA
)
51:0(DDA
)0(DDA
)1(DDA
)2(DDA
)3(DDA
)4(DDA
)5(DDA
)6(D
DA
)7(DDA
)81(DDA
)91(DDA
)02(DDA
)12(DDA
)22(DDA
)32(DDA
)42(DDA
)52(DDA
Figure 9 Flash memory & DDR RAM MCP circuit diagram
Page 41
- 42 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.7 LCD Display
LCD module include:
- Main LCD: 3.0” 240x400 WQVGA, 262K color TFT
- Backlight : 5 piece of white LED
LCD FPC Interface Spec:
Table 9 LCD FPC Interface Spec.
Page 42
- 43 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.8 Keypad Switching & Scanning
The keypad interface is a peripheral which can be used for scanning keypads up to 3 rows (outputs
from Port Control Logic) and 2columns (inputs to PCL). The number of rows and columns depend on
settings of the PCL.
Figure 10 Key pad part key matrix
DAP YEK
CAM
)0(TUO_PK
UP
)2(TUO_PK
)3(TUO_PK
VBAT
END
DNE
)3(NI_PK
)5(NI_PK
HOLD
CLR
SENDDN
Page 43
3.9 Keypad back-light illumination
There are 2 snow white color LEDs on Key FPCB for keypad illumination. Keypad Back-light is
controlled by SM-Power Flash LED port which has constant current control function. The whole
configuration of the SM-POWER Flash LED drivers is shown in below Figure11.
- 44 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 11 Keypad Back-light LEDs
Page 44
3.10 LCD back-light illumination
The SC654 is a high efficiency charge pump LED driver using Semtech s proprietary charge pump
technology. Performance is optimized for use in single-cell Li-ion battery applications.
- 45 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 12 LCD Back light unit and Flash LED charge pump IC
Figure 11 Keypad Back-light LEDs
KEY LED
VBAT
701R
601R
021
S
H
4
0
1
H
W
T
101DL
801R
021
021
S
S
H
H
-
4
4
0
0
1
1
H
H
W
W
T
T
201DL
301DL
R_DEL
501AV
00220M5LVE
LCD Backlight
VBAT
NE_THGILKCAB_DCL
005C
405R
u1
K001
305C
u1
U500
4
C
1+
5
C1-
OUTCP
9
IN
3
EN_SET
10
GND
15
PGND
AAT3169 IFO- T1
EUSY0336502
C2+
C2-
7
405C
u1
8
6
11
D1
12
2
D
13
D3
14
D4
1
5
D
2
D6
DELM
1DELM
2DELM
3DELM
4DELM
5DELM
205C
u
1
Page 45
The SC654 is a write-only single wire interface. It provides access to up to 32 registers that control
device functionality.In this system, two sets of pulse trains are transmitted via the SPIF pin. The first
pulse set is used to set the desired address. After the bus is held high for the address hold period, the
next pulse set is used to write the data value. After the data pulses are transmitted the bus is held high
again for the data hold period to signify the data write is complete. At this point the slave device
latches the data into the address that was selected by the first set of pulses. The protocol for using this
interface is described in the following subsection.
- 46 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 13 I2C Serial data port control method
Page 46
- 47 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.11 JTAG & ETM interface connector
In case of KP500 mass production, the JTAG & ETM interface connector will not be mount on board.
That is only for developing and software debugging purpose.( It will not be mounted on mass
production PCB)
Figure 15 JTAG & ETM(Embedded Trace Module) interface connector
SD_1V8
VIO_2V62
nTSRT
IDT
SMT
KCT
KCTR
ODT
nTSRTXE
NI_GIRT
CN100
G1 G2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
G3 G4
AXT430124
ENBY0029001
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
KLCECART
7TKPECART
6TKPECART
5TKPECART
T
4TKPECAR
3TKPECART
2TKPECART
1
T
TKPECAR
0
T
TKPECAR
TATSEPIP
2
TATSEPIP
1
0TATSEPIP
CNYSEC
ART
Page 47
- 48 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.12 Audio
KP500 Audio signal flow diagram as following diagram.
Figure 16 Audio signal flow diagram
MIC
BBP
PMB8877
BT+FM
SPK
RCV
MAX
9877
FM
OI /nip81
Page 48
- 49 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.12.1 Audio amplifier
Audio amplifier sub system IC is an audio power amplifier capable of delivering 1.2 W of continuous
average power into a mono 8Ω load, 50mW per channel of continuous average power into stereo 32Ω
single-ended (SE) loads. The MAX9877 features a 32-step digital volume control and ten distinct
output modes. The digital volume control, output modes (mono/SE/OCL) are programmed through a
two-wire I2C interface that allows flexibility in routing and mixing audio channels.
A
Figure 17 Audio amplifier PMIC
UDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR
VBAT
VBAT
102C
002C 202C
u1
u2.2
R_DNS_BB
L_DNS_BB
R_DNS_MF
L_DNS_MF
ADS_C2I
LCS_C2I
P_RAE
N_RAE
302C
A4
u1
u1602C
u1702C
u1802C
u1902C
2.8002R
2.8102R
C1N
A5
C1P
D1
U200
INA2
D2
MAX9877AEWP_TG45
INA1
EUSY0360201
C1
INB2
C
2
INB1
B2
BIAS
B
3
A
SD
C3
SCL
D4
RXIN+
B4
RXIN-
112C
u1
5
1
B
C
A3
D
D
SS
D
D
V
V
PV
D
D
N
N
G
PG
3
4
D
C
HPR
HPL
OUT+
OUT-
A1
A2
D5
B5
u2.2
R_OSH
L_OSH
012C
IND
212C
312C
p72
p72
P_VCR_KPS
N_VCR_KPS
Page 49
- 50 -
3. TECHNICAL BRIEF
3.12.2 Microphone circuit
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 18 Microphone circuit
20 Pin Connec tor
VBAT
DNE
R_DEL
)3(NI_PK
)5(NI_PK
CN101
1
3
4
5
6
7
8
9
10 11
AXK820145WG
ENBY0020101
Pin15 : MAIN_MIC_N
Pin14 : MAIN_MIC_P
Pin13 : VMIC_P
Pin12 : VMIC_N
20
192
18
17
16
15
14
12
p72
)0(TUO_PK
)2(TUO_PK
)3(TUO_PK
201C101C
p72
601C
u1
SEVY0003901
EVL5M02200
MIC101
1
2
3
413
201AV
101AV
SPM0204HE5- PB- 3
O
SUMY0010603
G1
G2
P
901R
IND
Page 50
- 51 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.13 Charging circuit
ISL9221 accepts two power inputs, normally one from a USB (Universal Serial Bus) port and the other
from a desktop cradle.
The ISL9221 features 28V and 7V maximum voltages for the cradle and the USB inputs respectively.
Due to the 28V rating for the cradle input, low-cost, large output tolerance adapters can be used
safely.
Figure 19 Charging circuit
Am054 : mh
o K51 234R
OVP Charging IC
)%1(
K6.5
134R
)%1
(
10
USB_BYP
VDC
1
VDC_BYP
12
2
VUSB
4
_CHG
_EN
5
3
_PPR
EUS
Y0351601
ISL9221
U401
11
BAT
8
GND
IMIN
6
IUSB
7
IVDC
9
13
PGND
K51
234R
V
IO_2V
62
Fu1.0
244C
K0
2
334R
144C
Fu
1.0
VBUS_OVP
K001
034R
624R
K001
u1
934C
Fu
1.0
044C
VBAT
I
ND
434R
TP401
VCHG_OVP
VCHG
VBUS_USB
K001
724R
TP4
00
RPP_
COE_GHC
NE_GHC
Page 51
3.14 FM radio & BLUETOOTH
FM radio
Simultaneous operation with Bluetooth
• Support of US/Europe (87.5 to 108 MHz) and Japanese (76 to 90 MHz) FM band
• Wide dynamic range AGC
• Soft mute and stereo blend
• Adjustment-free stereo decoder and AFC
• Autonomous search tuning function (up/down) with programmability (threshold setting)
• RDS demodulator
• Audio output available over Bluetooth audio interface or dedicated audio output
• Control of FM via Bluetooth HCI or I2C
• Adaptive filter to suppress narrow band interference in the FM channel
Bluetooth
General Features
• Small outline by LTCC substrate built-in RF function and Resin mold
• Integrated top BPF for Bluetooth and FM radio
• Integrated RDS/RBDS demodulator and decoder
• Bluetooth® 2.1+EDR conformity
• Secure Simple Pairing (SSP)
• Encryption Pause Resume (EPR)
• Enhance Inquiry Response (EIR)
• Link Supervision Time Out (LSTO)
• Sniff Sub Rating (SSR)
• Erroneous Data (ED)
• Packet Boundary Flag (PBF)
• WLAN coexistence including 802.15.2 three-wire coexistence support
• UART Interface
• PCM Interface
• I2S Interface
• I2C Interface
- 52 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 52
- 53 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Bluetooth Radio
• Common TX/RX teminal simplifies external matching, eliminates external antenna switch
• No external trimming is required In production
• Bluetooth v2.0 + EDR Specification compliant
Bluetooth Transmitter
• +6 dBm RF Transmit power with level control from on-chip 6-bit DAC over a dynamic range >
30dB
• Class 2 and Class 3 support without the need for an external power amplifier or TX/RX switch.
Bluetooth Receiver
• Integrated channel filters
• Digital demodulator for improved sensitivity and co-channel rejection
• Real time digitized RSSI available on HCI interface
• Fast AGC for enhanced dynamic range
• Channel classification for AFH
Figure 20. Bluetooth / FM Radio Circuit Diagram
NA_MF
T
p0001324C
424C
524C
IND
IN
D
FM Radio & Bluetooth
ANT400
GND1
GND2
AMAN802012 LG13
SNMF0036201
704L
Hn001
624C
p74
(1%)
FEED
724C
p74
814R
0
024R 124R
IND
R_DNS_MF
L_DNS_MF
NE_OXCV_TB
FL400
IN OUT
GND1GND2
LFB212G45 SG8A166
SFCY00009
IND
134C034C
INDIND
534C
IN
D
01
804L
TB_M62
K23KLC
TP402
B
I_T
TN
TP403
PUEKAW_T
B
TP404
XT_1S2I
TP405
XR_1S2I
TP406
0AW_1S2I
TP407
KLC_1S2I
nTESER_TB
714R
K051
H2
RES
F1
RFIOP
p01224C
G1
RFION
D4
NC
D1
INP
MRF_
F
C1
MRF_INN
F
Hn 6
5
3
A
FMVCO_LP
A2
FMVCO_LN
A1
u1.0824C
u1.0924C
u1.0434C
644C
IND
FM_CVAR
K6
AUDIOR
K5
AUDIOL
J5
AUDIOGND
p0001234C
K2
XTALP
K3
XTALN
B4
LPOIN
0
D1
GPIO7
B8
GPIO6
G6
U402
GPIO5
E6
GPIO4
BCM204 8SB0
G9
GPIO3
0
F1
EUSY036520 1
GPIO2
H9
GPIO1
H1
0
GPIO0
E7
A_GPIO7
B7
A_GPIO6
K9
A_GPIO5
E
9
A_GPIO4
A10
A_GPIO3
B10
A_GPIO2
C10
A_GPIO1
B9
A_GPIO0
D6
RST_N
1
2
S3
SS
SS
S
V
V
V
2
2
2
B
C
D
0
S1
S4
SS8
SS7
S
SS9
S
V
V
V
V
V
VSS6
VSS5
7
4
2
5
2
F
F
F
E5
E4
D
G
u1.0
744C
UART_CTS_N
UART_RTS_N
VREGFM_D
2
1
S1
S1
S
S
V
V
0
4
1
G
G
UART_RXD
UART_TXD
TM3
TM2
TM1
TM0
VREG_CTL
VREG_BT
VDD
VDDR3V
VDDO18_1
VDDO18_2
VDDO18_3
VDDC1
VDDC2
VDDC3
VDDC4
VDDC5
VDDTF
VDDRF
VDDPLL
VDDXO
VDDLO
VDDFM1
VDDFM2
VDDFM3
VDDFM4
VDDFM5
VDDO33_1
VDDO33_2
VDDO33_3
4
3
1
SS1
SS
V
V
2
1
J
H
844C
u1.0
VIO_2V62
TP408
F7
TP409
C9
TP410
J9
TP411
K10
J6
F6
J7
K7
TP412
D5
B5
A5
AC
6
A
R5V
VBT_2V65
B6
K8
A8
F9
G5
D9
G7
A7
J10
E1
E2
K1
J
3
J1
A4
B1
B3
J4
K4
A9
E10
J8
944C
u1
444C
344C
u1
u1
STR_TB_TRAU
STC_TB_TRAU
XT_TB_TRAU
XR_
TB_TRAU
VB
AT
V
IO_2V
NE_ODL_TB
604BF
IND924R
544C
p8.1
62
334C
504BF
u1
C
634
1
u
834C
734C
u1
u1.0
Page 53
- 54 -
3. TECHNICAL BRIEF
Synthesiser
• Fully integrated synthesizer requires no external VCO varactor diode, resonator or loop filter
• Compatible with crystals between 7.5 and 40MHz(in multiples of 250KHz) or an external clock
Audio
• Single-ended stereo analogue output
• 16-bit 48 kHz digital audio bit stream output
Baseband and Software
• Internal 48Kbyte RAM, allows full speed data transfer, mixed voice and data, and full piconet
operation, including all medium rate packet types
• Logic for forward error correction, header error control, access code correlation. CRC,
demodulation, encryption bit stream generation, whitening and transmit pulse shaping. Supports
all Bluetooth v 2.0 + EDR features incl. ESCO and AFH
• Transcoders for A-law, u-law and linear voice from host and A-law, u-law and CVSD voice over air
Physical Interfaces
• Synchronous serial interface up to 4Mbits/s for system debugging
• UART interface with programmable baud rate up to 4Mbits/s with an optional bypass mode
• USB v1.1 interface
• I2C slave for FM
• Two audio PCM interfaces (input and output)
• Analogue stereo (output only)
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 21. Bluetooth / FM Radio Block Diagram
Page 54
- 55 -
3. TECHNICAL BRIEF
3.15 18pin Multi Media Interface connector
Table 8. Multi media interface pin assign
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
KM380 series MMI
Pin Function Description
1 FM_ANT FM radio antenna / Audio ground
2 HS_MIC Headset microphone signal
3 JACK_TYPE Accessory type detect
4 HSO_L Headset left sound
5 HSO_R Headset Right sound
6 UART_TX/USB_DP/ UART / USB/ Remote control interrupt
REMOTE_INT
7 UART_RX/USB_DM/ UART / USB/ Remote control Key ADC
REMOTE_ADC
8 JACK_DETECT Headset detect (active low)
9 VSUPPLY Battery voltage
10 VSUPPLY Battery voltage
11 RPWRON Remote power on (active high. 2.8V)
12 VCHG Charger voltage
13 VCHG Charger voltage
14 DSR N.C.
15 VBUS_USB USB VBUS
16 TX UART TX data
17 RX UART RX data
18 GND Power GND
Page 55
- 56 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 22. MMI 18Pin Connector circuit
VIO_2V62
004R
U403
104R
TCETED_KOOH
204C
p021
1
74
NCS2200SQ2T2G
EUSY0250501
N_CIM_SH
P_CIM_SH
M1
-NIV
5
4
CCV
TUO
+NIV
DNG
3
2
014C
p72
VAUDA_2V5
304R
K022
K5.1
u1.0604C
u1.0804C
114C
p72 u01
204R
604R
904C
4C
214C
p001
L_OSH
C
024
R_OSH
Clos e to 18Pin Co nn.
p4270
1
404L
Hn00
PD_BSU
MD_BS
U
ED_KCAJ
TCET
NE_NORWPR
RSD
XT_TRAU
XR_TRAU
p42814C
Hn001504L
p42
Hn001604L
18Pin IO Co nnec tor
VBUS_USB
BSUV
704R
K7.4
74114R
74314R
204AV
C
124
904AV
014AV
u1
VSUPPLY
VCHG
VIO_2V6
2
404R
K01
304AV
404AV
504
RK2.2
634R
K001
IND
004BF
63804R
63904R
74014R
74534R
604AV
504AV
AV
FR
0
0
5
5
0
5
S0
V
C
I
104BF
204BF
304BF
404BF
04AV704
8
614C
u1
FR
0
0
5
5
0
5
S0
V
C
I
104L
Hn001
204L
Hn001
CN401
19
1
2
3
4
5
6
+BSU : 6
7
-BSU : 7
8
9
10
11
12
13
14
RSD : 41
15
16
17
18
20
HSEJ- 18S04 - 25PC
ENRY0006501
TNA_MF
004C
42
p
TNA oidaR MF : 1
CIM tesdaeH : 2
L_tesdaeH : 4
R_tesdaeH : 5
tceteD_KCAJ : 8
TTAB : 01,9
NO rewoP etomeR : 11
gnigrahC : 31,21
BSUV : 51
XT_TRAU : 61
XR_TRAU : 71
Page 56
- 57 -
3. TECHNICAL BRIEF
3.16 Tri-axial, digital acceleration sensor
General description
The BMA150 is a tri-axial, low-g acceleration sensor IC with digital output for consumer market
applications. It allows measurements of acceleration in perpendicular axes as well as absolute
temperature measurement.
An evaluation circuitry converts the output of a three-channel micromechanical acceleration sensing
structure that works according to the differential capacitance principle.
Package and interface have been defined to match a multitude of hardware requirements.
Since the sensor IC has small footprint and flat package it is attractive for mobile applications.
The sensor IC can be programmed to optimize functionality, performance and power consumption in
customer specific applications.
The BMA150 senses tilt, motion and shock vibration in cell phones, handhelds, computer peripherals,
man-machine interfaces, virtual reality features and game controllers.
The BMA150 is the LGA package version of the SMB380 triaxial acceleration sensor which is available
in a 3mm x 3mm x 0.9mm QFN package.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
A
A
Axes orientation of the BMA150
THREE- AXIS ACCELEROMETER
TNI_LECC
VIO_2V62
U302
1
CN
DDV
3
DNG
1
4
T
TNI
5
O
BSC
n
0
2
9
2
3
9
7
3
1
3
3
C
R
N
2
1
1
1
BMA150
EUSY0345201
01
CN1
2
92
OID
DV
8
IDS
2
7
T
ODS
6
O
KCS
N
043C
0
u1.
DS_FIC
LCS_FIC
Page 57
- 58 -
3. TECHNICAL BRIEF
RF Block Diagram
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 23 KF500 RF part Block Diagram
Mobile Switch
AN
T
M
FE
PAM(SKY77340)
Page 58
- 59 -
3. TECHNICAL BRIEF
3.17 General Description
The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for
GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications.
The transceiver provides an analog I/Q baseband interface and consists of a direct conversion
receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality.
Further on a completely integrated SD-synthesizer with HSCSD and GPRS/EDGE capability, a
digitally controlled reference oscillator with three outputs, a fully integrated quad-band RF oscillator
and a three wire bus interface with all necessary control circuits complete the transceiver.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 24 RF transceiver PMB6272 SMARTi-PM functional block diagram
Page 59
- 60 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
00
91SC
P009MSG058MSG
606R
0081SCD
2
GND1
GND2
4
1
HOT1
HOT2
3
01
2
6MHz
X60
0 T
SX- 3225
G
n022
146C
616C
p6
.5
216L
Hn1
.5
036C
n7.4
58V2_FRV
p0001836C
736C
u1.0u1.0
636C536C
V
RF_1V5
58V2_FRV
u1.0
926C
u1.0
346C
p9.3
p3.3
816C
Hn1.5
316L
546C
Hn81
p9.3
116L
046C
n74
246C
u1.0
VRF_2V85
VRF_1V5
01
806R
028
706R
VRF_2V85
VRF_2V85
016
L
Hn81
p9.3
646C
436C
u1.0
p3.3
446C
516C
p6.5
5V1_F
RV
n022
936C
p9.3
91
5V1XRDDV
02
8V2XRDDV5V1XTDDV
53
83
8V2XTDDV
71
8V2OCVDDV
8V2OXDDV
51
XO
1
1
1
2
XO
X
716
C
3
0
RX1
X
2
7
R
X
2
RX2
X
2
8
R
X3
2
4
2
5
RX3
X
R
X4
2
2
2
3
RX4
X
63
1XT
73
2XT
43
SAIBV
CR_OCV
81
3
1
V
D
D
B
I
AS2
V
8
8
V
D
D
D
I
G
1
V
5
V
D
D
D
I
G
2
V
8
5
2
1
V
D
D
L
N
A1
V
5
8V2XIMDDV
93
AX
2
B
3
4
B
X
C
L
K
7
6
D
A
61
NE
F
E
1
3
2
2EF
33
41
1
SYSF
1
0
F
SYS
2
F
SYS3
9
31
1DNG
G
N
D
2
2
6
04
3DNG
4DNG
14
2
9
R
X
1
PMB6272
U601
EUSY0274801
A
1
TB_M6
2
NE_FR
AD_FR
KLC_FR
XQ
Q
XI
I
LBAND_PAM_IN
HBAND_PAM_IN
KL
CM_ZHM62
Figure 25 RF transceiver PMB6272 SMARTi-PM schematic
Page 60
3.18 Receiver part
The constant gain direct conversion receiver contains all active circuits for a complete receiver chain
for GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced
inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated
by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
Down conversion to baseband domain is performed by low/high band quadrature direct down
conversion mixers. The baseband chain contains a LNB (low noise buffer), channel filter, output buffer
and DC-offset compensation. The 3rd order low pass filter is fully integrated and provides sufficient
suppression of blocking signals as well as adjacent channel interferers and avoids anti-aliasing
through the baseband ADC. The receive path is fully differential to suppress on-chip interferences.
Several gain steps are implemented to cope with the dynamic range of the input signals. Depending
on the baseband ADC dynamic range, single- or multiple gain step switching schemes are applicable.
Furthermore an automatic DC-offset compensation can be used (depending on the gain setting) to
reduce the DC-offset at baseband-output. A programmable gain correction can be applied to correct
for front end- and receiver gain tolerances.
- 61 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 26 Receiver part block diagram
Page 61
3.19 Transmitter part
The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for
DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N
Sigma-Delta synthesizer without any external components (see Figure39). The analog I/Q modulation
data from the baseband is converted to digital, filtered and transformed to polar coordinates. The
phase/frequency signal is further on processed by the Sigma-Delta modulation loop. The output of its
associated VCO is divided by four or two, respectively, and connected via an output buffer to the
appropriate single ended output pin. This configuration ensures minimum noise level. The 8PSK
transmitter supports power class E2 for GSM850 and GSM900 as well as for DCS1800 and PCS1900.
The digital transmitter architecture is based on a polar modulation architecture, where the analog
modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently
transformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitude
information is fed into a digital multiplier for power ramping and level control. The ready processed
amplitude signal is applied to a DAC followed by a low pass filter which reconstructs the analog
amplitude information.
The phase signal from the CORDIC is applied to the Sigma-Delta fractional-N modulation loop. The
divided output of its associated VCO is fed to a highly linear amplitude modulator, recombining
amplitude and phase information. The output of the amplitude modulator is connected to a single
ended output RF PGA for digitally setting the wanted transmit power. The PA interface of SMARTi-PM
supports direct control of standard dual mode power amplifiers (PA s) which usually have a power
control input VAPC and an optional bias control pin VBIAS for efficiency enhancement. In GMSK
mode, the PA is in saturated high efficiency
mode and is controlled via its VAPC pin directly by the baseband ramping DAC. In this way both up- /
down-ramping and output power level are set. In 8PSK mode, the ramping functionality is assured by
an on-chip ramping generator, whereas output power is controlled by the PGA s as described above.
- 62 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 27 Transmitter part block diagram
Page 62
3.20 RF synthesizer
The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX
operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as SigmaDelta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided
by the internal crystal oscillator. This frequency serves as comparison frequency of the phase detector
and as clock frequency for all digital circuitry.The divider in the feedback path of the synthesizer is
carried out as a multi-modulus divider (MMD). The loop filter is fully integrated and the loop bandwidth
is about 100 kHz to allow the transfer of the phase modulation. The loop bandwidth is automatically
adjusted prior to each slot (OLGA2). To overcome the statistical spread of the loop filter element values
an automatic loop filter adjustment (ALFA) is performed before each synthesizer startup. The fully
integrated quad-band VCO is designed for the four GSM bands (850, 900, 1800, 1900 MHz) and
operates at double or four times transmit or receive frequency. To cover the wide frequency range the
VCO is automatically aligned by a binary automatic band selection (BABS) before each synthesizer
startup.
3.21 VCTCXO
The SMARTiPM contains a fully integrated 26MHz digitally controlled crystal oscillator (DCXO) with
three outputs for the system clock, one output for the GSM baseband and two additional for other
subsystems (GPS, Bluetooth, etc.).The only external part of the oscillator is the crystal itself. The
frequency tuning is performed along the selected subrange by programming the frequency control
word (XO_TUNE) via the three wire bus (“3Wbus”)
- 63 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2
GND1
GND2
4
1
HOT1
HOT2
3
2
6MHz
X60
0 T
SX- 3225
246
u1
028
706R
8V2OXDDV
51
X
O
1
1
1
2
XO
X
8
V
D
D
D
I
G
1
V
5
V
D
D
D
I
G
2
V
8
5
93
AX
2
B
3
4
B
X
C
L
K
7
6
D
A
6
41
1SYSF
1
0
F
SYS2
F
SYS3
9
31
1DNG
04
3DNG
4DNG
14
PMB6272
U601
EUSY0274801
A
1
Figure 28 DCXO Schematic
Page 63
3.22 Front End Module control
Implemented in the S-Gold3 (FL600) are two outputs which are FE1, FE2 for direct control of front end
modules with two logic input pins to select RX and TX mode as well as low and high band operation.
FEM need 2V85_VRF supply.
Table 12 FEM Control Logic
- 64 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
MODE Tx 1GHz Tx 2GHz Rx 1GHz Rx 2GHz
VDD ON ON ON ON
VC1 OFF ON OFF ON
VC2 ON ON OFF OFF
Figure 29 FEM schematic
GND600
RF
006C
IND
016R
0
906R
GND601
0
106C
IND
SW600
116R
0
106L
H
n21
306L
2G
TNA
FR
1
Hn2.2
90
6C
IND
1G
0
0
0
3
0
6
3
0
0
E
0
Y
2
2
W
H
N
-
E
S
2
-
2
0
3
S
R
G
206C
u1
606C
p081
306C
p93
T
N
A
71
VRF_2V85
3
2
4
9
1
1
1
1
2
D
C
C
D
V
V
V
FL600
DGM1110 M014
SFAY00111 01
X1
X1
X2
X1
X2
R
_
R
R
R
R
_
_
_
0
_
0
0
0
0
0
5
5
0
8
0
8
8
9
1
9
SM
SM
SM
SM
SM
G
G
G
G
G
1
3
2
6
4
5
1EF
506C
6
8
1
9
0
1
1
1
1
2
2
3
1
4
6
5
D
D
D
D
D
D
N
N
N
N
N
N
G
G
G
G
G
G
X
T
_
X
0
T
_
0
X2
X1
X2
0
9
R
R
R
0
1
_
_
_
_
9
0
0
0
_
0
0
0
0
0
0
9
9
8
5
8
1
1
1
8
1
M
SM
SM
S
SM
SM
G
G
G
G
G
5
0
8
7
1
1
406C
p74
p74
2EF
L
1
116C
IND
16C
Page 64
3.23 Power Amplifier Module
The SKY77340 Power Amplifier Module(PAM) is designed in a compact from fact for quad-band
cellular handsets comprising GSM850/900,DCS1800,PCS1900,supporting GMSK and linear EDGE
modulation.
Class12 General Packet Radio Service(GPRS) multi-slot operation is also supported.
The module consists of a GSM850/900 PA block and a DCS1800/PCS1900 PA block,impedance
matching circuitry for 50ohm input and output impedances, and a Multi-function Power Amplifier
Control(MFC) block. A custom CMOS integrated circuit provides the internal MFC function and
interface circuitry.
Two separate Heterojunction Bipolar Transistor(HBT) PA blocks are fabricated onto InGaP die; one
supports the GSM850/900 bands, the other supports the DCS1800 and PCS1900 bands. Both PA
blocks share common power supply pins to distribute current. The InGaP die, the silicon die, nad the
passive components are mounted on a multi layer laminate substrate. The assembly is encapsulated
with plastic overmold.
RF input and output ports are internally matched to 50ohm to reduce the number of external
components Extremely low leakage current(2.5uA) maximizes handset standby time. Band select(BS)
circuitry select GSM transmit frequency band(logic0) and DCS/PCS transmit frequency(logic1). MODE
circuitry selects GMSK modulation (logic0) or EDGE modulation(logic1). VRAMP controls the output
power for GMSK modulation and provides bias optimization for EDGE modulation depending on the
state of MODE control.
The integrated multi-function(MFC) provides envelope amplitude control in GMSK mode, reducing
sensitivity to input drive, temp, power supply, and process variation. In EDGE mode, the MFC
configures the PA for fixed gain, and provides the ability to optimize the PA bias operation at different
power levels, This circuitry regulates PA bias conditions, reducing sensitivity to temp., power supply,
and process variation. The Enable input signal(pin8) provides a standby state to minimize battery
drain.
Table 13 PAM pin description
- 65 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Pin Mame Description
1 MODE GMSK/EDGE Power control mode. L=GMSK, H=EDGE
2 DCS/PCS_IN RF input(DCS/PCS) DC Blocked
3 BS Band Select
4 VBIAS Analog PA Bias Control(All Bands, EDGE Mode)
5 VBATT DC Supply
6 VRAMP Analog Output Power Control(All Bands, GMSK Mode)
7 GSM_IN RF input(CEL/EGSM) DC Blocked
8ENTransmit Enable/Disable. Low=Disable
9 GSM_OUT RF Output(CEL/EGSM) DC Blocked
*12 REVD2 Reserved
*10,11,13-15 GND Ground
*16 DCS/PCS_OUT RF Output(DCS/PCS) DC Blocked
Pad GND PAD GRID Ground pad grid is device underside.
Page 65
3.24 PAM Schematic
- 66 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 30 PAM schematic
U600
GND25
27
GND24
28
GND23
29
GND22
0
3
GND21
31
GND20
32
GND19
33
GND18
34
GN
D17
35
GND16
406L
Hn1
116C
216C
IND
IND
416C
p86
906L
726C
Hn22
IND
36
GSM_OUT
9
GND5
0
1
GND4
11
RSVD2
12
GND3
3
1
GND2
1
4
GND1
15
DCS
_PC
16
SKY77340
SMPY001230 1
S_OU
T
GND15
GND14
GND13
GND
GND11
GND10
GND9
GND8
GND7
GND6
GSM_IN
V
RAMP
VBATT
RSVD1
DCS_PCS_IN
MODE
136C
u1
VSUPPLY
26
25
2
4
12
23
22
2
1
20
19
18
17
EN
8
7
6
5
4
BS
3
2
1
16C
9
p93
826C
236C
336C
p93
p72
Fu 33
K22006R
106R K01
74206R
74306R
74406R
74506R
126C 526C
26C
0
p93
p93
C
p93
PMET_FR
p001016C
p001316C
326
426C226C
IND IND
IND
IND
AP_NOXT
NI_MAP_DNABL
LEVEL_AP
DNAB_AP
NI_MAP_DNABH
EDOM_AP
626C
Page 66
- 67 -
4. PCB layout
4.1 Main PCB component placement
4. PCB layout
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Main PCB Top placement
Page 67
- 68 -
4. PCB layout
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Main PCB bottom placement
Page 68
- 69 -
5. Trouble shooting
5.1 Trouble shooting test setup
Equipment setup
Power on all of test equipment
- Connect PIF-UNION JIG or dummy battery to the DUT for power up.
- Connect mobile switch cable between Communication test set and DUT when you need to make a
phone call.
- Follow trouble shooting procedure
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 69
- 70 -
5. Trouble shooting
5.2 Power on Trouble
Check Points
- Battery Voltage( Need to over 3.35V)
- Power-On Key detection (PWRON signal)
- Outputs of LDOs from PMIC
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
TP1
TP2
56
RTC_2V
RTC_2V11
412R
K2
NORWP
3142
11
Power On
R
NE_NORWP
312R
512R
K033
K2
NORWPR
022R
K001
712R
132C
M3.3
u01
U203
EMX18
I_YEK_DNE
N
EQBN0013701
VIO_2V62
612R
K001
External Reset
U204
7
nTSRTXE
TNI_REWOPS TNI_MP
1A
6
1B
5
2Y
4
DNG
NC7WZ08L8X
EUSY0102802
8
CCV
1
1Y
2
2B
3
2A
232C
u1.0
nTSRMPTESER_
Page 70
- 71 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LDO Net name Output Voltage Output Current Usage
SD1 CORE_1V35 1.35V 600mA Core & for LDO
SD2 SD_1V8 1.8V 300mA Memory
VAUX VFM_2V9 2.9V 100mA Touch, LCD
VIO VIO_2V62 2.62V 100mA Peripherals
VSIM VSIM_2V9 2.9V 70mA SIM card
VMME VMME_2V9 2.9V 150mA u-SD
VUMTS CAM_2V85 2.85V 110mA Camera
VUSB VUSB 3.1V 40mA USB
VLED VLED 2.9V 10mA Not used
VAUDIOa 2.5V 200mA Stereo headset, Mono earpiece
VAUDIOb VAUDB_2V5 2.5V 50mA Analog parts of S-Gold
VRF1 VRF_2V85 2.85V 150mA 2.85 V supply for SMARTi-PM
RF transceiver
VRF2 VRF_1V5 1,53V 1 00mA 1.5 V supply for SMARTi-PM
RF transceiver
VRF3 VBT_2V65 2.7V 150mA BT/FM Radio
VPLL VPLL_1V35 1.35V 30mA S-GOLD3 PLL
VRTC VRTC_2V11 2.11V 4mA Real Time Clock
VAFC VAFC 2.65V 5mA Not used
VVIB CAM_A_2V8 2.8V 140mA Camera
SD_1V8
VAUDA_2V
023C
u22
VAUDB_2V5
5
113C
u2.2
123C
u2.2
PMIC
C
VFM_2V9
213C
u2.2
713
u1.0
L
R
T
T
C
AG
N
VUSB VBAT
VBAT
103C
0
03C
u2.2
u1.0
503
C
323R
u2.2
u
K
1
nEO_BSU
U
PV_TAD_BS
MV_0ES_BSU
AP_NOXT
AT
0
0
3
B
F
313C
u1
813C
u01
4065000HCCE
U_PMIN
U_VMIN
VBAT
U_RCV
P
D_BSU
MD_BSU
PMRSTn
TSRMP
n
N
E_OXCV
NE_OXCV_TB
203D
DK
61S
E0
1B
2C
3D 11C
1C
2D
3E
1D
2E
1E
2F
1F
G
2
1G
2H
1H
1J
103L
2J
3H
Hu01
3J
1K
2L
223C
423C
323C
u2.2
u1.0
u2.2
K001
3
4
2
3
5
3
C
B
A
C
A4
A2
B
B
-
+
P
N
D
M
_
V
SB
SB
V
N
_
E
_
AC
AC
U
U
_
O
V
PE
AT
D
S
D
VCR
SE0
D
V
SU
NIPV
NIMV
+D
-D
N_TESER
N_2TESER
N_1PEELS
N_2PEELS
AOIDUAV
AOIDUADDV
DV
BOIDUAD
BOIDUAV
XUAV
XUADDV
TAG_1US
E
DNG_1US
BF_1US
ESNESI_1US
2DSDDV
BF_2DS
LBF_2DS
0
.
0
0
1
6
7
0
0
3
3
C
R
7
5
8
6
7
7
C
C
B
A5
B
A
A6
B
P
P
N
N
O
O
M
T
T
N
N
N
N
I
I
U
X_
U
_
_
O
O
E
O
O
O
O
M
M
_
_
_
N
N
EF
O
O
D
O
O
R
N
N
SS_
D
V
M
M
V
O
O
V
M
M
SS4
SS3
SS7
SS1
SS6
SS5
SS2
V
V
V
V
V
V
6
7
5
8
6
4
E4
D
D
D
D
C
D
VPLL_1V35
N
E
L
B
Y_
KEY_
KE
1
0
3
P
T
u
1
9
0
3
C
0
9
8
1
9
B
C
A
C
K
N
EF
EF
N
O
I
R
R
_
V
R
SH
_
ASH
L
F
ASH
L
F
2
1
0
SS1
SS9
SS1
SS8
SS1
V
V
V
V
V
V
7
E9
E6
E5
E8
E
IO_2V62
V
V
VBAT
BAT
u
u
K
K
2
2
u
7
7
.
.
.
.
1
2
2
4
4
4
3
2
0
0
0
3
3
3
C
2
3
C
C
0
0
3
3
R
R
1
0
1
4
1
9
1
B
B
B
A1
L
A1
L
2
O
O
I
I
S3
PA
L
V
PL
SD
N
M
V
V
PL
PU
XO
D
T
D
V
U300
PMB6821
EUSY0323901
8
7
6
5
4
3
1
0
9
SS1
SS1
SS1
SS1
SS1
SS1
SS2
SS2
SS1
V
V
V
V
V
V
V
V
V
7
6
5
4
3
5
4
3
9
8
F
F
F
F
F
F
F
G
G
G
I
M
E_
_
C
2
M
A
L
R
F
ER_
N
F
U
G
W
O
SC
SD
PW
O
O
_
_
R
D
W
PW
K
7
.
4
4
0
R3
T
P300
1
3
4
4
A
K4
K3
J
L
1
T
N
G
F
S1
S2
R
O
O
F
M
M
D
O
PO
_
W
T
ER_
PU
PU
N
U
W
O
O
PO
7
6
5
4
3
2
SS2
SS2
SS2
SS2
SS2
SS2
V
V
V
V
V
V
5
9
8
7
6
H
G
G
G
G
VIO_2V62
_
_
SO
C
C
N
N
E
I
SPO
2
2
I
R
I
L
O
5
5
J
L
L
L
T
2
T
F
U
F
R
O
C
O
_
_
F
E_
N
F
C
O
O
R
_
U
N
O
SO
E
R
9
8
0
SS2
SS2
SS3
V
V
V
6
6
7
J
H
H
VBAT
I
N
K
K
D
7
7
.
.
4
4
6
5
0
0
2
T
2
3
3
N
I
3
R
R
_
R
SP
6
7
7
8
L
J
J
K7
K6
L
K5
K8
L
T
K
M
M
M
L
R
AT
N
I
T
C
D
_
PW
PW
PW
_
_
N
C
_
_
_
C
C
C
2
2
1
3
I
2
_
2
I
L
L
L
I
H
B
B
B
C
1
2
SD
SD
VREF
SS_
SS_
SS_
V
V
V
9
4
8
D
H
H
CTR
VBAT
703C
u1
0
1
8
9
8
1
9
L
K1
K9
L
L
J
A
1
2
1
E
E
C
EF
N
N
ED
G
U
I
I
L
R
SD
RC
_
_
V
V
E_
AR
U
D
SE_
SE
G
H
D
N
SO
C
V
_
AR
_
SEN
SE
H
H
D
C
C
D
V
RV
RV
RV
UDDV
003R
TUO_
K72
103R
IN
D
0
003L
103D
Hu01
E061SDK
EMMV
01C
EMMDDV
01D
2FRDDV
11D
2FRV
01E
3F
11E
CFA_31FRDDV
01F
1F
11F
BIVV
11
G
BIVMISDDV
01G
M
ISV
11H
CFAV
01H
CT
9
H
STM
11J
STMUV
1DSDDV
BF_1DS
LBF_1DS
103BF
11K
01
J
01L2K
4
5
1
1
3
3
C
C
913C
u
u
0
0
1
1
u01
2FFO_NO
003D
2
1
CAM_A_2V8
623C
u1
PVO_GHCV
PVO_SUBV
SIM_2V9
VBT_2V65
VRF_2V85
923C
u2.2
SD_1V8VB
MME_2V9
VRF_1V5
V
333C
033C
133C
233C
433C
u2.2
u2.2
u2.2
u2.2
u2.2
V
V11
RTC_2
723C
823C
u1
u1
3
C
803
V133RDK
u2.2
013C
u1.
CORE_1V35
AM_2V85
VBAT
C
6
1
3
C
523C
u
0
1
u2.2
Page 71
- 72 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
START
Connect power
supply to the DUT
Vbat = over 3.35V
TP1
U203
Yes
ìPWRONî signal
Check 3 pin of U203
Low)
(High
Yes
ì_RESETî signal
Check 5 pin of U204
Yes
Check the all LDOís
output
Is it correct?
Yes
Is the 26MHz
clock From X600
signal correct?
Yes
No
No
No
No
Check the
RPWRON,
replace U203
Check solder
U204 or replace i
t
Check solder
U300 or replace i
t
Check solder X600
or replace it
Check 1 pin of X600
Or Check C638 of U601
U204
TP2
U300
Replace main PCB
U601
1 Pin X600
C638 of U601
Page 72
- 73 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.3 Charging trouble
Check Points
- Connection of TA (check TA voltage 5.1V)
- Charging Current Path component voltage drop
- Battery voltage
1 Charging method : CC-CV
2 Charger detect voltage : 4.0 V
3 Charging time : 2h 20m
4 Charging current : 550 mA
5 CV voltage : 4.2 V
6 Cutoff current : 110 mA
7 Full charge indication current (icon stop current) : 110 mA
8 Recharge voltage : 4.16 V
4.2V~3.71V 3.70V~3.55V
3.54V~3.46V 3.45V~3.31V
Am054 : mh
o K51 234R
OVP Charging IC
)%1(
K6.5
134R
)%1
(
10
USB_BYP
VDC
1
VDC_BYP
12
2
VUSB
4
_CHG
_EN
5
3
_PPR
EUS
Y0351601
ISL9221
U401
11
BAT
8
GND
IMIN
6
IUSB
7
IVDC
9
13
PGND
K51
234R
V
IO_2V
62
Fu1.0
244C
K0
2
334R
144C
Fu
1.0
VBUS_OVP
K001
034R
624R
K001
u1
934C
Fu
1.0
044C
VBAT
I
ND
434R
TP401
VCHG_OVP
VCHG
VBUS_USB
K001
724R
TP4
00
RPP_
COE_GHC
NE_GHC
TP1
TP2
Page 73
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 74 -
START
18pin IO(CN401)
Is soldered ?
Yes
Source pin
of U401 = 5.1V ?
Yes
Output pin
of U401 =4.2V?
Yes
Battery voltage
is over 3.4V?
Yes
Battery thermistor
value
is about 68K?
Yes
No
No
No
No
N
Change other TA
U401 or replace i
o
Resolder the
CN401
The TA can be
broken
then retes
t
Check solder
Waiting until
battery
Voltage goes up
to 3.4V
Change the
Battery
After check
thermistor
18pin IO
(CN401)
t
Charge is operating
U401
TP1: Source pin
U401
TP2: Output pin
Page 74
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 75 -
5.4 LCD display trouble
Check Points
- LCD assembly status ( LCD FPCB, Connector on FPCB)
- EMI filter soldering
- Connector combination
r
I_CNYSV_DCL : 2niP
DI_REKAM : 3niP
)1FI(EDOM_F
I : 11niP
)PTO(NEPO : 81niP
OM_F
)0FI(ED
9
VFM_2V
0
1
5
2
G1
G
INOUT_A4
INOUT_B4
4
1D_FID
2D_F
ID
3D_FID
4D_FID
D_FID
5
6D_FID
7D_FID
3
2
1
4
3
2
1
INOUT
INOUT_A2
INOUT_A1
INOUT_A4
INOUT_A3
INOUT_A2
INOUT_A1
F
05L
6
_A3
INOUT_B3
7
INOUT_B2
8
INOUT_B1
9
R00103
0Q30S41CRVE305LF
0
5
1
2
1
G
G
INOUT_B4
6
INOUT_B3
7
INOUT_B2
8
INOUT_B1
9
5
01030Q30S41CRVE
R0
TP501
TP50
TP503
TP50
TP505
TP50
TP507
TP509
2
4
6
81
5C
1
u
I : 91niP
CN502
1
40
2
39
3
38
4
37
5
36
6
35
7
34
8
33
9
32
1
31
0
30
11
29
12
13
28
14
27
15
26
16
25
17
24
18
23
19
22
2
0
21
GB042 - 40S- H10- E3000
ENBY00360 0
1
VFM_2V9
215R IND
D
TP508
AV
805
LCD Connector
DCL
DI_
DELM
1
2DELM
3DELM
4DELM
5DELM
TESER_FID_
CNYSV_FI
05020S41CLVE
9
VFM_2V
615R
K01
715R
IND
M_FIDELM0D_FID
EDO
DC_FID
SC_NIAM_FID
DR_F
ID
RW_FID_
6
7
8
9
405LF
INOUT_B4
INOUT_B3
INOUT_B2
INOUT_B1
E
rekaM
PRAHS
TIGL
0
1
G2
retnI DCL
5
1
G
INOUT_A4
INOUT_A3
INOUT_A2
INOUT_A1
1FI
H
L
815R
IND
4
3
2
1
R001030Q30S41CRV
edoM ecaf
DI rekaM
L
H
FL505
FL503
- Check the connection LCD FPCB
Connector(CN502)
- Check signal flow via EMI filte
(FL503, FL504, FL505)
FL504
FL504
Charge Pump(U500)
Page 75
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 76 -
Check LCD connector
combination then LCD test
with New LCD
START
Is LCD FPCB
normal?
Yes
Signal is normal on
DIF Signal
FL503, FL504, FL505
Yes
Assemble
No
No
Replace LCD FPCB
Check solder and
repair
Damaged filter
Page 76
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 77 -
5.5 Camera Trouble
Check Points
- Connectors combination
- FPCB status
CMA_A_2V8
(FB500)
4 Pin U501
3M F/F Camera Connect or
7D_FIC
6D_FI
C
5D_FIC
4D_FIC
I
3D_FIC
2D_FIC
1D_FIC
0D_FIC
EVCI
T
ESER_FIC
DP_FIC
005LF
1
INOUT_
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
1R070E48101EVC
RF10
F
1
INOUT_A
2
INOUT_A2
3
OUT_A3
IN
4
I
NOUT_A4
RF101R070E48101
005AV
9
IN
A1
OUT_B1
8
INOUT_B2
7
INOUT_B3
6
INOUT_B4
1
G
G2
0
5
1
205L
9
1
INOUT_B1
8
INOUT_B2
7
INOUT_B3
6
INOUT_B4
1
G
G2
0
5
1
505C
IND00120S5CLVE
CN500
1
2
3
4
5
6
7
8
9
10
11
12 13
ENBY00342 01
GB042 - 24S- H10 - E3000
VCAM_CORE_1V8
24
23
22
21
20
19
18
17
16
15
14
605C
5C
p65
70
u1.0
CAM_A_2V8
805C
CAM_2V85
0
0
5
B
F
905C
015C
u1.0
p65p65
LCS_FIC
ADS_FIC
105LF
1
INOUT_A1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
105C
IND
115C
u1.0
9
INOUT_B1
8
INOUT_B2
7
INOUT_B3
6
INOUT_B4
1
G2
G
0
5
1
0105R
0205R
RF
101R070E48101EVCI
1041100YEFS
NE_ODL_MAC
505R
K001
C
C
VBAT
u1
CNYSV_FI
CNYSH_FIC
KL
CM_FI
KLCP_FIC
U501
1
NC
STBY
2
BGND
GND
3
VIN4VOUT
BH18 LB1WHFV
EUSY022300 6
V
CORE_1V8
CAM_
5
6
315C215C
u1
CN500
4 Pin U501
- Check the connector combination(CN500)
CMA_A_2V8
(FB500)
Page 77
- 78 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
24pin main PCB connector
combination then Camera test
with equipped camera module
START
Check camera connector,
Yes
Replace New
Camera module
Working properly?
Yes
Replace Camera module
Yes
Assemble
No
Replace
Main
PCB
Page 78
5.6 Receiver & Speaker trouble
Check Points
- Speaker soldering status
- Audio amp & Analog switch soldering status
- 79 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
A
TP1
TP3
TP4
TP2
UDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR
VBAT
102C
002C 202C
u1
u2.2
R_DNS_BB
L_DNS_BB
R_DNS_MF
L_DNS_MF
ADS_C2I
LCS_C2I
P_RAE
N_RAE
302C
A4
u1
A5
u1602C
D1
u1702C
D2
u1802C
C1
u1902C
C
B2
B
C3
2.8002R
D4
2.8102R
B4
112C
u1
A3
C1N
C1P
U200
INA2
MAX9877AEWP_TG45
INA1
EUSY0360201
INB2
2
INB1
BIAS
3
A
SD
SCL
RXIN+
RXIN-
SS
V
3
D
VBAT
5
1
B
C
D
D
D
D
V
PV
HPR
HPL
OUT+
OUT-
D
D
N
N
G
PG
4
C
u2.2
A1
A2
R_OSH
L_OSH
D5
B5
012C
IND
P_VCR_KPS
N_VCR_KPS
212C
312C
p72
p72
Receiver & Speaker
N_VCR_KPS
P_VCR_KPS
104C
p93
404C
p22
004AV
504C
p22
004L
Hn001
304L
Hn001
104AV
CN400
2
1
24- 8 000- 002- 000- 829
ENEY0003801
TP1
TP
TP3
TP
2
4
U200
Page 79
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 80 -
AMP(
Speaker contact
L400
START
Check Speaker ís
Contacts are clear.
Yes
Input Signal is
High(TP1 C206,
TP2 C207) ?
es
Y
Output Signal is
High(TP3 C212,
No
N
L403
Resolder/Replace
o
Replace Main Board
o
N
Speaker
Replace Audio
U200).
Signal is
High(L400,
L40
3)?
Assemble
Yes
Yes
o
N
Replace L400, L403
Page 80
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 81 -
5.7 Microphone trouble
Check Points
- Microphone hole
- Mic. Bias & signal line
5
6
7
8
9
1
10 1 1
12
13
14
15
16
17
18
192
20
3
4
CN501
AXK720147G
ENBY0019501
I
CVL0
5051 01V
150FR
705AV
086805R
086605R
305AV405AV
105BF
VBAT
086705R
n22415C
n22515C
615C
005L
Hn001
u2.2
20 505AV
205BF
125C
u1
715C
p72
ICVL05051 01V150FR
605A
V
)3(TUO_PK
)0(TUO_PK
)2(TUO_
PK
P_CIMV
N_CIM_
NIAM
P_CIM_NIAM
N_CIMV
TP1
TP2
TP3
20 Pin Connector
VBAT
DNE
R_DEL
)3(NI_PK
)5(NI_PK
CN101
1
3
4
5
6
7
8
9
10 11
AXK820145WG
ENBY0020101
Pin15 : MAIN_MIC_N
Pin14 : MAIN_MIC_P
Pin13 : VMIC_P
20
192
18
17
16
15
14
12
Pin12 : VMIC_N
p72
)0(TUO_PK
)2(TUO_PK
)3(TUO_PK
601C
201C101C
p72
u1
SEVY00 03901
EVL5M02200
101AV
MIC101
1
SPM0204H E5 - PB- 3
O
2
SUMY00106 03
G1
3
G2
413
P
901R
201AV
IND
MIC101
Page 81
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 82 -
(
)
TP1 TP2
TP3
START
Check microphone sound
hole
Mic bias ON
(2.5V)when
TP3
call?
Yes
44pin connector
(CN501)is good?
CN101
N
No
o
CN501
Check mic. Bias
line
Repair the 44pin
conn. (CN501)
Yes
Check Signal
TP1, TP2 (2.5V)?
Y
es
Check All of
CN101 solder?
Assemble
Yes
No
No
Replace
microphone
(MIC101)
Replace KEY FPCB
Page 82
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 83 -
5.8 Vibrator trouble
Check Points
- Vibrator soldering
- IC is working correct
TP1
TP2
T
VBA
NE_BIV
803R
K00
1
TREVNI_NIL
NIL
QRF_MWP_
GAM_MWP_NIL
633C
u1
U301
4
VDD VOUT
D
N
CE_NC3GND
PG
U303
1
IN_B
2
I
N_A
3
GND
OUT_Y
TC7SZ86FU
EUSY0140901
U305
1
IN_B
2
IN_A
3
OUT_Y
GND
TC7SZ86FU
EUSY0140901
5
RP104K301D
EUSY0353901
VCC
VCC
5
4
5
4
1
2
3V0_VMOT
3V0_VMOT
533C
u1
IV
NE_B
023R
K021
Vibrator
K021613R
C
TPA6205A1ZQVR
C3
C2
143
EUSY0349001
u10.0
p0022733C
K001013R
U304
-
HUTDOWN
123R
V
VO+
V
K001
p0022243C
IN
IN+
_S
BYPASSC1GND
3V0_VMOT
833C
u1
SE
CLO
TO
C
A3
DD
B3
A1B1
O-
B2
ONNECTOR
203L
Hn001
303L
Hn001
CN300
1
2
24- 8000- 00 2- 000 - 829
ENEY0 003801
+-
U301
TP1
U304
TP2
Page 83
- 84 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Check Vibrator contacts are
START
clear
TP1(VIB_EN) is
high?
Yes
TP2 is 3.0V?
Yes
Replace Vibrator
Assemble
No
No
Replace U100
Replace U301
Page 84
- 85 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.9 Keypad back light trouble
Check Points
- Signal path is connected well
TP1
Main FPCB
KEY FPCB
KEY Backlight LED
R_DEL
NE_YEK
KEY LED
VBAT
601R
021
S
H
4
0
1
H
W
T
101DL
903R
IND
701R
021
S
H
4
0
1
H
W
T
201DL
313R
K001
D
2
01
523R
IN
3
Q300
KTC407
1
EQBN0007
213R
801R
021
S
H
4
0
1
H
W
T
301DL
423R
0
EK
5E
601
LB_Y
TP500
CN501
CN101
R_DEL
501AV
00220M5LVE
Page 85
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 86 -
Check All of LEDs solder
Check TP500 is
START
2.62V?
Yes
No
Check Q300 of main
board
20pin connector
(Main CN501, KEY
FPCBCN101) is
good
?
Y
es
Replace KEY FPCB
Assemble
No
Replace 20pin
conn.
(CN501, CN101)
TP1
Page 86
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 87 -
5.10 SIM & uSD trouble
SIM Check Points
- Power is working
- Socket soldering
- Proper SIM is used
Page 87
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 88 -
micro SD & SIM(Hybrid Socket)
VIO_2V62
702R
802R 622C
K74
902R
K74
74212R
START
74
K
K001
MM
D_C
2
3D_CMM
M
DMC_CM
KLC_CMM
0D_CMM
1D_CMM
TCETED_CMM
VSIM_2V9
402R
VMME_2V9
012R
112R602R
K74
K74
922C
IND
032C
u1
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
BWS
01
AWS
3
5
2
6
7
C
C
C
C
C
3
5
2
7
6
C
C
C
C
C
U202
17
43733- 2
ENSY0017901
1
C
1
C
61
1DNG
51
2DNG
41
3DNG
31
4DNG
1
2
5DNG
11
6DNG
K01
OI_MIS
KLC_MIS
TSR_MIS
722C
822C
p22
u1.0
p051
Check All of SIM card voltage
KP500 support
2.9V SIM only
6 pins are
soldered well?
Yes
Check Proper
SIM Card
Assemble
No
Yes
Resolder pin
Replace Main Board
Page 88
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 89 -
uSD Check Points
- Power is working
- Socket soldering
- Card detect is working
TP2
TP1
TP4
TP3
MMC-DETECT PIN
TP3
TP4
TP1
TP2
MMC_DETECT SIGNAL
Card insert Card Deject
micro SD & SIM(Hybrid Socket)
VIO_2V62
702R
802R 622C
K74
902R
K74
74212R
74
K
K001
MM
D_C
2
3D_CMM
M
DMC_CM
KLC_CMM
0D_CMM
1D_CMM
TCETED_CMM
VSIM_2V9
402R
VMME_2V9
012R
112R602R
K74
K74
922C
IND
032C
u1
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
BWS
01
AWS
3
5
2
6
7
C
C
C
C
C
3
5
2
7
6
C
C
C
C
C
U202
17
43733- 2
ENSY0017901
1
C
1
C
61
1DNG
51
2DNG
41
3DNG
31
4DNG
1
2
5DNG
11
6DNG
K01
OI_MIS
KLC_MIS
TSR_MIS
722C
822C
p22
u1.0
p051
Page 89
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 90 -
Check Micro SD card voltage
START
(VMME_2V9)
TF socket pins
are well soldered
Yes
Check proper
uSD?
Assemble
No
Yes
Resolder it
(check data line
TP 1~4 is 2.9V
Signal)
Replace Main Board
Page 90
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 91 -
5.11 Touch pad trouble
SIM Check Points
- Touch driver IC soldering`
- Touch FPCB Crack
A
CN503
G1 G2
G3 G4
1
0
9
8
7
X
+
+Y
1
Y
-
-X
2
3
4
5 6
AXK7L10227G
ENBY0018601
TOUCH SCREEN DRIVER IC
VFM_2V9
515R
25C
915C
u1
TN
T
I_HCUO
+X
+Y
-X
-Y
E
0
u1.0
IND
015AV
905AV
05020S41CLV
U502
A1
AUX
A2
VDD_R
A
3
X+
B1
PENIRQ- SCL
B2
A0
B3
Y+
E
05020S41CLVE
EF
1
15AV 215AV
05020S41CLV
TSC2007IYZGR
EUSY0337101
C1
SDA
C2
A1
C3
X-
D1
2
D
GND
D3
Y
-
05020S41CLVE
DS_C2I
LCS_C2I
Page 91
- 92 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
g
START
PinA2 of Touch driver
IC(U502) is high(2.9v)?
Yes
PinA3 of U502 is
high?
Yes
FPCB is Crack?
Yes
Replace Touch window with
Front Case
o
N
Check the PMIC
U300(PMB6821)
CN503 (touch connector)
No
No
Check the
U502(touch IC)
solderin
Check the Touch
window FPCB
connectio
n
U502 (touch driver IC)
Page 92
5.12 RTC trouble
- 93 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
START
Check TP1 is
high (1.0V)?
Check RTC_2V11
is high?(2.0v)
Assemble
Change BAT500
Change R500 or
Change U300,
Change Main PCB
Yes
No
No
Check All of BAT500 solder
Yes
BAT500
RTC_2V11
TP1
R500
RTC_2V11
TP1
BACKUP BATTERY
2V 0.5mAh
NB
L414R- F9J
BAT500
RTC
_2V11
j
9
f
_
r
4
1
4
bl
005R
n
_
t
t
K7.4
a
b
|
1
0
7
1
0
0
0
L
C
SB
Page 93
5.13 Tri-axial, digital acceleration sensor trouble
START
Check TP1 is
high (2.6V)?
Acceleration
sensor operated
Check TP2 is
high?(2.6v)
Change U300 or
Change Main PC
B
Change R500
Yes
No
No
Check All of U302 solder
Yes
Assemble
- 94 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
A
A
U302
TP1
TP2
TP1
TP2
THREE- AXIS ACCELEROMETER
VIO_2V62
U302
1
CN
DDV
3
DNG
1
TNI_LECC
n
0
2
9
2
3
9
7
3
1
3
3
C
R
4
5
BMA150
EUSY0345201
2
T
T
TNI
O
O
BSC
N
N
2
1
1
1
01
CN1
2
92
OID
DV
8
IDS
7
ODS
6
KCS
043C
0
u1.
DS_FIC
LCS_FIC
Page 94
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 95 -
5.14 Trouble shooting of Receiver part
g
Checking Flow
START
Setup Test Equipment
Cell Power : ñ74dBm
EGSM CH30
DCS CH699
Check point
DCXO
Checking Points
Figure 1. Main PCB
Check point
PLL Control
Check point
Mobile SW & FEM
Check point
RX I/Q Si
Re-Download S/W & CAL
nal
Page 95
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 96 -
5.14.1 Checking DCXO Circuit
TP1(C638) : 26MHz
X600
Replace X600
No
Yes
DCXO Circuit is OK.
See next page to check
PLL Circuit.
Is the waveform
of TP1(C638) similar to Fig.4?
TP1 (C638)
Figure 4. DCXO Waveform
Figure2. DCXO
2
GND1
GND2
4
1
HOT1
HOT2
3
2
6MHz
X60
0 T
SX- 3225
p0001836C
046C
n74
028
706R
71
8V2OCVDDV
8V2OXDDV
51
X
O
1
1
1
2
X
O
X
CR_OCV
81
8
V
D
D
D
I
G
1
V
5
C
L
K
7
6
D
A
61
NE
41
1SYSF
1
0
F
SYS2
F
SYS3
9
31
1DNG
NE_FR
KLCM_ZHM62
TP1
Figure 3. DCXO Cicuit
Waveform
DCXO Circuit Diagram
Checking Points Checking Flow
Page 96
5.14.2 Checking PLL Control signals
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 97 -
Figure 6. Transceiver Circuit Figure 7. PLL Control Waveform
Checking Points
Figure 5. Transceiver
RF Transceiver Circuit Diagram
Checking Flow
2
GND1
GND2
4
1
HOT1
HOT2
3
2
6MHz
X60
0 T
SX- 3225
p0001836C
736
C
u1.0u1.0
636C53
6C
u1
.0
046C
n74
246C
u1.0
028
706R
V
85
436C
u1.0
91
5V1XRDDV
02
8V2XRDDV5V1XTDDV
53
83
8V2XTDDV
71
8V2OCVDDV
8V2OXDDV
51
X
O
1
1
1
2
XO
X
3
0
R
X1
X
2
7
R
X
2
R
X
2
X
2
8
R
X3
2
4
2
5
R
X3
X
R
X4
2
2
2
3
R
X
4
X
63
1XT
73
2XT
43
SAIBV
CR_OCV
81
3
1
V
D
D
B
I
AS2
V
8
8
V
D
D
D
I
G
1
V
5
V
D
D
D
I
G
2
V
8
5
2
1
V
D
D
L
N
A1
V
5
8V2XIMDDV
93
AX
2
B
3
4
B
X
C
L
K
7
6
D
A
61
NE
F
E
1
3
2
2EF
33
41
1
SYSF
1
0
F
SYS2
F
SYS3
9
31
1DNG
G
N
D
2
2
6
04
3DNG
4DNG
14
2
9
R
X1
PMB6272
U601
EUSY027480 1
A
1
TB_M6
2
NE_FR
AD_FR
KLC_FR
XQ
Q
XI
I
KLCM_ZHM62
Waveform
?
?
RF_EN(TP1)
RF_CLK(TP2)
RF_DATA(TP3)
TP1 (RF_EN)TP3 (RF_CLK)
TP2 (RF_DATA)
U601
EN Signal(TP1) is OK ?
Yes
DA(Data,TP2) is Normal
Yes
CLK(Clock,TP3) is Normal
Yes
Control Signal is OK.
See next page to check
Mobile SW & FEM.
No
?
No
?
No
Check U601
Check U601
Check U601
Page 97
- 98 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.14.3 Checking Mobile SW & FEM
TP3_C604 (FE1)
FL600
TP2
TP4_C605 (FE2)
TP5 ~ 8
TP1
EGSM/GSM850 DCS/PCS
FE1 OFF ON
FE2 OFF OFF
Table 2. FEM RX Control Logic
Figure 8. Mobile SW & FEM Circuit
Figure 9. Mobile SW & FEM
Mobile SW & FEM Circuit Diagram
Checking Points
TP1
TP2
TP4
TP3
RF
GND600
006C
IND
016R
0
906R
GND601
0
106C
IND
116R
0
106L
H
n21
306L
Hn2.2
90
6C
IND
SW600
0
0
2G
TNA
FR
1
1G
0
3
0
6
3
0
0
E
0
Y
2
2
W
H
N
-
E
S
2
2
0
3
S
R
G
606C
p081
VRF_2V85
206C
306C
u1
p93
3
4
2
6
1
1
1
9
1
1
1
2
3
1
1
2
D
D
D
D
C
C
D
V
V
N
N
N
V
G
G
G
T
FL600
N
A
DGM1110 M014
71
SFAY001110 1
X2
X1
X2
X1
X1
X2
X1
X2
R
R
R
R
_
_
_
_
R
R
R
R
_
_
_
0
_
0
0
0
0
0
0
0
0
0
0
0
0
5
0
5
9
9
8
8
9
9
8
1
8
1
1
1
M
SM
SM
SM
SM
SM
SM
SM
S
G
G
G
G
G
G
G
G
4
1
8
3
2
6
7
5
1EF
506C
8
9
0
1
1
2
4
6
5
D
D
D
N
N
N
G
G
G
X
T
_
X
0
T
_
0
0
9
0
1
_
9
_
0
0
0
5
8
8
1
SM
SM
G
G
5
0
1
1
406C
p74
p74
2EF
406L
Hn1
116C
216C
IND
IND
16C
4
1CV2CV
41 NIP
31 NIP
T MSGE_058MSG
XT SCP_SCD
XR MSGE_058MSG
XR SCP_SCD
HX
L
H
H
L
L
H
L
U600
GND25
27
GND24
28
GND23
29
GND22
0
3
GN
D21
31
GND20
32
GND19
33
GND18
34
GND17
35
GND16
36
M_OUT
GS
9
GND5
0
1
GND4
11
VD2
RS
12
GND3
13
GND2
1
4
GND1
15
Page 98
- 99 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
(
)
)
Figure 30 Mobile SW
Checking Flow
Figure 31 FEM Control Signals
Check TP1 of SW600
with RF Cable and TP2 of C606
TP1 Signal same
as TP2?
Yes
o
N
Replace Mobil e SW
(SW6
00)
Check TP3, TP4 of FL600
Control Signal is
Mobil e SW & FEM is OK .
Check Ant enna.
Yes
O
K
Yes
TP5 Signal is
OK
?
Yes
o
N
o
N
Repl ace BB CHIP (U100)
Replace FEM (FL600)
EGSM TX
ANT SW2
TP2
TP1(ANT SW1
Page 99
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 100 -
5.14.4 Checking RX I/Q Signals
Check RX I/Q signals(TP1~TP4)
Signals are
Normal?
Replace
Transceiver
Yes
No
RX Part is OK.
Check Base Band Circuit
or
Re-Download S/W and Cal
I
I
Q
Q
RX
TP4
TP3
TP2
TP1
2
GND1
GND2
4
1
HOT1
HOT2
3
2
6MHz
X60
0 T
SX- 3225
46C
74
246C
u1.0
028
706R
85
436C
u1.0
91
5V1XRDDV
02
8V2XRDDV5V1XTDDV
53
83
8V2XTDDV
71
8V2OCVDDV
8V2OXDDV
51
X
O
1
1
1
2
XO
X
3
0
R
X1
X
2
7
R
X
2
R
X
2
X
2
8
R
X3
2
4
2
5
R
X3
X
R
X4
2
2
2
3
R
X
4
X
63
1XT
73
2XT
43
SAIBV
CR_OCV
81
3
1
V
D
D
B
I
AS2
V
8
8
V
D
D
D
I
G
1
V
5
V
D
D
D
I
G
2
V
8
5
2
1
V
D
D
L
N
A1
V
5
8V2XIMDDV
93
AX
2
B
3
4
B
X
C
L
K
7
6
D
A
61
NE
F
E
1
3
2
2EF
33
41
1
SYSF
1
0
F
SYS2FSYS3
9
31
1DNG
G
N
D
2
2
6
04
3DNG
4DNG
14
2
9
R
X1
PMB6272
U601
EUSY0274801
A
1
TB_M6
2
AD_FR
KLC_FR
XQ
Q
XI
I
Figure 12. RX I/Q Circuit
Figure 13. RX I/Q
Figure 14. RX I/Q Waveform
Checking Points
Checking Flow
TP1(I)
TP2(IX)
TP3(Q)
TP4(QX)
Page 100
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 101 -
5.15 Trouble Shooting of Transmitter Part
5.15.1. Checking VCTCXO Circuit
See RX Part “1. Checking DCXO Circuit”
5.15.2. Checking PLL Control Signal
See RX Part “2. Checking PLL Control Signal”
Checking Points
Checking Flow
Figure 15. Main PCBFigure 15. Main PCB
Figure 16. Main PCB
Loading...