LG KP500 Service Manual

Service Manual

Date: October, 2008 / Issue 1.0

Internal Use Only

Service Manual

KP500

Model : KP500

LGE Internal Use Only

- 3 -

* The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.

* This manual provides the information necessary to install, program, operate and maintain the KP500.

REVISED HISTORY

Editor Date Issue Contents of Changes S/W Version

S.J.CHOI 4/10 0.1

- 4 -

LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

- 5 -

1. INTRODUCTION .....................................7

1.1 Purpose .......................................................... 7

1.2 Regulatory Information.................................... 7

1.3 ABBREVIATION.............................................. 9

2. PERFORMANCE...................................11

2.1 H/W Features.................................................11

2.2 Technical specification...................................12

3. TECHNICAL BRIEF ..............................19

3.1 KP500 Functional Block diagram...................19

3.2 Baseband Processor (BBP) Introduction .......20

3.3 Power management IC ..................................32

3.4 Power ON/OFF ..............................................37

3.5 SIM & uSD interface.......................................39

3.6 Memory ..........................................................41

3.7 LCD Display ...................................................42

3.8 Keypad Switching & Scanning .......................43

3.9 Keypad back-light illumination........................44

3.10 LCD back-light illumination...........................45

3.11 JTAG & ETM interface connector ................47

3.12 Audio............................................................48

3.13 Charging circuit ............................................51

3.14 FM radio & BLUETOOTH.............................52

3.15 18pin Multi Media Interface connector .........55

3.16 Tri-axial, digital acceleration sensor..............57

3.17 General Description .....................................59

3.18 Receiver part................................................61

3.19 Transmitter part............................................62

3.20 RF synthesizer .............................................63

3.21 VCTCXO ......................................................63

3.22 Front End Module control.............................64

3.23 Power Amplifier Module ...............................65

3.24 PAM Schematic............................................66

4. PCB layout............................................67

4.1 Main PCB component placement...................67

5. Trouble shooting..................................69

5.1 Trouble shooting test setup............................69

5.2 Power on Trouble...........................................70

5.3 Charging trouble.............................................73

5.4 LCD display trouble........................................75

5.5 Camera Trouble .............................................77

5.6 Receiver & Speaker trouble ...........................79

5.7 Microphone trouble ........................................81

5.8 Vibrator trouble...............................................83

5.9 Keypad back light trouble...............................85

5.10 SIM & uSD trouble .......................................87

5.11 Touch pad trouble ........................................91

5.12 RTC trouble..................................................93

5.13 Tri-axial, digital acceleration sensor trouble.94

5.14 Trouble shooting of Receiver part................95

5.15 Trouble Shooting of Transmitter Part.........101

6. DOWNLOAD & S/W UPGRADE.............109

7. CIRCUIT DIAGRAM ............................121

8. BGM PIN MAP.....................................129

9. PCB LAYOUT......................................135

10. RF Calibration ..................................139

10.1 Test Equipment Setup................................139

10.2 Calibration Step..........................................139

11. Stand-alone Test ..............................144

11.1 Test Program Setting .................................144

11.2 Tx Test .......................................................146

11.3 Rx Test.......................................................147

12. EXPLODED VIEW & REPLACEMENT

PART LIST.........................................149

12.1 Exploded View ...........................................149

12.2 Replacement Parts.....................................151

12.3 Accessory.................................................. 169

Table Of Contents

- 6 -

LGE Internal Use Only

Only for training and service purposes

- 7 -

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the

features of the KP500.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges you’re your telecommunications

services. System users are responsible for the security of own system.

There are may be risks of toll fraud associated with your telecommunications system. System users

are responsible for programming and configuring the equipment to prevent unauthorized use. LGE

does not warrant that this product is immune from the above case but will prevent unauthorized use of

common-carrier telecommunication service of facilities accessed through or connected to it. LGE will

not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone

service until repair can be done. A telephone company may temporarily disconnect service as long as

repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure.

If these changes could reasonably be expected to affect the use of the KF600 or compatibility with the

network, the telephone company is required to give advanced written notice to the user, allowing the

user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the KP500 must be performed only at the LGE or its authorized agents.

The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system

and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

- 8 -

1. INTRODUCTION

E. Notice of Radiated Emissions

The KP500 complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information

such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly

different.

G. Interference and Attenuation

An KP500 may interfere with sensitive laboratory equipment, medical equipment, etc.

Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.

Following information is ESD handling: Service personnel should ground themselves by using a wrist

strap when exchange system boards.

When repairs are made to a system board, they should spread the floor with anti-static mat which is

also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective

packages until these are used. When returning system boards or parts such as EEPROM to the

factory, use the protective package as described.

LGE Internal Use Only

Only for training and service purposes

- 9 -

1. INTRODUCTION

1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:

LGE Internal Use Only

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EGPRS Enhanced General Packet Radio Service

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LGE Internal Use Only

Only for training and service purposes

1. INTRODUCTION

- 10 -

LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

8PSK 8 Phase Shift Keying

- 11 -

2. GENERAL PERFORMANCE

2.1 H/W Feature

2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Feature Comment

Standard Battery Li-ion, 900mAh

AVG TCVR Current 270mA typ @PL5

Standby Current 2.3 mA typ @PP9

Talk time 3 hours (GSM TX Level 7)

Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm)

Charging time Under 3 hours

RX Sensitivity EGSM/GSM850:-105dBm↓, DCS/PCS:-105dBm↓

TX output power EGSM/GSM850 : 33dBm (@PL 5)

DCS/PCS: 30dBm (@PL 0)

GPRS compatibility Class 10

SIM card type 3V Small

Display Main 240 x 400 pixels, 3” WQVGA, 262K color

Status Indicator Send Key, Shortcut Key, Volume Up/Down Key,

PWR Key, Camera Key, Lock Key

ANT Built in antenna

EAR Phone Jack 18pin multi port Headset jack

PC Synchronization Yes

Speech coding HR/EFR/FR/AMR

Data and Fax Yes

Vibrator Yes

Buzzer No

Voice Recoding Yes

C-Mic Yes

Receiver Yes

Travel Adapter Yes

Options Bluetooth hands-free kit, Data Kit

- 12 -

2. GENERAL PERFORMANCE

2.2 Technical specification

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

GSM900

TX: 890 + 0.2 x n MHz

RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )

EGSM

TX: 890 + 0.2 x (n-1024) MHz

1Frequency Band

RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )

DCS1800

TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)

RX: TX + 95 MHz

PCS1900

TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)

RX: TX + 80MHz

2 Phase Error

RMS < 5 degrees

Peak < 20 degrees

3 Frequency Error < 0.1ppm

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

12 19 dBm 3dB

4 Power Level DCS1800/PCS1900

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

- 13 -

2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Description Specification

GSM900/EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

5

Output RF Spectrum 6,000 -71

(due to modulation) DCS1800/PCS1900

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

GSM900/EGSM

Offset from Carrier (kHz) Max. (dBm)

Output RF Spectrum 400 -19

6

(due to switching transient) 600 -21

1,200 -21

1,800 -24

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2. GENERAL PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

DCS1800/PCS1900

Offset from Carrier (kHz). Max. (dBm)

Output RF Spectrum 400 -22

6

(due to switching transient) 600 -24

1,200 -24

1,800 -27

7 Spurious Emissions Conduction, Emission Status

EGSM

8 Bit Error Ratio

BER (Class II) < 2.439% @-102dBm

DCS1800/PCS1900

BER (Class II) < 2.439% @-100dBm

9 Rx Level Report accuracy

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6

3,000 4 -6

3,400 4 -9

4,000 0 -

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 2 -7

500

*

-5

13 Receiving Response 1,000 0 -5

3,000 2 -5

3,400 2 -10

4,000 2

*

Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.

- 15 -

2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Description Specification

14 STMR 13 5 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

-20 30.7

16 Distortion

-10 33.3

0 33.7

7 31.7

10 25.5

17 Side Tone Distortion Three stage distortion < 10%

18

System frequency

2.5ppm

(26 MHz) tolerance

19 32.768KHz tolerance 30ppm

Standby

20 Power consumption

- Normal 3 mA(@PP9)

21 Talk Time

EGSM/Lvl 7 (Battery Capacity 800mA):180 min EGSM/Lvl12(Battery Capacity 800 mA):320min Under conditions, at least 300 hours:

1. Brand new and full 800mAh battery

22 Standby Time

2. Full charge, no receive/send and keep GSM in idle mode.

3. Broadcast set off.

4. Signal strength display set at 3 level above.

5. Backlight of phone set off. At least 65 dB under below conditions:

23 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm

24 Charge Current

Fast Charge : < 400 mA Slow Charge: < 120 mA

Antenna Bar Number Power

7 >-92 dBm ~

5 -97dBm ~ -93dBm

25 Antenna Display

4 -100dBm ~ -98dBm

2 -103dBm ~ -101dBm

1 -105dBm ~ -104dBm

0< -106 dBm

Off No Service

LGE Internal Use Only

Only for training and service purposes

2. GENERAL PERFORMANCE

- 16 -

Item Description Specification

Battery Bar Number Voltage( 0.05V)

3 3.69V ~ 4.2V

26 Battery Indicator 2 3.53V ~ 3.69V

1 3.43V ~ 3.53V

0 3.30V ~ 3.43V

27 Low Voltage Warning

3.53V↓ 0.05V (Call)

3.43V ↓ 0.05V (Standby)

28 Forced shut down Voltage 3.3 0.05 V

Li-ion Battery

29 Battery Type

Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 800mAh

Switching-mode charger

30 Travel Charger Input: 150 ~ 240 V, 50/60Hz

Out put: 5.6, 0.4A

LGE Internal Use Only

2. GENERAL PERFORMANCE

- 17 -

* EDGE RF Specification (Option: is not serviced for “EDGE mode”)

Item Description Specification

1 RMS EVM 9% 2 Peak EVM 30% 395thPercentile EVM 15% 4Origin Offset Suppression ≥ 30dB

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 27dBm 3dB 13 17dBm 3dB

6 27dBm 3dB 14 15dBm 3dB

7 27dBm 3dB 15 13dBm 3dB

8 27dBm 3dB 16 11dBm 5dB

9 25dBm 3dB 17 9dBm 5dB

10 23dBm 3dB 18 7dBm 5dB

11 21dBm 3dB 19 5dBm 5dB

5 Power Level 12 19dBm 3dB

DCS1800/PCS1900

Level Power Toler. Level Power Toler.

0 26/25dBm 3dB 8 14 dBm 3dB

1 26/25dBm 3dB 9 12 dBm 4dB

2 26/25dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

6 Output RF Spectrum GSM900/EGSM

(due to modulation) Offset from carrier(kHz) Max. dBc

100 +0.5

200 -30

250 -33

400 -54

600 ~ <1,200 -60

1,200 ~ <1,800 -60

1,800 ~ <3,000 -63

3,000 ~ <6,000 -65

6,000 -71

LGE Internal Use Only

Only for training and service purposes

2. GENERAL PERFORMANCE

- 18 -

Item Description Specification

6 Output RF Spectrum DCS1800/PCS1900

(due to modulation) Offset from carrier(kHz) Max. dBc

100 +0.5

200 -30

250 -33

400 -54

600 ~ <1,200 -60

1,200 ~ <1,800 -60

1,800 ~ <3,000 -63

3,000 ~ <6,000 -65

6,000 -71

7 Output RF Spectrum GSM900/EGSM

(due to switching transient) Offset from carrier(kHz) Max. dBm

400 -23

600 -26

1,200 -27

1,800 --30

DCS1800/PCS1900

Offset from carrier(kHz) Max. dBm

400 -23

600 -26

1,200 -27

1,800 -30

LGE Internal Use Only

3. TECHNICAL BRIEF

- 19 -

3.1 KP500 Functional Block diagram

The functional component arrangement is mentioned below diagram.

3. TECHNICAL BRIEF

Figure 1 KP500 Functional block diagram

PMB6821(PM IC)

BB IC(PMB8877)

(2G NAND +

1G DDR SDRAM)

Charging IC

-SD + SIM Socket

TRANSCEIVER

PMB6272

DGM1110M014

BT IC

BCM2048SB0

Vibrator

LCD, 3.0"

262K TFT WQVGA

KEY PAD

KEY Back Light

Charge Pump

(SC654ULTRT)

LED Matrix Module

SD1 (1.35V)

SD2(1.8V)

VAUX (2.9V)

VIO(2.62V)

VSIM(2.9V)

VMME (2.9V)

VUMTS(2.85V)

VUSB(3.1V) VLED (2.9V)

VAUDIOa(2.5V)

VAUDIOb(2.5V)

VRF1(2.85V)

VRF2(1.53V)

VRF3(2.70V)

VPLL(1.35V)

VRTC(2.0V)

VVIB(2.8V)

VBAT

DCS/PCS

GSM850/900

FEM PAM(SKY77340)

3M CAM

FE1 FE2

PA_MODE

PA_BAND

TXON_PA

PA_LEVEL

AFC

I/I_/Q/Q_

RF_EN

RF_CLK

RF_DA

26M_MCLK

26M_TCXO

ANT

BPF

BT ANT

FM ANT

UART

/

I2S

/

BT_CLK

ADD(0:29)

/

DATA(0:15)

/

32kHz

HEADSET MIC

HEADSET RECEIVER

MAIN MIC

FM RADIO

AUIDO AMP(MAX9877)

EPN11

EPP11

EPPA11

EPPA21

RXINRXIN+

INA1

INA2

HPL

HPR

MAIN SPEAKER

OUT-

OUT+

MIC1(P/N)

MIC2(P/N)

VMICP/N

I2C

/

INB1/2

MIXER

BYPASS

PRE-AMP

Match

Controller

Battery

CHG_EN

T_IN1

VCHG

VUSB_USB

I2C

/

(LED CTRL : 5 ea)

I2C

/

I2C

/

I2C

/

VBAT

END_KEY

COL

ROW

KEY_COL

KEY_ROW

2V11_RTC

B/UP BAT.

CAM_ I2C

/

I2C1

CIF

MMC I/F

/

MMC I/F

VIB_EN

GPIO

PA_MODE

PA_BAND

TXON_PA

PA_LEVEL

UART

I2S

RF INTERFACE

Memory

Pin.01

FM_ANT

Pin.02

I/O CONNECTOR

Pin.03

Pin.04

Pin.05

Pin.06

Pin.07

Pin.08

Pin.11

Pin.12

Pin.13

Pin14

Pin.15

Pin.16

Pin.17

Pin.18

Pin.09

Pin.10

H/S MIC & HOOK_DET

H/S_LEFT

H/S_RIGHT

USB_M

USB_P

JACK_DETECT

VBAT

VBAT.

RPWRON

VCHG

DSR

VBUS_USB

UART_TX

UART_RX

DIF

/

DIF

Touch Window

3-Axis Accelerometer

CAM_I2C

I 2C

/

I 2C

KEY_EN

GPIO

KP500 Block Diagram

- 20 -

3. TECHNICAL BRIEF

3.2 Baseband Processor (BBP) Introduction

3.2.1 General Description

S-GOLD3™ is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital

functionality of a cellular radio. Additionally S-GOLD3™ Provides multimedia extensions such as

camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and

mixed signal portions of the base band in 0.09um, 1.2V technology.

The chip will fully support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD3™ support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data

application (up to class 12) and EGPRS (up to class 12) without additional external hardware.

LGE Internal Use Only

Only for training and service purposes

Figure 3 Top level block diagram of the S-GOLD3™ (PMB8877)

- 21 -

3. TECHNICAL BRIEF

3.2.2 Block Description

• Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration.

- TEAKLite DSP core

• ARM-Memory

- 32k Byte Boot ROM on the AHB

- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 16k Byte Cache for Program (internal)

- 8k Byte tightly coupled memory for Program(internal)

- 8k Byte Cache for Data(internal)

- 8k Byte tightly coupled memory for Data(internal)

• DSP-Memory

- 104K x 16bit Program ROM

- 8k x 16bit Program RAM

- 60k x 16bit Data ROM

- 37k x 16bit Data RAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

• Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

• Controller Bus system The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal and external memories and with the peripheral buses.

• Clock system The clock system allows widely independent selection of frequencies for the essential parts of the S-GOLD3. Thus power consumption and performance can be optimized for each application.

• Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes)

LGE Internal Use Only

- 22 -

3. TECHNICAL BRIEF

- Pulse Number Modulation output for Automatic Frequency Correction(AFC)

- Serial RF Control interface: support of direct conversion RF

- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission

- 1 Serial Synchronous SPI compatible interfaces in the controller domain

- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain

- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller supporting IrDA’s SIR standard (up to 115.2Kbps)

- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)

- I2C-bus interface (e.g. connection to S/M power)

- A fast display interface supporting serial and parallel interconnection

- An ITU-R BT.656 compatible Camera interface.

- Programmable clock output for a camera

- An multimedia/Secure Digital Card Interface (MMCI/SD: SDIO capable)

3.2.3 External Devices connected to memory interface

Table 1. Memory interface

3.2.4 RF Interface (T_OUT)

S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF

ICs Periodically each TDMA frame.

Table 2. RF Interface Spec

.

LGE Internal Use Only

Only for training and service purposes

Device Name Maker Remark

FLASH K5E1G12ACA-D075 Samsung Synchronous / A synchronous

DDR K5E1G12ACA-D075 Samsung Synchronous 133MHz

LCD IM200DST2A LGIT 8bit access 2 times transmission

Melody IC Not Used S/W Infineon Software CODEC

T_OUT

Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on

T_OUT1 Other function -

T_OUT2 PA_BAND TX RF band select

T_OUT3 ANT_SW1 FEM control

T_OUT4 ANT_SW2 FEM control

T_OUT5 ANT_SW3 FEM control

T_OUT6 MODE PAM Mode select

- 23 -

3. TECHNICAL BRIEF

3.2.5 USIF Interface

KF350 have three USIF Drivers as follow :

- USIF1 : Hardware Flow Control / SW upgrade / Calibration

- USIF2 : MON used Rx, Tx and CTS, RTS use BT Interface

- USIF3 : BT Interface

Table 3. USIF Interface Spec.

3.2.6 ADC channel

BBP ADC block is composed of 10 external ADC channel. This block operates charging process and

other related process by reading battery voltage and other analog values.

Table 4. S-Gold3 ADC channel usage

LGE Internal Use Only

Resource Name Remark

USIF1

USIF1_TXD UART_TX Transmit Data

USIF1_RXD UART_RX Receive Data

USIF1_CTS USB_DP

USIF1_RTS USB_DM

USIF2

USIF2_TXD NC NC

USIF2_RXD NC NC

USIF2_CTS BT_CTS

USIF2_RTS BT_RTS.

USIF3

USIF3_TXD BT_TX BT Transmit tx

USIF3_RXD BT_RX BT Receive rx

ADC channel

Resource Interconnection Description

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2 N.C

M3 JACK_TYPE Accessory type detect

M4 N.C

M5 H/W VERSION S-Gold3 H/W version detect

M6 N.C

M7 ICLD

M8 VSUPPLY Battery supply voltage measure

M9 N.C

M10 N.C

3.2.7 GPIO map

Over a hundred allowable resources, KF350 is using as follows except dedicated to SIM and Memory.

KF350 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,

is shown in below table

Table 5 S-Gold3 GPIO pin Map

- 24 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Port Function Net Name Description

KEY MATRIX

KP_IN0 N/A

KP_IN1 N/A

KP_IN2 N/A

KP_IN3 KP_IN3

KP_IN4 N/A

KP_IN5 KP_IN5

KP_OUT5 KP_IN6

KP_OUT0 KP_OUT0

KP_OUT1 LIN_INVERT

KP_OUT2 KP_OUT2

KP_OUT3 KP_OUT3

USIF1

USIF1_RXD UART_RX UART, RS232 Data

USIF1_TXD UART_TX UART, RS232 Data

USIF1_RTS_N USB_DAT_VP USB Data

USIF1_CTS_N USB_SE0_VM USB Data

USIF2

USIF2 _RXD ACCEL_INT

USIF2 _TXD N/A Not used

USIF2_RTS_N UART_BT_RTS Bluetooth RTS

USIF2_CTS_N UART_BT_CTS Bluetooth CTS

USIF3

USIF3 _RXD UART_BT_RX Bluetooth RX

USIF3 _TXD UART_BT_TX Bluetooth TX

GPIO_21 N/A

MMCI2

MMCI2_CMD PCB_VER1 PCB Version1

MMCI2_DAT[0] PCB_VER2 PCB Version2

MMCI2_CLK VIB_EN Vibrator LDO Enable

CAMERA I/F

CIF_D0 CIF_D(0) Camera DATA[0]

CIF_D1 CIF_D(1) Camera DATA[1]

- 25 -

3. TECHNICAL BRIEF

LGE Internal Use Only

CIF_D2 CIF_DATA2 Camera DATA[2]

CIF_D3 CIF_DATA3 Camera DATA[3]

CIF_D4 CIF_DATA4 Camera DATA[4]

CIF_D5 CIF_DATA5 Camera DATA[5]

CIF_D6 CIF_DATA6 Camera DATA[6]

CIF_D7 CIF_DATA7 Camera DATA[7]

CIF_PCLK CIF_PCLK Camera pixel clock

CIF_HSYNC CIF_HSYNC Camera H sync

CIF_VSYNC CIF_VSYNC Camera V sync

CLKOUT CIF_MCLK Camera main clock

CIF_PD CIF_PD Camera power down(active high)

CIF_RESET CIF_RESET Camera reset

LCD I/F

DIF_D0 DIF_D0 LCD data[0]

DIF_D1 DIF_D1 LCD data[1]

DIF_D2 DIF_D2 LCD data[2]

DIF_D3 DIF_D3 LCD data[3]

DIF_D4 DIF_D4 LCD data[4]

DIF_D5 DIF_D5 LCD data[5]

DIF_D6 DIF_D6 LCD data[6]

DIF_D7 DIF_D7 LCD data[7]

DIF_D8 CAM_LDO_EN Camera LDO Enable

DIF_CS1 DIF_MAIN_CS MAIN LCD chip select

DIF_CS2 IF_MODE Interface mode

DIF_CD DIF_CD Command Data switch

DIF_WR DIF_WR LCD Write

DIF_RD DIF_RD LCD Read

EINT7 HOOK_DETECT Ear-Mic hook detection

GPIO_100 DIF_VSYNC LCD Sync

GPIO_27 _ DIF_RESET LCD Reset

EINT5 TOUCH_INT Touch Sensor INT

#I2C1

I2C_SCL I2C_SCL For Touch LDO/PMIC/Audio Amp

I2C_SDA I2C_SDA For Touch LDO/PMIC/Audio Amp

USIF2_RTS_N UART_BT_RTS Bluetooth RTS

USIF2_CTS_N UART_BT_CTS Bluetooth CTS

USIF3

USIF3 _RXD UART_BT_RX Bluetooth RX

USIF3 _TXD UART_BT_TX Bluetooth TX

GPIO_21 N/A

MMCI2

- 26 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

MMCI2_CMD PCB_VER1 PCB Version1

MMCI2_DAT[0] PCB_VER2 PCB Version2

MMCI2_CLK VIB_EN Vibrator LDO Enable

CAMERA I/F

CIF_D0 CIF_DATA0 Camera DATA[0]

CIF_D1 CIF_DATA1 Camera DATA[1]

CIF_D2 CIF_DATA2 Camera DATA[2]

CIF_D3 CIF_DATA3 Camera DATA[3]

CIF_D4 CIF_DATA4 Camera DATA[4]

CIF_D5 CIF_DATA5 Camera DATA[5]

CIF_D6 CIF_DATA6 Camera DATA[6]

CIF_D7 CIF_DATA7 Camera DATA[7]

CIF_PCLK CIF_PCLK Camera pixel clock

CIF_HSYNC CIF_HSYNC Camera H sync

CIF_VSYNC CIF_VSYNC Camera V sync

CLKOUT CIF_MCLK Camera main clock

CIF_PD CIF_PD Camera power down(active high)

CIF_RESET CIF_RESET Camera reset

LCD I/F

DIF_D0 DIF_D0 LCD data[0]

DIF_D1 DIF_D1 LCD data[1]

DIF_D2 DIF_D2 LCD data[2]

DIF_D3 DIF_D3 LCD data[3]

DIF_D4 DIF_D4 LCD data[4]

DIF_D5 DIF_D5 LCD data[5]

DIF_D6 DIF_D6 LCD data[6]

DIF_D7 DIF_D7 LCD data[7]

DIF_D8 CAM_LDO_EN Camera LDO Enable

DIF_CS1 DIF_MAIN_CS MAIN LCD chip select

DIF_CS2 IF_MODE Interface mode

DIF_CD DIF_CD Command Data switch

DIF_WR DIF_WR LCD Write

DIF_RD DIF_RD LCD Read

EINT7 HOOK_DETECT Ear-Mic hook detection

GPIO_100 DIF_VSYNC LCD Sync

GPIO_27 _DIF_RESET LCD Reset

EINT5 TOUCH_INT Touch Sensor INT

#I2C1

I2C_SCL I2C_SCL For Touch LDO/PMIC/Audio Amp

I2C_SDA I2C_SDA For Touch LDO/PMIC/Audio Amp

PM_INT (EINT) PM_INT

#I2C2

I2C2_SCL CIF_SCL For Camera

I2C2_SDA CIF_SDA For Camera

SIM I/F

CC_IO SIM_IO SIM CARD I/O

CC_CLK SIM_CLK SIM CARD CLOCK

CC_RST SIM_RST SIM CARD RESET

IrDA

USB_OEn USB_OEn

EINT3 N/A

External Memory

MMCI_CMD MMC_CMD T-flash

MMCI_DAT[0] MMC_D0 T-flash

MMCI_CLK MMC_CLK T-flash

MMCI1_DAT[1] MMC_D1 T-flash

MMCI1_DAT[2] MMC_D2 T-flash

MMCI1_DAT[3] MMC_D3 T-flash

I2S1

I2S2_CLK0 I2S1_CLK Bluetooth Clock

GPIO_102 MMC_DETECT T-flash Detect

I2S2_RX I2S1_RX Bluetooth PCM RX

I2S2_TX I2S1_TX Bluetooth PCM TX

I2S2_WA0 2S1_WA0 Bluetooth Clock

I2S2

EINT4 CHG_EOC Charger

GPIO_102 LCD_ID LCD ID

CC0CC1IO _PPR Charger

CC0CC7IO BT_INT Bluetooth INT

CC0CC3IO N/A

GPIO_103 KEY_EN

Audio I/F

EPN1 EAR_N For Receiver

EPP1 EAR_P For Receiver

EPPA1 BB_SND_L For Speaker

EPREF Reference

EPPA2 BB_SND_R For Speaker

MICN1 MAIN_MIC_N For Mic

MICP1 MAIN_MIC_P For Mic

MICN2 HS_MIC_N For Headset Mic

MICP2 HS_MIC_P For Headset Mic

VMICP VMIC_P Power for MIC

- 27 -

3. TECHNICAL BRIEF

LGE Internal Use Only

- 28 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

VMICN VMIC_N Power for MIC

#I/Q-Signale

PAOUT1 PA_LEVEL

BB_I I

BB_IX IX

BB_Q Q

BB_QX QX

ADC

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2 PCB_VER

M3

M7

M8

M9 LOAD Current consumption measure

M10 N.C

Reference

VREFP VREFN

IREF

JTAG I/F

TDO TDO JTAG

TDI TDI JTAG

TMS TMS JTAG

TCK TCK JTAG

TRST_n TRSTn JTAG

RTCK RTCK JTAG

#Debug

TRIG_IN TRIG_IN ETM (Embedded Trace Macro Cell)

MON1 2V62_VIO ETM

MON2

TRACESYNC TRACESYNC ETM

TRACECLK TRACECLK ETM

PIPESTAT[2] PIPESTAT[2] ETM

PIPESTAT[1] PIPESTAT[1] ETM

PIPESTAT[0] PIPESTAT[0] ETM

TRACEPKT[0] TRACEPKT[0] ETM

TRACEPKT[1] TRACEPKT[1] ETM

TRACEPKT[2] TRACEPKT[2] ETM

TRACEPKT[3] TRACEPKT[3] ETM

TRACEPKT[4] TRACEPKT[4] ETM

TRACEPKT[5] TRACEPKT[5] ETM

- 29 -

3. TECHNICAL BRIEF

LGE Internal Use Only

TRACEPKT[6] TRACEPKT[6] ETM

TRACEPKT[7] TRACEPKT[7] ETM

Memory

MEM_ADV_n BA1

MEM_RDN _RD Read

MEM_AD[0] DATA0

MEM _AD[1] DATA1

MEM _AD[2] DATA2

MEM _AD[3] DATA3

MEM _AD[4] DATA4

MEM _AD[5] DATA5

MEM _AD[6] DATA6

MEM _AD[7] DATA7

MEM _AD[8] DATA8

MEM _AD[9] DATA9

MEM _AD[10] DATA10

MEM _AD[11] DATA11

MEM _AD[12] DATA12

MEM _AD[13] DATA13

MEM _AD[14] DATA14

MEM _AD[15] DATA15

MEM_CS0_n _NAND_CS

MEM_CS1_n _RAM_CS

MEM_WRN _WR

MEM_A[16] ADD[16]

MEM_A[17] ADD[17]

MEM_A[18] ADD[18]

MEM_A[19] ADD[19]

MEM_A[20] ADD[20]

MEM_A[21] ADD[21]

MEM_A[22] ADD[22]

MEM_A[23] ADD[23]

MEM_A[24] ADD[24]

MEM_A[25] ADD[25]

MEM_A[26] ADD[26]

MEM_CSA0_n ADD[27]

MEM_CSA1_n ADD[28]

MEM_CSA2_n ADD[29]

MEM_CSA3_n BA0

MEM_BFCLKO1

MEM_BFCLKO2 SDCLKI

- 30 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

MEM_SDCLKO SDCLKO

MEM_BC0_n _BC0

MEM_BC1_n _BC1

MEM_BC2_n LDQS

MEM_BC3_n UDQS

MEM _A[0] ADD[0]

MEM _A[1] ADD[1]

MEM _A[2] ADD[2]

MEM _A[3] ADD[3]

MEM _A[4] ADD[4]

MEM _A[5] ADD[5]

MEM _A[6] ADD[6]

MEM _A[7] ADD[7]

MEM _A[8] ADD[8]

MEM _A[9] ADD[9]

MEM _A[10] ADD[10]

MEM _A[11] ADD[11]

MEM _A[12] ADD[12]

MEM _A[13] ADD[13]

MEM _A[14] ADD[14]

MEM _A[15] ADD[15]

MEM_RAS_n _RAS

MEM_CAS_n _CAS

MEM_CKE CKE

FCDP_RBn FCDP

FWP _WP

T_OUT0 TXON_PA

T_OUT1 FE2

T_OUT2 PA_BAND

T_OUT3 FE1

GPIO_47 BT_WAKEUP Bluetooth wakeup

GPIO_48 VBUS_OVP

T_OUT6 PA_MODE

GPIO_50 For Vibrator

GPIO_51 DSR UART DSR

GPIO_52 LCD_BACKLIGHT_EN LCD Backlight Enable

CC1CC7IO JACK_DETECT Jack Detect

GPIO_54 BT_LDO_EN Bluetooth LDO Enable

#SPCU

SPCU_RQ_IN0

GPIO_118 BT_RESETn Bluetooth Reset

- 31 -

3. TECHNICAL BRIEF

LGE Internal Use Only

SPCU_RC_OUT0 VCXO_EN VCXO Enable

SPCU_RQ_IN2 RESOURCE_CTRL

#RF Control Unit

RF_STR0 RF_EN

RF_STR1 LIN_PWM_MAG For Vibrator

RF_DATA RF_DA

RF_CLK RF_CLK

other

AFC

GPIO_58 RPWRON

F26M 26MHZ_MCLK 26MHz Clock

F32K F32K

OSC32K OSC32K

RESET_n _RESET

RTC_OUT RTC_OUT

#Extra I/Os

CLK32K CLK32K For FM Radio, BT CLK32K

DSPOUT1 WDOG

LG KP500 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual