LG KP275, KP275c Service Manual

Service Manual

Model : KP275/KP275c

Service Manual

KP275/KP275c

Date: November, 2008 / Issue 1.0

Internal Use Only

LGE Internal Use Only

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1. INTRODUCTION ...............................5

1.1 Purpose .................................................. 5

1.2 Regulatory Information............................ 5

1.3 Abbreviations .......................................... 7

2. PERFORMANCE...............................8

2.1 Supporting Standard................................8

2.2 Main Parts: Solution.................................8

2.3 HW Feature..............................................9

2.4 HW Spec................................................11

3. TECHNICAL BRIEF ........................15

3.1 Functional Block Diagram......................15

3.2 Baseband Processor Introduction..........16

3.3 Power management IC ..........................28

3.4 Power ON/OFF ......................................35

3.5 SIM Interface..........................................36

3.6 MICRO SD connector ............................37

3.7 Memory..................................................38

3.8 LCD Display...........................................39

3.9 Keypad switching & scanning ................40

3.10 keypad back-light illumination..............41

3.11 LCD back-light illumination ..................43

3.12 Battery voltage monitor........................44

3.13 Audio....................................................45

3.14 BLUETOOTH.......................................48

3.15 FM Radio .............................................51

3.16 CAMERA connector.............................54

3.17 18PIN Interface connector ...................55

3.18 General Description .............................56

3.19 GSM Part .............................................59

3.20 WCDMA Part .......................................64

3.21 GSM Power Amplifier Module..............66

3.22 WCDMA Band1/5Power Amplifier

Module .................................................67

3.23 WCDMA Band1/5 Low Noise Amplifier68

3.24 WCDMA Band 1/5 Duplexer ................69

4. TROUBLE SHOOTING ...................70

4.1 Trouble shooting test setup....................70

4.2 Power on trouble....................................71

4.3 Charging Trouble ...................................74

4.4 UBS Trouble ..........................................77

4.5 SIM Detect Trouble................................79

4.6 Number Key Sense Trouble...................82

4.7 Multi Key sense Trouble ........................84

4.8 Keypad backlight Trouble ......................86

4.9 Micro SD Trouble...................................88

4.10 Audio Trouble.......................................90

4.11 Microphone Trouble.............................94

4.12 Camera Trouble...................................98

4.13 Main LCD Trouble..............................103

4.14 Bluetooth Trouble...............................105

4.15 FM Radio ...........................................108

4.16 RF Component...................................112

4.17 RF SIGNAL PATH .............................113

4.18 Trouble Shooting of GSM Part ..........114

4.19 Trouble Shooting of WCDMA Part.....122

5. DOWNLOAD.....................................128

5.1 USB Driver Installation to Download....128

5.2 Device Detection..................................130

5.3 USB Port Mapping ...............................131

5.4 Configuration to Download...................132

5.5 Nexus setting .......................................134

6. CIRCUIT DIAGRAM ......................135

7. BGM PIN MAP...............................143

8. PCB LAYOUT................................149

9. RF Calibration ..............................155

9.1 Test Equipment Setup .........................155

9.2 Calibration Step ...................................155

10. EXPLODED VIEW &

REPLACEMENT PART LIST ......161

10.1 Exploded View ...................................161

10.2 Replacement Parts ............................163

10.3 Accessory ..........................................184

Table Of Contents

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LGE Internal Use Only

Only for training and service purposes

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1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of the KP275C.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users

are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the KP275C or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the KP275C must be performed only by the LGE or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

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1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

An KP275C may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

Only for training and service purposes

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1. INTRODUCTION

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

LGE Internal Use Only

APC Automatic Power Control BB Baseband BER Bit Error Ratio CC-CV Constant Current - Constant Voltage DAC Digital to Analog Converter DCS Digital Communication System dBm dB relative to 1 milliwatt DSP Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory EL Electroluminescence ESD Electrostatic Discharge FPCB Flexible Printed Circuit Board GMSK Gaussian Minimum Shift Keying GPIB General Purpose Interface Bus GSM Global System for Mobile Communications IPUI International Portable User Identity IF Intermediate Frequency LCD Liquid Crystal Display LDO Low Drop Output LED Light Emitting Diode OPLL Offset Phase Locked Loop PAM Power Amplifier Module PCB Printed Circuit Board PGA Programmable Gain Amplifier PLL Phase Locked Loop PSTN Public Switched Telephone Network RF Radio Frequency RLR Receiving Loudness Rating RMS Root Mean Square RTC Real Time Clock FEM Front End Module SIM Subscriber Identity Module SLR Sending Loudness Rating SRAM Static Random Access Memory STMR Side Tone Masking Rating TA Travel Adapter TDD Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter VCO Voltage Controlled Oscillator VCTCXO Voltage Control Temperature Compensated Crystal Oscillator WAP Wireless Application Protocol

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

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2.1 Supporting Standard

2.2 Main Parts: Solution

Item Feature Comment

Supporting Standard WCDMA850 / WCDMA 2100

EGSM900 / DCS1800 / PCS1900 seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1, 2, 3, A-E

Frequency Range EGSM900 TX : 880 - 915MHz

EGSM900 RX : 925 - 960 MHz DCS1800 TX : 1710 - 1785 MHz DCS1800 RX : 1805 - 1880 MHz PCS1900 TX : 1850 - 1910 MHz PCS1900 RX : 1930 - 1990 MHz WCDMA850 TX : 824 - 849MHz WCDMA850 RX : 869 - 894MHz WCDMA2100 TX : 1920 - 1980 MHz WCDMA2100 RX : 2110 - 2170 MHz

Application Standard WAP 2.0, JAVA 2.0

Item Part name Comment

Digital Baseband PMB8868 (Infineon)

Analog Baseband PMB8868 (Infineon)

RF chip PMB6952 (Infineon)

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2. PERFORMANCE

LGE Internal Use Only

2.3 HW Feature

Item Feature Comment

Form Factor Slide type

Battery 1)Capacity

Standard : Li-Ion, 900mAh

2) Packaging Type : Soft Pack

Size 98 x 48 x 16.9 mm

Weight 98 g With Battery

GSM 280 hours @paging period 5

WCDMA 200hours @DRX=128frames

GSM 160min @ Power Level 7

WCDMA 160min @Tx=12dBm

Charging time 3 hours @power OFF/900mAh

RX sensitivity GSM850 : -105 dBm

DCS1800 : -105 dBm PCS1900 : -105 dBm WCDMA 850 : -106.7dBm WCDMA2100 : -106.7 dBm

GSM850 : 33 dBm Class4 (EGSM900) DCS1800 : 30 dBm Class1(DCS) PCS1900 : 30 dBm Class1(PCS)

EGSM900 : 27 dBm E2 (EGSM900) DCS1800 : 26 dBm E2 (DCS) PCS1900 : 26 dBm E2 (PCS)

GPRS compatibility GPRS Class 12

EDGE compatibility EDGE Class 12

Display Main LCD(2”, 176 x 220)/TFT

Built-in Camera 1.3 Mega pixel, VT CAM(VGA)

ANT Main : Internal Fixed Type

System connector 18 Pin

Ear Phone Jack 18pin, 4 Pole, Stereo

PC synchronization Yes

TX output

power

GSM/

GPRS

EDGE

Stand-by

time

Talk time

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2. PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Feature Comment

Speech coding FR, EFR, HR, AMR

Vibrator Built in Vibrator

Blue Tooth V1.2, A2DP

Voice Recording Yes

Speaker Phone mode Yes

Support

Travel Adapter Yes

CDROM Yes

Stereo Headset Yes

Data Cable No

T-Flash Yes Not Equipped

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2. PERFORMANCE

LGE Internal Use Only

2.4 HW Spec.

2.4.1 GSM Transmitter/Receiver spec.

Item Specification

1Frequency Band EGSM900

TX : 880 - 915MHz RX : 925 - 960 MHz

DCS1800

TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz

PCS1900

TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz

2 Phase Error Rms : 5°

Peak : 20°

3 Frequency Error GSM : 0.1 ppm

DCS/PCS : 0.1 ppm

4 EMC(Radiated Spurious GSM/DCS : < -28dBm

Emission Disturbance)

5 Transmitter Output power and GSM : 5dBm - 33dBm 3dB

Burst Timing DCS/PCS : 0dBm - 30dBm 3dB

6 Burst Timing < 3.69us

7 Spectrum due to modulation out 200kHz : -36dBm

to less than 1800kHz offset 600kHz : -51dBm/-56dBm

8 Spectrum due to modulation out GSM

to larger than 1800kHz offset to 1800-3000kHz :< -63dBc(-46dBm) the edge of the transmit band 3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

DCS

1800-3000kHz :< -65dBc(-51dBm) 6000kHz < : < -73dBc(-51dBm)

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2. PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Specification

9 Spectrum due to switching 400kHz : -19dBm/-22dBm(5/0), -23dBm

transient 600kHz : -21dBm/-24dBm(5/0), -26dBm

10 Reference Sensitivity - TCH/FS Class II(RBER) : -105dBm(2.439%)

11 Usable receiver input level range 0.012(-15 - -40dBm)

12 Intermodulation rejection - 800kHz, 1600kHz : -98dBm / -96dBm (2.439%)

Speech channels

13 AM Suppression -98dBm/-96dBm (2.439%)

- GSM : -31dBm

- DCS : -29dBm

14 Timing Advance 0.5T

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2. PERFORMANCE

LGE Internal Use Only

2.4.2 WCDMA Transmitter spec.

Item Specification

1 Transmit Frequency WCDMA 850 : 824 MHz ~ 849 MHz

WCDMA 2100 : 1920 MHz ~ 1980 MHz

2 Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB

3 Frequency Error within 0.1 PPM

4 Open Loop Power Control Normal Conditions : within 9 dB,

Extreme Conditions : within 12 dB

5 Minimum Transmit Power < -50 dBm / 3.84 MHz

6 Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)

7 Adjacent Channel Leakage > 33 dB @ 5 MHz,

Power Ratio (ACLR) > 43 dB @ 10 MHz

8 Spurious Emissions < -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

|f-fc| > 12.5 MHz < -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz

< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz

< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz

< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz

< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz

< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz

9 Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz

when Interference CW Signal Level = -40 dBc

10 Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

11 Peak Code Domain Error < -15 dB at Pout ≥ -20 dBm

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

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2.4.3 WCDMA Receiver spec.

Item Specification

1 Receive Frequency WCDMA 850 : 869 MHz ~ 894 MHz

WCDMA 2100 : 2110MHz ~ 2170 MHz

2 Reference Sensitivity Level WCDMA 850 :

BER < 0.001 when Îor = -104.7 dBm / 3.84 MHz WCDMA 2100 :

BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz 3 Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz 4 Adjacent Channel Selectivity ACS > 33 dB where BER < 0.001 when Îor =

(ACS) -92.7 dBm / 3.84 MHz

& Ioac = -52 dBm / 3.84 MHz @ 5 MHz 5Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz

& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset)

= 10 MHz

or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset)

= 15 MHz 6 Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz &

Iblocking = -44 dBm 7 Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz

& Iouw1 = -46 dBm @ Fuw1(offset) = 10 MHz

& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) =

20 MHz

8 Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz

< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz 9 nner Loop Power control in uplink Adjust output(TPC command)

cmd 1dB 2dB 3dB +1 +0.5/1.5 +1/3 +1.5/4

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4

group(10equal command group)

+1 +8/+12 +16/+24

LGE Internal Use Only

3. TECHNICAL BRIEF

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3.1 Functional Block Diagram

3. TECHNICAL BRIEF

[Figure 3.1] Functional Block Diagram

- 16 -

3. TECHNICAL BRIEF

3.2 Baseband Processor Introduction

3.2.1 General description

S-GOLD3H-LC is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a mixed signal baseband IC with a 3G coprocessor IC.

l Baseband IC containing all analog and digital functionality of a cellular radio. Additionally SGOLD3TM Provides multimedia extensions such as camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and mixed signal portions of the base band in 0.09um, 1.2V technology.

The chip will support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD3™ support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external hardware.

LGE Internal Use Only

Only for training and service purposes

[Figure 3.2] Top level block diagram of the MPEH(PMB8868)

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3. TECHNICAL BRIEF

3.2.2 Block Description

• Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,

and the Jazelle Java extension for Java acceleration.

- TEAKLite DSP core

• ARM-Memory

- 32k Byte Boot ROM on the AHB

- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 32k Byte Instruction Cache

- 32k Byte Data Cache

- 8k Byte Instruction Tightly coupled Memory(I-TCM)

- 8k Byte Data tightly coupled memory (D-TCM)

• DSP-Memory

- 120k x 16bit Program ROM

- 8k x 16bit Program RAM

- 72k x 16bit Data ROM

- 48k x 16bit Data XRAM

- 5k x 16bit Data YRAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

• Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

• Controller Bus system The processor cores and their peripherals are connected by powerful buses.

-Multi-layer AHB for connecting the ARM and the other master capable building blocks with theinternal and external memories and with the peripheral buses.

-An FPI-Bus for connecting GSM peripherals, called hereafter FPI3 bus.

-A controller FPI bus for connecting the low performance controller peripherals such as keypad, Called hereafter fPI2 bus.

-FPI2 and FPI3 are connected asynchronously to the AHB buses.

• Clock system The clock system allows widely independent selection of frequencies for the essential parts of the SGOLD3H-LC. Thus power consumption and performance can be optimized for each application.

LGE Internal Use Only

- 18 -

3. TECHNICAL BRIEF

• Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms(H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes)

3.2.3 RF Interface(T_OUT)

S-Gold3H-LC uses this interface to control RF IC and Peripherals.

[Table 3.2.3-1] RF Interface Spec.

LGE Internal Use Only

Only for training and service purposes

T_OUT

Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on T_OUT1 T_OUT2 ANT_SEL1 T_OUT3 T_OUT4 FEM control T_OUT5 FEM control T_OUT6 PA_MODE PAM Mode select T_OUT7 ANT_SEL2 T_OUT8 ANT_SEL3 T_OUT9 T_OUT10

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3. TECHNICAL BRIEF

3.2.4 ADC channel

ADC block is composed of 11 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values.

[Table 3.2.4-1] S-Gold3 ADC channel usage

LGE Internal Use Only

ADC channel

Resource Interconnection Description

M0 BAT_ID Battery temperature measure M1 RF_TEMP RF block temperature measure kM2 N.C M3 JACK_TYPE Accessory type detect M4 N.C M5 N.C M6 N.C M7 H/W VERSION H/W version detect M8 VBAT Battery supply voltage measure M9 N.C M10 N.C

3.2.5 GPIO map

Over a hundred allowable resources, KP275C is using as follows except dedicated to SIM and Memory. KP275C GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table

[Table 3.2.5-1] S-Gold3H-LC GPIO pin Map

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3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Port Function Net Name Description

KEY MATRIX

KP_IN0 KEYIN0 KP_IN1 KEYIN1 KP_IN2 KEYIN2 KP_IN3 KEYIN3 KP_IN4 KEYIN4 KP_IN5 KEYIN05 KP_IN6 KEYOUT5 KP_OUT0 KEYOUT0 KP_OUT1 KEYOUT1 KP_OUT2 KEYOUT2 KP_OUT3 KEYOUT3 USIF1 USIF1_RXD_MRST UART_RX UART Data USIF1_TXD_MTSR UART_TX UART Data USIF1_RTS_N USB_ DAT_VP USB Data USIF1_CTS_N USB_SE0_VM USB Data USIF2 USIF2 _RXD_MRST BT_UART_RX Bluetooth UART Data USIF2 _TXD_MTSR BT_UART_TX Bluetooth UART Data USIF2_RTS_N BT_UART_RTS Bluetooth RTS USIF2_CTS_N BT_UART_CTS Bluetooth CTS USIF3 GPIO_19 FM_RESET FM radio reset USIF3 _TXD_MTSR GPIO_21 VT_PWR_EN VT camera power enable CLK CLK32K CLK32k For FM Radio, BT CLK32K

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3. TECHNICAL BRIEF

LGE Internal Use Only

GPIO_22 Not used CAMERA I/F CIF_D0 CAM_D0 Camera DATA[0] CIF_D1 CAM_D1 Camera DATA[1] CIF_D2 CAM_D2 Camera DATA[2] CIF_D3 CAM_D3 Camera DATA[3] CIF_D4 CAM_D4 Camera DATA[4] CIF_D5 CAM_D5 Camera DATA[5] CIF_D6 CAM_D6 Camera DATA[6] CIF_D7 CAM_D7 Camera DATA[7] CIF_PCLK CAM_PCLK Camera pixel clock CIF_HSYNC CAM_HSYNC Camera H sync CIF_VSYNC CAM_VSYNC Camera V sync CLKOUT2 CAM_MCLK Camera main clock CIF_PD CAM_PWR_EN Camera power down(active high) CIF_RESET CAM_RESET Camera reset LCD I/F DIF_D0 LCD_D0 LCD data[0] DIF_D1 LCD_D1 LCD data[1] DIF_D2 LCD_D2 LCD data[2] DIF_D3 LCD_D3 LCD data[3] DIF_D4 LCD_D4 LCD data[4] DIF_D5 LCD_D5 LCD data[5] DIF_D6 LCD_D6 LCD data[6] DIF_D7 LCD_D7 LCD data[7] DIF_D8 DIF_ID LCD data[8] DIF_CS1 _LCD_CS1 MAIN LCD chip select EINT4 FM_INT FM radio interrupt DIF_CD LCD_CD Command Data switch DIF_WR _LCD_WR LCD Write GPIO_98 VT_CAM_RESET VT camera reset DIF_HD LCD Reset DIF_VD LCD_VSYNC LCD Vsync DIF_RESET1 _LCD_RESET LCD Reset DIF_RESET2 A_RESET 3G reset

- 22 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

I2C I2C1_SCL SCL_PMIC For PMIC I2C1_SDA SDA_PMIC For PMIC PM_INT (EINT) PM_INT For PMIC I2C2_SCL SCL I2C2_SDA SDA SIM I/F CC_IO SIM_DATA SIM CARD DATA CC_CLK SIM_CLK SIM CARD CLOCK CC_RST SIM_RST SIM CARD RESET I2S2 GPIO_31 BT_RESETn Bluetooth reset GPIO_102 DBB_BT_INT S-GOLD3H-LC to Bluetooth interrupt GPIO_32 UPPER_KEY_LED Function key LED enable CC0CC7IO BT_IN Bluetooth to S-GOLD3H-LC interrupt GPIO_34 MAIN_KEY_EN Number key LED enable GPIO_103 BT_LDO_EN Bluetooth LDO enable External Memory MMCI_CMD MMC_CMD T-flash command MMCI_DAT[0] MMC_D0 T-flash data0 MMCI_CLK MMC_CLK T-flash clock MMC1_DAT[1] MMC_D1 T-flash data1 MMC1_DAT[2] MMC_D2 T-flash data2 MMC1_DAT[3] MMC_D3 T-flash data3 MMC2_CMD MMC2_DAT[0] MMC2_CLK MOTOR_EN Vibrator enable IrDA GPIO_110 USB_OEn For USB GPIO_111 SLIDE_DETECT Slide on/off detect I2S1 I2S1_CLK0 BT_PCM_CLK For Bluetooth I2S1_CLK1 I2S1_RX BT_PCM_RX For Bluetooth I2S1_TX BT_PCM_TX For Bluetooth I2S1_WA0 BT_PCM_SYNC For Bluetooth

- 23 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Audio I/F EPN1 REC_N For Receiver EPP1 REC_P For Receiver EPPA1 HS_L For Headset EPREF Reference EPPA2 HS_R For Headset MICN1 MAIN_MIC_N For Main Mic MICP1 MAIN_MIC_P For Main Mic MICN2 HS_MIC_N For Headset Mic MICP2 HS_MIC_N For Headset Mic VMICP VMIC_P Power for MIC VMICN GND Ground for MIC ADC M0 BAT_ID Battery temperature measure M1 RF_TEMP RF block temperature measure M2 M3 JACK_TYPE Accessory type detect M7 H/W VERSION H/W version detect M8 VBAT Battery supply voltage measure M9 M10 Reference VREF VREFN IREF GND with resistor JTAG I/F JTAG0_TDO JTAG0_TDI JTAG0_TMS JTAG0_TCK JTAG0_TRST_n JTAG0_RTCK JTAG1_TDO JTAG1_TDI JTAG1_TMS JTAG1_rTCK JTAG0_TRST_n

- 24 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

ETM I/F TRIG_IN MON1 MON1 ETM MON2 MON2 ETM TRACESYNC TRACECLK PIPESTAT[2] PIPESTAT[1] PIPESTAT[0] TRACEPKT[0] TRACEPKT[1] TRACEPKT[2] TRACEPKT[3] TRACEPKT[4] TRACEPKT[5] TRACEPKT[6] TRACEPKT[7] Memory MEM_AD[0] DATA(0) MEM _AD[1] DATA(1) MEM _AD[2] DATA(2) MEM _AD[3] DATA(3) MEM _AD[4] DATA(4 MEM _AD[5] DATA(5) MEM _AD[6] DATA(6) MEM _AD[7] DATA(7) MEM _AD[8] DATA(8) MEM _AD[9] DATA(9) MEM _AD[10] DATA(10) MEM _AD[11] DATA(11) MEM _AD[12] DATA(12) MEM _AD[13] DATA(13) MEM _AD[14] DATA(14) MEM _AD[15] DATA(15) MEM _WR_n _WR MEM _RD_n _ RD

- 25 -

3. TECHNICAL BRIEF

LGE Internal Use Only

MEM _BC0_n _BC0 MEM _BC1_n _BC1 MEM _BC2_n LDQS MEM _BC3_n UDQS MEM _A[0] ADD(0) MEM _A[1] ADD(1) MEM _A[2] ADD(2) MEM _A[3] ADD(3) MEM _A[4] ADD(4) MEM _A[5] ADD(5) MEM _A[6] ADD(6) MEM _A[7] ADD(7) MEM _A[8] ADD(8) MEM _A[9] ADD(9) MEM _A[10] ADD(10) MEM _A[11] ADD(11) MEM _A[12] ADD(12) MEM _A[13] ADD(13) MEM _A[14] ADD(14) MEM _A[15] ADD(15) MEM _A[16] ADD(16) MEM _A[17] ADD(17) MEM _A[18] ADD(18) MEM _A[19] ADD(19) MEM _A[20] ADD(20) MEM _A[21] ADD(21 MEM _A[22] ADD(22) MEM _A[23] ADD(23) MEM _A[24] ADD(24) MEM _A[25] ADD(25) MEM _A[26] ADD(26) MDM_SDA[11] ADD(27) MDM_SDA[12] ADD(28) MDM_SDA[13] ADD(29) MDM_SDA[14] ADD(30) MEM _CS0_n _ _NAND_CS INTEL NOR (64MB)

- 26 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

MEM _CS1_n _RAM_CS INTEL SDRAM (64MB) MEM _CS2_n MEM _CS3_n _CS3 MEM _ADV_n ADV_A15 MEM _RAS_n _RAS MEM _CAS_n _CAS MEM _WAIT_n _WAIT MEM _SDCLK0 SDCLKO For Burst mode MEM _BFCLK01 BFCLKO For Burst mode MEM _BFCLK02 SDCLK1 For Burst mode MEM _CKE CKE Memory FCDP_RBn FCDP GPIO_60 RPWRON_DBB TDMA I/F T_OUT0 TXON_PA PAM T_OUT1 T_OUT2 ANT_SEL1 GPIO_46 MLED_CLDO_CTR Charge pump control EINT6 _EOC Charging terminate signal CC0CC2IO MMC_DETECT SD card detect T_OUT6 PA_MODE PAM T_OUT7 ANT_SEL2 T_OUT8 ANT_SEL3 GPIO_52 DSR CC1CC7IO JACK_DETECT Jack detect GPIO_54 TA_DETECT Charger detect GPIO_55 CHG_EN Charging enable RF I/F RF_STR0 2G_EN CC1CC5IO _PPR Charger detect RF_DATA 2G_DATA RF_CLK 2G_CLK RF_LOCK_DET 3G_LD MASTER_ON 3G_MASTER_ON PA_MODE 3G_PA_MODE1

- 27 -

3. TECHNICAL BRIEF

LGE Internal Use Only

FEM_CTRL[0] ANT_SEL4 FEM_CTRL[1] ANT_SEL5 FEM_CTRL[2] ANT_SEL6 System Port AFC AFC CLKOUT0 [<=26MHz] Not used F26M 26MHZ 26M Main Clock F32K to 32k crystal OSC32K to 32k crystal RESET_n _RESET TRIG_OUT TRIG_OUT RTC_OUT RTC_OUT VCXO_EN VCXO_EN DSP DSPIN0 CLK32K DSPOUT1 WDOG Navi key LED Backlight Control DSPIN1

- 28 -

3. TECHNICAL BRIEF

3.3 Power management IC

3.3.1 General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon SGOLD baseband device it is suitable for the S-GOLD lite and the E-GOLD+ baseband devices as well. It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon°Øs single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

• Charge Control for charging Li-Ion/Polymer batteries under software control

• Pre-charge current generator with selectable current level

• RTC regulator with ultra-low quiescent current

• USB interface support for peripheral and mini-host mode

• Backlight LEDs driver with current selection and PWM dimming function

• Two single LED driver outputs for signaling

• Vibrator driver with adjustable voltage

• Fully controlable by software via I2C - Bus

• Temperature and battery voltage sensors

• Interrupt channels for peripherals

• System debug mode

• VQFN 48 package with heat sink and non-protruding leads

• Compatible with the Infineon E-GOLD+ V2 and V3

LGE Internal Use Only

Only for training and service purposes

- 29 -

3. TECHNICAL BRIEF

SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by two linear regulators

• SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g. organizer functions, games, MP3 decoding) possible.

• SDBB has high efficiency up to 95% and also a power save mode.

• Memory Interface is directly supported by the SDBB

• SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.

• For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up withpower being supplied by the other linear regulator. SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of 8 Ohm for usage in hands-free phones and for ringing

• 450 mW maximum output power

• adjustable gain

• mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

• click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

• Precharge current source with two current levels

• Constant current / constant voltage charging with 3 different termination voltages

• Programable charge current limitation for use with different batteries

• Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage charging phase

• Top-off charge current sensing SM-POWER completes the USB interface of S-GOLD

• Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection

• Switch to supply USB pull-up resistor

• Mini-host pull down resistor functionality

• Charge pump with internal switching capacitor for USB host VBUS supply voltage SM-POWER fully supports LED and Vibra Motor functionality

• no external components needed

• driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM dimming

• two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour

• driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation

LGE Internal Use Only

SMPOWER offers several control functions

• Power-on Reset Generator with logic state machine

• I2C bus interface

• I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN (wake-up by Bluetooth) inputs

• Programable interrupt channels to handle peripherals like SIM, MMC and USB

• Monitoring of charging functions

• Undervoltage Shut-Down

• Errorflags (volatile or non-volatile) from many power-supply functions and thermal sensor in order to debug system

• Overtemperature Shut-Down

• Overtemperature Warning

• Support of S-GOLD standby power-down concept

• Support of S-GOLD Power-Down Pad Tristate Function

[Table 3.3.1-1] LDO Output Table of SM-Power3

- 30 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

LDO Net name Output Voltage Output Current Usage

SD1 1V35_Core 1.35V 600mA Core & for LDO

SD2 1V8_SD 1.8V 300mA Memory

VAUX 2V85_VFM 2.85V 100mA FM RADIO

VIO 2V62_VIO 2.62V 100mA Peripherals

VSIM 2V9_SIM 2.9V 70mA SIM card

VMME 2V9_VMME 2.9V 150mA u-SD

VUMTS 2V85_VCD 2.85V 110mA LCD

VAUDIOa 2V5_VAUDA 2.5V 200mA Stereo headset, Mono earpiece

VAUDIOb 2V5_VAUDB 2.5V 50mA Analog parts of S-Gold

VRF1 2V85_VRF 2.85V 150mA 2.85 V supply for SMARTi-PM RF transceiver

VRF2 1V5_VRF 1,53V 100mA 1.5 V supply for SMARTi-PM RF transceiver

VRF3 2V855_VBT 2.7V 150mA Bluetooth

VPLL 1V35_VPLL 1.35V 30mA S-GOLD3H PLL

VRTC 2V11_RTC 2.11V 4mA Real Time Clock

VAFC 2V7_VRF 2.65V 5mA Not used

VVIB 2V8_VAMP 2.8V 140mA AUDIO AMP

- 31 -

3. TECHNICAL BRIEF

LGE Internal Use Only

[Figure3.3.1-1] SM-Power 3 Circuit Diagram

1V8_SD

2V5_VAUDA

C223 10u

PMIC

2V5_VAUDB

2.2u 2.2u

C224 10u 16081608

C215C214

C222

0.1u

RTC_OUT ON_OFF2

2V85_VFM

R209

27K

R212

DNI

USB_OEn

USB_DAT_VP

USB_SE0_VM

VBAT

FB201

PM_VCXO_EN

1608

BT_VCXO_EN

C216 1u

C219

4.7u 1608

RB521S-30

PMRSTn

D204

VBAT

USB+

USB-

PMRSTn

L202

10uH

2.2uC227

C225

C226

2.2u

0.1u

1608

VUSB

VBAT

C203

2.2uC204

2.2u 1608

1608

R235 100K

0.1u

C210

B7

B5

A2

A4

B2

B3

C3

A3

C5

B6

C4

AC-

AC+

OE_N

VUSB

DAT_VP

SE0_VM

B1

RCV

C2

VPIN

D3

VMIN

C1

D+

D2

D-

E3

RESET_N

D1

RESET2_N

E2

SLEEP1_N

E1

SLEEP2_N

F2

VAUDIOA

F1

VDDAUDIOA

G2

VDDAUDIOB

G1

VAUDIOB

H2

VAUX

H1

VDDAUX

J1

SU1_GATE

J2

SU1_GND

H3

SU1_FB

J3

SU1_ISENSE

K1

VDDSD2

K2

SD2_FB

L2

SD2_FBL

4.7uC228

1608

SUSPEND

VDD_USB

MONO_INP

MONO_INN

VDD_MONO

A5

VREFEX_M

VSS1

C6

C201

0.1u

A7

C7

VSS_MONO

MONO_OUTP

VSS2

VSS3

D4

D5

1%

A6

MONO_OUTN

VSS4

VSS5

D6

D7

VSS6E4VSS7E5VSS8

D8

1V35_VPLL

VBAT

2V62_VIO

MAIN_KEY_LED

MAIN_KEY_EN

1u

4.7KR215

4.7KR214

2.2u

C209

C207

C208

C9

FLASH_ON

VSS11

E8

R213 4.7K

1608

TP202

TP203

L1

A11

A10

B4

B11

B9

K3

B10

TXONPA

VSS12

E9

A1

J4

VIO

VPLL

VSD2

PUMS2

PUMS3

PUMS1

OUTPORT

VDDPLLIO

U202

PMB6821

VSS17

VSS18

VSS19

VSS20

VSS21

VSS22G6VSS23

VSS13

F3

F4

VSS24

VSS14

VSS15

VSS16

F7

F8

F9

F5

F6

G3

G4

G5

G7

G8

1u

100K

R219

C212

C8

B8

A9

VREF

RREF

FLASH_SHINK

VSS10

VSS9

E7

E6

WDOG

TP204

L3

WDOG

POWER_ON

VSS25

VSS26

H5

G9

PWRON

ON_OFF2

TP205

L4

L5

ON_OFF1K4ON_OFF2

VSS27

VSS28

H6

H7

RESOURCE_CTRL

J5

K5

ON_OFF_OUT

RESOURCE_CRTL

VSS29

VSS30

J6

SPOWER_INT

SDA_PMIC

SCL_PMIC

R216

4.7K

J7

K6

I2C_INT

I2C_CLK

I2C_DAT

D9

H8

2V62_VIO

TP206

L6

VSS_SD1

TP207

K7

BL1_PWM

VSS_SD2H4VSS_VREF

R217

4.7K

TP208

J8

BL2_PWM

BL3_PWM

L7

CH_CNTRL

L8

K8

CHARGE_UC

CH_SOURCE

VBAT

K9

L9

K10

SENSE_IN1

VDD_CHARGE

J9

VDD_REF

SENSE_IN2

C202

C205 33u

0.1uC211

TP209

L11

A8

VSD1

VLED

VDDMME

VDDRF2

VDDRF13_AFC

VDDSIMVIB

VDDUMTS

VDDSD1 SD1_FB

SD1_FBL

KDR331V

2

3

1

1u

D202

L201 10uH

D203

C11

VMME

C10

D10 D11

VRF2

E10

VRF3

E11

F10

VRF1

F11

VVIB

G11

G10

VSIM

H11

VAFC

H10

VRTC

FB202

H9 J11

VUMTS

K11 J10 L10

C220

4.7u 1608

SDB0530

FB203

OVP_VUSB

1608

OVP_VCHG

R233

47K

TA_DETECT

R234

47K

C233 1u

2V11_RTC

2V85_VRF

C235

2V9_VSIM

1V5_VRF

2V9_VMME

1V8_SD

2V85_VBT

C239

C237

C238

C236

2.2u2.2u

C240

C241

2.2u

2V7_VRF

C234 1u

1V35_CORE

2V8_AMP

2V85_VLCD

VBAT

1608

10uC218

10uC221

10u

1608

4.7uC231

C232

C217

1u

C230 4.7u

C229 2.2u

LG KP275, KP275c Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual