LG KP275, KP275c Service Manual

Service Manual

Model : KP275/KP275c

Service Manual

KP275/KP275c

Date: November, 2008 / Issue 1.0

Internal Use Only

LGE Internal Use Only

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1. INTRODUCTION ...............................5

1.1 Purpose .................................................. 5

1.2 Regulatory Information............................ 5

1.3 Abbreviations .......................................... 7

2. PERFORMANCE...............................8

2.1 Supporting Standard................................8

2.2 Main Parts: Solution.................................8

2.3 HW Feature..............................................9

2.4 HW Spec................................................11

3. TECHNICAL BRIEF ........................15

3.1 Functional Block Diagram......................15

3.2 Baseband Processor Introduction..........16

3.3 Power management IC ..........................28

3.4 Power ON/OFF ......................................35

3.5 SIM Interface..........................................36

3.6 MICRO SD connector ............................37

3.7 Memory..................................................38

3.8 LCD Display...........................................39

3.9 Keypad switching & scanning ................40

3.10 keypad back-light illumination..............41

3.11 LCD back-light illumination ..................43

3.12 Battery voltage monitor........................44

3.13 Audio....................................................45

3.14 BLUETOOTH.......................................48

3.15 FM Radio .............................................51

3.16 CAMERA connector.............................54

3.17 18PIN Interface connector ...................55

3.18 General Description .............................56

3.19 GSM Part .............................................59

3.20 WCDMA Part .......................................64

3.21 GSM Power Amplifier Module..............66

3.22 WCDMA Band1/5Power Amplifier

Module .................................................67

3.23 WCDMA Band1/5 Low Noise Amplifier68

3.24 WCDMA Band 1/5 Duplexer ................69

4. TROUBLE SHOOTING ...................70

4.1 Trouble shooting test setup....................70

4.2 Power on trouble....................................71

4.3 Charging Trouble ...................................74

4.4 UBS Trouble ..........................................77

4.5 SIM Detect Trouble................................79

4.6 Number Key Sense Trouble...................82

4.7 Multi Key sense Trouble ........................84

4.8 Keypad backlight Trouble ......................86

4.9 Micro SD Trouble...................................88

4.10 Audio Trouble.......................................90

4.11 Microphone Trouble.............................94

4.12 Camera Trouble...................................98

4.13 Main LCD Trouble..............................103

4.14 Bluetooth Trouble...............................105

4.15 FM Radio ...........................................108

4.16 RF Component...................................112

4.17 RF SIGNAL PATH .............................113

4.18 Trouble Shooting of GSM Part ..........114

4.19 Trouble Shooting of WCDMA Part.....122

5. DOWNLOAD.....................................128

5.1 USB Driver Installation to Download....128

5.2 Device Detection..................................130

5.3 USB Port Mapping ...............................131

5.4 Configuration to Download...................132

5.5 Nexus setting .......................................134

6. CIRCUIT DIAGRAM ......................135

7. BGM PIN MAP...............................143

8. PCB LAYOUT................................149

9. RF Calibration ..............................155

9.1 Test Equipment Setup .........................155

9.2 Calibration Step ...................................155

10. EXPLODED VIEW &

REPLACEMENT PART LIST ......161

10.1 Exploded View ...................................161

10.2 Replacement Parts ............................163

10.3 Accessory ..........................................184

Table Of Contents

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LGE Internal Use Only

Only for training and service purposes

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1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of the KP275C.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users

are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the KP275C or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the KP275C must be performed only by the LGE or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

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1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

An KP275C may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

Only for training and service purposes

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1. INTRODUCTION

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

LGE Internal Use Only

APC Automatic Power Control BB Baseband BER Bit Error Ratio CC-CV Constant Current - Constant Voltage DAC Digital to Analog Converter DCS Digital Communication System dBm dB relative to 1 milliwatt DSP Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory EL Electroluminescence ESD Electrostatic Discharge FPCB Flexible Printed Circuit Board GMSK Gaussian Minimum Shift Keying GPIB General Purpose Interface Bus GSM Global System for Mobile Communications IPUI International Portable User Identity IF Intermediate Frequency LCD Liquid Crystal Display LDO Low Drop Output LED Light Emitting Diode OPLL Offset Phase Locked Loop PAM Power Amplifier Module PCB Printed Circuit Board PGA Programmable Gain Amplifier PLL Phase Locked Loop PSTN Public Switched Telephone Network RF Radio Frequency RLR Receiving Loudness Rating RMS Root Mean Square RTC Real Time Clock FEM Front End Module SIM Subscriber Identity Module SLR Sending Loudness Rating SRAM Static Random Access Memory STMR Side Tone Masking Rating TA Travel Adapter TDD Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter VCO Voltage Controlled Oscillator VCTCXO Voltage Control Temperature Compensated Crystal Oscillator WAP Wireless Application Protocol

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

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2.1 Supporting Standard

2.2 Main Parts: Solution

Item Feature Comment

Supporting Standard WCDMA850 / WCDMA 2100

EGSM900 / DCS1800 / PCS1900 seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1, 2, 3, A-E

Frequency Range EGSM900 TX : 880 - 915MHz

EGSM900 RX : 925 - 960 MHz DCS1800 TX : 1710 - 1785 MHz DCS1800 RX : 1805 - 1880 MHz PCS1900 TX : 1850 - 1910 MHz PCS1900 RX : 1930 - 1990 MHz WCDMA850 TX : 824 - 849MHz WCDMA850 RX : 869 - 894MHz WCDMA2100 TX : 1920 - 1980 MHz WCDMA2100 RX : 2110 - 2170 MHz

Application Standard WAP 2.0, JAVA 2.0

Item Part name Comment

Digital Baseband PMB8868 (Infineon)

Analog Baseband PMB8868 (Infineon)

RF chip PMB6952 (Infineon)

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2. PERFORMANCE

LGE Internal Use Only

2.3 HW Feature

Item Feature Comment

Form Factor Slide type

Battery 1)Capacity

Standard : Li-Ion, 900mAh

2) Packaging Type : Soft Pack

Size 98 x 48 x 16.9 mm

Weight 98 g With Battery

GSM 280 hours @paging period 5

WCDMA 200hours @DRX=128frames

GSM 160min @ Power Level 7

WCDMA 160min @Tx=12dBm

Charging time 3 hours @power OFF/900mAh

RX sensitivity GSM850 : -105 dBm

DCS1800 : -105 dBm PCS1900 : -105 dBm WCDMA 850 : -106.7dBm WCDMA2100 : -106.7 dBm

GSM850 : 33 dBm Class4 (EGSM900) DCS1800 : 30 dBm Class1(DCS) PCS1900 : 30 dBm Class1(PCS)

EGSM900 : 27 dBm E2 (EGSM900) DCS1800 : 26 dBm E2 (DCS) PCS1900 : 26 dBm E2 (PCS)

GPRS compatibility GPRS Class 12

EDGE compatibility EDGE Class 12

Display Main LCD(2”, 176 x 220)/TFT

Built-in Camera 1.3 Mega pixel, VT CAM(VGA)

ANT Main : Internal Fixed Type

System connector 18 Pin

Ear Phone Jack 18pin, 4 Pole, Stereo

PC synchronization Yes

TX output

power

GSM/

GPRS

EDGE

Stand-by

time

Talk time

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2. PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Feature Comment

Speech coding FR, EFR, HR, AMR

Vibrator Built in Vibrator

Blue Tooth V1.2, A2DP

Voice Recording Yes

Speaker Phone mode Yes

Support

Travel Adapter Yes

CDROM Yes

Stereo Headset Yes

Data Cable No

T-Flash Yes Not Equipped

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2. PERFORMANCE

LGE Internal Use Only

2.4 HW Spec.

2.4.1 GSM Transmitter/Receiver spec.

Item Specification

1Frequency Band EGSM900

TX : 880 - 915MHz RX : 925 - 960 MHz

DCS1800

TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz

PCS1900

TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz

2 Phase Error Rms : 5°

Peak : 20°

3 Frequency Error GSM : 0.1 ppm

DCS/PCS : 0.1 ppm

4 EMC(Radiated Spurious GSM/DCS : < -28dBm

Emission Disturbance)

5 Transmitter Output power and GSM : 5dBm - 33dBm 3dB

Burst Timing DCS/PCS : 0dBm - 30dBm 3dB

6 Burst Timing < 3.69us

7 Spectrum due to modulation out 200kHz : -36dBm

to less than 1800kHz offset 600kHz : -51dBm/-56dBm

8 Spectrum due to modulation out GSM

to larger than 1800kHz offset to 1800-3000kHz :< -63dBc(-46dBm) the edge of the transmit band 3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

DCS

1800-3000kHz :< -65dBc(-51dBm) 6000kHz < : < -73dBc(-51dBm)

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2. PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Specification

9 Spectrum due to switching 400kHz : -19dBm/-22dBm(5/0), -23dBm

transient 600kHz : -21dBm/-24dBm(5/0), -26dBm

10 Reference Sensitivity - TCH/FS Class II(RBER) : -105dBm(2.439%)

11 Usable receiver input level range 0.012(-15 - -40dBm)

12 Intermodulation rejection - 800kHz, 1600kHz : -98dBm / -96dBm (2.439%)

Speech channels

13 AM Suppression -98dBm/-96dBm (2.439%)

- GSM : -31dBm

- DCS : -29dBm

14 Timing Advance 0.5T

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2. PERFORMANCE

LGE Internal Use Only

2.4.2 WCDMA Transmitter spec.

Item Specification

1 Transmit Frequency WCDMA 850 : 824 MHz ~ 849 MHz

WCDMA 2100 : 1920 MHz ~ 1980 MHz

2 Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB

3 Frequency Error within 0.1 PPM

4 Open Loop Power Control Normal Conditions : within 9 dB,

Extreme Conditions : within 12 dB

5 Minimum Transmit Power < -50 dBm / 3.84 MHz

6 Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)

7 Adjacent Channel Leakage > 33 dB @ 5 MHz,

Power Ratio (ACLR) > 43 dB @ 10 MHz

8 Spurious Emissions < -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

|f-fc| > 12.5 MHz < -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz

< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz

< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz

< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz

< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz

< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz

9 Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz

when Interference CW Signal Level = -40 dBc

10 Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

11 Peak Code Domain Error < -15 dB at Pout ≥ -20 dBm

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

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2.4.3 WCDMA Receiver spec.

Item Specification

1 Receive Frequency WCDMA 850 : 869 MHz ~ 894 MHz

WCDMA 2100 : 2110MHz ~ 2170 MHz

2 Reference Sensitivity Level WCDMA 850 :

BER < 0.001 when Îor = -104.7 dBm / 3.84 MHz WCDMA 2100 :

BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz 3 Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz 4 Adjacent Channel Selectivity ACS > 33 dB where BER < 0.001 when Îor =

(ACS) -92.7 dBm / 3.84 MHz

& Ioac = -52 dBm / 3.84 MHz @ 5 MHz 5Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz

& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset)

= 10 MHz

or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset)

= 15 MHz 6 Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz &

Iblocking = -44 dBm 7 Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz

& Iouw1 = -46 dBm @ Fuw1(offset) = 10 MHz

& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) =

20 MHz

8 Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz

< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz 9 nner Loop Power control in uplink Adjust output(TPC command)

cmd 1dB 2dB 3dB +1 +0.5/1.5 +1/3 +1.5/4

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4

group(10equal command group)

+1 +8/+12 +16/+24

LGE Internal Use Only

3. TECHNICAL BRIEF

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3.1 Functional Block Diagram

3. TECHNICAL BRIEF

[Figure 3.1] Functional Block Diagram

- 16 -

3. TECHNICAL BRIEF

3.2 Baseband Processor Introduction

3.2.1 General description

S-GOLD3H-LC is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a mixed signal baseband IC with a 3G coprocessor IC.

l Baseband IC containing all analog and digital functionality of a cellular radio. Additionally SGOLD3TM Provides multimedia extensions such as camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and mixed signal portions of the base band in 0.09um, 1.2V technology.

The chip will support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD3™ support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external hardware.

LGE Internal Use Only

Only for training and service purposes

[Figure 3.2] Top level block diagram of the MPEH(PMB8868)

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3. TECHNICAL BRIEF

3.2.2 Block Description

• Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,

and the Jazelle Java extension for Java acceleration.

- TEAKLite DSP core

• ARM-Memory

- 32k Byte Boot ROM on the AHB

- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 32k Byte Instruction Cache

- 32k Byte Data Cache

- 8k Byte Instruction Tightly coupled Memory(I-TCM)

- 8k Byte Data tightly coupled memory (D-TCM)

• DSP-Memory

- 120k x 16bit Program ROM

- 8k x 16bit Program RAM

- 72k x 16bit Data ROM

- 48k x 16bit Data XRAM

- 5k x 16bit Data YRAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

• Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

• Controller Bus system The processor cores and their peripherals are connected by powerful buses.

-Multi-layer AHB for connecting the ARM and the other master capable building blocks with theinternal and external memories and with the peripheral buses.

-An FPI-Bus for connecting GSM peripherals, called hereafter FPI3 bus.

-A controller FPI bus for connecting the low performance controller peripherals such as keypad, Called hereafter fPI2 bus.

-FPI2 and FPI3 are connected asynchronously to the AHB buses.

• Clock system The clock system allows widely independent selection of frequencies for the essential parts of the SGOLD3H-LC. Thus power consumption and performance can be optimized for each application.

LGE Internal Use Only

- 18 -

3. TECHNICAL BRIEF

• Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms(H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes)

3.2.3 RF Interface(T_OUT)

S-Gold3H-LC uses this interface to control RF IC and Peripherals.

[Table 3.2.3-1] RF Interface Spec.

LGE Internal Use Only

Only for training and service purposes

T_OUT

Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on T_OUT1 T_OUT2 ANT_SEL1 T_OUT3 T_OUT4 FEM control T_OUT5 FEM control T_OUT6 PA_MODE PAM Mode select T_OUT7 ANT_SEL2 T_OUT8 ANT_SEL3 T_OUT9 T_OUT10

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3. TECHNICAL BRIEF

3.2.4 ADC channel

ADC block is composed of 11 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values.

[Table 3.2.4-1] S-Gold3 ADC channel usage

LGE Internal Use Only

ADC channel

Resource Interconnection Description

M0 BAT_ID Battery temperature measure M1 RF_TEMP RF block temperature measure kM2 N.C M3 JACK_TYPE Accessory type detect M4 N.C M5 N.C M6 N.C M7 H/W VERSION H/W version detect M8 VBAT Battery supply voltage measure M9 N.C M10 N.C

3.2.5 GPIO map

Over a hundred allowable resources, KP275C is using as follows except dedicated to SIM and Memory. KP275C GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table

[Table 3.2.5-1] S-Gold3H-LC GPIO pin Map

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3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Port Function Net Name Description

KEY MATRIX

KP_IN0 KEYIN0 KP_IN1 KEYIN1 KP_IN2 KEYIN2 KP_IN3 KEYIN3 KP_IN4 KEYIN4 KP_IN5 KEYIN05 KP_IN6 KEYOUT5 KP_OUT0 KEYOUT0 KP_OUT1 KEYOUT1 KP_OUT2 KEYOUT2 KP_OUT3 KEYOUT3 USIF1 USIF1_RXD_MRST UART_RX UART Data USIF1_TXD_MTSR UART_TX UART Data USIF1_RTS_N USB_ DAT_VP USB Data USIF1_CTS_N USB_SE0_VM USB Data USIF2 USIF2 _RXD_MRST BT_UART_RX Bluetooth UART Data USIF2 _TXD_MTSR BT_UART_TX Bluetooth UART Data USIF2_RTS_N BT_UART_RTS Bluetooth RTS USIF2_CTS_N BT_UART_CTS Bluetooth CTS USIF3 GPIO_19 FM_RESET FM radio reset USIF3 _TXD_MTSR GPIO_21 VT_PWR_EN VT camera power enable CLK CLK32K CLK32k For FM Radio, BT CLK32K

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3. TECHNICAL BRIEF

LGE Internal Use Only

GPIO_22 Not used CAMERA I/F CIF_D0 CAM_D0 Camera DATA[0] CIF_D1 CAM_D1 Camera DATA[1] CIF_D2 CAM_D2 Camera DATA[2] CIF_D3 CAM_D3 Camera DATA[3] CIF_D4 CAM_D4 Camera DATA[4] CIF_D5 CAM_D5 Camera DATA[5] CIF_D6 CAM_D6 Camera DATA[6] CIF_D7 CAM_D7 Camera DATA[7] CIF_PCLK CAM_PCLK Camera pixel clock CIF_HSYNC CAM_HSYNC Camera H sync CIF_VSYNC CAM_VSYNC Camera V sync CLKOUT2 CAM_MCLK Camera main clock CIF_PD CAM_PWR_EN Camera power down(active high) CIF_RESET CAM_RESET Camera reset LCD I/F DIF_D0 LCD_D0 LCD data[0] DIF_D1 LCD_D1 LCD data[1] DIF_D2 LCD_D2 LCD data[2] DIF_D3 LCD_D3 LCD data[3] DIF_D4 LCD_D4 LCD data[4] DIF_D5 LCD_D5 LCD data[5] DIF_D6 LCD_D6 LCD data[6] DIF_D7 LCD_D7 LCD data[7] DIF_D8 DIF_ID LCD data[8] DIF_CS1 _LCD_CS1 MAIN LCD chip select EINT4 FM_INT FM radio interrupt DIF_CD LCD_CD Command Data switch DIF_WR _LCD_WR LCD Write GPIO_98 VT_CAM_RESET VT camera reset DIF_HD LCD Reset DIF_VD LCD_VSYNC LCD Vsync DIF_RESET1 _LCD_RESET LCD Reset DIF_RESET2 A_RESET 3G reset

- 22 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

I2C I2C1_SCL SCL_PMIC For PMIC I2C1_SDA SDA_PMIC For PMIC PM_INT (EINT) PM_INT For PMIC I2C2_SCL SCL I2C2_SDA SDA SIM I/F CC_IO SIM_DATA SIM CARD DATA CC_CLK SIM_CLK SIM CARD CLOCK CC_RST SIM_RST SIM CARD RESET I2S2 GPIO_31 BT_RESETn Bluetooth reset GPIO_102 DBB_BT_INT S-GOLD3H-LC to Bluetooth interrupt GPIO_32 UPPER_KEY_LED Function key LED enable CC0CC7IO BT_IN Bluetooth to S-GOLD3H-LC interrupt GPIO_34 MAIN_KEY_EN Number key LED enable GPIO_103 BT_LDO_EN Bluetooth LDO enable External Memory MMCI_CMD MMC_CMD T-flash command MMCI_DAT[0] MMC_D0 T-flash data0 MMCI_CLK MMC_CLK T-flash clock MMC1_DAT[1] MMC_D1 T-flash data1 MMC1_DAT[2] MMC_D2 T-flash data2 MMC1_DAT[3] MMC_D3 T-flash data3 MMC2_CMD MMC2_DAT[0] MMC2_CLK MOTOR_EN Vibrator enable IrDA GPIO_110 USB_OEn For USB GPIO_111 SLIDE_DETECT Slide on/off detect I2S1 I2S1_CLK0 BT_PCM_CLK For Bluetooth I2S1_CLK1 I2S1_RX BT_PCM_RX For Bluetooth I2S1_TX BT_PCM_TX For Bluetooth I2S1_WA0 BT_PCM_SYNC For Bluetooth

- 23 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Audio I/F EPN1 REC_N For Receiver EPP1 REC_P For Receiver EPPA1 HS_L For Headset EPREF Reference EPPA2 HS_R For Headset MICN1 MAIN_MIC_N For Main Mic MICP1 MAIN_MIC_P For Main Mic MICN2 HS_MIC_N For Headset Mic MICP2 HS_MIC_N For Headset Mic VMICP VMIC_P Power for MIC VMICN GND Ground for MIC ADC M0 BAT_ID Battery temperature measure M1 RF_TEMP RF block temperature measure M2 M3 JACK_TYPE Accessory type detect M7 H/W VERSION H/W version detect M8 VBAT Battery supply voltage measure M9 M10 Reference VREF VREFN IREF GND with resistor JTAG I/F JTAG0_TDO JTAG0_TDI JTAG0_TMS JTAG0_TCK JTAG0_TRST_n JTAG0_RTCK JTAG1_TDO JTAG1_TDI JTAG1_TMS JTAG1_rTCK JTAG0_TRST_n

- 24 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

ETM I/F TRIG_IN MON1 MON1 ETM MON2 MON2 ETM TRACESYNC TRACECLK PIPESTAT[2] PIPESTAT[1] PIPESTAT[0] TRACEPKT[0] TRACEPKT[1] TRACEPKT[2] TRACEPKT[3] TRACEPKT[4] TRACEPKT[5] TRACEPKT[6] TRACEPKT[7] Memory MEM_AD[0] DATA(0) MEM _AD[1] DATA(1) MEM _AD[2] DATA(2) MEM _AD[3] DATA(3) MEM _AD[4] DATA(4 MEM _AD[5] DATA(5) MEM _AD[6] DATA(6) MEM _AD[7] DATA(7) MEM _AD[8] DATA(8) MEM _AD[9] DATA(9) MEM _AD[10] DATA(10) MEM _AD[11] DATA(11) MEM _AD[12] DATA(12) MEM _AD[13] DATA(13) MEM _AD[14] DATA(14) MEM _AD[15] DATA(15) MEM _WR_n _WR MEM _RD_n _ RD

- 25 -

3. TECHNICAL BRIEF

LGE Internal Use Only

MEM _BC0_n _BC0 MEM _BC1_n _BC1 MEM _BC2_n LDQS MEM _BC3_n UDQS MEM _A[0] ADD(0) MEM _A[1] ADD(1) MEM _A[2] ADD(2) MEM _A[3] ADD(3) MEM _A[4] ADD(4) MEM _A[5] ADD(5) MEM _A[6] ADD(6) MEM _A[7] ADD(7) MEM _A[8] ADD(8) MEM _A[9] ADD(9) MEM _A[10] ADD(10) MEM _A[11] ADD(11) MEM _A[12] ADD(12) MEM _A[13] ADD(13) MEM _A[14] ADD(14) MEM _A[15] ADD(15) MEM _A[16] ADD(16) MEM _A[17] ADD(17) MEM _A[18] ADD(18) MEM _A[19] ADD(19) MEM _A[20] ADD(20) MEM _A[21] ADD(21 MEM _A[22] ADD(22) MEM _A[23] ADD(23) MEM _A[24] ADD(24) MEM _A[25] ADD(25) MEM _A[26] ADD(26) MDM_SDA[11] ADD(27) MDM_SDA[12] ADD(28) MDM_SDA[13] ADD(29) MDM_SDA[14] ADD(30) MEM _CS0_n _ _NAND_CS INTEL NOR (64MB)

- 26 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

MEM _CS1_n _RAM_CS INTEL SDRAM (64MB) MEM _CS2_n MEM _CS3_n _CS3 MEM _ADV_n ADV_A15 MEM _RAS_n _RAS MEM _CAS_n _CAS MEM _WAIT_n _WAIT MEM _SDCLK0 SDCLKO For Burst mode MEM _BFCLK01 BFCLKO For Burst mode MEM _BFCLK02 SDCLK1 For Burst mode MEM _CKE CKE Memory FCDP_RBn FCDP GPIO_60 RPWRON_DBB TDMA I/F T_OUT0 TXON_PA PAM T_OUT1 T_OUT2 ANT_SEL1 GPIO_46 MLED_CLDO_CTR Charge pump control EINT6 _EOC Charging terminate signal CC0CC2IO MMC_DETECT SD card detect T_OUT6 PA_MODE PAM T_OUT7 ANT_SEL2 T_OUT8 ANT_SEL3 GPIO_52 DSR CC1CC7IO JACK_DETECT Jack detect GPIO_54 TA_DETECT Charger detect GPIO_55 CHG_EN Charging enable RF I/F RF_STR0 2G_EN CC1CC5IO _PPR Charger detect RF_DATA 2G_DATA RF_CLK 2G_CLK RF_LOCK_DET 3G_LD MASTER_ON 3G_MASTER_ON PA_MODE 3G_PA_MODE1

- 27 -

3. TECHNICAL BRIEF

LGE Internal Use Only

FEM_CTRL[0] ANT_SEL4 FEM_CTRL[1] ANT_SEL5 FEM_CTRL[2] ANT_SEL6 System Port AFC AFC CLKOUT0 [<=26MHz] Not used F26M 26MHZ 26M Main Clock F32K to 32k crystal OSC32K to 32k crystal RESET_n _RESET TRIG_OUT TRIG_OUT RTC_OUT RTC_OUT VCXO_EN VCXO_EN DSP DSPIN0 CLK32K DSPOUT1 WDOG Navi key LED Backlight Control DSPIN1

- 28 -

3. TECHNICAL BRIEF

3.3 Power management IC

3.3.1 General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon SGOLD baseband device it is suitable for the S-GOLD lite and the E-GOLD+ baseband devices as well. It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon°Øs single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

• Charge Control for charging Li-Ion/Polymer batteries under software control

• Pre-charge current generator with selectable current level

• RTC regulator with ultra-low quiescent current

• USB interface support for peripheral and mini-host mode

• Backlight LEDs driver with current selection and PWM dimming function

• Two single LED driver outputs for signaling

• Vibrator driver with adjustable voltage

• Fully controlable by software via I2C - Bus

• Temperature and battery voltage sensors

• Interrupt channels for peripherals

• System debug mode

• VQFN 48 package with heat sink and non-protruding leads

• Compatible with the Infineon E-GOLD+ V2 and V3

LGE Internal Use Only

Only for training and service purposes

- 29 -

3. TECHNICAL BRIEF

SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by two linear regulators

• SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g. organizer functions, games, MP3 decoding) possible.

• SDBB has high efficiency up to 95% and also a power save mode.

• Memory Interface is directly supported by the SDBB

• SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.

• For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up withpower being supplied by the other linear regulator. SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of 8 Ohm for usage in hands-free phones and for ringing

• 450 mW maximum output power

• adjustable gain

• mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

• click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

• Precharge current source with two current levels

• Constant current / constant voltage charging with 3 different termination voltages

• Programable charge current limitation for use with different batteries

• Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage charging phase

• Top-off charge current sensing SM-POWER completes the USB interface of S-GOLD

• Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection

• Switch to supply USB pull-up resistor

• Mini-host pull down resistor functionality

• Charge pump with internal switching capacitor for USB host VBUS supply voltage SM-POWER fully supports LED and Vibra Motor functionality

• no external components needed

• driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM dimming

• two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour

• driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation

LGE Internal Use Only

SMPOWER offers several control functions

• Power-on Reset Generator with logic state machine

• I2C bus interface

• I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN (wake-up by Bluetooth) inputs

• Programable interrupt channels to handle peripherals like SIM, MMC and USB

• Monitoring of charging functions

• Undervoltage Shut-Down

• Errorflags (volatile or non-volatile) from many power-supply functions and thermal sensor in order to debug system

• Overtemperature Shut-Down

• Overtemperature Warning

• Support of S-GOLD standby power-down concept

• Support of S-GOLD Power-Down Pad Tristate Function

[Table 3.3.1-1] LDO Output Table of SM-Power3

- 30 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

LDO Net name Output Voltage Output Current Usage

SD1 1V35_Core 1.35V 600mA Core & for LDO

SD2 1V8_SD 1.8V 300mA Memory

VAUX 2V85_VFM 2.85V 100mA FM RADIO

VIO 2V62_VIO 2.62V 100mA Peripherals

VSIM 2V9_SIM 2.9V 70mA SIM card

VMME 2V9_VMME 2.9V 150mA u-SD

VUMTS 2V85_VCD 2.85V 110mA LCD

VAUDIOa 2V5_VAUDA 2.5V 200mA Stereo headset, Mono earpiece

VAUDIOb 2V5_VAUDB 2.5V 50mA Analog parts of S-Gold

VRF1 2V85_VRF 2.85V 150mA 2.85 V supply for SMARTi-PM RF transceiver

VRF2 1V5_VRF 1,53V 100mA 1.5 V supply for SMARTi-PM RF transceiver

VRF3 2V855_VBT 2.7V 150mA Bluetooth

VPLL 1V35_VPLL 1.35V 30mA S-GOLD3H PLL

VRTC 2V11_RTC 2.11V 4mA Real Time Clock

VAFC 2V7_VRF 2.65V 5mA Not used

VVIB 2V8_VAMP 2.8V 140mA AUDIO AMP

- 31 -

3. TECHNICAL BRIEF

LGE Internal Use Only

[Figure3.3.1-1] SM-Power 3 Circuit Diagram

1V8_SD

2V5_VAUDA

C223 10u

PMIC

2V5_VAUDB

2.2u 2.2u

C224 10u 16081608

C215C214

C222

0.1u

RTC_OUT ON_OFF2

2V85_VFM

R209

27K

R212

DNI

USB_OEn

USB_DAT_VP

USB_SE0_VM

VBAT

FB201

PM_VCXO_EN

1608

BT_VCXO_EN

C216 1u

C219

4.7u 1608

RB521S-30

PMRSTn

D204

VBAT

USB+

USB-

PMRSTn

L202

10uH

2.2uC227

C225

C226

2.2u

0.1u

1608

VUSB

VBAT

C203

2.2uC204

2.2u 1608

1608

R235 100K

0.1u

C210

B7

B5

A2

A4

B2

B3

C3

A3

C5

B6

C4

AC-

AC+

OE_N

VUSB

DAT_VP

SE0_VM

B1

RCV

C2

VPIN

D3

VMIN

C1

D+

D2

D-

E3

RESET_N

D1

RESET2_N

E2

SLEEP1_N

E1

SLEEP2_N

F2

VAUDIOA

F1

VDDAUDIOA

G2

VDDAUDIOB

G1

VAUDIOB

H2

VAUX

H1

VDDAUX

J1

SU1_GATE

J2

SU1_GND

H3

SU1_FB

J3

SU1_ISENSE

K1

VDDSD2

K2

SD2_FB

L2

SD2_FBL

4.7uC228

1608

SUSPEND

VDD_USB

MONO_INP

MONO_INN

VDD_MONO

A5

VREFEX_M

VSS1

C6

C201

0.1u

A7

C7

VSS_MONO

MONO_OUTP

VSS2

VSS3

D4

D5

1%

A6

MONO_OUTN

VSS4

VSS5

D6

D7

VSS6E4VSS7E5VSS8

D8

1V35_VPLL

VBAT

2V62_VIO

MAIN_KEY_LED

MAIN_KEY_EN

1u

4.7KR215

4.7KR214

2.2u

C209

C207

C208

C9

FLASH_ON

VSS11

E8

R213 4.7K

1608

TP202

TP203

L1

A11

A10

B4

B11

B9

K3

B10

TXONPA

VSS12

E9

A1

J4

VIO

VPLL

VSD2

PUMS2

PUMS3

PUMS1

OUTPORT

VDDPLLIO

U202

PMB6821

VSS17

VSS18

VSS19

VSS20

VSS21

VSS22G6VSS23

VSS13

F3

F4

VSS24

VSS14

VSS15

VSS16

F7

F8

F9

F5

F6

G3

G4

G5

G7

G8

1u

100K

R219

C212

C8

B8

A9

VREF

RREF

FLASH_SHINK

VSS10

VSS9

E7

E6

WDOG

TP204

L3

WDOG

POWER_ON

VSS25

VSS26

H5

G9

PWRON

ON_OFF2

TP205

L4

L5

ON_OFF1K4ON_OFF2

VSS27

VSS28

H6

H7

RESOURCE_CTRL

J5

K5

ON_OFF_OUT

RESOURCE_CRTL

VSS29

VSS30

J6

SPOWER_INT

SDA_PMIC

SCL_PMIC

R216

4.7K

J7

K6

I2C_INT

I2C_CLK

I2C_DAT

D9

H8

2V62_VIO

TP206

L6

VSS_SD1

TP207

K7

BL1_PWM

VSS_SD2H4VSS_VREF

R217

4.7K

TP208

J8

BL2_PWM

BL3_PWM

L7

CH_CNTRL

L8

K8

CHARGE_UC

CH_SOURCE

VBAT

K9

L9

K10

SENSE_IN1

VDD_CHARGE

J9

VDD_REF

SENSE_IN2

C202

C205 33u

0.1uC211

TP209

L11

A8

VSD1

VLED

VDDMME

VDDRF2

VDDRF13_AFC

VDDSIMVIB

VDDUMTS

VDDSD1 SD1_FB

SD1_FBL

KDR331V

2

3

1

1u

D202

L201 10uH

D203

C11

VMME

C10

D10 D11

VRF2

E10

VRF3

E11

F10

VRF1

F11

VVIB

G11

G10

VSIM

H11

VAFC

H10

VRTC

FB202

H9 J11

VUMTS

K11 J10 L10

C220

4.7u 1608

SDB0530

FB203

OVP_VUSB

1608

OVP_VCHG

R233

47K

TA_DETECT

R234

47K

C233 1u

2V11_RTC

2V85_VRF

C235

2V9_VSIM

1V5_VRF

2V9_VMME

1V8_SD

2V85_VBT

C239

C237

C238

C236

2.2u2.2u

C240

C241

2.2u

2V7_VRF

C234 1u

1V35_CORE

2V8_AMP

2V85_VLCD

VBAT

1608

10uC218

10uC221

10u

1608

4.7uC231

C232

C217

1u

C230 4.7u

C229 2.2u

- 32 -

3. TECHNICAL BRIEF

3.3.2 Charging control

• KP275C is use external charging IC

• Charging IC is ISL9221

1. Charging method : CC-CV

2. Charger output voltage : 5.1 V

3. Charging time : 2h 10m

4. Charging current : 600 mA

5. CV voltage : 4.2 V

6. Cutoff current : 117 mA

7. Full charge indication current (icon stop current) : 117 mA

8. Recharge voltage : 4.15 V

9. Low battery alarm a. Idle : 3.45 V ~ 3.31 V b. Dedicated : 3.45 V ~ 3.3 V

10. Low battery alarm interval a. Idle : 3 min b. Dedicated : 1 min

11. Switch-off voltage : 3.31 V

12. Charging temperature adc range a. ~ -20°C : low charging voltage operation (3.6 V ~ 3.9 V) . b. -20°C ~ 60°C : standard charging (up to 4.2 V) c. 60°C~ : low charging voltage operation (3.6V ~ 3.9V)

LGE Internal Use Only

Only for training and service purposes

[Figure 3.3.2-1] Charging IC (ISL9221)

CHARGING IC

_EOC

CHG_EN

USB_VCHG

VCHG

2V62_VIO

R226

100K

_PPR

2V11_RTC

R227

100K

C242

U203

1

2

3

4

5

6

C243

1u

R228

1u

4.7K

1%

VDC

VUSB

_PPR

_CHG

_EN

IMIN

ISL9221

PGND

VDC_BYP

BAT

USB_BYP

IVDC

GND

IUSB

378mA 600mA117mA

13

12

11

10

9

8

7

R230

18K

1%

VBAT

OVP_VCHG

OVP_VUSB

R229

11.3K

1%

C244 1u

C245 1u

C246 1u

- 33 -

3. TECHNICAL BRIEF

LGE Internal Use Only

[Figure 3.3.2-1] Block diagram of Charging IC

[Table 3.3.2-1] PIN description of Charging IC

NAME PIN TYPE DESCRIPTION

VDC 1 AI Input pin from car adapter or AC/DC adapter

VUSB 2 AI Input pin from USB host device

VDC_LDO 12 AO Output pin of Linear Regulator

USB_SYP 10 AO Output pin from USB bypass circuitry

IVDC 9 AI Battery current setting pin for adapter power

IUSB 7 AI Current setting pin for USB power

IMIN 6 AI End-of-charge current setting pin

BAT 11 AO Output pin to battery

EN 5 DI Active low charge enable pin

PPR 3 OD Active low power present indicator pin

CIIC 4 OD Active low charging indication pin

GND 8 G Ground pad

- 34 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

[Figure 3.3.2-2] Charging Profile

- 35 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.4 Power ON/OFF

KS360 series Power State : Defined 3cases as follow

Voltage level of PWRON pin is high before push the END_KEY button. If push the END_KEY button, voltage level of PWRON pin is change from high to low. ON_OFF1 is a power-on input for SM-POWER3 with active low levels.

[Figure 3.4-1] Remote power on and End-key power on circuit

2V11_RTC

Remote Power On

3.3M

RPWRON_EN

END_KEY

R207

C206

2.2u

END_KEY_IN

R223

10K

2

R225 100K

2

R210

3.3M

R220 10K

R221 DNI

3

Q203 KTC4075E

1

3

Q201 KTC4075E

1

R218

100K

R202 100K

3

2

1

END_KEY_IN

KEYIN0

KEYOUT0

R208 0

Q202 KTC4075E

PWRON

RPWRON_DBB

PWRON

WDOG

TP204

TP203

L3

K4

K3

L4

WDOG

ON_OFF1

POWER_ON

ON_OFF2

RESOURCE_CTRL

TP205

J5

L5

ON_OFF2

ON_OFF_OUT

RESOURCE_CRTL

LGE Internal Use Only

Only for training and service purposes

3.5 SIM Interface

KP275C supports 1.8V & 2.9V plug in SIM. SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with S-Gold3H-LC and the SIM power supply enabled by PMIC.

SIM Interface

SIM_CLK : SIM card reference clock SIM_RST : SIM card Async /sync reset SIM_IO : SIM card bidirectional reset

3. TECHNICAL BRIEF

- 36 -

[Figure 3.5-1] SIM Circuit

SIM CONNECTOR

SIM_DATA

2V9_VSIM

R317

10K

C323

22p

2V9_VSIM

J301

4

C5

5

C6

6

C7

10

GND4

9

C1 C2

C3 GND1 GND2GND3

1 2 3 7 8

2V9_VSIM

C322

0.1u

C324

22p

SIM_RST SIM_CLK

C325

DNI

- 37 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.6 MICRO SD connector

The Micro SD Memory Module has eight exposed contacts on one side. The S-Gold3H-LC connected to the module using a dedicated eight-pin connector

[Figure 3.6-1] Micro SD Connector

MICRO SD Connector

2V62_VIO

56KR323

56KR324

2V9_VMME

56KR325

2V9_VMME

MMC_D1

MMC_D0

MMC_CLK

MMC_CMD

MMC_D3

MMC_D2

MMC_DETECT

C329

1u

R322 100K

C330

DNI

R327 56K

C331

DNI DNI

C332

C333

DNI

R326 56K

C334

C335

DNI

10p 1u

C336

DNI

C337

S301 AXA463062P

DAT1_2 DUMMY1 DAT0 VSS CLK VDD CMD CD_DAT3 DUMMY2 DAT2 DETECT_A DETECT_B DUMMY3

GND

- 38 -

3. TECHNICAL BRIEF

3.7 Memory

1Gbit NAND Flash & 512Mbit DDR SDRAM employed on KP275C with 16 bit parallel data bus thru ADD(0) ~ ADD(24). The 1Gbit Nand Flash memory with DDR SDRAM stacked device family offers multiple high-performance solutions.

LGE Internal Use Only

Only for training and service purposes

[Figure 3.7-1] Memory circuit diagram

1G NAND(Large Block x16bit) +512M DDR SDRAM

C139

1V8_SD

ADD(16:28)

_RD _NAND_CS _RAM_CS

SDCLKI SDCLKO CKE ADD(17) ADD(16) _WR _CAS _RAS LDQS UDQS _BC1 _BC0 _WR ADD(29) ADD(30)

DATA(0:15)

1V8_SD

R108 10K

FCDP

IO10 IO11 IO12 IO13 IO14 IO15 IO16

NC46 NC47 NC48 NC49 NC50 NC51 NC52 NC53 NC54 NC55 NC56 NC57 NC58 NC59 NC60 NC61 NC62 NC63 NC64 NC65 NC66 NC67 NC68 NC69 NC70 NC71

_WP

RY__BY

_CLK

CLK CKE CLE ALE

_WEN

_CAS

_RAS LDQS UDQS

UDQM LDQM

_WED

BA0 BA1

TP102

ADD(16)

D4

A0

ADD(17)

E4

A1

ADD(18)

F4

A2

ADD(19)

G4

A3

ADD(20)

G8

A4

ADD(21)

F8

A5

ADD(22)

E8

A6

ADD(23)

D8

A7

ADD(24)

D9

A8

ADD(25)

G7

A9

ADD(26)

G5

A10 A11 A12

IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9

_RE _CE _CS

ADD(27)

F7

ADD(28)

E7

TP103

DATA(0)

P10

DATA(1)

N10

DATA(2)

M10

DATA(3)

L10

DATA(4)

F10

DATA(5)

E10

DATA(6)

D10

DATA(7)

C10

DATA(8)

N11

DATA(9)

M11

DATA(10)

L11

DATA(11)

K11

DATA(12)

G11

DATA(13)

F11

DATA(14)

E11

DATA(15)

D11

K2 K4 K5 K8 K9 K10 L2 M2 N2 P1 P2 P3 P11 P12 R1 R2 R3 R10 R11 R12 T1 T2 T3 T10 T11 T12

10KR106

N3

TP104

F3

TP105

G3

TP106

D5 E3 C6 C7

TP107

D7

TP108

K3 L3

TP109

M3 E6 F6 L6 L7 K7 K6 D6 E5 F5

ADD(0:15)

1V8_SD

C134

C133

0.1u

1V8_SD

C137

C138

0.1u

C140

0.1u

ADD(0) ADD(1) ADD(2) ADD(3) ADD(4) ADD(5) ADD(6) ADD(7) ADD(8) ADD(9) ADD(10) ADD(11) ADD(12) ADD(13) ADD(14) ADD(15)

C135

0.1u

1V8_SD

TP101

L4

M4

N4 L5

M5

N5

M6

N6

M7

N7 L8

M8

N8 L9

M9

N9

A1 A2

A3 A10 A11 A12

B1

B2

B3 B10 B11 B12

C1

C2

C3 C11 C12

D1

D2

D3

E2

E9

F2

F9

G6

G9 G10

H3

H4

H5

H6

H7

H8

H9 H11

J2 J3 J4 J5 J6 J7 J8

J9 J10 J11

C4 C8 P6

P4

P8

H2

C5

C9

G2

H10

P5 P7 P9

DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15

NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20 NC21 NC22 NC23 NC24 NC25 NC26 NC27 NC28 NC29 NC30 NC31 NC32 NC33 NC34 NC35 NC36 NC37 NC38 NC39 NC40 NC41 NC42 NC43 NC44 NC45

VCCD1 VCCD2 VCCD3

VCCQD1 VCCQD2

VCCN1

VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7

TY9000A000TMGFU102

- 39 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.8 LCD Display

LCD module include:

- Main LCD: 2.0” 176x220 QCIF, 262K color TFT

- Backlight : 3 piece of white LED

[Figure3.8-1] LCD circuit diagram

LCD_D0 LCD_D1 LCD_D2 LCD_D3

LCD_D4 LCD_D5 LCD_D6 LCD_D7

LCD_VSYNC

_LCD_CS1

LCD_CD

_LCD_WR

2V8_AVDD

varistor

VA305

FL301 ICVE10184E150R101FR

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

FL304 ICVE10184E150R101FR

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

FL305 EVRC14S03Q030050R

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

1V8_CAMCORE

C316

0.1u

varistor

VA306

5

C317

0.1u

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

G15G2

10

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

G110G2

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

G15G2

10

9 8 7 6

9

8

7

6

SPK_RCV_N

SPK_RCV_P

C318

39p

KEYIN3 KEYIN4

KEYIN5 KEYOUT3 KEYOUT2 KEYOUT1

KEYOUT5

END_KEY

C319 39p

varistor

VA307

varistor

VA308

CN302

G1 G2

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

G3 G4

2V85_VLCD

FB308

1000

VBAT

C307 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37

C308

18p

0.1u

LCD_ID

C311

22p

MOTOR_P

MLED MLED1 MLED2 MLED3

UPPER_KEY_LED

CAM_DATA_OUT7 CAM_DATA_OUT6 CAM_DATA_OUT5 CAM_DATA_OUT4 CAM_DATA_OUT3 CAM_DATA_OUT2 CAM_DATA_OUT1 CAM_DATA_OUT0

CAM_VSYNC CAM_HSYNC

SDA

SCL

CAM_MCLK_IN CAM_PCLK_OUT

varistor

VA303

47R310

_LCD_RESET

varistor

VA304

VT_PWR_EN

VT_CAM_RESET

70 pin main connector

ATX570124

3.9 Keypad switching & scanning

The keypad interface is a peripheral which can be used for scanning keypads up to 8 rows (outputs from Port Control Logic) and 8 columns (inputs to PCL). The number of rows and columns depend on settings of the PCL.

- 40 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

[Figure 3.9-1] Number key circuit diagram [Figure 3.9-2]

Function key circuit diagram

KEY PAD

KEYIN3

VA801

EVLC5S0250

VA802

MENU

LEFT

SOFT802

CALL

EVLC5S0250

KEYIN4

DOWN

VA803

UP

OK

EVLC5S0250

KEYIN5

SOFT801

RIGHT

SOFT803

END_KEY

VA805 EVLC5S0250

VA806 EVLC5S0250

VA807 EVLC5S0250

VA808 EVLC5S0250

END

VA804 EVLC5S0250

VBAT

KEYOUT1

KEYOUT2

KEYOUT3

KEYOUT5

NUMBER KEY PAD

KEYIN0

KB_STAR

KEYIN1

301

4

304

7

307

*

21

302

5

8

308

0

310

KEYIN2

3

303

6

306305

9

309

#

KB301

KEYOUT1

KEYOUT2

KEYOUT3

KEYOUT5

3.10 keypad back-light illumination

3.10.1 Number keypad back-light illumination

There are 2 snow white color LEDs on Key for keypad illumination. Keypad Back-light is controlled by SMPower3 Flash LED port which has constant current control function. The whole configuration of the SMPOWER3 Flash LED drivers is shown in below Figure.

- 41 -

3. TECHNICAL BRIEF

LGE Internal Use Only

[Figure 3.10.1-1] LED driver in the SM-POWER3

[Figure 3.10.1-2] Number key back-light LED circuit diagram

KEY BACKLIGHT

MAIN_KEY_LED

R316

100ohm

100ohmR319

LD301

C

2

SSC-SWTS1007

LD302

C

2

SSC-SWTS1007

VBAT

A

1

A

1

C321

0.1u

- 42 -

3. TECHNICAL BRIEF

3.10.2 Function KEY back-light illumination

S-GOLD3H-LC is control the Tr for Function KEY back-light illumination.

LGE Internal Use Only

Only for training and service purposes

[Figure 3.10.2-1] Function KEY back-light LED circuit diagram

VBAT

SUB KEY LED

C803

1u

UPPER_KEY_LED

R801

LD801

LEBB-S14E

EVLC5S02100

VA812

LD802

R802

150

LD803

LEBB-S14E

R803

150

1KR809

R810 10K

LD804

LEBB-S14E

R804

150150

Q801

KTC4075E

LD805

LEBB-S14E

R805 150

LEBB-S14E

EVLC5S02100

VA813

LD806

R806

150

LD807

LEBB-S14E

R807 150

LD808

LEBB-S14E

R808

150

C804 1u

LEBB-S14E

3.11 LCD back-light illumination

SC624 is high efficiency charge pump LED driver using Semtech’s proprietary mAhXLife technology. The load and supply conditions determine whether the charge pump operates 1X, 1.5X, or 2X mode. SC624 also provides two low-drop out, low-noise linear regulators for powering a camera module or other peripheral circuits.

- 43 -

3. TECHNICAL BRIEF

LGE Internal Use Only

[Figure 3.11-1] LCD charge pump circuit diagram

BACKLIGHT CHARGE PUMP

VBAT

1V8_CAMIO

FB204

C248

4.7u

MLED1 MLED2 MLED3 MLED_CLDO_CTRL

C249

1u

1 2 3 4 5

C2PGND NC1 BL1 BL2

C247

1u

20

21

THER_GND

U204 SC624ULTRT

6

19

C1-

BL3

7

VIN

BL4

18

C1+

AGND

8

17

9

16

C2+

VOUT

GREF

NC2

10

LDO1 LDO2

BYP NC3

SWIF

15 14 13 12 11

C250

2.2u

MLED

C251

C259 22n

2V8_AVDD

FB206

1u

1V8_CAMCORE

FB205

FB207

C252

2.2u

2V62_VIO

R232

DNI

R231

DNI

- 44 -

3. TECHNICAL BRIEF

3.12 Battery voltage monitor

S-Gold3H-LC is monitor battery capacity with ADC port.

LGE Internal Use Only

Only for training and service purposes

[Figure3.12-1] Battery voltage monitor circuit diagram

VBAT

BAT_ID

RF_TEMP

R102 390K

(1%)

R103 100K

(1%)

JACK_TYPE

R131

PCB_VERSION

24000ohm

(1%)

PA_LEVEL

F3 G4 E2 D1

F4 E3 D3 E4 D2 D4

F5

P4

M8

M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 M10

PAOUT1_1 PAOUT1_2

- 45 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.13 Audio

KP275C Audio signal flow diagram as following diagram.

[ Figure 3.13-1] Audio signal flow diagram

AN

FM RADIO

RADIO_OUT_L

RADIO_OUT_L RADIO_OUT_R

RADIO_OUT_R

HS_L

32

I2C

EPPA1

EPPA1 EPPA2

EPPA2

EPP1

EPP1 EPN2

EPN2

I2C

K

HS_L HS_R

HS_R

REC_P

REC_P REC_

REC_

I2C

T

AMP

N

Ear-Phone

RCV/SPK

S-Gold3H

- 46 -

3. TECHNICAL BRIEF

3.13.1 Audio amplifier

MAX9877 combines a high efficiency Class D audio power amplifier with a stereo Class AB capacitorless Direct Drive headphone amplifier. MAX9877 del KP275C use external AMP(MAX9877). ivers up to 725mV from a 3.7V supply into an 8ohm load with 87% efficiency to extend battery life.

LGE Internal Use Only

Only for training and service purposes

[Figure 3.13.1-1] Audio AMP circuit diagram

AUDIO AMP

RADIO_OUT_R

RADIO_OUT_L

HS_R

HS_L

C423 39p

REC_P REC_N

C4301uC431 39p

C424 39p

39p

C416 1u C420 1u

SDA SCL

VBAT

C403

1uC407

A3

A4

1uC411

A5

1uC412

D1

1uC415

D2

C1 C2

B2

B3 C3

2.2R405 D4

2.2R406

B4

C429

1u

C1N

C1P

INA2 INA1

INB2 INB1

BIAS

SDA SCL

RXIN+ RXIN-

VSS

U401 MAX9877AEWP_TG45

GND

D3

C404

4.7u

B1

C5

VDD

PVDD

PGND

C4

HPR

HPL

OUT+

OUT-

A1

A2

C417

D5

B5

C427 C428 39p

C418 39p39p

39p

HSO_R

HSO_L

SPK_RCV_P SPK_RCV_N

3.13.2 Microphone circuit

3.13.3 Headset circuit

- 47 -

3. TECHNICAL BRIEF

LGE Internal Use Only

[Figure 3.13.2-1] Microphone circuit diagram

[Figure 3.13.3-1] Headset circuit diagram

MAIN MIC

MIC401

6

G4

5

PWR

4

G3

3

G2

2

G1

1

OUT

SPM0204LE5-QB

VMIC_P

100nH

L401

C421

39p

C408

10u 1608

C413

39p

C409

39p

C422

39p

C410 DNI

0.1uC414

VMIC_GND

MAIN_MIC_N

0.1uC419

MAIN_MIC_P

VMIC_GND

18PIN MULTIPORT RECEPTACEL

2V5_VAUDB

R307

1.5K

HS_MIC_N

HS_MIC_P

22nC309

R308 2.2K

22nC310

C312

39p

HSO_L HSO_R

C313 10u

C314 39p

FB303 1800

C315 39p

1800FB301

PRSB6.8C

VA301

PRSB6.8C

VA302

JACK_TYPE

MULTI_PORT_0 MULTI_PORT_1

JACK_DETECT

RPWRON_EN

UART_TX UART_RX

VBAT

USB_VCHG

FL302

100nH

C301

1u

GND1 GND2

IN OUT

NFM18PC104R1C3

24pC306

1800FB302

1800

1800FB306

1800FB307

2V62_VIO

10KR306

10K

100KR304

R303

L302

FB304 1800

DSR

FB305

VCHG

FL303

C302 1u

A_MON_TX

C303

C304

NFM18PC104R1C3

39p

1u

A_MON_RX

GND1 GND2

IN OUT

DNIR333

R334 DNI

FOR RADIO

L301 270nH

CN301

21 19

1 2

2 : Headset MIC

3

3 : Jack type 4 : HSO_L

4

5 : HSO_R

5

6 : USB+/Remote_INT/MON_TXD

6

7 : USB-/Remote_ADC/MON_RXD

7

8 : JACK_D

8 9

9,10 : BATT

10

11 : R/ON

11 12

12,13 : CHG

13

14 : DSR

14

15 : VUSB

15

16 : UART_TX

16

17 : UART_RX

17

18 20 22

C305 10p

FM_ANT

R305

DNI

Short = KP270

DNI = KP275 series

3.14 BLUETOOTH

3.14.1 General Description

The Broadcom BCM2046 is a monolithic single-chip, Bluetooth 2.1-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver. It employs the highest level of integration and eliminates all critical external components, thus minimizing the footprint and implementation cost of Bluetooth solution. The BCM2046 is the optimal solution for any voice and/or data application that that requires the Bluetooth SIG standard HCI Controller interface (HCI) via USB, UART, or H5 and PCM audio interface support . The BCM2046 radio transceiver provides enhanced radio performance to meet the most stringent industrial temperature applications or the tightest intergration into mobile handsets and portable devices. It is fully compatible with any of the standard TCXO frequencies and provides full radio compatibility to operate simultaneously with GPS and cellular radios.

- 48 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

[Figure 3.14.1-1] Bluetooth Circuit Diagram

BLUETOOTH_BC

ANT401

NC1

FEED

NC2

L402 NA

0R422

C446 DNI

CLK32K

FL403

IN OUT

GND1 GND2

LFB212G45SG8A166

R419 47K

R423

100K

BT_CLK

CLK_FM

BT_VCXO_EN

BT_INT

DBB_BT_INT

10pC445

C450 10p

R413 150K

1000pC449

TP408 TP409

1V8_SD

FB403

C440

0.1u

Close to VDDO

(1%)

J3

RES

C1

RFIOP

E1

RFION

D1

RFTUNE

470pC447

J2

VCTRIFP

J5

XTAL_P

J4

XTAL_N

A5

LPO_IN

A9

SCL_TX_PU_TDO_N

A8

SDA_TX_PU_TDO

H7

GPIO7_TX_PU_TDDN_TX_PU_TDO_USB

H8

PA_CTL_GPIO6_TX_PU_TDD_TX_PU_T

G9

XTAL_PD_GPIO5_TX_PU_TDO_TX_PU_

F9

RF_ACTIVE_GPIO4

E9

BT_PRIORITY_STATUS_GPIO3

A6

TX_CONFX_WLAN_ACTIVITY_GPIO2

B6

HOST_WAKE_USB_DETACH_GPIO_1

B5

BT_WAKE_GPIO_0

Close to VDDR3V

A7

B7

VDDC1

VDDC2

VSS1

C2

H9

VDDO1

VSS2

D2

2V85_VBT

C434

2.2u

J9

D5

FB401

Close to VREG1 Close to VDDVCO

BT_LDO_EN

TP402

DNIR409

G8

A4

H1

A3

A2

B3

VREG1

VDDO2

VDDR3V

VDDVCO

VREG_CTL

VDDO_USB

VREG2_VBAT

U403

BCM2046SB1

PCM_OUT_SPDIF_OUT_SD_OUT

VSS4

VSS5E2VSS6

E4

VSS7E6VSS8

E5

F1

VSS9

VSS10

F2

VSS3

D6

FB402

C435

2.2u

0R410

A1

J1

G1

G2

B1

H4

VDDIF

VDDTF

VDDLO

VDDXO

VDDIFP

VDDPLL

PCM_CLK_SCK

PCM_IN_SPDIF_IF_SD_IN

PCM_SYNC_TX_PU_TDO

UART_CTS_N UART_RTS_N

VSS11

VSS12

VSS13

VSS14

VSS15

F4

F5

F6

H2

H3

C436 1u

B2

VDDRF

UART_RXD UART_TXD

HUSB_DN

HUSB_DP

RST_N

TST1

C438

C437

2.2u

0.1u

Close to VDDIFP

BT_RESETn

0R417

0R420

1V8_SD

FB404

BT_PCM_CLK BT_PCM_TX BT_PCM_RX

BT_PCM_SYNC

BT_UART_RTS BT_UART_CTS BT_UART_TX BT_UART_RX

C442

2.2u

Close to VDDTF

TP403

B4 H5

TM2 TM1 TM0

H6 J6 D4

F8 E8 D9 D8

C8 C9 B9 B8

J8 J7

(256KHz)

R418 0

R421 0

TP404 TP405 TP406

TP407

- 49 -

3. TECHNICAL BRIEF

LGE Internal Use Only

FEATURES

-Bluetooth 2.1 compliant with enhanced data rate support

-class 1 capable with built-in PA

-Programmable output power control meets Class1, Class2, or Class3 requirements

-Use supply voltages up to 5.5V

-Internal OR gate TCXO control

-Fractional-N synthesizer supports frequency references form 12MHz to 40 MHz

-Lower Power consumption

-Standard PCB and module package types available

-ARM7TDMI-S- Based microprocessor with intergrated ROM and RAM.

-supports mobile and PC applications without external memory

APPLICATIONS

-Mobile handsets and smart phones

-Personal digital assistants

-Desktop and Laptop personal computers

-Automotive telematic systems

-Computer peripheral devices (PCMCIA cards, CF cards, and USB dongles)

- 50 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

[Figure 3.14.1-2] Bluetooth Block Diagram

XMM6070

I2S1ís

USIF2ís

BT_INT

DBB_BT_INT

KT22M- ECW29A- 26.000

BT_CLK

VC- TCXO

(26MHz_BT)

MC- 146

X- TAL

(32. 768KHz)

BT_CLK

CLK32K

PCM

UART

BCM2046SB1

BT_PCM_TX

BT_PCM_RX

BT_PCM_SYNC

BT_PCM_CLK

BT_UART_TX

BT_UART_RX

BT_UART_RTS

BT_UART_CTS

HOST_WAKE_GPIO_1

BT_WAKE_GPIO_0

XTAL_P

LPQ_IN

XTAL_PD_GPIO5

LFB212G45SG8A

BPF

2V85_VBT

1V8_SD

BT ANT

PMB6821

BT_VCXO_EN

PMB6952

BT_VCXO_EN

Chip

Antenna

- 51 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.15 FM Radio

3.15.1 General Description

The Si4702 integrates the complete tuner function from antenna input to stereo audio output for FM broadcast radio reception.

FM RADIO

FM_ANT

FM_RESET

AUDIO AMP

RADIO_OUT_R

RADIO_OUT_L

HS_R HS_L

REC_P REC_N

C423 39p

C430 39p

C441 100p

C424 39p

C431 39p

CLK_FM

C416 1u C420 1u

SDA SCL

SCL SDA

1uC412 1uC415

2.2R405

C429

FM_INT

TP401

19

18

17

20

21

NC2

PGND

GPIO1

GPIO2

U402

_SEN

SCLK

SDIO

6

7

8

9

VBAT

C403

1u

B1

A3

VSS

VDD

U401 MAX9877AEWP_TG45

GND

D3

GPIO3

RCLK

1

NC1

2

FMIP

3

RFGND

4

GND1

5

_RST

SI4702-C19-GM

R414

10K

1uC407

A4

C1N

1uC411

A5

C1P

D1

INA2

D2

INA1

C1

INB2

C2

INB1

B2

BIAS

B3

SDA

C3

SCL

D4

RXIN+

2.2R406

B4

RXIN-

1u

C4

16

VA

VIO

10

C5

PGND

GND3 LOUT

ROUT

GND2

PVDD

2V62_VIO

C439

1u

15 14 13 12 11

VD

1V8_SD

C448

0.1u

C404

4.7u

A1

HPR

A2

HPL

D5

OUT+

B5

OUT-

C443 22n

C417

C427 C428 39p

RADIO_OUT_L RADIO_OUT_R

HSO_R

HSO_L

C418 39p39p

SPK_RCV_P SPK_RCV_N

39p

- 52 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

[Figure 3.15.1-1] FM Radio Circuit Diagram

18PIN MULTIPORT RECEPTACEL

2V5_VAUDB

R307

1.5K

HS_MIC_N

HS_MIC_P

22nC309

R308 2.2K

22nC310

C312

39p

HSO_L

HSO_R

C313 10u

VCHG

C304

C303

NFM18PC104R1C3

1u

39p

C314 39p

FB303 1800

C315 39p

1800FB301

PRSB6.8C

VA301

PRSB6.8C

VA302

JACK_TYPE

MULTI_PORT_0 MULTI_PORT_1

JACK_DETECT

RPWRON_EN

UART_TX UART_RX

VBAT

USB_VCHG

FL302

100nH

C301

1u

GND1 GND2

IN OUT

NFM18PC104R1C3

24pC306

1800FB302

1800

1800FB306

1800FB307

2V62_VIO

10KR306

10K

100KR304

R303

L302

FB304 1800

DSR

FB305

FL303

C302 1u

A_MON_TX

A_MON_RX

GND1 GND2

IN OUT

DNIR333

R334 DNI

CN301

FOR RADIO

L301 270nH

21 19

1

2

3

4

5

6

7

8

9

10 11 12 13 14 15 16 17

18 20 22

R305

C305 10p

DNI

Short = KP270

DNI = KP275 series

2 : Headset MIC 3 : Jack type

4 : HSO_L 5 : HSO_R 6 : USB+/Remote_INT/MON_TXD 7 : USB-/Remote_ADC/MON_RXD 8 : JACK_D

9,10 : BATT

11 : R/ON

12,13 : CHG

14 : DSR 15 : VUSB 16 : UART_TX 17 : UART_RX

FM_ANT

BT

FM

32K

RADIO_OUT_L

RADIO_OUT_R

Ear-

Phone

32K

FM_reset

SDA/SCL

Audio AMP

RCV/SPK

S-GOLD 3

26M

- 53 -

3. TECHNICAL BRIEF

3.15.2 Features

- Worldwide FM band support (76-108 MHz)

- Digital low-IF receiver

- Frequency synthesizer with integrated VCO

- Seek tuning and Volume control

- Automatic frequency control (AFC) and Automatic gain control (AGC)

- Excellent overload immunity

- Signal strength measurement

- Programmable de-emphasis (50/75 µs)

- Adaptive noise suppression

- Line-level analog output

- 32.768 kHz reference clock and integrated crystal oscillator.

- 2-wire and 3-wire control interface

- Integrated LDO regulator allows direct connection to battery

- Integrated crystal oscillator

LGE Internal Use Only

- 54 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

3.16 CAMERA connector

3.16.1 Main & VT camera Block diagram

Main Camera Product outline

- Catch Image Size : SXGA ( 1280 x 1024 )

- For the Image data interface, 8Bit parallel data output

- Camera Module is controlled by host DSP ( I2C Communication )

VT Camera Product outline

- Catch Image Size : VGA ( 640 x 480 )

- For the Image data interface, 8Bit parallel data output

- Camera Module is controlled by host DSP ( I2C Communication )

VT_PWR_EN

VT_CAM_RESET

VGA

D0 ~ D7

VSYNC

HSYNC

MCLK

SDA

SCL

CAM_PWR_EN

_CAM_RESET

Camera

1.3 Mega

Camera

- 55 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.17 18PIN Interface connector

[Table 3.17-1] PIN assign

KP275C series MMI

Pin Function Description

1 FM_ANT FM radio antenna / Audio ground

2 HS_MIC Headset microphone signal

3 JACK_TYPE Accessory type detect

4 HS_OUT_L Headset left sound

5 HS_OUT_R Headset Right sound

6 USB_DP/REMOTE_INT USB/ Remote control interrupt

7 USB_DM/REMOTE_ADC USB/ Remote control Key ADC

8 JACK_DETECT Headset detect (active low)

9 VBAT Battery voltage

10 VBAT Battery voltage

11 RPWRON_EN Remote power on (active high. 2.8V)

12 VCHG Charger voltage

13 VCHG Charger voltage

14 DSR DSR

15 USB_VCHG USB VBUS

16 UART_Tx UART TX data

17 UART_Rx UART RX data

18 GND Power GND

3.18 General Description

The PMB 6952 SMARTi 3GE combines the SMARTiPM quad-band GSM/EDGE and SMARTi3G tripleband W-CDMA transceivers in a laminate based PG-TFSGA-121-2 package. A significant circuit board area reduction is achieved compared to using separately packaged transceivers. SMARTiPM is a quad-band transceiver for EGSM900/GSM900/ GSM1800/GSM1900 voice and data applications.

- 56 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

[Figure 3.18-1] Block Diagram of RF part

RF2.8V

FEM(LSHS-C085FB)

TX

900MHz

900MH

RX

VC2

VC3

TX

z

TXON_PA

FEM(LSHS-C085FB)

SAW

Decoder

TQM7M5005

PA_LEVEL

PA_BAND

MODE

Rx RF SAW

W

Rx RF SA

Switch

3G DUPLEXER

3G LN

3G PAM

PA_EN

PA_MO

Rx

T

Tx

x

A

DE

PMB8877

(S-GOLD3)

PA

Control

Hardware

GSM

Timer Unit

RF Control

Unit

26MHz_MCLK

I/IX

Q/QX

TXON_PA

PA_BAND

PA_LEVEL

MODE

ANT_SW

ANT_SW 1

1

ANT_SW2

RF_EN

RF_DA

RF_CLK

VCTCXO

AFC

BT_CL

26MHz_MCLK

VBAT

PMB6821

(SM-Power )

RF1.5V

RF2.85V

EN/DATA/CLK

TXI/TXIX

TXQ/TXQX

PA_EN

PA_MODE

26MHz

K

3-Wire

Bus

interfac

SMARTi 3G

Internal

1.5V LDO

I

Q

3-wire bus

RX PG

FSYS

3-wire bus

PMB6272(SMARTi PM)

ADC

Sigma-Delta

Modulator

e

Fractional

N-PLL

Loop filter

Frac-PLL

C

LF

Frac-PLL

TX gain

control

VCO

3.8GH

LNA

/4

/2

Polar

Modulator

z

o

0

:4

o

90

o

0

:2

o

90

o

0

:2

o

90

o

0

:2

o

90

o

0

:4

o

90

PGA

1800MHz

1900MHz

850/900MHz

1800/1900MHz

VBAT

- 57 -

3. TECHNICAL BRIEF

SMARTiPM features a direct conversion receiver and a quad-band polar modulator transmitter forGSM and EDGE. An analog I/Q baseband interface is provided. The HSCSD and GPRS/EDGE capable synthesizer is fully integrated, including all RF oscillators. A reference oscillator buffer amplifier with three outputs is provided to simplify clock distribution. A three wire bus interface is used for control and programming. SMARTi3G is a triple-band W-CDMA transceiver for voice and high speed data applications. SMARTi3G features a direct conversion receiver and a direct modulation transmitter. Analog I/Q baseband interfaces are supported. A three wire bus interface is provided for control and programming. A second three wire bus may optionally be used for fast control of the receiver programmable gain amplifier. Fractional-N PLL RF synthesizers including separate TX and RX VCOs are fully integrated. Programmable logic outputs are provided to control external low noise amplifiers, power amplifiers, and antenna switches. To avoid interference between the 2.5G and 3G transceivers, simultaneous operation of SMARTiPM and SMARTi3G is not permitted.

LGE Internal Use Only

[Figure 3.18-2] RF Functional Block Diagram

1.71...2.95V Suppl y

1.5V Suppl

2.7...2.95V Suppl y

RXI/RXIX

RXQ/RXQX

ENPGC DATAPGC CLKPGC

FSYSIN_3G

EN / DATA / CLK

TXI/TXIX

TXQ/TXQX

MASTERON

LD

TXHSMODE

XEN

T

TXGC

I/IX

Q/QX

EN_PM DATA_PM CLK_

FSYSIN_PM

FSYSOUT1

FSYSOUT2

FSYSOUT

SMARTi 3G

o

MO

D

Sigma-Delta

MASH Modulat

Dig

PGA

&

m

ent

0

:4

o

90

o

0

:2

o

90

o

0

:2

o

90

o

0

:2

o

90

o

0

:4

o

90

 4

2

NI.NF

or

PGA

1dB

VCO

contro

Integrated

3.8GHz VC

DAC

l

VCO-LDO

O

VCO_RC

 4



2

Bias DAC

PGA

6dB

Internal

1.5V

y

LDO

I

Q

Frac-PLL

3-wire bus

C

RX PG

FSYS

3-wire bus

SMARTi PM

sequencin

PM

ADC

2

ADC

2

3

VCO

LF

VCO

LF

Frac-PLL

TX gain

control

2

3W bus

Bias

g

Q

d/

dt

cordic

I/Q

=>

I

R/

p

26 MHz

2.7...2.95V Supply1.4...1. 6V Supply

.125dBRam

fast

D

CP

PF

multi modulus div ider

Timing

Measure

OLG adjus

t

on chip

er

loop filt

RXINL/RXINLX 869-894 (band V/V I)

RXINH/RXINHX 2110-2170 MHz (band I)

RXINM/RXINMX 1930-1990 MHz (band II/III )

RXBAND1 RXBAND2 RXBAND3

TXOUTM/TXOUTMX 1850-1910 MHz (band II/III)

TXOUTH/TXOUTHX 1920-1980 MHz (band I)

TXOUTL/TXOUTLX 824-849 (band V/VI)

TXBAND1 TXBAND2 TXBAND3

RX1/RX1X 850MHz

RX2/RX2X 900MHz

RX3/RX3X 1800MHz

RX4/RX4X 1900MHz

TX1 850/900MHz

TX2 1800/1900MHz

AS

VBI

- 58 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

[Figure 3.18-3] Schematic of RF Control Signals

MLED_CLDO_CTRL

MMC_DETECT

JACK_DETECT

3G_RX_IP 3G_RX_IN 3G_RX_QP 3G_RX_QN 3G_TX_IP 3G_TX_IN 3G_TX_QP 3G_TX_QN

3G_VGC_TX

TXON_PA

ANT_SEL1

_EOC

PA_MODE ANT_SEL2 ANT_SEL3

DSR

TA_DETECT

CHG_EN

_PPR

PA_LEVEL

2G_IP

2G_IN 2G_QP 2G_QN

R104 22K

2G_EN

2G_DATA

2G_CLK

(1%)

P4

M8

L5 M5 M4

P5

AD15 AE16 AD17 AE17 AE13 AD13 AE14 AD14

AD11 AE11 AE12 AD12

Y8

AB7

V9

AA8

W9

V8

AB3 AB4

W8 AC1 AB5 AB1 AA3 AA1 AC3

W5

W7

W6

PAOUT1_1 PAOUT1_2

BB_I BB_IX BB_Q BB_QX ARXP_I ARXN_I ARXP_Q ARXN_Q ATXP_I ATXN_I ATXP_Q ATXN_Q

ATX_VGA_DAC ATX_PA_DAC ATX_PA_ADC AIREF

T_OUT0 T_OUT1 T_OUT2 T_OUT3 T_OUT4 T_OUT5 T_OUT6 T_OUT7 T_OUT8 T_OUT9 T_OUT10 T_IN0 T_IN1 RF_STR0 RF_STR1 RF_DATA RF_CLK AFC

- 59 -

3. TECHNICAL BRIEF

3.19 GSM Part

3.19.1 GSM Receiver

The constant gain direct conversion receiver contains all active circuits for a complete receiver chain for GSM/GPRS/EDGE (see [Figure 3.19.1-1] ). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced inputs are fully integrated. No interstage filtering is needed. The orthogonal LO signals are generated by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.Down conversion to baseband domain is performed by low/high band quadrature direct down conversion mixers. The baseband chain contains a LNB (low noise buffer), channel filter, output buffer and DC-offset compensation. The 3rd order lowpass filter is fully integrated and provides sufficient suppression of blocking signals as well as adjacent channel interferers and avoids anti-aliasing through the baseband ADC. The receive path is fully differential to suppress on-chip interferences. Several gain steps are implemented to cope with the dynamic range of the input signals. Depending on the baseband ADC dynamic range, single- or multiple gain step switching schemes are applicable. Furthermore an automatic DC-offset compensation can be used (depending on the gain setting) to reduce the DC-offset at baseband-output. A programmable gain correction can be applied to correct for front end- and receiver gain tolerances.

LGE Internal Use Only

[Figure 3.19.1-1] GSM Receiver Part Block Diagram

- 60 -

3. TECHNICAL BRIEF

3.19.2 GSM Transmitter

The GMSK transmitter supports power class 4 for EGSM900 and GSM900 as well as power class 1 for DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N Sigma-Delta synthesizer without any external components (see [Figure 3.19.2-1]). The analog I/Q modulation data from the baseband is converted to digital, filtered and transformed to polar coordinates. The phase/frequency signal is further on processed by the Sigma-Delta modulation loop. The output of its associated VCO is divided by four or two, respectively, and connected via an output buffer to the appropriate single ended output pin. This configuration ensures minimum noise level. The 8PSK transmitter supports power class E2 for EGSM900 and GSM900 as well as for DCS1800 and PCS1900. The digital transmitter architecture is based on a polar modulation architecture, where the analog modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently transformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitude information is fed into a digital multiplier for power ramping and level control. The ready processed amplitude signal is applied to a DAC followed by a low pass filter which reconstructs the analog amplitude information. The phase signal from the CORDIC is applied to the Sigma-Delta fractional-N modulation loop. The divided output of its associated VCO is fed to a highly linear amplitude modulator, recombining amplitude and phase information. The output of the amplitude modulator is connected to a single ended output RF PGA for digitally setting the wanted transmit power.

LGE Internal Use Only

Only for training and service purposes

[Figure 3.19.2-1] GSM Transmitter Part Block Diagram

- 61 -

3. TECHNICAL BRIEF

The PA interface of SMARTi 3GE supports direct control of standard dual mode power amplifiers (PA’s) which usually have a power control input VAPC and an optional bias control pin VBIAS for efficiency enhancement. In GMSK mode, the PA is in saturated high efficiency mode and is controlled via its VAPC pin directly by the baseband ramping DAC. In this way both up- / down-ramping and output power level are set. In 8PSK mode, the ramping functionality is assured by an on-chip ramping generator, whereas output power is controlled by the PGA’s as described above.

3.19.3 GSM RF Synthesizer

The SMARTi 3GE contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma-Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided by the internal crystal oscillator. This frequency serves as comparison frequency of the phase detector and as clock frequency for all digital circuitry. The divider in the feedback path of the synthesizer is carried out as a multi-modulus divider (MMD). The loop filter is fully integrated and the loop bandwidth is about 100 kHz to allow the transfer of the phase modulation. The loop bandwidth is automatically adjusted prior to each slot (OLGA2). To overcome the statistical spread of the loopfilter element values an automatic loopfilter adjustment (ALFA) is performed before each synthesizer startup. The fully integrated quad-band VCO is designed for the four GSM bands (850, 900, 1800, 1900 MHz) and operates at double or four times transmit or receive frequency. To cover the wide frequency range the VCO is automatically aligned by a binary automatic band selection (BABS) before each synthesizer startup.

3.19.4 Reference Oscillator

The SMARTi 3GE comprises three 26MHz reference frequency outputs for the GSM baseband, for the 3G RF and for other subsystems (GPS, Bluetooth, etc.) as well as an reference frequency input for application of an external VCXO module.

3.19.5 Front End Module Control

Implemented in the SMARTi 3GE are two outputs for direct control of GSM front end modules with two logic input pins to select RX- and TX-mode as well as low- and highband operation.

LGE Internal Use Only

- 62 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

[Figure 3.19.5-1] KP275C Front End Control (FEM input)

ANT_SEL2

ANT_SEL6

ANT_SEL1

ANT_SEL4

U505

1

2

3

4

A1

B1

Y2

GND

NL27WZ32USG

8

VCC

7

Y1

6

B2

5

A2

2V85_VRF

C540 1000p

FB503

R516 1K

R519

2V85_VRF

ANT_SEL3

ANT_SEL5

C553 1u

C541

0.1u

1KR517 1KR518 1K

100p

C546

100p

C547

100p

C548

C549 100p

LMSP43QL-771FL501

GSM850_900TX

GSM1800_1900TX

2

ANT

1

GND1

8

GND3

10

GND2

23

GND4

24

GND5

7

VC13VC24VC3

VDD

GSM850_RX1 GSM850_RX2

GSM900_RX1 GSM900_RX2

GSM1800_RX1 GSM1800_RX2

GSM1900_RX1 GSM1900_RX2

VC4

5

6

UMTS1 UMTS2 UMTS3

11 9

12 13

14 15

16 17

18 19

20 21 22

GSM_PAOUT_LB GSM_PAOUT_HB

3G_RF_BC5_8

3G_RF_BC1

- 63 -

3. TECHNICAL BRIEF

LGE Internal Use Only

ANT_SEL1

[Figure 3.19.5-2] KP275C Front End Control (Control signal from Baseband IC)

2

A

3

A

4

A

5

A

[Figure 3.19.5-3] KP275C Front End Control Logic Table

ANT_SEL1

MLED_CLDO_CTRL

_EOC

MMC_DETECT

PA_MODE

PA_MODE ANT_SEL2

ANT_SEL2 ANT_SEL3

ANT_SEL3

V9

T_OUT2

AA8

T_OUT3

W9

T_OUT4

V8

T_OUT5

AB3

T_OUT6

AB4

T_OUT7

W8

T_OUT8

AC1

GPIO[16] GPIO[17] GPIO[18] GPIO[19]

A10 B10 A9 A8

ANT_SEL4 ANT_SEL5 ANT_SEL6

VC1 VC2 VC3 VC4ANT_SEL1ANT_SEL 850/900 TX 1 0 0 0 0 1 0 0 0 0 1800/1900 TX 11 0 011 0000 850 RX 0 1 1 0 1 0 1 0 0 0 900 RX 0 0 1 0 0 0 1 0 0 0 1800 RX 0000000000 1900 RX 0100100000 UMTS1 0001000 001 UMTS2 0101000 101 UMTS3 0 0 1 1 0 0 0 0 1

NT_SEL

NT_SEL6

1

- 64 -

3. TECHNICAL BRIEF

3.20 WCDMA Part

The single-chip transceiver is designed to fulfill the W-CDMA UTRA FDD system requirements for bands I, II, III, IV, V, VI and IX. It contains all active circuits required to simultaneously modulate an analog W-CDMA I/Q signal to the TX RF frequency and demodulate a RX RF W-CDMA signal to an I/Q baseband signal.

3.20.1 WCDMA Receiver

The direct conversion receiver for each band consists of:

• fully differential signal path

• RF low noise amplifier (LNA2)

• I/Q demodulator including LO buffer and I/Q divider

• LO including on-chip VCO and synthesizer

• DC offset compensation without external components

• analog channel filter including auto calibration circuit (w/o external components)

• programmable gain control (PGC) controlled by 3-wire bus programming and gain setting unit onchip

• allpass filter (auto calibrated)

• configurable output drivers (programmable DC voltages and driver currents for different load impedances)

RX Front-End

An external low noise amplifier as well as duplex and interstage filters are needed to form a complete receive chain for each band.

Baseband Processing (analog)

The amplified RF signal is converted by a quadrature demodulator to I and Q signals at baseband frequency. The resulting inphase and quadrature signals are fed into the analog baseband low pass filter (Chebyshev type). An optional, additional filter stage can be activated in order to provide the required selectivity for narrowband blockers. The filter corner frequency is controlled by an on-chip filter alignment circuit. This filter also provides the overall baseband PGC functionality. The differential offset voltage after the demodulator is reduced by an on-chip DC compensation loop. The subsequent last PGC amplifier stage provides 1 dB gain steps. All gains are selected by 3-wire bus program-ming.

LGE Internal Use Only

Only for training and service purposes

- 65 -

3. TECHNICAL BRIEF

3.20.2 Transmitter

The direct-up conversion transmitter for each band consists of:

• fully differential signal path

• configurable input stages (programmable AC and DC input voltages)

• analog channel filter including auto calibration circuit (w/o external components)

• automatic carrier adjustment also featuring compensation of residual I/Q DC offsets

• I/Q modulator including LO buffer and I/Q divider

• LO including on-chip VCO and synthesizer

• RF voltage-controlled gain amplifier (VGA) For each band, the modulator performs a direct quadrature modulation of the baseband input signals at I and Q. The internally divided RF VCO signal is split into two orthogonal carriers. The gain of the VGA is controlled by the voltage at the control pin TXGC. The robustness against PCB and baseband processor spurious as well as noise is improved by an integrated baseband filter (Butterworth type). The RF output signal is available at the differential outputs TXOUTH,/TXOUTHX, TXOUTM/TXOUTMX, and TXOUTL/TXOUTLX. The modulator supply voltage must also be applied to these open drain differential outputs.

TX Output Power

The voltage at the VGA control pin TXGC (VGC) should be limited to ensure that the specified maximum output power (minimum Poutmax) is not exceeded. The VGC value at which the specified minimum Poutmax is reached varies from device to device. ACLR and other specifications are only valid for output power levels below the specified minimum Poutmax.

TX Front End

An external power amplifier as well as duplex and interstage filters are needed to form a complete transmit chain for each band.

3.20.3 Synthesizer

The receiver and the transmitter contain each a complete fractional-N RF synthesizer with fast locking. The VCO’s run at 4 GHz and the RX and TX frequencies are obtained through division by two (bands I, II, III and IV) or four (bands V and VI). The PLL loop filters are fully integrated. The reference frequency has to be provided by an external clock. The total VCO frequency range is divided in 256 subranges, in order to limit the VCO slope. Before the settling process of the PLL starts, a successive approximation algorithm selects the most appropriate subrange.

LGE Internal Use Only

- 66 -

3. TECHNICAL BRIEF

3.21 GSM Power Amplifier Module

LGE Internal Use Only

Only for training and service purposes

[Figure 3.21-1] Schematic Diagram of 2.5G PAM (TQM7M5005)

[Table 3.21-1] TQM7M5005 Pin description

Pin# Description Function

1 DCS/PCS in DCS/PCS RF input-DC blocked 2 MODE SELECT MODE = High, the PAM operates in EDGE(8PSK)mode

MODE = Low, the PAM operates in GMSK mode

3 BAND SELECT(BS) BAND SELECT = Low, Low-Band active

BAND SELECT = High, High-Band active 4 VBATT Battery supply voltage, typ. 3.0-4.5V, nom. 1.6A 5 VRAMP DAC Control Signal(anaiog). Nominal Vramp range is 0.2 to 1.6V

GGMSK mode - Controls ramp profile and output power.

EDGE mode - Continuous bias adjustment. Reducing Vramp from max of

1.6V reduces current when used at lower power levels.

6 TX_EN TX_EN = High, PA is enabled for operation.

TX_EN = Low, PA is In Sleep mode 7 GSM850/900 in GSM850/GSM900 RF input - DC blocked

10 GSM850/900 out GSM850/GSM900 RF output - DC blocked 12 DCS/PCS out DCS/PCS RF output - DC blocked

9,14 Bypass Cap Connect 0.01µF bypass capacitor as close to pin as practical

8,11,14 GND Ground

VBAT

C544

33u

C550 27p

C551 6p

GSM850_900_IN

U503

TQM7M5005

TX_EN

VRAMP

VBATT

MODE_SELECT

DCS_PCS_IN

7

6

5

4

BSBY_CAP1

3

2

1

47p C560

10KR520

TXON_PA

PA_LEVEL

2G_BS

PA_MODE

GSM_PAOUT_LB

GSM_PAOUT_HB

C552 6.8p

C554

DNI

L507 2.2nH

C556 DNI

L506

18nH

C557

1.5p

C558

0.01u

C559

0.01u

15

11 14

13

10

12

PGND

GND3

8

GND2 GND1

BY_CAP2

9

GSM850_900_OUT

DCS_PCS_OUT

- 67 -

3. TECHNICAL BRIEF

3.22 WCDMA Band1/5Power Amplifier Module

LGE Internal Use Only

[Figure 3.22-1] Schematic Diagram of WCDMA Band1 PAM (ACPM-7381)

[Figure 3-22-2] Schematic Diagram of WCDMA Band5 PAM (ACPM-7311)

[Table 3.22-1] ACPM-7381 Pin description

Pin# Name Description

1 Vcc1 Supply Voltage 2 RF In RF Input 3 Vmode1 Control Voltage 4 Vmode2 Control Voltage 5 Ven Enable Voltage 6 GND Ground 7 GND Ground 8 RF Out RF Output 9 GND Ground

10 Vcc2 Supply Voltage

VBAT

U507ACPM-7381

VCC1VCC2

RFIN VMODE1 VMODE0

VEN

1 2 3 4 5

C580

C579

2.2u

1608

220p

100p

C578 220p

11

PGND

10

9

GND3

8

RFOUT

7

GND2

6

GND1

C582C581 100p

3G_PA_MODE1 3G_PAEN_BC1

VBAT

ACPM-7311 U509

11

PGND

C602

2200p

10

GND3

9

GND2

8

RFOUT

7

GND1 VCC2

VEN VMODE0 VMODE1

RFIN

VCC1

1 2 3 4 56

C603

2.2u

1608

C604

680p

C599

100p

C600 100p

3G_PAEN_BC5_8 3G_PA_MODE1

- 68 -

3. TECHNICAL BRIEF

3.23 WCDMA Band1/5 Low Noise Amplifier

LGE Internal Use Only

Only for training and service purposes

[Figure 3.23-1] Schematic Diagram of WCDMA Band1 LNA (BGA711L7)

[Figure 3.23-2] Schematic Diagram of WCDMA Band5 LNA (BGA751L7)

[Table 3.23-1] BGA711L7 Pin description

Pin# Symbol Function

1 RFIN LNA input 2 VEN Mode control 3 VGS Gain step control 4 VCC Supply voltage 5 RREF Tunable current consumption 6 RFOUT LNA output 7 GND Ground connection for band and control circuitry

2V85_VRF

U506 BGA711L7

1

RFIN6RFOUT

2

EN

3

GS

RREF

PGND

7

VCC

5

4

C567

0.01u

C565 DNI

10pC563

3G_LNA_CTRL_BC1

L511

2nH

3G_LNA_GAIN_CTRL

C569 100p

C568

12p

R524

27K

C583 3p

C585 DNI

2V85_VRF

BGA751L7U508

6

5

RREF

4

VCC

PGND

3G_LNA_CTRL_BC5_8

L522

6.8nH

3G_LNA_GAIN_CTRL

C589 100p

RFIN1RFOUT

2

VEN

3

VGS

7

C587

0.01u

12p

560K

R525

C588

- 69 -

3. TECHNICAL BRIEF

3.24 WCDMA Band 1/5 Duplexer

LGE Internal Use Only

[Figure 3.24-1] Schematic Diagram of WCDMA Band1 Duplexer

[Figure 3.24-2] Schematic Diagram of WCDMA Band5 Duplexer

[Table 3.24-1] B7684 Pin description

B7684FL504

TX_IN

RX_OUT

GND4 GND5 GND6

3G_RF_BC1

12pC570

L515

5.6nH

ANT

GND1 GND2 GND3

3G_RF_BC5_8

C590 100p

L529

15nH

FL507

ANT

GND1 GND2 GND3 GND4

B7638

GND6 GND5

RX

TX

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 70 -

4. TROUBLE SHOOTING

4.1 Trouble shooting test setup

Equipment setup

Power on all of test equipment

- Connect PIF-UNION JIG or dummy battery to the DUT for power up.

- Connect mobile switch cable between Communication test set and DUT when you need to make a phone call.

- Follow trouble shooting procedure

LGE Internal Use Only

4. TROUBLE SHOOTING

- 71 -

4.2 Power on trouble

Start

Battery Voltage, higher

Than 3.2V?

YES

32.769KHz clock at X101

32.769KHz clock at X101 is ok? Click TP1

is ok? Click TP1

YE

S

26MHz clock at U502 is

ok? Click TP2

YES

PWRON pin(TP3) is high

PWRON pin(TP3) is high Before push the end key?

Before push the end key?

PWRON pin(TP3) is low

PWRON pin(TP3) is low when push the end key?

when push the end key?

NO

N

Change or Charging

the Battery

Check soldering

or change X101

Check soldering or

Change U101, U504, U502,X501

O

NO

Resolder R202

Check soldering R220,

Q202 or change Q202

.

LDOs output(C223,C207,

C209,C217,C218,C221,C232,C234,

C236,C237,C239) of U202

while push the end key

is ok?

Power on is ok?

END

NO

N

O

Check soldering or change

U202 and relevant component

Change the main board

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 72 -

TP1

TP2

TP3

MEM_BC1_N MEM_BC2_N

MEM_BC3_N MEM_RAS_N MEM_CAS_N

MEM_CKE

CLK32K

F32K

OSC32K

RESET_N

RSTOUT_N

RTC_OUT SPCU_RQ_IN0 SPCU_RQ_IN1

SPCU_RC_OUT0

SPCU_RQ_IN2

VREFP

IREF

FSYSOUT1

H17 F15 F12 H12 D14 H11

B1 D5 D6

E6 R2 F7 T1 R3 T3 V1 J4

C143 220n

J5

_BC1 LDQS UDQS _RAS _CAS CKE

CLK32K

_RESET

RTC_OUT

VREFN

2V85_VRF

5

VCC

2

GND

3

BT_VCXO_EN PM_VCXO_EN

C520

2.2u

4

C141 C142 18p

18p

C521 1000p

1000pC525

4

1

R512

1K

R514 820

MC-146_12_5PFX101

32.768KHz

3

2

26MHZ

BT_CLK

R515 100K

U502

MC74VHC1G04DFT2G

Remote Power On

RPWRON_EN

3.3MR207

C206

2.2u

END_KEY_IN

R210

3.3M

2

3

Q201 KTC4075E

1

R218

100K

2V11_RTC

R202 100K

R208 0

3

Q202

2

KTC4075E

1

PWRON

RPWRON_DBB

LGE Internal Use Only

4. TROUBLE SHOOTING

- 73 -

C209

C207

C329 C237 C234C236 C232

C

81

C218 C217 C221

X101

C223

U20

R202 Q202

R220

3

2

2 2

0

U101

U502

X50

U50

1

4

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 74 -

4.3 Charging Trouble

START

Change the battery.

If voltage level of battery is under 3.2 V

then wait by above 3 .2V

Volt a ge at C243 is 5.1V?

(TP1)

YES

Volta ge at the C244 is 4.9V?

(TP2)

YES

Volta ge at the C202 is 4.7V?

(TP3)

YES

Charging is work well?

NO

1. Check solde ring or change FL303

2. Change TA

Check soldering or change D202

Change U203

Volt a ge a t R102 is

above 0.64V?

NO

Resolder R102, R103 or change main board

END

YES

YE

S

Charging is work well?

NO

Change the main bo ard

LGE Internal Use Only

4 TROUBLE SHOOTING

- 75 -

TP1

TP3

D202

TP2

CHARGING IC

_EOC

CHG_EN

2V62_VIO

R226

100K

_PPR

2V11_RTC

R227

100K

C242

VBAT

USB_VCHG

1u

VCHG

C205 33u

C243 1u

C202

1u

R228

4.7K

1%

U203

1

VDC

2

VUSB

3

_PPR

4

_CHG

5

_EN

6

IMIN

KDR331V

3

D202

ISL9221

PGND

VDC_BYP

BAT

USB_BYP

IVDC

GND

IUSB

2

1

13

12

11

10

9

8

7

378mA 600mA117mA

R230

18K

1%

OVP_VUSB

R229

11.3K

1%

C244 1u

R233

47K

R234

47K

OVP_VCHG

OVP_VUSB

C245 1u

OVP_VCHG

TA_DETECT

VBAT

C246 1u

0.1uC211

TP207

TP208

K7

J8

BL2_PWM

BL3_PWM

K8

L8

L7

CH_CNTRL

CH_SOURCE

K9

CHARGE_UC

TP209

J9

A8

L9

K10

VLED

VDD_REF

SENSE_IN1

SENSE_IN2

VDD_CHARGE

L11

VSD1

L201

10uH

D203

SDB0530

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 76 -

D20

C202

2

FL30

C24

U203

U20

C245

3

2

3

R102

R10

3

LGE Internal Use Only

4. TROUBLE SHOOTING

- 77 -

4.4 UBS Trouble

Start

Cable is insert?

YES

NO

Cable insert

USB_VCHG(C242) is

about to 5V?

Click TP1

YES

OVP_VUSB(C245) is

about to 5V?

Click TP2

YES

VDD_CHARGE(C202) is

about to 4.8V?

Click TP3

S

YE

USB function is ok?

NO

N

NO

Change cable

O

Check soldering or

change U20

Check soldering or

change D202

Change U202 or

main boar

3

d

END

- 78 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

TP1

TP3

D202

TP2

U203

CHARGING IC

_EOC

CHG_EN

2V62_VIO

R226

100K

_PPR

2V11_RTC

R227

100K

USB_VCHG

C242

1u

VBAT

VCHG

C243 1u

C205 33u

4.7K

R228

1%

1

2

3

4

5

6

C202

1u

U203

VDC

VUSB

_PPR

_CHG

_EN

IMIN

VDC_BYP

USB_BYP

KDR331V

3

D202

ISL9221

PGND

BAT

IVDC

GND

IUSB

VBAT

13

12

11

10

9

8

7

378mA 600mA117mA

R230

R229

18K

11.3K

1%

2

OVP_VUSB

1

C244 1u

1%

C245 1u

R233

47K

R234

47K

OVP_VCHG

OVP_VUSB

OVP_VCHG

TA_DETECT

C246 1u

TP207

TP208

K7

J8

BL2_PWM

BL3_PWM

K8

L8

L7

CH_CNTRL

CH_SOURCE

K9

J9

L9

K10

SENSE_IN1

SENSE_IN2

CHARGE_UC

VDD_CHARGE

0.1uC211

TP209

A8

VLED

VDD_REF

L11

VSD1

C242

C24

U203

C245

C24

L201

10uH

2

5

D203

SDB0530

D20

C202

U20

2

- 79 -

4. TROUBLE SHOOTING

LGE Internal Use Only

4.5 SIM Detect Trouble

Start

Change SIM Card.

Work well?

NO

Check soldering of

J301

YES

2V9_VSIM(C236) is 3.0V?

Click TP1

YES

SIM_CLK(C324),

SIM_DATA(C323) is

Work well? Click TP2

YES

NO

N

O

NO

END

Resolder J301

Check C236 or

Change U202

Change the main board

Change the main boar

d

YES

END

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 80 -

TP3

TP1

J301

SIM_DATA

J9

0.1uC211

TP209

A8

L11

VLED

VSD1

VDD_REF

VDDMME

VDDRF2

VDDRF13_AFC

VDDSIMVIB

VDDUMTS

VUMTS

VDDSD1

SD1_FB

SD1_FBL

2V9_VSIM

R317

10K

C323

22p

VMME

VRF2

VRF3

VRF1

VVIB

VSIM

VAFC

VRTC

L201 10uH

C11 C10

D10 D11

E10 E11

F10 F11 G11

G10

H11

H10

H9 J11

K11 J10 L10

2V9_VSIM

D203

FB202

C220

4.7u

1608

SDB0530

FB203

1608

VBAT

1608

C229 2.2u

1608

C230 4.7u

J301

4 5 6

10

9

1V35_CORE

1608

4.7uC231

C5 C6 C7 GND4

2V85_VLCD

1608

10u

10uC218

C217

1608

10uC221

GND1 GND2GND3

2V8_AMP

C232 1u

C1 C2 C3

C233 1u

1 2 3 7 8

2V11_RTC

2V7_VRF

C234 1u

2V9_VSIM

C322

0.1u

2V85_VRF

2V9_VSIM

C236

C235

2.2u2.2u

C324

22p

C237

2.2u

2V85_VBT

1V5_VRF

C238

2.2u

C325

DNI

C239

2.2u

1V8_SD

SIM_RST SIM_CLK

2V9_VMME

C240

2.2u

C241

2.2u

LGE Internal Use Only

4. TROUBLE SHOOTING

- 81 -

C323

U202

J301

J30

C32

1

4

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 82 -

4.6 Number Key Sense Trouble

start

N

Change the Dome Sheet

And check again.

Work well

END

?

YES

O

FL101, FL102 is 2.6V?

YES

Check R116,R117

YES

Work well?

N

O

N

O

Check soldering of R116, R117,FL101, FL102. Any problem?

YES

Change Main Board

Resolder R116, R117, FL101,FL102

LGE Internal Use Only

4. TROUBLE SHOOTING

- 83 -

NUMBER KEY PAD

J301

KEYIN0

KEYIN1

21

301

302

5

4

304

8

7

308

307

0

*

KB_STAR

310

KEYIN2

KB301

3

303

KEYOUT1

6

306305

KEYOUT2

9

309

KEYOUT3

#

KEYOUT5

R116

ICVE10184E150R500FR

KEYIN2 KEYIN3 KEYIN4 KEYIN5

KEYOUT5 KEYOUT1 KEYOUT2 KEYOUT3

ICVE10184E150R500FR

FL102

FL101

4

3

2

1

2

3

4

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

5

G110G2

G15G2

10

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

CAM_PCLK

CAM_HSYNC

CAM_VSYNC

CAM_MCLK

CAM_PWR_EN

_CAM_RESET

6

7

8

9

KEYOUT0

8

7

6

CAM_D0 CAM_D1 CAM_D2 CAM_D3 CAM_D4 CAM_D5 CAM_D6 CAM_D7

KEYIN0 KEYIN1

REC_N

REC_P

HS_L

R116 51

R117 51

R118 51

V11 Y10

AB10

Y12

AB11

AD7

AA11

W12

AA12

W11 AA13 AB14 AB12 AA10

W18

P15 U17 R15

T17 U18 R17 U16

V17

AA19

U15

K2 K3

J1

J2 H1 H2

G1

CIF_D0 CIF_D1 CIF_D2 CIF_D3 CIF_D4 CIF_D5 CIF_D6 CIF_D7 CIF_PCLK CIF_HSYNC CIF_VSYNC CLKOUT2 CIF_PD CIF_RESET

KP_IN0 KP_IN1 KP_IN2 KP_IN3 KP_IN4 KP_IN5 KP_IN6 KP_OUT0 KP_OUT1 KP_OUT2 KP_OUT3

EPN1_1 EPN1_2 EPP1_1 EPP1_2 EPPA1_1 EPPA1_2

R117

FL102

FL10

1

4.7 Multi Key sense Trouble

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 84 -

start

Change the Dome Sheet

And check again.

Work well

END

?

YES

NO

YES

Check R116,R117,FL101

FL102 is 2.6V?

YES

Work well?

NO

Change multi key PCB and check again. Work wel

Change Slide and check again.

Work well?

Change the main board

NO

N

l?

O

N

O

Check soldering of R116, R117,FL101, FL102. Any problem?

YES

Resolder R116, R117, FL101,FL102

LGE Internal Use Only

4. TROUBLE SHOOTING

- 85 -

KEY PAD

VA801

EVLC5S0250

ICVE10184E150R500FR

KEYIN2 KEYIN3 KEYIN4 KEYIN5

KEYOUT5 KEYOUT1 KEYOUT2 KEYOUT3

ICVE10184E150R500FR

FL102

FL101

4

3

2

1

2

3

4

KEYIN3

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

VA802

MENU

LEFT

SOFT802

CALL

5

G110G2

G15G2

EVLC5S0250

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

10

KEYIN4

DOWN

6

7

8

9

8

7

6

VA803

EVLC5S0250

UP

OK

CAM_D0 CAM_D1 CAM_D2 CAM_D3 CAM_D4 CAM_D5 CAM_D6 CAM_D7

CAM_PCLK

CAM_HSYNC

CAM_VSYNC

CAM_MCLK

CAM_PWR_EN

_CAM_RESET

KEYOUT0

KEYIN5

SOFT801

SOFT803

KEYIN0 KEYIN1

REC_N

REC_P

HS_L

RIGHT

END_KEY

VA808 EVLC5S0250

R117 51

R118 51

END

VA804 EVLC5S0250

VA805 EVLC5S0250

VA806 EVLC5S0250

VA807 EVLC5S0250

R116 51

VBAT

KEYOUT1

KEYOUT2

KEYOUT3

KEYOUT5

V11 Y10

AB10

Y12

AB11

AD7

AA11

W12

AA12

W11 AA13 AB14 AB12 AA10

W18

P15 U17 R15

T17 U18 R17 U16

V17

AA19

U15

K2 K3

J1

J2 H1 H2

G1

CIF_D0 CIF_D1 CIF_D2 CIF_D3 CIF_D4 CIF_D5 CIF_D6 CIF_D7 CIF_PCLK CIF_HSYNC CIF_VSYNC CLKOUT2 CIF_PD CIF_RESET

KP_IN0 KP_IN1 KP_IN2 KP_IN3 KP_IN4 KP_IN5 KP_IN6 KP_OUT0 KP_OUT1 KP_OUT2 KP_OUT3

EPN1_1 EPN1_2 EPP1_1 EPP1_2 EPPA1_1 EPPA1_2

R116

R11

FL102

7

FL101

- 86 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

4.8 Keypad backlight Trouble

start

Check soldering of LD301

LD302, R316, R319

YES

Signal MAIN_KEY_EN

Is LOW?

Click TP

1

YES

Signal MAIN_KEY_LED

Is LOW?

Click TP

2

YES

Backlight is work well?

YES

END

NO

Resolder LD301

LD302, R316, R319

Change the Main Board

Change the Main Boar

Change LD301, LD302

And check again.

Work well?

d

NO

Change the Main Board

- 87 -

4. TROUBLE SHOOTING

LGE Internal Use Only

TP1

TP2

AUXN1

AUXN2

AUXP1N2AUXP2

N1

M1

VMIC_P

AUXGND

H5

N4

0.1uC1441000pC149

KEY BACKLIGHT

MAIN_KEY_LED

VMICN

VMICP

I2C1_SCL

I2C1_SDA

G5

R123

0

VMIC_GND

E7

AA6

AA4

SCL_PMIC

SDA_PMIC

I2C2_SCL

PM_INTV5I2C2_SDA

Y4

PM_INT

SCL

CC_CLK

CC_IOT4CC_RST

P2

P3

SIM_CLK

SIM_DATA

1V8_SD

4.7KR122

R121 4.7K

SDA

SWIF_TXRX

I2S1_CLK0W4I2S1_CLK1Y1I2S1_RXW2I2S1_TX

T5

SIM_RST

BT_PCM_CLK

I2S1_WA0

Y2

U1

W3

BT_PCM_TX

BT_PCM_RX

BT_PCM_SYNC

I2S2_CLK0

I2S2_CLK1

I2S2_RX

V2

U5

W1

BT_RESETn

DBB_BT_INT

UPPER_KEY_LED

R316

I2RF_STR0

I2S2_TXU2I2S2_WA0

I2S2_WA1

B2

U3

3G_EN

BT_INT

BT_LDO_EN

MAIN_KEY_EN

I2RF_DATA

I2RF_SCLK

C2

C1

3G_CLK

3G_DATA

100ohm

100ohmR319

USIF_TXD

AE3

AD3

A_MON_TX

USIF_RXD

A_MON_RX

C

2

SSC-SWTS1007

C

2

SSC-SWTS1007

USIF1_CTS_N

USIF1_RTS_N

USIF1_RXD_MRST

USIF1_TXD_MTSR

USIF2_RXD_MRST

T2

V16

V15

Y17

AB16

UART_TX

UART_RX

USB_DAT_VP

USB_SE0_VM

BT_UART_RX

1V8_SD

LD301

1

LD302

1

USIF2_CTS_N

USIF2_RTS_N

USIF2_TXD_MTSR

USIF3_RXD_MRST

USIF3_TXD_MTSR

V6

U4

R4

AB18

AA18

BT_UART_CTS

BT_UART_RTS

BT_UART_TX

R130

47K

FM_RESET

A

USIF3_SCLK

W16

R125

VT_PWR_EN

DSPIN0

T16

W14

CLK32K

47K

VBAT

GPIO[13] GPIO[14] GPIO[15] GPIO[16] GPIO[17] GPIO[18] GPIO[19]

DSPIN1

DSPOUT1

V18

WDOG

1V8_SD

C321

0.1u

A12 B12 A11 A10 B10 A9 A8

TP111

3G_PA_MODE1 ANT_SEL4 ANT_SEL5 ANT_SEL6

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 88 -

4.9 Micro SD Trouble

start

Change Micro SD card

Yes

N

Micro SD card is work well?

N

O

Check soldering of S301 and relevant compone

nt

O

Resolder S301 and Relevant component

YE

END

S

Check voltage of

2V9_VMME, 2V62_VIO

YE

S

Micro SD card is work well?

YES

Click TP1

YES

NO

No

Change U202

1.Change soket(S301)

2.Chagne main board

2.Chagne main boar

d

LGE Internal Use Only

4. TROUBLE SHOOTING

- 89 -

MMC_D1

TP1

MMC_D0

MMC_CLK

MMC_CMD

MMC_D3

MMC_D2

MMC_DETECT

2V62_VIO

R322 100K

C330

C329

DNI

1u

R327 56K

C331

DNI DNI

56KR323

C332

56KR324

C333

DNI

2V9_VMME

56KR325

R326 56K

C334

C335

DNI

10p 1u

2V9_VMME

C336

C337

DNI

S301 AXA463062P

DAT1_2 DUMMY1 DAT0 VSS CLK VDD CMD CD_DAT3 DUMMY2 DAT2 DETECT_A DETECT_B DUMMY3

GND

U202

S301

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 90 -

4.10 Audio Trouble

4.10.1 Receiver path

start

Connect the phone to network

equipment and setup call.

Setup 1KHz tone ou

t

Is there analog signal

at R405, R406?

Click TP1

YES

Is there analog signal

at C427, C428?

Click TP

Receiver is work well?

END

2

YES

NO

N

Change the main board

Change U401

1.Check soldering and

O

resolder CN302,CN903

2.Change the Speaker

3.Change the FPCB

4.Chagne the Slide

LGE Internal Use Only

4. TROUBLE SHOOTING

- 91 -

r

TP1

TP2

U401

AUDIO AMP

RADIO_OUT_R RADIO_OUT_L

HS_R HS_L

C423 39p

REC_P REC_N

C4301uC431 39p

C424 39p

39p

C416 1u C420 1u

SDA SCL

VBAT

C403

1uC407

C1N

C1P

INA2 INA1

INB2 INB1

BIAS

SDA SCL

RXIN+ RXIN-

A3

VSS

U401 MAX9877AEWP_TG45

A4

1uC411

A5

1uC412

D1

1uC415

D2

C1 C2

B2

B3 C3

2.2R405 D4

2.2R406

B4

C429

1u

C404

4.7u

C5

B1

VDD

PVDD

A1

HPR

A2

HPL

C417

D5

OUT+

B5

OUT-

C427 C428 39p

PGND

GND

C4

D3

C418 39p39p

39p

HSO_R

HSO_L

SPK_RCV_P SPK_RCV_N

C428

C42

R405

R406

U401

7

CN903

Speake

FPCB

CN302

- 92 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

4.10.1 Receiver path

start

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out and

Insert headset

YE

S

Is there headset detection

icon on the LCD

YE

Is there analog signal

at C416, C420?

Click TP1

YES

Is there analog signal

at C417, C418?

Click TP

YES

Headset is work well?

YES

?

S

2

NO

N

Change headset

Resolder C416, C420,

C423, C424 or

change the main boar

Resolder FB301, FB303

or change U401

O

Check soldering CN301

d

END

- 93 -

4. TROUBLE SHOOTING

LGE Internal Use Only

TP1

TP2

U401

AUDIO AMP

RADIO_OUT_R RADIO_OUT_L

HS_R HS_L

C423 39p

REC_P REC_N

C4301uC431 39p

C424 39p

39p

C416 1u C420 1u

SDA SCL

VBAT

C403

1uC407

C1N

C1P

INA2 INA1

INB2 INB1

BIAS

SDA SCL

RXIN+ RXIN-

A3

VSS

U401 MAX9877AEWP_TG45

A4

1uC411

A5

1uC412

D1

1uC415

D2

C1 C2

B2

B3 C3

2.2R405 D4

2.2R406

B4

C429

1u

C404

4.7u

C5

B1

VDD

PVDD

A1

HPR

A2

HPL

C417

D5

OUT+

B5

OUT-

C427 C428 39p

PGND

GND

C4

D3

C418 39p39p

39p

HSO_R

HSO_L

SPK_RCV_P SPK_RCV_N

U401

FB301

C418

C417

C420

C42

FB303

C416

4

C42

3

CN301

- 94 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

4.11 Microphone Trouble

4.11.1 Microphone for main MIC

start

Connect the phone to network

Equipment and setup call.

Audio path on the network equipment is

echo mode

Is there analog signal

?

END

?

YES

at C414, C419

Mic is work well?

NO

Resolder C414, C419 or change MIC40

Change the main board

1

- 95 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Fig 6 Waveform of DCXO

1608

C409

39p

G1

2

3

G2

4

G3

G4

6

1

OUT

PWR

5

SPM0204LE5-QB

MIC401

0.1uC414

VMIC_P

100nH

L401

DNI

C410

39p

C421

0.1uC419

39p

C413

C408

10u

39p

C422

VMIC_GND

MAIN_MIC_N

MAIN_MIC_P

VMIC_GND

C414C419

- 96 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

4.11.1 Microphone for headset

start

Connect the phone to network

Equipment and setup call.

Audio path on the network equipment is

echo mode

YE

S

Is there headset detection

icon on the LCD?

YES

Is there analog signal

at C309, C310?

YES

Headset mic is work well?

S

YE

END

NO

N

NO

O

Change headset

Resolder C309, C310 or change headse

Change the main board

t

LGE Internal Use Only

4. TROUBLE SHOOTING

- 97 -

C309

C31

0

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 98 -

4.12 Camera Trouble

4.12.1 Main Camera (1.3 Mega)

START

2V8_AVDD,1V8_CAMIO,

1V8_CAMCORE voltage level is ok?

Click TP1

YES

Check control signal and data.

YES

Replace new camera Module.

Working properly?

YES

NO

Check soldering or change FB204, FB205, FB206, FB207, U20

4

1.Check soldering or change FL401, FL402 and relevant component

2. Change the main board

Replace camera socket

Replace camera socket or Change the main boar

or Change the main boar

d

END

LGE Internal Use Only

4. TROUBLE SHOOTING

- 99 -

TP1

CAM_D0 CAM_D1 CAM_D2 CAM_D3

CAM_D4 CAM_D5 CAM_D6 CAM_D7

MEGA CAMERA CONNECTOR

FL401 ICVE10184E070R101FR

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

FL402 ICVE10184E070R101FR

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

C425

DNI

C432

DNI

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

G15G2

10

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

G15G2

10

R404

20

R408

20

C426

10p

C433

10p

9

8

7

6

9

8

7

6

CAM_DATA_OUT0 CAM_DATA_OUT1 CAM_DATA_OUT2 CAM_DATA_OUT3

CAM_DATA_OUT4 CAM_DATA_OUT5 CAM_DATA_OUT6 CAM_DATA_OUT7

CAM_MCLK_INCAM_MCLK

CAM_PCLKCAM_PCLK_OUT

CAM_D7 CAM_D6 CAM_D5 CAM_D4 CAM_D3 CAM_D2 CAM_D1 CAM_D0

1V8_CAMCORE

1V8_CAMIO

13

17

DVDD

AGND2

AGND1

PGND428PGND5

PGND6

27

14

16

VDDIO

STANDBY

PGND7

26

25

2V8_AVDD

C405

0.1u

AVDD

MCLK

RESETB

SDA SCK

HSYNC

VSYNC

PCLK

PGND8

C406

0.1u

7 9 10 11 12 18 19 20

R402

DNI

1V8_CAMIO

R403

DNI

CAM_MCLK_IN _CAM_RESET SDA SCL CAM_PWR_EN CAM_HSYNC CAM_VSYNC CAM_PCLK

C401

C402

1u

0.1u

8

15

21

6

DGND1

DGND2

PGND1

32

DGND3

CN401

PGND231PGND3

30

29

5

D7

4

D6

3

D5

2

D4

1

D3

24

D2

23

D1

22

D0

FB205

FB207

FB206

FB204

U204

Camera Module

Camera socket

FL402

FL40

1

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 100 -

C401 C402 C405

C40

6

LGE Internal Use Only

4. TROUBLE SHOOTING

- 101 -

4.12.1 VT Camera (VGA)

START

2V8_AVDD

1V8_CAMCORE voltage level is o

Click TP2

YES

Check cont rol sig nal and data.

YES

ce n

Replace new ca mera Module.

rr

Working prop erly?

YES

k?

NO

Check sold ering or cha nge FB204, FB205, FB2 06, FB207, U20

1.Check sold ering or cha nge F L401,

4

L,

FL402 and relevant c omponent

2. Change the main board

1. Repla ce camera so cket or Change the FPCB

2. Change the main b

oard

END

LG KP275, KP275c Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual