LG KP210, KP215 Service Manual

Service Manual

KP210/KP215

Model : KP210/KP215

Date: February, 2008 / Issue 1.0

- 3 -

1. INTRODUCTION .............................. 5

1.1 Purpose .................................................. 5

1.2 Regulatory Information............................ 5

1.3 Abbreviations .......................................... 7

2. PERFORMANCE.............................. 9

2.1 H/W Features.......................................... 9

2.2 Technical Specification(KP210a) .......... 10

2.3 Technical Specification (KP215b) ......... 15

3. TECHNICAL BRIEF ....................... 20

3.1 TX module (SKY77517/SKY77518, U401)

.............................................................. 20

3.2 Transceiver (AD6548, U402) ................ 22

3.3 26 MHz Clock (Crystal, X401)............... 24

3.4 Baseband Processor (AD6721, U102).. 25

3.5 Display and Interface ............................ 31

3.6 Camera Interface(AIT701G, U300)....... 33

3.7 Keypad Switches and Scanning ............35

3.8 Microphone ............................................36

3.9 Main Speaker.........................................37

3.10 Headset Interface.................................38

3.11 Key Back-light Illumination...................39

3.12 LCD Back-light Illumination..................40

3.13 VIBRATOR...........................................41

3.14 Battery Charging ..................................42

4. TROUBLE SHOOTING ...................43

4.1 RF Component.......................................43

4.2 RX Trouble.............................................44

4.3 TX Trouble .............................................49

4.4 Power On Trouble..................................55

4.5 Charging Trouble ...................................57

4.6 Vibrator Trouble .....................................59

4.7 LCD Trouble...........................................61

4.8 Camera Trouble .....................................64

4.9 Speaker Trouble ....................................67

4.10 SIM Card Interface Trouble..................69

4.11 Earphone Trouble ................................71

4.12 KEY backlight Trouble .........................73

4.13 Receiver Trouble..................................75

4.14 Microphone Trouble .............................77

4.15 RTC Trouble ........................................79

4.16 Folder on/off Trouble............................81

4.17 Micro SD Trouble .................................83

5. DOWNLOAD.......................................85

5.1 Download ...............................................85

6. BLOCK DIAGRAM ..........................91

7. CIRCUIT DIAGRAM ........................93

8. BGA IC Pin Check ..........................99

9. PCB LAYOUT................................103

10. ENGINEERING MODE ................109

10.1 BB Test [MENU 1]..............................110

10.2 RF Test [MENU 2]..............................112

10.3 MF mode [MENU 3] ...........................112

10.4 Trace option [MENU 4] ......................113

10.5 Call timer [MENU 5] ...........................113

10.6 Fact. Reset [MENU 6] ........................113

10.7 S/W version........................................113

11. STAND ALONE TEST .................114

11.1 Introduction ........................................114

11.2 Setting Method...................................114

11.3 Means of Test ....................................115

12. AUTO CALIBRATION..................117

12.1 Overview ............................................117

12.2 Equipment List ...................................117

12.3 Test Jig Operation..............................118

12.4 Procedure ..........................................119

12.5 AGC ...................................................121

12.6 APC....................................................121

12.7 ADC ...................................................121

13. EXPLODED VIEW &

REPLACEMENT PART LIST ..... 123

13.1 Exploded View .................................. 123

13.2 Replacement Parts ............................125

Table Of Contents

LGE Internal Use Only

- 4 -

LGE Internal Use Only

Only for training and service purposes

- 5 -

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

- 6 -

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information

such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static matb which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

Only for training and service purposes

- 7 -

1. INTRODUCTION

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

LGE Internal Use Only

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current – Constant Voltage

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

OPLL Offset Phase Locked Loop

- 8 -

1. INTRODUCTION

LGE Internal Use Only

Only for training and service purposes

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

PSRAM Pseudo SRAM

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

- 9 -

2. PERFORMANCE

2.1 H/W Features

2. PERFORMANCE

LGE Internal Use Only

Item Feature Comment

Standard Battery Li-ion, 3.7V 800mAh

Talk time Up to 180min: GSM Tx Level 7

Stand by time Up to 250 hours (Paging Period: 5, RSSI: -85 dBm)

Charging time Approx. 2.5 hours

RX Sensitivity -102dBm

TX output power

GSM850, GSM900: 32.5dBm(Level 5), DCS, PCS: 29.5dBm(Level 0)

GPRS compatibility Class 10

SIM card type 3V Small

Display

MAIN: TFT 128 × 160 pixel 262K Color

SUB: CSTN 96 × 64 pixel 65K Color

Hard icons. Key Pad

Status Indicator

0 ~ 9, #, *, Up/Down/Left/Right/Ok Navigation Key Menu Key, Clear Key, Back Key, Confirm Key Send Key, Volume Key, PWR Key, Camera Key, Hot Key

ANT Internal

EAR Phone Jack Yes (Stereo)

PC Synchronization Yes

Speech coding EFR/FR/HR

Data Yes

Vibrator Yes

Loud Speaker Yes

Voice Recoding Yes

Microphone Yes

Speaker/Receiver One way speaker

Travel Adapter Yes

MIDI SW MIDI

Camera VGA

- 10 -

2. PERFORMANCE

2.2 Technical Specification(KP210a)

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

GSM850

TX: 824 + 0.2 x (n-127) MHz

1Frequency Band

RX: 869 + 0.2 x (n-127) MHz ( n = 128 ~ 251)

PCS1900

TX: 1850 + ( n-511) x 0.2 MHz RX: 1930 + ( n-511) x 0.2 MHz (n = 512 ~ 810)

2 Phase Error

RMS < 5 degrees Peak < 20 degrees

3 Frequency Error < 0.1ppm

GSM850

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

4 Power Level 12 19 dBm 3dB

PCS

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

5

EDGE

Not support

Max. Power

6

EDGE

Not support

Modulation Accuracy

- 11 -

2. PERFORMANCE

LGE Internal Use Only

Item Description Specification

GSM850

Offset from Carrier (kHz). Max. [dBc]

100 0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

7

Output RF Spectrum 6,000 -71

(Due to Modulation) PCS

Offset from Carrier (kHz). Max. [dBc]

100 0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

GSM850

Offset from Carrier (kHz) Max. [dBm]

Output RF Spectrum 400 -19

8

(Due to Switching) 600 -21

1,200 -21

1,800 -24

- 12 -

2. PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

PCS

Offset from Carrier (kHz) Max. [dBm]

Output RF Spectrum 400 -22

8

(Due to Switching) 600 -24

1,200 -24

1,800 -27

9 Spurious Emissions

Conduction, Emission Status

Radiation, Emission Status

GSM850

10 Bit Error Ratio

BER (Class II) < 2.439% @-102dBm

PCS

BER (Class II) < 2.439% @-102dBm

11 Rx Level Report accuracy 3 dB

12 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 0 -12

13 Sending Response 1,000 0 -6

2,000 4 -6

3,000 4 -6

3,400 4 -9

4,000 0 -

14 RLR(Normal volume) -4 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -6 -

Receiving Response

200 2 -

15

(Type 3.2)

300 2 -9

1,000 2 -7

3,400 2 -12

4,000 2 -

- 13 -

2. PERFORMANCE

LGE Internal Use Only

Item Description Specification

16 STMR > 17 dB

17 Echo Loss > 40 dB

18 Idle Noise Sending < -64 dBm0p

19 Idle Noise Receiving < -36 dBm0p

Max. power < 330mA @GSM850, PL=5 < 250mA @PCS, PL=0

Standby < 5.5mA @PP2 < 3.3mA @PP5

20 Power consumption

< 2.7mA @PP9

Bluetooth (not support)

FM radio (not support)

Backup Battery(Without Main Battery) Normal Power Off: < 5uA Emergency Power Off: < 15uA

2.2 hr., Min.@GSM850, PL=5

21 Talk Time

4.0 hr., Min.@GSM850, PL=12

3.0 hr., Min.@PCS, PL=0

5.0 hr., Min.@PCS, PL=10

270 hr., Min.@PP9 220 hr., Min.@PP5

22 Standby Time - Full charge, no receive/send and keep GSM in idle mode

Broadcast set off. Signal strength display set at 3

levelabove. Backlight of phone set off.

At least 55 dB under below conditions:

23 Ringer Volume(TBD) 1. Ringer set as ringer.

2. Test distance set as 1 m.

24 Charge Current

Fast Charge: < 500 mA

Slow Charge: < 120 mA

25 Charging Time Under 3 hr.

- 14 -

2. PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

Antenna Bar Number Power

5 -92 dBm ~

4-100 dBm ~ –93 dBm

26 Antenna Display 3 skip

2-103 dBm ~ –101 dBm

1-105 dBm ~ –104 dBm

0~ –105 dBm

Battery Bar Number Voltage

1 → 03.54V 0.05V

27 Battery Indicator(TBD) 2 → 13.64V 0.05 V

3 → 23.75V 0.05 V

3 4.2V

28 Low Voltage Warning(TBD)

3.54 0.05 V (Call)

3.40 0.05 V (Standby)

29 Forced shut down Voltage 3.33 0.05V

30 Battery Type

Main Battery: Li-ion, 800mAh, Hard pack Back-up Battery: Lithium, 1mAh

31 Travel Charger

Input: 100 ~ 240 V, 50/60Hz Output: 4.8V, 900mA

- 15 -

2. PERFORMANCE

LGE Internal Use Only

2.3 Technical Specification (KP215b)

Item Description Specification

GSM900

1) PGSM TX: 890 + 0.2 x n MHz

1Frequency Band

RX: 935 + 0.2 x n MHz (n = 1 ~ 124)

2) EGSM TX: 890 + 0.2 x (n-1024) MHz RX: 935 + 0.2 x (n-1024) MHz n = 975 ~ 1023)

DCS1800

TX: 1710.2 + 0.2 x (n-512) MHz RX: 1805.2 + 0.2 x (n-512) MHz (n = 512 ~ 885)

2 Phase Error

RMS < 5 degrees Peak < 20 degrees

3 Frequency Error < 0.1ppm

GSM900

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

4 Power Level 12 19 dBm 3dB

DCS1800

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

5

EDGE

Not support

Max. Power

6

EDGE

Not support

Modulation Accuracy

- 16 -

2. PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

GSM900

Offset from Carrier (kHz). Max. [dBc]

100 0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

7

Output RF Spectrum 6,000 -71

(Due to Modulation) DCS1800

Offset from Carrier (kHz). Max. [dBc]

100 0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

GSM900

Offset from Carrier (kHz) Max. [dBm]

Output RF Spectrum 400 -19

8

(Due to Switching) 600 -21

1,200 -21

1,800 -24

- 17 -

2. PERFORMANCE

LGE Internal Use Only

Item Description Specification

DCS1800

Offset from Carrier (kHz) Max. [dBm]

Output RF Spectrum 400 -22

8

(Due to Switching) 600 -24

1,200 -24

1,800 -27

9 Spurious Emissions

Conduction, Emission Status

Radiation, Emission Status

GSM900

10 Bit Error Ratio

BER (Class II) < 2.439% @-102dBm

DCS1800

BER (Class II) < 2.439% @-102dBm

11 Rx Level Report accuracy 3 dB

12 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 0 -12

13 Sending Response 1,000 0 -6

2,000 4 -6

3,000 4 -6

3,400 4 -9

4,000 0 -

14 RLR(Normal volume) -4 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -6 -

Receiving Response

200 2 -

15

(Type 3.2)

300 2 -9

1,000 2 -7

3,400 2 -12

4,000 2 -

- 18 -

2. PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

16 STMR > 17 dB

17 Echo Loss > 40 dB

18 Idle Noise Sending < -64 dBm0p

19 Idle Noise Receiving < -36 dBm0p

Max. power < 330mA @GSM850, PL=5 < 250mA @PCS, PL=0

Standby < 5.5mA @PP2 < 3.3mA @PP5

20 Power consumption

< 2.7mA @PP9

Bluetooth (not support)

FM radio (not support)

Backup Battery(Without Main Battery) Normal Power Off: < 5uA Emergency Power Off: < 15uA

2.2 hr., Min.@GSM900, PL=5

21 Talk Time

4.0 hr., Min.@GSM900, PL=12

3.0 hr., Min.@DCS, PL=0

5.0 hr., Min.@DCS, PL=10

270 hr., Min.@PP9 220 hr., Min.@PP5

22 Standby Time - Full charge, no receive/send and keep GSM in idle mode

Broadcast set off. Signal strength display set at 3

levelabove. Backlight of phone set off.

At least 55 dB under below conditions:

23 Ringer Volume(TBD) 1. Ringer set as ringer.

2. Test distance set as 1 m.

24 Charge Current

Fast Charge: < 500 mA

Slow Charge: < 120 mA

25 Charging Time Under 3 hr.

Item Description Specification

Antenna Bar Number Power

5-92 dBm ~

4-100 dBm ~ -93 dBm

26 Antenna Display 3 skip

2-103 dBm ~ -101 dBm

1-105 dBm ~ -104 dBm

0~ -105 dBm

Battery Bar Number Voltage

1 → 03.54V 0.05V

27 Battery Indicator(TBD) 2 → 13.64V 0.05 V

3 → 23.75V 0.05 V

3 4.2V

28 Low Voltage Warning(TBD)

3.54 0.05 V (Call)

3.40 0.05 V (Standby)

29 Forced shut down Voltage 3.33 0.05V

30 Battery Type

Main Battery: Li-ion, 800mAh, Hard pack Back-up Battery: Lithium, 1mAh

31 Travel Charger

Input: 100 ~ 240 V, 50/60Hz Output: 4.8V, 900mA

- 19 -

2. PERFORMANCE

LGE Internal Use Only

- 20 -

3. TECHNICAL BRIEF

3.1 TX module (SKY77517/SKY77518, U401)

The SKY77517 is a Transmit and receive front-end-module (FEM) with Integrated Power Amplifier Control (iPAC) for dual-band cellular handsets comprising GSM850 and PCS1900 operation. Designed in a low profile, compact form factor, the SKY77517 offers a complete Transmit VCO-toAntenna and Antenna-to-Receive SAW filter solution. The FEM also supports class 12 General Packet Radio Service (GPRS) multi-slot operation.

The module consists of a GSM850 PA block and a PCS1900 PA block, impedance-matching circuitry for 50 ohm input and output impedances, TX harmonics filtering, high linearity and low insertion loss PHEMT RF switches, diplexer and a Power Amplifier Control (PAC) block with internal current sense resistor. A custom BiCMOS integrated circuit provides the internal PAC function and decoder circuitry to control the RF switches. The two Heterojunction Bipolar Transistor (HBT) PA blocks are fabricated onto a single Gallium Arsenide (GaAs) die. One PA block supports the GSM850 band and the other PA block supports the PCS 1900 band. Both PA blocks share common power supply pads to distribute current. The output of each PA block and the outputs to the two receiver pads are connected to the antenna pad through PHEMT RF switches and a diplexer. The GaAs die, PHEMT die, Silicon (Si) die and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.

Band selection and control of transmit and receive modes are performed using two external control pads. Refer to the functional block diagram in Figure 3.1 below. The band select pad (BS) selects between GSM and PCS modes of operation. The transmit enable (TX_EN) pad controls receive or transmit mode of the respective RF switch (TX = logic 1). Proper timing between transmit enable (TX_EN) and Analog Power Control (VRAMP) allows for high isolation between the antenna and TX_VCO while the VCO is being tuned prior to the transmit burst.

The SKY77517 is compatible with logic levels from 1.2V to VCC for BS and TX_EN pads, depending on the level applied to the VLOGIC pad. This feature provids additional flexibility for the designer in the selection of FEM interface control logic.

The SkY77518 is Txmodule for GSM900/DCS1800 dual-band. Every function and logic is equal tom the SKY77517.

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Figure 3.1.1 Functional Block Diagram

- 21 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Pin Mame Description

1 VCATT Battery input voltage

2 VLOGIC Control logic level selection/Standby control

3 VRAMP Analog power control voltage input

4 TX_EN TX/RX select (mode control)

5BSBand Select (mode control)

6 DCS_RX DCS Receive RF Output (1930-1990 MHz)

7 GSM_RX GSM Receive RF Output (869-894 MHz)

8-10 GND RF and DC Ground

11 ANT RF_IN/RF_OUT to Antenna

12-16 GND RF and DC Ground

17 GSM_IN RF input 824-849 MHz

18 NC No Connect

19 DCS_IN RF input 1850-1910 MHz

20 GND RF and DC Ground

GMD PADS GROUND GRID Ground Pads, module underside

Mode VLOGIC

Input Control Bits

TX_En BS

STANDBY 0 X

1

X

1

GSM_RX 1 0 0

CS_RX 1 0 1

GSM_TX 1 1 0

PCS_TX 1 1 1

Table 3.1.1 Pad description

Table 3.1.2 Mode Control logic

Figure 3.1.2 Pad configuration (Top view) and case marking

LGE Internal Use Only

Only for training and service purposes

3.2 Transceiver (AD6548, U402)

The AD6548 provides a highly integrated direct conversion radio solution that combines, on a single chip, all radio and power management functions necessary to build the most com-pact GSM radio solution possible. The only external components required for a complete radio design are the Rx SAWs, PA, Switchplexer and a few passives enabling an extremely small cost effective GSM Radio solution. The AD6548 uses the industry proven direct conversion receiver architecture of the OthelloTM family. For Quad band applications the front end features four fully integrated programmable gain differential LNAs. The RF is then down converted by quad-rature mixers and then fed to the baseband programmable-gain amplifiers and active filters for channel selection. The Receiver output pins can be directly connected to the baseband analog processor. The Receive path features automatic calibration and tracking to remove DC offsets. The transmitter features a translation-loop architecture for directly modulating baseband signals onto the integrated TX VCO.

The translation-loop modulator and TX VCO are extremely low noise removing the need for external SAW filters prior to the PA. The AD6548 uses a single integrated LO VCO for both the receive and the transmit circuits. The synthesizer lock times are optimized for GPRS applications up to and including class 12.

AD6548 incorporates a complete reference crystal calibration system. This allows the external VCTCXO to be replaced with a low cost crystal. No other external components are required. The AD6548 uses the traditional VCTCXO reference source. The AD6548 also contains on-chip low dropout voltage regulators (LDOs) to deliver regulated supply voltages to the functions on chip, with a battery input voltage of between 2.9V and 5.5V. Comprehensive power down options are included to minimize power consumption in normal use. A standard 3 wire serial interface is used to program the IC. The interface features low-voltage digital interface buffers compatible with logic levels from 1.6V to 2.9V.

3. TECHNICAL BRIEF

- 22 -

Figure 3.2 AD6548 Block Diagram

Antenna Switch Module

PA Module

GSM1800/1900

GSM850/90

VCC_TXVCO

TX Loop

Filt

er

TXOP_HI

LNA Gain Reducti

TX_LO2

TX_LO1

on

Interf

Serial

VDD

/2

RX LO

Generator

TX LO

Generator

ace

Control

Band

VBAT

TXOP_L

O

0

VCC_FE

RX850

RX850B

RX900

RX900B

RX1800

RX1800B

RX1900

RX1900B

SDATA

SCLK

SEN

PFD

TX_LO

1

Frac-N Synth

TX circuits

supply

LDO

Reg 3

VLDO1 VLDO2

DC Offset Correction

LO VCO

Suppl

y

LDO

Reg 2

AD6548

General

Suppl

LDO

Reg 1

VLDO

TX_LO

y

3

/4

Ref

2

VCTCXO

Supply

I

IB

VCC_BBI

VCC_

Q

QB

VAFC

REFIN

REF_OP

VCC_REF

TXIB

TXI

RXI

RXIB

TXQ

BBQ

TXQB

RXQ

RXQB

AFC

B

CLK

REF_OP

- 23 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Notes:

1. Supply regulated by internal LDO3 and should not be connected to any other supply

2. Internally connected as Synth supply (Counters + SDM + Charge pump)

3. Supply regulated by internal LDO2 and should not be connected to any other supply

AD6548/9 Pin Descriptions

No Name Description No Name Description

1 VCC_FE Front end supply (IP) 17 VCC_REF Reference Oscillator Supply (IP)

2I I baseband input/output 18

VAFC/ AD6548 Crystal Freq control (IP)

N/C AD6549: Spare Pin

3IBI baseband input/output 19 REFIN Crystal Connection

4 VCC_BBI Baseband I, TX path supply (IP) 20 REFINB Crystal Connection

5 SDATA Serial port data 21 REF_OP Reference Frequency Output

6 SCLK Serial port clock 22 QB Q baseband input/output

7 SEN Serial port enable 23 Q Q baseband input/output

8 N/C Not connected 24 VCC_BBQ Baseband Q supply (IP)

9 VLDO3 TX LDO Output (1) 25 RX1900B PCS 1900 LNA input

10 TXOP_LO Transmit O/P (850/900MHz) 26 RX1900 PCS 1900 LNA input

11 TXOP_HI Transmit O/P (1800/1900MHz) 27 RX1800B DCS 1800 LNA input

12 VCC_TXVCO TX VCO supply (1) 28 RX1800 DCS 1800 LNA input

13 VDD Serial interface supply 29 RX900B E-GSM LNA input

14 VBAT Battery I/P for LDO reg’s 30 RX900 E-GSM LNA input

15 VLDO1 LDO regulator Output (2) 31 RX850B GSM 850 LNA input

16 VLDO2 LO VCO Supply (3) 32 RX850 GSM 850 LNA input

GOMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

LGE Internal Use Only

Only for training and service purposes

3.3 26 MHz Clock (Crystal, X401)

The 26 MHz clock (X401) consists of a XO (Crystal Oscillator) which oscillates at a frequency of 26 MHz. The AD6548 requires only an external low cost crystal as the frequency reference. The circuitry to oscillate the crystal and tune its frequency is fully integrated. The Oscillator is a balanced implementation requiring the crystal to be connected across 2 pins. There is a programmable capacitor array included for coarse tuning of fixed offsets (e.g. crystal manufacturing tolerance), and an integrated varactor for dynamic control. The oscillator is designed for use with a 26MHz crystal. Dedicated control software ensures excellent frequency stability under all circumstances.

3. TECHNICAL BRIEF

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Figure 3.3 CRYSTAL CIRCUIT DIAGRAM

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3. TECHNICAL BRIEF

LGE Internal Use Only

3.4 Baseband Processor (AD6721, U102)

AD6721 is an ADI designed processor

AD6721 consists of

1. Control Processor Subsystem including: 32-bit MCU ARM7TDMI® Control Processor 65 MHz operation at 1.8V 2Mb of on-chip System SRAM Memory

2.DSP Subsystem including: 16-bit Fixed Point DSP Processor 91 MIPS[1] at 1.8V Data and Program SRAM Program Instruction Cache Full Rate, Enhanced Full Rate and Half Rate Speech Encoding/Decoding Capable of Supporting AMR & PDC Speech Algorithms

3.Peripheral Functions Parallel and Serial Display Interface USB 2.0 Full Speed device Interface Keypad Interface Flash Memory Interface Page-Mode Flash Support

1.8V and 3.0V, 64 kbps SIM Interface Universal System Connector Interface Data Services Interface Battery Interface (e.g. Dallas)

4. Other Supports 13 MHz and 26 MHz Input Clocks

1.8V Typical Core Operating Voltages 361-Ball Package (13x13mm) , 0.65mm Ball pitch

5. The AD6721 baseband transmit section supports the following

mobile station GMSK modulation power classes:

GSM 900/850 power classes 4 and 5, DCS 1800 power classes 1 and 2, and PCS 1900 power classes 1 and 2

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3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Figure 3.4 SYSTEM INTERCONECTION OF AD6721 EXTERNAL INTERFACE

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3. TECHNICAL BRIEF

LGE Internal Use Only

3.4.1 Interconnection with external devices

A. RTC block interface

Countered by external X-TAL The X-TAL oscillates 32.768KHz

B. LCD module interface

The LCD module is controlled by Camera backend IC AIT701G If AIT701G is in the state of by-pass mode, the LCD control signals from AD6721 are by-passed through AIT701G. In operating mode, the AIT701G controls the LCD module through L_MAIN_LCD_CS, L_SUB_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, L_DATA[15-00], 2V8_MV, LCD_IF, LCD_ID.

Signals Description

L_MAIN_LCD_CS MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin

pinL_SUB_LCD_CS SUB LCD driver chip enable. SUB LCD driver IC has own CS pin

LCD_ID Select LCD module maker

LCD_RESET This pin resets LCD module. This signal comes from AD6721 directly.

LCD_WR Enable writing to LCD Driver.

LCD_RD Enable reading to LCD Driver.

LCD_RS

This pin determines whether the data to LCD module are display data or control data. LCD_RS can select 16 bit parallel bus.

2V8_CAM 2.8V voltage is supplied to LCD driver IC.

IF_MODE

Select 16bits or 8bits interface mode for MAIN LCD. For the future

Table 3.4.B LCD CONTRON SIGNALS DISCRIPTION

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3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

The backlight of LCD module is controlled by AD6721 via AAT3155. The control signals related to Backlight LED are given bellow.

C. RF interface

The AD6721 control RF parts through PA_BAND, ANT_SW1, ANT_SW2, ANT_SW3 , CLKON , PA_EN, S_EN, S_DATA, S_CLK

Signals Description

MLED Current source for backlight LED

LCD_DIM_CTRL Control LCD backlight level in 16 steps

MLED[1:4] This pins are returned-paths for backlight LED current source (MLED)

Table 3.4.B2 DESCRIPTION OF LCD BACKLIGHT LED CONTROL

Signals Description

PA_BAND (GPO 17) PAM Band Select

ANT_SW1 (GPO 9)) Antenna switch Band Select

ANT_SW2 (GPO 10) Antenna switch Band Select

PA_EN (GPO 16) PAM Enable/Disable

S_EN (GPO 19) PLL Enable/Disable

S_DATA (GPO 20) Serial Data to PLL

S_CLK (GPO 21) Clock to PLL

Table 3.4.C RF CONTROL SIGNALS DESCRIPTION

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3. TECHNICAL BRIEF

LGE Internal Use Only

D. SIM interface

The AD6721 provides SIM Interface Module. The AD6721 checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST(GPIO_23) are required. The descriptions about the signals are given by bellow Table 3-4 in detail.

Signals Description

SIM_DATA

This pin receives and sends data to SIM card.

This model can support 3.0 volt and 1.8 volt interface SIM card.

SIM_CLK Clock 3.25MHz frequency.

SIM_RST

Reset SIM block

(GPIO_23)

Table 3.4.D SIM CONTROL SIGNALS DESCRIPTION

Figure 3.4.D2 SIM Interface of AD6721

SIM CONNECTOR

[Rev.C] Remove N.A. resistor (R246)

2V85_VSIM

R243

15K

0R249

C222

NA

C5 C6 C7 GND4

J200

GND1 GND2GND3

4 5 6

10

9

2V85_VSIM

1

C1

2

C2

3

C3

7 8

C223

C221

NA

220n

SIM_RST SIM_CLKSIM_DATA

C224

1000p

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3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

E. LDO Block

There are 9 LDOs in the AD6721.

- 1V8_VCORE: supplies Digital baseband Processor core and AD6721 digital core(1.8V, 80mA)

- 2V8_VMEM: supplies external memory and the interface to the external memory on the digital baseband processor (2.8V, 150mA)

- 2V8_VEXT: supplies Radio digital interface and high voltage interface (2.8V, 200mA)

- 2V85_VSIM: the SIM interface circuitry on the digital processor and SIM card (2.85V,1.8V, 20mA)

- 1V8_VRTC: supplies the Real-Time Clock module (1.8 V, 20 µA)

- 2V5_VMIC: supplies the microphone interface circuitry (2.5 V, 2 mA)

- 2V75_VVCXO: supplies the voltage controlled crystal oscillator (2.75 V, 10 mA)

- VUSB: supplies USB interface circuitry(3.2V, 20mA)

- VGP: supplies VDD_IO3 of MMP(3.2V, 40mA)

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3. TECHNICAL BRIEF

LGE Internal Use Only

3.5 Display and Interface

Controlled by L_MAIN_LCD_CS, L_SUB_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD,

LCD_IF, L_DATA[00:15] ports

• L_MAIN_LCD_CS: MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin

• LCD_RESET: This pin resets LCD module. This signal comes from AD6721 directly.

• LCD_RS: This pin determines whether the data to LCD module are display data or control data.

• LCD_WR: Write control Signal

• LCD_RD: Read control Signal. But this pin used only for debugging.

• L_DATA[00:15]: Parallel data lines.

• LCD_ID: LCD type selection signals

- LCD_ID: LCD maker(0V for LGIT, 2.8V for Sharp)

• For using 262K color, data buses should be 16 bits.

Properties Spec. Unit

Active Screen Size 33.8mm(W) x 46.24mm(H) mm

Color Depth 262K TFT colors

Resolution 128 X 160 dots

• Main LCD

Properties Spec. Unit

Active Screen Size 18.902mm(W) x 13.43mm(H) mm

Color Depth 65K CSTN colors

Resolution 96 x 64 dots

• Sub LCD