LG KP115a Service Manual
Service Manual
Model : KP115a
Service Manual
KP115a
Date: April, 2008 / Issue 1.0
Internal Use Only
- 3 -
1. INTRODUCTION ...............................5
1.1 Purpose .................................................. 5
1.2 Regulatory Information............................ 5
1.3 Abbreviations .......................................... 7
2. PERFORMANCE...............................9
2.1 H/W Features...........................................9
2.2 Technical Specification ..........................10
3. TECHNICAL BRIEF ........................15
3.1 TX module (SKY77518, U502) ..............15
3.2 Transceiver (AD6548, U503) .................17
3.3 26 MHz Clock (Crystal, X501)) ..............19
3.4 MP3 IC (VC0978BRDA, U305) ..............20
3.5 Baseband Processor (AD6724, U104)...21
3.6 Keypad Switches and Scanning ............27
3.7 Microphone ............................................28
3.8 Headset Interface...................................29
3.9 Key Back-light Illumination.....................30
3.10 LCD Back-light Illumination..................31
3.11 VIBRATOR...........................................32
3.12 FM RADIO INTERFACE ......................33
3.13 Battery Charging ..................................35
4. TROUBLE SHOOTING ...................36
4.1 RF Component.......................................36
4.2 RX Trouble.............................................37
4.3 TX Trouble .............................................40
4.4 Power On Trouble..................................44
4.5 Charging Trouble ...................................46
4.6 Vibrator Trouble .....................................48
4.7 LCD Trouble...........................................50
4.8 Speaker Trouble ....................................54
4.9 SIM Card Interface Trouble....................56
4.10 Earphone Trouble ................................58
4.11 KEY backlight Trouble .........................60
4.12 Receiver Trouble..................................62
4.13 Microphone Trouble .............................64
4.14 RTC Trouble ........................................66
4.15 FM Radio Trouble ................................68
4.16 MP3 Trouble ........................................71
5. DOWNLOAD.......................................74
5.1 Download ...............................................74
6. BLOCK DIAGRAM ..........................80
7. CIRCUIT DIAGRAM ........................81
8. BGA IC Pin Check ..........................87
9. PCB LAYOUT..................................91
10. ENGINEERING MODE ..................93
10.1 BB Test [MENU 1]................................94
10.2 RF Test [MENU 2]................................95
10.3 MF mode [MENU 3] .............................96
10.4 Trace option [MENU 4] ........................97
10.5 Call timer [MENU 5] .............................97
10.6 Fact. Reset [MENU 6] ..........................97
10.7 S/W version..........................................97
11. STAND ALONE TEST ...................98
11.1 Introduction ..........................................98
11.2 Setting Method.....................................98
11.3 Means of Test ......................................99
12. AUTO CALIBRATION .................101
12.1 Overview ............................................101
12.2 Equipment List ...................................101
12.3 Test Jig Operation..............................102
12.4 Procedure ..........................................103
12.5 AGC ...................................................105
12.6 APC....................................................105
12.7 ADC ...................................................105
13. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 107
13.1 Exploded View .................................. 107
13.2 Replacement Parts ............................109
13.3 Accessory ......................................... 121
Table Of Contents
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 6 -
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 7 -
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
- 8 -
1. INTRODUCTION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Pseudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
- 9 -
2. PERFORMANCE
2.1 H/W Features
2. PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Feature Comment
Standard Battery Li-ion, 3.7V 900mAh
Talk time Up to 230min : GSM Tx Level 7
Stand by time Up to 390 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx. 3 hours
RX Sensitivity -102dBm
TX output power
GSM850 : 32.5dBm(Level 5),
PCS : 29.5dBm(Level 0)
GPRS compatibility Class 10
SIM card type 3V, 1.8V Small
Display MAIN : CSTN 128 × 128 pixel 65K Color
Hard icons. Key Pad
Status Indicator 0 ~ 9, #, *, Up/Down/Left/Right/Ok Navigation Key
Menu Key, Back Key, Send Key, PWR Key
ANT Internal
EAR Phone Jack Yes (Stereo)
PC Synchronization Yes
Speech coding EFR/FR/HR
Data Yes
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
Speaker/Receiver O/O
Travel Adapter Yes
MIDI 64poly (Mono SPK)
Camera No
Bluetooth / FM Radio 76~108MHz supported
- 10 -
2. PERFORMANCE
2.2 Technical Specification
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM850
GSM850 TX : 824 - 849 MHz
1Frequency Band
GSM850 RX : 869 - 894 MHz
PCS
PCS1900 TX : 1850 - 1910 MHz
PCS1900 RX : 1930 - 1990 MHz
2 Phase Error
RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM850
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
PCS
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
- 11 -
2. PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM850
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
5
Output RF Spectrum 6,000 -71
(due to modulation) PCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM850
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
- 12 -
2. PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
DCS
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM850
8Bit Error Ratio
BER (Class II) < 2.439% @-102 dBm
PCS
BER (Class II) < 2.439% @-102 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500
*
-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*
Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
- 13 -
2. PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
2.5ppm
(13 MHz) tolerance
19 32.768KHz tolerance 30ppm
At least 65 dBspl under below conditions:
20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
21 Charge Current
Fast Charge : < 600 mA
Slow Charge : < 120 mA
Antenna Bar Number Power
5 -85 dBm ~
4-90 dBm ~ -86 dBm
22 Antenna Display 3 -95 dBm ~ -91 dBm
2-100 dBm ~ -96 dBm
1-105 dBm ~ -101 dBm
0~ -105 dBm
Battery Bar Number Voltage
Power off 3.30V 0.05 V
23 Battery Indicator 0(blink) 3.54V 0.05 V
13.64V 0.05 V
23.75V 0.05 V
33.76V 0.05 V ~
24 Low Voltage Warning
3.54 0.05 V (Call) every 1 minutes
3.4 0.05 V (Standby)
- 14 -
2. PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
25 Forced shut down Voltage 3.35 0.05V
1 Li-ion Battery
26 Battery Type
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz
Output: 4.8V ~ 6.4V, 400 mA
- 15 -
3. TECHNICAL BRIEF
3.1 TX module (SKY77517, U502)
The SKY77517 is a Transmit and receive front-end-module (FEM) with Integrated Power Amplifier
Control (iPAC) for dual-band cellular handsets comprising GSM850 and PCS operation. Designed in
a low profile, compact form factor, the SKY77517 offers a complete Transmit VCO-to-Antenna and
Antenna-to-Receive SAW filter solution. The FEM also supports class 12 General Packet Radio
Service (GPRS) multi-slot operation.
The module consists of a GSM850 PA block and a PCS PA block, impedance-matching circuitry for
50 ohm input and output impedances, TX harmonics filtering, high linearity and low insertion loss
PHEMT RF switches, diplexer and a Power Amplifier Control (PAC) block with internal current sense
resistor. A custom BiCMOS integrated circuit provides the internal PAC function and decoder
circuitry to control the RF switches. The two Heterojunction Bipolar Transistor (HBT) PA blocks are
fabricated onto a single Gallium Arsenide (GaAs) die. One PA block supports the GSM850 band and
the other PA block supports the PCS band. Both PA blocks share common power supply pads to
distribute current. The output of each PA block and the outputs to the two receiver pads are
connected to the antenna pad through PHEMT RF switches and a diplexer. The GaAs die, PHEMT
die, Silicon (Si) die and passive components are mounted on a multi-layer laminate substrate. The
assembly is encapsulated with plastic overmold.
Band selection and control of transmit and receive modes are performed using two external control
pads. Refer to the functional block diagram in Figure 3.1 below. The band select pad (BS) selects
between GSM and PCS modes of operation. The transmit enable (TX_EN) pad controls receive or
transmit mode of the respective RF switch (TX = logic 1). Proper timing between transmit enable
(TX_EN) and Analog Power Control (VRAMP) allows for high isolation between the antenna and
TX_VCO while the VCO is being tuned prior to the transmit burst.
The SKY77517 is compatible with logic levels from 1.2V to VCC for BS and TX_EN pads, depending
on the level applied to the VLOGIC pad. This feature provids additional flexibility for the designer in
the selection of FEM interface control logic.
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3.1 Functional Block Diagram
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
- 16 -
Table 3.1 Pad description
Table 3.2 Mode Control logic
Figure 3.2 Pad configuration (Top view) and case marking
Pin Mame Description
1 VBATT Battery input voltage
2 VLOGIC Control logic level selection/Standby control
3VRAMP Analog power control voltage input
4 TX_EN TX/RX select (mode control)
5BSBand Select (mode control)
6PCS_RX PCS Receive RF Output (1930-1990 MHz)
7 GSM_RX GSM Receive RF Output (869-894 MHz)
8 GND RF and DC Ground
9 GND RF and DC Ground
10 GND RF and DC Ground
11 ANT RF_IN/RF_OUT to Antenna
12 GND RF and DC Ground
13 GND RF and DC Ground
14 GND RF and DC Ground
15 GND RF and DC Ground
16 GND RF and DC Ground
17 GSM_IN RF input 824-849 MHz
18 NC No Connect
19 PCS_IN RF input 1850-1910 MHz
20 GND RF and DC Ground
GMD PADS GROUND GRID Ground Pads, module underside
Mode V
LOGIC
Input Control Bits
TX_En BS
STANDBY 0 X
1
X
1
GSM_RX 1 0 0
PCS_RX 1 0 1
GSM_TX 1 1 0
PCS_TX 1 1 1
- 17 -
3. TECHNICAL BRIEF
3.2 Transceiver (AD6548, U503)
The AD6548 provides a highly integrated direct conversion radio solution that combines, on a single chip, all
radio and power management functions necessary to build the most com-pact GSM radio solution possible.
The only external components required for a complete radio design are the Rx SAWs, PA, Switchplexer and a
few passives enabling an extremely small cost effective GSM Radio solution. The AD6548 uses the industry
proven direct conversion receiver architecture of the OthelloTM family. For Quad band applications the front
end features four fully integrated programmable gain differential LNAs. The RF is then down converted by
quad-rature mixers and then fed to the baseband programmable-gain amplifiers and active filters for channel
selection. The Receiver output pins can be directly connected to the baseband analog processor. The Receive
path features automatic calibration and tracking to remove DC offsets. The transmitter features a translationloop
architecture for directly modulating baseband signals onto the integrated TX VCO. The translation-loop
modulator and TX VCO are extremely low noise removing the need for external SAW filters prior to the PA.
The AD6548 uses a single integrated LO VCO for both the receive and the transmit circuits. The synthesizer
lock times are optimized for GPRS applications up to and including class 12.
AD6548 incorporates a complete reference crystal calibration system. This allows the external VCTCXO to be
replaced with a low cost crystal. No other external components are required. The AD6548 uses the traditional
VCTCXO reference source. The AD6548 also contains on-chip low dropout voltage regulators (LDOs) to
deliver regulated supply voltages to the functions on chip, with a battery input voltage of between 2.9V and 5.5V.
Comprehensive power down options are included to minimize power consumption in normal use. A standard 3
wire serial interface is used to program the IC. The interface features low-voltage digital interface buffers
compatible with logic levels from 1.6V to 2.9V.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3.3 AD6548 Block Diagram
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Notes:
1. Supply regulated by internal LDO3 and should not be connected to any other supply
2. Internally connected as Synth supply (Counters + SDM + Charge pump)
3. Supply regulated by internal LDO2 and should not be connected to any other supply
3. TECHNICAL BRIEF
- 18 -
Table 1 AD6548/9 Pin Descriptions
No Name Description No Name Description
1 VCC_FE Front end supply (IP) 17 VCC_REF Reference Oscillator Supply (IP)
2I I baseband input/output 18 VAFC/ AD6548 Crystal Freq control (IP)
N/C AD6549: Spare Pin
3IBI baseband input/output 19 REFIN Crystal Connection
4 VCC_BBI Baseband I, TX path supply (IP) 20 REFINB Crystal Connection
5 SDATA Serial port data 21 REF_OP Reference Frequency Output
6 SCLK Serial port clock 22 QB Q baseband input/output
7 SEN Serial port enable 23 Q Q baseband input/output
8 N/C Not connected 24 VCC_BBQ Baseband Q supply (IP)
9 VLDO3 TX LDO Output (1) 25 RX1900B PCS 1900 LNA input
10 TXOP_LO Transmit O/P (850/900MHz) 26 RX1900 PCS 1900 LNA input
11 TXOP_HI Transmit O/P (1800/1900MHz) 27 RX1800B DCS 1800 LNA input
12 VCC_TXVCO TX VCO supply (1) 28 RX1800 DCS 1800 LNA input
13 VDD Serial interface supply 29 RX900B E-GSM LNA input
14 VBAT Battery I/P for LDO reg’s 30 RX900 E-GSM LNA input
15 VLDO1 LDO regulator Output (2) 31 RX850B GSM 850 LNA input
16 VLDO2 LO VCO Supply (3) 32 RX850 GSM 850 LNA input
GOMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
- 19 -
3. TECHNICAL BRIEF
3.3 26 MHz Clock (Crystal, X501)
The 26 MHz clock (X501) consists of a XO (Crystal Oscillator) which oscillates at a frequency of 26 MHz. The
AD6548 requires only an external low cost crystal as the frequency reference. The circuitry to oscillate the crystal
and tune its frequency is fully integrated. The Oscillator is a balanced implementation requiring the crystal to be
connected across 2 pins. There is a programmable capacitor array included for coarse tuning of fixed offsets (e.g.
crystal manufacturing tolerance), and an integrated varactor for dynamic control. The oscillator is designed for use
with a 26MHz crystal. Dedicated control software ensures excellent frequency stability under all circumstances.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3.4 CRYSTAL CIRCUIT DIAGRAM
X501
DSX321G-26M
EXXY0025201
12
34
26MHz
- 20 -
3. TECHNICAL BRIEF
3.4 MP3 IC (VC0978BRDA, U305)
- 1.8-3.3V power supply for digital I/O
- 1.8V power supply for digital core
- PLL input clock 3-36MHz
- PC interface : USB 2.0 device HS,FS, U-disk function, FAT16/32 file system
- storage interface : SD card(1bit/4bit), MMC card, T-flash, 8-bit NAND flash card
- I2S audio interface
- MP3 decoder
- ADPCM decoder
- MIDI 64poly
- Stereo DAC
- Stereo headset amplifiers
- Single speaker amplifiers
- Bypass function
LGE Internal Use Only
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Figure 3.5 VC0978 AUDIO PROCESSOR SYSTEM
- 21 -
3. TECHNICAL BRIEF
3.5 Baseband Processor (AD6724, U104)
• AD6721 is an ADI designed processor
• AD6721 consists of
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FEATURES-DIGITAL
Complete Integrated Programmable Digital
Baseband Processor divided into three main
subsystems:
Control Processor Subsystem including:
• 32-bit MCU ARM7TDMI® Control Processor
• 39 MHz operation at 1.8V
• 1Mb of on-chip System SRAM Memory
DSP Subsystem including:
• 16-bit Fixed Point DSP Processor
• 91 MIPS[1] at 1.8V
• Data and Program SRAM
• Program Instruction Cache
• Full Rate, Enhanced Full Rate and Half Rate
• Speech Encoding/Decoding
• Capable of Supporting AMR & PDC Speech
Algorithms
Peripheral Functions
• Parallel and Serial Display Interface
• Keypad Interface
• Flash Memory Interface
• Page-Mode Flash Support
• 1.8V and 3.0V, 64 kbps SIM Interface
• Universal System Connector Interface
• Data Services Interface
• Battery Interface (e.g. Dallas)
Control of Radio Subsystem
Three independent programmable backlight
outputs
Real Time Clock with Alarm
Programmable Power Management and Clock
Management Supports 13 MHz and 26 MHz
Input Clocks
Slow Clocking Scheme for Low Idle Mode
Current Power Down modes
On-chip support for GSM Data Services up to
14.4Kbits/sec, GPRS, HSCSD and IrDA
JTAG Interface for Test and In-Circuit Emulation
FEATURES-ANALOG
Baseband Transmit Section
• GMSK Modulator
• I-channel & Q-channel Transmit DACs and
Filters
• Power Ramping DAC
Baseband Receive Section
• I-channel and Q-channel Receive ADCs and
Filters
Auxiliary Section
• Voltage Reference
• Automatic Frequency Control DAC
• Auxiliary ADC
• Light Controllers
Audio Section
• 8 kHz & 16 kHz Voiceband Codec
• 48 kHz Monophonic DAC
• Power Amplifiers
Poer Management Section
• Voltage Regulators
• Battery Charger
• Battery Protection
264-Ball package (17x17 grid), 12x12mm,
0.65mm ball pitch
APPLICATIONS
GSM850/GSM900/DCS1800/PCS1900 Wireless
Terminals GSM Phase 2 Compliant
- 22 -
3. TECHNICAL BRIEF
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Figure 3.5 SYSTEM INTERCONECTION OF AD6721 EXTERNAL INTERFACE
- 23 -
3. TECHNICAL BRIEF
3.5.1 Interconnection with external devices
A. RTC block interface
Countered by external X-TAL
The X-TAL oscillates 32.768KHz
B. LCD module interface
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Signals Description
nLCD_MAIN_CS MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin
LCD_SCLK This signal transfer serial clock to driver IC.
LCD_ID Select LCD module maker(2.8V : GP, 0V : SHARP)
nLCD_RESET This pin resets LCD module. This signal comes from AD6724 directly.
LCD_SDATA This signal transfer serial data to driver IC.
Table 3.5.B LCD CONTRON SIGNALS DISCRIPTION
0V
Voltage
Low
High
SHARP
LCD & CHARGE PUMP
2.8V
ID
LCD Connector
GP
MAKER
R216
47R223
75K
ECCH0004904
1u
C222
VBAT
4
5
IN
NC
12
U202
C1+
10
9
C1-
7
C2+
6
C2-
CP
8
1
D1
D2
2
3
D3
EN_SET
11
GND
AAT3157ITP-T1
EUSY0238702
R227 47
C221
ECZH0001215
1u
C232
27p
C231
DNI 100K
R230
R224 47
C220
ECCH0004904
1u
C223
27p
R226 47
43K
R219
C241
ECCH0004904
1u
1u
C234
EVLC5S0250
SEVY0005201
VA207
MIPG
C226
5
6
7
8
9
27p
14
15
1
10
11
12
13
2
3
4
ENQY0014701
IMSA-9671S-13Y912
J202
MIPD
27p
C235
2V8_VEXT
C238
DNIDNI
C237
C224
27p
27p
C236
C225
DNI
MLED
LCD_SCLK
nLCD_MAIN_CS
LCD_SDATA
LCD_BACKLIGHT_CTRL
MLED1
MLED2
MLED1
MLED2
LCD_ID
MLED
nLCD_RESET
- 24 -
3. TECHNICAL BRIEF
The backlight of LCD module is controlled by AD6724 via AAT3157.
The control signals related to Backlight LED are given bellow.
C. RF interface
The AD6724 control RF parts through PA_BAND, ANT_SW, PA_EN, S_EN, S_DATA, S_CLK
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Signals Description
MLED Current source for backlight LED
LCD_BACKLIGHT_CTRL Control LCD backlight level in 16 steps
MLED[1:2] This pins are returned-paths for backlight LED current source
(MLED)
Table 3.5.B2 DESCRIPTION OF LCD BACKLIGHT LED CONTROL
Signals Description
PA_BAND (GPO 3) PAM Band Select
ANT_SW (GPO 9) Antenna switch Band Select
PA_EN (GPO11) PAM Enable/Disable
S_EN (GPO 19) PLL Enable/Disable
S_DATA (GPO 20) Serial Data to PLL
S_CLK (GPO 21) Clock to PLL
Table 3.5.C RF CONTROL SIGNALS DESCRIPTION
- 25 -
3. TECHNICAL BRIEF
D. SIM interface
The AD6724 provides SIM Interface Module. The AD6724 checks status periodically during
established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep
mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK,
nSIM_RST(GPIO_23) are required. The descriptions about the signals are given by bellow Table 35 in detail.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Signals Description
SIM_DATA
This pin receives and sends data to SIM card.
This model can support 3.0 volt and 1.8 volt interface SIM card.
SIM_CLK Clock 3.25MHz frequency.
SIM_RST
Reset SIM block
(GPIO_23)
Table 3.5.D SIM CONTROL SIGNALS DESCRIPTION
Figure 3.5.D2 SIM Interface of AD6724
SIM SOCKET
DNI
C230
C2
2
3
C3
C5
4
5
C6
6
C7
GND1
7
8
GND2
9
GND3
GND4
10
J201
5000-6P-1.8SL
ENSY0018701
C1
1
C229
1000p
220n
C228
2V85_VSIM
C227
R218
DNI
15K
2V85_VSIM
DNI
R217
2V85_VSIM
SIM_DATA SIM_CLK
nSIM_RST
- 26 -
3. TECHNICAL BRIEF
E. LDO Block
There are8 LDOs in the AD6724.
- 1V8_VCORE : supplies Digital baseband Processor core and AD6724 digital core(1.8V, 80mA)
- 2V8_VMEM : supplies external memory and the interface to the external memory on the digital
baseband processor (2.8V, 150mA)
- 2V8_VEXT : supplies Radio digital interface and high voltage interface (2.8V, 200mA)
- 2V85_VSIM : supplies the SIM interface circuitry on the digital processor and SIM card
(2.85V,1.8V, 20mA)
- 1V8_VRTC : supplies the Real-Time Clock module (1.8 V, 20 µA)
- 2V5_VMIC : supplies the microphone interface circuitry (2.5 V, 2 mA)
- 2V75_VVCXO: supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)
-2V75_VABB:analog basand relulator
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 27 -
3. TECHNICAL BRIEF
3.6 Keypad Switches and Scanning
The key switches are metal domes, which make contact between two concentric pads on the keypad
layer of the PCB when pressed. There are 20 switches connected in a matrix of 5rows by 4 columns,
as shown in Figure 3-8, except for the power switch (END), which is connected independently.
Functions, the row and column lines of the keypad are connected to ports of AD6724. The columns
are outputs, while the rows are inputs and have pull-up resistors built in. When a key is pressed, the
corresponding row and column are connected together, causing the row input to go low and generate
an interrupt. The columns/rows are then scanned by AD6724 to identify the pressed key.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3.8 Keypad Switches and Scanning
9
2
END
7
MENU
KEY Matrix
*
3
5
LEFT
6
OK
1
#
DOWN
0
4
UP
SEL SEND
RIGHT
8
DNI
C429
0
C423
DNI
2
10K
R428
VBAT
C425
DNI
R431 680
SW412
SW404
C426
DNI
R432 680
DNI
C428
9
SW402
R426
680
SW408
3
5
DNI
C417
SW403
SW401
SW421
C420
DNI
R430 680
R427
680
680
R421
DNI
R422
680
C427
SW417
SW416
8
C430
4
DNI
6
SW420
7
1
SW419
R433 680
680
R425
680
R429
KEY_ROW0
KEY_COL0
KEY_COL1
KEY_COL2
KEY_COL3
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4
nPOWER_KEY
- 28 -
3. TECHNICAL BRIEF
3.7 Microphone
The microphone is placed to the Front cover and soldered to main PCB. The audio signal is passed to
VINNORN and VINNORP pins of AD6724. The voltage supply VMIC is output from AD6721, and is a
biased voltage for the MIC_P. The MIC_P and MIC_N signals are then A/D converted by the voice
band ADC part of AD6724.
The digitized speech (PCM 8KHz ,16KHz) is then passed to the DSP section of AD6724 for
processing (coding, interleaving etc).
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3.9 Connection between Microphone
MAIN_MIC
2V5_VMIC
39p
C211
C202
10u
ECTH0001701
C205
27p
C207
39p
100ohm
R205
1
2
MIC201
OB4-15L42-C33L
SUMY0003802|mic_ob4_15l42_c33_bottomview
0.1u
C208
2.2K
R204
2.2K
R208
SEVY0004101
VA204
ICVN0505X150FR
C206
39p
C210
39p
SEVY0004101
ICVN0505X150FR
VA203
1K
R202
100ohm
R206
VINNORN
VINNORP
39p
C129
39p
C135
C130
39p
C132
39p
R123 0
39p
C131
C133
39p
R120 0
N17
M17
AIN1P
P17
AIN2N
R17
AIN2P
L17
AIN3N
AIN3P
L16
K17
AOUT1N
AOUT1P
H16
R15
AOUT2N1
P14
AOUT2N2
AOUT2P1
R16
P15
AOUT2P2
AOUT3N
J17
H17
AOUT3P
AIN1N
C134
39p
SPK_N
VINNORP
VINNORN
AUXIN
AUXIP
SPK_P
REC_P
REC_N
- 29 -
3. TECHNICAL BRIEF
3.8 Headset Interface
This phone has 4 electrodes such as GND, AUXIP, AUXIN, nJACK_DET.
Switching from Receiver to Headset Jack
If jack is inserted, JACK_DETECT goes from high to low.
Audio path is switched from receiver to earphone by JACK_DETECT interrupt.
Switching from Headset Jack to Receiver
If jack is removed, JACK_DETECT goes from low to high.
Audio path is switched from earphone to receiver by JACK_DETECT interrupt.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3.11 HEADSET JACK INTERFACE
0.1u
C404
8
1A1B0
10
1B1
1
2A
52
2B0
3
2B1
4
GND
S1
7
S2
6
9
VCC
U402
FSA2268TUMX
EUSY0340301
ECTH0003401
C415
33u
10u
ECTZ0003701
C437
10uC436
ECTZ0003701
100K
R407
2V8_VEXT
33u
C416
ECTH0003401
HEADSET_RADIO_SEL
AUXOP_FM_R
AUXON_FM_L
AUXON
AUXOP
HP_R
HP_L
* U406 : NA
(1
for RADIO
I/O CONNECTOR
for RADIO
(KP110a/115a/110/115b)
100K
R419
DNI
C410
2V5_VMIC
FB404
C419
2V8_VEXT
DN
R420
100K
VUSBIN_IO
0.1uC412
1800FB403
2.2KR413
3
4
5
6
7
8
9
1
10
19
2
21
CN401
R438
0
R440
R439 0
0
1.5K
R412
NC2
9
OUT1
6
7
OUT2
_EN
10
3
_FLAG
EUSY0356701
NCP347MTAFTBG
U406
GND
2
11
GND_PAD
1
IN1
4
IN2
IN3
5
IN_PAD
12
8
NC1
FB402 1800
C418
10u
C411
C414
VBAT
ECCH0003002
VCHARGE_IO
39p
C409
0.1u
1800
FB401
USB-
USB+
AUXOP_FM_R
AUXON_FM_L
nJACK_DET
AUXIP
AUXIN
- 30 -
3. TECHNICAL BRIEF
3.9 Key Back-light Illumination
In key back-light illumination, there are 6 Blue LEDs in Main Board, which are driven by
nKEY_BACKLIGHT signal from AD6724.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3.12 KEY BACK-LIGHT ILLUMINTION
(10V,K,X7R)
KEY BACKLIGHT
LEBB-S14E
LD204
LD205
LEBB-S14E
ECZH0003103
C240
0.1u
0.1u
ECZH0003103
C239
LD201
LEBB-S14E
EDLH0004501
R220
100ohm
100ohm
R225
LD206
LEBB-S14E
LEBB-S14E
LD203
VBAT
LD202
LEBB-S14E
VBAT
R221 100ohm
100ohm
R229
R228
100ohm
R222 100ohm
nKEY_BACKLIGHT
- 31 -
3. TECHNICAL BRIEF
3.10 LCD Back-light Illumination
LCD backlight LEDs is controlled by AD6724 via AAT3157, U202.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3.13 MAIN LCD BACKLIGHT ILLUMINATION
Figure 3-5-3. Charge pump Output Current
LCD & CHARGE PUMP
R216
75K
ECCH0004904
1u
C222
VBAT
4
5
IN
NC
12
U202
C1+
10
9
C1-
7
C2+
6
C2-
CP
8
1
D1
D2
2
3
D3
EN_SET
11
GND
AAT3157ITP-T1
EUSY0238702
C221
ECZH0001215
1u
C220
ECCH0004904
1u
C223
27p
43K
R219
C241
ECCH0004904
1u
C226
27p
2V8_VEXT
C224
27p
C225
DNI
MLED
LCD_BACKLIGHT_CTRL
MLED1
MLED2
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