LG KP110 Service Manual

KP110 SVC svc cover(5.5) 2008.2.22 1:48 PM ˘`1

Service Manual

Internal Use Only

Service Manual

KP110

Model : KP110

Date: February, 2008 / Issue 1.0

- 3 -

1. INTRODUCTION ...............................5

1.1 Purpose .................................................. 5

1.2 Regulatory Information............................ 5

1.3 Abbreviations .......................................... 7

2. PERFORMANCE...............................9

2.1 H/W Features...........................................9

2.2 Technical Specification ..........................10

3. TECHNICAL BRIEF ........................15

3.1 TX module (SKY77518, U502) ..............15

3.2 Transceiver (AD6548, U503) .................17

3.3 26 MHz Clock (Crystal, X501)) ..............19

3.4 MP3 IC (VC0978BRDA, U305) ..............20

3.5 Baseband Processor (AD6724, U104)...21

3.6 Keypad Switches and Scanning ............27

3.7 Microphone ............................................28

3.8 Headset Interface...................................29

3.9 Key Back-light Illumination.....................30

3.10 LCD Back-light Illumination..................31

3.11 VIBRATOR...........................................32

3.12 FM RADIO INTERFACE ......................33

3.13 Battery Charging ..................................35

4. TROUBLE SHOOTING ...................36

4.1 RF Component.......................................36

4.2 RX Trouble.............................................37

4.3 TX Trouble .............................................40

4.4 Power On Trouble..................................44

4.5 Charging Trouble ...................................46

4.6 Vibrator Trouble .....................................48

4.7 LCD Trouble...........................................50

4.8 Speaker Trouble ....................................54

4.9 SIM Card Interface Trouble....................56

4.10 Earphone Trouble ................................58

4.11 KEY backlight Trouble .........................60

4.12 Receiver Trouble..................................62

4.13 Microphone Trouble .............................64

4.14 RTC Trouble ........................................66

4.15 FM Radio Trouble ................................68

4.16 MP3 Trouble ........................................71

5. DOWNLOAD.......................................74

5.1 Download ...............................................74

6. BLOCK DIAGRAM ..........................80

7. CIRCUIT DIAGRAM ........................81

8. BGA IC Pin Check ..........................87

9. PCB LAYOUT..................................91

10. ENGINEERING MODE ..................93

10.1 BB Test [MENU 1]................................94

10.2 RF Test [MENU 2]................................95

10.3 MF mode [MENU 3] .............................96

10.4 Trace option [MENU 4] ........................97

10.5 Call timer [MENU 5] .............................97

10.6 Fact. Reset [MENU 6] ..........................97

10.7 S/W version..........................................97

11. STAND ALONE TEST ...................98

11.1 Introduction ..........................................98

11.2 Setting Method.....................................98

11.3 Means of Test ......................................99

12. AUTO CALIBRATION .................101

12.1 Overview ............................................101

12.2 Equipment List ...................................101

12.3 Test Jig Operation..............................102

12.4 Procedure ..........................................103

12.5 AGC ...................................................105

12.6 APC....................................................105

12.7 ADC ...................................................105

13. EXPLODED VIEW &

REPLACEMENT PART LIST ..... 107

13.1 Exploded View .................................. 107

13.2 Replacement Parts ............................109

13.3 Accessory ......................................... 121

Table Of Contents

LGE Internal Use Only

- 4 -

LGE Internal Use Only

Only for training and service purposes

- 5 -

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

- 6 -

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

Only for training and service purposes

- 7 -

1. INTRODUCTION

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

LGE Internal Use Only

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

OPLL Offset Phase Locked Loop

- 8 -

1. INTRODUCTION

LGE Internal Use Only

Only for training and service purposes

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

PSRAM Pseudo SRAM

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

- 9 -

2. PERFORMANCE

2.1 H/W Features

2. PERFORMANCE

LGE Internal Use Only

Item Feature Comment

Standard Battery Li-ion, 3.7V 900mAh

Talk time Up to 230min : GSM Tx Level 7

Stand by time Up to 390 hours (Paging Period: 5, RSSI: -85 dBm)

Charging time Approx. 3 hours

RX Sensitivity -102dBm

TX output power

GSM900 : 32.5dBm(Level 5),

DCS : 29.5dBm(Level 0)

GPRS compatibility Class 10

SIM card type 3V,1.8V Small

Display MAIN : CSTN 128 × 128 pixel 65K Color

Hard icons. Key Pad

Status Indicator 0 ~ 9, #, *, Up/Down/Left/Right/Ok Navigation Key

Menu Key, Back Key, Send Key, PWR Key

ANT Internal

EAR Phone Jack Yes (Stereo)

PC Synchronization Yes

Speech coding EFR/FR/HR

Data Yes

Vibrator Yes

Loud Speaker Yes

Voice Recoding Yes

Microphone Yes

Speaker/Receiver O/O

Travel Adapter Yes

MIDI 64poly (Mono SPK)

Camera No

Bluetooth / FM Radio 76~108MHz supported

- 10 -

2. PERFORMANCE

2.2 Technical Specification

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

GSM900

TX: 890 + 0.2 x (N-1024) MHz (N=975~1023)

1Frequency Band

RX: 935 + 0.2 x (N-1024) MHz (N=975~1023)

DCS

TX: 1710.2 + 0.2x( N-512 ) MHz (N=512~885) RX: 1805.2 + 0.2x( N-512 ) MHz (N=512~885)

2 Phase Error

RMS < 5 degrees Peak < 20 degrees

3 Frequency Error < 0.1 ppm

GSM900

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

4 Power Level 12 19 dBm 3dB

DCS

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

- 11 -

2. PERFORMANCE

LGE Internal Use Only

Item Description Specification

GSM900

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -63

3,000~ <6,000 -65

5

Output RF Spectrum 6,000 -71

(due to modulation) DCS

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -65

3,000~ <6,000 -65

6,000 -73

GSM900

Offset from Carrier (kHz) Max. (dBm)

Output RF Spectrum 400 -19

6

(due to switching transient) 600 -21

1,200 -21

1,800 -24

- 12 -

2. PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

DCS

Offset from Carrier (kHz). Max. (dBm)

Output RF Spectrum 400 -22

6

(due to switching transient) 600 -24

1,200 -24

1,800 -27

7 Spurious Emissions Conduction, Emission Status

GSM900

8Bit Error Ratio

BER (Class II) < 2.439% @-102 dBm

DCS

BER (Class II) < 2.439% @-102 dBm

9 RX Level Report Accuracy 3 dB

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6

3,000 4 -6

3,400 4 -9

4,000 0 -

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 2 -7

500

*

-5

13 Receiving Response 1,000 0 -5

3,000 2 -5

3,400 2 -10

4,000 2

*

Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.

- 13 -

2. PERFORMANCE

LGE Internal Use Only

Item Description Specification

14 STMR 13 5 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

-20 30.7

16 Distortion

-10 33.3

0 33.7

7 31.7

10 25.5

17 Side Tone Distortion Three stage distortion < 10%

18

System frequency

2.5ppm

(13 MHz) tolerance

19 32.768KHz tolerance 30ppm

At least 65 dBspl under below conditions:

20 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm

21 Charge Current

Fast Charge : < 600 mA Slow Charge : < 120 mA

Antenna Bar Number Power

5 -85 dBm ~

4-90 dBm ~ -86 dBm

22 Antenna Display 3 -95 dBm ~ -91 dBm

2-100 dBm ~ -96 dBm

1-105 dBm ~ -101 dBm

0~ -105 dBm

Battery Bar Number Voltage

Power off 3.30V 0.05 V

23 Battery Indicator 0(blink) 3.54V 0.05 V

13.64V 0.05 V

23.75V 0.05 V

33.76V 0.05 V ~

24 Low Voltage Warning

3.54 0.05 V (Call) every 1 minutes

3.4 0.05 V (Standby)

- 14 -

2. PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

25 Forced shut down Voltage 3.35 0.05V

1 Li-ion Battery

26 Battery Type

Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 800mAh

Switching-mode charger

27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz

Output: 4.8V ~ 6.4V, 400 mA

- 15 -

3. TECHNICAL BRIEF

3.1 TX module (SKY77518, U502)

The SKY77518 is a Transmit and receive front-end-module (FEM) with Integrated Power Amplifier Control (iPAC) for dual-band cellular handsets comprising GSM800 and DCS operation. Designed in a low profile, compact form factor, the SKY77518 offers a complete Transmit VCO-to-Antenna and Antenna-to-Receive SAW filter solution. The FEM also supports class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of a GSM800 PA block and a DCS PA block, impedance-matching circuitry for 50 ohm input and output impedances, TX harmonics filtering, high linearity and low insertion loss PHEMT RF switches, diplexer and a Power Amplifier Control (PAC) block with internal current sense resistor. A custom BiCMOS integrated circuit provides the internal PAC function and decoder circuitry to control the RF switches. The two Heterojunction Bipolar Transistor (HBT) PA blocks are fabricated onto a single Gallium Arsenide (GaAs) die. One PA block supports the GSM800 band and the other PA block supports the DCS band. Both PA blocks share common power supply pads to distribute current. The output of each PA block and the outputs to the two receiver pads are connected to the antenna pad through PHEMT RF switches and a diplexer. The GaAs die, PHEMT die, Silicon (Si) die and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. Band selection and control of transmit and receive modes are performed using two external control pads. Refer to the functional block diagram in Figure 3.1 below. The band select pad (BS) selects between GSM and DCS modes of operation. The transmit enable (TX_EN) pad controls receive or transmit mode of the respective RF switch (TX = logic 1). Proper timing between transmit enable (TX_EN) and Analog Power Control (VRAMP) allows for high isolation between the antenna and TX_VCO while the VCO is being tuned prior to the transmit burst. The SKY77518 is compatible with logic levels from 1.2V to VCC for BS and TX_EN pads, depending on the level applied to the VLOGIC pad. This feature provids additional flexibility for the designer in the selection of FEM interface control logic.

3. TECHNICAL BRIEF

LGE Internal Use Only

Figure 3.1 Functional Block Diagram

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 16 -

Table 3.1 Pad description

Table 3.2 Mode Control logic

Figure 3.2 Pad configuration (Top view) and case marking

Pin Mame Description

1 VCATT Battery input voltage

2 VLOGIC Control logic level selection/Standby control

3VRAMP Analog power control voltage input

4 TX_EN TX/RX select (mode control)

5BSBand Select (mode control)

6 DCS_RX DCS Receive RF Output (1805-1880 MHz)

7 GSM_RX GSM Receive RF Output (920-960 MHz)

8 GND RF and DC Ground

9 GND RF and DC Ground

10 GND RF and DC Ground

11 ANT RF_IN/RF_OUT to Antenna

12 GND RF and DC Ground

13 GND RF and DC Ground

14 GND RF and DC Ground

15 GND RF and DC Ground

16 GND RF and DC Ground

17 GSM_IN RF input 880-915 MHz

18 NC No Connect

19 DCS_IN RF input 1710-1785 MHz

20 GND RF and DC Ground

GMD PADS GROUND GRID Ground Pads, module underside

Mode V

LOGIC

Input Control Bits

TX_En BS

STANDBY 0 X1 X1

GSM_RX 1 0 0

DCS_RX 1 0 1

GSM_TX 1 1 0

DCS_TX 1 1 1

- 17 -

3. TECHNICAL BRIEF

3.2 Transceiver (AD6548, U503)

The AD6548 provides a highly integrated direct conversion radio solution that combines, on a single chip, all radio and power management functions necessary to build the most com-pact GSM radio solution possible. The only external components required for a complete radio design are the Rx SAWs, PA, Switchplexer and a few passives enabling an extremely small cost effective GSM Radio solution. The AD6548 uses the industry proven direct conversion receiver architecture of the OthelloTM family. For Quad band applications the front end features four fully integrated programmable gain differential LNAs. The RF is then down converted by quad-rature mixers and then fed to the baseband programmable-gain amplifiers and active filters for channel selection. The Receiver output pins can be directly connected to the baseband analog processor. The Receive path features automatic calibration and tracking to remove DC offsets. The transmitter features a translationloop architecture for directly modulating baseband signals onto the integrated TX VCO. The translation-loop modulator and TX VCO are extremely low noise removing the need for external SAW filters prior to the PA. The AD6548 uses a single integrated LO VCO for both the receive and the transmit circuits. The synthesizer lock times are optimized for GPRS applications up to and including class 12. AD6548 incorporates a complete reference crystal calibration system. This allows the external VCTCXO to be replaced with a low cost crystal. No other external components are required. The AD6548 uses the traditional VCTCXO reference source. The AD6548 also contains on-chip low dropout voltage regulators (LDOs) to deliver regulated supply voltages to the functions on chip, with a battery input voltage of between 2.9V and 5.5V. Comprehensive power down options are included to minimize power consumption in normal use. A standard 3 wire serial interface is used to program the IC. The interface features low-voltage digital interface buffers compatible with logic levels from 1.6V to 2.9V.

LGE Internal Use Only

Figure 3.3 AD6548 Block Diagram

LGE Internal Use Only

Only for training and service purposes

Notes:

1. Supply regulated by internal LDO3 and should not be connected to any other supply

2. Internally connected as Synth supply (Counters + SDM + Charge pump)

3. Supply regulated by internal LDO2 and should not be connected to any other supply

3. TECHNICAL BRIEF

- 18 -

Table 1 AD6548/9 Pin Descriptions

No Name Description No Name Description

1 VCC_FE Front end supply (IP) 17 VCC_REF Reference Oscillator Supply (IP)

2I I baseband input/output 18 VAFC/ AD6548 Crystal Freq control (IP)

N/C AD6549: Spare Pin

3IBI baseband input/output 19 REFIN Crystal Connection

4 VCC_BBI Baseband I, TX path supply (IP) 20 REFINB Crystal Connection

5 SDATA Serial port data 21 REF_OP Reference Frequency Output

6 SCLK Serial port clock 22 QB Q baseband input/output

7 SEN Serial port enable 23 Q Q baseband input/output

8 N/C Not connected 24 VCC_BBQ Baseband Q supply (IP)

9 VLDO3 TX LDO Output (1) 25 RX1900B PCS 1900 LNA input

10 TXOP_LO Transmit O/P (850/900MHz) 26 RX1900 PCS 1900 LNA input

11 TXOP_HI Transmit O/P (1800/1900MHz) 27 RX1800B DCS 1800 LNA input

12 VCC_TXVCO TX VCO supply (1) 28 RX1800 DCS 1800 LNA input

13 VDD Serial interface supply 29 RX900B E-GSM LNA input

14 VBAT Battery I/P for LDO reg’s 30 RX900 E-GSM LNA input

15 VLDO1 LDO regulator Output (2) 31 RX850B GSM 850 LNA input

16 VLDO2 LO VCO Supply (3) 32 RX850 GSM 850 LNA input

GOMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

- 19 -

3. TECHNICAL BRIEF

3.3 26 MHz Clock (Crystal, X501)

The 26 MHz clock (X501) consists of a XO (Crystal Oscillator) which oscillates at a frequency of 26 MHz. The AD6548 requires only an external low cost crystal as the frequency reference. The circuitry to oscillate the crystal and tune its frequency is fully integrated. The Oscillator is a balanced implementation requiring the crystal to be connected across 2 pins. There is a programmable capacitor array included for coarse tuning of fixed offsets (e.g. crystal manufacturing tolerance), and an integrated varactor for dynamic control. The oscillator is designed for use with a 26MHz crystal. Dedicated control software ensures excellent frequency stability under all circumstances.

LGE Internal Use Only

Figure 3.4 CRYSTAL CIRCUIT DIAGRAM

X501

DSX321G-26M

EXXY0025201

12

34

26MHz

- 20 -

3. TECHNICAL BRIEF

3.4 MP3 IC (VC0978BRDA, U305)

- 1.8-3.3V power supply for digital I/O

- 1.8V power supply for digital core

- PLL input clock 3-36MHz

- PC interface : USB 2.0 device HS,FS, U-disk function, FAT16/32 file system

- storage interface : SD card(1bit/4bit), MMC card, T-flash, 8-bit NAND flash card

- I2S audio interface

- MP3 decoder

- ADPCM decoder

- MIDI 64poly

- Stereo DAC

- Stereo headset amplifiers

- Single speaker amplifiers

- Bypass function

LGE Internal Use Only

Only for training and service purposes

Figure 3.5 VC0978 AUDIO PROCESSOR SYSTEM

- 21 -

3. TECHNICAL BRIEF

3.5 Baseband Processor (AD6724 , U104)

• AD6721 is an ADI designed processor

• AD6721 consists of

LGE Internal Use Only

FEATURES-DIGITAL

Complete Integrated Programmable Digital Baseband Processor divided into three main subsystems:

Control Processor Subsystem including:

• 32-bit MCU ARM7TDMI® Control Processor

• 39 MHz operation at 1.8V

• 1Mb of on-chip System SRAM Memory

DSP Subsystem including:

• 16-bit Fixed Point DSP Processor

• 91 MIPS[1] at 1.8V

• Data and Program SRAM

• Program Instruction Cache

• Full Rate, Enhanced Full Rate and Half Rate

• Speech Encoding/Decoding

• Capable of Supporting AMR & PDC Speech Algorithms

Peripheral Functions

• Parallel and Serial Display Interface

• Keypad Interface

• Flash Memory Interface

• Page-Mode Flash Support

• 1.8V and 3.0V, 64 kbps SIM Interface

• Universal System Connector Interface

• Data Services Interface

• Battery Interface (e.g. Dallas)

Control of Radio Subsystem Three independent programmable backlight outputs Real Time Clock with Alarm Programmable Power Management and Clock Management Supports 13 MHz and 26 MHz Input Clocks Slow Clocking Scheme for Low Idle Mode Current Power Down modes On-chip support for GSM Data Services up to

14.4Kbits/sec, GPRS, HSCSD and IrDA JTAG Interface for Test and In-Circuit Emulation

FEATURES-ANALOG

Baseband Transmit Section

• GMSK Modulator

• I-channel & Q-channel Transmit DACs and Filters

• Power Ramping DAC

Baseband Receive Section

• I-channel and Q-channel Receive ADCs and Filters

Auxiliary Section

• Voltage Reference

• Automatic Frequency Control DAC

• Auxiliary ADC

• Light Controllers

Audio Section

• 8 kHz & 16 kHz Voiceband Codec

• 48 kHz Monophonic DAC

• Power Amplifiers

Poer Management Section

• Voltage Regulators

• Battery Charger

• Battery Protection

264-Ball package (17x17 grid), 12x12mm,

0.65mm ball pitch

APPLICATIONS

GSM850/GSM900/DCS1800/PCS1900 Wireless Terminals GSM Phase 2 Compliant

- 22 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Figure 3.5 SYSTEM INTERCONECTION OF AD6721 EXTERNAL INTERFACE

- 23 -

3. TECHNICAL BRIEF

3.5.1 Interconnection with external devices

A. RTC block interface

Countered by external X-TAL The X-TAL oscillates 32.768KHz

B. LCD module interface

LGE Internal Use Only

Signals Description

nLCD_MAIN_CS MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin

LCD_SCLK This signal transfer serial clock to driver IC.

LCD_ID Select LCD module maker(2.8V : GP, 0V : SHARP)

nLCD_RESET This pin resets LCD module. This signal comes from AD6724 directly.

LCD_SDATA This signal transfer serial data to driver IC.

Table 3.5.B LCD CONTRON SIGNALS DISCRIPTION

0V

Voltage

Low

High

SHARP

LCD & CHARGE PUMP

2.8V

ID

LCD Connector

GP

MAKER

R216

47R223

75K

ECCH0004904

1u

C222

VBAT

4

5

IN

NC

12

U202

C1+

10

9

C1-

7

C2+

6

C2-

CP

8

1

D1 D2

2 3

D3

EN_SET

11

GND

AAT3157ITP-T1

EUSY0238702

R227 47

C221

ECZH0001215

1u

C232

27p

C231

DNI 100K

R230

R224 47

C220

ECCH0004904

1u

C223

27p

R226 47

43K

R219

C241

ECCH0004904

1u

C234

EVLC5S0250

SEVY0005201

VA207

MIPG

C226

5

6

7

8

9

27p

14 15

1

10

11

12

13

2

3

4

ENQY0014701

IMSA-9671S-13Y912

J202

MIPD

27p

C235

2V8_VEXT

C238

DNIDNI

C237

C224

27p

C236

C225

DNI

MLED

LCD_SCLK

nLCD_MAIN_CS

LCD_SDATA

LCD_BACKLIGHT_CTRL

MLED1 MLED2

MLED1

MLED2

LCD_ID

MLED

nLCD_RESET

- 24 -

3. TECHNICAL BRIEF

The backlight of LCD module is controlled by AD6724 via AAT3157. The control signals related to Backlight LED are given bellow.

C. RF interface

The AD6724 control RF parts through PA_BAND, ANT_SW, PA_EN, S_EN, S_DATA, S_CLK

LGE Internal Use Only

Only for training and service purposes

Signals Description

MLED Current source for backlight LED

LCD_BACKLIGHT_CTRL Control LCD backlight level in 16 steps

MLED[1:2] This pins are returned-paths for backlight LED current source (MLED)

Table 3.5.B2 DESCRIPTION OF LCD BACKLIGHT LED CONTROL

Signals Description

PA_BAND (GPO 3) PAM Band Select

ANT_SW (GPO 9) Antenna switch Band Select

PA_EN (GPO11) PAM Enable/Disable

S_EN (GPO 19) PLL Enable/Disable

S_DATA (GPO 20) Serial Data to PLL

S_CLK (GPO 21) Clock to PLL

Table 3.5.C RF CONTROL SIGNALS DESCRIPTION

- 25 -

3. TECHNICAL BRIEF

D. SIM interface

The AD6724 provides SIM Interface Module. The AD6724 checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, nSIM_RST(GPIO_23) are required. The descriptions about the signals are given by bellow Table 35 in detail.

LGE Internal Use Only

Signals Description

SIM_DATA

This pin receives and sends data to SIM card.

This model can support 3.0 volt and 1.8 volt interface SIM card.

SIM_CLK Clock 3.25MHz frequency.

SIM_RST

Reset SIM block

(GPIO_23)

Table 3.5.D SIM CONTROL SIGNALS DESCRIPTION

Figure 3.5.D2 SIM Interface of AD6724

SIM SOCKET

DNI

C230

C2

2 3

C3

C5

4 5

C6

6

C7

GND1

7 8

GND2

9

GND3

GND4

10

J201

5000-6P-1.8SL

ENSY0018701

C1

1

C229

1000p

220n

C228

2V85_VSIM

C227

R218

DNI

15K

2V85_VSIM

DNI

R217

2V85_VSIM

SIM_DATA SIM_CLK

nSIM_RST

- 26 -

3. TECHNICAL BRIEF

E. LDO Block

There are8 LDOs in the AD6724.

- 1V8_VCORE : supplies Digital baseband Processor core and AD6724 digital core(1.8V, 80mA)

- 2V8_VMEM : supplies external memory and the interface to the external memory on the digital baseband processor (2.8V, 150mA)

- 2V8_VEXT : supplies Radio digital interface and high voltage interface (2.8V, 200mA)

- 2V85_VSIM : supplies the SIM interface circuitry on the digital processor and SIM card (2.85V,1.8V, 20mA)

- 1V8_VRTC : supplies the Real-Time Clock module (1.8 V, 20 µA)

- 2V5_VMIC : supplies the microphone interface circuitry (2.5 V, 2 mA)

- 2V75_VVCXO: supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)

-2V75_VABB:analog basand relulator

LGE Internal Use Only

Only for training and service purposes

- 27 -

3. TECHNICAL BRIEF

3.6 Keypad Switches and Scanning

The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 20 switches connected in a matrix of 5rows by 4 columns, as shown in Figure 3-8, except for the power switch (END), which is connected independently. Functions, the row and column lines of the keypad are connected to ports of AD6724. The columns are outputs, while the rows are inputs and have pull-up resistors built in. When a key is pressed, the corresponding row and column are connected together, causing the row input to go low and generate an interrupt. The columns/rows are then scanned by AD6724 to identify the pressed key.

LGE Internal Use Only

Figure 3.8 Keypad Switches and Scanning

9

2

END

7

MENU

KEY Matrix

*

3

5

LEFT

6

OK

1

#

DOWN

0

4

UP

SEL SEND

RIGHT

8

DNI

C429

0

C423

DNI

2

10K

R428

VBAT

C425

DNI

R431 680

SW412

SW404

C426

DNI

R432 680

DNI

C428

9

SW402

R426

680

SW408

3

5

DNI

C417

SW403

SW401

SW421

C420

DNI

R430 680

R427

680

R421

DNI

R422

680

C427

SW417

SW416

8

C430

4

DNI

6

SW420

7

1

SW419

R433 680

680

R425

680

R429

KEY_ROW0

KEY_COL0

KEY_COL1

KEY_COL2

KEY_COL3

KEY_ROW1

KEY_ROW2

KEY_ROW3

KEY_ROW4

nPOWER_KEY

- 28 -

3. TECHNICAL BRIEF

3.7 Microphone

The microphone is placed to the Front cover and soldered to main PCB. The audio signal is passed to VINNORN and VINNORP pins of AD6724. The voltage supply VMIC is output from AD6721, and is a biased voltage for the MIC_P. The MIC_P and MIC_N signals are then A/D converted by the voice band ADC part of AD6724.

The digitized speech (PCM 8KHz ,16KHz) is then passed to the DSP section of AD6724 for processing (coding, interleaving etc).

LGE Internal Use Only

Only for training and service purposes

Figure 3.9 Connection between Microphone

MAIN_MIC

2V5_VMIC

39p

C211

C202

10u

ECTH0001701

C205

27p

C207

39p

100ohm

R205

1

2

MIC201

OB4-15L42-C33L

SUMY0003802|mic_ob4_15l42_c33_bottomview

0.1u

C208

2.2K

R204

2.2K

R208

SEVY0004101

VA204

ICVN0505X150FR

C206

39p

C210

39p

SEVY0004101

ICVN0505X150FR

VA203

1K

R202

100ohm

R206

VINNORN

VINNORP

39p

C129

39p

C135

C130

39p

C132

39p

R123 0

39p

C131

C133

39p

R120 0

N17

M17

AIN1P

P17

AIN2N

R17

AIN2P

L17

AIN3N

AIN3P

L16

K17

AOUT1N

AOUT1P

H16

R15

AOUT2N1

P14

AOUT2N2

AOUT2P1

R16

P15

AOUT2P2

AOUT3N

J17

H17

AOUT3P

AIN1N

C134

39p

SPK_N

VINNORP VINNORN AUXIN AUXIP

SPK_P

REC_P

REC_N

- 29 -

3. TECHNICAL BRIEF

3.8 Headset Interface

This phone has 4 electrodes such as GND, AUXIP, AUXIN, nJACK_DET.

Switching from Receiver to Headset Jack

If jack is inserted, JACK_DETECT goes from high to low. Audio path is switched from receiver to earphone by JACK_DETECT interrupt.

Switching from Headset Jack to Receiver

If jack is removed, JACK_DETECT goes from low to high. Audio path is switched from earphone to receiver by JACK_DETECT interrupt.

LGE Internal Use Only

Figure 3.11 HEADSET JACK INTERFACE

0.1u

C404

8

1A1B0

10

1B1

1

2A

52

2B0

3

2B1

4

GND

S1

7

S2

6

9

VCC

U402

FSA2268TUMX

EUSY0340301

ECTH0003401

C415 33u

10u

ECTZ0003701

C437

10uC436

ECTZ0003701

100K

R407

2V8_VEXT

33u

C416

ECTH0003401

HEADSET_RADIO_SEL

AUXOP_FM_R

AUXON_FM_L

AUXON

AUXOP

HP_R

HP_L

* U406 : NA

(1

for RADIO

I/O CONNECTOR

for RADIO

(KP110a/115a/110/115b)

100K

R419

DNI

C410

2V5_VMIC

FB404

C419

2V8_VEXT

DN

R420

100K

VUSBIN_IO

0.1uC412

1800FB403

2.2KR413

3 4 5 6 7 8 9

1

10

19

2

21

CN401

R438

0

R440

R439 0

0

1.5K

R412

NC2

9

OUT1

6

7

OUT2

_EN

10

3

_FLAG

EUSY0356701

NCP347MTAFTBG

U406

GND

2

11

GND_PAD

1

IN1

4

IN2

IN3

5

IN_PAD

12

8

NC1

FB402 1800

C418

10u

C411

C414

VBAT

ECCH0003002

VCHARGE_IO

39p

C409

0.1u

1800

FB401

USB-

USB+

AUXOP_FM_R

AUXON_FM_L

nJACK_DET

AUXIP

AUXIN

- 30 -

3. TECHNICAL BRIEF

3.9 Key Back-light Illumination

In key back-light illumination, there are 6 Blue LEDs in Main Board, which are driven by nKEY_BACKLIGHT signal from AD6724.

LGE Internal Use Only

Only for training and service purposes

Figure 3.12 KEY BACK-LIGHT ILLUMINTION

(10V,K,X7R)

KEY BACKLIGHT

LEBB-S14E

LD204

LD205

LEBB-S14E

ECZH0003103

C240

0.1u

ECZH0003103

C239

LD201

LEBB-S14E

EDLH0004501

R220 100ohm

100ohm

R225

LD206

LEBB-S14E

LD203

VBAT

LD202

LEBB-S14E

VBAT

R221 100ohm

100ohm

R229

R228

100ohm

R222 100ohm

nKEY_BACKLIGHT

- 31 -

3. TECHNICAL BRIEF

3.10 LCD Back-light Illumination

LCD backlight LEDs is controlled by AD6724 via AAT3157, U202.

LGE Internal Use Only

Figure 3.13 MAIN LCD BACKLIGHT ILLUMINATION

Figure 3-5-3. Charge pump Output Current

LCD & CHARGE PUMP

R216

75K

ECCH0004904

1u

C222

VBAT

4

5

IN

NC

12

U202

C1+

10

9

C1-

7

C2+

6

C2-

CP

8

1

D1 D2

2 3

D3

EN_SET

11

GND

AAT3157ITP-T1

EUSY0238702

C221

ECZH0001215

1u

C220

ECCH0004904

1u

C223

27p

43K

R219

C241

ECCH0004904

1u

C226

27p

2V8_VEXT

C224

27p

C225

DNI

MLED

LCD_BACKLIGHT_CTRL

MLED1 MLED2