LG KG245 Service Manual

Date: April, 2006 / Issue 1.0

Service Manual

Model : KG245

Service Manual

KG245

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1. INTRODUCTION...................................5

1.1 Purpose ..................................................... 5

1.2 Regulatory Information ............................... 5

1.3 Abbreviations .............................................. 7

2. PERFORMANCE ..................................9

2.1 H/W Features...............................................9

2.2 Technical Specification ..............................10

3. TECHNICAL BRIEF............................15

3.1 Transceiver (SI4210, U401).......................15

3.2 PAM (SKY77328, U500)........................... 19

3.3 26 MHz Clock (VCTCXO, X400)................20

3.4 Power Supplies for RF Circuits

(RF LDO, U403).........................................20

3.5 Digital Main Processor (AD6527, U102)....22

3.6 Analog Main & Power Management

Processor (AD6537B, U101) .....................28

3.7 LCD MODULE ...........................................38

3.8 Camera ......................................................39

3.9 Keypad Switch and Scanning ....................41

3.10 Microphone ..............................................42

3.11 Main Speaker...........................................42

3.12 Headset Interface ....................................43

3.13 Key Back-light Illumination.......................44

3.14 VIBRATOR ..............................................45

3.15 Bluetooth Section Description (M201) .....46

4. TROUBLE SHOOTING.......................48

4.1 RF Component ..........................................48

4.2 RX Trouble.................................................49

4.3 TX Trouble .................................................55

4.4 Power On Trouble......................................62

4.5 Bluetooth Section Trouble Shooting ..........63

4.6 Charging Trouble .......................................68

4.7 Vibrator Trouble .........................................70

4.8 LCD Trouble ..............................................72

4.9 Camera Trouble.........................................74

4.10 Speaker Trouble ......................................76

4.11 SIM Card Interface Trouble .....................78

4.12 Earphone Trouble ....................................80

4.13 KEY backlight Trouble .............................82

4.14 Receiver Trouble .....................................84

4.15 Microphone Trouble.................................86

4.16 RTC Trouble ............................................88

4.17 Folder on/off Trouble ...............................89

5. DOWNLOAD.......................................90

5.1 Download Setup ........................................90

5.2 Download Procedure .................................91

5.3 SERVICE AND CALIBRATION .................98

6. BLOCK DIAGRAM ...........................101

7. Circuit Diagram................................103

8. pcb layout.........................................111

9. ENGINEERING MODE......................115

9.1 BB Test [MENU 1] ...................................116

9.2 RF Test [MENU 2] ...................................118

9.3 MF mode [MENU 3] .................................118

9.4 Trace option [MENU 4] ............................119

9.5 Call timer [MENU 5] .................................119

9.6 Fact. Reset [MENU 6]..............................119

9.7 S/W version[MENU 7]..............................119

10. STAND ALONE TEST ....................120

10.1 Introduction ............................................120

10.2 Setting Method.......................................120

10.3 Means of Test ........................................121

11. AUTO CALIBRATION.....................123

11.1 Overview................................................123

11.2 Requirements ........................................123

11.3 Menu and Settings.................................123

11.4 AGC .......................................................125

11.5 APC .......................................................125

11.6 ADC .......................................................125

11.7 Setting....................................................125

11.8 How to do calibration .............................125

12. EXPLODED VIEW & REPLACEMENT

PART LIST ..................................... 127

12.1 Exploded View ...................................... 127

12.2 Replacement Parts ................................129

12.3 Accessory ............................................. 145

Table Of Contents

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1. INTRODUCTION

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1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

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E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

1. INTRODUCTION

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1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

OPLL Offset Phase Locked Loop

1. INTRODUCTION

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PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

PSRAM Pseudo SRAM

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

2. PERFORMANCE

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2.1 H/W Features

2. PERFORMANCE

Item Feature Comment

Classification : Li-on

Standard Battery

Capacity min 830mAh Voltage :3.7V Cell Weight : 22g

Under the minimum current consumption environment

Stand by Current (such as paging period 9), the level of standby current

is below 4mA.

Talk time Up to 2.5 hours (GSM TX Level 5)

Stand by time Up to 200 hours (Paging Period: 9, RSSI: -85 dBm)

Charging time Approx. Under 3 hours

RX Sensitivity GSM, EGSM: -107dBm, DCS: -107dBm

TX output power

GSM, EGSM: 33dBm(Level 5), DCS, PCS: 30dBm(Level 0)

GPRS compatibility Class 10

SIM card type 3V Small

Display

Main LCD : 128 x 160 260K TFT, 1.77” Sub LCD : 96 x 64 65K OLED,1.04”

Hard icons. Key Pad 0 ~ 9, #, *, Up/Down Navigation Key

Status Indicator Menu Key, Clear Key

Send Key, END/PWR Key Soft Key(Left/Right)

ANT Internal

EAR Phone Jack Yes (mono)

PC Synchronization Yes

Speech coding EFR/FR/HR

Data and Fax Yes

Vibrator Yes

Loud Speaker Yes

Voice Recoding Yes

Microphone Yes

Speaker/Receiver One way dual speaker

Travel Adapter Yes

Bluetooth / USB Yes

MIDI 64 Poly (Mono SPK)

Options Data Kit , CD

Camera Module Yes (VGA, CMOS)

2. PERFORMANCE

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2.2 Technical Specification

Item Description Specification

EGSM

TX: 890 + (n-1024) x 0.2 MHz RX: 935 + (n-1024) x 0.2 MHz (n=975~1024)

DCS

1Frequency Band TX: 1710 + (n-512) x 0.2 MHz

RX: 1805 + (n-512) x 0.2 MHz (n=512~885)

PCS

TX: 1810 + (n-512) x 0.2 MHz RX: 1905 + (n-512) x 0.2 MHz (n=512~810)

2 Phase Error

RMS < 5 degrees Peak < 20 degrees

3 Frequency Error < 0.1 ppm

GSM, EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

4 Power Level 12 19 dBm 3dB

DCS, PCS

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

2. PERFORMANCE

- 11 -

Item Description Specification

GSM, EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -63

3,000~ <6,000 -65

5

Output RF Spectrum 6,000 -71

(due to modulation) DCS, PCS

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -65

3,000~ <6,000 -65

6,000 -73

GSM, EGSM

Offset from Carrier (kHz) Max. (dBm)

Output RF Spectrum 400 -19

6

(due to switching transient) 600 -21

1,200 -21

1,800 -24

2. PERFORMANCE

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Item Description Specification

DCS, PCS

Offset from Carrier (kHz). Max. (dBm)

Output RF Spectrum 400 -22

6

(due to switching transient) 600 -24

1,200 -24

1,800 -27

7 Spurious Emissions Conduction, Emission Status

GSM, EGSM

8 Bit Error Ratio

BER (Class II) < 2.439% @-102 dBm

DCS, PCS

BER (Class II) < 2.439% @-100 dBm

9 RX Level Report Accuracy 3 dB

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6

3,000 4 -6

3,400 4 -9

4,000 0 -

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 2 -7

500

*

-5

13 Receiving Response 1,000 0 -5

3,000 2 -5

3,400 2 -10

4,000 2

*

Mean that Adopt a straight line in between 300 Hz and

1,000 Hz to be Max. level in the range.

2. PERFORMANCE

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Item Description Specification

14 STMR 13 5 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

-20 30.7

16 Distortion

-10 33.3

0 33.7

7 31.7

10 25.5

17 Side Tone Distortion Three stage distortion < 10%

18

System frequency

2.5ppm

(13 MHz) tolerance

19 32.768KHz tolerance 30ppm

At least 65 dBspl under below conditions:

20 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm

21 Charge Current

Fast Charge : < 450 mA Pre Charge : < 100 mA

Antenna Bar Number Power

5 -85 dBm ~

4 -90 dBm ~ -86 dBm

22 Antenna Display 3 -95 dBm ~ -91 dBm

2 -100 dBm ~ -96 dBm

1 -105 dBm ~ -101 dBm

0~ -105 dBm

Battery Bar Number Voltage

0 3.51 ~ 3.61 V

23 Battery Indicator 1 3.62 ~ 3.69 V

2 3.70 ~ 3.77 V

3 3.78 ~ 3.91 V

4 3.92 V ~

24 Low Voltage Warning

3.62 0.03V (Call)

3.50 0.03V (Standby)

2. PERFORMANCE

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Item Description Specification

25 Forced shut down Voltage 3.35 0.03 V

1 Li-ion Battery

26 Battery Type

Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 830mAh

Switching-mode charger

27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz

Output: 5.2 V, 800 mA

3. TECHNICAL BRIEF

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3.1 Transceiver (SI4210, U401)

The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VCTCXO part. The Aero 2 transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellular handsets and wireless data modems. The integrated solution eliminates the IF SAW filter, external low noise amplifier (LNAs) for three bands, transmit and RF voltage controlled oscillator (VCO modules, and other discrete components found in conventional designs.)

3. TECHNICAL BRIEF

Figure. 3-1 RECEIVER FUNCTIONAL BLOCK DIAGRAM

3. TECHNICAL BRIEF

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(1) Receiver Part

The Aero 2 transceiver uses a low-IF receiver architecture which allows for the on chip integration of the channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required in conventional super-heterodyne architectures.

A. RF front end

RF front end consists of Front End Module(FL400) and dual band LNAs integrated in transceiver (U401). The Received RF signals(GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz PCS 1905MHz ~ 1980MHz) are fed into the antenna or Mobile switch. The Front End Module(FL500) is used to control the Rx and Tx paths. And, the input signals ANT_SW1, ANT_SW2 of a FL400 are directly connected to baseband controller to switch either Tx or Rx path on. The logic and current is given below Table 3-1

Three differential-input LNAs are integrated in SI4205. The GSM input supports the GSM 850 (864894MHz) or E-GSM 900 (925-960MHz) bands. The DCS input supports the DCS 1800 (1805-1880 MHz) band. The PCS input supports the PCS 1900 (1930-1990 MHz) band. The LNA inputs are matched to the 150 balanced output SAW filters through external LC matching networks. The LNA gain is controlled with the LNAG[1:0] and LNAC[1:0] bits in register 05h (Figure 3-2).

ANT_SW1 ANT_SW2

GSM Tx 2.5 ~ 3.0 0 V 0V

DCS, PCS Tx 0V 2.5 ~ 3.0 V

GSM Rx 0V 0 V

DCS, PCS Rx 0V 0 V

Table 3-1 THE LOGIC AND CURRENT

3. TECHNICAL BRIEF

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B. Intermediate frequency (IF) and Demodulation

A quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediate frequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900 modes. The mixer output is amplified with an analog programmable gain amplifier (PGA), which is controlled with the AGAIN[2:0] bits in register 05h (Figure3-2). The quadrature IF signal is digitized with high resolution A/D converters (ADCs).

The ADC output is downconverted to baseband with a digital 100KHz quadrature LO signal. Digital decimation and IIR filters perform channel selection to remove blocking and reference interference signals. The selectivity setting (CSEL=0) or a low selectivity setting (CSEL=1). The low selectivity filter has a flatter group channelization filter is in the baseband chip. After channel selection, the digital output is scaled with a digital PGA, which is controlled with the DGAIN [5:0] bits in register 05h.

The amplified digital output signal go through with DACs that drive a differential analog signal onto the RXIP,RXIN,RXQP and RXQN pins to interface to standard analog ADC input baseband ICs. No special processing is required in the baseband for offset compensation or extended dynamic range.

Compared to a direct-conversion architecture, the low-IF architecture has a much greater degree of immunity to dc offsets that can arise from RF local oscillator(RFLO) self-mixing, 2nd order distortion of blockers, and device 1/f noise.

Figure. 3-2 SI4210 RECEIVER PART

3. TECHNICAL BRIEF

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(2) Transmitter Part

The transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-locked loop (OPLL) and two output buffers that can drive external power amplifiers (PA), one for the GSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (18501910MHz) bands.

A. IF Modulator

The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the Transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted sideband rejection and produces a GMSK modulated signal. The baseband software is able to cancel out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A converters. The Tx-Modulator implements a quadrature modulator. A quadrature mixer upconverts the differential in-phase (TXIP, TXIN) and quadrature (TXQP, TXQN) signals with the IFLO to generate a SSB IF signal that is filtered and used as the reference input to the OPLL.

The IFLO frequency is generated between 766 and 896 MHz and internally divided by 2 to generate the quadrature LO signals for the quadrature modulator, resulting in an IF between 383 and 448 MHz. For the E-GSM 900 band, two different IFLO frequencies are required for spur management. Therefore, the IF PLL must be programmed per channel in the E-GSM 900 band.

Figure. 3-3 SI4210 TRANSMITTER PART

3. TECHNICAL BRIEF

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B. OPLL

The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for the GSM 850 and E-GSM 900 bands. The RFLO frequency is generated between 1272 and 1483 MHz. To allow a single VCO to be used for the RFLO, high-side injection is used for the GSM 850 and E-GSM 900 bands, and low-side injection is used for the DCS 1800 and PCS 1900 bands. The I and Q signals are automatically swapped when switching bands. Additionally, the SWAP bit in register 03h can be used to manually exchange the I and Q signals.

Low-pass filters before the OPLL phase detector reduce the harmonic content of the quadrature modulator and feedback mixer outputs. The cutoff frequency of the filters is programmable with the FIF[3:0] bits in register 04h (Figure 3-3), and should be set to the recommended settings detailed in the register description.

3.2 PAM (SKY77328, U500)

The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks, impedancematching circuitry for 50 Ω input and output impedances, and a Power Amplifier Control (PAC) block with an internal current-sense resistor.

Figure. 3-4 SKY77328

3. TECHNICAL BRIEF

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3.3 26 MHz Clock (VCTCXO, X400)

The 26 MHz clock(X400) consists of a VCTCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 26 MHz. It is used within the Si4205, analog base band chipset (U101, AD6537B), digital base band chipset (U102, AD6527)

3.4 Power Supplies for RF Circuits (RF LDO, U403)

Two regulators are used for RF circuits. One is MIC5255 (U403), and the other is one port of AD6537B (U101). MIC5255 (U403) supplies power to transceiver (SI4210, U401). One port of AD6537B supplies power to VVCXO (X400). Main power (VBAT) from battery is used for PAM (SKY77328, U400) because PAM requires high power.

NA

100

C443

R416

1000p

C441

2V75_VVCXO

GND

2

OUT

3

4

VCC

1

VCONT

R417

15K

X400

26MHz

C442

2.2u

AFC

Figure 3-5 VCTCXO CIRCUIT DIAGRAM

Supplier Voltage PowersPowers enabled signal

U403(RF) 2.85 V U401 CLKON

U102(VVCXO) 2.75 V X400

Battery(VBAT) 3.4 ~ 4.2 V U400, U403

Table 3-2 RF POWER SUPPLIERS

3. TECHNICAL BRIEF

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Figure 3-6 RF LDO CIRCUIT DIAGRAM

CLKON

VBAT

U403

1

IN5OUT

2

GND

3

MIC5255-2.85BM5

R419 100K

C444

1u

RF2V85

4

BYPEN

C445

0.01u

C446

4.7u

3. TECHNICAL BRIEF

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3.5 Digital Main Processor (AD6527, U102)

Figure 3-7. SYSTEM INTERCONECTION OF AD6527 EXTERNAL INTERFACE

3. TECHNICAL BRIEF

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• AD6527 is an ADI designed processor.

• AD6527 consists of

1. Control Processor Subsystem

• 32-bit ARM7TDMI Control Processor

• 58.5 MHz operation at 1.7V

• On-board 16KB instruction/Data Cache

• 1 Mbits of on-chip System SRAM

2. DSP Subsystem

• 16-bit Fixed Point DSP Processor

• 91 MIPS at 1.7V

• 16K word Data and 16K word Program SRAM

• 4K word Program Instruction Cache

• Architecture supports Full Rate, Enhanced Full Rate, Half Rate, and AMR Speech Encoding/Decoding Algorithms

3. Peripheral Subsystem

• Shared on-chip peripheral and off-chip interface:

• Support for Burst and Page Mode Flash

• Support for Pseudo SRAM

• Ciphering module for GPRS supporting GAE1 and GAE2 encryption algorithms

• Parallel and Serial Display Interface

• 8 x 8 Keypad Interface

• Four independent programmable backlight plus One Service Light

• 1.8V and 3.0V, 64 kbps SIM interface

• Universal System Connector Interface

• Slow, Medium and Fast IrDA transceiver interface

• Enhanced Generic Serial Port

• Dedicated SPI interface

• Thumbwheel Interface

• JTAG Interface for Test and In-Circuit Emulation

4. Other

• Supports 13 MHz and 26 MHz Input Clocks

• 1.8V Typical Core Operating Voltages

• 204-Ball LFBGA(mini-BGA) Package

5. Applications

• GSM900/DCS1800/PCS1900/PCS850 Wireless Terminals

• GSM Phase 2+ Compliant

• GPRS Class 12 Compliant

• Multimedia Services(MMS)

• Extended Messaging System(EMS)

3. TECHNICAL BRIEF

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3.5.1 Interconnection with external devices

A. RTC block interface

Countered by external X-TAL The X-TAL oscillates 32.768KHz

B. LCD module interface

The LCD module is controlled by CAMERA IC, CL765A If CL765A is in the state of by-pass mode, the LCD control signals from AD6527 are by-passed through CL765A. In operating mode, the CL765A controls the LCD module through L_MAIN_LCD_CS, L_SUB_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD, L_DATA[15-00], 2V8_MV,1.8_MV.

Signals Description

L_MAIN_LCD_CS MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin

L_SUB_LCD_CS SUB LCD driver chip enable. SUB LCD driver IC has own CS pin

LCD_RESET (GPIO 15) This pin resets LCD module. This signal comes from DBB directly.

LCD_WR Enable writing to LCD Driver.

LCD_RD Enable reading to LCD Driver.

LCD_RS This pin determines whether the data to LCD module are display

data or control data. LCD_RS can select 16 bit parallel bus.

2V8_MV,1V8_MV 2.85V voltage is supplied to LCD driver IC.

LCD_SIGNAL1

(GPIO_16)

For the future.

LCD_SIGNAL2

(GPIO_17)

Table 3-3. LCD CONTRON SIGNALS DISCRIPTION

3. TECHNICAL BRIEF

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C. RF interface

The AD6527 control RF parts through PA_BAND, ANT_SW1, ANT_SW2, CLKON , PA_EN, SEN, SDATA, SCLK, RF_PWR_DWN.

D. Key interface

Include 5 column , 5 row and additional GPIO 35 for KEY_ROW5. The AD6527 detects whether key is pressed or not by using interrupt method.

E. AD6537B Interrupt

AD6537B provides an active-high interrupt output signal. Interrupt signals are generated by the Auxiliary ADC, audio, and charger modules.

Signals Description

PA_BAND (GPO 17) PAM Band Select

ANT_SW1 (GPO 9) Antenna switch Band Select

ANT_SW2 (GPO 11) Antenna switch Band Select

CLKON RF LDO Enable/Disable

PA_EN (GPO 16) PAM Enable/Disable

S_EN (GPO 19) PLL Enable/Disable

S_DATA (GPO 20) Serial Data to PLL

S_CLK (GPO 21) Clock to PLL

RF_EN (GPO 4) Power down Input

Table 3-5. SIM CONTROL SIGNALS DESCRIPTION

3. TECHNICAL BRIEF

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F. SIM interface

The AD6527 provides SIM Interface Module. The AD6527 checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST(GPIO_23) are required. The descriptions about the signals are given by bellow Table 3-6 in detail.

Signals Description

SIM_DATA This pin receives and sends data to SIM card. This model can support

1.8volt and 3.0 volt interface SIM card.

SIM_CLK Clock 3.25MHz frequency.

SIM_RST

Reset SIM block

(GPIO_23)

Table 3-6. SIM CONTRON SIGNALS DISCRIPTION

Figure 3-8. SIM Interface of AD6527

(KDS, 1.6T)

SIM CONNECTOR

C324

NA

C325 22p

R369

20K

2V85_VSIM

1000pC326

J301

CLK

3

GND

4

6

I_O

RST

2

1

VCC

5

VPP

2V85_VSIM

220nC318

SIM_DATA

SIM_RST SIM_CLK

3. TECHNICAL BRIEF

- 27 -

3.5.2 AD6527 Architecture

The internal architecture of AD6527 is shown above Figure 3-10. AD6527 regroups three main subsystems connected together through a dynamic and flexible communication bus network. It also includes onboard system RAM (SRAM) and interfaces with external Flash Memory, Baseband converter functions, and terminal functions like MMI, SIM and Universal System Connector (USC). The Digital Signal Processing (DSP) subsystem primarily hosts all the speech processing, channel equalization and channel codec functions. The code used to implement such functions can be stored in external Flash Memory and dynamically downloaded on demand into the DSP’s program RAM and Instruction Cache. The micro-controller subsystem supports all the GSM terminal software, including the layer 1, 2 and 3 of the GSM protocol stack, the MMI, and applications software such as data services, test and maintenance. It is tightly associated with on-chip system SRAM and also includes boot ROM memory with a small dedicated routine to facilitate the initialization of the external Flash Memory via code download using the on-chip serial interface to the external Flash Memory interface. The peripheral subsystem is composed of system peripherals such as interrupt controller, real time clock, watch dog timer, power management and a timing and control module. It also includes peripheral interfaces to the terminal functions: keyboard, battery supervision, radio and display. Both the DSP and the MCU can access the peripheral subsystem via the peripheral bus (PBUS). For program and data storage, both the MCU subsystem and the DSP subsystem can access the on chip system SRAM and external memory such Flash Memory. The access to the SRAM module is made through the RAM Bus (RBUS) under the control of the bus arbitration logic. Similarly, access to the Flash Memory is through the parallel External Bus (EBUS).

Figure 3-9. AD6527 Architecture

3. TECHNICAL BRIEF

- 28 -

3.6 Analog Main & Power Management Processor (AD6537B, U101)

Figure 3-10. AD6537B FUNCTIONAL BLOCK DIAGRAM

B

3. TECHNICAL BRIEF

- 29 -

• AD6537B is an ADI designed Analog Baseband processor. AD6537B covers the processing GMSK modulation interface, Aux ADC, Voice signal processing and Power Management.

• AD6537B consists of

1. BB Transmit section

• GMSK Modulation

• I-channel & Q-channel Transmit DACs and Filters

• Power Ramping DAC

2. BB Receive section

• I-channel & Q-channel Receive ADCs and Filters

3. Auxiliary section

• Voltage Reference

• Automatic Frequency Control DAC

• Auxiliary ADC

• Light Controllers

4. Audio Section

• 8 kHz & 16 kHz Voiceband Codec

• 48 kHz Monophonic DAC

• Power Amplifiers

5. Power Management section

• Voltage Regulators

• Battery Charger

• Battery Protection

6. Digital Processor section

• Control, Baseband, and Audio Serial Ports

• Interrupt Logic

3. TECHNICAL BRIEF

- 30 -

3.6.1 Baseband Transmit Section

1. The AD6537B Baseband Transmit Section is designed to support GMSK for both single-slot and multi-slot application.

2. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter.

3.6.2 Baseband Transmit Section

1. This section consists of two identical ADC channels that process baseband in-phase(I) and quadrature(Q) input signals.

Figure 3-11. AD6537B BASEBAND TRANSMIT SECTION

Figure 3-12. AD6537B BASEBAND RECEIVER SECTION

3. TECHNICAL BRIEF

- 31 -

3.6.3 Auxiliary Section

1. This section includes an Automatic Frequency Control(AFC) DAC, voltage reference buffers, an Auxiliary ADC, and light controllers.

• AFC DAC: 13 bits

2. This section also contains AUX ADC and Voltage Reference

• IDAC: 10 bits

• The Auxiliary ADC provides :

- Two differential inputs for temperature sensing.

- A differential input for the battery charger current sensor

Figure 3-13. AD6537B AUXILIARY SECTION

3. TECHNICAL BRIEF

- 32 -

3.6.4 Audio Section

1. Receive audio signal from microphone. This model uses differential configuration.

2. Send audio signal to speaker. This model uses differential configuration.

3. This section provides an audio codec with a digital-to-analog converter and an analogto-digital converter, a ring tone volume controller, a microphone interface, and multiple analog input and output channels.

4. It interconnects with external devices like main microphone, main receiver, and headset. The descriptions of audio port used in This model are given bellow in detail.

-AIN1P,AIN1N : Main microphone positive/negative terminal

-AIN2P,AIN2N : Headset microphone positive/negative terminal

-AIN3P,AIN3N : External Analog Input terminal

-AOUT1P,AOUT1N : Main Speaker positive/negative terminal

-AOUT3P : Headset speaker terminal

Figure 3-14. AD6537B AUDIO SECTION

3. TECHNICAL BRIEF

- 33 -

3.6.5 Power Management

1. Power up sequence logic

1. The AD6537B controls power on sequence

2. Power on sequence

- If a battery is inserted, the battery powers the 8 LDOs.

- Then if PWRONKEY is detected, the LDOs output turn on.

- REFOUT is also enabled

- Reset is generated and send to the AD6527

Figure 3-15. AD6537B POWER MANAGEMENT SECTION

3. TECHNICAL BRIEF

- 34 -

2. LDO Block

1. There are 8 LDOs in the AD6537B.

- VCORE : supplies Digital baseband Processor core and AD6537B digital core (1.8V, 80mA)

- VMEM : supplies external memory and the interface to the external memory on the digital

baseband processor (1,8V or 2.8V, 150mA)

- VEXT : supplies Radio digital interface and high voltage interface (2.8V, 170mA)

- VSIM : supplies the SIM interface circuitry on the digital processor and SIM card

(1.8V or 2.85V, 20mA)

- VRTC : supplies the Real-Time Clock module (1.8 V, 20 µA)

- VABB : supplies the analog portions of the AD6537B

- VMIC : supplies the microphone interface circuitry (2.5 V, 1 mA)

- VVCXO : supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)

Figure 3-16. AD6537B POWER MODE LOGIC

3. TECHNICAL BRIEF

- 35 -

3. Battery Charging Block

1. It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware.

2. Charging Process

- Check charger is inserted or not

- If AD6537B detects that Charger is inserted, the CC-CV charging starts.

- Exception : When battery voltage is lower than 3.2V, the precharge(low current charge mode)

starts firstly.

- And the battery voltage reach to 3.2V the CC-CV charging starts.

3. Pins used for charging

- GATEDRIVE : charge DAC output

- ISENSE : charge current sense input

- VBATSENSE : battery voltage sense input.

- BATTYPE : battery type identification input

- REFCHG : voltage reference output

4. TA (Travel Adaptor)

- Input voltage: AC 85V ~ 260V, 50~60Hz

- Output voltage: DC 5.2V ( 0.2 V )

- Output current: Max 800mA ( 50mA )

5. Battery

- Li-ion battery (Max 4.2V, Nom 3.7V)

- Standard battery: Capacity - 830mAh

Figure 3-17. AD6537B BATTERY CHARGING BLOCK

- 36 -

3. TECHNICAL BRIEF

Figure 3-18.KG245 HEADSET SPEAKER CIRCUIT (AD6537B)

CLOSE TO AD6537B

39p

C144

C139 39p

R109 4.7

T8

SGND1R8SGND2

NC_R12

R12

M2

DGND

C2

GPI

LGND

N15

K16

J16

AOUT3P

AGND1

R16

AIN1N

P16

AIN1P

AIN2N

R15

AIN2P

P15

AIN3R

AOUT1N

K15

AOUT1P

J15

AOUT2N1

T9

AOUT2N2

R9

AOUT2P1

R11

AOUT2P2

T11

AOUT3N

39p

C132

4.7R110

39p

C134

39p

C138

39p

C142

C140 39p

39p

C131 C133

39p

C143

39p

AUXIN VINNORP VINNORN

SPKP_P

AUXOP

AUXIP

RCV_N

RCV_P

From Headset

Microphone

To Headset

Speaker

Figure 3-19. KG245 HEADSET SPEAKER CIRCUIT (AD6537B)

CLOSE TO AD6537B

39p

C144

C139 39p

R109 4.7

T8

SGND1R8SGND2

NC_R12

R12

M2

DGND

C2

GPI

LGND

N15

K16

J16

AOUT3P

AGND1

R16

AIN1N

P16

AIN1P

AIN2N

R15

AIN2P

P15

AIN3R

AOUT1N

K15

AOUT1P

J15

AOUT2N1

T9

AOUT2N2

R9

AOUT2P1

R11

AOUT2P2

T11

AOUT3N

39p

C132

4.7R110

39p

C134

39p

C138

39p

C142

C140 39p

39p

C131 C133

39p

C143

39p

AUXIN VINNORP VINNORN

SPKP_P

AUXOP

AUXIP

RCV_N

RCV_P

From Main

Microphone

C229

1u

VBAT

IN2

C1

NC1

A1

NC2

C4

NO1

A4

NO2

B4

V+

U204

MAX4684EBC_T

C3

COM1

A3

COM2

B1

GND

C2

IN1

A2

SPK_RCV_N

SPK_RCV_SEL

SPK_RCV_P

SPK_N

SPK_P

RCV_N

RCV_P

To Main

Receiver/

Speaker

3. TECHNICAL BRIEF

- 37 -

In order to reduce time for trickle charging, additional circuit(Pre-charge circuit) was included. This circuit has supplied Max 160mA current into the battery additionally. So call it, it reduce trickle charging time

Figure 3-20. CIRCUIT FOR BATTERY CHARGING AT AD6537B

Pre - CHARGING

NORMAL CHARGING

NC_R1

NC_B7 NC_B5

VCHG

T15 R1

R3 T5 G16

B7 B5

B8 A5 A7 A6

NC_T15

VMEMSEL

GND_NET1

NC_G16

VBATSENSE

ISENSE

GATEDRIVE

ONNOFF

R215

10K

C210 1u

VCHARGE

R209

VBAT

ERHY0007007

15

(1%,1/8W)

6

4

R104

0.2 (1%)

Q201

UMX1NTN

C126

1u

D101

(2012)

CUS02

R105 330

Q101

G

S

4

2

1

TPCF8102-TE85L-F

D33D4

D2

D1

1

25

3

D5

D6

R216

1K

5

6

7

8

VBAT

R220

7.5K

VCHARGE

R223

10K

C125

4.7u

VCHG_LED

3

2

Q202

2SC5585

1

R226

20

3. TECHNICAL BRIEF

- 38 -

3.7 LCD MODULE

Controlled by L_MAIN_LCD_CS, L_SUB_LCD_CS, LCD_RESET, LCD_RS, LCD_WR,LCD_RD,L_DATA[00:17] ports

• L_MAIN_LCD_CS : MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin

• LCD_RESET : This pin resets LCD module. This signal comes from DBB directly.

• LCD_RS: This pin determines whether the data to LCD module are display data or control data.

• L_WR : Write control Signal

• L_RD : Read control Signal. But this pin used only for debugging.

• L_DATA[00:17] : Parallel data lines.

• LCD_SIGNAL1 : LCD type selection signals

• For using 65K color, data buses should be 16 bits.

Figure 3-21. LCD MODULE CIRCUIT

2V8_C_PWR

VGA CAMERA

128x160 MAIN TFT LCD

96x64 SUB OLED CONNECTOR(60Pin)

L_DATA00 L_DATA01 L_DATA02 L_DATA03

L_DATA04 L_DATA05 L_DATA06 L_DATA07

LCD_RESET

L_MAIN_LCD_CS L_SUB_LCD_CS

LCD_WR LCD_RS

C_SDA C_SCK C_RST

OLED_ON

BACK_BATT

MOTOR

ICVE21184E150R500FRFL601

1

INOUT_B1

INOUT_A1

2

INOUT_A2

INOUT_B2

3

INOUT_A3

INOUT_B3

4

INOUT_B4

INOUT_A4

G110G2

5

FL603 ICVE21184E150R500FR

1

INOUT_A1

INOUT_B1

2

INOUT_A2

INOUT_B2

3

INOUT_A3

INOUT_B3

4

INOUT_A4

INOUT_B4

G15G2

10

R603

100

C601

0.1uF

C613

C612

56p

ICVE21184E150R500FR

FL606

1

INOUT_A1

INOUT_B1

2

INOUT_B2

INOUT_A2

3

INOUT_A3

INOUT_B3

4

INOUT_B4

INOUT_A4

G110G2

5

ICVE21184E150R500FRFL608

1

INOUT_B1

INOUT_A1

2

INOUT_B2

INOUT_A2

3

INOUT_B3

INOUT_A3

4

INOUT_B4

INOUT_A4

G1

G2

C614

5

10

56p

4.7KR602

R601 4.7K

9

8

7

6

9

8

7

6

9

8

7

6

9

8

7

6

27pC604

LCD_ID SPK_RCV_P SPK_RCV_N

VCHG_LED

FLASH_LED

MLED

R604 100K

27p

C602

2V8_VEXT

VCHARGE

2V8_C_PWR

(60pin, Socket, 1.5T, 0.4mm)

AXK760145J

CN601

1

60

2

59

3

58 57

4

56

5

55

6

54

7

53

8

52

9

10

51

11

50

12

49

13

48

14

47

15

46

16

45

17

44

18

43

19

42

20

41

21

40

22

39

23

38

24

37

25

36

26

35

27

34

28

33

29

32

30 31

1uC605

27pC603

C606 1u

VBAT

IFMODE

MLED1 MLED2 MLED3

C607 1u

FL602

FL604

FL607

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

5

INOUT_A5

6

INOUT_A6

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

ICVE21184E150R500FR

9

INOUT_B1

8

INOUT_B2

7

INOUT_B3

6

INOUT_B4

G110G2

5

ICVE31186E150R101FR

13

INOUT_B1

12

INOUT_B2

11

INOUT_B3

10

INOUT_B4

9

INOUT_B5

8

INOUT_B6

G17G2

14

ICVE21184E150R500FRFL605

9

INOUT_B1

8

INOUT_B2

7

INOUT_B3

6

INOUT_B4

G110G2

5

ICVE21184E150R500FR

9

INOUT_B1

8

INOUT_B2

7

INOUT_B3

6

INOUT_B4

G110G2

5

ICVE21184E150R500FRFL609

9

INOUT_B1

8

INOUT_B2

7

INOUT_B3

6

INOUT_B4

G110G2

5

C608

C609

56p

L_DATA08 L_DATA09 L_DATA10 L_DATA11

L_DATA12 L_DATA13 L_DATA14 L_DATA15 L_DATA16 L_DATA17

C_MCLK C_PCLK C_HS C_VS

C611

C610

56p

C_CD00 C_CD01 C_CD02 C_CD03

C_CD04 C_CD05 C_CD06 C_CD07

3. TECHNICAL BRIEF

- 39 -

3.8 Camera

The CL765A contains various highly-advanced functions such as fully-hardwired JPEG codec, image scaler for Digital Zoom Function, MJPEG codec, high-speed Image data processing, OSD and so on. For the system level ingegration, the CL765A provides various off-chip interfaces including CMOS/CCD camera sensor interface, LCD interface, SD card interface and CCIR601/656 interface for external TV encoder interface.

Figure 3-22. CL765A BLOCK DIAGRAM

3. TECHNICAL BRIEF

- 40 -

A.Camera Interface : Allows you to use the built-in camera to take photos with the phone . The phone

encodes up to 640 x 480 size with free size support. B.U503 : Camera back-end IC. Camera signal is delivered from Camera Sensor to Camera IC(Q501). C. Q501,U503,U502 : Regulator for U503 and Camera sensor.

Figure 3-23. CL761 CAMERA IC CIRCUIT

2V85_VCAM

2V8_C_PWR

Q501

SI1305-E3

D

C506

C505 10u

0.1u

L_MAIN_LCD_CS

L_SUB_LCD_CS

S

L_DATA00 L_DATA01 L_DATA02 L_DATA03 L_DATA04 L_DATA05 L_DATA06 L_DATA07 L_DATA08 L_DATA09 L_DATA10 L_DATA11 L_DATA12 L_DATA13 L_DATA14 L_DATA15 L_DATA16 L_DATA17

LCD_WR LCD_RD

LCD_RS

G

J1

L6

M7

M6

GPIO_0H3GPIO_1H1GPIO_2

L2

L_RESET_N

L10

L_DA0

J9

L_DA1

K10

L_DA2

H8

L_DA3

H9

L_DA4

J10

L_DA5

G10

L_DA6

G9

L_DA7

G8

L_DA8

F8

L_DA9

F10

L_DA10

E10

L_DA11

F9

L_DA12

D10

L_DA13

E9

L_DA14

C10

L_DA15

H2

L_DA16

G1

L_DA17

L1

L_CS_N

K2

L_WR_N

K1

L_RD_N

K3

L_ADS

K9

LS_CS_N

TEST_EN

T_MODE0

SCAN_EN

M_SA0D8M_SA1

M_SD0A7M_SD1

M_8BIT

M_ADS

B7

D9

C8

B10

R508 100K

ADD01

ADD02

DATA00

DATA01

CAMERA CTL IC

2V85_VCAM

100KR504

100KR502

100KR503

C_CD06

C_CD07

J8

L3

M10

C9

B8

G2

C_D7

STROBE

C_PWDN

CIS_TYPE0

CIS_TYPE1

CIS_TYPE2

U503

EUSY0240501

(Core Logic, CL761A)

M_SD2A6M_SD3B6M_SD4C6M_SD5A4M_SD6B4M_SD7

M_SD8B3M_SD9

C4

C3

DATA02

DATA03

DATA04

DATA05

DATA06

DATA07

DATA08

DATA09

C_CD05

K8

M9

C_D5L9C_D6

M_SD10D3M_SD11

A3

DATA10

C_CD04

C2

DATA11

C_CD01

C_CD02

C_CD03

C_D2M8C_D3L8C_D4

M_SD12

M_SD13E3M_SD14C1M_SD15

B1

DATA12

DATA13

DATA14

L7

C_CD00

M5

C_D0K7C_D1

E2

DATA15

C_SCK

C_SDA

M4

C_SCK

C_SDA

M_CS_N

_RD

_LCD_CS

C_PCLK

L4

C_PCLK

M_WR_N

F3

_WR

C_HS

C_RST

K4

M3

C_HS

C_RST

M_HOLDE1M_INTRD1M_RD_NG3M_RESET_N

F1

CAM_INT

CAM_HOLD

C_VS

M1

M2

C_VS

A9

CAM_RST

C_MCLK

VDDS

C_MCLK

VDDL

VDDI1 VDDI2

VDDC1 VDDC2 VDDC3 VDDC4

1608

GNDI1 GNDI2 GNDI3

GNDI4 GNDC1 GNDC2 GNDC3 GNDC4 GNDC5

XOUT

MS_CS_N

_SUB_CS

K5

J2

B9 C7

A8 A10 D2 H10

B2 E8 J3 K6 A5 B5 C5 F2 L5

A2

XIN

A1

R509 100K

CAMERA/MIDI LDO

ONNOFF

2V85_VCAM

C510

C509 C511

C508

C507

0.1u

1u

0.01u

C515

4.7u

WHITE/FLASH LED LDO

C516

0.01u

26MHz

C_FLASH

LCD_DIM_CTL

1V8_MIDI_COREVBAT

2V85_VCAM

U501

10

VIN1VOUT1

2

9

VOUT2

EN1

3

8

EN2

NC3

4

7

BYP

NC2

6

GND

11

5

C501

C502

1u

0.01u

BGND

NC1

MIC2211-GOYML

C503

C504

1u

10u

(1.8V=150mA, 2.85V=300mA)

1u

VBAT

C517

4.7u

R506

1.5K

R511

1.5K

R512

R507

1K

1uC513

C512 1u

11

12

14

C1-

C1+

C2+

4

VIN

9

U502

GND

17

16

EN_FLSH

10

EN_SET

AAT2807AIXN-4.5

C514 1u

15

2

C2-

VOUT_FL

VOUT_BL

C3+

ISINK1 ISINK2 ISINK3

1

C3-

3

13

8

NCPGND

5 6 7

C519

C518

1u

FB501

FB502

MLED1 MLED2 MLED3

R505

FLASH_LED

22

MLED

3. TECHNICAL BRIEF

- 41 -

3.9 Keypad Switch and Scanning

The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are (Normal Key 24EA, Camera side key, Volume up down side key), connected in a matrix of 5 rows by 5 columns and additional GPIO 35 for KEY_ROW5, as shown in Figure 324, except for the power switch (KB1), which is connected independently. Functions, the row and column lines of the keypad are connected to ports of AD6527. The columns are outputs, while the rows are inputs and have pull-up resistors built in. When a key is pressed, the corresponding row and column are connected together, causing the row input to go low and generate an interrupt. The columns/rows are then scanned by AD6527 to identify the pressed key.

Figure 3-24. Keypad Switches and Scanning

5

2

SEND

7

1

*

3

RIGHT

4

CAMERA

CONF

#

VOL_UP

UP

DOWN

CLR

VOL_DOWN

MENU

LEFT

0

Side Key

6

9

FAV

8

SEL

T

END

EVL14K02200

VA303

680

R354

R333 680

SW329

SW325

680R352

SW321

100

R318

SW310

SW311

EVL14K02200

VA306

SW315

S71PL256NC0_TLA084

SW317

680R323

R331 680

R301

10K

SW309

SW318

680

EVL14K02200

VA301

R332

SW314

R322 680

VA302

EVL14K02200

R319

100 100

R320

VA305

EVL14K02200

SW326

680R324

SW312

SW306

SW324

SW322

VA307

EVL14K02200

SW328

VBAT

SW308

R356 680

R321

100

SW316

4 5

CN602

1 2 3

R343 680

SW313

SW327

SW323

SW307

SW319

680R349

R302 680

SW320

KEY_ROW2

KEY_ROW5

KEY_COL1

KEY_COL0

KEY_COL4

KEY_ROW1

KEY_COL3

KEY_ROW3

KEY_ROW4

KEY_COL2

KEY_ROW0

POWERKEY

3. TECHNICAL BRIEF

- 42 -

3.10 Microphone

The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to AIN1P and AIN1N pins of AD6537B. The voltage supply VMIC is output from AD6537B, and is a biased voltage for the AIN1P. The AIN1P and AIN1N signals are then A/D converted by the voiceband ADC part of AD6537B.The digitized speech (PCM 8KHz ,16KHz) is then passed to the DSP section of AD6527 for processing (coding, interleaving etc).

3.11 Main Speaker

In the case of G692 , there are 3 different speakers. One is main speaker for the received voice, another are loud speaker for playback of ring tone , key tone and other MIDI sounds and the other is headset speaker. The main speaker is driven directly from AD6537B AOUT1P and AOUT1N pins and the gain is controlled by the PGA in an AD6537B. The receiver is placed in the folder cover and connected to AOUT1x terminal via FPCB.

Figure 3-25. Connection between Microphone and AD6537B

2V5_VMIC

R202

1K

39p

C208 39p

C218

39p

C204 10u

C212

39p

EVL5M02200

VA202

VA201 EVL5M02200

MIC

(BSE, -42dB, FPCB Type)

VINNORP

VINNORN

C211

39p

R210 100

R206

2.2K

100R217

0.1uC215

R221

2.2K

C217

CLOSE TO MIC

3. TECHNICAL BRIEF

- 43 -

3.12 Headset Interface

This phone chooses a 6 pin type headset which has 6 electrodes such as GND, AUXIP, AUXIN (this pin is floating), AUXOP, JACK_DETECT, HOOK_DETECT. This type supports mono sound.

Switching from Receiver to Headset Jack

If jack is inserted, JACK_DETECT goes from high to low. Audio path is switched from receiver to earphone by JACK_DETECT interrupt.

Switching from Headset Jack to Receiver

If jack is removed, JACK_DETECT goes from low to high. Audio path is switched from earphone to receiver by JACK_DETECT interrupt.

Hook detection

If hook-button is pressed, HOOK_DETECT is changed from high to low. This is detected by AD6527(GPIO_36). And then hook is detected.

Figure 3-26. HEADSET JACK INTERFACE

CLOSE TO EARJACK

AUXIN

JACK_DETECT

(GPIO_45)

C203

0.1u

AUXOP

AUXIP

VA203

2V8_VEXT

C201

0.1u

EVL5M02200

C209

C216 0.1u

NA

2V5_JACK

R201

1K

C206 22u

R204

1.5K

C219

39p

VA204

33uC214

R225

1M

EVL5M02200

HOOK_DETECT

(GPIO_39)

C220

39p

U201

1

GND

NC

VOUT

Vin

NCP563Q25T1

4

32

J201

7502-2.5G-SB1-A (3 pole, ENJE0003501)

2V5_JACK

C202

10u

(1608)

3. TECHNICAL BRIEF

- 44 -

3.13 Key Back-light Illumination

In key back-light illumination, there are 14 Blue LEDs in Main Board, which are driven by KEY_BACKLIGHT signal from AD6527.

Figure 3-27. KEY BACK-LIGHT ILLUMINTION

1uC301

C302 1u

C303 1u

KEY_BACKLIGHT

1u

C304

VBAT

75

R304

R303

C306 1u

C307 1u

C305 1u

LD301

LD302

LEBB-S14H

KEY BACKLIGHT

75

R305

LD303

LEBB-S14H

R306

LD304

LEBB-S14H

R307

LD305

75

R308

LD306

LEBB-S14H

75

R309

LD307

LEBB-S14H

75

LEBB-S14H

VBAT

R310 75

LD308

LEBB-S14H

75R311

LD309

LEBB-S14H

75R312

LD310

LEBB-S14H

75R313

LD311

LEBB-S14H

R314 75

LD312

LEBB-S14H

R315 75

LD313

LEBB-S14H

75R316

LD314

LEBB-S14H

1u

C308

C309

1u

C312

C313

1u

C314

1u

C310

C311

Q301

31

R325

12K

R328

12K

C316

27p

R329

R330

10

2

UMX1NTN

4

56

C315

27p

R326

R327

10

3. TECHNICAL BRIEF

- 45 -

3.14 VIBRATOR

The vibrator is placed in the folder cover and contacted to LCD MODULE. The vibrator is driven from VIBRATOR (GPIO_3) of AD6527.

Figure 3-28. MOTOR

VIBRATOR

VBAT

R350

20

R353

1.5K

R357

7.5K

Q302

23

1

EMZ2

VBAT

R334

47K

R351

220

5

64

C317

4.7u

MOTOR

3.15 Bluetooth Section Description (M201)

1) U203(BH28FB1WHFV) : Provide power for bluetooth block

2) U205(TC7SH08FS) : PCM Sync Clock rate converter for bluetooth clock(8kHZ)

3) U206(MAX4717EBC-T) : Analog switch for bluetooth block

4) M201(LBMA-2C67B2) : Bluetooth module

3. TECHNICAL BRIEF

- 46 -

Figure 3-29. BLUETOOTH CIRCUIT

BLUETOOTH

BT_EN

2V8_VBT

U205

TC7SH08FS

1

3

PCM_TX

USC3

VBAT 2V8_VBT

L201

NA NA

VDD_1_8V

ANT

VDD_DIG

VDD_VREGIN

GND1 GND2 GND3 GND4

UART_TX

UART_RX UART_RTS UART_CTS

PCM_IN

PCM_OUT

PCM_SYNC

PCM_CLK

R227

0

22 21 3

4 6 11 25

27 24 23 26

19 17 18 20

U203

R228

330

C232

0.1u

C236

0.1u

5

VCC

4

GND

2

C231

2.2u

PCM_EN

USC1

USC2

C230 15p

PCM_SYNC8

R240

VIN VOUT

3 2 1

2V8_VMEM

C2

IN1

A2

IN2

C3

COM1

A3

COM2

10K

BGND

GND STBY

BH28FB1WHFV

B4

V+

NO1

NO2

NC1

NC2

GND

B1

4 6

NC

5

C233

C234

2.2u

15p

RESETB

PIO0 PIO1 PIO2 PIO3 PIO4 PIO5

NC

SPI_CLK SPI_CSB SPI_MOSI SPI_MISO

5

M201

LBMA-2C67B2

C237 NA

16

1 2 7 8 9

10

28

13 14 12 15

_BT_RST

C240

0.1u

C4

PCM_RX

A4

PCM_TX

C1

USC_1

A1

USC_2 PCM_SYNC8

U206

MAX4717EBC-T

C248

L202

22nH

R235 47

R238 47

ANT201

GND1

FEED

GND2

AMAN542015LG02

(SNGF0008801)

C249 15p

47R232

DEBUG_RX

47R233

DEBUG_TX

PCM_TX

47R236

PCM_RX

47R237

USC0

2V8_VBT

C238

2.2u

C239

2.2u

3. TECHNICAL BRIEF

- 47 -

3.16.1 Bluetooth Circuit Description (M201)

1. Bluetooth Module Features

- Output power(Class2): 1.0 dBm Typ.

- Receiver Sensitivity: -83 dBM Max.

- Dimensions: 6.9 * 7.9 * 1.5 (unit: mm)

- Wide operating temperature range(Target): -40 to85C (Storage: -40 to 100C)

- D.C Supply voltage range: 1.8V or 3.0V(Nominal)

- Interfaces: UART and SPI for data and PCM for voice

- Stack layer: HCI or RFCOMM

- Compatibility with Bluetooth Specification 1.2

Figure 3-30. BLUETOOTH INTERFACE

4. TROUBLE SHOOTING

- 48 -

4.1 RF Component

4. TROUBLE SHOOTING

SW400

FL400

U400

U401

X400

U403

U402

Mobile Switch

Sw400

FEM

Fl400

VVCXO,26MHz Clock

X400

2.85V Regulator

U403

Inerter

U402

RF Main Chip(SI4210)

U401

Power Amp Module(SKY77328)

U400

Figure 4-1. RF Component

4. TROUBLE SHOOTING

- 49 -

4.2 RX Trouble

START

(1) Check

regulator circuit

Redownload SW or Do calibration again

HP8960 : Test mode

62 CH, 7 level setting (TCH)

62CH, -60dBm setting (BCCH)

Spectrum analyzer setting

Oscilloscope setting

(2) Check VCTCXO

(3) Check

Mobile SW

&FEM

(4) Check

RX IQ

CHECKING FLOW

(1) Checking Regulator Circuit

4. TROUBLE SHOOTING

- 50 -

TEST POINT

CIRCUIT

CHECKING FLOW

Figure 4-2 (a). Regulator Circuit

Figure 4-2 (b). Regulator Circuit

U403. 3

(EN)

U403

U403. 5

(OUT)

CLKON

VBAT

U403

1

IN5OUT

2

GND

3

MIC5255-2.85BM5

R419 100K

C444

1u

4

BYPEN

C445

0.01u

RF2V85

C446

4.7u

Voltage at

Pin5 of U403

Is 2.85V?

YES

Regulator Circuit is OK

See next Page to check

VCTCXO

NO

Level at

Pin3 of U403

Is high?

YES

Replace U403

NO

Change main board

4. TROUBLE SHOOTING

- 51 -

(2) Checking VVCXO Circuit



X400.3

(OUT)

X400.4

(VCC)

X400

Check Pin 3.

Refer to Graph 4-1(b)

26 MHzO.K?

No

VVCXO Circuit is OK See next Page to check Mobile SW

See next Page to check Mobile SW

Yes

Check Pin 4.

Refer to Graph 4-1(a)

2.75V OK?

No

Yes

Changing X400

Check U101, PMIC

NA

100

C443

R416

1000p

C441

2V75_VVCXO

GND

2

OUT

3

4

VCC

1

VCONT

R417

15K

X400

26MHz

C442

2.2u

AFC

Figure 4-3 (a). VVTXO Circuit

TEST POINT

CIRCUIT

CHECKING FLOW

WAVEFORM

Graph 1(a)

Graph 1(b)

(3) Checking Mobile SW & FEM

4. TROUBLE SHOOTING

- 52 -

TEST POINT

CIRCUIT WAVEFORM

ANT_SW1 ANT_SW2

GSM_TX High Low

DCS_TX Low High

RX Low Low

Figure 4-4(a) Mobile SW & FEM Circuit

ANT SW Control GSM& DCS RX Mode

Graph 2

Table 1Figure 4-4 (b). Mobile SW & FEM Circuit

SW400.ANT

SW400.RF

VC_DCSPCS

VC_EGSM

FL400

SW400

(GPIO_11)

(GPIO_9)

270p

C440

NA

L400

C417 22p

6

GND3

GND4

7

16

GND5

GND6

17

18

GND7

GND8

19

20

GND9

14

PCS_RX1

PCS_RX2

15

VC_DCSPCS

3

VC_EGSM

9

ANT

1

DCSPCS_TX

5

12

DCS_RX1

DCS_RX2

13

10

EGSM_RX1

EGSM_RX2

11

8

EGSM_TX

2

GND1

GND10

21

22

GND11

GND12

23

24

GND13

4

GND2

FL400

HWXQ511

1p

C407

ANT400

C418

ANT

G1

G2

RF

NA

KMS-506

SW400

ANT401

270p

C439

L407

5.6nH

NA

C410

ANT402

ANT_SW1

ANT_SW2

FL301. 10

VC1

VC2

Low

VC_DCSPCS

Low

VC_EGSM

4. TROUBLE SHOOTING

- 53 -

ANT_SW1 ANT_SW2

GSM_TX High Low

DCS_TX Low High

RX Low Low

Table 4-2

CHECKING FLOW

Check C439,C440

Check whether Ant SW

Set as RX mode

RRefer to Table 4-2

Yes

VC1 :Low VC2 :Low

Check SW400 Pin ANT,RF

with RF Cable connected.

Open

Yes

Changing SW400

Check SW400 Pin ANT,RF

with No RF Cable Connected

Short

Yes

Changing SW400

For these 2 test case,

No Call connection is needed

No

Changing the Board.

Check RF Level of

FL500.10 (for GSM) &

FL500.1(for DCS)

Ant SW & Mobile SW is OK

See next Page to check

Rx IQ Signal

Pin10 : ~ -62dBm Pin 1 : ~ -63dBm

No

Changing FL400

Yes

No

For this RF Level test case,

RX Stand alone Mode is needed

refer to chapter 11

(4) Checking RX IQ

4. TROUBLE SHOOTING

- 54 -

TEST POINT

CIRCUIT

WAVEFORM

C425

C427

U401

C427 1.5p

C426 1.5p

5.6nH

L403

C423 2p

XMODE

XTAL1

30

XTAL2

RESET

RFIDP

22

RFIEN

21

RFIEP

18

RFIPN

17

RFIPP

RFOH

16

15

RFOL

12

VDD1

VDD2

1328

VDD3

VDD4

29

VIO

11

XDIV

26

25

AFC

27 14

GND

24

RFIAN

23

RFIAP

20

RFIDN

19

U401

SI4210

C428 12p

C425 1.8p

L404

6.8nH

CHECKING FLOW

Redownload software and calibration again

Similar?

No

Replace U401

Yes

No

Check C425,C427.

Check if there is any

Major difference

Refer to graph 4-3

Figure 4-5 (a). RX IQ Circuit

Figure 4-5 (b). RX IQ Circuit

Graph 3

4. TROUBLE SHOOTING

- 55 -

4.3 TX Trouble

CHECKING FLOW

START

(1)Check

regulator circuit

Redownload SW or Do calibration again

HP8960 : Test mode

62 CH, 7 level setting (TCH)

62CH, -60dBm setting (BCCH)

Spectrum analyzer setting

Oscilloscope setting

(2)Check

VVCXO

(4)Check

PAM control

signal

(5)Check

TX IQ

(3)Check

Mobile SW

& FEM

(1) Checking Regulator Circuit

4. TROUBLE SHOOTING

- 56 -

TEST POINT

CIRCUIT

U403. 5

(OUT)

U403. 3

(EN)

U403

Figure 4-6 (a). Regulator Circuit

RF2V85

VBAT

0.01u

C445

R419 100K

C444

1u

4

BYPEN

3

GND

2

1

IN5OUT

MIC5255-2.85BM5

U403

C446

4.7u

CLKON

CIRCUIT

Regulator Circuit is OK

See next Page to check

VVCXO

Voltage at

Pin5 of U403

Is 2.85V?

Level at

Pin3 of U403

Is high?

YES

NO

Replace U403

YES

NO

Change main board

Figure 4-6 (b). Regulator Circuit

(2) Checking VVCXO Circuit

4. TROUBLE SHOOTING

- 57 -

TEST POINT CHECKING FLOW

Figure 4-7 (a). VVCXO Circuit



X400.3

(OUT)

X400.4

(VCC)

X400

CIRCUIT

Figure 4-7 (b). VVCXO Circuit

Graph 4(a)

NA

100

C443

R416

1000p

C441

2V75_VVCXO

GND

2

OUT

3

4

VCC

1

VCONT

R417

15K

X400

26MHz

C442

2.2u

AFC

WAVEFORM

Graph 4(a)

Check Pin 3.

Refer to Graph 4-1(b)

26 MHzO.K?

No

VVCXO Circuit is OK See next Page to check Mobile SW

See next Page to check Mobile SW

Yes

Check Pin 4.

Refer to Graph 4-1(a)

2.75V OK?

No

Yes

Changing X400

Check U101, PMIC

(3) Checking Mobile SW & FEM

4. TROUBLE SHOOTING

- 58 -

TEST POINT

CIRCUIT WAVEFORM

Figure 4-8 (a). SW & FEM Circuit

SW400.AN

T

SW400.RF

VC_DCSPCS

VC_EGSM

FL400

SW400

(GPIO_11)

(GPIO_9)

270p

C440

NA

L400

C417 22p

6

GND3

GND4

7

16

GND5

GND6

17

18

GND7

GND8

19

20

GND9

14

PCS_RX1

PCS_RX2

15

VC_DCSPCS

3

VC_EGSM

9

ANT

1

DCSPCS_TX

5

12

DCS_RX1

DCS_RX2

13

10

EGSM_RX1

EGSM_RX2

11

8

EGSM_TX

2

GND1

GND10

21

22

GND11

GND12

23

24

GND13

4

GND2

FL400

HWXQ511

1p

C407

ANT400

C418

ANT

G1

G2

RF

NA

KMS-506

SW400

ANT401

270p

C439

L407

5.6nH

NA

C410

ANT402

ANT_SW1

ANT_SW2

Graph 5(a) GSM Tx mode

Graph 5(b) DCS,PCS Tx mode

4. TROUBLE SHOOTING

- 59 -

CHECKING FLOW

Check SW400.ANT, RF with RF

Cable connected.

Open

Yes

Changing SW400

Check SW400.ANT,RF

with RF Cable disconnected

Short

Yes

Changing SW400

No

Check C439,C440

Check whether Ant SW

Set as TX mode

RRefer to Graph4-6

RRefer to Table 6-11

Yes

Check VC_EGSM,

VC_DCSPCS

Check RF Level of

FL400 Pin 5 (for GSM) & Pin 3 (for

DCS)

Pin5 : ~29.5dBm Pin 3 : ~26.5dBm

No

Yes

No

Changing board

Go to 4.3.5 Checking PAM

control signal

END

For the test,

TX Stand alone Mode is needed. Refer to chapter 11 (PL=7 for GSM, PL=2 for DCS)

ANT SW VC_EGSM VC_CDSPCS

DCS TX 0 1

EGSM TX 1 0

EGSM, DCS RX 0 0

Table 4-3

(4) Checking PAM Control Signal

4. TROUBLE SHOOTING

- 60 -

TEST POINT WAVEFORM

Figure 4-9 (a). PAM Control

U400

R606 (PA_EN)

CIRCUIT

Figure 4-9 (b). PAM Control

(GPIO_16)

(GPIO_17)

C406 27p

C404 22u

R606 100

VBAT

R605 100

C405 27p

18

ENABLE

1

BS

PA_BAND

PA_EN

CHECKING FLOW

Go to Next Step

Similar?

Yes

No

Check TX_RAMP and PA_EN

Check if there is Any Major Difference or not Refer to Graph 4 - 7

Go to Next Step

Similar?

Yes

No

Go to Next Step

Similar?

Yes

No

Redownload S/W

Check TX_RAMP and PA_EN

Check if there is Any Major Difference or not Refer to Graph 4 - 7

Graph 6

4. TROUBLE SHOOTING

- 61 -

(5) Checking TX IQ

TEST POINT

CIRCUIT

Figure 4-10 (b). TX IQ

C427 1.5p

C426 1.5p

5.6nH

L403

C423 2p

XMODE

XTAL1

30

XTAL2

_RESET

RFIDP

22

RFIEN

21

RFIEP

18

RFIPN

17

RFIPP

RFOH

16

15

RFOL

12

VDD1

VDD2

1328

VDD3

VDD4

29

VIO

11

XDIV

26

25

AFC

27 14

GND

24

RFIAN

23

RFIAP

20

RFIDN

19

U401

SI4210

C428 12p

C425 1.8p

L404

6.8nH

CHECKING FLOW

Redownload the Software And calibrate

Check if there is

Any

Major Difference

Refer to Graph 4

-8

Similar?

Yes

No

Replace U101

WAVEFORM

Figure 4-10 (a). TX IQ

U401

C425

C427

Graph 7

4.4 Power On Trouble

4. TROUBLE SHOOTING

- 62 -

TEST POINT

CIRCUIT

C115

(1V8_VRTC)

C113

(1V8_VCORE

)

C114

(2V8_VMEM)

C119

(2V75_VVCXO)

C118

(2V5_VMIC)

C116

(2V85_VSIM)

(1608)

C116 1u

1V8_VRTC

C122 1u

2V5_VMIC

VBAT

P1

VCORE1 VCORE2

N1

A4

VEXT1 VEXT2

B4

VMEM1

T3 T2

VMEM2

N16

VMIC

VRTC

T7 T6

VSIM

D16

VVCXO

VABB

H16

VBAT_NET

T4

NC_E15

E15

NC_E16

E16 F16

NC_F16

1V8_VCORE

2V8_VEXT

C118 1u

2V85_VSIM

2.2uC117

0.1uC115

C119 1u

R102 1K

2V75_VVCXO

1u

2V75_VABB

C113

C114

2V8_VMEM

1u

BACK_BATT

Figure 4-11(a). Power On Trouble

Figure 4-11(b). Power On Trouble

4. TROUBLE SHOOTING

- 63 -

CHECKING FLOW

START

Check Battery Voltage

> 3.35V

Push power-on key

And check the level change

of PWRKEY

Check the voltage of

The LDO outputs at U101

Logic level at KEYON of U101

= HIGH

Does it work properly?

THE PHONE WILL

POWER ON.

Charge or Change Battery

Check the contact of power key

Or dome-switch

Replace U101

VCORE=1.8V VVCXO=2.75V VMEM=2.8V VRTC=1.8V VEXT=2.8V VSIM=1.8V or 2.85V VABB=2.75V VMIC=2.5V

Re-download software

The power-on procedure is

Completed. The problem may

be elsewhere.

Does it work properly?

Replace the main board

YES

NO

4. TROUBLE SHOOTING

- 64 -

4.5 Bluetooth Section Trouble Shooting

M201

R232

(DEBUG_RX)

R233

(DEBUG_TX)

R236

(PCM_RX)

R235

(PCM_TX)

R237

(PCM_SYNC8)

R238

(USC0)

R227

(ANT)

BLUETOOTH

(SNGF0008801)

2.2u

C239

15p

C234

22nH

L202

2.2u

C238

R238 47

47R236

VBAT 2V8_VBT

L201

NA NA

C248

C231

2.2u

2V8_VMEM

R240

10K

47R233

C233

2.2u

ANT201

FEED

GND1

GND2

0.1u

AMAN542015LG02

C232

47R237

BH28FB1WHFV

U203

6

BGND2GND

NC5STBY

1

3

VIN VOUT

4

R227

0

R228

330

A4

NO2

B4

V+

R235 47

U206

MAX4717EBC-T

C3

COM1

A3

COM2

B1

GND

C2

IN1

A2

IN2

C1

NC1

A1

NC2

C4

NO1

C240

0.1u

47R232

15p

C249

NA

C237

2V8_VBT

0.1u

C236

23

24

UART_RX

UART_TX

27

22

VDD_1_8V

VDD_DIG

21

VDD_VREGIN

3

PCM_CLK

PCM_IN

19

PCM_OUT

17 18

PCM_SYNC

PIO0

1 2

PIO1 PIO2

7 8

PIO3 PIO4

9

10

PIO5

16

RESETB

SPI_CLK

13 14

SPI_CSB

SPI_MISO

15

12

SPI_MOSI

26

UART_CTS

UART_RTS

LBMA-2C67B2

M201

ANT

5

4

GND1

6

GND2 GND3

11

GND4

25

28

NC

20

4

5

VCC

U205

TC7SH08FS

2

GND

1

3

15p

C230

USC1

USC2

DEBUG_RX

USC3

PCM_SYNC8

PCM_TX

PCM_RX

_BT_RST

PCM_RX

PCM_TX

USC_1

USC_2 PCM_SYNC8

PCM_TX

USC0

PCM_EN

BT_EN

DEBUG_TX

TEST POINT

CIRCUIT

Figure 4-12(a). Bluetooth Section Trouble Shooting

Figure 4-12(b). Bluetooth Section Trouble Shooting

4. TROUBLE SHOOTING

- 65 -

Checking flow

Bluettooth Power on

IS _BT_RST signal

shape similar FIG.1

Yes

2V8_VBT at

C233 =2.8V ?

Yes

No

2V8_VBT at C233,

C234 =2.8V ?

Yes

Check PCB

pattern

Replace U101

Replace U102

No

BT_EN at

R228 =2.8V ?

Yes

Replace

U207

No

Replace

U102

4. TROUBLE SHOOTING

- 66 -

Yes

No

Replace U101

Resolder

Replace U101

Replace M201

Connect BT Headset

Yes

Not available

IF RF level at Antenna

Feeding about 0dBm?

Yes

Replace Headset

No

Is soldering of R239,

L202 good?

Yes

Replace

M201

No

Resolder

4. TROUBLE SHOOTING

- 67 -

Establish a call

Yes

IIS PCM_RX signal

shape similar FIG.3

Yes

Software

Re_download

No

Replace U102

Replace M201

4. TROUBLE SHOOTING

- 68 -

4.6 Charging Trouble

D101

R104

Q101

R105

CIRCUIT DIAGRAM

CIRCUIT

(1%)

(2012)

VBAT

VCHARGE

VCHG

VMEMSEL

R3

VBATSENSE

B8 A5

NC_B5

B5

NC_B7

B7

G16

NC_G16

R1

NC_R1

T15

NC_T15

GATEDRIVE

A6

T5

GND_NET1

A7

ISENSE

R104

0.2

C126

1u

S

5

Q101

TPCF8102-TE85L-F

D1

1

D2

2

D33D4

6

D5

7

D6

8

G

4

R105 330

4.7u

C125

CUS02

D101

Figure 4-13(a). Charging Trouble

Figure 4-13(b). Charging Trouble

4. TROUBLE SHOOTING

- 69 -

Checking Flow

START

I/O Connector(CN301)

Is well-soldered ?

YES

Voltage at anode of

D101 = 5.2V ?

YES

Q101,D101, R104 are

well-soldered?

YES

Voltage across R104 is

about 10~100mV?

YES

0.7V < voltage(R105) < 1.3V?

YES

Battery is charged?

NO

Resolder the CN301 Pin 4,5 : VCHARGE

Pin12,19 : GND

The TA is out of order

Change the TA

Resolder the

Q101, D101, R104

Replace the

Q101, D101

Replace the

Q101

The battery may have

problems.

Change the battery.

YES

Charging is

properly operating

4. TROUBLE SHOOTING

- 70 -

4.7 Vibrator Trouble

Soldering Check in LCD Module

+-

R357

Q302

R350

R334

R353

C317

TEST POINT

VIBRATOR

23

64

1

5

Q302

EMZ2

VBAT

R357

7.5K

R351

220

C317

4.7u

47K

R334

20

R350

R353

1.5K

MOTOR

VIBRATOR

CIRCUIT

Figure 4-14(a). Vibrator Trouble

Figure 4-14(b). Vibrator Trouble

4. TROUBLE SHOOTING

- 71 -

Checking Flow

SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu

START

Is the voltage at pin 3

of Q302 high ?

YES

Is the voltage at pin 2

of Q302 low ?

YES

Is the voltage at pin 1

of Q302 high ?

YES

Check the soldering

of CN601 ?

YES

Check the soldering

of vibrator ?

NO

Check the soldering

of R353, R357

YES

Check the soldering

of R334

YES

Check the soldering

of R351

YES

Replace Q302

NO

Resolder R353, R357

NO

Resolder R334

NO

Resolder R351

Resolder CN601

Resolder vibrator

YES

Replace vrbrator

YES

Vibrator

Working well !

4. TROUBLE SHOOTING

- 72 -

4.8 LCD Trouble

TEST POINT

Figure 4-15(a). LCD Trouble

Figure 4-15(b). LCD Trouble

CN601

FL602

FL601

FL604

FL609

FL605

FL607

FL603 FL606 FL608

LCD Module connection

connector( 60Pin, female )

Camera Module connection

Connector ( 20Pin, female )

LCD Module

4. TROUBLE SHOOTING

- 73 -

CHECKING FLOW

START

Is the connection of

FPCB with connector on

PCB(CN601) ok ?

YES

NO

Reassemble FPCB with CN601 connector

Check the connection LCD

module with connector

On FPCB ?

NO

Reassemble LCD module with connector on FPCB

Check the soldering of

CN601 ?

NO

Change the FPCB and try again

YES

Check the soldering of

EMI filter ?

Resoldering CN601

NO

Resoldering EMI filter(FL600~FL609)

Does LCD work

properly ?

NO

Replace LCD module

YES

LCD working well !

YES

4. TROUBLE SHOOTING

- 74 -

4.9 Camera Trouble

TEST POINT

Figure 4-16(a). Camera Trouble

Figure 4-16(b). Camera Trouble

U503

Q501

FL605

FL609

FL608

FL607

Camera Module

Connector

( 20Pin, male )

4. TROUBLE SHOOTING

- 75 -

CHECKING FLOW

START

Does the LCD itself

Has no trouble ?

YES

NO

Replace the Q501

Change the camera

module, Does it work

properly ?

YES

Itís camera moduleís problem

Replace the camera module

Check the voltage

of pin 3 of

U406 is 3V ?

Check the voltage of pin 22 of

CN601 if 3V ?

YES

Check the signals of the

FL605~FL608

YES

Check the signals of the

FL605~FL608

YES

Camera will work properly

YES

NO

Check the voltage

of pin 1 of

Q501 LOW ?

NO

YES

Go to the LCD trouble

Replace the U503

NO

Check the soldering

of CN601 ?

NO

Replace the Q501

NO

Does the image

appears on LCD ?

YES

Camera will work properly

Replace

FL605~FL608

NO

4. TROUBLE SHOOTING

- 76 -

4.10 Speaker Trouble

Checking Flow

CIRCUIT

Soldering Check

C246

(SPOUT2)

C245

(SPOUT1)

U207

(EUSY0291001)

64 POLY MIDI IC(MP3 Ringtone)

22n

C243

NA

R241

C222

0.1u

C228

C224

4.7u

C242 390p

4.7u

C221

R230

6.8K

82K

R239

0.1u

C223

VBAT

A8

SPOUT1_B7

SPOUT2

A7

C8

SPVDD

B8

SPVSS

TESTI0

D6

TESTI1

F6

TESTI2

G6

TESTI3

C7

C2

TXOUT

B2

VREF

_CS__SS

H4

E7

_IRQ

_RD_SI

G4

_RST

D3

J5

_WR_SCK

IOVDD1

E8

H3

IOVDD2

LED0

H8

H7

LED1

J7

LED2

F7

LRCK

MCLK

E6

G7

MTR MTR_G7

J8

D2

PLLC

RXIN

C3

RXIN_C3

A1

SDIN

F8

H5

SMODE

SO

J6

SPOUT1

B7

DVSS1D1DVSS2D8DVSS3

J4

B4

EQ1

EQ2

A3

A4

EQ3

A2

EXC

C4

EXTIN

C6

EXTOUT

GPIO

H6

HPC

B3

B6

HPOUTL

A6

HPOUTR

HPVSS

A5

G5

IFSEL

D4

INDEX

BBL

B5

BBR

C5

BCLK

G8

CLKI

E2

G3

D0 D1

J2

D2

H2

D3

G2 H1

D4

J1

D4_H1

F3

D5

G1

D6 D7

F2

D7

DVDD1E1DVDD2J3DVDD3

U207

YMU792

F1

A0

E3

A1

AVDD

C1

AVSS

B1

0.1u

C226

C227

0.1u

47p

C247

0.033u

C244

1V8_MIDI_CORE

47p

C246

C250 100p

C251

0.1u

C235

2200p

FB201

2V85_VCAM

20K

R242

47p

C245

C225

0R229

4.7u

0.01u

C241

24K

R234

SPKP_P

SPK_P

ADD01

SPK_N

_MIDI_RST

26MHz

_MIDI_CS

ADD00

_WR _RD

DATA05 DATA06 DATA07

DATA00 DATA01 DATA02 DATA03 DATA04

_MIDI_IRQ

Figure 4-17(a). Speaker Trouble

Figure 4-17(b). Speaker Trouble

4. TROUBLE SHOOTING

- 77 -

CHECKING FLOW

START

Check the soldering of

C245, C246

Yes

Check the state of

contact of dual mode speaker

Speaker

Working well!!

Yes

Voltage across C223

= 1.8V?

Check the signal level of

C245, C246

No

Yes

Replace C223

Check the soldering of

C223

No

Yes

Re-soldering

C223

Re-solder C245,

C246 or Replace

U207

No

Re-soldering

C245, C246

Replace speaker

No

Yes

4.11 SIM Card Interface Trouble

(KDS, 1.6T)

SIM CONNECTOR

C324

NA

C325 22p

R369

20K

2V85_VSIM

1000pC326

J301

CLK

3

GND

4

6

I_O

RST

2

1

VCC

5

VPP

2V85_VSIM

220nC318

SIM_DATA

SIM_RST SIM_CLK

Figure 4-18(a). Sim Card Interface

Figure 4-18(b). Sim Card Interface

4. TROUBLE SHOOTING

- 78 -

TEST POINT

CIRCUIT

J301

4. TROUBLE SHOOTING

- 79 -

CHECKING FLOW

START

Does the SIM cards

supports 3V ?

NO

Change the SIM Card. Our phone

supports only 3V SIM card.

YES

Voltage at pin1 of

J301 is 2.85V?

NO

Resolder J301

YES

Replace J301

YES

Voltage output

of VSIM LDO

Is 2.85V?

Change the SIM Card

And try again.

Does it work

Properly?

YES

Change SIM Card

Redownload SW.

Does it work

Properly?

NO

Change the main board

NO

YES

SIM Card will be detected.

4. TROUBLE SHOOTING

- 80 -

4.12 Earphone Trouble

TEST POINT

CIRCUIT

J201

U201

C214

C201

CLOSE TO EARJACK

(GPIO_39)

(GPIO_45)

(1608)

(3 pole, ENJE0003501)

2V8_VEXT

EVL5M02200

VA203

22u

C206

C202

10u

J201

7502-2.5G-SB1-A

NC

4

VOUT

32

Vin

NCP563Q25T1

U201

GND

1

NA

C209

2V5_JACK

0.1u

C201

39p

C219

C216 0.1u

R225

1M

R204

1.5K

0.1u

C203

2V5_JACK

VA204

EVL5M02200

39p

C220

33uC214

R201

1K

HOOK_DETECT

JACK_DETECT

AUXIP

AUXIN

AUXOP

Figure 4-19(a). Earphone Trouble

Figure 4-19(b). Earphone Trouble

4. TROUBLE SHOOTING

- 81 -

CHECKING FLOW

START

Does the audio

profile of the phone

change to the

earphone mode?

Resolder J201

YES

Earphone will work properly

Change earphone

Can you hear your

voice from

the earphone?

Set the audio part of the test

Equipment to echo mode

Change the earphone

and try again

NO

Can you hear your

voice from

the earphone?

YES

Can you hear

the sound from

the earphone?

No

Set the audio part of

the test equipment to

PRBS or continuous

wave mode

Download software.

YES

Does it work well?

Change the main board.

YES

NO

Voltage at

C214

=1.2V ?

Check soldering

C214

YES

Change the main board.

YES

Download software

Resolder component

4. TROUBLE SHOOTING

- 82 -

4.13 KEY backlight Trouble

TEST POINT

Figure 4-20(a). KEY Backlight Trouble

4. TROUBLE SHOOTING

- 83 -

CIRCUIT

CHECKING FLOW

KEY BACKLIGHT

LD302

LEBB-S14H

10

R330

75

R306

LEBB-S14H

LD308

C303 1u

LD305

12K

R328

LEBB-S14H

LD303

10

R329

1u

R303

75

C310

R310 75

R314 75

75R313

C316

27p

C304

75

R309

1u

LEBB-S14H

LD307

C315

27p

C305 1u

1uC301

LEBB-S14H

LD304

LEBB-S14H

LD309

LD313

10

R326

75

R307

C306 1u

LD306

LEBB-S14H

1u

VBAT

C308

LD312

LEBB-S14H

R315 75

LEBB-S14H

LD311

10

R327

75R312

1u

C312

R305

75

LEBB-S14H

C307 1u

LD314

C302 1u

2

56

31

4

UMX1NTN

Q301

C309

1u

C314

1u

LEBB-S14H

LD301

R308

75

C313

1u

12K

R325

75R316

C311

1u

LD310

LEBB-S14H

VBAT

75

R304

75R311

KEY_BACKLIGHT

Figure 4-20(b). KEY Backlight Trouble

START

Is the level at R325

High?

NO

Check U102

YES

Are all LEDs

Working?

NO

YES

Check the soldering

each R and LED

Backlight will work properly.

NO

Replace or resoldering

component

4.14 Receiver Trouble

Figure 4-21(a). Receiber Trouble

Figure 4-21(b). Receiver Trouble

4. TROUBLE SHOOTING

- 84 -

TEST POINT

39p

C144

C139 39p

R109 4.7

T8

SGND1R8SGND2M2DGND

C2

GPI

LGND

N15

K16

J16

AOUT3P

AGND1

AOUT1N

K15

AOUT1P

J15

AOUT2N1

T9

AOUT2N2

R9

AOUT2P1

R11

AOUT2P2

T11

AOUT3N

4.7R110

39p

C138

39p

C142

C140 39p

C143

39p

SPKP_P

AUXOP

RCV_N

RCV_P

CIRCUIT

R110

R109

C140

C139

4. TROUBLE SHOOTING

- 85 -

CHECKING FLOW

SETTING : After initialize Agilent 8960, Test EGSM, DCS mode

Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max.

START

Does waveform at

R109 and R110

fluctuate?

YES

Is CN601 connected

properly?

YES

Is receiver connected

Properly?

YES

Receiver will work properly.

NO

Replace main board

Reassemble CN601

Resoldering receiver

4. TROUBLE SHOOTING

- 86 -

4.15 Microphone Trouble

TEST POINT

CIRCUIT

(BSE, -42dB, FPCB Type)

CLOSE TO MIC

MIC

39p

C217

39p

C212

10u

C204

0.1uC215

39p

R210 100

C208

100R217

R202

1K

C211

39p

EVL5M02200

VA202

R206

2.2K

39p

C218

VA201 EVL5M02200

2V5_VMIC

R221

2.2K

VINNORN

VINNORP

Figure 4-22(a). Microphone Trouble

Figure 4-22(b). Microphone Trouble

C218

C217

C133

C134

R202

4. TROUBLE SHOOTING

- 87 -

CHECKING FLOW

SETTING : After initialize Agilent 8960, Test EGSM, DCS mode

START

Voltage across R202

= DC 2.5V ?

YES

Check the signal

Level at each side

of MIC.

Is it a few tens

mV AC?

YES

Check the soldering of

R210, R217,

C211, C215

YES

Microphone will work

properly.

NO

Voltage VMIC of U101

= DC 2.5V?

YES

Resolder R202 & R206.

Replace microphone

Resolder component

NO

Replace U101

4. TROUBLE SHOOTING

- 88 -

4.16 RTC Trouble

TEST POINT

CIRCUIT

R115

NA

MC-146

X101

12

3

4

32.768KHz

R114

0

NRESET

V3

E9

OSCIN

OSCOUT

C9

F9

PWRON

V6

NAUXCS1

T5

NGPCS1

N9

GPIO_42_NMAIN_LCD_CS

V7

GPIO_43_NSUB_LCD_CS

L14

GPIO_1_IRDA_RX GPIO_2_NIRDA_EN

K16

L18

GPIO_0_IRDA_TX

N10

CLKIN

P13

CLKON

NA

C129

C128 1000p

10M

R106

C127

NA

CLKON

_SUB_CS

_LCD_CS

BT_EN

_RESET

_MIDI_CS

Figure 4-23(a). RTC Trouble

Figure 4-23(b). RTC Trouble

X101

R106

4. TROUBLE SHOOTING

- 89 -

4.17 Folder on/off Trouble

TEST POINT

CIRCUIT

330p

C520

0.1u

C521

2V8_VEXT

OUT

VDD

A3212ELH

U504

GND

R510

100K

10p

C522

FLIP

Figure 4-25(a). Folder On/Off Trouble

Figure 4-25(b). Folder On/Off Trouble

C521

C522

U504

5.1 Download Setup

5.1.1 In case of using the Data kit

Preparation

•

Target Handset

•

Data kit

•

Battery

• IBM compatible PC supporting RS-232 with Windows 98 or newer

If you use data kit, you should have a battery with the voltage above 3.7V.

5.1.2 In case of using the PIF

Preparation

• Target Handset

• PIF

• RS-232 Cable and PIF-to-Phone interface Cable

• TA/Power Supply or Battery

• BM compatible PC supporting RS-232 with Windows 98 or newer

If you use battery, you should have a battery with the voltage above 3.7V.

5. DOWNLOAD AND CALIBRATION

- 90 -

Figure 5-1 Describes Download Setup

5. DOWNLOAD AND CALIBRATION

- 91 -

5.2 Download Procedure

5.2.1. Computer Program file -> MultiGSM.exe Click

5. DOWNLOAD AND CALIBRATION

- 92 -

5.2.2. Click the “Setting” button. Then, choose Configuration which is going to download.

5. DOWNLOAD AND CALIBRATION

- 93 -

5.2.3. Configuration Setting

C:\GSMULTI\Model\MG210.dll

5. DOWNLOAD AND CALIBRATION

- 94 -

5.2.4. Press “Start Button”.

KG245

5. DOWNLOAD AND CALIBRATION

- 95 -

5.2.5. After “Start Button”, Which Stand-by condition

KG245

5. DOWNLOAD AND CALIBRATION

- 96 -

5.2.6. SW downloading Condition.

KG245

5. DOWNLOAD AND CALIBRATION

- 97 -

5.2.7. SW downloading END Condition.

KG245

5. DOWNLOAD AND CALIBRATION

- 98 -

5.3 SERVICE AND CALIBRATION

5.3.1. Calibration

A. Equipment Setup

Mobile Switch Cable

Power Supply

GPIB

Cable

PC

Battery Simulator

Jig

TA

GSM Test Set(8960)

GPIB Cable

Figure 5-2 Calibration Equipment List

5. DOWNLOAD AND CALIBRATION

- 99 -

B. RF Calibration Program

1. Execute "Hot_KimchiD.exe"

2. Click on "APPLY" button.

3. Click on "CALIBRATION START"

KG245

5. DOWNLOAD AND CALIBRATION

- 100 -

4. Click on "CALIBRATION START" button.

KG245

5. DOWNLOAD AND CALIBRATION

- 101 -

6. BLOCK DIAGRAM

LG KG245 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual