LG GM360i Service Manual

Service Manual Model : GM360i

Internal Use Only

Service Manual

GM360i

Date: June, 2010 / Issue 1.0

Table Of Contents

1. INTRODUCTION ..................................................................5

1.1 Purpose ............................................................................................... 5

1.2 Regulatory Information ............................................................... 5

1.3 Abbreviations ................................................................................... 7

2. PERFORMANCE ...................................................................9

2.1 H/W Features .................................................................................... 9

2.2 Technical Speciﬁcation ...............................................................10

3. TECHNICAL BRIEF .............................................................16

3.1 GM360i Functional Block diagram. .......................................16

3.2 Baseband Processor (BBP) Introduction..............................17

3.3 Power management IC ..............................................................30

3.4 Power ON/OFF ...............................................................................35

3.5 SIM & uSD interface .....................................................................37

3.6 Memory ............................................................................................39

3.7 LCD Display .....................................................................................40

3.8 Keypad Switching & Scanning ................................................41

3.9 Keypad back-light illumination ..............................................42

3.10 LCD back-light illumination ...................................................44

3.11 Audio ...............................................................................................45

3.12 Audio ampliﬁer & Microphone .............................................46

3.13 Charging circuit ..........................................................................48

3.14 FM radio & BLUETOOTH & WLAN .........................................49

3.15 5pin u-USB Interface connector...........................................52

3.16 General Description ..................................................................55

3.17 Receiver part ................................................................................57

3.18 Transmitter part ..........................................................................58

3.19 RF synthesizer ..............................................................................59

3.20 Front End Module control ......................................................59

3.21 Power Ampliﬁer Module .........................................................60

3.22 PAM Schematic ...........................................................................61

4.5 Camera Trouble .............................................................................70

4.6 Receiver & Speaker trouble ......................................................72

4.7 Microphone trouble ....................................................................75

4.8 Vibrator trouble .............................................................................77

4.9 Keypad back light trouble .........................................................79

4.10 SIM & uSD trouble ......................................................................81

4.11 Touch trouble...............................................................................84

4.12 Trouble shooting of Receiver part .......................................86

4.13 Trouble shooting of Transmitter part. ................................92

5. DOWNLOAD & S/W UPGRADE...................................... 101

6. BLOCK DIAGRAM ........................................................... 114

7. CIRCUIT DIAGRAM ........................................................ 115

8. BGA Pin Map .................................................................. 123

9. PCB LAYOUT ................................................................... 131

10. RF CALIBRATION ......................................................... 135

10.1 Test Equipment Setup ........................................................... 135

10.2 Calibration Step ....................................................................... 135

11. STAND ALONE TEST .................................................... 140

11.1 est Program Setting ............................................................... 140

11.2 x Test .............................................................................................143

11.3 Rx Test ..........................................................................................145

12. EXPLODED VIEW & REPLACEMENT

PART LIST .................................................................... 147

12.1 EXPLODED VIEW ......................................................................147

12.2 Replacement Parts..................................................................149

12.3 Accessory ...................................................................................168

4. TROUBLE SHOOTING .......................................................62

4.1 Trouble shooting test setup .....................................................62

4.2 Power on Trouble ..........................................................................63

4.3 Charging trouble ..........................................................................66

4.4 LCD display trouble .....................................................................68

- 3 -

LGE Internal Use Only

- 4 -

Only for training and service purposes

1. INTRODUCTION

1. Introduction

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of the GM360.

1.2. Regulatory Information

1.2.1 Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.

1.2.2 Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

1.2.3 Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the GM360 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

1.2.4 Maintenance Limitations

Maintenance limitations on the GM360 must be performed only at the LGE or its authorized agents. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

GM360i

- 5 -

LGE Internal Use Only

1. INTRODUCTION

1.2.5 Notice of Radiated Emissions

The GM360 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

1.2.6 Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

1.2.7 Interference and Attenuation

An GM360 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

1.2.8 Electrostatic Sensitive Devices

ATTENTION

Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign. Following information is ESD handling: Service personnel should ground themselves by using a wrist strap when exchange system boards.

When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts such as EEPROM to the factory, use the protective package as described.

GM360i

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Only for training and service purposes

1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:

୛ APC Automatic Power Control

୛ BB Baseband

୛ BER Bit Error Ratio

୛ CC-CV Constant Current – Constant Voltage

୛ CLA Cigar Lighter Adapter

୛ DAC Digital to Analog Converter

୛ DCS Digital Communication System

୛ dBm dB relative to 1 milli-watt

୛ DSP Digital Signal Processing

୛ EEPROM Electrical Erasable Programmable Read-Only Memory

୛ EGPRS Enhanced General Packet Radio Service

୛ EL Electroluminescence

୛ ESD Electrostatic Discharge

୛ FPCB Flexible Printed Circuit Board

୛ GMSK Gaussian Minimum Shift Keying

୛ GPIB General Purpose Interface Bus

୛ GPRS General Packet Radio Service

୛ GSM Global System for Mobile Communications

୛ IPUI International Portable User Identity

୛ IF Intermediate Frequency

୛ LCD Liquid Crystal Display

୛ LDO Low Drop Output

୛ LED Light Emitting Diode

୛ LGE LG Electronics

1. INTRODUCTION

- 7 -

LGE Internal Use Only

1. INTRODUCTION

୛ OPLL Offset Phase Locked Loop

୛ PAM Power Amplifier Module

୛ PCB Printed Circuit Board

୛ PGA Programmable Gain Amplifier

୛ PLL Phase Locked Loop

୛ PSTN Public Switched Telephone Network

୛ RF Radio Frequency

୛ RLR Receiving Loudness Rating

୛ RMS Root Mean Square

୛ RTC Real Time Clock

୛ SAW Surface Acoustic Wave

୛ SIM Subscriber Identity Module

୛ SLR Sending Loudness Rating

୛ SRAM Static Random Access Memory

୛ STMR Side Tone Masking Rating

୛ TA Travel Adapter

୛ TDD Time Division Duplex

୛ TDMA Time Division Multiple Access

୛ UART Universal Asynchronous Receiver/Transmitter

୛ VCO Voltage Controlled Oscillator

୛ DCXO Digitally Controled Crystal Oscillator

୛ WAP Wireless Application Protocol

୛ 8PSK 8 Phase Shift Keying

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Only for training and service purposes

2. PERFORMANCE

2. General Performance

2.1 H/W Feature

Item Feature Comment

Standard Battery Li-ion, 900mAh

AVG TCVR Current 250mA typ @PL5

Standby Current 2.3 mA typ @PP9

Talk time 3 hours (GSM TX Level 7)

Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm)

Charging time Under 3 hours

RX Sensitivity EGSM/GSM850:-105dBm˨ ,DCS/PCS:-105dBm˨

TX output power

EGSM/GSM850 : 33dBm (@PL 5) DCS/PCS: 30dBm (@PL 0)

GPRS compatibility Class 10

SIM card type 3V Small

Display

Main 240 u 400 pixels, 3” WQVGA, 262K color

Status Indicator

Send Key, Shortcut Key, Volume Up/Down Key, PWR Key, Camera Key, Lock Key

ANT Built in antenna

EAR Phone Jack 3.5Pi Headset jack

PC Synchronization Yes

Speech coding HR/EFR/FR/AMR

Data and Fax Yes

Vibrator Yes

Buzzer No

Voice Recoding Yes

C-Mic Yes

Receiver Yes

Travel Adapter Yes

Options Bluetooth hands-free kit, Data Kit

2. PERFORMANCE

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LGE Internal Use Only

2. PERFORMANCE

2.2 Technical specification

Item Description Specification

1

Frequency Band

GSM850

TX: 824 + 0.2 x n MHz RX: 869 + 0.2 x n MHz ( n = 1 ~ 124 )

EGSM

TX: 890 + 0.2 x (n-1024) MHz RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )

DCS1800

TX: 1710 + ( n-511 ) u 0.2 MHz (n = 512 a 885)

RX: TX + 95 MHz

PCS1900

TX: 1850.2 + ( n-512 ) u 0.2 MHz (n = 512 a 810) RX: TX + 80MHz

2

Phase Error

RMS < 5 degrees Peak < 20 degrees

3

Frequency Error < 0.1ppm

GSM850/EGSM

Level Power Toler. Level Power Toler. 5 33 dBm ±2dB 13 17 dBm ±3dB 6 31 dBm ±3dB 14 15 dBm ±3dB

7 29 dBm ±3dB 15 13 dBm ±3dB 8 27 dBm ±3dB 16 11 dBm ±5dB 9 25 dBm ±3dB 17 9 dBm ±5dB 10 23 dBm ±3dB 18 7 dBm ±5dB 11 21 dBm ±3dB 19 5 dBm ±5dB 12 19 dBm ±3dB

DCS1800/PCS1900

Level Power Toler. Level Power Toler. 0 30 dBm ±2dB 8 14 dBm ±3dB 1 28 dBm ±3dB 9 12 dBm ±4dB 2 26 dBm ±3dB 10 10 dBm ±4dB 3 24 dBm ±3dB 11 8 dBm ±4dB

4 22 dBm ±3dB 12 6 dBm ±4dB 5 20 dBm ±3dB 13 4 dBm ±4dB

6 18 dBm ±3dB 14 2 dBm ±5dB

4

Power Level

7 16 dBm ±3dB 15 0 dBm ±5dB

- 10 -

Only for training and service purposes

2. PERFORMANCE

GSM850/EGSM Offset from Carrier (kHz). Max. dBc 100 +0.5 200 -30

250 -33 400 -60 600 ~ 1,200 -60 1,200 ~ 1,800 -60 1,800 ~ 3,000 -63 3,000 ~ 6,000 -65 6,000 -71

DCS1800/PCS1900

Offset from Carrier (kHz). Max. dBc

100 +0.5 200 -30 250 -33 400 -60 600 ~ 1,200 -60 1,200 ~ 1,800 -60 1,800 ~ 3,000 -65 3,000 ~ 6,000 -65

5

Output RF Spectrum (due to modulation)

6,000 -73

GSM850/EGSM

Offset from Carrier (kHz) Max. (dBm)

400 -19

600 -21

1,200 -21

1,800 -24

DCS1800/PCS1900

Offset from Carrier (kHz) Max. (dBm)

400 -22

600 -24

1,200 -24

6

Output RF Spectrum (due to switching transient)

1,800 -27

- 11 -

LGE Internal Use Only

2. PERFORMANCE

7 Spurious Emissions

Conduction, Emission Status

8

Bit Error Ratio

GSM850 / EGSM

BER (Class II) < 2.439% @-102dBm

DCS1800/PCS1900

BER (Class II) < 2.439% @-100dBm

9

Rx Level Report accuracy

r 3 dB

10 SLR

8 r 3 dB Frequency (Hz) Max.(dB) Min.(dB)

100 -12 / 200 0 / 300 0 -12 1,000 0 -6 2,000 4 -6 3,000 4 -6 3,400 4 -9

11

Sending Response

4,000 0 /

12 RLR

2 r 3 dB Frequency (Hz) Max.(dB) Min.(dB)

100 -12 / 200 0 / 300 2 -7 500 * -5 1,000 0 -5 3,000 2 -5 3,400 2 -10 4,000 2

13 Receiving Response

* Mean that Adopt a straight line in between 300

Hz and 1,000 Hz to be Max. level in the range.

14 STMR

13 r 5 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

-20 30.7

-10 33.3 0 33.7 7 31.7

16

Distortion

10 25.5

17

Side tone Distortion Three stage distortion < 10%

- 12 -

Only for training and service purposes

2. PERFORMANCE

18

<Change> System frequency (26 MHz) tolerance

d 2.5 ppm

19

<Change>32.768KHz tolerance

d 30ppm

20

Power consumption

Standby

- Normalஆd 3 mA(@PP9)

21

Talk Time

EGSM/Lvl 7 (Battery Capacity 800mA):180 min EGSM/Lvl12(Battery Capacity 800 mA):320min

22

Standby Time

Under conditions, at least 300 hours:

1. Brand new and full 900mAh battery

2. Full charge, no receive/send and keep GSM in idle mode.

3. Broadcast set off.

4. Signal strength display set at 3 level above.

5. Backlight of phone set off.

23

Ringer Volume

At least 65 dB under below conditions:

1. Ringer set as ringer.

2. Test distance set as 50 cm

24

Charge Current

Fast Charge : < 650 mA Slow Charge: < 120 mA

Antenna Bar Number

Power

7

>-92 dBm a

5

-97dBm a –93dBm

4

-100dBm a –98dBm

2

-103dBm a –101dBm

1

-105dBm a –104dBm

0 < –106 dBm

25

Antenna Display

Off No Service Battery Bar Number Voltage (±0.05V) 3 3.72V~4.2V 2 3.65V~3.71V 1 3.59V~3.64V

26 Battery Indicator

0 3.35V~3.58V

3.59VĻ±0.05V (Call)

27 Low Voltage Warning

3.59VĻ±0.05V (Standby)

28 Forced shut down Voltage

3.35 r 0.05 V

29

Battery Type

Li-ion Battery Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 900mAh

30

Travel Charger

Switching-mode charger Input: 150 a 240 V, 50/60Hz Out put: 5.1, 0.7A

- 13 -

LGE Internal Use Only

2. PERFORMANCE

* EDGE RF Specification (Option: is not serviced for ”EDGE mode”)

Item Description Specification

1 RMS EVM ≤9% 2 Peak EVM ≤30%

3 95th Percentile EVM ≤15%

4 Origin Offset Suppression ≥30dB

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 27dBm ±3dB 13 17dBm ±3dB 6 27dBm ±3dB 14 15dBm ±3dB

7 27dBm ±3dB 15 13dBm ±3dB 8 27dBm ±3dB 16 11dBm ±5dB 9 25dBm ±3dB 17 9dBm ±5dB 10 23dBm ±3dB 18 7dBm ±5dB 11 21dBm ±3dB 19 5dBm ±5dB 12 19dBm ±3dB DCS1800, PCS1900

Level Power Toler. Level Power Toler.

0 26/25dBm ±3dB 8 14dBm ±3dB

1 26/25dBm ±3dB 9 12dBm ±4dB 2 26/25dBm ±3dB 10 10dBm ±4dB 3 24dBm ±3dB 11 8dBm ±4dB 4 22dBm ±3dB 12 6dBm ±4dB 5 20dBm ±3dB 13 4dBm ±4dB 6 18dBm ±3dB 14 2dBm ±5dB

5 Power Level

7 16dBm ±3dB 15 0dBm ±5dB

GSM900/EGSM

Offset from carrier(kHz) Max. dBc

100 +0.5 200 -30 250 -33 400 -54 600~<1,200 -60 1,200~<1,800 -60 1,800~<3,000 -63 3,000~<6,000 -65

6

Output RF Spectrum (due to modulation)

6,000 -71

- 14 -

Only for training and service purposes

2. PERFORMANCE

DCS1800, PCS1900

Offset from carrier(kHz) Max. dBc 100 +0.5

200 -30 250 -33 400 -54 600~<1,200 -60 1,200~<1,800 -60 1,800~<3,000 -63 3,000~<6,000 -65 6,000 -71

GSM900/EGSM

Offset from carrier(kHz) Max. dBm 400 -23

600 -26 1,200 -27 1,800 -30

DCS1800, PCS1900

Offset from carrier(kHz) Max. dBm 400 -23 600 -26 1,200 -27

7

Output RF Spectrum (due to switching transient)

1,800 -30

6

- 15 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3-1 Baseband circuit

3.1 GM360 Functional Block diagram.

The functional component arrangement is mentioned below diagram.

3-1 Baseband circuit

3.1 GM360 Functional Block diagram.

The functional component arrangement is mentioned below diagram.

Figure 1 GM360 Functional block diagram

G

U100

PMB8877

G

WM9093

RCV/SPK

MAIN MIC

HSMIC

RF

SIM

NAND_ DATA

DATA[00:15]

SDRAM

1248 Mbit

NAND

Flash

2048M

U 101

BT

அ

FM Radio

UART1

I2S

32K

PCM

RF

G

EDGE

PAM

FEM

Transceiver

U501

EDGE

26M

GSM850/900/1800/1

VIBRATOR

DATA

LCD

Fi

FM Audio

G

Ear-Mic

ADD

I2C1

Touch

Camera Flash

SDIO

ADD

RCV

EAR/SPK

LCD_ID

IF_MODE

DIF_CD

DIF_CS DIF_RESET DIF_VSYNC

DIF [0:7]

CONTROL

CAMERA

I2C2

CIF [0:7]

DATA

CIF_PCLK CIF_HSYNC CIF_VSYNC

CIF_MCLK

CIF_PD

CIF_RESET

G

PMIC

PMB6821

FM Audio

SDRAM DATA

USBUART

KEY_PAD_I/F

Micro

USB

Conne

ctor

MUIC

32K

DATA[00:15]

LCD_BACKLIGHT_EN

LCD

US

U

A

3. TECHNICAL BRIEF

GM360i

- 16 -

Only for training and service purposes

3.2 Baseband Processor (BBP) Introduction

Figure 2 Top level block diagram of the S-GOLD3

TM

(PMB8877)

3. TECHNICAL BRIEF

- 17 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.1 General Description

S-GOLD3TM is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD3TM Provides multimedia extensions such as camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and mixed signal portions of the base band in 0.09um, 1.2V technology.

The chip will fully support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD3

TM

support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data application (up

to class 12) and EGPRS (up to class 12) without additional external hardware.

3.2.2 Block Description

z Processing core

ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration.

- TEAKLite DSP core

z ARM-Memory

- 32k Byte Boot ROM on the AHB

- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 16k Byte Cache for Program (internal)

- 8k Byte tightly coupled memory for Program(internal)

- 8k Byte Cache for Data(internal)

- 8k Byte tightly coupled memory for Data(internal)

z DSP-Memory

- 104K x 16bit Program ROM

- 8k x 16bit Program RAM

- 60k x 16bit Data ROM

- 37k x 16bit Data RAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

z Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

z Controller Bus system

The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal and external memories and with the peripheral buses.

- 18 -

Only for training and service purposes

3. TECHNICAL BRIEF

z Clock system

The clock system allows widely independent selection of frequencies for the essential parts of the S-GOLD3. Thus power consumption and performance can be optimized for each application.

z Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame

synchronous low power mode and enhanced CPU modes(idle and sleep modes)

- Pulse Number Modulation output for Automatic Frequency Correction(AFC)

- Serial RF Control interface: support of direct conversion RF

- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission

- 3 USIF with autobaud detection, hardware flow control and integrated

- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards

(up to 4Mbps)

- I2C-bus interface (e.g. connection to S/M power)

- A fast display interface supporting serial and parallel interconnection

- An ITU-R BT.656 compatible Camera interface.

- Programmable clock output for a camera

- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)

- 19 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.3 External Devices connected to memory interface

Table 1. Memory interface

Device Name Maker Remark

FLASH K522H1HACB-B060 SAMSUNG Synchronous / A synchronous DDR K522H1HACB-B060 SAMSUNG Synchronous 166MHz LCD LS030B3UX05 SHARP 8bit access 2 times transmission Melody IC Not Used S/W Infineon Software CODEC

3.2.4 RF Interface (T_OUT)

S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF ICs Periodically each TDMA frame.

Table 2. RF Interface Spec.

T_OUT Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on T_OUT1 Other function T_OUT2 PA_BAND TX RF band select T_OUT3 Other function - T_OUT4 Other function T_OUT5 Other function T_OUT6 PA MODE PAM Mode select

3.2.5 USIF Interface

GM360 have three USIF Drivers as follow :

- USIF1 : Hardware Flow Control / SW upgrade / Calibration

- USIF2 : Not used Rx, Tx and CTS, RTS use BT Interface

- USIF3 : Other function

GM360i

- 20 -

Only for training and service purposes

Table 3. USIF Interface Spec.

3.2.6 ADC channel

BBP ADC block is composed of 10 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values.

Table 4. S-Gold3 ADC channel usage

ADC channel Resource Interconnection Description

M0 BAT_ID Battery temperature measure M1 RF_TEMP RF block temperature measure M2 N.C M3 N.C M4 N.C M5 N.C M6 N.C M7 PCB Version check optional M8 VSUPPLY Battery supply voltage measure M9 N.C M10 N.C

Resource Name Remark USIF1

USIF1_TXD TXD Transmit Data USIF1_RXD RXD Receive Data USIF1_CTS USB_SE0_VM USIF1_RTS USB_DAT_VP

USIF2 USIF2_TXD NC NC USIF2_RXD Other function USIF2_CTS BT_UART_CTS BT UART_CTS USIF2_RTS BT_UART_RTS. BT_UART_RTS USIF3 USIF3_TXD Other function - USIF3_RXD Other function -

3. TECHNICAL BRIEF

- 21 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.7 GPIO map

Over a hundred allowable resources, GM360 is using as follows except dedicated to SIM and Memory. GM360 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table

Table 5 S-Gold3 GPIO pin Map

Port function Signal Name Description

#Keypad

G G

KP_IN0

MMC_COVER_DET

G SD Card cover detect

KP_IN1

HS_MIC_BIAS_EN

G Headset mic. Bias LDO Enable

KP_IN2

VIB_EN

G Vibrator enable

KP_IN3

KP_IN(3)

G Keypad

KP_IN4

CAM_LDO_EN2

G Camera 2’nd LDO enable

KP_IN5

KP_IN(5) G Keypad

KP_IN6

KP_IN(6) G Keypad

KP_OUT0

USW_INT G MUIC interrupt

KP_OUT1

KP_OUT(0)

G Keypad

KP_OUT2

KP_OUT(2)

G Keypad

KP_OUT3

KP_OUT(3)

G Keypad

#USIF1: Universal Serial IF #USB

G G

USIF1_RXD_MRST

UART_RX G UART, RS232 data

USIF1_TXD_MTSR

UART_TX G UART, RS232 data

USIF1_RTS_N

USB_DAT_VP G USB data

USIF1_CTS_N

USB_SE0_VM G USB data

#USIF2: Universal Serial IF

G G

USIF2_RXD_MRST

LCD_ID G LCD ID

USIF2_TXD_MTSR

N/A G

USIF2_RTS_N

BT_UART_RTS G BT UART flow control

USIF2_CTS_N

BT_UART_CTS G BT UART flow control

#USIF3: Universal Serial IF

G G

USIF3_RXD_MRST

WLAN_D(1) G Optional

USIF3_TXD_MTSR

WLAN_D(2) G Optional

USIF3_SCLK

WLAN_D(3) G Optional

#MMCI2: Intrachip

G G l

MMCI2_CMD

WLAN_CMD G Optional

MMCI2_DAT[0]

WLAN_D(0) G Optional

MMCI2_CLK

WLAN_CLK G Optional

GM360i GM360i

- 22 -

Only for training and service purposes

3. TECHNICAL BRIEF

#CIF: Camera Interface

G G

CIF_D0

G Camera data 0

CIF_D1

G Camera data 1

CIF_D2

Camera data 2

CIF_D3

G Camera data 3

CIF_D4

G Camera data 4

CIF_D5

Camera data 5

CIF_D6

G Camera data 6

CIF_D7

G Camera data 7

CIF_PCLK

CIF_PCLK G Camera pixel clock

CIF_HSYNC

CIF_HSYNC G Camera H sync

CIF_VSYNC

CIF_VSYNC G Camera V sync

CLKOUT2

CIF_MCLK G Camera main clock

CIF_PD

CIF_PD G Camera power down

CIF_RESET

CIF_RESET G Camera reset

#Display_Interface

G G

DIF_D0

G LCD data 0

DIF_D1

G LCD data 1

DIF_D2

G LCD data 2

DIF_D3

G LCD data 3

DIF_D4

G LCD data 4

DIF_D5

G LCD data 5

DIF_D6

G LCD data 6

DIF_D7

G LCD data 7

DIF_D8

CAM_LDO_EN1

G Camera 1’st LDO enable

DIF_CS1

DIF_CS G LCD chip select

DIF_CS2

IF_MODE G LCD Interface mode

DIF_CD

G LCD ADD/DATA select

DIF_WR

G LCD write enable

DIF_RD

G LCD read enable

DIF_HD

HOOK_DETECT G Hook detect

DIF_VD

DIF_VSYNC G LCD V sync

DIF_RESET1

DIF_RESET G LCD reset

DIF_RESET2

TOUCH_INT G Touch interrupt

#I2C1

G G

I2C1_SCL

I2C_SCL G I2C clock

I2C1_SDA

I2C_SDA G I2C data

PM_INT

G PM interrupt

#I2C2

G G

I2C2_SCL

G I2C2 clock

I2C2_SDA

G I2C2 data

- 23 -

LGE Internal Use Only

3. TECHNICAL BRIEF

#Chip Card (USIM1)

G G

CC_IO

SIM_IO G SIM IO

CC_CLK

SIM_CLK

G SIM clock

CC_RST

SIM_RST G SIM reset

#FIrDA: Fast IrDA

G

IrDA_TX

USB_OEN G USB data

IrDA_RX

BT_HOST_WAKEUP

G BT interrupt

#SWIF: 1 wire IF

G G

SWIF_TXRX

N/A G

#MMCI1: Card Connector

G G

MMCI1_CMD

MMC_CMD G T-Flash memory command

MMCI1_DAT[0]

MMC_DATA[0] G T-Flash memory data 0

MMCI1_CLK

MMC_CLK G T-Flash memory clock

#MMCI1: SD-Extension

G G

MMCI1_DAT[1]

MMC_DATA[1] G T-flash memory data 1

MMCI1_DAT[2]

MMC_DATA[2] G T-flash memory data 2

MMCI1_DAT[3]

MMC_DATA[3] G T-flash memory data 3

#I2S1

G G

I2S1_CLK0

BT_PCM_CLK G BT PCM data clock

I2S1_CLK1

MMC_DET G T-flash memory detect

I2S1_RX

BT_PCM_IN G BT PCM data input

I2S1_TX

BT_PCM_OUT G BT PCM data output

I2S1_WA0

BT_PCM_SYNC G BT PCM data sync

#I2S2

G G

I2S2_CLK0

I2S2_CLK G I2S2 clock

I2S2_CLK1

BT_UART_RX G BT UART rx data

I2S2_RX

I2S2_SDO G I2S2 data

I2S2_TX

KEY_EN G Key backlight enable

I2S2_WA0

I2S2_WS G I2S2 word select

I2S2_WA1

BT_UART_TX G BT UART tx data

#Voiceband: Analog Interface

G G

EPN1

EAR_N G

EPP1

EAR_P G

EPPA1

BB_SND_L G

EPREF

NC G

EPPA2

BB_SND_R G

MICN1

MAIN_MIC_N G

MICP1

MAIN_MIC_P G

- 24 -

Only for training and service purposes

3. TECHNICAL BRIEF

MICN2

HS_MIC_N G

MICP2

HS_MIC_P G

AUXN1

GND G

AUXP1

GND G

AUXN2

GND G

AUXP2

GND G

AUXGND

GND G

VMICP

VMIC_P G

VMICN

VMIC_N G

#I/Q-Signale: Analog Interface, Baseband

G G

PAOUT1

PA_LEVEL G

BB_I

I G

BB_IX

IX G

BB_Q

Q G

BB_QX

QX G

#Measurement

G G

M_0

BAT_ID G

M_1

RF_TEMP G

M_2

G G

M_3

G G

M_4

G G

M_5

G G

M_6

G G

M_7

PCB Version G

M_8

VBAT G

M_9

G G

M_10

G G

#Bandgap reference: Analog Interface

G G

VREFP

VREFN G

IREF

G G

#JTAG

G G

TDO

TDO G

TDI

TDI G

TMS

TMS G

TCK

TCK G

TRST_n

TRSTN G

RTCK

RTCK G

#Debug

G G

TRIG_IN

TRIG_IN high

- 25 -

LGE Internal Use Only

3. TECHNICAL BRIEF

MON1

2V62_VIO high

MON2

G low

TRACESYNC

G

TRACECLK

G

PIPESTAT[2]

PIPESTAT2

G

PIPESTAT[1]

PIPESTAT1

G

PIPESTAT[0]

PIPESTAT0

G

TRACEPKT[0]

TRACEPKT0

G

TRACEPKT[1]

TRACEPKT1

G

TRACEPKT[2]

TRACEPKT2

G

TRACEPKT[3]

TRACEPKT3

G

TRACEPKT[4]

TRACEPKT4

G

TRACEPKT[5]

TRACEPKT5

G

TRACEPKT[6]

TRACEPKT6

G

TRACEPKT[7]

TRACEPKT7

G

#External Bus Interface (EBU)

G G

MEM_WAIT_n

N/A G

MEM_ADV_n

BA1 G

MEM_RDN

_RD G

MEM_AD[0]

DATA(0) G

MEM_AD[1]

DATA(1) G

MEM_AD[2]

DATA(2) G

MEM_AD[3]

DATA(3) G

MEM_AD[4]

DATA(4) G

MEM_AD[5]

DATA(5) G

MEM_AD[6]

DATA(6) G

MEM_AD[7]

DATA(7) G

MEM_AD[8]

DATA(8) G

MEM_AD[9]

DATA(9) G

MEM_AD[10]

DATA(10) G

MEM_AD[11]

DATA(11) G

MEM_AD[12]

DATA(12) G

MEM_AD[13]

DATA(13) G

MEM_AD[14]

DATA(14) G

MEM_AD[15]

DATA(15) G

MEM_CS0_n

_NAND_CS G

MEM_CS1_n

_RAM_CS G

MEM_CS2_n

G G

MEM_CS3_n

G G

- 26 -

Only for training and service purposes

3. TECHNICAL BRIEF

MEM_WRN

_WR G

MEM_A[16]

ADD(16) G

MEM_A[17]

ADD(17) G

MEM_A[18]

ADD(18) G

MEM_A[19]

ADD(19) G

MEM_A[20]

ADD(20) G

MEM_A[21]

ADD(21) G

MEM_A[22]

ADD(22) G

MEM_A[23]

ADD(23) G

MEM_A[24]

ADD(24) G

MEM_A[25]

ADD(25) G

MEM_A[26]

ADD(26) G

MEM_CSA0_n

ADD(27) G

MEM_CSA1_n

ADD(28) G

MEM_CSA2_n

ADD(29) G

MEM_CSA3_n

BA0 G

MEM_BFCLKO1

G G

MEM_BFCLKO2

SDCLKI G

MEM_SDCLKO

SDCLKO G

MEM_BC0_n

_BC0 G

MEM_BC1_n

_BC1 G

MEM_BC2_n

LDQS G

MEM_BC3_n

UDQS G

MEM_A[0]

ADD(0) G

MEM_A[1]

ADD(1) G

MEM_A[2]

ADD(2) G

MEM_A[3]

ADD(3) G

MEM_A[4]

ADD(4) G

MEM_A[5]

ADD(5) G

MEM_A[6]

ADD(6) G

MEM_A[7]

ADD(7) G

MEM_A[8]

ADD(8) G

MEM_A[9]

ADD(9) G

MEM_A[10]

ADD(10) G

MEM_A[11]

ADD(11) G

MEM_A[12]

ADD(12) G

MEM_A[13]

ADD(13) G

MEM_A[14]

ADD(14) G

MEM_A[15]

ADD(15) G

MEM_RAS_n

_RAS G

MEM_CAS_n

_CAS G

MEM_CKE

CKE G

- 27 -

LGE Internal Use Only

3. TECHNICAL BRIEF

#FCDP: Flash Controller DMA Port

G G

FCDP_RBn

FCDP G

#Flash Write Protection

G G

FWP

_WP G

#GSM TDMA Timer: GSM Control

G G

T_OUT0

TXON_PA G

T_OUT1

WLAN_WAKEUP G optional

T_OUT2

PA_BAND G

T_OUT3

WLAN_HOST_WAKEUP G optional

T_OUT4

BT_REG_ON G optional

T_OUT5

VIB_PWM G Vibrator PWM

T_OUT6

PA_MODE G

T_OUT7

_CHG_EOC G End of charge

T_OUT8

TOUCH_LDO_EN G Touch LDO enable

T_OUT9

LCD_BACKLIGHT_EN G Backlight charge pump enable

T_OUT10

JACK_DETECT G Jack detect

T_IN0

_WLAN_RESET G optional

T_IN1

_CHG_EN G Charge enable

#SPCU

G G

SPCU_RQ_IN0

G G

SPCU_RQ_IN1

_BT_RESET G Bluetooth reset

SPCU_RC_OUT0

VCXO_EN G

SPCU_RQ_IN2

RESOURCE_CTRL G

#RF Control Unit

G G

RF_STR0

RF_EN G

RF_STR1

_PPR G

RF_DATA

RF_DA G

RF_CLK

RF_CLK G

#Other Functional Pins: Clocks and control

G G

AFC

G G

CLKOUT0

F_MODE G

F26M

26MHZ_MCLK G

F32K

F32K G

OSC32K

OSC32K G

RESET_n

_RESET G

RSTOUT_n

NC G

RTC_OUT

RTC_OUT G

- 28 -

Only for training and service purposes

#Extra I/Os & Interrupt Inputs

G G

DSPIN0

CLK32K G

DSPOUT1

WDOG G

DSPIN1

BT_WAKEUP G Bluetooth wakeup

3. TECHNICAL BRIEF

- 29 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.3 Power management IC

3.3.1 General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon S-GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well. It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

• Charge Control for charging Li-Ion/Polymer batteries under software control

• Pre-charge current generator with selectable current level

• RTC regulator with ultra-low quiescent current

• USB interface support for peripheral and mini-host mode

• Backlight LEDs driver with current selection and PWM dimming function

• Two single LED driver outputs for signaling

• Vibrator driver with adjustable voltage

• Fully controlable by software via I2C – Bus

• Temperature and battery voltage sensors

• Interrupt channels for peripherals

• System debug mode

• VQFN 48 package with heat sink and non-protruding leads

• Compatible with the Infineon E-GOLD+ V2 and V3

- 30 -

Only for training and service purposes

3. TECHNICAL BRIEF

SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality.

SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by two linear regulators

–SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g.

organizer functions, games, MP3 decoding) possible. – SDBB has high efficiency up to 95% and also a power save mode. – Memory Interface is directly supported by the SDBB – SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices. – For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up with power being supplied by the other linear regulator.

SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of 8 Ohm for usage in hands-free phones and for ringing

– 450 mW maximum output power – adjustable gain

– mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

– click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries – Precharge current source with two current levels – Constant current / constant voltage charging with 3 different termination voltages – Programable charge current limitation for use with different batteries – Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage charging phase – Top-off charge current sensing SM-POWER completes the USB interface of S-GOLD – Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection – Switch to supply USB pull-up resistor – Mini-host pull down resistor functionality – Charge pump with internal switching capacitor for USB host VBUS supply voltage SM-POWER fully supports LED and Vibra Motor functionality – no external components needed – driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM dimming – two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour

–driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation

SM-POWER offers several control functions – Power-on Reset Generator with logic state machine – I2C bus interface

– I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN (wake-up by

Bluetooth) inputs – Programable interrupt channels to handle peripherals like SIM, MMC and USB – Monitoring of charging functions – Undervoltage Shut-Down – Errorflags (volatile or non-volatile) from many power-supply functions and thermal sensor in order to debug system – Overtemperature Shut-Down – Overtemperature Warning – Support of S-GOLD standby power-down concept – Support of S-GOLD Power-Down Pad Tristate Function

- 31 -

LGE Internal Use Only

LG GM360i Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual