LG GM310 Service Manual

Service Manual Model : GM310

Internal Use Only

Service Manual

GM310

Date: April, 2009 / Issue 1.0

Table Of Contents

1. INTRODUCTION ...............................................5

1.1 Purpose ......................................................................5

1.2 Regulatory Information .................................................5

1.3. ABBREVIATION ...........................................................7

2. PERFORMANCE ...............................................9

2.1 Supporting Standard ....................................................9

2.2 Main Parts : Solution ..................................................10

2.3 H/W features .............................................................10

2.4 HW Spec. ................................................................12

3. BB CIRCUIT TECHNICAL BRIEF .....................15

3.1 Functional Block Diagram ..........................................15

3.2 Baseband Processor Introduction ..............................15

3.3 Power management IC...............................................27

3.4 Power ON/OFF ..........................................................34

3.5 SIM Interface .............................................................35

3.6 MICRO SD connector .................................................36

3.7 Memory ....................................................................37

3.8 LCD Display ..............................................................38

3.9 Keypad switching & scanning .....................................39

3.10 keypad back-light illumination ..................................40

3.12 Battery voltage monitor ............................................42

3.13 Audio ......................................................................43

3.14 BLUETOOTH ............................................................46

3.15 18PIN Interface connector ........................................49

5.5 SIM Detect Trouble ....................................................73

5.6 Number Key Sense Trouble ........................................75

5.7 Multi Key sense Trouble .............................................77

5.8 Keypad backlight Trouble ...........................................79

5.9 Micro SD Trouble .......................................................81

5.10 Audio Trouble ..........................................................83

5.11 Microphone Trouble .................................................87

5.12 Camera Trouble .......................................................91

5.13 Main LCD Trouble ....................................................93

5.14 Bluetooth Trouble .....................................................95

5.15 RF Component ........................................................98

5.16 RF SIGNAL PATH .....................................................99

5.17 Trouble Shoothing of GSM Part ...............................100

5.18 Trouble Shooting of WCDMA Part ............................108

6. DOWNLOAD & S/W UPGRADE ..................... 115

7. BLOCK DIAGRAM ........................................ 126

8. CIRCUIT DIAGRAM ...................................... 127

9. BGA Pin Map .............................................. 137

10. PCB LAYOUT .............................................143

11. RF Calibration .......................................... 155

11.1. Test Equipment Setup ...........................................155

11.2. Calibration Step ....................................................155

4. RF Circuit Technical Brief ............................50

4.1 General Description ...................................................50

4.2 GSM Part ..................................................................53

4.3 WCDMA Part .............................................................57

4.4 GSM Power Ampliﬁ er Module .....................................59

4.5 WCDMA Band1+8 Power Ampliﬁ er Module .................60

4.6 WCDMA Band1+8 Low Noise Ampliﬁ er .......................61

4.7 WCDMA Band1 Duplexer ...........................................62

4.8 WCDMA Band5 Duplexer ...........................................63

5. Trouble shooting .......................................... 64

5.1 Trouble shooting test setup ........................................64

5.2 Power on trouble .......................................................65

5.3 Charging Trouble .......................................................68

5.4 USB Trouble ..............................................................71

12. EXPLODED VIEW & REPLACEMENT

PART LIST ................................................ 161

12.1 EXPLODED VIEW ...................................................161

12.2 Replacement Parts ................................................163

12.3 Accessory ............................................................. 191

- 3 -

LGE Internal Use Only

- 4 -

Only for training and service purposes

1. INTRODUCTION

1.1.Purpose

1. INTRODUCTION

This manual provides the information necessary to repair, calibration, description and download the features of the

GM310.

1.2.Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system.

There are may be risks of toll fraud associated with your telecommunications system. System users

are responsible for programming and configuring the equipment to prevent unauthorized use. LGE

does not warrant that this product is immune from the above case but will prevent unauthorized use of

common carrier telecommunication service of facilities accessed through or connected to it. LGE will

not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone

service until repair can be done. A telephone company may temporarily disconnect service as long as

repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the

work, the telephone company is required to give advanced written notice to the user, allowing the user

to take appropriate steps to maintain telephone service.

GM310 or compatibility with the net

- 5 -

LGE Internal Use Only

1. INTRODUCTION

GM310f service manual

D. Maintenance Limitations

Maintenance limitations on the GM310 must be performed only by the LGE or its authorized agent. The

user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,

note that unauthorized alternations or repair may affect the regulatory status of the system and may

void any remaining warranty.

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information

such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly

different.

G. Interference and Attenuation

An GM310 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference

from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following

information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is

also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as

described.

- 6 -

Only for training and service purposes

1. INTRODUCTION

GM310f service manual

◆

1.3. ABBREVIATION

1. INTRODUCTION

For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control BB Baseband BER Bit Error Ratio CC-CV Constant Current – Constant Voltage CLA Cigar Lighter Adapter DAC Digital to Analog Converter DCS Digital Communication System dBm dB relative to 1 milli-watt DSP Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory EGPRS Enhanced General Packet Radio Service EL Electroluminescence ESD Electrostatic Discharge FPCB Flexible Printed Circuit Board GMSK Gaussian Minimum Shift Keying GPIB General Purpose Interface Bus GPRS General Packet Radio Service GSM Global System for Mobile Communications IPUI International Portable User Identity IF Intermediate Frequency LCD Liquid Crystal Display LDO Low Drop Output LED Light Emitting Diode LGE LG Electronics OPLL Offset Phase Locked Loop PAM Power Amplifier Module PCB Printed Circuit Board

- 7 -

LGE Internal Use Only

1. INTRODUCTION

GM310f service manual

◆

PGA Programmable Gain Amplifier PLL Phase Locked Loop PSTN Public Switched Telephone Network RF Radio Frequency RLR Receiving Loudness Rating RMS Root Mean Square RTC Real Time Clock SAW Surface Acoustic Wave SIM Subscriber Identity Module SLR Sending Loudness Rating SRAM Static Random Access Memory STMR Side Tone Masking Rating TA Travel Adapter TDD Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter VCO Voltage Controlled Oscillator VCTCXO

WAP Wireless Application Protocol

◆ 8PSK 8 Phase Shift Keying

Voltage Control Temperature Compensated Crystal

Oscillator

- 8 -

Only for training and service purposes

2. PERFORMANCE

GM310f service manual

2.1 Supporting Standard

2. PERFORMANCE

Item Feature Comment

Supporting

Standard

Frequency Range GSM850 TX : 824 - 849 MHz

WCDMA 2100/850 GSM850/EGSM900/DCS1800/PCS1900 with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1, 2, 3, A-E

GSM850 RX :869 - 894 MHz EGSM900 TX : 880 - 915 MHz EGSM900 RX : 925 - 960 MHz DCS1800 TX : 1710 - 1785 MHz DCS1800 RX : 1805 - 1880 MHz PCS1900 TX : 1850 - 1910 MHz PCS1900 RX : 1930 - 1990 MHz WCDMA2100 TX : 1920 - 1980 MHz WCDMA2100 RX : 2110 - 2170 MHz WCDMA850 TX : 824 - 849 MHz WCDMA850 RX : 869 - 894 MHz

Application

Standard

WAP 2.0, JAVA 2.0

2.2 Main Parts : Solution

Item Part name Comment

Digital Baseband PMB8868 (Infineon)

Analog Baseband PMB8868 (Infineon)

RF chip PMB6952 (Infineon)

- 9 -

LGE Internal Use Only

2. PERFORMANCE

GM310f service manual

2.3 H/W features

Item Feature Comment

Form Factor Slide type

Battery

1)Capacity Standard : Li-Ion, 900mAh

2) Packaging Type : Soft Pack

Item Feature Comment

Size 103 x 51.8 x 13.75

Weight 98 g With Battery

GSM 300 hours @paging period 5 Stand-by

time

WCDMA 300hours @DRX=7

GSM 240min @ Power Level 7 Talk

time

WCDMA 180min @Tx=12dBm

Charging time 3 hours @power OFF/900mAh

Rx sensitivity GSM850 : -105 dBm

EGSM900 : -105 dBm DCS1800 : -105 dBm PCS1900 : -105 dBm WCDMA2100 : -106.7 dBm WCDMA900 : -103.7 dBm

TX output

power

GSM/

GPRS

EDGE GSM850 : 27 dBm

GSM850 : 33 dBm EGSM900 : 33 dBm DCS1800 : 30 dBm PCS1900 : 30 dBm

EGSM900 : 27 dBm DCS1800 : 26 dBm PCS1900 : 26 dBm

Class4 (GSM850) Class4 (EGSM900) Class1(DCS) Class1(PCS) E2 (EGSM850) E2 (EGSM900) E2 (DCS)

E2 (PCS) GPRS compatibility GPRS Class 12 EDGE compatibility EDGE Class 12

Display 2.2” 240x320 (QVGA) TFT

Built-in Camera 3 Mega pixel

ANT Main : Internal Fixed Type

System connector 18 Pin

- 10 -

Only for training and service purposes

GM310f service manual

Ear Phone Jack 3.5pi, 4 Pole, Stereo

PC synchronization Yes

Speech coding FR, EFR, HR, AMR

Vibrator Built in Vibrator

Blue Tooth V1.2, A2DP

2. PERFORMANCE

Voice Recording Yes

Speaker Phone

mode Support

Travel Adapter Yes

CDROM No

Stereo Headset Yes

Data Cable No

T-Flash Yes

Yes

- 11 -

LGE Internal Use Only

2. PERFORMANCE

GM310f service manual

2.4 HW Spec.

2.4.1. GSM Transmitter/Receiver spec.

Item Specification

Frequency

Phase Error

Frequency Error

EMC(Radiated Spurious Emission

Disturbance)

Transmitter Output power and

Burst Timing

Burst Timing <3.69us

Spectrum due to modulation out

to less than 1800kHz offset

Spectrum due to modulation out

to larger than 1800kHz offset to

the edge of the transmit band

GSM850 TX : 824 - 849 MHz RX : 869 - 894 MHz

EGSM900 TX : 880 - 915 MHz RX : 925 - 960 MHz

DCS1800 TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz

PCS1900 TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz

Rms : 5°

Peak : 20 °

GSM : 0.1 ppm

DCS/PCS : 0.1 ppm

GSM/DCS : < -28dBm

GSM : 5dBm – 33dBm ± 3dB

DCS/PCS : 0dBm – 30dBm ± 3dB

200kHz : -36dBm

600kHz : -51dBm/-56dBm

GSM : 1800-3000kHz :< -63dBc(-46dBm)

3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

DCS : 1800-3000kHz :< -65dBc(-51dBm)

6000kHz < : < -73dBc(-51dBm)

Spectrum due to switching

transient

Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)

Usable receiver input level range 0.012(-15 - -40dBm)

Intermodulation rejection –

Speech channels

AM Suppression

- GSM : -31dBm - DCS : 29dBm

Timing Advance ± 0.5T

400kHz : -19dBm/-22dBm(5/0), -23dBm

600kHz : -21dBm/-24dBm(5/0), -26dBm

± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)

-98dBm/-96dBm (2.439%)

- 12 -

Only for training and service purposes

GM310f service manual

2.4.2. WCDMA Transmitter spec.

Item Specification

Transmit Frequency 1920 MHz ~ 1980 MHz/ 880 MHz ~ 915 MHz

Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error within ±0.1 PPM

Open Loop Power Control Normal Conditions : within ±9 dB,

Extreme Conditions : within ±12 dB

Minimum Transmit Power < -50 dBm /3.84 MHz

Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)

2. PERFORMANCE

Adjacent Channel Leakage

Power Ratio (ACLR)

Spurious Emissions

|f-fc| > 12.5 MHz

Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz

Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

Peak Code Domain Error

> 33 dB @ ±5 MHz,

> 43 dB @ ±10 MHz

< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz

< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz

< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz

< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz

< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz

< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz

when Interference CW Signal Level = -40 dBc

< -15 dB at Pout t -20 dBm

- 13 -

LGE Internal Use Only

2. PERFORMANCE

GM310f service manual

A

2.4.3. WCDMA Receiver spec.

Item Specification

Receive Frequency 2110 ~ 2170 MHz / 925 ~ 960 MHz

Reference Sensitivity Level BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz(WCDMA2100)

BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz(WCDMA900)

Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz

djacent Channel Selectivity

(ACS)

Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz(WCDMA2100)

Spurious Response BER < 0.001 when Îor = -103.7 dBm (WCDMA2100)

Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz(WCDMA2100)

ACS > 33 dB where BER < 0.001 when Îor = -92.7 dBm / 3.84

MHz & Ioac = –52 dBm / 3.84 MHz @ ±5 MHz(WCDMA2100)

ACS > 33 dB where BER < 0.001 when Îor = -89.7 dBm / 3.84

MHz & Ioac = –52 dBm / 3.84 MHz @ ±5 MHz(WCDMA900)

when Îor = -100.7 dBm/ 3.84 MHz(WCDMA900)

& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz

or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz

when Îor = -100.7 dBm (WCDMA900)

& 3.84 MHz & Iblocking = -44 dBm

when Îor= -100.7 dBm / 3.84 MHz(WCDMA900)

& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz

& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz

Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz

< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz

Inner Loop Power Control In

Uplink

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4

group(10equal command group)

+1 +8/+12 +16/+24

- 14 -

Only for training and service purposes

3. BB Circuit Technical brief

GM310f service manual

Φ

Fu

F

N

3. BB Circuit Technical brief

3.1 Functional Block Diagram

3M Camera

3M Camera3M Camera

Memory

1Gb Nand

512Mb SDRam

LDO

RF Part

FEM

EDGE

UMTS 1900 or 2100

Duplex

UMTS 850 or 900

GSM/EDGE 850/900/1800/1900

Transceiver

PMB6952

EDGE

PAM

UMTS

LNA

UMTS

PAM

UMTS

BATTERY

BATTER

900mAh

Y

26M

Charging IC

ISL9221

U

LDO

BaseBand Processor

USIM

32K

32K32K

18Pin-MMI

Connector

18Pin-MMI

TA

Sub Keypad

Touch IC

Backup

Backup Battery

Battery

PMB8868

BaseBand Processor

PMB8868

USB

Navi Key

High speed USB

Switch

Main Keypad

Main Keypad Main Keypad

PMB6821

Full speed USB

Mic

PMIC

PMB6821

Motor IC

Hall IC

Charge

Pump

MP3 Chip

TCC8121

Audio Amp

LM49150

Audio

FM Recording

BT / FM Radio

RBCA-B561A

BT / FM

Motor

QVGA LCD(240 x 320)

QVGA LCD(240 x 320)QVGA LCD(240 x 320)

Micro SD

Switch

RCV/SPK

RCV/SPKRCV/SPK

Filter

FilterFilter

3.5

Φ

3.5

Ear-phone

[Figure 3.1] Functional Block Diagram

3.2 Baseband Processor Introduction

[Figure 3.2] T op level block diagram of the MPEH(PMB8868)

- 15 -

LGE Internal Use Only

3. BB Circuit Technical brief

GM310f service manual

3.2.1 General description

S-GOLD3H-LC is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a

mixed signal baseband IC with a 3G coprocessor IC.

l Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-

GOLD3

as a single chip solution, integrating the digital and mixed signal portions of the base band in 0.09um,

1.2V technology.

application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external

hardware.

TM

Provides multimedia extensions such as camera, software MIDI, MP3 sound. It is designed

The chip will support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD3

TM

support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data

3.2.2. Block Description

z Processing core

ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,

and the Jazelle Java extension for Java acceleration.

- TEAKLite DSP core

z ARM-Memory

- 32k Byte Boot ROM on the AHB

- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 32k Byte Instruction Cache

- 32k Byte Data Cache

- 8k Byte Instruction Tightly coupled Memory(I-TCM)

- 8k Byte Data tightly coupled memory (D-TCM)

z DSP-Memory

- 120k x 16bit Program ROM

- 8k x 16bit Program RAM

- 72k x 16bit Data ROM

- 48k x 16bit Data XRAM

-5k x 16bit Data YRAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

- 16 -

Only for training and service purposes

3. BB Circuit Technical brief

GM310f service manual

z Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

z Controller Bus system

The processor cores and their peripherals are connected by powerful buses.

-Multi-layer AHB for connecting the ARM and the other master capable building blocks with the

internal and external memories and with the peripheral buses.

-An FPI-Bus for connecting GSM peripherals, called hereafter FPI3 bus.

-A controller FPI bus for connecting the low performance controller peripherals such as keypad,,

Called hereafter fPI2 bus.

-FPI2 and FPI3 are connected asynchronously to the AHB buses.

z Clock system

The clock system allows widely independent selection of frequencies for the essential parts of the S-

GOLD3H-LC. Thus power consumption and performance can be optimized for each application.

z Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms

(H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame

synchronous low power mode and enhanced CPU modes(idle and sleep modes)

- 17 -

LGE Internal Use Only

3. BB Circuit Technical brief

GM310f service manual

3.2.3 RF Interface(T_OUT)

S-Gold3H-LC uses this interface to control RF IC and Peripherals.

[Table 3.2.3-1] RF Interface Spec.

T_OUT Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on

T_OUT1 -

T_OUT2 ANT_SEL1 FEM control

T_OUT3

T_OUT4

T_OUT5

T_OUT6 PA_MODE PAM Mode select

T_OUT7 ANT_SEL2 FEM control

T_OUT8 ANT_SEL3 FEM control

T_OUT9

T_OUT10

- 18 -

Only for training and service purposes

GM310f service manual

3.2.4 ADC channel

3. BB Circuit Technical brief

ADC block is composed of 11 external ADC channel. This block operates charging process and other

related process by reading battery voltage and other analog values.

[Table 3.2.4-1] S-Gold3 ADC channel usage

ADC channel Resource Interconnection Description

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

kM2 N.C

M3 JACK_TYPE Accessory type detect

M4 N.C

M5 N.C

M6 N.C

M7 H/W VERSION H/W version detect

M8 VBAT Battery supply voltage measure

M9 N.C

M10 N.C

- 19 -

LGE Internal Use Only

3. BB Circuit Technical brief

GM310f service manual

3.2.5 GPIO map

Over a hundred allowable resources, GM310 is using as follows except dedicated to SIM and Memory.

GM310 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,

is shown in below table

[Table 3.2.5-1] S-Gold3H-LC GPIO pin Map

Port Function Net Name Description KEY MATRIX

KP_IN0 KP_IN1 KP_IN2 KP_IN3 KP_IN4 KP_IN5 KP_IN6 KP_OUT0 KP_OUT1 KP_OUT2 KP_OUT3

USIF1

USIF1_RXD_MRST USIF1_TXD_MTSR USIF1_RTS_N USIF1_CTS_N

USIF2

USIF2 _RXD_MRST USIF2 _TXD_MTSR USIF2_RTS_N USIF2_CTS_N

USIF3

USIF3 _RXD_MRST USIF3 _TXD_MTSR GPIO_21

CLK

CLK32K GPIO_22

KEYIN0

KEYIN1

KEYIN2

KEYIN3

KEYIN4

KEYIN05

KEYOUT5

KEYOUT0

KEYOUT1

KEYOUT2

KEYOUT3

UART_RX UART Data

UART_TX UART Data

USB_ DAT_VP USB Data

USB_SE0_VM USB Data

TCC_PWRON Multimedia chip power on

TCC_RESET Multimedia chip reset

BT_UART_RTS Bluetooth RTS

BT_UART_CTS Bluetooth CTS

BT_UART_RX Bluetooth UART Data

BT_UART_TX Bluetooth UART Data

USB_SEL USB 1.1, 2.0 select

CLK32k For FM Radio, BT CLK32K

Not used

- 20 -

Only for training and service purposes

GM310f service manual

CAMERA I/F

CIF_D0 CIF_D1 CIF_D2 CIF_D3 CIF_D4 CIF_D5 CIF_D6 CIF_D7 CIF_PCLK CIF_HSYNC CIF_VSYNC CLKOUT2 CIF_PD CIF_RESET

LCD I/F

DIF_D0 DIF_D1 DIF_D2 DIF_D3 DIF_D4 DIF_D5 DIF_D6 DIF_D7 DIF_D8 DIF_CS1 EINT4 DIF_CD DIF_WR LCD_RD DIF_HD DIF_VD DIF_RESET1 DIF_RESET2

I2C

I2C1_SCL I2C1_SDA PM_INT (EINT)

3. BB Circuit Technical brief

CAM_D0 Camera DATA[0]

CAM_D1 Camera DATA[1]

CAM_D2 Camera DATA[2]

CAM_D3 Camera DATA[3]

CAM_D4 Camera DATA[4]

CAM_D5 Camera DATA[5]

CAM_D6 Camera DATA[6]

CAM_D7 Camera DATA[7]

CAM_PCLK Camera pixel clock

CAM_HSYNC Camera H sync

CAM_VSYNC Camera V sync

CAM_MCLK Camera main clock

CAM_PWR_EN Camera power down(active high)

CAM_RESET Camera reset

LCD_D0 LCD data[0]

LCD_D1 LCD data[1]

LCD_D2 LCD data[2]

LCD_D3 LCD data[3]

LCD_D4 LCD data[4]

LCD_D5 LCD data[5]

LCD_D6 LCD data[6]

LCD_D7 LCD data[7]

DIF_ID LCD data[8]

_LCD_CS1 LCD chip select

EXT_SPK_DETECT External speaker detect

LCD_CD Command Data switch

_LCD_WR LCD Write

LCD_RD LCD Read

HOOK_DETECT Headset hook detect

LCD_VSYNC LCD Vsync

_LCD_RESET LCD Reset

A_RESET 3G reset

SCL_PMIC For PMIC

SDA_PMIC For PMIC

PM_INT For PMIC

- 21 -

LGE Internal Use Only

3. BB Circuit Technical brief

GM310f service manual

I2C2_SCL I2C2_SDA

SIM I/F

CC_IO CC_CLK CC_RST

I2S2

GPIO_31 GPIO_102 GPIO_32 CC0CC7IO GPIO_34 GPIO_103

External Memory

GPIO_104 GPIO_105 GPIO_106 GPIO_39 GPIO_40 GPIO_41 GPIO_22 GPIO_107 GPIO_108

SCL

SDA

SIM_IO SIM CARD DATA

SIM_CLK SIM CARD CLOCK

SIM_RST SIM CARD RESET

BT_RESETn Bluetooth Reset

DBB_BT_INT S-GOLD3H-LC to Bluetooth interrupt

TCC_INT Multimedia chip Interrupt

BT_INT Bluetooth to S-GOLD3H-LC interrupt

MAIN_KEY_EN Number Key LED enable

Not used

TOUCH_RESET Touch IC Reset

SDA_TOUCH Touch IC I2C Data

SCL_TOUCH Touch IC I2C Clock

TCC_MMC_DETECT Multimedia chip T-flash detect

CAM_LDO_EN Camera LDO enable

TOUCH_WAKEUP Touch IC wakeup

TOUCH_INT Touch IC Interrupt

MOTOR_EN Vibrator enable

Not used

IrDA

GPIO_110

GPIO_111

I2S1

I2S1_CLK0 I2S1_CLK1 I2S1_RX

I2S1_TX I2S1_WA0

Audio I/F

EPN1 EPP1 EPPA1 EPREF

USB_OEn For USB

SLIDE_DETECT Slide on/off detect

BT_PCM_CLK For Bluetooth

BT_PCM_RX For Bluetooth

BT_PCM_TX For Bluetooth

BT_PCM_SYNC For Bluetooth

REC_N For Receiver

REC_P For Receiver

HS_L For Headset

Reference

- 22 -

Only for training and service purposes

3. BB Circuit Technical brief

GM310f service manual

EPPA2 MICN1 MICP1 MICN2 MICP2 VMICP VMICN

ADC

M0 M1 M2 M3 M7 M8 M9 M10

Reference

VREF IREF

JTAG I/F

JTAG0_TDO JTAG0_TDI JTAG0_TMS JTAG0_TCK JTAG0_TRST_n JTAG0_RTCK JTAG1_TDO JTAG1_TDI JTAG1_TMS JTAG1_rTCK JTAG0_TRST_n

ETM I/F

TRIG_IN MON1 MON2 TRACESYNC TRACECLK PIPESTAT[2]

HS_R For Headset

MAIN_MIC_N For Main Mic

MAIN_MIC_P For Main Mic

HS_MIC_N For Headset Mic

VMIC_P Power for MIC

GND Ground for MIC

BAT_ID Battery temperature measure

RF_TEMP RF block temperature measure

JACK_TYPE Accessory type detect

H/W VERSION H/W version detect

VBAT Battery supply voltage measure

VREFN

GND with resistor

MON1 ETM

MON2 ETM

- 23 -

LGE Internal Use Only

3. BB Circuit Technical brief

GM310f service manual

PIPESTAT[1] PIPESTAT[0] TRACEPKT[0] TRACEPKT[1] TRACEPKT[2] TRACEPKT[3] TRACEPKT[4] TRACEPKT[5] TRACEPKT[6] TRACEPKT[7]

Memory

MEM_AD[0] MEM _AD[1] MEM _AD[2] MEM _AD[3] MEM _AD[4] MEM _AD[5] MEM _AD[6] MEM _AD[7] MEM _AD[8] MEM _AD[9] MEM _AD[10] MEM _AD[11] MEM _AD[12] MEM _AD[13] MEM _AD[14] MEM _AD[15] MEM _WR_n MEM _RD_n MEM _BC0_n MEM _BC1_n MEM _BC2_n MEM _BC3_n MEM _A[0] MEM _A[1] MEM _A[2] MEM _A[3] MEM _A[4]

DATA(0)

DATA(1)

DATA(2)

DATA(3)

DATA(4)

DATA(5)

DATA(6)

DATA(7)

DATA(8)

DATA(9)

DATA(10)

DATA(11)

DATA(12)

DATA(13)

DATA(14)

DATA(15)

_WR

_RD

_BC0

_BC1

LDQS

UDQS

ADD(0)

ADD(1)

ADD(2)

ADD(3)

ADD(4)

- 24 -

Only for training and service purposes

3. BB Circuit Technical brief

GM310f service manual

MEM _A[5] MEM _A[6] MEM _A[7] MEM _A[8] MEM _A[9] MEM _A[10] MEM _A[11] MEM _A[12] MEM _A[13] MEM _A[14] MEM _A[15] MEM _A[16] MEM _A[17] MEM _A[18] MEM _A[19] MEM _A[20] MEM _A[21] MEM _A[22] MEM _A[23] MEM _A[24] MEM _A[25] MEM _A[26] MDM_SDA[11] MDM_SDA[12] MDM_SDA[13] MDM_SDA[14] MEM _CS0_n MEM _CS1_n MEM _CS2_n MEM _CS3_n MEM _ADV_n MEM _RAS_n MEM _CAS_n MEM _WAIT_n MEM _SDCLK0 MEM _BFCLK01 MEM _BFCLK02 MEM _CKE

ADD(5)

ADD(6)

ADD(7)

ADD(8)

ADD(9)

ADD(10)

ADD(11)

ADD(12)

ADD(13)

ADD(14)

ADD(15)

ADD(16)

ADD(17)

ADD(18)

ADD(19)

ADD(20)

ADD(21)

ADD(22)

ADD(23)

ADD(24)

ADD(25)

ADD(26)

ADD(27)

ADD(28)

ADD(29)

ADD(30)

_NAND_CS INTEL NOR (64MB)

_RAM_CS INTEL SDRAM (64MB)

_CS3

ADV_A15

_RAS

_CAS

_WAIT

SDCLKO For Burst mode

BFCLKO For Burst mode

SDCLK1 For Burst mode

CKE

- 25 -

LGE Internal Use Only

3. BB Circuit Technical brief

GM310f service manual

Memory

FCDP_RBn GPIO_60

TDMA I/F

T_OUT0 T_OUT1 T_OUT2 GPIO_46 EINT6 CC0CC2IO T_OUT6 T_OUT7 T_OUT8 GPIO_52 CC1CC7IO GPIO_54 GPIO_55

RF I/F

RF_STR0 CC1CC5IO RF_DATA RF_CLK RF_LOCK_DET MASTER_ON PA_MODE FEM_CTRL[0] FEM_CTRL[1] FEM_CTRL[2]

System Port

AFC CLKOUT0 [<=26MHz] F26M F32K OSC32K RESET_n TRIG_OUT RTC_OUT VCXO_EN

FCDP

RPWRON_DBB

TXON_PA PAM

ANT_SEL1

LCD_BL_CTRL Charge pump control

_EOC Charging terminate signal

MMC_DETECT SD card detect

PA_MODE PAM

ANT_SEL2

ANT_SEL3

DSR

JACK_DETECT Jack detect

TA_DETECT Charger detect

CHG_EN Charging enable

2G_EN

_PPR Charger detect

2G_DATA

2G_CLK

3G_LD

3G_MASTER_ON

3G_PA_MODE1

ANT_SEL4

ANT_SEL5

ANT_SEL6

AFC

Not used

26MHZ 26M Main Clock

to 32k crystal

_RESET

TRIG_OUT

RTC_OUT

VCXO_EN

- 26 -

Only for training and service purposes

GM310f service manual

DSP

GM310f service manual

DSPIN0

3. BB Circuit Technical brief

CLK32K

DSPOUT1 GPIO_63

WDOG Navi key LED Backlight Control

HS_MIDI_EN Headset MIDI enable

3.3 Power management IC

3.3.1 General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has

been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon

SGOLD

baseband device it is suitable for the S-GOLD lite and the E-GOLD+ baseband devices as well.

It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the

Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all

power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone

minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and

memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

• Charge Control for charging Li-Ion/Polymer batteries under software control

• Pre-charge current generator with selectable current level

• RTC regulator with ultra-low quiescent current

• USB interface support for peripheral and mini-host mode

• Backlight LEDs driver with current selection and PWM dimming function

• Two single LED driver outputs for signaling

- 27 -

LGE Internal Use Only

3. BB Circuit Technical brief

GM310f service manual

• Vibrator driver with adjustable voltage

• Fully controlable by software via I2C - Bus

• Temperature and battery voltage sensors

• Interrupt channels for peripherals

• System debug mode

• VQFN 48 package with heat sink and non-protruding leads

• Compatible with the Infineon E-GOLD+ V2 and V3

SM-POWER is a further step on the successful E-Power product line with enhanced and optimized

functionality.

SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by

two linear regulators

- SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone

functions (e.g. organizer functions, games, MP3 decoding) possible.

- SDBB has high efficiency up to 95% and also a power save mode.

- Memory Interface is directly supported by the SDBB

- SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.

- For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the

linear regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase

the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up

withpower being supplied by the other linear regulator.

SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of

8 Ohm for usage in hands-free phones and for ringing

- 450 mW maximum output power

- adjustable gain

- mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

- click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer

batteries

- Precharge current source with two current levels

- Constant current / constant voltage charging with 3 different termination voltages

- Programable charge current limitation for use with different batteries

- Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage

charging phase

- 28 -

Only for training and service purposes

3. BB Circuit Technical brief

GM310f service manual

- Top-off charge current sensing SM-POWER completes the USB interface of S-GOLD

- Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection

- Switch to supply USB pull-up resistor

- Mini-host pull down resistor functionality

- Charge pump with internal switching capacitor for USB host VBUS supply voltage SM-POWER fully

supports LED and Vibra Motor functionality

- no external components needed

- driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM

dimming

- two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour

- driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation

SMPOWER

offers several control functions

- Power-on Reset Generator with logic state machine

- I2C bus interface

- I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN

(wake-up by Bluetooth) inputs

- Programable interrupt channels to handle peripherals like SIM, MMC and USB

- Monitoring of charging functions

- Undervoltage Shut-Down

- Errorflags (volatile or non-volatile) from many power-supply functions and thermal sensor in order to

debug system

- Overtemperature Shut-Down

- Overtemperature Warning

- Support of S-GOLD standby power-down concept

- Support of S-GOLD Power-Down Pad Tristate Function

- 29 -

LGE Internal Use Only

3. BB Circuit Technical brief

GM310f service manual

[Table 3.3.1-1] LDO Output Table of SM-Power3

LDO Net name Output Voltage Output Current Usage

SD1 1V35_Core 1.35V 600mA Core & for LDO

SD2 1V8_SD 1.8V 300mA Memory

VAUX 2V85_VFM 2.85V 100mA SUB PMIC

VIO 2V62_VIO 2.62V 100mA Peripherals

VSIM 2V9_SIM 2.9V 70mA SIM card

VMME 2V9_VMME 2.9V 150mA u-SD

VUMTS 2V85_VCD 2.85V 110mA LCD

VAUDIOa 2V5_VAUDA 2.5V 200mA Stereo headset, Mono earpiece

VAUDIOb 2V5_VAUDB 2.5V 50mA Analog parts of S-Gold

VRF1 2V85_VRF 2.85V 150mA

2.85 V supply for SMARTi-PM

RF transceiver

1.5 V supply for SMARTi-PM

VRF2 1V5_VRF 1,53V 100mA

RF transceiver

VRF3 2V855_VBT 2.7V 150mA Bluetooth

VPLL 1V35_VPLL 1.35V 30mA S-GOLD3H PLL

VRTC 2V11_RTC 2.11V 4mA Real Time Clock

VAFC 2V7_VRF 2.65V 5mA Not used

VVIB 2V8_VAMP 2.8V 140mA Not used

OIV_26V

TP203

K3

OUTPORT

POWER_ON

VSS24

VSS25

G8

TP204

L3

G9

WDOG

K4

WDOG

VSS26

H5

PWRON

ON_OFF2

TP205

L5

ON_OFF1L4ON_OFF2

VSS27

VSS28

H6

H7

SPOWER_INT

RESOURCE_CTRL

K5

J5

I2C_INT

ON_OFF_OUT

RESOURCE_CRTL

VSS30

VSS29

J6

SDA_PMIC

K6

I2C_DAT

2

202R

K7.4

SCL_PMIC

J7

I2C_CLK

H8

L6

VSS_SD1

H4

02R

BL1

BL2

K7

BL1_PWM

BL2_PWM

VSS_SD2D9VSS_VREF

K7.4

3

J8

BL3

BL3_PWM

L7

CH_CNTRL

L8

K8

CHARGE_UC

CH_SOURCE

K9

L9

K10

SENSE_IN1

VDD_CHARGE

TABV

C

J9

VDD_REF

SENSE_IN2

V133RDK

2

3

402C

1

u1

102

D

502C

u33

1.0112

u

102

L

TP206

Hu01

A8

VLED

D202

L11

VSD1

S

RB521S-30

C

EMMV

01C

EMMDDV

01D

DV

2FRD

11

D

2FRV

01E

3FRV

11E

FA_31FRDDV

C

01F

RV

1F

11

F

BIVV

1

1G

BIVMISDDV

01G

MISV

11H

CFAV

01H

CTRV

202BF

9H

STMUDDV

11J

STMUV

BF_1DS

302BF

11K

1DSDDV

01

J

01L

806

1

LBF_1D

912C u7.4 806

1

HCV_PVO

G

602

R

BSUV_PVO

K7

4

TCETED_AT

012

R

K74

EROC_53V1

DCLV_58V2

TABV

1608

4.7u

2.2uC228 C216 10u

C229

C230 4.7u

CTR_11V2

1608

10u

132C332

C

C217

C220 10u

u

1

u

CIMP

R

BDUAV_5V2

DS_8V

1

ADUAV_5V2

412C

312C

2

u2.

2

122C

322

0

C

u1.

222

u01

806

8061

1

702R

2FFO_NOTUO_CT

K72

902

R

D

IN

nEO_BSU PV_TAD_BSU

MV_0ES_

BSU

ABV

T

MFV_58V2

P

102B

F

8061

B

5

12C

u

1

R

812C

u7.4

806

1

TABV

1B 2

C

3D 11

V

1

C

PD_SF_BSU MD_SF_BSU

nTSRM

NE_OXCV_MP NE_OXCV_T

302D

03-S125B

4

22C u2.2

1

806

+D

2D

D

-

nTSRMP

3E 1

D

2E 1

E

2F 1

F

2G 1G

2H 1

H

1J

202L

2J 3

H

1

Hu0

3J

S

1K 2K

S

2

L

522C

u1.0

C226 2.2u

8061

C227 4.7u

BSUV

TAB

TABV

V

2.2u

102C

u2.

2

1

806

1

C202

C

412R K00

1

0.1u

C210

C5

B6

A7

C4

B5

B7

A4

A3

B2

A2

B3

C3

AC-

DAT_VP

SE0_VM

VCR NIPV

NIM

N_TESER

N_2TESER N_1PEELS N_2PEELS

AOIDUAV

AOIDUADDV

BOIDUADDV

BOIDUAV

XUAV

XUADDV

ETAG_1US

DNG_1US

BF_1US

ESNESI_1U

2DSDDV BF_2D BF_2DS

L

AC+

OE_N

SUSPEND

A5

VUSB

VDD_USB

MONO_INP

MONO_INN

VREFEX_M

VDD_MONO

MONO_OUTP

VSS1

VSS2

C6

D4

302

u1.0

C7

VSS_MONO

VSS3

D5

1

A6

MONO_OUTN

VSS4

VSS5

D6

D7

%

100KR215

B8

RREF

VSS6D8VSS7E4VSS8

C8

E5

1u

C212

VREF

E6

1

MAIN_KEY_LED

MAIN_KEY_EN

A9

B10

C9

FLASH_ON

FLASH_SHINK

VSS10

VSS11

VSS9

E7

E8

E9

53V

1u

C207

TXONPA

VSS12

F3

LLPV_

T

ABV

TABV

OIV_

2

26V

4.7KR211

2.2uC209

C208 2.2u

R213 4.7K

R212 4.7K

8061

TP202

J4

A1

A11

B4

B11

L1

A10

B9

VIO

VPLL

VSD2

PUMS1

PUMS2

PUMS3

VDDPLLIO

102U

1286BMP

VSS13

VSS14

VSS15

VSS16

VSS17

VSS18

VSS19

VSS20

VSS21

VSS22G5VSS23

F4

F5

F6

F7

F8

F9

G3

G4

G6

G7

FRV_7V2

2

u2.2

FRV_5V

8V2

FRV_5

M

2

ISV_9V

632C

532C

u

u2.2

2.2

EMMV_9V2

1

DS_8V

1

TBV_58V

0

42C

732

C432C

C

832

9

32C

u2.

2

u2.2

2.2

u

u2.2

[Figure3.3.1-1] SM-Power 3 Circuit Diagram

- 30 -

Only for training and service purposes

GM310f service manual

3.3.2 Charging control

3. BB Circuit Technical brief

- GM310 is use external charging IC

-Charging IC is ISL9221

1. Charging method : CC-CV

2. Charger output voltage : 5.1 V

3. Charging time : 2h 10m

4. Charging current : 600 mA

5. CV voltage : 4.2 V

6. Cutoff current : 117 mA

7. Full charge indication current (icon stop current) : 117 mA

8. Recharge voltage : 4.15 V

9. Low battery alarm

a. Idle : 3.45 V ~ 3.31 V

b. Dedicated : 3.45 V ~ 3.3 V

10. Low battery alarm interval

a. Idle : 3 min

b. Dedicated : 1 min

11. Switch-off voltage : 3.31 V

12. Charging temperature adc range

a. ~ -20 : low charging voltage operation (3.℃ 6 V ~ 3.9 V) .

b. -20 ~ 60 : standard charging (up to 4.2 V) ℃℃

c

. 60 ~ : low charging voltage operation (3.6V ~ 3.9V) ℃

G

AHC

I G

C

NI

R

IV_26V2

O

R

722

1

K00

1

R

PP

_

COE_

NE_G

HC

GHCV_BSU

GHC

V

R_11V

C

2

T

8

22R K00

752C

1

u

U

402

1

C

V

D

2

BSUV

3

_

RPP

4

GHC

_

5

NE_

6

NI

MI

852

C

9

R

2

u1

4

K7.

1

[Figure 3.3.2-1] Charging IC (ISL9221)

- 31 -

V

T

AB

2

29LSI

1

3

1

D

NG

P

2

1

P

V

B_CD

Y

1

AB

T

0

1

U

P

B_BS

Y

9

DVI

C

8

NG

D

7

BSU

I

Am006Am711

Am873

132R

032

R

K81

3

K

11

.

%

1

1%

%

952C

1

u

u1

GHC

VO

V_P

BSUV_PVO

6

2

1

062C

C 1

u

LGE Internal Use Only

LG GM310 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual