LG GD580 Service Manual

Service Manual Model : GD580

Internal Use Only

Service Manual

GD580

Date: November, 2009 / Issue 1.0

Table Of Contents

1. Introduction ...................................................5

1.1 Purpose ......................................................................5

1.2 Regulatory Information .................................................5

1.3 Abbreviation ................................................................7

2. performance ...................................................9

2.1 System Overview .........................................................9

2.2. Usable environment ..................................................10

2.3 Radio Performance ....................................................11

2.4 Current Consumption .................................................19

2.5 RSSI .........................................................................19

2.6 Battery Bar ................................................................19

2.7 Sound Pressure Level ................................................20

2.8 Charging ...................................................................21

3. Technical brief .............................................22

3.1 Digital Baseband(DBB) & Multimedia Processor ...........22

4.10 Charger Trouble Shooting .......................................113

4.11 Bluetooth Trouble ...................................................116

4.12 RF Component ......................................................119

4.13 Procedure to check ...............................................120

4.14 Checking Common Power Source Block ..................121

4.15 Checking VCXO Block ............................................128

4.16 Checking Front End Module Block ..........................132

4.17 Checking Front End Module Block input logic ..........133

4.18 Checking WCDMA Block ........................................142

4.19 Checking GSM Block .............................................155

5. Download ................................................... 167

5.1 Requirements ..........................................................167

5.2. GD580 Download ...................................................168

5.3 Trouble Shooting ......................................................175

6. Block diagram ............................................ 170

3.2 GAM Hardware Subsystem .........................................44

3.3. Audio Part ................................................................53

3.4 GPADC(General Purpose ADC) and AUTOADC2 ............61

3.5 Charger control .........................................................62

3.6. Voltage Regulation ....................................................68

3. 7 RF Technical Description ...........................................69

4. Trouble Shooting .......................................... 79

4.1 Power ON Trouble ......................................................79

4.2 USB Trouble ..............................................................80

4.3 SIM Detect Trouble ....................................................81

4.4 MicroSD card Trouble ................................................82

4.5 Key and Touch Screen Trouble ....................................83

4.6 Camera Trouble .........................................................85

4.7 Main LCD Trouble ......................................................92

4.8 Keypad Backlight Trouble ...........................................96

7. Circuit Diagram .......................................... 181

8. BGA Pin Map .............................................. 191

9. PCB Layout .................................................197

10. Calibration ................................................ 205

10.1 General Description ...............................................205

10.2 XCALMON Environment .........................................205

10.3 Calibration Environment .........................................206

10.4 Program Operation ................................................207

11. Exploded view & Replacement part list . 213

11.1 Exploded view .......................................................213

11.2 Replacement Parts ................................................215

12.3 Accessory .............................................................237

4.9 Audio Trouble Shooting ..............................................99

- 3 -

LGE Internal Use Only

- 4 -

Only for training and service purposes

1. Introduction

1. INTRODUCTION

1. Introduction

1.1.Purpose

This manual provides the information necessary to repair, calibration, description and download the

features of the KM555E.

GD580.

1.2.Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system.

There might be risks of toll fraud associated with your telecommunications system. System users are

responsible for programming and configuring the equipment to prevent unauthorized use. LGE does

not warrant that this product is immune from the above case but will prevent unauthorized use of

common carrier telecommunication service of facilities accessed through or connected to it. LGE will

not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone

service until repair can be done. A telephone company may temporarily disconnect service as long as

repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the KM555E or compatibility with the net

work, the telephone company is required to give advanced written notice to the user, allowing the user

to take appropriate steps to maintain telephone service.

GD580

D. Maintenance Limitations

Maintenance limitations on the KM555E must be performed only by the LGE or its authorized agent.

The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system

and may void any remaining warranty.

GD580

- 5 -

LGE Internal Use Only

1. Introduction

KM555E service manual

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information

such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly

different.

G. Interference and Attenuation

KM555E may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from

GD580

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following

information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is

also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as

described.

- 6 -

Only for training and service purposes

1. Introduction

KM555E service manual



1.3 Abbreviation

For the purposes of this manual, following abbreviations apply:

1. Introduction

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current – Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EGPRS Enhanced General Packet Radio Service

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

- 7 -

LGE Internal Use Only

1. Introduction

KM555E service manual



PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO

WAP

 8PSK 8 Phase Shift Keying

Voltage Control Temperature Compensated Crystal

Oscillator

Wireless Application Protocol

- 8 -

Only for training and service purposes

2. Performance

2.1 System Overview

Item Specifications

2. Performance

Band

Type

Dimension

Weight

Power

Talk Time

Stand-by Time

Antenna

LCD(Main)

Back Light

Back Light color

Vibrator

Speaker

GSM Triple Band(900/1800/1900), UMTS, Bluetooth

Folder type

108.3 x 51.5 x 13.4mm

103.5g [87.0g With out Battery]

800mAh Li-Ion

Over 170 Min (WCDMA, Tx=12dBm, @ Voice)

Over 180 Min (GSM, Tx=Max, @ Voice)

Over 250 hours (WCDMA, DRX=7

GSM, Paging period=5)

Intenna Type

240x400Pixel

Yes

White

Yes (Coin Type)

Yes

MIC

Receiver

Earphone Jack

SIM Socket

Volume Key

Voice Key

I/O Connect

Yes ( SMT Type) /2EA

1 for speaker phone/1 for Voice call

Yes

Yes(SIM Block Type) : 3.0V & 1.8V

Push Type(+,-)

Push Type

18 Pin

- 9 -

LGE Internal Use Only

2. Performance

2.2 Usable environment

1) Environment

Item Spec. Unit

Voltage 3.7 (Typ), 3.4 (Min), (Shut Down: 3.2) V

Operating Temp. -20 ~ + 60 °C

Storage Temp. -30 ~ + 85 °C

Humidity max. 85 %

2) Environment (Accessory)

Item Spec. Min Typ. Max Unit

Power Available power 100 220 240 Vac

* CLA : 12~24V (DC)

- 10 -

Only for training and service purposes

2.3 Radio Performance

1) Transmitter – GSM Mode

2. Performance

NO

1

ITEM

Conducted

Spurious

Emission

MS

allocated

Channel

Idle Mode

MS

allocated

Channel

GSM900 DCS1800 PCS1900

9k ~ 1GHz -36dBm

1G ~ 1710MHz -30dBm

1710M ~

1G ~ 12.75GHz -30dBm

9k ~ 880MHz -57dBm 9k ~ 880MHz -57dBm 9k ~ 880MHz -57dBm

880M ~ 915MHz -59dBm 880M ~ 915MHz -59dBm 880M ~ 915MHz -57dBm

915M ~ 1000Mz -57dBm 915M ~ 1000MHz -57dBm 915M ~ 1000MHz -57dBm

1G ~ 1.71GHz -47dBm 1G ~ 1.71GHz -47dBm 1G ~ 1.85GHz -47dBm

1.71G ~

1.785GHz

1.785G ~

12.75GHz

30M ~ 1GHz -36dBm

1G ~ 4GHz -30dBm

-53dBm

-47dBm

1785MHz

1785M ~

12.75GHz

1.71G ~

1.785GHz

1.785G ~

12.75GHz

30M ~ 1GHz -36dBm

1G ~ 1710MHz -30dBm

1710M ~

1785MHz

1785M ~ 4GHz -30dBm

-36dBm

-30dBm

-53dBm 1.85G ~ 1.91GHz -53dBm

-47dBm

-36dBm

9k ~ 1GHz -36dBm

1G ~ 12.75GHz -30dBm

1.91G ~

12.75GHz

30M ~ 1GHz -36dBm

1G ~ 4GHz -30dBm

-47dBm

Radiated

Spurious

Emission

Idle Mode

2 Frequency Error

3 Phase Error

30M ~ 880MHz -57dBm 30M ~ 880MHz -57dBm 30M ~ 880MHz -57dBm

880M ~ 915MHz -59dBm 880M ~ 915MHz -59dBm 880M ~ 915MHz -59dBm

915M ~

1000MHz

1G ~ 1.71GHz -47dBm 1G ~ 1.71GHz -47dBm 1G ~ 1.85GHz -47dBm

1.71G ~

1.785GHz

1.785G~ 4GHz -47dBm 1.785G~ 4GHz -47dBm 1.91G~ 4GHz -47dBm

0.1ppm



5(RMS)

20(PEAK)

-57dBm 915M ~ 1000MHz -57dBm 915M ~ 1000MHz -57dBm

-53dBm



- 11 -

1.71G ~

1.785GHz

0.1ppm



5(RMS)

20(PEAK)

-53dBm 1.85G ~ 1.91GHz -53dBm

0.1ppm





5(RMS)

20





(PEAK)



LGE Internal Use Only

2. Performance

NO ITEM GSM900 DCS1800 PCS1900

Frequency Error

Under

Multipath and RA250: 300Hz RA130: 400Hz RA130: 420Hz

4

5

7

8

9 Burst timing Mask IN Mask IN Mask IN

*. Output RF Spectrum (Modulation) Absolute Specification <3GPP TS 05.05, subclause 4.2.1>

interference HT100: 180Hz HT100: 350Hz HT100: 370Hz

Condition TU50: 160Hz TU50: 260Hz TU50: 280Hz

Due to

modulati

on

Output RF

Spectrum

Due to

Switchin

g

transient

Intermodulation

attenuation

Transmitter Output

Power

3dB below reference

sensitivity

TU3: 230Hz TU1.5: 320Hz TU1.5: 330Hz

0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB

200kHz -30dB 200kHz -30dB 200kHz -30dB 250kHz -33dB 250kHz -33dB 250kHz -33dB 400kHz -60dB 400kHz -60dB 400kHz -60dB

600 ~ 1800kHz -60dB 600 ~ 1800kHz -60dB 600 ~ 1200kHz -60dB 1800 ~ 3000kHz -63dB 1800 ~ 6000kHz -65dB 1200 ~ 1800kHz -60dB 3000 ~ 6000kHz -65dB >= 6000kHz -73dB 1800 ~ 6000kHz -65dB

>=6000kHz -71dB >= 6000kHz -73dB

400kHz -19dB 400kHz -22dB 400kHz -22dB 600kHz -21dB 600kHz -24dB 600kHz -24dB

1200kHz -21dB 1200kHz -24dB 1200kHz -24dB

1800kHz -24dB 1800kHz -27dB 1800kHz -27dB

-

Power

control

Level (dBm) Level (dBm) (dB) Level (dBm) (dB)

Power

53330 3030 303 63131 2831 28 72932 2632 263 82733 2433 243

92534 2234 223 10 23 11 21 12 19 13 17 14 15 15 13 16 11 17 9 18 7 19 5

         

3dB below reference

sensitivity

Frequency offset 800kHz

Intermodulation product

should be Less than 50dB

below the level of Wanted

signal

Power

control

35 2035 203 36 1836 183 37 1637 163 38 1438 143 39 1249 124 310 10410 104 511 8411 84 512 6412 64 513 4413 44 514 2514 25

Power

15 0

TolerancePower



3dB below reference

sensitivity

control

515 05

-

Power

Toleran

ce

3



Frequency offset from the carrier

< 600 kHz 36 dBm 36 dBm

³ 600 kHz, < 1 800 kHz 51 dBm 56 dBm

³1800kHz 46 dBm 51 dBm

GSM 400 & GSM 900

& GSM 850

- 12 -

DCS 1 800 &PCS 1 900

Only for training and service purposes

2) Transmitter – WCDMA Mode

2. Performance

No

Maximum Output Power Class3: +24dBm(+1/-3dB)

1

2

Open Loop Power control

3

Item Specification

Frequency Error ±0.1ppm

in uplink

±9dB@normal, ±12dB@extreme

Adjust output (TPC command)

cmd 1dB 2dB 3dB

Inner Loop Power control

4

in uplink

+1 +0.5/1.5 +1/3 +1.5/4.5

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4.5 group(10equal command group)

+1 +8/+12 +16/+24

Minimum Output Power < -50dBm(3.84MHz)

5

Out-of-synchronization

6

handling of output power

Qin/Qout:DPCCH quality levels

Toff@DPCCH/lor:-22->-28dB Ton@DPCCH/lor:-24->-18dB

7

8

9

10

11

Transmit OFF Power -56dBm(3.84M)

Transmit ON/OFF Time

Mask

Change of TFC

Power setting in uplink

compressed

Occupied

Bandwidth(OBW)

1213 Spectrum emission Mask

Adjacent Channel

Leakage Ratio(ACLR)

±25us

PRACH, CPCH, uplink compres sed mode

±25us

power varies according to the data rate

DTX: DPCH off

(minimize interference between UE)

±3dB(after 14slots transmission gap)

< 5MHz(99%)

-35-15*(f-2.5)dBc @f=2.5~3.5MHz, 30k

-35-1*(f-3. 5)dBc@f=3.5~7.5MHz, 1M

-39-10*(f-7.5)dBc @f=7.5~8.5MHz, 1M

-49 dBc@f=8. 5~12. 5MHz, 1M

-33dBc@5MHz, ACP>-50dBm

-43dBc@10MHz, ACP>-50dBm

- 13 -

LGE Internal Use Only

2. Performance

14

Spurious Emissions

*: additional requirement

-36dBm@f=9~150KHz, 1k BW

-36dBm@f=150KHz~30MHz, 10k

-36dBm@f=30~1000MHz, 100k

-30dBm@f=1~12.75GHz, 1M

-41dBm*@1893.5~1919.6MHz, 300k

-67dBm*@925~935MHz, 100k

-79dBm*@935~960MHz, 100k

-71dBm*@1805~1880MHz, 100k

Trans mit Intermodulation

15

16

17

Error Vector

Magnitude(EVM)

Transmit OFF Power

-31dBc@5MHz, Interferer -40dBc

-41dBc@10MHz, Interferer -40dBc

17.5% (>-20dBm)

(@12.2k, 1DPDCH+1DPCCH)

-15dB@SF=4, 768kbps,

multi-code transmission

- 14 -

Only for training and service purposes

3) Receiver - GSM Mode

2. Performance

NO

Sensitivity (TCH/FS Class

1

Co-Channel Rejection

2

(TCH/FS Class II,RBER,

Adjacent

Channel

3

Rejection

(Speech Channel)

4 Intermodulation Rejection

5

Bloc king Response

(TCH/FS Clas s II, RBER)

Item GSM850/GSM900 DCS1800/PCS1900

II)

TUhigh/ F H)

200kHz C/Ia1= -12dB C/Ia1= -12dB

400kHz

-105dBm -105dBm

C/Ic= 7dB C/Ic= 7dB

C/Ia2= -44dB C/Ia2= -44dB

Wanted Signal: -98dBm Wanted Signal: -96dBm

1’st interferer: -44dBm 1’st interferer: -44dBm

2’nd interferer: -45dBm

Wanted Signal: -101dBm

Unwanted Signal: Depend on freq.

2’nd interferer: -44dBm

Wanted Signal: -101dBm

Unwanted Signal: Depend

on freq.

- 15 -

LGE Internal Use Only

2. Performance

4) Receiver – WCDMA Mode

No

Reference Sensivitivity

1

2

Maximum Input Level

3

4 In-band Blocking

5 Out -band Blocking

Item Specification

Level

Adjacent Channel

Selectivity(ACS)

-106.7dBm(3.84M)

-25dBm(3.84MHz)

-44dBm/3.84MHz(DPCH_Ec)

UE@+20dBm output power(class3)

33dB

UE@+20dBm output power(class3)

-56dBm/3.84MHz@10MHz

UE@+20dBm output power(class3)

-44dBm/3.84MHz@15MHz

UE@+20dBm output power(class3)

-44dBm/3.84MHz@f=2050~ 2095 & 2185~2230MHz, band a)

UE@+20dBm output power(clas s3)

-30dBm/3.84MHz@f=2025~ 2050 & 2230~2255MHz, band a)

UE@+20dBm output power(clas s3)

-15dBm/3.84MHz@f=1~2025 & 2255~12500MHz, band a)

UE@+20dBm output power(clas s3)

6

Spurious Response

7

8 Spurious Emissions

Intermodulation

Charac terist ic

UE@+20dBm output power(class3)

-46dBm/3.84MHz@20MHz

UE@+20dBm output power(class3)

-57dBm@f=9KHz~ 1GHz, 100k BW

-47dBm@f=1~12.75GHz, 1M

-60dBm@f=1920~1980MHz, 3.84MHz

-60dBm@f=2110~2170MHz, 3.84MHz

- 16 -

-44dBm CW

-46dBm CW@10MHz &

Only for training and service purposes

5) Bluetooth Mode

5.1) Transmitter

2. Performance

No Item

1Out Power

2Power Density

3

4

5

6

7

Power Control

TX Output Spectrum

-Frequency range

TX Output Spectrum

-20dB Bandwidth

Tx Output Spectrum

-Adjacent channel Po

Modulation Characteristics

Specification

Class 2 : -6~4dBm

Power density < 20dBm per 100kHz EIRP

Option

2dBstep size8dB

fmax & fmin @ below the level of -30dBm(100khz BW )

within 2.4GHz~2.4835GHz

≤

1MHz



≤

-40dBm @ C/I  3MHz

140kHz  delta f1 avg 175kHz

delta f2max 115kHz at least 99.9% of all deltaf2max

delta f2avg/deata f1avg0.8

8 Init. Carrier Freq. Tolerance

9

10

Carrier Frequency Drift

Out of Band Spurious Emissions

Freq.Range Operating standby

30MHz~1GHz -36dBm -57dBm

Above 1GHz~12.75GHz -30dBm -47dBm

1.8~1.9GHz -47dBm -47dBm

5.15~5.3GHz -47dBm -47dBm

≤

±75KHz

1 slot :  ± 25kHz

3 slot :  ± 40kHz

5 slot :  ± 40kHz

Maximum drift r ate  20KHz/50usec

- 17 -

LGE Internal Use Only

2. Performance

5.2) Receiver

11 Sensitivity single slot packets

12 Sensitivity multi slot packets

13

14

C/I performance

Blocking Charac teristic

BER'0.1%@-70dBm

BER  0.1%@ (Low,Mid,High Frequency)

2405MHz,2441MHz,2477MHz

Interference

Co-Channel interference, C/I co-c hannel

Adjacent(1MHz)interference, C/I 1MHz

Adjacent(2MHz)interference, C/I 2MHz

Adjacent(3MHz)interference, C/I 3MHz

Adjacent(3MHz)interference to in band

mirror frequency, C/I image ±1MHz

BER  0.1%@wanted signal -67dBm

interfering Signal Frequency

30MHz~2000MHz

2000MHz~2400MHz

Ratio

11dB

0dB

-30dB

-40dB

-9dB

-20dB

Power Level

-10dBm

-27dBm

15

Intermodluation Performance

16 Maximum I nput Level

2500MHz~3000MHz

3000MHz~12.75GHz

BER  0.1%@wanted signal -64dBm

static sinwave signal at f1=-39dBm

a BT modulated signal f2=-39dBm(payload PRBS15)

BER  0.1%@-20dBm

-27dBm

-10dBm

- 18 -

Only for training and service purposes

2.4 Current Consumption

Stand by Voice Call VT

2. Performance

WCDMA 250 Hours = 3.2 mA

(DRX=7)

GSM 250 Hours = 3.2 mA

(Paging period=5)

(VT test : Speaker off, LCD backlight On)

170 Min = 270 mA (Tx=12dBm)

180 Min = 260 mA (Tx=Max)

100 Min = 450mA (Tx=12dBm)

2.5 RSSI

GSM WCDMA

BAR 7 -> 5 -93 󰆚 2dBm -90 󰆚 2dBm

BAR 5 -> 4 -98 󰆚 2dBm -103 󰆚 2dBm

BAR 4 -> 2 -101 󰆚 2dBm -107 󰆚 2dBm

BAR 2 -> 1 -104 󰆚 2dBm -109 󰆚 2dBm

BAR 1 -> 0 -106 󰆚 2dBm -111 󰆚 2dBm

(WCDMA Up Link Max Power : 24dBm)

(VT test WCDMA Up Link Max Power : 21dBm)

2.6 Battery Bar

Indication Voltage

BAR 3 (100%) : Level Full 4.17V  0.05V

BAR 3 (41%) -> 2 󰳱(13%) 3.73  0.05V

BAR 2 (13%) -> 1 󰳱(4%) 3.54  0.05V

BAR 1 (4%) -> Icon Blinking& Alerting Sound

POWER OFF 3.20  0.05V

3.43  0.05V

- 19 -

LGE Internal Use Only

2. Performance

g

)

g

)

g

)

(

g)

MS

2.7 Sound Pressure Level

NO ITEM Specification

1 Sending Loudness Rating (SLR)

2 Receiving Loudness Rating (RLR)

4 Echo Loss (EL)

5 6

7

Sendin

Distortion (SD

Receiving Distortion (RD

I d le Nois e -Se n d in g ( I NS)

MS

8 Idle N o is e -Rec e iv ing ( I N R )

9

10

11

12 Echo Loss (EL)

13 14

Sending Loudness Rating (SLR)

Receiving Loudness Rating (RLR)

Side Tone Masking Rating (STMR)

Sendin

Receivin

Distortion (SD

Distortion (RD

HEAD

SET

15 I dle N ois e -Sending ( I N S) -55dB m 0p be lo w

16 Idle N o is e - R e ce iv in g ( I NR)

TDMA NOISE

-.GSM:Power Lev el:5 DCS:Power Level:0

17

(Cell Power:90~105dBm)

-.Acoustic(Max Vol.)

MS/HEADSET SLR:8±3dB

MS/HEADSET RLR:-18±3dB / -15dB

SLR/RLR : Mid-Value Settin

GSM

DCS

GSM

Headset

DCS

SEND

REV.

SEND

REV.

SEND

REV.

SEND

REV.

NOM

MAX

NOM

MAX

NOM

MAX

NOM

MAX

8±3dB

-4±3dB

-8dB ~ -5dB

17dB over3 Side Tone Masking Rating (STMR)

58dB over

Refer to T ABLE 30.3 Refer to T ABLE 30.4

NOM

MAX

NOM

MAX

NOM

MAX

NOM

MAX

NOM

MAX

NOM

MAX

-64dBm0p below

-57dBm0p below

-54dBm0p below

8±3dB

-1±3dB

-12±3dB

25dB over

40dB over

Refer to T ABLE 30.3 Refer to T ABLE 30.4

NOM

MAX

NOM

MAX

-45dBm0p below

-40dBm0p below

-70dBm below

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Only for training and service purposes

2.8 Charging

· Normal mode: Complete Voltage: 4.2V

Charging Current: 500mA below

·Await mode: In case of During a Call, should be kept 3.9V (GSM: It should be kept 3.9V in all power level

WCDMA: It will not be kept 3.9V in some power level)

· Extend await mode: At Charging prohibited temperature(0C under or 45C over)

(GSM: It should be kept 3.7V in all power level

WCDMA: It will not be kept 3.7V in some power level

)

2. Performance

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LGE Internal Use Only

3. Technical brief

3.1 Digital Baseband(DBB) & Multimedia Processor

3.1.1 General Description

• Access subsystem

- Access Central Processing Unit (CPU) subsystem – ARM926, Joint Test Action Group (JTAG), Embedded Trace Module (ETM), Instruction and Data (I&D)-cache, and I&D-TCM

- Access peripheral subsystems – Subscriber Identity Module (SIM) interface, IrDA®, Universal Serial Bus (USB), Universal Asynchronous Receiver/Transmitter (UART), and so on

- Digital Signal Processor (DSP) subsystem – CEVA-X1620, JTAG, Static Random Access Memory (SRAM), and Program Data Read Only Memory (PDROM)

- EDGE/GSM/GPRS (EGG) subsystem – EGG hardware accelerators

- WCDMA subsystem – WCDMA hardware accelerators

• Application subsystem

- Application CPU subsystem – containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM

- Application peripheral subsystems – I2C™, keypad, UART, and so on

- Graphics subsystem – XGAM subsystem

- Audio Processing Execution (APEX) and video encoder subsystems

In addition to the two subsystems above, there is also a test block, chip control block, and

a pad multiplexing block residing at the top level

y DSP

- The Digital Signal Processor Subsystem (DSPSUB) includes a DSP mega cell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to the mega cell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP mega cell is clocked at 208 MHz.

- The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB.

y WCDMA subsystem

- The digital baseband controller WCDMA subsystem incorporate a WCDMA modem

- An interface to the WCMDA together with memory control and an internal single port RAM. The WCDMA subsystem has three AHB slave interfaces.

- The Ericsson DB 3150 also includes HSDPA class 6 functionality.

- The WCDMA subsystem is handled and provided by Ericsson.

y XGAM subsystem

- The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video.

- The XGAM subsystem is handled and provided by Ericsson.

y Operation and Services

- I²C™ Interface

- SIM Interfaces

- General Purpose I/O (GPIO) Interface

- External Memory Interface that supports NAND, NOR, PSRAM, SDRAM,

-JTAG

-RTC

- ETM (in Prototype Package)

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Only for training and service purposes

3. Technical brief



Figure 3-1-1 GD580 Block Diagram

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LGE Internal Use Only

3. Technical brief

3.1.2 External memory interface

RF calibration data, Audio parameters and battery calibration data etc are stored in flash memory area.

A. GD580

y 2Gb NAND flash memory + 1Gb SDRAM

Device Part Name Maker Item Time Size Speed

Program speed 220μs 1 page = (2K+64)Byte 2.64MByte/s

NAND flash KA100J00BA-AJYY Samsung

Erase speed 1.5ms 1 Block = (128K+4K)Byte 8MByte/s

Table 3-1-1. External Memory Interface Spec. of GD580

Figure 3-1-2. External Memory Configuration of GD580

y Package

- 107-ball FBGA Type – 10.5X13X1.2mmt, 0.8mm pitch

- 24 -

Only for training and service purposes

3.1.3 Hardware Architecture

A. Block Diagram

3. Technical brief

Figure 3-1-3. Access system of Ericsson DB3150

- 25 -

LGE Internal Use Only

3. Technical brief

Figure 3-1-4. Application system of Ericsson DB3150

- 26 -

Only for training and service purposes

3. Technical brief

B. CPU Subsystem

- Access CPU subsystem

The digital baseband controller includes an access CPU subsystem, which includes the sub modules described below.

• 32 KiB I-cache

• 16 KiB D-cache

• Page table

• Memory Management Unit (MMU)

•JTAG

•ETM9

• 26 KiB I-TCM

•8 KiBD-TCM

- Application CPU subsystem

The digital baseband controller includes an Application CPU subsystem, which includes the sub modules described below.

• 32 KiB I-cache

• 16 KiB D-cache

• Page table

• MMU

•JTAG

•ETM9

•8 KiBI-TCM

•8 KiBD-TCM

C. Peripheral Hardware Subsystem

The digital baseband controller includes hardware that supports mobile terminal peripherals such as a MMC, SD, UART, I2C, USB, keypad, and infrared. Collectively, this hardware comprises the Peripheral subsystem. The functional blocks of the Peripheral subsystem connect to the peripheral bus through four separate bridges, which provide a simple interface to support different timing and memory access arrangements.

D. DSP Hardware Subsystem

The Digital Signal Processor Subsystem (DSPSUB) includes a DSP mega cell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to the mega cell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP mega cell is clocked at 208 MHz.

The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB.

E. XGAM Subsystem

The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video.

The XGAM subsystem is handled and provided by Ericsson.

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LGE Internal Use Only

3. Technical brief

F. System Control Subsystem

The SYSCON resides at the top level of the circuit architecture and is responsible for clock generation and clock and reset distribution within the digital baseband controller, as well as to external devices.

The block is a slave peripheral under control of the ARM processor. The programming of the SYSCON controls the fundamental modes of operation within the digital baseband controller. Individual blocks can also be reset and their clocks held inactive by accessing the appropriate control registers.

3.1.4 RF Interface

A. GSM Radio Link Interface

DB3150 controls GSM RF part using these signals through GSM RF chip-RF3000.

y RF_DATA_A y RF_DATA_B

y RF_DATA_C

y RF_DATA_STRB

RF_DATA_A

RF_DATA_B

RF_DATA_C

RF_DATA_STRB

Y4 AA2 Y3 Y2

Figure 3-1-5. Schematic of GSM RF Interface

B. WCDMA Radio Link Interface

y RF_WCDMA_PA_0_EN

y RF_WCDMA_PA_1_EN y RF_WCDMA_DCDC_EN y RF_WCDMA_PWRDET_EN

RF_DATA_A

RF_DATA_B

RF_DATA_C

RF_DATA_STRB

RF_WCDMA_PA_0_EN

RF_WCDMA_PA_1_EN

RF_WCDMA_DCDC_EN

RF_WCDMA_PWRDET_EN

ADC_I_NEG

ADC_I_POS

ADC_Q_NEG

ADC_Q_POS

DAC_I_NEG

DAC_I_POS

DAC_Q_NEG

DAC_Q_POS

TX_POW

Y4 AA2 Y3 Y2

AB8 V7 AB5 AB6

Y10 W10 W9 Y9

Y8 W8 W7 Y7

AB7

QDATA_AMP_MSB IDATA_FREQ_MSB AMP_LSB_FREQ_LSB DCLK_DATSTR

WTX_BAND_1_EN

WDCDC_EN WPOW_DET_EN

WRX_I_N WRX_I_P WRX_Q_N WRX_Q_P

WTX_I_ N WTX_I_ P WTX_Q_N WTX_Q_P

WPOW_DET

Figure 3-1-6. Schematic of WCDMA RF Interface

- 28 -

Only for training and service purposes

3.1.5 SIM Interface

SIM interface scheme is shown in Figure3-1-7.

SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DBB(DB3150) with ABB(AB3000) and filter.

SIM (Interface between DBB and ABB)

SIMDAT0 SIM card bidirectional data line

SIMC

LK0 SIM card reference clock

SIMRST0 SIM card async/sync reset

Table 3-1-2. SIM Interface

3. Technical brief

DB3150

SIMDAT0

SIMCLK0

SIMRST0

VDD

E

10K

SDAT SIMDAT

SCLK SIMCLK

SRST SIMRST

Figure 3-1-7. SIM Interface

SIMVCC

AB3000

3.1.6 UART Interface

UART signals are connected to DB3150 GPIO through IO connector

UART0

Resource Name Note

ACC_GPIO_2 ACC_GP02_UART0_RX ACC Receive Data

10K

VDD

DAT

CLK CARD

RST

ACC_GPIO_3 ACC_GP03_UART0_TX ACC Transmit Data

APP_GPIO_0 APP_GP00_UART_RX APP Receive Data

APP_GPIO_1 APP_GP01_UART_TX APP Transmit Data

Table 3-1-3. UART Interface

UART1

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LGE Internal Use Only

3. Technical brief

3.1.7 GPIO (General Purpose Input/Output) map

In total 39 allowable resources. This model is using 39 resources. GPIO Map, describing application, I/O state, and enable level are shown in below table.

Access GPIO

GPIO Assigned Name Init Status

ACC_GPIO_0 ACC_USB_SUSPND Output low

ACC_GPIO_1 ACC_USB_PUEN output low

ACC_GPIO_2 ACC_UART0_RX Input

ACC_GPIO_3 ACC_UART0_TX output low

ACC_GPIO_4 ACC_USB_RCV Input

ACC_GPIO_5 ACC_USB_VBDET Input

ACC_GPIO_6 ACC_GP_LED_M_RES_M Output low

ACC_GPIO_7 ACC_GP_LED_M_LDO_EN Output low

ACC_GPIO_8 NA Output low

ACC_GPIO_9 ACC_GP_HF_MIC_BIAS_EN Output low

ACC_GPIO_10 NA Output Low

ACC_GPIO_11 NA Output Low

ACC_GPIO_12 ACC_GP_BT_SPI_INT Input

ACC_GPIO_13 ACC_GP_FLIPSENSE Input

ACC_GPIO_14 ACC_GP_FM_RDY Output low

ACC_GPIO_15 ACC_GP_PHFSENSE Input

ACC_GPIO_16 DCON Output low

ACC_GPIO_17 ACC_GP_VGA_SDN Output low

ACC_GPIO_18 NA Output low

ACC_GPIO_19 ACC_GP_BT_SPI_CS0N Output low

ACC_GPIO_20 ACC_GP_BT_SPI_DAT0 Input

ACC_GPIO_21 ACC_GP_BT_SPI_DAT1 Input

ACC_GPIO_22 ACC_GP_BT_SPI_CLK Output Low

ACC_GPIO_23 ACC_GP_LED_M_CTRL Output Low

Table 3-1-4. DB3150 ACC GPIO Map Table

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Only for training and service purposes

3.1.8 GPIO (General Purpose Input/Output) map

Application GPIO

GPIO Assigned Name Init Status

APP_GPIO_0 APP_UART_RX Input

APP_GPIO_1 APP_UART_TX Output low

APP_GPIO_2 APP_GP_3MCAM_SDN Output high

APP_GPIO_3 APP_GP_CAM_LDO_EN Output low

APP_GPIO_4 APP_GP_FM_SDA Output low

APP_GPIO_5 APP_GP_LED_M_BOOST_EN Output low

APP_GPIO_6 APP_GP_MMC_DET Input

3. Technical brief

APP_GPIO_7 APP_GP_3AXIS_INT Input

APP_GPIO_8 APP_GP_3AXIS_SDA Input

APP_GPIO_9 APP_GP_3AXIS_SCL Output high

APP_GPIO_10 APP_GP_LCD_BL_CTRL Output high

APP_GPIO_11 APP_GP_MMC_CLKRET Output low

APP_GPIO_12 APP_GP_FM_SCL Output Low

APP_GPIO_13 ACC_GP_LED_M_SDA Input

APP_GPIO_14 ACC_GP_LED_M_SCL Output Low

Table 3-1-5. DB3150 APP GPIO Map Table

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LGE Internal Use Only