LG 55EA9800-CA Schematic

Internal Use Only

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North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

OLED TV

SERVICE MANUAL

CHASSIS : EC34D

MODEL : 55EA9800 55EA9800-CA

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL67798301 (1309-REV00)

CONTENTS

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CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS

SERVICING PRECAUTIONS

SPECIFICATION

ADJUSTMENT INSTRUCTION

EXPLODED VIEW

SCHEMATIC CIRCUIT DIAGRAM

....................................................................................... 6

.................................................................................. 20

........................................................................ 3

.................................................................... 4

.............................................................. 13

..............................................................

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

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IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this service manual. CAUTION: Do not connect the test xture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some eld-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

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Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

- 5 -

Only for training and service purposes

SPECIFICATION

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NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This specification is applied to the OLED TV with EC34D chassis.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : UL, CSA, CE, IEC specification

2. Requirement for Test

Each part is tested as below without special appointment.

- EMC : FCC, ICES, CE, IEC specificat ion

- Wireless : Wireless HD Specification (Option)

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

4. Model General Specification

No. Item Specication Remarks

1 Market China/HONGKONG

[HONGKONG] PAL D/K : VHF/UHF 1 to 69, Cable 1 to 47 PAL I : VHF/UHF 1 to 69, Cable 1 to 47 NTSC M : VHF/UHF 2 to 78, Cable 1 to 71

1) PAL-I

2 Broadcasting system

3 Receiving system

4 Video Input (1EA) PAL, NTSC AV gender jack 1EA

5 Component Input (1EA)

6 RGB Input RGB-PC → Spec out Analog ( D-SUB 15PIN )

7 HDMI Input (4EA)

8 Audio Input (2EA)

9 SDPIF out (1EA) SPDIF out

10 USB (3EA) EMF, DivX HD, For SVC (download) JPEG, MP3, DivX HD (USB 2.0 : 2EA, USB 3.0 : 1EA)

11 Ethernet Lan Jack

2) PAL-DK

3) NTSC-M

4) DTMB

5) DVB-C(CHINA Only)

Analog : Upper Heterodyne Digital : COFDM, QAM

Y/Cb/Cr Y/Pb/Pr

HDMI1-DTV/ARC HDMI2-DTV HDMI3-DTV HDMI4-DTV/MHL

DVI Audio Component/AV common

DTMB : 21 to 69

[CHINA] PAL D/K : VHF/UHF 1~62, CATV 1~41 PAL I : VHF/UHF 1~69, CATV 1~47 NTSC M : VHF/UHF 2~78, CATV 1~71 DTMB: 1 to 62 DVBC: 52.5Mhz ~ 866Mhz

DTMB : DMB-T (Multi Carrier) + ADTB-T (Single Carrier)

► DTMB (Carrier, Code Rate, Constellation, Frame Header, Interleaving) * China

- MODE1 : 3780, 0.4, 16QAM, PN945, 720, 9.626Mbps

- MODE2 : 1, 0.8, 4QAM, PN595, 720, 10.396Mbps

- MODE3 : 3780, 0.6, 16QAM, PN945, 720, 14.438Mbps

- MODE4 : 1, 0.8, 16QAM, PN595, 720, 20.791Mbps

- MODE5 : 3780, 0.8, 16QAM, PN420, 720, 21.658Mbps

- MODE6 : 3780, 0.6, 64QAM, PN420, 720, 24.365Mbps

- MODE7 : 1, 0.8, 32QAM, PN595, 720, 25.989Mbps * Hong Kong

- 3780, 0.4/0.6, 4/16/64QAM, PN945, 720 ► DVB-C

- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s

- Modulation : 16QAM, 32-QAM, 64-QAM, 128-QAM and 256-QAM

Component Gender 1EA

PC(HDMI version 1.3) Support HDCP

L/R Input

Only for training and service purposes

- 6 -

5. External Input Format

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5.1. 2D Mode

(1) Component input(Y, CB/PB, CR/PR)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock Proposed

1. 720*480i 15.63 59.94 13.500 SDTV, DVD 480I(525I)

2 720*480i 15.73 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576i 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4 720*480p 31.47 59.94 27.000 SDTV 480P

5 720*480p 31.50 60.00 27.027 SDTV 480P

6 720*576p 31.25 50.00 27.000 SDTV 576P 50Hz

7 1280*720 44.96 59.94 74.176 HDTV 720P

8 1280*720 45.00 50.00 74.250 HDTV 720P

9 1280*720 45.00 60.00 74.25 HDTV 720P 50Hz

10 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

11 1920*1080 33.72 59.94 74.176 HDTV 1080I

12 1920*1080 33.75 60.00 74.25 HDTV 1080I

13 1920*1080 26.97 23.976 63.296 HDTV 1080P

14 1920*1080 27.00 24.000 63.36 HDTV 1080P

15 1920*1080 33.71 29.97 79.120 HDTV 1080P

16 1920*1080 33.75 30.00 79.20 HDTV 1080P

17 1920*1080 56.25 50 148.5 HDTV 1080P

18 1920*1080 67.432 59.94 148.350 HDTV 1080P

19 1920*1080 67.5 60.00 148.5 HDTV 1080P

Only for training and service purposes

- 7 -

(2) HDMI Input(PC/DTV)

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No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

HDMI-PC DDC

1 720*400 31.469 70.08 28.32 DOS Х

2 640*480 31.469 59.94 25.17 VESA(VGA) O

3 800*600 37.879 60.317 40 VESA(SVGA) O

4 1024*768 48.363 60.004 65 VESA(XGA) O

5 1360*768 47.712 60.015 84.75 VESA(WXGA) O

6 1152*864 54.348 60.053 80 VESA O

7 1280*1024 63.981 60.02 109.00 SXGA O

8 1920*1080 67.5 60 158.40 WUXGA(Reduced Blanking) O

HDMI-DTV

1 720*480 15.73 59.94 13.500

Spec. out but display.2 720*480 15.75 60.00 13.514

3 720*576 15.625 50.00 13.500

4 640*480 31.47 59.94 24.175

5 640*480 31.5 60.00 25.2

6 720*480 31.47 59.94 27 SDTV 480P

7 720*480 31.5 60.00 27.027 SDTV 480P

8 720*576 31.25 50.00 27 SDTV 576P

9 1280*720 44.96 59.94 74.176 HDTV 720P

10 1280*720 45 60.00 74.25 HDTV 720P

11 1280*720 37.5 50.00 74.25 HDTV 720P

12 1920*1080 28.125 50.00 74.25 HDTV 1080I

1920*1080 33.72 59.94 74.176 HDTV 1080I

14 1920*1080 33.75 60.00 74.25 HDTV 1080I

15 1920*1080 26.97 23.976 63.296 HDTV 1080P

16 1920*1080 27.00 24.000 63.36 HDTV 1080P

17 1920*1080 33.71 29.97 79.120 HDTV 1080P

18 1920*1080 33.75 30.00 79.20 HDTV 1080P

19 1920*1080 56.25 50.00 148.5 HDTV 1080P

20 1920*1080 67.432 59.94 148.350 HDTV 1080P

21 1920*1080 67.5 60 158.40 HDTV 1080P

Only for training and service purposes

- 8 -

5.2. 3D Mode

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(1) RF Input

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks

1 1920*1080 45.00 60 74.25 HDTV 1080I Side by Side, Top & Bottom

2 1280*720 45.00 60 74.25 HDTV 720P Side by Side, Top & Bottom

(2) HDMI Input

1) HDMI 1.3 - DTV (3D Supported mode manually)

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed 3D input proposed mode

2D to 3D

1 1280*720 45.00 60.00 74.25 HDTV 720P

2 1280*720 37.500 50 74.25 HDTV 720P

3 1920*1080 33.75 60.00 74.25 HDTV 1080I

4 1920*1080 28.125 50.00 74.25 HDTV 1080I

5 1920*1080 27.00 24.00 74.25 HDTV 1080P

6 1920*1080 28.12 25.00 74.25 HDTV 1080P

7 1920*1080 33.75 30.00 74.25 HDTV 1080P

8 1920*1080 67.50 60.00 148.5 HDTV 1080P

9 1920*1080 56.250 50.00 148.5 HDTV 1080P

Side by Side(half),Top & Bottom, Single Frame Sequential

2D to 3D Side by Side(half),Top & Bottom, Single Frame Sequential

2D to 3D Side by Side(half),Top & Bottom,

2D to 3D, Side by Side(half), Top & Bottom, Checkerboard

2D to 3D, Side by Side(half), Top & Bottom, Checkerboard, Single Frame Sequential, Row Interleaving, Column Interleaving

2D to 3D Side by Side(half), Top & Bottom, Checkerboard, Single Frame Sequential, Row Interleaving, Column Interleaving

Only for training and service purposes

- 9 -

2) HDMI 1.4b (3D Supported mode automatically)

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No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) VIC 3D input proposed mode Proposed

1 640*480 31.469 / 31.5 59.94/ 60 25.125 1

2 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 2,3

3 720*576 31.25 50 27 17,18

4 720*576 15.625 50 27 21

5 1280*720 37.500 50 74.25 19

6 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 4

7 1280*720 75 50 148.5 19

8 1280*720 90 59.94 / 60 148.5 4

9 1920*1080 28.125 50.00 74.25 20

10 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 5

11 1920*1080 56.25 50.00 148.5 20

12 1920*1080 67.437/67.50 59.94 / 60 148.5 5

13 1920*1080 26.97 / 27 23.97 / 24 74.17/74.25 32

14 1920*1080 28.125 25 74.17/74.25 33

15 1920*1080 33.716 / 33.75 29.976 / 30.00 74.25 34

16 1920*1080 43.94/54 23.97 / 24 148.5 32

17 1920*1080 56.25 25 148.5 33

18 1920*1080 67.432/67.5 29.976 / 30.00 148.5 34

19 1920*1080 56.250 50 148.5 31

20 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 16

Frame packing Line alternative Side-by-side(Full) Top-and-Bottom Side-by-side(half)

Top-and-Bottom Side-by-side(half) Side-by-side(Full)

Frame packing Line alternative

Top-and-Bottom Side-by-side(half) Side-by-side(Full)

Frame packing Line alternative

Frame packing Field alternative

Top-and-Bottom Side-by-side(half) Side-by-side(Full)

Frame packing Field alternative

Top-and-Bottom Side-by-side(half)

Secondary(SDTV 480P) (SDTV 480P) (SDTV 480P) Secondary(SDTV 480P) Secondary(SDTV 480P)

Secondary(SDTV 576P) (SDTV 576P) (SDTV 576P) Secondary(SDTV 576P) Secondary(SDTV 576P)

Secondary(SDTV 576I) (SDTV 576I (SDTV 576I Secondary(SDTV 576I) Secondary(SDTV 576I)

Primary(HDTV 720P) Primary(HDTV 720P)

Primary(HDTV 720P) (HDTV 720P) (HDTV 720P)

Secondary(HDTV 1080I) Primary(HDTV 1080I)

Primary(HDTV 1080I) (HDTV 1080I) (HDTV 1080I)

Primary(HDTV 1080P) Primary(HDTV 1080P)

Secondary(HDTV 1080P) Secondary(HDTV 1080P)

(HDTV 1080P) Secondary(HDTV 1080P)

Primary(HDTV 1080P) (HDTV 1080P) (HDTV 1080P)

Secondary(HDTV 1080P) (HDTV 1080P) (HDTV 1080P)

(HDTV 1080P) (HDTV 1080P) (HDTV 1080P)

Primary(HDTV 1080P) Secondary(HDTV 1080P)

Only for training and service purposes

- 10 -

(3) HDMI-PC Input (3D Supported mode manually)

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No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1024*768 48.363 60.004 65.000 HDTV 768P Side by Side, Top & Bottom

2 1360*768 47.712 60.015 85.500 HDTV 768P Side by Side, Top & Bottom

Side by Side , Top & Bottom

3 1920*1080 67.50 60.00 148.50 HDTV 1080P

Checkerboard, Single Frame Sequential Row Interleaving, Column Interleaving

(4) USB Input

1) USB Input (3D Supported mode automatically)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920*1080 33.75 30.000 74.25 HDTV 1080P

(2) USB Input (3D Supported mode manually)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920*1080 33.75 30.000 74.25 HDTV 1080P

Side by Side, Top & Bottom, Checkerboard, MPO (Photo)

Side by Side, Top & Bottom Checkerboard, Single Frame Sequential, Row Interleaving, Column Interleaving (Photo : Side by Side, Top & Bottom)

(5) DLNA Input

1) DLNA Input (3D Supported mode automatically)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920*1080 33.75 30.000 74.25 HDTV 1080P

2) DLNA Input (3D Supported mode manually)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920*1080 33.75 30.000 74.25 HDTV 1080P

Side by Side, Top & Bottom, Checkerboard, MPO (Photo)

Side by Side, Top & Bottom Checkerboard, Single Frame Sequential, Row Interleaving, Column Interleaving (Photo : Side by Side, Top & Bottom)

Only for training and service purposes

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(6) Component Input

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No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1280*720 37.5 50 74.25 HDTV 720P

2 1280*720 45.00 60.00 74.25 HDTV 720P

3 1280*720 44.96 59.94 74.176 HDTV 720P

4 1920*1080 33.75 60.00 74.25 HDTV 1080I

5 1920*1080 33.72 59.94 74.176 HDTV 1080I

6 1920*1080 28.12 50 74.25 HDTV 1080I

7 1920*1080 67.500 60 148.50 HDTV 1080P

8 1920*1080 67.432 59.94 148.352 HDTV 1080P

9 1920*1080 27.000 24.000 74.25 HDTV 1080P

10 1920*1080 28.12 25 74.25 HDTV 1080P

11 1920*1080 56.25 50 74.25 HDTV 1080P

12 1920*1080 26.97 23.976 74.176 HDTV 1080P

13 1920*1080 33.75 30.000 74.25 HDTV 1080P

14 1920*1080 33.71 29.97 74.176 HDTV 1080P

2D to 3D, Side by Side(half), Top & Bottom

■ Remark: 3D Input mode

No. Side by Side Top & Bottom Checker board

Single Frame

Sequential

Frame Packing

- 12 -

Only for training and service purposes

Line

Interleaving

Column

Interleaving

ADJUSTMENT INSTRUCTION

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1. Application Range

This specification sheet is applied to EC34D Chassis applied OLED TV all models manufactured in TV factory.

2. Designation

(1) Because this is not a hot chassis, it is not necessary to

use an isolation transformer. However, the use of isolation

transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of

25 °C ± 5 °C of temperature and 65 % ± 10 % of relative

humidity if there is no specific designation. (4) The input voltage of the receiver must keep AC 100-240

V~, 50/60 Hz. (5) The receiver must be operated for about 5 minutes prior to

the adjustment when module is in the circumstance of over

15 °C.

In case of keeping module is in the circumstance of 0 °C, it should be placed in the circumstance of above 15 °C for 2 hours. In case of keeping module is in the circumstance of below

-20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.

[Caution] When still image is displayed for a period of 20 minutes or longer (Especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area.

(4) Communication Port connection

1) Connect : PCBA Jig → RS-232C Port == PC → RS-232C Port

(5) Download

1) CN/HK models (13Y_H13)

- MAC+ Widevine + ESN + HDCP 2.0

(6) Inspection

- In INSTART menu, check these keys.

3. MAIN PCBA Adjustments

3.1. ADC Calibration

- An ADC calibration is not necessary because MAIN SoC (LGExxxx) is already calibrated from IC Maker

- If it needs to adjust manually, refer to appendix

3.2. MAC Address, ESN, Widevine, HDCP2.0 key download

(1) Equipment & Condition

1) Play file: keydownload.exe

(2) Communication Port connection

1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)

2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)

(3) Download process

1) Select the download items.

2) Mode check: Online Only

3) Check the test process : DETECT → MAC_WRITE →

WIDEVINE_WRITE

4) Play: START

5) Check of result: Ready, Test, OK or NG

3.3. LAN Inspection(Ping Test)

3.3.1. Equipment setting

(1) Play the LAN Port Test PROGRAM. (2) Input IP set up for an inspection to Test Program.

*IP Number : 12.12.2.2 Connect SET → LAN Port == PC → LAN Port

SET PC

3.3.2. LAN PORT inspection(PING TEST)

(1) Play the LAN Port Test Program. (2) Connect each other LAN Port Jack. (3) Play Test (F9) button and confirm OK Message. (4) Remove LAN cable.

Only for training and service purposes

- 13 -

3.4. EDID download

www.eletronicageral.com.br

3.4.1. Overview

It is a VESA regulation. A PC or a MNT will display an optimal resolution through information sharing without any necessity of user input. It is a realization of "Plug and Play".

3.4.2. Equipment

(1) Since embedded EDID data is used, EDID download JIG,

HDMI cable are not need.

(2) Adjustment remote control

3.4.3. Download method

(1) Press Adj. key on the Adjustment remote control (2) Select EDID D/L menu. (3) By pressing Enter key, EDID download will begin (4) If Download is successful, OK is display, but If Download is

failure, NG is displayed.

(5) If Download is failure, Re-try downloads.

Caution) When EDID Download, must remove HDMI Cable.

3.4.4. EDID DATA

# HDMI1 (C/S: E8 71) EDID Block 0, Bytes 0-127 [00H-7FH]

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01

10 01 17 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26

20 0F 50 54 A1 8 00 31 40 45 40 61 40 71 40 81 80

30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C

40 45 00 40 84 63 00 00 1E 66 21 50 B0 51 00 1B 30

50 40 70 36 00 40 84 63 00 00 1E 00 00 00 FD 00 3A

60 3E 1E 53 10 00 0A 20 20 20 20 20 20 00 00 00

70 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 XX

EDID Block 1, Bytes 128-255 [80H-FFH]

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 02 03 3A F1 4E 10 9F 04 13 05 14 03 02 12 20 21

10 22 15 01 29 3D 06 C0 15 07 50 09 57 07 78 03 0C

20 00 10 00 B8 2D 20 C0 0E 01 4F 3F FC 08 10 18 10

30 06 10 16 10 28 10 E3 05 03 01 02 3A 80 18 71 38

40 2D 40 58 2C 45 00 40 84 63 00 00 1E 01 1D 80 18

50 71 1C 16 20 58 2C 25 00 40 84 63 00 00 9E 01 1D

60 00 72 51 D0 1E 20 6E 28 55 00 40 84 63 00 00

70 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 XX

* Checksum (HDMI 1/2/3/4)

Input FFh (Checksum)

HDMI1 E8 81

HDMI2 E8 71

HDMI3 E8 61

HDMI4 E8 51

4. Final Assembly Adjustment

4.1. White Balance Adjustment

4.1.1. Overview

(1) W/B adj. Objective & How-it-works

1) Objective: To reduce each Panel's W/B deviation

2) How-it-works : When R/G/B gain in the OSD is at 192, it means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.

3) Adjustment condition : normal temperature

① Surrounding Temperature : 25 °C ± 5 °C ② Warm-up time: About 5 Min ③ Surrounding Humidity : 20 % ~ 80 %

Before White balance adjustment, Keep power on

④

status, don’t power off

(2) Adj. condition and cautionary items

1) Li ghting condition in surrounding area surrounding lighting should be lower 10 lux. Try to isolate adj. area into dark surrounding.

2) Probe location: Color Analyzer(CA-210) probe should be within 10 cm and perpendicular of the module surface (80°~ 100°)

3) Aging time

After Aging Start, Keep the Power ON status during 5

①

Minutes.

In case of LCD, Back-light on should be checked

②

using no signal or Full-white pattern.

4.1.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH 12 / LED:

CH 14 / OLED: CH 17)

(2) Adjustment Computer(During auto adj., RS-232C protocol

is needed) (3) Adjustment Remote control (4) Video Signal Generator MSPG-925F 720p/204-Gray

(Model: 217, Pattern: 49)

* Color Analyzer Matrix should be calibrated using CS-1000.

4.1.3. Equipment connection

Pro be

RS -232 C

Sig nal Sou rce

* If TV internal pattern is used, not needed

Co lor Anal yze r

RS- 232 C

Co mp ute r

RS- 232 C

Pattern Gen era to r

Only for training and service purposes

- 14 -

4.1.4. Adj. Command (Protocol)

www.eletronicageral.com.br

▪ RS-232C Command used during auto-adjustment.

RS-232C COMMAND

CMD DATA ID

Wb 00 00 Begin White Balance adj.

Wb 00 ff

End White Balance adj.(internal pattern disappears)

▪ Adj. Map

Command

(lower case ASCII)

CMD1 CMD2 MIN MAX

Cool

Medium

Warm

Adj. item

R Gain j g 00 C0

G Gain j h 00 C0

B Gain j i 00 C0

R Cut

G Cut

B Cut

R Gain j a 00 C0

G Gain j b 00 C0

B Gain j c 00 C0

R Cut

G Cut

B Cut

R Gain j d 00 C0

G Gain j e 00 C0

B Gain j f 00 C0

R Cut

G Cut

Explanation

Data Range

(Hex.)

Default

(Decimal)

4.1.6. Reference(White balance Adj. coordinate and color temperature)

▪ Luminance : 204 Gray, 80IRE ▪ Standard color coordinate and temperature using CS-1000 (over 26 inch)

Mode

Coordinate

x y

Temp ∆uv

Cool 0.276 0.283 11,000 K 0.0000

Medium 0.285 0.293 9,300 K 0.0000

Warm 0.313 0.329 6,500 K +0.0030

Standard color coordinate and temperature using CA-210(CH-14)

▪

Mode

Coordinate

x y

Temp ∆uv

Cool 0.276 ± 0.002 0.283 ± 0.002 11,000 K 0.0000

Medium 0.285 ± 0.002 0.293 ± 0.002 9,300 K 0.0000

Warm 0.313 ± 0.002 0.329 ± 0.002 6,500 K +0.0030

4.2. Tool Option setting & Inspection per

countries

4.2.1. Overview

(1) Tool option selection is only done for models in Non-USA

North America due to rating

(2) Applied model: LA02D and LA02E Chassis applied to

CANADA and MEXICO

4.1.5. Adjustment method

(1) Auto WB calibration

1) Set TV in ADJ mode using P-ONLY key(or POWER ONLY key).

2) Place optical probe on the center of the display

- It need to check probe condition of zero calibration before adjustment

3) Connect RS-232C Cable

4) Select mode in ADJ Program and begin a adjustment.

5) When WB adjustment is completed with OK message, check adjustment status of pre-set mode(Cool, Medium, Warm)

6) Remove probe and RS-232C cable.

▪ W/B Adj. must begin as start command “wb 00 00” , and

finish as end command “wb 00 ff”, and Adj. offset if need

(2) LED White balance table

1) Cool Mode

- Purpose : Especially G-gain fix adjust leads to the

luminance enhancement. Adjust the color temperature to reduce the deviation of the module color temperature.

- Principle : To adjust the white balance without the

saturation, Adjust the G gain more than 172 (If R gain or G gain is more than 255, G gain can adjust less than

172) and change the others (R/B Gain).

- Adjustment mode : mode - Cool

2) Medium / Warm Mode

- Purpose : Adjust the color temperature to reduce the

deviation of the module color temperature.

- Principle : To adjust the white balance without the

saturation, Fix the one of R/G/B gain to 192 (default data) and decrease the others.

- Adjustment mode : Two modes - Medium / Warm

4.2.2. Country Group selection

(1) Press ADJ key on the Adj. R/C, and then select Country

Group Menu

(2) Depending on destination, select KR or US, then on the

lower Country option, select US, CA, MX. Selection is done using +, - KEY

4.2.3. Tool Option Inspection

(1) Press Adj. key on the Adj. R/C, and then check Tool option.

4.3. Magic Motion remote control Check

4.3.1. Required Instruments

(1) RF-remote contr ol fo r che ck, IR-KEY-C ODE remote

control.

(2) Check AA battery before test. A recommendation is that a

tester change battery every lots.

4.3.2. Test procedures

(1) Make pairing with TV set by pressing “Start key(Wheel

key)” on RCU. (2) Check a cursor on screen by pressing "Wheel key" of RCU. (3) Stop paring with TV set by pressing “Back+ Home” key of

RCU.

Only for training and service purposes

- 15 -

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