LG 32SL80YR-MA Schematic

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP91T

MODEL : 32SL80YR 32SL80YR-MA

North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com

Internal Use Only

Printed in KoreaP/NO : MFL60021574 (0909-REV00)

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 2 -

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 9

BLOCK DIAGRAM ................................................................................. 14

EXPLODED VIEW .................................................................................. 15

SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 3 -

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.

It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument’s
exposed
METALLIC PARTS

Good Earth Ground
such as WATER PIPE,
CONDUIT etc.

AC Volt-meter

When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

IMPORTANT SAFETY NOTICE

0.15uF

Ω

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 4 -

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.

2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its
assemblies.

4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.

7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.

4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).

7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500

°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.

(500

°F to 600°F)

b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature

(500

°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 5 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.

2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and
solder it.

3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as
possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit
board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as
possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit
board.

3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.

2. Securely crimp the leads of replacement component around
notch at stake top.

3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 6 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

4. Electrical specification

- General Specification

1. Application range

This spec sheet is applied to LCD TV used LP91T chassis.

2. Specification

Each part is tested as below without special appointment.

1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC

2) Relative Humidity : 65±10%

3)

Power Voltage : Standard input voltage(100~240V@50/60Hz)

* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to
the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety: CE, IEC specification

- EMC : CE, IEC

No Item Specification Measurement Remark

1 Screen Size 32” wide Color Display Module Resolution : 1920*1080
2 Aspect Ratio 16:9
3 LCD Module 32” TFT WUXGA LCD
4 Operating Environment Temp.: 0 ~ 40 deg

Humidity : 0 ~ 85 %

5 Storage Environment Temp.: -20 ~ 60 deg

Humidity : 0~ 85 %

6 Input Voltage AC100-240V~, 50/60Hz

≤116.7W FHD, 200/240Hz(SBL)

7 LDC Module FHD 731.8(H) x 426.4(V) x 39.0(D) [with inverter]

(Maker : LGD) 0.36375 x 0.36375 Unit : mm

Coating 3H, Anti-Glare

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Only for training and service purposes

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LGE Internal Use Only

No. Item Min. Typ. Max. Unit Maker Remark

1. Luminance 480 540 cd/m

2

(W/O PC mode)

2. VIew angle (R/L, U/D) 178 / 178 degree LGD

3. Color Coordinates White X Typ 0.279 Typ LGD 32”(FHD)
Y -0.03 0.292 +0.03

RED X 0.638

Y 0.334

Green X 0.288

Y 0.607

Blue X 0.145

0.062

4. Contrast ratio 8000:1 1200:1

5. Luminance Variation 1.3

5. Chroma& Brightness (Optical)

(1) LCD Module

The Color Coordinates check condition

- 50cm from the surface, Full White Pattern

- Picture mode Vivid

6. Component Video Input (Y, PB, PR)

No

Specification

Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz

10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 8 -

LGE Internal Use Only

No

Specification Proposed

Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model

7. RGB

- Analog PC, RGB- DTV –NOT SUPPORT

8. HDMI Input

(1) PC - Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA

(2) DTV Mode

No

Specification

Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P

10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 9 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LCD TV, LP91T
chassis.

2. Specification

(1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolation

transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of

25 ±5ºC of temperature and 65±10% of relative humidity if

there is no specific designation.
(4) The input voltage of the receiver must keep 100-220V,

50/60Hz.
(5) Before adjustment, execute Heat-Run for 5 minutes at RF

no signal.

3. Adjustment items

3.1. PCB assembly adjustment items

(1) Download the MSTAR main software (IC800, Mstar ISP

Utility)

1) Using D/L Jig

2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID

- EDID datas are automatically download when adjusting

the Tool Option2
(4) ADC Calibration – RGB / Component
(4) Check SW Version.

3.2. SET assembly adjustment items

(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input

4. PCB assembly adjustment method

4.1. Mstar Main S/W program download

4.1.1. Using D/L Jig
(1) Preliminary steps

1) Connect the download jig to D-sub(RGB) jack

(2) Download steps

1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened

2) Click the “Connect” button and confirm “Dialog Box”

3) Click the “Config.” button and Change speed I2C Speed
setting : 350Khz~400Khz

4) Read and write bin file.

Click “(1)Read” tab, and then load download
file(XXXX.bin) by clicking “Read”.

1

Filexxx.bin

5) Click “(2)Auto” tab and set as below

6) Click “(3)Run”.

7) After downloading, you can see the “(4)Pass” message.

4.1.2. Using the Memory Stick
* USB download : Service Mode

1) Insert the USB memory stick to the ISB port.

2) Automatically detect the SW Version.

-> S/W download process is executed automatically.

3) Show the message “Copy the file from the Memory”

4) After Finished the Download, Automatically DC Off -> On

5) Check The update SW Version.

4.2. Input tool option.

Adjust tool option refer to the BOM.

- Tool Option Input : PCBA Check Process

- Area Option Input : Set Assembly Process
After Input Tool Option and AC off

Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)

(1) Profile : Must be changed the option value because being

different with some setting value depend on
module maker, inch and market

(2) Equipment : adjustment remote control.

(3) Adjustment method

- The input methods are same as other chassis.(Use IN­START Key on the Adjust Remocon.)
(If not changed the option, the input menu can differ the
model spec.)

Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value
Caution : Don’t Press “IN-STOP” key after completing the
function inspection.

4.3. EDID D/L method

Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data

4.3.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2seconds.

4.3.2. 2nd Method
* Caution : Must be checked that the tool option is right or not.

If tool option is wrong, hdmi edid data could not be
downloaded well.

1) Press the ADJ key

2) Move to the EDID D/L and Press the right direction key(

G)

3) Press the right direction key(

G) at Start.

4) After about a few seconds, appear “OK”, then compele.

4.3.3. RS-232C command Method
(1) Command : AE 00 10

* Caution

Don’t connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of edid could be
failed.

- 10 -

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.

Only for training and service purposes

1

Filexxx.bin

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 11 -

LGE Internal Use Only

4.3.4. EDID data
(1) Analog(RGB): 128bytes>

(2) HDMI 1 : 256Bytes

(3) HDMI 2 : 256Bytes

(4) HDMI 3 : 256Bytes

4.4. ADC Calibration

4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments

- Remote controller for adjustment

- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process

1) Change the Input to Component1 or 2 mode.

2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.

(MSPG-925F Model: 209 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.

4) Enter Password number. Password is “0 0 0 0”.

5) Select “0. ADC calibration : Component” by using

D/E

(CH +/-) and press ENTER(A).

6) ADC adjustment is executed automatically .

7) When ADC adjustment is finished, this OSD appear

4.4.2. ADC Calibration - RGB (Using External pattern)
(1) Required Equipments

- Remote controller for adjustment

- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process

1) Change the Input to RGB mode..

2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.

(MSPG-925F Model: 60 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.

4) Enter Password number. Password is “0 0 0 0”.

5) Select “0. ADC calibration : RGB” by using

D/E(CH +/-)

and press ENTER(

A).

6) ADC adjustment is executed automatically .

7) When ADC adjustment is finished, this OSD appear

OK

OK

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Only for training and service purposes

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LGE Internal Use Only

4.5. Check SW Version

(1) Method

1) Push In-star key on Adjust remote-controller.

2) SW Version check
Check “SW VER : V3.xx”

5. PCB assembly adjustment method

5.1. Input Area-Option

(1) Profile : Must be changed the Area option value because

being different of each Country’s Language and

signal Condition.
(2) Equipment : adjustment remote control.
(3) Adjustment method

- The input methods are same as other chassis.(Use IN­START Key on the Adjust Remocon.)

Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value.

* White Balance Adjustment

- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.

- Principle : To adjust the white balance without the saturation,

Fix the one of R/G/B gain to 192 (default data)
and decrease the others.

- Adjustment mode : Three modes - Cool / Medium / Warm

- Required Equipment

1) Remote controller for adjustment

2) Color Analyzer : CA100+ or CA-210 or same product ­LCD TV( ch : 9 ),

(should be used in the calibrated ch by CS-1000)

3) Auto W/B adjustment instrument(only for auto adjustment)

5.2. Adjustment of White Balance

: (For automatic adjustment)

* LP91S/T Chassis Support Only I2C Interface.
(1) Enter the adjustment mode of DDC

- Set command delay time : 50ms

- Enter the DDC adjustment mode at the same time heat­run mode when pushing the power on by power only key

- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat­run pattern display)

(2) Release the DDC adjustment mode

- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode

- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.

- Need to transmit the aging off command to TV set after
finishing the adjustment.

- Check DDC adjust mode release by exit key and release
DDC adjust mode)

(3) Enter the adjust mode of white balance)

- Enter the white balance adjustment mode with aging
command (F3, 00, FF)

* Luminance min value is 150cd in the Cool/Medium/Warm

mode(For LCD)

5.3. Adjustment of White Balance

(for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the

calibrated ch by CS-1000

(2) Operate the zero-calibration of the CA100+ or CA-210,

then stick sensor to the module when adjusting.

(3) For manual adjustment, it is also possible by the following

sequence.

1) Select white pattern of heat-run by pressing “POWER

ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)

2) Push “Exit” key.

3) Change to the AV mode by remote control.

4) Input external pattern (85% white pattern)

5) Push the ADJ key -> Enter “0000” (Password)

6) Select “3. W/B ADJUST”

7) Enter the W/B ADJUST Mode

8) Stick the sensor to the center of the screen and select

each items (Red/Green/Blue Gain and Offset) using

D/E(CH +/-) key on R/C..

9) Adjust R/ G/ B Gain using

F/G(VOL +/-) key on R/C.

10) Adjust three modes all (Cool / Medium / Warm) : Fix

the one of R/G/B gain and change the others

11) When adjustment is completed, Enter “COPY ALL”.

12) Exit adjustment mode using EXIT key on R/C.

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 13 -

BLOCK DIAGRAM

RGB_PC

PC_Audio

TV

(RF)

COMP1

HDMI1

HDMI2

HDMI3

TX

PC_R/G/B/HS/VS

PC_A u di o _L / R :700mVrms

MNT_VOUT: 1Vpp

AV2_VIN :1Vpp

AV2_LIN/ RIN :500mVrms

L_SPK_OUT

R_SPK_OUT

EEPROM

24C02

Comp 1_L/R :500mVrms

TUNER

AV1_VIN: 1Vpp

AV1_LIN/ RIN :500mVrms

PWM

NTP3100L

MNT_OUT

MNT_LOUT/ ROUT:500mVrms

AV 2

MAIN SCALER

LGE376 xA

COMP1_Y/Pb/ Pr: 1/ 0.7Vpp

COMP2_Y/Pb/ Pr: 1/ 0.7Vpp

IR

HDMI_DATA_1

HDMI_DATA_2

DDC_SCL2/SDA2

TU_MAIN

S I F

COMP1_Y/Pb/ Pr: 1/ 0.7Vpp

AV1_VIN

PC_Audio_L/ R

COMP1_LIN/RIN

L_CH

R_CH

TU_MAIN

M_SCL/SDA

EEPROM

24C02

SIF

AV1_LIN/RIN

MNT_L/ R OUT

AV1

MNT _OUT

Comp 2_L/R :500mVrms

COMP2_Y/Pb/ Pr: 1/ 0.7Vpp

COMP2_LIN/RIN

COMP2

PC_R/G/B/HS/VS

DDC_SCL1/SDA1

DSUB_SCL/ SDA

MNT_VOUT

AV2_VIN

AV2_LIN/RIN

IIS_OUT

USB USB_DP/ DN

AUDIO

AMP

DDC_SCL3/SDA3

HDMI_DATA_3

TMDS

TMDS

TMDS

EEPROM

24C02

FRC IC

LGE7329 A

URSA_[ C~D]

URSA_[ A:B ]

OPC_EN

DDR2 SDRAM

(2*256MB)

Seri a l Fl a s h

PSU

RL_ON/I-DIMMING / DI SP_EN

PANEL_STATUS

E-DIM

Bluetooth

Circ uit

BLT_DP/ DN

DDR2 SDRAM

(512MB)

EEPROM

(256K)

Seri a l Fla s h

(8MByte)

EEPROM

fo r HDCP

(8K)

EEP_SCL/ SDA

EEP_SCL/ SDA

MEMC_RXE2–

MEMC_RXE4–

MEMC_RXC3–

MEMC_RXC–

MEMC_RXE1–

MEMC_RXE0–

MEMC_RXO2–

MEMC_RXO4–

MEMC_RXO3–

MEMC_RXOC–

MEMC_RXO1–

MEMC_RXO0–

EEPROM

24C02

M_SCL/ SDA

FULL HD LVDS connector

FRC LVDS connector

* OPC_OUT is directly connected

between T-con and Module Inverter

by using FFC.

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 14 -

LGE Internal Use Only

300

200

LV1

LV2

200T

200N

500

510

A2

A10

310

120

121

600

610

801

804

805

530

540

806

803

807

802

550

910

A7

400

521

810

520

580

900

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

COMPONENT1/2, AV1, MNT_OUT

JK101

PPJ231-01

MNT_VOUT

MNT_LOUT

MNT_OUT

MUTE_LINE

POP NOISE

MNT_ROUT

4

5

7

8

6

10uF

C105

RT1C3904-T112

10uF

C10000

READY

16V

10uF

C106

16V

Q201

16V

POP NOISE

C

B

E

B

E

100uF 16VC103

R134
1K

R135
1K

C

Q200

RT1C3904-T112

0

R142

C

B

Q100E

RT1C3904-T112

0

R143

C

B

Q101E

RT1C3904-T112

D203
30V

D204
30V

ZD200
SD05

ZD201
SD05

75R212

C104
6800pF

0R124

C10001

6800pF

R211
220K

R214
220K

D104
30V

D201
30V

10KR217

10KR215

R210
75

R219
12K

R218
12K

CVBS_RIN

CVBS_LIN

CVBS_VIN

AV1

[YL]E-LUG

[YL]O-SPRING

[YL]CONTACT

[WH]C-LUG

[RD]CONTACT

[RD]O-SPRING

[RD]E-LUG

5A

4A

3A

4B

3C

4C

5C

PPJ233-01

JK102

PC

JK105
SPG09-DB-010

6

1

11

7

2

12

8

3

13

9

4

14

10

16

15

SHILED

5

PC SOUND

RED_GND
GND_2
RED
GREEN_GND
DDC_DATA
GREEN
BLUE_GND
H_SYNC
BLUE
NC
V_SYNC
GND_1
SYNC_GND
DDC_CLOCK
DDC_GND

E_SPRING

3

T_TERMINAL1

6A

B_TERMINAL1

7A

+5V_MULTI

C117

0.1uF

C

A

AC

R101

75

JP104

D119

30V

CDS3C30GTH

C

A

D126

AC

ENKMC2837-T112

R102
75

R130

220K

C118

0.1uF

D127

ENKMC2837-T112

R138

10K

C119

0.1uF

C

A

AC

R103
75

R140
12K

**MULTI ITEM

1.24C02-SUB:0IMMRAL014D

2.ENKMC2837-SUB:0DS226009AA

D128

[KDS226]

ENKMC2837-T112

PC_R

JP105

R110
68

R116
68

DSUB_SDA

C100
68pF

C102
68pF

DSUB_SCL

PC_G

PC_B

JP106

CDS3C30GTH

ZD104
SD05

ZD105
SD05

CDS3C30GTH

D107

30V

R111

4.7K

R112

4.7K

D110

30V

PC_AUD_R

PC_HS

PC_VS

JK103

PPJ-230-01

11

FIX-TER

13

10

4

5

6

7

8

9

[RD]MONO

[RD]R_IN

[WH]L_IN

[RD]R

[BL]B

[GN]C_DET

[GN]G

[GN]GND

D100
30V

CDS3C30GTH

D101
30V

ZD100
SD05

ZD101
SD05

ZD102
SD05

ZD103
SD05

R100
220K

R104
220K

R107
75

R108
75

R109
75

10KR113

R117
12K

10KR114

R118
12K

COMP1_R

COMP1_L

COMP1_PR

COMP1_PB

COMP1_Y

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

JK104

PPJ-230-01

COMPONENT2

11

13

10

FIX-TER

4

5

6

7

8

9

[RD]MONO

[RD]R_IN

[WH]L_IN

[RD]R

[BL]B

[GN]C_DET

[GN]G

[GN]GND

D114
30V

D115
30V

ZD106
SD05

ZD107
SD05

ZD108
SD05

ZD109
SD05

R121
220K

R122
220K

10K R132

10K R133

R125
75

R126
75

R127
75

R136
12K

R137
12K

COMP2_R

COMP2_L

COMP2_PR

COMP2_PB

COMP2_Y

COMPONENT1

JK106

PEJ027-01

CATALYST

IC100

CAT24C02WI-GT3

A0

1

A1

2

A2

3

VSS

4

PC EDID

4

5

7B

6B

8

VCC

8

WP

7

SCL

6

SDA

5

R_SPRING

T_SPRING

B_TERMINAL2

T_TERMINAL2

SHIELD_PLATE

R154

4.7K

READY

R123
100

R119
100

R120
100

D120

R131

30V

220K

CDS3C30GTH

+5VST_MST

C113

R129

R128

4.7K

0.01uF

4.7K

H6 SL80
INPUT-ANALOG/PC

R139

10K

R141
12K

DDC_WP
DSUB_SCL
DSUB_SDA

PC_AUD_L

IC100-*1

M24C02-RMN6T

E0

E1

E2

VSS

STM_replace

1

2

3

4

VCC

8

WC

7

SCL

6

SDA

5

2009/04/02

9 12

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

P201

12507WS-08L

9

SIDE AV

1

JP201

2

3

5.6B

ZD202

ZD203

5.6B

R227
75

4

JP202

5

D206
30V

R223
220K

10KR224

6

JP203

7

D205
30V

R222
220K

10KR225

8

R226

12K

R228
12K

SIDE_V

SIDE_LIN

SIDE_RIN

USB

JK200
KJA-UB-4-0004

**1A Design

1234

USB DOWN STREAM

5

READY

D207

+5V_USB

0

R202

Non_OCP

Close to SIDE_USB

L200
500

100uF
16V

C202

220uF
16VC200

10uF 6.3VC201

0R200

0R201

30V

D208

30V

READY

USB_DN

USB_DP

R203
160 OCP

R204
1K OCP

OCP

C

AC

A

KDS226

D200

Pin to Pin with

EAN43439401

OCPIC201

MIC2009YM6-TR

5 ILIMIT

4 FAULT/

R208
510
OCP

C203

0.1uF
OCP

L202

C204
10uF
OCP

120OHM
OCP

1VIN6VOUT

2GND

3ENABLE

R205

4.7K
OCP

M1

MDS61887702

GASKET

6T_GASKET(32/42/55)

M1-*1

MDS61887703

GASKET

7T_GASKET(47)

M2

MDS61887702

GASKET

6T_GASKET(55)

M3

MDS61887702

GASKET

6T_GASKET(55)

M3-*1

MDS61887703

GASKET

7T_GASKET(47)

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

M4

MDS61887702

GASKET

6T_GASKET(55)

M4-*1

MDS61887703

GASKET

7T_GASKET(47)

M5

MDS61887702

GASKET

READY

M6

MDS61887702

GASKET

6T_GASKET(32/42/55)

M6-*1

MDS61887703

GASKET

7T_GASKET(47)

==6T==

32" : MDS61887702, M1, M6

42" : MDS61887702, M1, M6

55" : MDS61887702, M1, M2, M3 M3, M4, M6, M7, M8

==7T==

47" : MDS61887703, M1, M3, M4, M6

M7

MDS61887702

GASKET

6T_GASKET(55)

M8

MDS61887702

GASKET

6T_GASKET(55)

H6 SL80
SIDE AV/USB

2009/04/02

2 12

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

HPD_MST_2

20

R301
10K

20

2SC3875S

Q301

RT1C3904-T112

B

19

18

17

16

15

14

13

12

11

CLK+

10

DATA0-

9

DATA0_SHIELD

8

DATA0+

7

DATA1-

6

DATA1_SHIELD

5

DATA1+

4

3 DATA2-

DATA2_SHIELD

2

DATA2+

1

OPTION

SW_HPD : USE SW HPD (Default)

MST_HPD : USE MST HPD

+5V_MULTI

+5V_HDMI_2

R303

C

E

1K

JP301

JP300

IC301

CAT24C02WI-GT3

A0

1

A1

2

A2

3

VSS

4

VCC

8

7

6

5

JP307 JP308

WP

SCL

SDA

CEC
TMDS2_RXC-

TMDS2_RXC+
TMDS2_RX0-

TMDS2_RX0+
TMDS2_RX1-

TMDS2_RX1+
TMDS2_RX2-

TMDS2_RX2+

+5V_HDMI_2

A1

A2

D301
KDS184S

C

HPD_MST_3

R311

R309

C301

10K

10K

100R327

100R304

100R305

0.01uF

DDC_WP

DDC_SDA2

DDC_SCL2

SIDE_HDMI

R312
10K

JACK_GND

SIDE_HDMI

20

Q302

2SC3875S

B

19 HPD

18+5V_POWER

17DDC/CEC_GND

16 SDA

15 SCL

14 NC

13 CEC

12 CLK-

11 CLK_SHIELD

10 CLK+

9 DATA0-

8 DATA0_SHIELD

7 DATA0+

6 DATA1-

5 DATA1_SHIELD

4 DATA1+

3 DATA2-

2 DATA2_SHIELD

1 DATA2+

C

RT1C3904-T112

E

+5V_HDMI_3

SIDE_HDMI

R314
1K

JP304

JP305

CEC
TMDS3_RXC-

TMDS3_RXC+
TMDS3_RX0-

TMDS3_RX0+
TMDS3_RX1-

TMDS3_RX1+
TMDS3_RX2-

TMDS3_RX2+

IC302

CAT24C02WI-GT3

A0

1

A1

2

A2

3

VSS

4

VCC

8

WP

7

SCL

6

SDA

5

100R329

100R317

100R318

+5V_MULTI

+5V_HDMI_3

A1

A2

D302
KDS184S

C

C300

0.01uF

R320

R319

10K

10K

DDC_WP

DDC_SDA3
DDC_SCL3

HPD_MST_1

JK302

YKF45-7054V

R300
10K

20

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3 DATA2-

2

1

Q300

C

B

E

CLK+

DATA0-

DATA0_SHIELD

DATA0+

DATA1-

DATA1_SHIELD

DATA1+

DATA2_SHIELD

DATA2+

RT1C3904-T112

2SC3875S

+5V_HDMI_1

R302
1K

IC300

CAT24C02WI-GT3

A0

1

A1

2

A2

3

VSS

4

CEC
TMDS1_RXC-

TMDS1_RXC+
TMDS1_RX0-

TMDS1_RX0+
TMDS1_RX1-

TMDS1_RX1+
TMDS1_RX2-

TMDS1_RX2+

DC1R019NBH

JK303

SIDE_HDMI

+5V_MULTI

+5V_HDMI_1

A1

A2

D300
KDS184S

C

VCC

8

JP306

WP

7

SCL

6

SDA

5

100R331

100R306

100R307

JP302

JP303

R308
10K

R310
10K

C302

0.01uF

DDC_WP

DDC_SDA1
DDC_SCL1

Q303
BSS83
CEC_READY

D
B

G

S

+3.3V_MST

R315
68K
CEC_READY

D303
MMBD301LT1G
30V CEC_READY

D304
CDS3C30GTH
30V CEC_READY

R313
0

R332
56000

READY

CEC_C

CEC

JK301

YKF45-7058V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

H6 SL80
INPUT-HDMI

2009/04/02

3 12

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

P400

12507WS-12L

10

CONTROL KEY/IR

BLUETOOTH

1

2

ZD401

ZD402

3

4

5

6

C404
470pF

C412
470pF

C406
47uF

7

8

9

ZD400

500-ohmL411

500-ohmL410

+3.3V_MST

READY

R420

4.7K

120ohmL403

120ohmL406

+5VST_MST

L404

MLB-201209-0120P-N2

C403
47pF

+3.3V_MST

C408

0.1uF

120ohmL402

READY

SUB_SCL

SUB_SDA

+3.3V_MST

R421

4.7K

C411

0.1uF

R426
IR-OUT

C407

0.1uF
READY

+3.3V_MULTI_MST

47K

KEY1

KEY2

IR

+5VST_MST

R427
10K
IR-OUT

C

B

Q405

E

2SC3052
IR-OUT

R428
IR-OUT

10K

+5VST_MST

R429
10K
IR-OUT

C

B

E

Q404
2SC3052
IR-OUT

R430
IR-OUT

P401

12507WS-06L

+3.3V_MULTI_MST

22

R401

close to R401

0

C400

0.1uF

BLT_DP

BLT_DN

R402

R403

1

2

0

0

3

4

5

6

7

13

11

12

C414

0.1uF

L407

MLB-201209-0120P-N2

R400
0
READY

R417
0

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

H6 SL80
KEY/IR/BLUETOOTH

2009/04/02

4 12

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

+5V_TUNER

C541
22uF

C540

0.1uF

IC501

0R511

C538

0.1uF

AZ1117H-3.3
3INPUT 1 ADJ/GND

$0.051

2

OUTPUT

120-ohm

L508

AZ1117H-1.8TRE1(EH13A)

INPUT

C539

0.1uF

OUTPUT

3

$0.051

IC502

2

C546
22uF

C545
22uF

ADJ/GND

1

GND

C542

0.1uF

C543

0.1uF

C544

0.1uF

L507

C526

0.1uF

2.2uH

+3.3V_TUNER

+1.8V_TUNER_A

+1.8V_TUNER_D

JK501
NTSC

1

2

JK500
PAL

1

2

KCN-BT-2-0082

KCN-ET-0-0094

D500

$0.088

L500
1uH
OPT

+5V_TUNER

+3.3V_TUNER

1000pFC510

48VDDA_8

0.1uFC505

1000pFC503

56pFC500

L501
270nH

C501
120pF

6.8nHL502
L503

390nH

+3.3V_TUNER

0.1uFC504

820nHL504

1 VDDA_1
2 IN1
3 GND_1
4 IN2
5 GND_2
6 EXTCHOKE

0.1uFC512

46GND_9

47VDDC_9

0.1uFC513

4.99KR500

44REXT

45VDDA_7

IC500

XC5000

0.1uFC515

42VDDC_7

43VDDC_8

0.1uFC517

0.1uFC521

0.1uFC518

40VREF_N

41VREF_P

0.1uFC520

38VI2C

39VDDC_6

7 GND_3

0.1uFC506

0.1uFC507

8 VDDA_2
9 VDDA_3

10 VDDC_1

$2.25

11 GND_4

0.1uFC508

12 VDDC_2

C529

0.1uF

37RESET

+3.3V_TUNER

C530

0.1uF

10R504

36GND_8
35SDA
34SCL
33VDDD_2
32EXTREF
31X1
30GND_7
29X2
28ADDRSEL
27DDI2
26VDDC_5
25DDI1

TU_RESET

0.1uFC524

+1.8V_TUNER_A

0R502

100R50939pFC502

M_SDA

100R510

C536

C535

18pF

18pF

$0.085

4GND_2 1X-TAL_1

X501

C533
15pF

0.1uFC525

31.875MHz

M_SCL

2GND_13X-TAL_2

C532
15pF

+1.8V_TUNER_A

13 VDDC_3

14 VDDA_4

0.1uFC509

0.1uFC511

15 VAGC

16 VIF

17 VDDA_5

18 SIF

0.1uFC514

19 GND_5

20 VDDC_4

0.1uFC516

2.7uHL506

21 VDDA_6

22 GND_6

0.1uFC519

23 VDDD_1

24 TESTMODE

0.1uFC522

0.1uFC523

680R5012.7uHL505

680R503

C527
10pF

C528
10pF

B

B

+5V_TUNER

R507
390

E

Q501
ISA1530AC1

C

+5V_TUNER

R505
390

R506
0
E

Q500
ISA1530AC1

C

+1.8V_TUNER_D

C534

0.1uF
MAIN_SIF

C531

0.1uF

0R508

C537
270pF
READY

TV_MAIN

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

H6 SL80
TUNER

2009/04/02

5 12

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

+1.8V

SW_RESET

MULTI_PW_SW

MLB-201209-0120P-N2

MLB-201209-0120P-N2

+3.3V_MULTI_MST

L601

MLB-201209-0120P-N2

RT1C3904-T112

R612

READY

22K

I2S_MCLK

L606

L605

+3.3V_MST

L609

MLB-201209-0120P-N2

B

10KR607

Q601

0R609

READY

0R682

READY

+1.8V_AVDD

+1.8V_AVDD

+1.8V_DVDD

READY

+3.3V_MST

E

C601
100pF

R611
10K

C

+1.8V_AVDD

+1.8V_DVDD

+3.3V_MULTI_AUD

C603
1000pF

R600

3.3K

C600
10uF16V

C604
10uF16V

C608
1uF

100R601

C606
1000pF

+3.3V_MULTI_AUD

C605

0.1uF

C602

0.1uF

C607

0.1uF

22000pFC611

1 BST1A
2 VDR1A

RESET

3
4AD
5 DVSS_1
6 VSS_IO
7 CLK_I
8 VDD_IO

9 DGND_PLL
10 AGND_PLL
11 LFM
12 AVDD_PLL
13 DVDD_PLL
14 TEST0

55PGND1A_1

56PGND1A_2

53OUT1A_1

54OUT1A_2

READY

C620
10uF35V

51PVDD1A_1

52PVDD1A_2

49

50

PVDD1B_1

PVDD1B_2

C615

0.1uF

48

OUT1B_2

C617

0.1uF

46

47

OUT1B_1

R604

3.3
C613

0.01uF

C616

22000pF

45

PGND1B_1

PGND1B_2

R608
12

C619
390pF

C621
390pF

R610
12

44

BST1B

43

VDR1B

AUDIO MAIN AMP

IC600
NTP-3100L

15 DVSS_2

16 DVDD

17 SDATA

18 WCK

19 BCK

20 SDA

21 SCL

22 MONITOR_0

23 MONITOR_1

24 MONITOR_2

25 FAULT

26 VDR2B

27 BST2B

28 PGND2B_1

+16V_NTP

C674
68uF
35V

R605
12

R606
12

C618
1uF

NC

VDR2A

BST2A
PGND2A_2
PGND2A_1

OUT2A_2

OUT2A_1
PVDD2A_2
PVDD2A_1
PVDD2B_2

C675

68uF
35V

L603
AD-8770

2S

1S 1F

EAP60684501

42
41
40
39
38
37
36
35
34
33
32PVDD2B_1
31OUT2B_2
30OUT2B_1
29PGND2B_2

C676

C677

68uF

68uF

35V

35V

L600

MLB-201209-0120P-N2

C672

0.01uF

R663

C637

4.7K

C632

0.47uF

C625
22000pF

+16V_NTP

C626

0.1uF

0.1uF

C669

0.1uF

C629

0.1uF

R623

4.7K

R658
12

C630
390pF

C634
390pF

R621
12

R626

3.3
R625

3.3
C671

0.01uF

R622
12

R624
12

MLB-201209-0120P-N2

L607
AD-8770

2S

1S 1F

EAP60684501

L602

2F

C673

0.47uF

2F

C624
1uF

C644

0.1uF

C643

0.1uF

SPK_L+

SPK_L-

R628

4.7K

R667

4.7K

C648

0.01uF

R671

3.3

R635

3.3
C647

0.01uF

L604

MLB-201209-0120P-N2

L608

MLB-201209-0120P-N2

SPK_R+

SPK_R-

SPK_R-

SPK_R+

SPK_L-

SPK_L+

+1.8V_DVDD

P600
SMAW250-04Q

C609
10uF 16V

1

2

3

4

C610

0.1uF

0R677

0R676

I2S_SDO

5

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

0R678

I2S_WS

I2S_SCK

C638

33pF

50V

READY

100R603

100R602

M_SDA

0R656

READY

M_SCL

C639
33pF
50V

READY

1uFC614

1000pFC651

0R673

MULTI_PW_SW

22000pFC623

H6 SL80
AUDIO

2009/04/02

6 12

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

MNT_LOUT

MNT_ROUT

AMP :GAIN X 4

+12V_AUDIO

C707

0.1uF

C

B

E

Q700
RT1C3904-T112

R700

4.7K

MNT_L_AMP

MNT_R_AMP

+12V_AUDIO

C

B

E

Q701
RT1C3904-T112

R701

4.7K

C709

0.1uF

C700
6800pF

C701
6800pF

1KR702

10KR704

33pFC702

R708

6.8K

5.6KR705

+12V_AUDIO

C704

0.01uF

5.6KR706

33pFC703

10KR707

R709

6.8K

1KR703

IC701

1 OUT1

LM324D

2 INPUT1-

3 INPUT1+

4 VCC

5 INPUT2+

6 INPUT2-

7 OUT2 8OUT3

14OUT4

13INPUT4-

12INPUT4+

11GND

10INPUT3+

9INPUT3-

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

H6 SL80
AUDIO OUT

2009/04/02

7 12

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

SERIAL FLASH 8M

+3.3V_MULTI_MST

C807

0.01uF

+3.3V_MULTI_MST

R877

4.7K

SPI_CZ

SPI_DO

EEPROM

IC801
24LC256-I/SM

A0

24C64_Normal

1

A1

2

A2

3

VSS

4

8

7

6

5

HDCP EEPROM READY

HDCP_READY

R8004

4.7K

IC803
CAT24WC08W-T

A0

1

A1

2

A2

3

VSS

4

GAIN X 4

MNT_VOUT

RESET

P_12V

P_16V

R800

R8001

0

0
READY

D801
KDS181

1KR860

R8036

20K

R861
1K

VCC

WP

SCL

SDA

+12V_AUDIO

E

B

C

Q801
ISA1530AC1

READY

150R885

C870
47uF 25V

B

8

7

6

5

220R808

402R807

E
C

IC802

MX25L6405DMI-12G

1

HOLD

2 VCC

3 NC_1

4 NC_2

5 NC_3

6 NC_4

CS

7

8 SO/SIO1 9

IC802_MSTAR

+3.3V_MULTI_MST

C803

0.01uF
R8027

4.7K

0R812

0R813

+3.3V_MULTI_MST

VCC

WP

SCL

SDA

Q800
ISA1530AC1

HDCP_READY

R8005

HDCP_READY

R809
470

C

B

E

Q802
RT1C3904-T112

R810
68

R886

2K

WP/ACC

22

22R8006

R8000
10K

16SCLK

15SI.SIO0

14NC_8

13NC_7

12NC_6

11NC_5

10GND

R8028

4.7K

EEP_SCL
EEP_SDA

DDC_WP
EEP_SCL
EEP_SDA

47R8041

+5VST_MST

SW800
JTP-1127WEM

1
3

SPI_CLK
SPI_DI

+3.3V_MULTI_MST

R878

4.7K

R8031

C

B

E

10K
Q805
RT1C3904-T112

MNT_VOUT_T

D802
KDS181

R853

1K

24

C814

0.1uF

**H/W OPTION

Small HD(19/22)
Small FHD (27)
Non Small HD
Non Small FHD
Apollo

R8011

4.7K

R8010

4.7K
READY

DDC_WP

Close to IC Pin

+3.3V_MULTI_MST

+3.3V_MST

100R888

Q804
RT1C3904-T112

C

B

E

B

C8000

2.2uF
READY

R887
33K

C866

10uF16V

C878

1uF

C871

4.7uF
10V

+5VST_MST

R855
10K

C

Q803
RT1C3904-T112

E

C867

0.1uF

C877

0.1uF

33KR8007

READY

+5VST_MST

C812

4.7uF

D803
KDS181

R896

4.7K

4.7K

4.7K

MODEL_OPT1

L803

MLB-201209-0120P-N2

L8 01 READY

MLB-201209-0120P-N2

L802

MLB-201209-0120P-N2

L800

MLB-201209-0120P-N2

R8037

0

R898

X
X
X

X

4.7K

X

4.7K

X 4.7K

+3.3V_MULTI_MST+3.3V_MULTI_MST

R898

4.7K

R896

4.7K
READY

+3.3V_AVDD_33_DM

+3.3V_AVDD_AU

+3.3V_LPLL_VDDP

+3.3V_AVDD_AU

RL_ON

POWER_DET

MULTI_PW_SW

SYS_RESET

R8010

R8011

4.7K

4.7K
X

4.7K

4.7K
X

MODEL_OPT2

X

4.7K

4.7K
X

4.7K

4.7K100HZ

MNT_VOUT_T

MNT_L_AMP
MNT_R_AMP

PC_B

PC_G

PC_R

COMP1_PB

COMP1_Y

COMP1_PR

COMP2_PB

COMP2_Y

COMP2_PR

CVBS_VIN

SIDE_V

TV_MAIN

MAIN_SIF

SIDE_LIN
SIDE_RIN

+3.3V_MST

+3.3V_AVDD_33_DM

TMDS2_RXC-

TMDS2_RXC+

TMDS2_RX0-

TMDS2_RX0+

HPD_MST_2

TMDS2_RX1-

HDMI_2

HDMI_1

TMDS2_RX1+

0.1uFC833

TMDS2_RX2­TMDS2_RX2+
TMDS1_RXC-

TMDS1_RXC+

TMDS1_RX0­TMDS1_RX0+

0.1uFC815

TMDS1_RX1­TMDS1_RX1+

TMDS1_RX2­TMDS1_RX2+

HPD_MST_1

0.1uFC819

C804/C805/C806:Close to IC
as close as possible

0.1uFC838

1uFC810

22KR842

0.01uFC839
22KR845

0.01uFC841

+1.2V_VDDC_MST

47R814
470R803
47R816
47R818
47R838

C825
47R815
47R833
47R817
470R819
47R836
47R804

47R832
47R834
470R835
47R837
47R8042
47R8019
47R897
47R802

47R831
47R857
47R830

47R875
47R876

POWER_SW

10KR8020

RXBCKN

10R851

1

RXBCKP

2

10R854

RXB0N

3

10R856

RXB0P

4

10R858

HOTPLUGB

5

RXB1N

6

10R859

RXB1P

7

10R862

AVDD_33_1

8

RXB2N

9

10R869

RXB2P

10

10R871

RXACKN

11

10R872

RXACKP

12

10R873

RXA0N

13

10R874

RXA0P

14

10R879

AVDD_33_2

15

RXA1N

16

10R880

RXA1P

17

10R890

GND_1

18

RXA2N

19

10R891

RXA2P

20

10R892

HOTPLUGA

21

REXT

22

390R840

VCLAMP

23

0.1uFC804

REFP

24

0.1uFC805

REFM

25

0.1uFC806

BIN1P

26

0.047uFC843

SOGIN1

27

1000pFC846

GIN1P

28

0.047uFC845

RIN1P

29

0.047uFC847

BINM

0.047uF

30

BIN0P

31

0.047uFC851

GINM

32

0.047uFC827

GIN0P

33

0.047uFC852

SOGIN0

34

1000pFC854

RINM

35

0.047uFC829

RIN0P

36

0.047uFC855

AVDD_33_3

37

GND_2

38

BIN2P

39

0.047uFC826

GIN2P

40

0.047uFC828

SOGIN2

41

1000pFC835

RIN2P

42

0.047uFC830

CVBS6

43

0.047uFC8001

CVBS5

44

0.047uFC8002

CVBS4

45

0.047uFC831

CVBS3

46

0.047uFC832

CVBS2

47

CVBS1

48

VCOM1

49

0.047uFC834

CVBS0

50

0.047uFC836

VCOM0

51

0.047uFC837

AVDD_33_4

52

CVBSOUT

53

GND_3

54

SIF0P

55

0.1uFC868

SIF0M

56

0.1uFC869

VDDC_1

57

AUL5

58

2.2uFC856

AUR5

59

2.2uFC861

AUVRM

60

AUOUTL2

61

100R882

AUOUTR2

62

100R881

AUOUTL1

63

100R846

AUOUTR1

64

100R847

+3.3V_AVDD_33_DM

+3.3V_AVDD_AU

R893:AUDIO_SW

+3.3V_MST

SYS_RESET

CEC_C

PC_VS

0R8035

HSYNC1

VSYNC1

CEC

HWRESET

254

255

256

PC_HS

0R8034

VSYNC0

252

253

HSYNC0

251

DSUB_SDA

IR

100R895

GPIO140

IRIN

249

250

RXD

C811

0.1uF

100R849

GPIO138

GPIO139

248

247

TXD

100R850

GPIO134

GPIO135

246

100R893

245

KEY2

KEY1

MODEL_OPT2

MODEL_OPT1

SAR3

100R824

241

SAR2

100R825

240

SAR1

BLT_DP

USB0_DM

USB0_DP

SAR0

236

237

238

239

20pFC817

20pFC816

12MHz

X801

1M

R839

XOUT

XIN

AVDD_MPLL

244

242

243

BLT_DN

0R894

GND_17

GND_18

234

235

EEP_SCL

TXD

EEP_SDA

RXD

100R8022

100R8021

SPDIFO

UART2_RX/I2CM_SDA

UART2_TX/I2CM_SCK

UART1_RX/GPIO86

UART1_TX/GPIO87

230

231

232

233

229

LGE3767A

MST99A88ML

(MATRIX ONLY SD DIVX_ NON RM)

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

AUL0

AUL1

AUL2

AUL3

AUR2

2.2uFC873

2.2uFC802

2.2uFC874

COMP2_L

COMP2_R

AUL4

AUR3

AUR4

GND_4

AUCOM

2.2uFC822

2.2uFC821

2.2uFC875

0.1uFC808

PC_AUD_L

PC_AUD_R

10uF 16VC809

Close to IC

with width trace

AUVRP

0.1uFC813

AUVAG

1000pFC818

GND_5

AVDD_AU

0.01uFC840

4.7uFC820

VDDC_2

DDCA_CK

DSUB_SCL

DDCA_DA

DDCDA_CK

DDCDA_DA

100R8023

100R8024

DDC_SCL1

DDC_SDA1

DSUB_SDA

GPIO20

DDCDB_CK

DDCDB_DA

100R8026

100R8025

0R8033 READY

DDC_SCL2

POWER_DET

DDC_SDA2

VDDP_1

0.1uFC882

VDDC_3

UART2_TX

UART2_RX

0R870

0R806

M_SDA

AUR0

AUR1

2.2uFC823

2.2uFC801

2.2uFC824

COMP1_L

CVBS_LIN

CVBS_RIN

2.2uFC872

COMP1_R

I2S_OUT

+5VST_MST

I2S_SDO

I2S_SCK

RL_ON

10KR8003

100R826

100R827

0.1uFC883

VDDP_5

GND_16

VDDC_7

I2S_OUT_BCK

I2S_OUT_SD

224

225

226

227

228

IC800

93

94

95

96

97

RXC0N

RXCCKP

RXCCKN

DDCDC_CK

DDCDC_DA

10R801

10R820

10R805

100R8039

100R8040

DDC_SCL3

DDC_SDA3

TMDS3_RX0-

TMDS3_RXC-

TMDS3_RXC+

HDMI_3

4.7KR863

4.7KR864

M_SCL

DDR2_A[0-12]

TU_RESET

PANEL_STATUS

I2S_MCLK

I2S_WS

100R8016

100R8017

100R8012

100R828

100R829

VDDC_6

I2S_IN_WS/GPIO67

I2S_IN_BCK/GPIO68

I2S_IN_SD

I2S_OUT_MCK

I2S_OUT_WS

218

219

220

221

222

223

98

99

100

101

102

103

RXC0P

RXC1P

GND_6

RXC1N

RXC2N

AVDD_DM

10R823

10R841

10R822

0.01uFC876

10R821

TMDS3_RX1-

TMDS3_RX1+

TMDS3_RX0+

+3.3V_MULTI_MST

MEMC_RESET

DDR2_A[7]

DDR2_A[3]

DDR2_A[12]

DDR2_CKE

56

AR812

56R85210R848

A_MADR[12]

A_MADR[7]

A_MADR[3]

A_MCLKE

214

215

216

217

104

105

106

107

RXC2P

USB1_DP

USB1_DM

HOTPLUGC

USB_DP

USB_DN

HPD_MST_3

TMDS3_RX2-

TMDS3_RX2+

USB PART

DDR2_A[5]

DDR2_A[1]

DDR2_A[9]

AR813

AVDD_DDR_6

A_MADR[5]

A_MADR[9]

212

213

108

109

SDI

SCK

SDO

33

AR818

SPI_DI

SPI_CLK

DDR2_A[10]

56

211

110

SPI_DO

DDR2_BA0

A_BADR[0]

A_MADR[1]

A_MADR[10]

209

210

111

112

SCZ

PWM0

PWM1

SPI_CZ

DDR2_BA1

56

AR814

A_WEZ

A_BADR[1]

206

207

208

113

114

115

PWM2

PWM3

I-DIM

DDR2_A[11]

DDR2_WEZ

A_MADR[11]

205

116

LVA4P

E-DIM

MEMC_RXE0+

+3.3V_MULTI_MST

R811
1K
READY

0R8008

R889
1K

[MODE SELECTION]

DDR2_A[8]

DDR2_A[6]

DDR2_A[4]

56

AR815

A_MADR[4]

GND_15

A_MADR[6]

A_MADR[8]

201

202

203

204

117

118

119

120

LVA3P

LVA4M

LVA3M

LVACKP

MEMC_RXE1-

MEMC_RXE0-

MEMC_RXE2+

MEMC_RXE1+

DDR2_A[2]

DDR2_A[0]

DDR2_CASZ

DDR2_RASZ

56

AR800

A_RASZ

A_CASZ

A_MADR[0]

A_MADR[2]

197

198

199

200

121

122

123

124

LVA2P

LVA1P

LVA2M

LVACKM

MEMC_RXE2-

MEMC_RXEC-

MEMC_RXE3+

MEMC_RXEC+

R883
1K

R8002

0

R884
1K
READY

DDR2_ODT

0.1uFC844

GND_14

AVDD_MEMPLL

MVREF

A_ODT

193

194

195

196

192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129

125

126

127

128

LVA0P

LVA1M

LVA0M

VDDP_2

MEMC_RXE4-

MEMC_RXE3-

MEMC_RXE4+

+1.8V_DDR

1KR867

0.01uFC863

1KR868

B_MCLKZ
B_MCLK
B_MDATA[5]
B_MDATA[2]
B_MDATA[0]
B_MDATA[7]
AVDD_DDR_5
B_MDATA[13]
B_MDATA[10]
GND_13
B_MDATA[8]
B_MDATA[15]
AVDD_DDR_4
B_DDR2_DQSB[1]
B_DDR2_DQS[1]
GND_12
VDDP_4
AVDD_DDR_3
B_DDR2_DQSB[0]
B_DDR2_DQS[0]
GND_11
B_DDR2_DQM[0]
B_DDR2_DQM[1]
AVDD_DDR_2
B_MDATA[14]
B_MDATA[9]
GND_10
B_MDATA[12]
B_MDATA[11]
AVDD_DDR_1
B_MDATA[6]
B_MDATA[1]
GND_9
B_MDATA[3]
B_MDATA[4]
VDDC_5
VDDP_3
GPIO58
GPIO57
GPIO56
GPIO55
GPIO54
GPIO53
GPIO52
GPIO51
GND_8
GPIO152/I2C_OUT_SD3
GPIO151/I2C_OUT_SD2
GPIO150/I2C_OUT_MUTE
VDDC_4
GND_7
AVDD_LPLL
LVB0M
LVB0P
LVB1M
LVB1P
LVB2M
LVB2P
LVBCKM
LVBCKP
LVB3M
LVB3P
LVB4M
LVB4P

+3.3V_LPLL_VDDP

+1.8V

+1.2V_VDDC_MST

33R843
33R844

0.1uFC853

0.1uFC849

0.1uFC848

1KR8038

100R 80 1 4 READY

0.01uFC850

0.1uFC842

Close to IC as close as possible

+1.2V_VDDC_MST

C857

0.01uF

DDR2_MCLKZ
DDR2_MCLK

AR805
56

AR806
56

DDR2_DQS1M
DDR2_DQS1P

DDR2_DQS0M
DDR2_DQS0P

DDR2_DQM0
DDR2_DQM1

AR809
56

AR810
56

MUTE_LINE
SUB_SCL
SUB_SDA

PANEL_ON
DISP_EN/VAVS_ON
SW_RESET
DDC_WP

READY

100R8015

OPC_EN

MEMC_RXO4­MEMC_RXO4+
MEMC_RXO3­MEMC_RXO3+
MEMC_RXOC­MEMC_RXOC+
MEMC_RXO2­MEMC_RXO2+
MEMC_RXO1­MEMC_RXO1+
MEMC_RXO0­MEMC_RXO0+

C879

C859

0.01uF

0.01uF

DDR2_D[5]
DDR2_D[2]
DDR2_D[0]
DDR2_D[7]

DDR2_D[13]
DDR2_D[10]

DDR2_D[8]

DDR2_D[15]

DDR2_D[14]

DDR2_D[9]
DDR2_D[12]
DDR2_D[11]

DDR2_D[6]

DDR2_D[1]

DDR2_D[3]

DDR2_D[4]

READY

4.7K

R899

1KR8018

4.7KR865

4.7KR866

4.7KR8009

3.3KR8029

4.7KR8032

R8014:M_SCL_REAR
R8015:M_SDA_REAR

C880

0.01uF

DDR2_D[0-15]

+3.3V_MST
+3.3V_MULTI_MST

+1.8V

C864

0.01uF

C858

0.01uF

C860

0.01uF

C862

0.01uF

MEMC_RESET

C881

0.01uF

C865

0.01uF

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

H6 SL80

2009/04/02

MAIN Mstar 8 12

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

#9.DDR2

+1.8V_DDR

Close to DDR2 IC

1K

R907

C904

0.01uF

C905
1000pF

1K

R908

DDR2_A[0-12]

DDR2_BA0
DDR2_BA1

DDR2_MCLK

DDR2_MCLKZ

DDR2_CKE

DDR2_ODT

DDR2_RASZ
DDR2_CASZ

DDR2_WEZ

DDR2_DQS0P
DDR2_DQS1P

DDR2_DQM0
DDR2_DQM1

DDR2_DQS0M
DDR2_DQS1M

DDR2_400Mhz_QIMONDA

C918

0.1uF
50V

DDR2_A[0]
DDR2_A[1]
DDR2_A[2]
DDR2_A[3]
DDR2_A[4]
DDR2_A[5]
DDR2_A[6]
DDR2_A[7]
DDR2_A[8]
DDR2_A[9]
DDR2_A[10]
DDR2_A[11]
DDR2_A[12]

150R906

READY

56R900
56R901

56R902
56R903

56R904
56R905

+1.8V_DDR

C900

C919

0.01uF

10uF 10V

IC900
HYB18TC512160CF-2.5

J2 VREF

M8 A0
M3 A1
M7 A2

N2 A3
N8 A4
N3 A5
N7 A6

P2 A7
P8 A8
P3 A9

M2 A10/AP

P7 A11

R2 A12

L2 BA0
L3 BA1

J8 CK

CK

K8
K2 CKE

K9 ODT

CS

L8
K7

RAS
CAS

L7
K3

WE

F7 LDQS

B7 UDQS

F3 LDM

B3 UDM

LDQS

E8

UDQS

A8

L1 NC4
R3 NC5
R7 NC6

A2 NC1
E2 NC2
R8 NC3

J7 VSSDL

J1 VDDL

DDR2 MEMORY

IC900-*1

H5PS5162FFR-S6C

VREF

DDR2_D[0-15]

G8DQ0
G2DQ1
H7DQ2
H3DQ3
H1DQ4
H9DQ5
F1DQ6
F9DQ7
C8DQ8
C2DQ9
D7DQ10
D3DQ11
D1DQ12
D9DQ13
B1DQ14
B9DQ15

DDR2_D[0]
DDR2_D[1]
DDR2_D[2]
DDR2_D[3]
DDR2_D[4]
DDR2_D[5]
DDR2_D[6]
DDR2_D[7]
DDR2_D[8]

DDR2_D[9]
DDR2_D[10]
DDR2_D[11]
DDR2_D[12]
DDR2_D[13]
DDR2_D[14]
DDR2_D[15]

DDR2_HYNIX

+1.8V_DDR

0.01uFC901

A1VDD5
E1VDD4
J9VDD3
M9VDD2
R1VDD1

A9VDDQ10
C1VDDQ9
C3VDDQ8
C7VDDQ7
C9VDDQ6
E9VDDQ5
G1VDDQ4
G3VDDQ3
G7VDDQ2
G9VDDQ1

Close to DDR2 IC

0.01uFC902

0.01uFC903

0.01uFC906

0.01uFC907

0.01uFC908

0.01uFC909

0.01uFC910

0.01uFC911

0.01uFC912

0.01uFC913

0.01uFC914

0.01uFC915

0.01uFC916

0.01uFC917

DDR2_ELPIDA

A3VSS5
E3VSS4
J3VSS3
N1VSS2
P9VSS1

B2VSSQ10
B8VSSQ9
A7VSSQ8
D2VSSQ7
D8VSSQ6
E7VSSQ5
F2VSSQ4
F8VSSQ3
H2VSSQ2
H8VSSQ1

J2

A0

M8

A1

M3

A2

M7

A3

N2

A4

N8

A5

N3

A6

N7

A7

P2

A8

P8

A9

P3

A10/AP

M2

A11

P7

A12

R2

BA0

L2

BA1

L3

CK

J8

CK

K8

CKE

K2

ODT

K9

CS

L8

RAS

K7

CAS

L7

WE

K3

LDQS

F7

UDQS

B7

LDM

F3

UDM

B3

LDQS

E8

UDQS

A8

NC4

L1

NC5

R3

NC6

R7

NC1

A2

NC2

E2

NC3

R8

VSSDL

J7

VDDL

J1

EDE5116AJBG-8E-E

VREF

A0
A1
A2
A3
A4
A5
A6
A7
A8

A9
A10
A11
A12

BA0
BA1

CK

CK

CKE

ODT

CS

RAS
CAS

WE

LDQS
UDQS

LDM
UDM

LDQS
UDQS

NC_4
NC_5
NC_6

NC_1
NC_2
NC_3

VSSDL

VDDL

J2

M8
M3
M7
N2
N8
N3
N7
P2
P8
P3
M2
P7
R2

L2
L3

J8
K8
K2

K9
L8
K7
L7
K3

F7
B7

F3
B3

E8
A8

L1
R3
R7

A2
E2
R8

J7

J1

IC900-*2

DQ0

G8

DQ1

G2

DQ2

H7

DQ3

H3

DQ4

H1

DQ5

H9

DQ6

F1

DQ7

F9

DQ8

C8

DQ9

C2

DQ10

D7

DQ11

D3

DQ12

D1

DQ13

D9

DQ14

B1

DQ15

B9

VDD5

A1

VDD4

E1

VDD3

J9

VDD2

M9

VDD1

R1

VDDQ10

A9

VDDQ9

C1

VDDQ8

C3

VDDQ7

C7

VDDQ6

C9

VDDQ5

E9

VDDQ4

G1

VDDQ3

G3

VDDQ2

G7

VDDQ1

G9

VSS5

A3

VSS4

E3

VSS3

J3

VSS2

N1

VSS1

P9

VSSQ10

B2

VSSQ9

B8

VSSQ8

A7

VSSQ7

D2

VSSQ6

D8

VSSQ5

E7

VSSQ4

F2

VSSQ3

F8

VSSQ2

H2

VSSQ1

H8

DQ0

G8

DQ1

G2

DQ2

H7

DQ3

H3

DQ4

H1

DQ5

H9

DQ6

F1

DQ7

F9

DQ8

C8

DQ9

C2

DQ10

D7

DQ11

D3

DQ12

D1

DQ13

D9

DQ14

B1

DQ15

B9

VDD_5

A1

VDD_4

E1

VDD_3

J9

VDD_2

M9

VDD_1

R1

VDDQ_10

A9

VDDQ_9

C1

VDDQ_8

C3

VDDQ_7

C7

VDDQ_6

C9

VDDQ_5

E9

VDDQ_4

G1

VDDQ_3

G3

VDDQ_2

G7

VDDQ_1

G9

VSS_5

A3

VSS_4

E3

VSS_3

J3

VSS_2

N1

VSS_1

P9

VSSQ_10

B2

VSSQ_9

B8

VSSQ_8

A7

VSSQ_7

D2

VSSQ_6

D8

VSSQ_5

E7

VSSQ_4

F2

VSSQ_3

F8

VSSQ_2

H2

VSSQ_1

H8

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

H6 SL80

2009/04/02

9 12MAIN_DDR

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

1K R1012

10KR1001

C1044

2.2uF

LED Block

+5VST_MST

R1002
10K

I-DIM

LD1002
SAM2333

OPC_OUT2

+5V_MULTI

R1005

1.2K

P_5V

P_12V

P_16V

L1005

MLB-201209-0120P-N2

0R1067

R1066
READY

C1024

0.1uF
READY

C1020
READY

P1000
FM20020-24

P_5V

R1000

1NC
3 GND
5 GND
7 5.2V

9 5.2V
11 GND
13 12V
15 GND
17 24V

0

19 NC

2Power_On
4GND
6GND

85.2V

105.2V
12GND
1412V
16GND
1824V

20INV_ON
21 A.DIM 22Err_Out
23 NC 24PWM_DIM

25

R1053
0 NON_LGD

2.2K

3

2

1

Q1000
2SC3875S

P_5V

P_12V

P_16V

PANEL_STATUS

READY

L1004

MLB-201209-0120P-N2

10KR1003

+5V_MULTI 0.01uF
R1046

3K

3

2

1

Q1002
2SC3875S

RL_ON

10KR1047

DISP_EN/VAVS_ON

P_5V

P_12V

P_16V

L1001

MLB-201209-0120P-N2

C1002
47uF 25V

500L1000

C1003
10uF16V

L1012

MLB-201209-0120P-N2

C1007

0.01uF

C1006
68uF35V

C1008

0.01uF

C1034

0.1uF

C1046

**5V_MULTI-->1.2V

R1011

6.2K

OPC_OUT1

+5V_MULTI

C1004
10uF 16V

C1018
10uF 16V

C1012
560pF

12KR1008

C1045

2.2uF 16V
READY

ADJ

VCC

ITH

GND

+5VST_MST

C1011

0.01uF

+12V_AUDIO

+16V_NTP

C1001

0.1uF

IC1001

BD9130EFJ-E2

1

2

3

4

MAX 2A

*ST 5V->3.3V

IC1007
AP2121N-3.3TRE1

+5VST_MST

EN

8

PVCC

7

SW

6

PGND

5

L1002

2.2uH

10KR1006

R1009
2K

C1013
10uF 16V

C1025
10uF 16V

R1010

3.3K

R2
R1

C1014

0.1uF

C1041
1uF 25V
READY

GND

1

2VOUT3 VIN

OUT:1.27V

C1052
10uF 16V

+1.2V_VDDC_MST

C1053

0.01uF

+3.3V_MST

C1037
1uF 25V
READY

V0 = 0.8*(1+(R2/R1))

**DC-DC CONVERTER_READY
12V->5V_TUNER/USB

+5V_MULTI

R1019

2K

READY

0.47uF

10

L1009

3.6uH

C1026

0.1uF

P_12V

R1057

R1

43K

R2

R1058

5.6K

500L1008

C1030
10uF 25V

C1031
10uF

25V

R1=R2*((Vo/0.8)-1)

READY

IC1006
MP2212DN

1FB

MAX 3A

2 GND

3IN

4BS

10KR1059

8EN/SYNC

7SW_2

6SW_1

5VCC

R1056

R1018

C1033

C1035
1uF 25V

0R1055

0

C1017
100uF16V

C1000
10uF 16V

OUT:6.8V

C1029

C1038

10uF 16V

1uF 25V
READY

C1040

0.1uF

C1042

0.1uF

IC1000

AP1117EG-13

2OUT3IN

MAX 1A

1

ADJ/GND

R1014
330

IC1004

AP1117EG-13

2 OUT3IN

MAX 1A

1

ADJ/GND

R1016
330

R1013

110

R1015

110

500L1010

C1049
100uF 16V

C1043

100uF 16V

+5V_TUNER

+5V_USB

**5V_MULTI->3.3V->1.8V

IC1003

+5V_MULTI

AZ1085S-3.3TR/E1

INPUT

C1054

0.1uF

3

MAX 3A

1

ADJ/GND

0R1073

2

OUTPUT

OUT:3.3V

C1028
100uF

16V

C1016
10uF

0

R1074

C1036

0.1uF
AP1117EG-13

IN

MAX 1A

3

C1015

0.1uF

IC1002

1

ADJ/GND

OUT

2

R1

R2

R1004
300

R1007
150

C1022
10uF

**Switch 12V:P12V
**Switch 5V:5V_MULTI -> 1.8V

P_12V

L1006

MLB-201209-0120P-N2

PANEL_ON

POWER_SW

10K

R1017

C1027

68uF

READY

Close to Q1003

10KR1048

10KR1068

35V

R1049
33K

R1065
33K

C

B

E

P_5V

R1070
22K

R1069

1.6K
C

B

E

C1047
1uF 25V

Q1001
RT1C3904-T112

C1048
1uF

C1048-*1

2.2uF
16V

Q1004
RT1C3904-T112

1UF

2.2UF

S1

1

G1

2

S2

3

G2

4

Q1003

SI4925BDY

EBK32753101

D1_2

8

D1_1

7

D2_2

6

D2_1

5

MLB-201209-0120P-N2

C1005

0.1uF

C1019
10uF 16V

+3.3V_MULTI_MST

C1039
1uF 25V
READY

MLB-201209-0120P-N2

C1023

0.1uF

L1013

C1032

0.1uF

+1.8V_DDR

DDR2, Vref

+1.8V

NTP,AUDIO DSP

V0 = 1.25*(1+(R2/R1))

L1007

R1050

R1051

2.2K

R1052

2.2K

C1021

0.01uF

2.2K

+5V_MULTI

C1009
100uF16V

C1010

0.01uF

+12V_LCD

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

H6 SL80
POWER

2009/04/02

10 12

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

+3.3V_MEMC

120-ohmL1102

0R1105
0R1106
100R1107
100R1108
1KR1101

R1102
1K
READY

120-ohmL1103

120-ohmL1101

R1100
1K
READY

R1158
1K

MEMC_DQ[16-31]

ISP_RXD_TR
ISP_TXD_TR

M_SDA

M_SCL

+3.3V_MEMC

LED_DEMO

+3.3V_MEMC

LVDS_SEL

AFLC_EN

R1159
1K
READY

R1160
1K

+3.3V_MEMC

R1103
10K

R1104
10K

+1.8V_MEMC

+1.26V_MEMC

MEMC_DQ[20]
MEMC_DQ[19]

MEMC_DQ[17]
MEMC_DQ[22]

MEMC_DQ[27]
MEMC_DQ[28]

MEMC_DQ[25]
MEMC_DQ[30]

MEMC_DQM3
MEMC_DQM2

MEMC_DQS2

MEMC_DQSB2

MEMC_DQS3

MEMC_DQSB3

MEMC_DQ[31]
MEMC_DQ[24]

MEMC_DQ[26]
MEMC_DQ[29]

MEMC_DQ[23]
MEMC_DQ[16]
MEMC_DQ[18]
MEMC_DQ[21]

MEMC_MCLK

MEMC_MCLKZ

MVREF

MEMC_ODT

C1103

C1102

1uF

0.1uF

120-ohmL1104

22uF 16VC1115
10uFC1117

0.1uFC1118

0.1uFC1119

10uF 10VC1120
10uFC1121

0.1uFC1122

0.1uFC1123

0.1uFC1105

0.1uFC1106

0.1uFC1124

0.1uFC1107

0.1uFC1125

0.1uFC1108

0.1uFC1109

0.1uFC1110

0.1uFC1111

0.1uFC1112
10uFC1116
22uF 16VC1104

MEMC_A[0-12]

0.1uFC1101

10uF 10VC1126

0.1uFC1129

10uFC1127

E1 SDAS

D1 SCLS

F1 GPIO[8]
G1 GPIO[9]
K8 GND_14

E5 VDDC_1

E2 GPIO[10]

F2 GPIO[11]

F3 GPIO[12]
G2 GPIO[13]
M4 GPIO[22]
M5 GPIO[23]
G3 GPIO[14]

E4 GPIO[15]

F4 GPIO[16]
G4 GPIO[17]
H4 GPIO[18]

J4 GPIO[19]

K4 GPIO[20]

L4 GPIO[21]

J6 VDDP_2

H9 GND_7

GND_15K9

F6 VDDC_2
H1 MDATA[20]
H2 MDATA[19]

H3 MDATA[17]

J1 MDATA[22]

J2 MDATA[27]
J3 MDATA[28]

K1 MDATA[25]
K2 MDATA[30]
K6 AVDD_DDR_2
K3 DQM[3]

L1 DQM[2]

J8 GND_10
L2 DQS[2]
L3 DQSB[2]
L6 AVDD_DDR_4
L8 VDDP_3

H10 GND_8

M1 DQS[3]
M2 DQSB[3]

L7 AVDD_DDR_5

M3 MDATA[31]
N1 MDATA[24]

J9 GND_11

N2 MDATA[26]
N3 MDATA[29]

L1 0 AVDD_DDR_6

P1 MDATA[23]

R1 MDATA[16]

T1 MDATA[18]
T2 MDATA[21]

R2 MCLK[0]

P2 MCLKZ[0]

G7 GND_1

L9 AVDD_MEMPLL

N5 MVREF
N4 ODT

RASZR3CASZP3MADR[0]T4MADR[2]R4MADR[4]

T3

MEMC_RASZ

MEMC_RXE2-

MEMC_RXE1-

MEMC_RXE1+

MEMC_RXE0-

MEMC_RXE2+

MEMC_RXE0+

B2RECKN

A2RECKP

C2RE3N

C1RE3P

A1RE4N

B1RE4P

GND_12P4MADR[6]T5MADR[8]R5MADR[11]P5WEZT6BADR[1]R6BADR[0]P6MADR[1]T7MADR[10]

J10

0.1uFC1113

MEMC_CASZ

MEMC_A[2]

MEMC_A[4]

MEMC_A[0]

MEMC_A[6]

MEMC_RXEC+

MEMC_RXE3+

MEMC_RXE3-

MEMC_RXE4+

MEMC_RXEC-

A4

C4RE1N

C3RE1P

A3RE2N

B3RE2P

RE0P

[E1]
[D1]

[L9]

[N5]

[N4]

MEMC_BA1

MEMC_BA0

MEMC_WEZ

MEMC_A[11]

MEMC_A[8]

MEMC_RXE4-

MEMC_RXO0+

MEMC_RXO0-

R1146
100
R1147
100
R1148
100
R1149
100
R1150
100
R1151
100

0.1uFC1131

A5RO4N

B5RO4P

H8GND_6

F11AVDD_LVDS_1

B4RE0N

AVDD_DDR_7R7MADR[5]P7MADR[9]T8MADR[12]R8MADR[7]P8MADR[3]N8MCLKE

L11

0.1uFC1114

MEMC_A[10]

MEMC_A[1]

MEMC_A[9]

MEMC_A[5]

MEMC_RXO2+

MEMC_RXO1-

MEMC_RXOC+

MEMC_RXO1+

MEMC_RXO2-

B7RO2P

B6ROCKN

A6ROCKP

C6RO3N

C5RO3P

GND_16F7VDDC_3T9MDATA[4]R9MDATA[3]K7GND_13P9MDATA[1]
K10

0.1uFC1132

MEMC_MCLKE

MEMC_A[7]

MEMC_A[12]

MEMC_A[3]

MEMC_RXO4+

MEMC_RXOC-

MEMC_RXO3+

MEMC_RXO3-

MEMC_RXO4-

R1152

Closed to IC1100

100
R1153
100
R1154
100
R1155
100
R1156
100
R1157
100

0.01uFC1133

M_XTALI

M_XTALO

A14GPIO_1

B14GPIO_2

D3XIN

D4XOUT

K16GPIO_14

K15GPIO_13

H7GND_5

G11AVDD_LVDS_2

B8RO0N

A8RO0P

C8RO1N

C7RO1P

A7RO2N

IC1100

LGE7329A

MDATA[6]

AVDD_DDR_3

MDATA[11]

MDATA[12]

MDATA[9]

MDATA[14]

AVDD_DDR_1

J11

P10

T10

T11

R10

R11

K11

0.1uFC1130

MEMC_DQ[11]

MEMC_DQ[9]

MEMC_DQ[12]

MEMC_DQ[14]

MEMC_DQ[1]

MEMC_DQ[6]

MEMC_DQ[3]

MEMC_DQ[4]

0.1uFC1128

+3.3V_MEMC

L1105

120-ohm

0.1uFC1134

E11GPIO_12

N7GPIO[25]

D6SCLM

D5SDAM

DQM[1]

DQM[0]

DQS[0]

P11

T12

R12

MEMC_DQS0

MEMC_DQM0

MEMC_DQM1

1uFC1135

F10AVDD_PLL

G8GND_2

D11GPIO_8

D13GPIO_9

DQSB[0]

VDDP_1

J7

GND_9

P12

H11

0.1uFC1136

0.1uFC1137

MEMC_DQSB0

URSA_A0M

URSA_A1P

URSA_A0P

C9LVA1P

A9LVA0M

B9LVA0P

DQS[1]

DQSB[1]

MDATA[15]

P13

T13

R13

MEMC_DQS1

MEMC_DQSB1

MEMC_DQ[15]

URSA_A2M

URSA_A2P

URSA_A1M

URSA_ACKP

A11LVACKM

B11LVACKP

B10LVA2M

A10LVA2P

C10LVA1M

MDATA[8]

MDATA[10]

MDATA[13]

P14

T14

R14

MEMC_DQ[8]

MEMC_DQ[10]

MEMC_DQ[13]

URSA_A4P

URSA_A3M

URSA_ACKM

URSA_A3P

A12LVA4P

C12LVA3M

C11LVA3P

MDATA[7]

MDATA[0]

MDATA[2]
P15

T15

R15

MEMC_DQ[0]

MEMC_DQ[7]

MEMC_DQ[2]

URSA_B0P

URSA_A4M

A13LVB0M

B13LVB0P

D7GPIO_4

D9GPIO_6

B12LVA4M

[N13]
[N12]

MCLKZ[1]N9GPIO[26]

GPIO[27]

MDATA[5]

MCLK[1]

P16

T16

R16

N10

MEMC_MCLK1

MEMC_MCLKZ1

MEMC_DQ[5]

URSA_B0M

URSA_B1M

URSA_B1P

D12REXT

C14LVB1M

C13LVB1P

GPIO_5

GPIO_7
GPIO_11
GPIO_10

GPIO_3

LVB2P

LVB2M
LVBCKP

LVBCKM

LVB3P

LVB3M

LVB4P

LVB4M

AVDD_33_2

GND_4
LVC0P

LVC0M

LVC1P

LVC1M

LVC2P

LVC2M
LVCCKP

LVCCKM

LVC3P

LVC3M

LVC4P

LVC4M

LVD0P

LVD0M

LVD1P

LVD1M

GND_3
LVD2P

LVD2M
LVDCKP

LVDCKM

AVDD_33_1

LVD3P

LVD3M

LVD4P

LVD4M

VDDC_5
GPIO[24]

GPIO[7]

GPIO[6]

GPIO[5]

GPIO[4]

GPIO[3]

GPIO[2]

GPIO[1]

GPIO[0]

PWM0
PWM1

CSZ

SDO

SDI

SCK
GPIO[30]
GPIO[29]

GND_17

RESETG6VDDC_4

N11

M11

0R1109

MEMC_DQ[0-15]

0.1uFC1138

P1103

XTAL

M_XTALO

X1101

C1147
15pF

1MR1124
12MHz

C1148
15pF

M_XTALI

SMAW250-04Q
DEBUG

1

2

3

4

5

JP1101

ISP_RXD_TR
ISP_TXD_TR

JP1102

JP1100

10uF 16VC1150

1000pFC1151

L1107
CIC21J501NE

0.1uFC1152

URSA_B4M

+12V_LCD

+3.3V_MEMC

URSA_B4P
URSA_B3M
URSA_B3P

L1106

820R1110

C1142

D8
D10
E10
E3
D2
C15
B15
A15
A16
B16
C16
D15
D16
F9
G10
E15
E16
E14
F14
F16
F15
G15
G16
G14
H14
H16
H15
J15
J16
J14
K14

G9
L14
L15
L16
M16
F8
M15
M14
N16
N15

H6
N6
E12
D14
F12
E13
F13
G13
H13
J13
K12
L12
K13
M12
M13
L13
N14
N13

N12GPIO[28]

22uFC1139
10uFC1140

0.1uFC1146

0.1uFC1141

0.1uF

0.1uFC1143

0.1uFC1144

0.1uFC1145

BLM18PG121SN1D

URSA_B2P
URSA_B2M
URSA_BCKP
URSA_BCKM
URSA_B3P
URSA_B3M
URSA_B4P
URSA_B4M

URSA_C0P
URSA_C0M
URSA_C1P
URSA_C1M
URSA_C2P
URSA_C2M
URSA_CCKP
URSA_CCKM
URSA_C3P
URSA_C3M
URSA_C4P
URSA_C4M
URSA_D0P
URSA_D0M
URSA_D1P
URSA_D1M

URSA_D2P
URSA_D2M
URSA_DCKP
URSA_DCKM

URSA_D3P
URSA_D3M
URSA_D4P
URSA_D4M

M_SPI_CZ
M_SPI_DO
M_SPI_DI
M_SPI_CK

+3.3V_MEMC

R1111
10K

R1114
1K

R1115
1K
READY

I2C
EEPROM
SPI

MEMC_RESET

SPI FLASH

M_SPI_CZ

M_SPI_DO

OPC_EN

GPIO8
HIGH
HIGH
HIGH

R1128

OPC_EN

+3.3V_MEMC

R1116
1K

R1117
1K
READY

PWM1

HIGH
HIGH

+3.3V_MULTI_MST

C

B

22

E

PWM0
HIGHLOW
LOW
HIGH

56R1120

CS

56R1121

10KR1122

IC1101_URSA_winbond

R1127
470

Q1101
RT1C3904-T112

IC1101
W25X20AVSNIG

1

2DO

3WP

4GND

R1137

0 READY

+3.3V_MEMC

8 VCC

HOLD

7

6 CLK

5 DIO

+3.3V_MEMC

OPC_OUT2

OPC_OUT1

E-DIM

LVDS_SEL

AFLC_EN

+3.3V_MEMC

C1149

0.1uF

56R1125

56R1126

LED_DEMO

READY

M_SPI_CK

M_SPI_DI

22R1123

22R1138
22R1139

0 READYR1161

URSA_BCKM

URSA_BCKP

URSA_B2M

URSA_B2P

URSA_B1M

URSA_B1P

URSA_B0M

URSA_B0P

4.7K

R1129
READY

0

R1132
READY

URSA_A4M

URSA_A4P

URSA_A3M

URSA_A3P

URSA_ACKM

URSA_ACKP

URSA_A2M

URSA_A2P

URSA_A1M

URSA_A1P

URSA_A0M

URSA_A0P

READY

0

R1144
READY

4.7KR1112

JEIDA

R1131

READY

4.7K
0READY R 1 16 2

4.7K

R1118
READY

4.7K

R1133
READY

4.7K

R1134
READY

4.7K

R1135
READY

IC1101_URSA_Replace_macronix

IC1101-*1

MX25L2005MC-12G

CS

1

SO

2

WP

3

GND

4

READY

0R1 136 READY

0R1145

0R1 11 3 VESA
0 READYR1140
0R1 119 READY
0 READYR1141
0 READYR1142
0 READYR1143

0R1130

VCC

8

HOLD

7

SCLK

6

SI

5

P1101

TF05-51S

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

URSA_D4M

URSA_D4P

URSA_D3M

URSA_D3P

URSA_DCKM

URSA_DCKP

URSA_D2M

URSA_D2P

URSA_D1M

URSA_D1P

URSA_D0M

URSA_D0P

URSA_C4M

URSA_C4P

URSA_C3M

URSA_C3P

URSA_CCKM

URSA_CCKP

URSA_C2M

URSA_C2P

URSA_C1M

URSA_C1P

URSA_C0M

URSA_C0P

P1102

TF05-41S

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

H6 SL80 2009/04/02
MEMC & LVDS Out

11 12

EAX61181901

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

Mstar LCD SL80

MEMC_DQ[16-31]

+3.3V_MEMC

1300 mA @85% efficiency

IC1205

R1
R2

MP2212DN

1FB

MAX 3A

2 GND

3IN

4BS

READY
C1200
100pF

P_12V

L1205
500

C1253
10uF 25V

C1254
10uF 25V

R1236
39K

R1237
12K

Vo=0.8(1+R1/R2)

DDR_DQ[16-31]

C1202

56AR1201

56AR1202

56AR1203

56AR1204

10uF 10V

+1.8V_MEMC

BLM18PG121SN1D

L1201

0.1uF

C1201

MEMC_DQ[27]
MEMC_DQ[28]
MEMC_DQ[25]
MEMC_DQ[30]

MEMC_DQ[22]
MEMC_DQ[17]

MEMC_DQ[20]

MEMC_DQ[31]
MEMC_DQ[24]
MEMC_DQ[26]
MEMC_DQ[29]

MEMC_DQ[23]
MEMC_DQ[16]
MEMC_DQ[18]
MEMC_DQ[21]

+1.8V_MEMC_DDR

+1.8V_MEMC for DDR

1000 mA @85% efficiency

+5V_MULTI

+3.3V_MEMC

R1234

C1246

10

8EN/SYNC

10KR1235

7SW_2

0.1uF

3.6uHL1204

6SW_1

5VCC

C1255

C1256

1uF 25V

0.47uF

0R1226

233 mA+400mA+600mA

C1257
10uF 16V

DDR_DQ[16-31]

C1258
10uF 16V

QIMONDA

IC1201

+3.3V_MEMC

L1206
500

C1243
100uF

C1239
1000pF

C1244
22uF

C1240

0.1uF

C1267

0.1uF
C1245

330pF

+1.8V_MEMC_DDR

R1221
1K 1%

R1222
1K 1%

DDRB_A[0-12]

DDRB_A[0-12]

18KR1225

ADJ

VCC

ITH

GND

IC1203

BD9130EFJ-E2

1

2

3

4

MAX 2A

EN

8

PVCC

7

SW

6

PGND

5

L1203

2.2uH

10KR1227

0R1233

R1

C1247
22uF

R2

V0 = 0.8(1+R1/R2)

HYB18TC512160CF-2.5

DDR_DQ[27]
DDR_DQ[28]
DDR_DQ[25]
DDR_DQ[30]

DDR_DQ[17]
DDR_DQ[19]
DDR_DQ[20]

DDR_DQ[31]
DDR_DQ[24] MEMC_A[2]
DDR_DQ[26] MEMC_A[6]

DDR_DQ[23]
DDR_DQ[16]
DDR_DQ[18]
DDR_DQ[21]

DDR_DQ[17]
DDR_DQ[18]
DDR_DQ[19]
DDR_DQ[20]
DDR_DQ[21]
DDR_DQ[22]
DDR_DQ[23]
DDR_DQ[24] MEMC_A[5]
DDR_DQ[25]

DDR_DQ[27]
DDR_DQ[28]
DDR_DQ[29]
DDR_DQ[30]
DDR_DQ[31]

C1218

+1.8V_MEMC_DDR

10uFC1203

0.1uFC1204

0.1uFC1205

0.1uFC1206

0.1uFC1207

0.1uFC1208

10uFC1212

0.1uFC1209

0.1uFC1210

0.1uFC1211

0.1uFC1213

0.1uFC1214

0.1uFC1215

0.1uFC1216

0.1uFC1217

0.1uF

0.1uFC1219

DDR2 1.8V By CAP - Place these Caps near Memory

G8DQ0
G2DQ1
H7DQ2
H3DQ3
H1DQ4
H9DQ5
F1DQ6
F9DQ7
C8DQ8
C2DQ9
D7DQ10
D3DQ11
D1DQ12
D9DQ13
B1DQ14
B9DQ15

A1VDD5
E1VDD4
J9VDD3
M9VDD2
R1VDD1

A9VDDQ10
C1VDDQ9
C3VDDQ8
C7VDDQ7
C9VDDQ6
E9VDDQ5
G1VDDQ4
G3VDDQ3
G7VDDQ2
G9VDDQ1

A3VSS5
E3VSS4
J3VSS3
N1VSS2
P9VSS1

B2VSSQ10
B8VSSQ9
A7VSSQ8
D2VSSQ7
D8VSSQ6
E7VSSQ5
F2VSSQ4
F8VSSQ3
H2VSSQ2
H8VSSQ1

J 2 VREF

M8 A0
M3 A1
M7 A2

N2 A3
N8 A4
N3 A5
N7 A6

P2 A7
P8 A8
P3 A9

M2 A10/AP

P7 A11

R2 A12

L2 BA0
L3 BA1

J8 CK

K8

CK

K2 CKE

K9 ODT
L8

CS
RAS

K7

CAS

L7
K3 WE

F7 LDQS

B7 UDQS

F3 LDM

B3 UDM

LDQS

E8

UDQS

A8

L1 NC4
R3 NC5
R7 NC6

A2 NC1
E2 NC2
R8 NC3

J 7 VSSDL

J 1 VDDL

DDRB_A[0]
DDRB_A[1]
DDRB_A[2]
DDRB_A[3]
DDRB_A[4]
DDRB_A[5]
DDRB_A[6]
DDRB_A[7]
DDRB_A[8]

DDRB_A[9]
DDRB_A[10]
DDRB_A[11]
DDRB_A[12]

R1201
150
READY

+1.8V_MEMC_DDR

C1261

0.1uF

22R1202

22R1203

22R1204

56R1205
56R1206

56R1207
56R1208

56R1209
56R1210

B_URSA_BA0
B_URSA_BA1
MEMC_MCLK

MEMC_MCLKZ
B_URSA_MCLKE

MEMC_ODT

B_URSA_RASZ
B_URSA_CASZ
B_URSA_WEZ

MEMC_DQS2
MEMC_DQS3

MEMC_DQM2
MEMC_DQM3

MEMC_DQSB2
MEMC_DQSB3

B_URSA_BA0
B_URSA_BA1

B_URSA_MCLKE

B_URSA_WEZ

MEMC_BA0
MEMC_BA1

MEMC_MCLKE

MEMC_WEZ

DDRB_A[10]
DDRB_A[1]
DDRB_A[3]

DDRB_A[9]
DDRB_A[12]
DDRB_A[7]
DDRB_A[5]

DDRB_A[0]
DDRB_A[2]
DDRB_A[4]
DDRB_A[6]

B_URSA_RASZ
B_URSA_CASZ

DDRB_A[11]
DDRB_A[8]

22AR1217

22AR1218

22AR1205

22AR1206

22AR1207

22AR1208

MEMC_BA0
MEMC_BA1
MEMC_MCLKE
MEMC_WEZ

A_URSA_BA0
A_URSA_BA1
A_URSA_MCLKE
A_URSA_WEZ

MEMC_A[10]

MEMC_A[1]
MEMC_A[3]

MEMC_A[9]

MEMC_A[12] DDRA_A[12]

MEMC_A[7]

MEMC_A[0]

MEMC_A[4]
MEMC_A[6]

MEMC_A[11]

MEMC_A[8]

MEMC_RASZ
MEMC_CASZ

MEMC_A[10]
MEMC_A[1]
MEMC_A[3]

MEMC_A[9]
MEMC_A[12]
MEMC_A[7]
MEMC_A[5]

MEMC_A[2]
MEMC_A[0]

MEMC_A[4]

MEMC_RASZ
MEMC_CASZ

MEMC_A[8]
MEMC_A[11]

IC1201-*1

H5PS5162FFR-S6C

VREF

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9

A10/AP

A11
A12

BA0
BA1

CK
CK

CKE

ODT

CS
RAS
CAS

WE

LDQS
UDQS

LDM
UDM

LDQS
UDQS

NC4
NC5
NC6

NC1
NC2
NC3

VSSDL

VDDL

J2

M8
M3
M7
N2
N8
N3
N7
P2
P8
P3
M2
P7
R2

L2
L3

J8
K8
K2

K9
L8
K7
L7
K3

F7
B7

F3
B3

E8
A8

L1
R3
R7

A2
E2
R8

J7

J1

Hynix

DQ0

G8

DQ1

G2

DQ2

H7

DQ3

H3

DQ4

H1

DQ5

H9

DQ6

F1

DQ7

F9

DQ8

C8

DQ9

C2

DQ10

D7

DQ11

D3

DQ12

D1

DQ13

D9

DQ14

B1

DQ15

B9

VDD5

A1

VDD4

E1

VDD3

J9

VDD2

M9

VDD1

R1

VDDQ10

A9

VDDQ9

C1

VDDQ8

C3

VDDQ7

C7

VDDQ6

C9

VDDQ5

E9

VDDQ4

G1

VDDQ3

G3

VDDQ2

G7

VDDQ1

G9

VSS5

A3

VSS4

E3

VSS3

J3

VSS2

N1

VSS1

P9

VSSQ10

B2

VSSQ9

B8

VSSQ8

A7

VSSQ7

D2

VSSQ6

D8

VSSQ5

E7

VSSQ4

F2

VSSQ3

F8

VSSQ2

H2

VSSQ1

H8

R1228
39K 1%

R1229
30K 1%

MEMC_A[0-12]

EDE5116AJBG-8E-E

VREF

A0
A1
A2
A3
A4
A5
A6
A7
A8

A9
A10
A11
A12

BA0
BA1

CK
CK

CKE

ODT

CS
RAS
CAS

WE

LDQS
UDQS

LDM
UDM

LDQS
UDQS

NC_4
NC_5
NC_6

NC_1
NC_2
NC_3

VSSDL

VDDL

400mA + 600mA

C1248

0.1uF

22AR1209

DDRA_A[10]

DDRA_A[1]
DDRA_A[3]

22AR1210

DDRA_A[9]

DDRA_A[7]
DDRA_A[5]

22AR1211

DDRA_A[2]DDR_DQ[26]
DDRA_A[0]
DDRA_A[6]
DDRA_A[4]DDR_DQ[29]

22AR1212

A_URSA_RASZ
A_URSA_CASZ

DDRA_A[8]

DDRA_A[11]

IC1201-*2

DQ0

G8

J2

ELPIDA

DQ1

G2

DQ2

H7

M8
M3
M7
N2
N8
N3
N7
P2
P8
P3
M2
P7
R2

L2
L3

J8
K8
K2

K9
L8
K7
L7
K3

F7
B7

F3
B3

E8
A8

L1
R3
R7

A2
E2
R8

J7

J1

DQ3

H3

DQ4

H1

DQ5

H9

DQ6

F1

DQ7

F9

DQ8

C8

DQ9

C2

DQ10

D7

DQ11

D3

DQ12

D1

DQ13

D9

DQ14

B1

DQ15

B9

VDD_5

A1

VDD_4

E1

VDD_3

J9

VDD_2

M9

VDD_1

R1

VDDQ_10

A9

VDDQ_9

C1

VDDQ_8

C3

VDDQ_7

C7

VDDQ_6

C9

VDDQ_5

E9

VDDQ_4

G1

VDDQ_3

G3

VDDQ_2

G7

VDDQ_1

G9

VSS_5

A3

VSS_4

E3

VSS_3

J3

VSS_2

N1

VSS_1

P9

VSSQ_10

B2

VSSQ_9

B8

VSSQ_8

A7

VSSQ_7

D2

VSSQ_6

D8

VSSQ_5

E7

VSSQ_4

F2

VSSQ_3

F8

VSSQ_2

H2

VSSQ_1

H8

+1.8V_MEMC

+1.8V_MEMC_DDR

R1223
1K 1%

C1241

R1224

0.1uF

1K 1%

DDRA_A[0-12]

DDRA_A[0-12]

A_URSA_BA0
A_URSA_BA1

MEMC_MCLK1

MEMC_MCLKZ1

A_URSA_MCLKE

MEMC_ODT

A_URSA_RASZ
A_URSA_CASZ

A_URSA_WEZ

MEMC_DQS0
MEMC_DQS1

MEMC_DQM0
MEMC_DQM1

MEMC_DQSB0
MEMC_DQSB1

C1242
1000pF

DDRA_A[0]
DDRA_A[1]
DDRA_A[2]
DDRA_A[3]
DDRA_A[4]
DDRA_A[5]
DDRA_A[6]
DDRA_A[7]
DDRA_A[8]
DDRA_A[9]
DDRA_A[10]
DDRA_A[11]
DDRA_A[12]

22R1211

R1220
150READY

22R1212

22R1213

56R1214
56R1215

56R1216
56R1217

56R1218
56R1219

+1.8V_MEMC_DDR

C1262

0.1uF

+1.26V Core for MEMC

+5V_MULTI

C1264
1uF

+1.8V_MEMC

C1250

C1249

0.1uF

10uF 10V

Close to IC1204

HYB18TC512160CF-2.5

J2VREF

M8A0
M3A1
M7A2
N2A3
N8A4
N3A5
N7A6
P2A7
P8A8
P3A9
M2A10/AP
P7A11
R2A12

L2BA0
L3BA1

J8CK
K8

CK

K2CKE

K9ODT
L8

CS

RAS

K7

CAS

L7
K3WE

F7LDQS
B7UDQS

F3LDM
B3UDM

LDQS

E8

UDQS

A8

L1NC4
R3NC5
R7NC6

A2NC1
E2NC2
R8NC3

J7VSSDL

J1VDDL

QIMONDA

IC1202

8EN

7 POK

6 VCNTL

5 VIN

G8 DQ0
G2 DQ1
H7 DQ2
H3 DQ3
H1 DQ4
H9 DQ5

F1 DQ6

F9 DQ7
C8 DQ8
C2 DQ9
D7 DQ10
D3 DQ11
D1 DQ12
D9 DQ13
B1 DQ14
B9 DQ15

A1 VDD5
E1 VDD4

J 9 VDD3
M9 VDD2
R1 VDD1

A9 VDDQ10
C1 VDDQ9
C3 VDDQ8
C7 VDDQ7
C9 VDDQ6
E9 VDDQ5
G1 VDDQ4
G3 VDDQ3
G7 VDDQ2
G9 VDDQ1

A3 VSS5
E3 VSS4

J3 VSS3
N1 VSS2

P9 VSS1

B2 VSSQ10
B8 VSSQ9
A7 VSSQ8
D2 VSSQ7
D8 VSSQ6
E7 VSSQ5

F2 VSSQ4

F8 VSSQ3
H2 VSSQ2
H8 VSSQ1

IC1204
APE8953MP

2A

1KR1230

DDR_DQ[0]
DDR_DQ[1]
DDR_DQ[2]
DDR_DQ[3]
DDR_DQ[4]
DDR_DQ[5]DDR_DQ[22]
DDR_DQ[6]
DDR_DQ[7]
DDR_DQ[8]

DDR_DQ[9]
DDR_DQ[10]
DDR_DQ[11]
DDR_DQ[12]
DDR_DQ[13]
DDR_DQ[14]
DDR_DQ[15]

1GND

2FB

R1231

3VOUT_1

R1

10K 1%

4VOUT_2

V0 = 0.8(1+R1/R2)

DDR_DQ[0-15]

DDR_DQ[0-15]

DDR2 1.8V By CAP - Place these Caps near Memory

+1.8V_MEMC_DDR

10uFC1222

0.1uFC1223

0.1uFC1224

0.1uFC1225

0.1uFC1226

0.1uFC1228

10uFC1227

0.1uFC1229

0.1uFC1230

0.1uFC1231

0.1uFC1232

0.1uFC1233

0.1uFC1234

0.1uFC1235

0.1uFC1236

0.1uFC1237

0.1uFC1238

+1.8V_MEMC

R2

C1259
18nF 16V

C1251
100uF16V

DDR_DQ[15]DDR_DQ[16]
DDR_DQ[8]
DDR_DQ[10]
DDR_DQ[13]

DDR_DQ[7]
DDR_DQ[0]
DDR_DQ[2]MEMC_DQ[19]
DDR_DQ[5]

DDR_DQ[11]
DDR_DQ[12]
DDR_DQ[9]

DDR_DQ[6]
DDR_DQ[1]
DDR_DQ[3]
DDR_DQ[4]

BLM18PG121SN1D

L1202

C1220

0.1uF

IC1202-*1

H5PS5162FFR-S6C

VREF

J2

A0

M8

A1

M3

A2

M7

A3

N2

A4

N8

A5

N3

A6

N7

A7

P2

A8

P8

A9

P3

A10/AP

M2

A11

P7

A12

R2

BA0

L2

BA1

L3

CK

J8

CK

K8

CKE

K2

ODT

K9

CS

L8

RAS

K7

CAS

L7

WE

K3

LDQS

F7

UDQS

B7

LDM

F3

UDM

B3

LDQS

E8

UDQS

A8

NC4

L1

NC5

R3

NC6

R7

NC1

A2

NC2

E2

NC3

R8

VSSDL

J7

VDDL

J1

17.4K 1%R1232

Hynix

C1252

0.1uF

C1260
10uF 16V

56AR1213

MEMC_DQ[15]

MEMC_DQ[8]
MEMC_DQ[10]
MEMC_DQ[13]

56AR1214

MEMC_DQ[7]

MEMC_DQ[0]

MEMC_DQ[2]

MEMC_DQ[5]

56AR1215

MEMC_DQ[11]
MEMC_DQ[12]

MEMC_DQ[9]
MEMC_DQ[14]DDR_DQ[14]

56AR1216

MEMC_DQ[6]

MEMC_DQ[1]

MEMC_DQ[3]

MEMC_DQ[4]

+1.8V_MEMC_DDR

C1221

0.1uF 16V

DQ0

G8

DQ1

G2

DQ2

H7

DQ3

H3

DQ4

H1

DQ5

H9

DQ6

F1

DQ7

F9

DQ8

C8

DQ9

C2

DQ10

D7

DQ11

D3

DQ12

D1

DQ13

D9

DQ14

B1

DQ15

B9

VDD5

A1

VDD4

E1

VDD3

J9

VDD2

M9

VDD1

R1

VDDQ10

A9

VDDQ9

C1

VDDQ8

C3

VDDQ7

C7

VDDQ6

C9

VDDQ5

E9

VDDQ4

G1

VDDQ3

G3

VDDQ2

G7

VDDQ1

G9

VSS5

A3

VSS4

E3

VSS3

J3

VSS2

N1

VSS1

P9

VSSQ10

B2

VSSQ9

B8

VSSQ8

A7

VSSQ7

D2

VSSQ6

D8

VSSQ5

E7

VSSQ4

F2

VSSQ3

F8

VSSQ2

H2

VSSQ1

H8

600 mA

+1.26V_MEMC

MEMC_DQ[0-15]

IC1202-*2

EDE5116AJBG-8E-E

VREF

A0
A1
A2
A3
A4
A5
A6
A7
A8

A9
A10
A11
A12

BA0
BA1

CK
CK

CKE

ODT

CS
RAS
CAS

WE

LDQS
UDQS

LDM
UDM

LDQS
UDQS

NC_4
NC_5
NC_6

NC_1
NC_2
NC_3

VSSDL

VDDL

G8

J2

ELPIDA

G2
H7

M8

H3

M3

H1

M7

H9

N2

F1

N8

F9

N3

C8

N7

C2

P2

D7

P8

D3

P3

D1

M2

D9

P7

B1

R2

B9

L2
L3

A1
E1
J9

J8

M9

K8

R1

K2

K9

A9

L8

C1

K7

C3

L7

C7

K3

C9
E9

F7

G1

B7

G3
G7
G9

F3
B3

A3

E8

E3

A8

J3
N1

L1

P9

R3
R7

B2

A2

B8

E2

A7

R8

D2
D8
E7

J7

F2
F8
H2

J1

H8

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15

VDD_5
VDD_4
VDD_3
VDD_2
VDD_1

VDDQ_10
VDDQ_9
VDDQ_8
VDDQ_7
VDDQ_6
VDDQ_5
VDDQ_4
VDDQ_3
VDDQ_2
VDDQ_1

VSS_5
VSS_4
VSS_3
VSS_2
VSS_1

VSSQ_10
VSSQ_9
VSSQ_8
VSSQ_7
VSSQ_6
VSSQ_5
VSSQ_4
VSSQ_3
VSSQ_2
VSSQ_1

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

H6 SL80

2009/04/02

12 12MEMC_DDR & POWER