LG 32LH70YR User Manual

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP91D

MODEL : 32LH70YR

32LH70YR-LA/TA

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

Internal Use Only

Only for training and service purposes

- 2 -

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION .................................................................9

TROUBLE SHOOTING ............................................................................14

BLOCK DIAGRAM...................................................................................17

EXPLODED VIEW .................................................................................. 18

SVC. SHEET ...............................................................................................

Only for training and service purposes

- 3 -

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

IMPORTANT SAFETY NOTICE

0.15uF

Ω

Only for training and service purposes

- 4 -

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500

°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500

°F to 600°F)

b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500

°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Only for training and service purposes

- 5 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Only for training and service purposes

- 6 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

4. Electrical specification

4.1. General Specification

1. Application range

This spec sheet is applied to LCD TV used LP91D chassis.

2. Specification

Each part is tested as below without special appointment.

1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC

2) Relative Humidity : 65±10%

3)

Power Voltage : Standard input voltage(100~240V@50/60Hz)

* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety: CE, IEC specification

- EMC : CE, IEC

No Item Specification Measurement Remark

1 Screen Size 32” wide Color Display Module Resolution : 1920*1080

2 Aspect Ratio 16:9

3 LCD Module 32” TFT WUXGA LCD FHD

4 Operating Environment Temp.: 0 ~ 40 deg

Humidity : 0 ~ 80 %

5 Storage Environment Temp.: -20 ~ 60 deg

Humidity : 0~ 85 %

6 Input Voltage AC100-240V~, 50/60Hz

≤ 180 W 32” FHD, 100Hz

7 LDC Module FHD 760 x 450 x 48

(Maker : LGD) 0.36375 x 0.36375

Coating 3H

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Only for training and service purposes

No. Item Min. Typ. Max. Unit Maker Remark

1. Luminance 400 500 cd/m

2

(W/O PC mode)

2. VIew angle (R/L, U/D) 178/ 178 degree LGD CR > 10

3. Color Coordinates White Wx Typ 0.279 Typ LGD 32”(FHD)

Wy -0.03 0.292 +0.03 LC320WUD-SBA1

RED Xr 0.638 (100Hz/Slim)

Yr 0.334

Green Xg 0.291

Yg 0.607

Blue Xb 0.145

Yb 0.062

4. Contrast ratio 900:1 1300:1 LGD 32”(100Hz)

5. Luminance Variation 1.3

5. Chroma& Brightness (Optical)

5.1. LCD Module

the Color Coordinates check condition

- 50cm from the surface, Full White Pattern

- Picture mode Vivid

6. Component Video Input (Y, PB, PR)

No

Specification

Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)

2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)

3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz

4 720* 480 31.47 59.94 27.000 SDTV 480P

5 720* 480 31.50 60.00 27.027 SDTV 480P

6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz

7 1280* 720 44.96 59.94 74.176 HDTV 720P

8 1280* 720 45.00 60.00 74.250 HDTV 720P

9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz

10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

11 1920* 1080 33.72 59.94 74.176 HDTV 1080I

12 1920* 1080 33.75 60.00 74.25 HDTV 1080I

13 1920* 1080 56.25 50 148.5 HDTV 1080P

14 1920* 1080 67.432 59.94 148.350 HDTV 1080P

15 1920* 1080 67.5 60.00 148.5 HDTV 1080P

- 8 -

Only for training and service purposes

No

Specification

Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

1 640* 350 31.468 70.09 25.17 EGA

2 720* 400 31.469 70.09 28.32 DOS

3 640* 480 31.469 59.94 25.17 VESA( VGA)

4 800* 600 37.879 60.317 40 VESA( SVGA)

5 1024* 768 48.363 60.004 65 VESA( XGA)

6 1280* 768 47.776 59.87 79.5 VESA( WXGA)

7 1360* 768 47.72 59.799 84.75 VESA( WXGA)

8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model

9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model

7. RGB

7.1. Analog PC, RGB- DTV –NOT SUPPORT

8. HDMI Input

8.1. PC –Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1 640 x 480 31.469 59.94 25.17 VESA( VGA)

2 800 x 600 37.879 60.317 40.00 VESA( SVGA)

3 1024 x 768 48.363 60.004 65.00 VESA( XGA)

4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)

5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)

6 1366 x 768 47.7 60.00 84.62 WXGA

7 1280 x 1024 63.595 60.00 108.875 SXGA

8 1920 x 1080 66.647 59.988 138.625 WUXGA

8.2. DTV Mode

No

Specification

Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out

2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.

3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4 720 x 480 31.47 59.94 27 SDTV 480P

5 720 x 480 31.5 60.00 27.027 SDTV 480P

6 720 x 576 31.25 50.00 27 SDTV 576P

7 1280 x 720 44.96 59.94 74.176 HDTV 720P

8 1280 x 720 45 60.00 74.25 HDTV 720P

9 1280 x 720 37.5 50.00 74.25 HDTV 720P

10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I

11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I

12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I

13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P

14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P

15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P

16 1920 x 1080 27 24.00 74.25 HDTV 1080P

17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P

Only for training and service purposes

- 9 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LCD TV, LP91A/B/C/D chassis.

2. Specification

1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.

2) Adjustment must be done in the correct order.

3) The adjustment must be performed in the circumstance of 25 ±5 °C of temperature and 65±10% of relative humidity if there is no specific designation.

4) The input voltage of the receiver must keep 100~220V, 50/60Hz.

5) Before adjustment, execute Heat-Run for 5 minutes at RF no signal.

3. Adjustment items

3.1. PCB assembly adjustment items

(1) Download the MSTAR main software

(IC800, Mstar ISP Utility)

1) Using D/L Jig

2) Using USB Memory Stick. (2) Input Tool-Option/Area option. (3) Download the EDID

- EDID datas are automatically download when adjusting

the Tool Option2 (4) ADC Calibration – RGB / Component (4) Check SW Version.

3.2. SET assembly adjustment items

(1) Input Area option (2) Adjustment of White Balance : Auto & Manual (3) Input Tool-Option/Area option (4) Intelligent Sensor Inspection Guide (5) Preset CH information (6) Factoring Option Data input

4. PCB assembly adjustment method

4.1. Mstar Main S/W program download

4.1.1. Using D/L Jig (1) Preliminary steps

1) Connect the download jig to D-sub(RGB) jack

(2) Download steps

1) Execute ‘ISP Tool’ program, the main window(Mstar ISP utility Vx.x.x) will be opened

2) Click the “Connect” button and confirm “Dialog Box”

3) Click the “Config.” button and Change speed I2C Speed setting : 350Khz~400Khz

4) Read and write bin file.

Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.

- LH70

1

Filexxx.binFilexxx.bin

5) Click “(2)Auto” tab and set as below

6) Click “(3)Run”.

7) After downloading, you can see the “(4)Pass” message.

4.1.2. Using the Memory Stick * USB download : Service Mode

1) Insert the USB memory stick to the ISB port.

2) Automatically detect the SW Version.

-> S/W download process is executed automatically.

3) Show the message “Copy the file from the Memory”

4) After Finished the Download, Automatically DC Off -> On

5) Check The update SW Version.

4.2. Input tool option.

Adjust tool option refer to the BOM.

- Tool Option Input : PCBA Check Process

- Area Option Input : Set Assembly Process

After Input Tool Option and AC off Before PCBA check, you have to change the Tool option and have to AC off/on (Plug out and in) (If missing this process, set can operate abnormally)

(1) Profile : Must be changed the option value because being

different with some setting value depend on module maker, inch and market

(2) Equipment : adjustment remote control.

(3). Adjustment method

- The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.) (If not changed the option, the input menu can differ the model spec.)

Refer to Job Expression of each main chassis ass’y (EBTxxxxxxxx) for Option value Caution : Don’t Press “IN-STOP” key after completing the function inspection.

4.3. EDID D/L method

Recommend that don’t connect HDMI and RGB(D-SUB) cable when downloading the EDID. If not possible, recommend that connect the MSPG equipment. There are two methods of downloading the edid data

4.3.1. 1st Method EDID datas are automatically downloaded when adjusting the Tool Option2. Automatically downloaded when pushing the enter key after adjusting the tool option2. It takes about 2seconds.

4.3.2. 2nd Method * Caution :

Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not be downloaded well.

1) Press the ADJ key

2) Move to the EDID D/L and Press the right direction key(

G)

3) Press the right direction key(

G) at Start.

4) After about a few seconds, appear “OK”, then compele.

4.3.3. RS-232C command Method (1) Command : AE 00 10

* Caution

Don’t connect HDMI and RGB(D-SUB) cable when downloading the EDID. If the cables are connected, Downloading of edid could be failed.

- 10 -

Only for training and service purposes

1

Filexxx.bin

4.3.4. EDID data (1) Analog(RGB): 128bytes>

(2) HDMI 1 : 256Bytes

(3) HDMI 2 : 256Bytes

(4) HDMI 3 : 256Bytes

4.4. ADC Calibration

4.4.1. ADC Calibration - Component (Using External pattern) (1) Required Equipments

- Remote controller for adjustment

- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process

1) Change the Input to Component1 or 2 mode.

2) Input the Component 480i@60Hz 100% Color Bar YPbPr signal into Component1 or 2.

(MSPG-925F Model: 209 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.

4) Enter Password number. Password is “0 0 0 0”.

5) Select “0. ADC calibration : Component” by using

D/E

(CH +/-) and press ENTER(A).

6) ADC adjustment is executed automatically .

7) When ADC adjustment is finished, this OSD appear

4.4.2. ADC Calibration - RGB (Using External pattern) (1) Required Equipments

- Remote controller for adjustment

- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process

1) Change the Input to RGB mode..

2) Input the PC 1024x768@60Hz Horizontal Color Bar signal into RGB.

(MSPG-925F Model: 60 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.

4) Enter Password number. Password is “0 0 0 0”.

5) Select “0. ADC calibration : RGB” by using

D/E(CH +/-)

and press ENTER(

A).

6) ADC adjustment is executed automatically .

7) When ADC adjustment is finished, this OSD appear

- 11 -

Only for training and service purposes

OK

4.5. Check SW Version

(1) Method

1) Push In-star key on Adjust remote-controller.

2) SW Version check Check “SW VER : V3.xx” – LH70

5. PCB assembly adjustment method

5.1. Input Area-Option

(1) Profile : Must be changed the Area option value because

being different of each Country’s Language and

signal Condition. (2) Equipment : adjustment remote control. (3) Adjustment method

- The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.)

Refer to Job Expression of each main chassis ass’y (EBTxxxxxxxx) for Option value.

* White Balance Adjustment

- Purpose : Adjust the color temperature to reduce the deviation of the module color temperature.

- Principle : To adjust the white balance without the saturation,

Fix the one of R/G/B gain to 192 (default data) and decrease the others.

- Adjustment mode : Three modes – Cool / Medium / Warm

- Required Equipment

1) Remote controller for adjustment

2) Color Analyzer : CA100+ or CA-210 or same product LCD TV( ch : 9 ),

(should be used in the calibrated ch by CS-1000)

3) Auto W/B adjustment instrument(only for Auto adjustment)

5.2. Adjustment of White Balance

: (For automatic adjustment)

* LP91A~D Support RS-232C & I2C DDC Communication-

White Balance Mode.

(1) Enter the adjustment mode of DDC

- Set command delay time : 50ms

- Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key

- Maintain the DDC adjustment mode with same condition of Heat-run => Maintain after AC off/on in status of Heatrun pattern display)

(2) Release the DDC adjustment mode

- Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode

- Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment.

- Need to transmit the aging off command to TV set after finishing the adjustment.

- Check DDC adjust mode release by exit key and release DDC adjust mode)

(3) Enter the adjust mode of white balance)

- Enter the white balance adjustment mode with aging command (F3, 00, FF)

* Luminance min value is 150cd in the Cool/Medium/Warm

mode(For LCD)

5

.3. Adjustment of White Balance

(for Manual adjustment) (1) Color analyzer(CA100+, CA210) should be used in the

calibrated ch by CS-1000

(2) Operate the zero-calibration of the CA100+ or CA-210,

then stick sensor to the module when adjusting.

(3) For manual adjustment, it is also possible by the following

sequence.

1) Select white pattern of heat-run by pressing “POWER

ON” key on remote control for adjustment then operate heat run longer than 15 minutes. (If not executed this step, the condition for W/B may be different.)

2) Push “Exit” key.

3) Change to the AV mode by remote control.

4) Input external pattern (85% white pattern)

5) Push the ADJ key -> Enter “0000” (Password)

6) Select “3. W/B ADJUST”

7) Enter the W/B ADJUST Mode

8) Stick the sensor to the center of the screen and select

each items (Red/Green/Blue Gain and Offset) using

D/E(CH +/-) key on R/C..

9) Adjust R/ G/ B Gain using

F/G(VOL +/-) key on R/C.

10) Adjust three modes all (Cool / Medium / Warm) : Fix

the one of R/G/B gain and change the others

11) When adjustment is completed, Enter “COPY ALL”.

12) Exit adjustment mode using EXIT key on R/C.

- 12 -

Only for training and service purposes

* CASE

First adjust the coordinate far away from the target value(x, y).

1. x, y > target i) Decrease the R, G.

2. x, y < target i) First decrease the B gain, ii) Decrease the one of the others.

3. x > target, y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R

4. x < target, y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G

(4) Standard color coordinate and temperature when using the

CA100+ or CA210 equipment

To check the Coordinates of White Balance, you have to measure at the below conditions. Picture Mode : User 1 Dynamic Contrast : Off Dynamic Colour : Off (If you miss the upper condition, the coordinates of W/B can be lower than the spec.)

- 13 -

Only for training and service purposes

Coordinate

Mode

x y

Temp uv∆

Cool 0.276±0.002 0.283±0.002 11000K 0.000

Medium 0.285±0.002 0.293±0.002 9300K 0.000

Warm 0.313±0.002 0.329±0.002 6500K 0.003

Only for training and service purposes

- 14 -

TROUBLESHOOTING

No power

(LED indicator off)

Check 24V, 12V, 5,2V

of Power B/D

Check short of Main B/D

or Change Power B/D

Pass

Check Output of

IC1001, IC1003, IC1007

Check P307 Connector

Change LED Assy

:

[A] PROCESS

Fail

Pass

Check LED Assy

Change IC1002,, Q1003

Pass

Check short of IC1001,

IC1003, IC1007

Fail

Re-soldering or Change defect

part of IC1001, IC1003, IC1007

Fail

No Raster

[B]: Process

Check LED status

On Display Unit

Repeat A PROCESS

Pass

Fail

Check Output of IC802 Change IC802

Fail

Change Inverter Connector

Or Inverter

Fail

Pass

Fail

Pass

Change Module

Fail

Check LVDS Cable

Pass

Check Panel Link Cable

Or Module

Change Panel Link Cable

Or Module

Check Inverter Connector

Or Inverter

Pass

Only for training and service purposes

- 15 -

No Raster on PC Signal

Check Input source Cable

And Jack

Pass

Re-soldering or Change the defect part

Check the Input/Output

Of P401

Fail

Pass

Check the Input/Output

Of IC100

Re-soldering or

Change the defect part,

Check FFC cable

Fail

Pass

Re-soldering or

Change the defect part,

Check RGB EDID Data

Repeat [A], & [B] Process

Pass

Check the Input/Output

Of J104

Fail

Pass

Check the Input/Output

Of IC800

Fail

Re-soldering or

Change the defect part

Pass

No Raster on COMMPONENT Signal

Check Input source

Cable And Jack

Pass

Re-soldering or

Change the defect part

Check The input/Output

Of P401

Fail

Pass

Check the Input/Output

Of IC800

Re-soldering or

Change the defect part

Check FFC Cable

Fail

Pass

Re-soldering or

Change the defect part

Repeat [A], & [B] Process

Check The Input/Output

Of JK101

Fail

Pass

No Raster on HDMI Signal

Check Input source

Cable And Jack

Pass

Check the Input/Output

Of JK301, JK302, JK303

Fail

Re-soldering or

Change the defect part

Pass

Check the Input/Output

Of IC300, IC301, JK302

Fail

Re-soldering or Change the defect part Check HDMI EDID Data

Re-download HDCP

Pass

Check the Input/Output

Of IC800

Fail

Re-soldering or Change the defect part

Repeat [A], & [B] Process

Only for training and service purposes

- 16 -

No Sound

Check The Input Sourse

Check The Input/Output

Of IC600

Re-soldering or

Change the defect partFail

Pass

Check The Speaker

Change Speaker

Fail

Check The Speaker Wire

Pass

Change The Source Input

Fail

No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal

Check Input source

Cable And Jack

Pass

Check Input source

Cable And Jack

Pass

Check The Input/Output

Of JK101, JK201

Pass

Re-soldering or

Change the defect part

Pass

Fail

Pass

Check the Input/Output

Of P401

Fail

Re-soldering or

Change the defect part

Check FFC Cable

Repeat [A], & [B] Process

Pass

Check the Input/Output

Of IC800

Fail

Re-soldering or

Change the defect part

Pass

Check The Input/Output

Of TU500

Pass

Re-soldering or

Change the defect part

Pass

Fail

Check the Input/Output

Of P401

Fail

Re-soldering or

Change the defect part

Check FFC Cable

Pass

Check the Input/Output

Of IC800

Fail

Re-soldering or

Change the defect part

Repeat [A], & [B] Process

Only for training and service purposes

- 17 -

BLOCK DIAGRAM

RGB_PC

PC_Aud io

TV

(RF)

COMP1

HDMI1

HDMI2

HDMI3

RS232

TX

232C Driver

ST3232C

Tx/ Rx : ± 15Vpp

PC_R/G/B/HS/VS

PC_Aud io_L/ R :700mVrms

MNT_VOUT: 1Vpp

AV2_VIN : 1Vpp

AV2_LIN/ RIN :500mVrms

L_SPK_OUT

R_SPK_OUT

EEPROM

24C02

Comp 1_L/R :500mVrms

TUNER

AV1_VIN : 1Vpp

AV1_LIN/ RIN :500mVrms

PWM

NTP3100L

MNT_OUT

MNT_LOUT/ ROUT: 500mVrms

AV 2

MAIN SCALER

LGE376xA

TXD /RXD : 5V Digital

COMP1_Y/ Pb/ Pr: 1/0.7Vpp

COMP2_Y/ Pb/ Pr: 1/0.7Vpp

IR

HDMI_DATA_1

HDMI_DATA_2

TU_MAIN

S I F

COMP1_Y/ Pb/ Pr: 1/0.7Vpp

AV1_VIN

PC_Aud io_L/ R

COMP1_LIN/ RIN

L_CH

R_CH

FRC LVDS connector

TU_MAIN

M_SCL/ SDA

EEPROM

24C02

SIF

AV1_LIN/ RIN

MNT_L/ R OUT

AV1

MNT_OUT

Comp 2_L/R :500mVrms

COMP2_Y/ Pb/ Pr: 1/0.7Vpp

COMP2_LIN/ RIN

COMP2

PC_R/G/B/HS/VS

DDC_SCL1/SDA1

DDC_SCL1/SDA2

DDC_SCL1/SDA3

DSUB_SCL/SDA

MNT_VOUT

AV2_VIN

AV2_LIN/ RIN

IIS_OUT

USB USB_DP/DN

AUDIO

AMP

HDMI_DATA_3

TMDS

EEPROM

24C02

FULL HD LVDS co nn ecto r

FRC IC

LGE7329A

URSA_[C~D]

URSA_[ A:B]

OPC_EN

DDR2 SDRAM

(2*256MB)

Serial Flash

PSU

RL_ON/ I-DIM MI NG/ D IS P_EN

PANEL_STATUS

E-DIM

OPC_OUT

Bluetooth

Circuit

BLT_DP/DN

DDR2 SDRAM

(512MB)

EEPROM

(256K)

Serial Flas h

(8MByte)

EEPROM

for HDCP

(8K)

EEP_SCL/ SDA

MEMC_RXE2±

MEMC_RXE4±

MEMC_RXC3±

MEMC_RXC±

MEMC_RXE1±

MEMC_RXE0±

MEMC_RXO2±

MEMC_RXO4±

MEMC_RXO3±

MEMC_RXOC±

MEMC_RXO1±

MEMC_RXO0±

EEPROM

24C02

M_SCL/ SDA

- 18 -

Only for training and service purposes

300

200

200T

400

530

540

820

550

830

570

A5

801

805

804

803

802

806

900

910

120

560

122

123

301

310

500

580

A10

A2

510

200N

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TMDS2_RX1+

CAT24C02WI-GT3

IC302

3

A2

2

A1

4

VSS

1

A0

5

SDA

6

SCL

7

WP

8

VCC

DDC_SCL1

TMDS3_RX1-

2SC3875S

Q302

E

B

C

DDC_SDA1

100R306

TMDS1_RX2+

TMDS3_RX0+

2SC3875S

Q300

E

BC

10KR300

JP305

JP303

10KR301

1KR303

TMDS2_RX0+

TMDS3_RX2+

+5V_HDMI_3

100R331

100R307

TMDS2_RX2+

0.01uF

C302

TMDS1_RXC-

100R329

+5V_HDMI_1

DDC_SCL2

CEC

1KR302

DDC_SDA2

100R304

TMDS3_RXC-

TMDS1_RX0+

CAT24C02WI-GT3

IC301

3A2

2A1

4VSS

1A0

5 SDA

6 SCL

7WP

8 VCC

+5V_HDMI_2

KDS184S

D302

A1CA2

100R317

TMDS1_RX1+

TMDS2_RXC-

TMDS1_RXC+

CAT24C02WI-GT3

IC300

3

A2

2

A1

4

VSS

1

A0

5

SDA

6

SCL

7

WP

8

VCC

0.01uF

C301

CEC

JP302

2SC3875S

Q301

E

B

C

0.01uF

C300

TMDS2_RX0-

+5V_HDMI_2

KDS184S

D300

A1CA2

TMDS3_RXC+

DDC_SCL3

HPD_MST_2

DDC_WP

HPD_MST_1

TMDS2_RX2-

TMDS1_RX0-

TMDS3_RX0-

1KR314

KDS184S

D301

A1CA2

JP304

100R327

TMDS1_RX1-

TMDS1_RX2-

TMDS2_RX1-

+5V_HDMI_1

TMDS3_RX1+

HPD_MST_3

100R318

+5V_HDMI_3

100R305

CEC

TMDS3_RX2-

TMDS2_RXC+

10KR312

DDC_SDA3

DDC_WP

+5V_MULTI

CEC

0

R313

68K CEC_READY

R315

CEC_C

MMBD301LT1G 30V CEC_READY

D303

CDS3C30GTH 30V CEC_READY

D304

+3.3V_MST

BSS83

Q303

CEC_READY

S

B

D

G

YKF45-7058V

EAG59023302

JK303

1414

NC

1313

CEC

55

DATA1_SHIELD

20

1212

CLK-

1111

CLK_SHIELD

22

DATA2_SHIELD

1919

HPD

1818

+5V_POWER

1010

CLK+

44

DATA1+

11

DATA2+

1717

DDC/CEC_GND

99

DATA0-

88

DATA0_SHIELD

33

DATA2-

1616

SDA

77

DATA0+

66

DATA1-

1515

SCL

YKF45-7058V

EAG59023302

JK302

1414

NC

1313

CEC

55

DATA1_SHIELD

20

1212

CLK-

1111

CLK_SHIELD

22

DATA2_SHIELD

1919

HPD

1818

+5V_POWER

1010

CLK+

44

DATA1+

11

DATA2+

1717

DDC/CEC_GND

99

DATA0-

88

DATA0_SHIELD

33

DATA2-

1616

SDA

77

DATA0+

66

DATA1-

1515

SCL

YKF45-7054V

EAG59023301

JK301

1414

NC

1313

CEC

55

DATA1_SHIELD

20

1212

CLK-

1111

CLK_SHIELD

22

DATA2_SHIELD

1919

HPD

1818

+5V_POWER

1010

CLK+

44

DATA1+

11

DATA2+

1717

DDC/CEC_GND

99

DATA0-

88

DATA0_SHIELD

33

DATA2-

1616

SDA

77

DATA0+

66

DATA1-

1515

SCL

10K

R308

10K

R310

10K

R309

10K

R320

10K

R311

10K

R319

56000

READY

R316

EAX58298501 Mstar LCD LH70

2008/09/20H6 LH70

2 9INPUT-HDMI

HDMI3

HDMI2

HDMI1

USB_DP

USB_DN

+5V_USB

10uF OCP_READY

C204

30VD207

READY

30VD208

READY

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

0.1uF OCP_READY

C203

1K OCP_READY

R204

MIC2009YM6-TR

OCP_READYIC201

3ENABLE

2GND

4 FAULT/

1VIN6 VOUT

5 ILIMIT

4.7K OCP_READY

R205

KJA-UB-0-0037

JK200

1

2

3

4

5

120-ohm OCP_READY

L202

0

Non_OCP

R202

10uF

6.3V

C201

500

L200

0 R200

0

R201

100uF 16V

C200

100uF 16V

C202

100uF 16V

C205

KDS226

OCP_READY

D213

A

AC

C

510 OCP_READY

R238

160

OCP_READY

R203

DSUB_SDA

+5VST_MST

DSUB_SCL

100R119

4.7K

R128

0.01uF

C113

100R110

100R120

4.7K

R129

CAT24C02WI-GT3

IC100

3

A2

2

A1

4

VSS

1

A0

5

SDA

6

SCL

7

WP

8

VCC

4.7K

R154

READY

DDC_WP

USB

**1A Design

Its possibel to 27~47ohm

EAX58298501 Mstar LCD LH70

2008/09/20H6 LH70

1 9INPUT-USB

Pin to Pin with

EAN43439401

close to JK200

PC EDID

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

0.1uF

C411

+3.3V_MST

KEY2

120ohmL403

2SC3052

Q404

IR-OUT

EBC

+5VST_MST

IR

+3.3V_MST

2SC3052

Q405

IR-OUT

EBC

KEY1

22

IR-OUT

R430

ZD401

ESD_READY

47pF

C403

4.7K

R420

0.1uF

C408

470pF

C404

+3.3V_MULTI_MST

120ohmL406

10K

IR-OUT

R428

IR_OUT

500-ohmL411

0R403

4.7K

R421

SUB_SDA

0

R400

ZD400

ESD_READY

120ohmL402

0.1uF

C407

READY

500-ohmL410

ZD402

ESD_READY

SUB_SCL

+5VST_MST

10KIR-OUT

R427

47K

IR-OUT

R426

470pF

C412

+5VST_MST

10KIR-OUT

R429

0.1uF

C414

SPK_N

10KR404

0

R401

READY

0R402

47uF16V

C406

6630V90141J

P400

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

120-ohmL404

120-ohmL407

PC_AUD_R

PC_B

SIDE_LIN

S_VIDEO_DET

COMP2_L

COMP1_L

PC_AUD_L

M_SCL

TV_MAIN

COMP1_Y

MNT_LOUT

+5V_TUNER

COMP2_PR

MUTE_LINE

MNT_ROUT

IR_OUT

COMP2_R

COMP2_PB

DSUB_SDA

PC_G

PC_VS

COMP1_R

COMP2_Y

SIDE_V

SIDE_Y

+5V_MULTI

+3.3V_MST

CVBS_RIN

M_SDA

TXD

PC_R

COMP1_PR

PC_HS

SIDE_RIN

SIDE_C

502500-7011

P401

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

CVBS_VIN

MNT_VOUT

MAIN_SIF

RXD

DSUB_SCL

COMP1_PB

CVBS_LIN

CONTROL KEY

EAX58298501

Mstar LCD LH70

2008/09/20H6 LH70

3 9CONTROL & INTERFACE

INTERFACE

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

I2S_MCLK

SPK_L+

4.7K

R663

I2S_SCK

0.01uF

C671

M_SCL

0.1uF

C643

1uFC614

0R676

+1.8V_DVDD

0.01uF

C672

0.01uF

C647

I2S_WS

1000pF

C603

22000pF

C616

+1.8V_AVDD

SPK_R+

0.1uF

C607

SPK_L+

SPK_L-

4.7K

R628

0.1uF

C629

100R603

0.1uF

C610

100R601

390pF

C621

SPK_L-

0.1uF

C644

0.1uF

C626

+1.8V

1000pF

C606

+1.8V_AVDD

0R656

READY

3.3

R604

SPK_R+

+1.8V_DVDD

0.1uF

C605

+1.8V_DVDD

MULTI_PW_SW

0.1uF

C602

0.47uF

C673

0R673

390pF

C630

100R602

SPK_R-

1uF

C624

22000pF

C625

4.7K

R623

0.01uF

C648

0.1uF

C615

0.1uF

C669

+16V_NTP

1000pFC651

22000pFC611

100pF

C601

22000pFC623

0.01uF

C613

0.1uF

C617

+16V_NTP

390pF

C619

+1.8V_AVDD

SPK_R-

0.47uF

C632

1uF

C608

M_SDA

0R678

SW_RESET

1uF

C618

0R677

3.3K

R600

4.7K

R667

0.1uF

C637

I2S_SDO

390pF

C634

+3.3V_MULTI_MST

+3.3V_MULTI_AUD

3.3

R626

3.3

R635

3.3

R625

3.3

R671

12

R60512R606

12

R60812R610

12

R621

12

R658

12

R622

12

R624

10uF16V

C600

10uF16V

C604

68uF35V

C622

68uF35V

C620

68uF35V

C612

68uF35V

C627

10uF 16V

C609

NTP-3100L

EAN60664001

IC600

1 BST1A

2 VDR1A

3 RESET

4AD

5 DVSS_1

6 VSS_IO

7 CLK_I

8 VDD_IO

9 DGND_PLL

10 AGND_PLL

11 LFM

12 AVDD_PLL

13 DVDD_PLL

14 TEST0

15 DVSS_2

16 DVDD

17 SDATA

18 WCK

19 BCK

20 SDA

21 SCL

22 MONITOR_0

23 MONITOR_1

24 MONITOR_2

25 FAULT

26 VDR2B

27 BST2B

28 PGND2B_1

29PGND2B_2

30OUT2B_1

31OUT2B_2

32PVDD2B_1

33

PVDD2B_2

34

PVDD2A_1

35

PVDD2A_2

36

OUT2A_137OUT2A_2

38

PGND2A_1

39

PGND2A_2

40

BST2A

41

VDR2A

42

NC

43

VDR1B

44

BST1B

45

PGND1B_1

46

PGND1B_2

47

OUT1B_1

48

OUT1B_2

49

PVDD1B_1

50

PVDD1B_2

51PVDD1A_1

52PVDD1A_2

53OUT1A_1

54OUT1A_2

55PGND1A_1

56PGND1A_2

120-ohmL601

120-ohmL605

120-ohmL606

RT1C3904-T112

Q601

READY

E

B

C

10K

R611

READY

10K

READY

R607

+3.3V_MST

0R609

0R682

READY

MULTI_PW_SW

SMAW250-04Q

P600

123

4

5

33pF

50V

READY

C639

33pF

50V

READY

C638

AD-8770

EAP60684501

L607

2S

1S 1F

2F

AD-8770

EAP60684501

L603

2S

1S 1F

2F

22K

READY

R612

6800pF

C701

5.6KR705

5.6KR706

LM324D

IC701

3 INPUT1+

2 INPUT1-

4 VCC

1 OUT1

6 INPUT2-

5 INPUT2+

7 OUT2 8OUT3

9INPUT3-

10INPUT3+

11GND

12INPUT4+

13INPUT4-

14OUT4

1KR703

MNT_L_AMP

BLT_DP

+12V_AUDIO

RT1C3904-T112

Q700

EBC

MNT_LOUT

MNT_ROUT

0

R744

0.1uF

C709

0.01uF

C704

4.7K

R700

+3.3V_MULTI_MST

0R733

RT1C3904-T112

Q701

EBC

6.8K

R708

0R734

+12V_AUDIO

6.8K

R709

10KR707

33pF

C703

1KR702

12507WR-06L

P700

12345

6

7

4.7K

R701

BLT_DN

0.1uF

C707

+12V_AUDIO

33pF

C702

6800pF

C700

MNT_R_AMP

10KR704

SPK_L-

EAX58298501

Mstar LCD LH70

4 9AUDIO

H6 LH70 2008/09/20

AUDIO MAIN AMP

AMP :GAIN X 4

Chinese Hotel & BLUETOOTH Option(LH70)

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

1K

R889

56

AR806

47R817

470R835

0.1uFC805

0.047uFC829

100R882

0R812

4.7uFC820

10R848

0.1uFC849

47R804

+3.3V_MULTI_MST

10KR8003

56

AR805

0.01uFC863

100R8023

0.01uFC839

22R8006

HDCP_READY

33 AR818

0.01uF

C803

47R837

10R874

+3.3V_MULTI_MST

0.01uFC840

33R843

10R871

MNT_VOUT

+3.3V_MST

10R891

390R840

47R815

100R8 0 14 READY

MNT_VOUT_T

4.7K

R8028

0.047uFC855

56 AR813

RT1C3904-T112

Q802

EBC

0.1uFC844

56

AR810

402R807

READY

10R862

+1.8V_DDR

10R879

56 AR812

1000pFC835

0.047uFC828

0.047uFC851

0.1uFC853

1KR868

4.7K

R8004

HDCP_READY

+3.3V_MULTI_MST

100R881

0.047uFC826

SPI_DI

+1.2V_VDDC_MST

1000pFC818

0.047uFC832

100R8024

10R892

100R825

10R880

0.1uFC806

100R824

10R841

+1.8V

0.01uF

C859

0.01uFC876

220R808

47R834

4.7K

R877

+3.3V_MULTI_MST

+12V_AUDIO

100R850

4.7K

R878

100R828

56R852

+3.3V_MST

0.047uFC837

4.7KR864

0.1uFC804

56 AR800

470

R809

1M R839

100R8017

0.1uFC848

+3.3V_MULTI_MST

4.7K

R8010

READY

0R8034

10R858

10R872

1K

R883

10R820

22KR842

1K

R811

READY

10R873

+3.3V_MULTI_MST

SPI_CLK

100R827

0.1uFC883

CAT24WC08W-T

IC803

3A22A14

VSS

1

A0

5

SDA6SCL7WP8VCC

+3.3V_MULTI_MST

22R8005

HDCP_READY

+5VST_MST

0.047uFC827

EEP_SDA

56

AR809

1KR867

100R8025

100R847

READY

68

R810

4.7K

READY

R896

22KR845

47R832

EEP_SCL

+1.8V

100R895

EEP_SCL

10R854

10R823

DDR2_A[0-12]

4.7KR865

0.01uF

C864

SPI_DO

10KR8020

0.01uF

C858

0.047uFC831

0R8035

0.01uFC810

10R869

10R851

10R801

10R890

10R822

0.01uFC841

4.7KR866

0.1uFC819

0.047uF

C825

0.1uF

C811

1K

R884

READY

100R849

+1.2V_VDDC_MST

0.1uFC869

56 AR814

0.1uFC842

56 AR815

0.1uFC833

100R8016

4.7KR863

100R8 0 15 READY

0.1uFC838

0.047uFC834

10R856

0.1uFC882

4.7K

R898

0.1uFC808

0R813

0.01uF

C865

0.01uF

C860

100R826

0R8033 READY

100R829

100R846

READY

0.047uFC830

MX25L6405DMI-12G

IC802

3 NC_1

2 VCC

4 NC_2

1

HOLD

6 NC_4

5 NC_3

7CS8 SO/SIO1 9

WP/ACC

10GND

11NC_5

12NC_6

13NC_7

14NC_8

15SI.SIO0

16SCLK

EEP_SDA

+1.2V_VDDC_MST

4.7K

R8011

12MHz X801

0.01uFC850

+3.3V_MULTI_MST

100R8026

0.1uFC813

10R821

0.01uF

C807

10R859

DDC_WP

0.1uFC815

47R838

4.7K

R8027

24LC256-I/SM

IC801

24C64_Normal

3A22A14

VSS

1

A0

5

SDA6SCL7WP8VCC

SPI_CZ

33R844

+3.3V_MULTI_MST

DDR2_D[0-15]

0.047uFC852

0.01uF

C862

100R8012

1KR8038

100R8039

100R8040

15pFC816

15pFC817

22KR8002

0.01uFC877

22KR8009

0.01uFC878

10uF 16VC809

470R819 1000pFC854

0.01uF

C879

0.01uF

C880

0.01uF

C881

2.2uFC861

2.2uFC801

2.2uFC856

2.2uFC822

2.2uFC802

2.2uFC824

2.2uFC872

2.2uFC874

2.2uFC873

2.2uFC823

2.2uFC821

2.2uFC875

0R894

47R818

47R816

47R814

470R803

0.047uFC836

0.1uFC868

0.047uFC843

0.047uFC847

0.047uFC845

1000pFC846

47R875

10R857

10R802

10R897

47R833

47R836

0.01uF

C857

10R830

10R831

47R876

ISA1530AC1

Q801

EBC

4.7uF

C812

100R888

RL_ON

47uF 25V

C870

KDS181

D802

+5VST_MST

2.2uF

16V

C8000

READY

KDS181

D801

33K

R887

1KR860

ISA1530AC1

Q800

E

B

C

+5VST_MST

MULTI_PW_SW

RT1C3904-T112

Q803

EBC

150R885

KDS181

D803

JTP-1127WEM

SW800

1243

0.1uF

C814

10K

R855

SYS_RESET

POWER_DET

10K

R8000

+5VST_MST

33KR8007

10K

R8036

READY

RT1C3904-T112

Q804

E

B

C

0

R800

0

R8001

READY

P_12V P_16V

1KR8018

0R8013 0R899

47R8041

TMDS2_RXC-

TMDS2_RXC+

TMDS2_RX0-

TMDS2_RX0+

TMDS2_RX1-

TMDS2_RX1+

TMDS2_RX2-

TMDS2_RX2+

TMDS1_RXC-

TMDS1_RXC+

TMDS1_RX0-

TMDS1_RX0+

TMDS1_RX1-

TMDS1_RX1+

TMDS1_RX2-

TMDS1_RX2+

HPD_MST_2

HPD_MST_1

PC_B

PC_G

PC_R

COMP1_PB

COMP1_Y

COMP1_PR

COMP2_PB

COMP2_Y

COMP2_PR

CVBS_VIN

SIDE_V

TV_MAIN

MAIN_SIF

SIDE_LIN

SIDE_RIN

MNT_R_AMP

MNT_L_AMP

MNT_VOUT_T

CVBS_LIN

CVBS_RIN

COMP1_L

COMP1_R

COMP2_L

COMP2_R

PC_AUD_L

PC_AUD_R

TMDS3_RXC-

TMDS3_RXC+

TMDS3_RX0-

TMDS3_RX0+

TMDS3_RX1-

TMDS3_RX1+

TMDS3_RX2-

TMDS3_RX2+

HPD_MST_3

USB_DN

USB_DP

SPI_CLK

SPI_DI

SPI_DO

SPI_CZ

MEMC_RXEC+

MEMC_RXE3-

MEMC_RXE2-

MEMC_RXE3+

MEMC_RXE0-

MEMC_RXE2+

MEMC_RXE0+

I-DIM

MEMC_RXE4+

MEMC_RXE4-

MEMC_RXE1-

E-DIM

MEMC_RXE1+

MEMC_RXEC-

DDC_SDA2

DSUB_SDA

DDC_SCL1

DDC_SDA1

DDC_SCL2

DSUB_SCL

DDC_SCL3

DDC_SDA3

MEMC_RXO2+

MEMC_RXO1+

MEMC_RXO4-

MEMC_RXO0+

MEMC_RXO2-

MEMC_RXOC+

MEMC_RXOC-

MEMC_RXO3+

MEMC_RXO0-

MEMC_RXO3-

MEMC_RXO1-

MEMC_RXO4+

DDC_WP

SW_RESET

DISP_EN/VAVS_ON

PANEL_ON

SUB_SDA

SUB_SCL

MUTE_LINE

DDR2_DQM1

DDR2_DQM0

DDR2_DQS0P

DDR2_DQS0M

DDR2_DQS1P

DDR2_DQS1M

DDR2_MCLKZ

DDR2_MCLK

DDR2_ODT DDR2_RASZ DDR2_CASZ

DDR2_BA0

DDR2_BA1

DDR2_WEZ

DDR2_CKE

I2S_MCLK I2S_WS

I2S_SCK I2S_SDO RL_ON

TXD

EEP_SDA

RXD

EEP_SCL

KEY2

KEY1

POWER_DET

BLT_DN BLT_DP

SYS_RESET

CEC_C

IR

PC_HS PC_VS

DSUB_SDA

RXD

TXD

M_SCL M_SDA

POWER_SW

10R805

100R893

0R870

100R8022

100R8021

PANEL_STATUS

47R8042

0.047uFC800247R8019

0.047uFC8001

SIDE_Y

SIDE_C

MEMC_RESET

0R8008

OPC_EN

0R806

MODEL_OPT1

MODEL_OPT2

MODEL_OPT1 MODEL_OPT2

+3.3V_AVDD_AU

+3.3V_MULTI_MST

0.1uF

C867

10uF16V

C866

+3.3V_AVDD_33_DM

+3.3V_LPLL_VDDP

+3.3V_AVDD_33_DM

+3.3V_AVDD_AU

+3.3V_LPLL_VDDP

+3.3V_AVDD_33_DM

3.3KR8029

2K

R886

1KR8030 READY

RT1C3904-T112

Q805

EBC

DDC_WP

10K

R8031

1K

R853

S_VIDEO_DET

4.7KR8032

4.7uF

10V

C871

READY

0

R8037

1K

R861

SPK_N

0 R8043

0

R8044

0

R8045

READY

0

R8046

READY

LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ]

EAN60658901

IC800

1

RXBCKN

2

RXBCKP

3

RXB0N

4

RXB0P

5

HOTPLUGB

6

RXB1N

7

RXB1P

8

AVDD_33_1

9

RXB2N

10

RXB2P

11

RXACKN

12

RXACKP

13

RXA0N

14

RXA0P

15

AVDD_33_2

16

RXA1N

17

RXA1P

18

GND_1

19

RXA2N

20

RXA2P

21

HOTPLUGA

22

REXT

23

VCLAMP

24

REFP

25

REFM

26

BIN1P

27

SOGIN1

28

GIN1P

29

RIN1P

30

BINM

31

BIN0P

32

GINM

33

GIN0P

34

SOGIN0

35

RINM

36

RIN0P

37

AVDD_33_3

38

GND_2

39

BIN2P

40

GIN2P

41

SOGIN2

42

RIN2P

43

CVBS644CVBS545CVBS446CVBS347CVBS248CVBS1

49

VCOM1

50

CVBS0

51

VCOM0

52

AVDD_33_4

53

CVBSOUT

54

GND_3

55

SIF0P

56

SIF0M

57

VDDC_1

58

AUL5

59

AUR5

60

AUVRM

61

AUOUTL2

62

AUOUTR2

63

AUOUTL1

64

AUOUTR1

65

AUL0

66

AUR0

67

AUL1

68

AUR1

69

AUL2

70

AUR2

71

AUL3

72

AUR3

73

AUCOM

74

AUL4

75

AUR4

76

GND_4

77

AUVRP

78

AUVAG

79

AVDD_AU

80

GND_5

81

VDDC_2

82

DDCA_CK

83

DDCA_DA

84

DDCDA_CK

85

DDCDA_DA

86

DDCDB_CK

87

DDCDB_DA

88

GPIO20

89

VDDP_1

90

VDDC_3

91

UART2_RX

92

UART2_TX

93

DDCDC_CK

94

RXCCKN

95

RXCCKP

96

DDCDC_DA

97

RXC0N

98

RXC0P

99

GND_6

100

RXC1N

101

RXC1P

102

AVDD_DM

103

RXC2N

104

RXC2P

105

HOTPLUGC

106

USB1_DM

107

USB1_DP

108

SCK

109

SDI

110

SDO

111

SCZ

112

PWM0

113

PWM1

114

PWM2

115

PWM3

116

LVA4P

117

LVA4M

118

LVA3P

119

LVA3M

120

LVACKP

121

LVACKM

122

LVA2P

123

LVA2M

124

LVA1P

125

LVA1M

126

LVA0P

127

LVA0M

128

VDDP_2

129

LVB4P

130

LVB4M

131

LVB3P

132

LVB3M

133

LVBCKP

134

LVBCKM

135

LVB2P

136

LVB2M

137

LVB1P

138

LVB1M

139

LVB0P

140

LVB0M

141

AVDD_LPLL

142

GND_7

143

VDDC_4

144

GPIO150/I2C_OUT_MUTE

145

GPIO151/I2C_OUT_SD2

146

GPIO152/I2C_OUT_SD3

147

GND_8

148

GPIO51

149

GPIO52

150

GPIO53

151

GPIO54

152

GPIO55

153

GPIO56

154

GPIO57

155

GPIO58

156

VDDP_3

157

VDDC_5

158

B_MDATA[4]

159

B_MDATA[3]

160

GND_9

161

B_MDATA[1]

162

B_MDATA[6]

163

AVDD_DDR_1

164

B_MDATA[11]

165

B_MDATA[12]

166

GND_10

167

B_MDATA[9]

168

B_MDATA[14]

169

AVDD_DDR_2

170

B_DDR2_DQM[1]

171

B_DDR2_DQM[0]

172

GND_11

173

B_DDR2_DQS[0]

174

B_DDR2_DQSB[0]

175

AVDD_DDR_3

176

VDDP_4

177

GND_12

178

B_DDR2_DQS[1]

179

B_DDR2_DQSB[1]

180

AVDD_DDR_4

181

B_MDATA[15]

182

B_MDATA[8]

183

GND_13

184

B_MDATA[10]

185

B_MDATA[13]

186

AVDD_DDR_5

187

B_MDATA[7]

188

B_MDATA[0]

189

B_MDATA[2]

190

B_MDATA[5]

191

B_MCLK

192

B_MCLKZ

193

GND_14

194

AVDD_MEMPLL

195

MVREF

196

A_ODT

197

A_RASZ

198

A_CASZ

199

A_MADR[0]

200

A_MADR[2]

201

A_MADR[4]

202

GND_15

203

A_MADR[6]

204

A_MADR[8]

205

A_MADR[11]

206

A_WEZ

207

A_BADR[1]

208

A_BADR[0]

209

A_MADR[1]

210

A_MADR[10]

211

AVDD_DDR_6

212

A_MADR[5]

213

A_MADR[9]

214

A_MADR[12]

215

A_MADR[7]

216

A_MADR[3]

217

A_MCLKE

218

VDDC_6

219

I2S_IN_WS/GPIO67

220

I2S_IN_BCK/GPIO68

221

I2S_IN_SD

222

I2S_OUT_MCK

223

I2S_OUT_WS

224

VDDP_5

225

GND_16

226

VDDC_7

227

I2S_OUT_BCK

228

I2S_OUT_SD

229

SPDIFO

230

UART2_RX/I2CM_SDA

231

UART2_TX/I2CM_SCK

232

UART1_RX/GPIO86

233

UART1_TX/GPIO87

234

GND_17

235

GND_18

236

USB0_DM

237

USB0_DP

238

SAR0

239

SAR1

240

SAR2

241

SAR3

242

AVDD_MPLL

243

XOUT

244

XIN

245

GPIO134

246

GPIO135

247

GPIO138

248

GPIO139

249

GPIO140

250

IRIN

251

HSYNC0

252

VSYNC0

253

HSYNC1

254

VSYNC1

255

CEC

256

HWRESET

MEMC_RESET

MLB-201209-0120P-N2

L800

MLB-201209-0120P-N2

L801

MLB-201209-0120P-N2

L802

DDR2_A[10]

DDR2_A[2]

DDR2_A[8]

DDR2_A[7]

DDR2_D[10]

DDR2_A[11]

DDR2_D[1]

DDR2_A[4]

DDR2_D[4]

DDR2_D[0]

DDR2_A[1]

DDR2_A[0]

DDR2_D[14]

DDR2_A[3]

DDR2_D[12]

DDR2_D[15]

DDR2_D[9]

DDR2_D[2]

DDR2_D[11]

DDR2_D[5]

DDR2_A[9]

DDR2_A[12]

DDR2_D[6]

DDR2_A[5]

DDR2_D[3]

DDR2_D[7]

DDR2_D[13]

DDR2_A[6]

DDR2_D[8]

EAX58298501

Mstar LCD LH70

R8016:DSP_BSY

R8017:DSP_IRQ

I2S_OUT

SERIAL FLASH 8M

GAIN X 4

HDMI_1

HDCP EEPROM READY

[MODE SELECTION]

USB PART

C804/C805/C806:Close to IC

as close as possible

Close to IC as close as possible

HDMI_2

EEPROM

Close to IC

with width trace

HDMI_3

5 9MAIN Mstar

H6 LH70 2008/09/20

RESET

R8011

4.7K 4.7K

4.7K

4.7K X

X

R896

X

4.7K

Apollo

Small HD(19/22)

100HZ

X

4.7K

X4.7K

4.7K

X

4.7K

Non Small HD

X

**H/W OPTION

4.7KSmall FHD (27)

R8010

X

X 4.7K

Non Small FHD

R898

X

4.7K

Close to IC Pin

LGE Internal Use Only

DDR2_CASZ

0.01uFC909

1K

R908

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

DDR2_WEZ

DDR2_ODT

DDR2_A[0-12]

DDR2_BA1

0.01uFC916

0.01uFC913

DDR2_DQS0M

+1.8V_DDR

DDR2_DQS1M

56R903

0.01uFC914

150R906

READY

0.01uFC902

DDR2_CKE

0.01uFC915

0.01uFC906

0.01uFC903

0.01uFC911

0.01uFC910

DDR2_BA0

HYB18TC512160B2F-2.5

IC900

J 2 VREF

J8 CK

H2VSSQ2

B7 UDQS

N8 A4

P8 A8

L1 NC4

L2 BA0

R8 NC3

K7

RAS

F8VSSQ3

F3 LDM

P3 A9

M3 A1

N3 A5

K8

CK

R3 NC5

L3 BA1

J 7 VSSDL

L7

CAS

F2VSSQ4

B3 UDM

M2 A10/AP

K2 CKE

R7 NC6

M7 A2

N7 A6

M8 A0

J 1 VDDL

K3

WE

E8

LDQS

P7 A11

K9 ODT

A2 NC1

N2 A3

P2 A7

H8VSSQ1

F7 LDQS

A8

UDQS

R2 A12

L8

CS

E2 NC2

E7VSSQ5

D8VSSQ6

D2VSSQ7

A7VSSQ8

B8VSSQ9

B2VSSQ10

P9VSS1

N1VSS2

J3VSS3

E3VSS4

A3VSS5

G9VDDQ1

G7VDDQ2

G3VDDQ3

G1VDDQ4

E9VDDQ5

C9VDDQ6

C7VDDQ7

C3VDDQ8

C1VDDQ9

A9VDDQ10

R1VDD1

M9VDD2

J9VDD3

E1VDD4

A1VDD5

B9DQ15

B1DQ14

D9DQ13

D1DQ12

D3DQ11

D7DQ10

C2DQ9

C8DQ8

F9DQ7

F1DQ6

H9DQ5

H1DQ4

H3DQ3

H7DQ2

G2DQ1

G8DQ0

DDR2_MCLKZ

0.01uFC907

DDR2_MCLK

0.01uF

C900

0.01uFC912

56R900

56R904

DDR2_D[0-15]

DDR2_RASZ

DDR2_DQM1

0.01uFC917

1000pF

C905

56R901

56R902

0.01uFC901

56R905

0.01uFC908

1K

R907

0.01uF

C904

DDR2_DQM0

DDR2_DQS1P

DDR2_DQS0P

0.1uF 50V

C918

+1.8V_DDR

10uF 10V

C919

H5PS5162FFR-S6C

IC900-*1

J2

VREF

J8

CK

H2

VSSQ2

B7

UDQS

N8

A4

P8

A8

L1

NC4

L2

BA0

R8

NC3

K7

RAS

F8

VSSQ3

F3

LDM

P3

A9

M3

A1

N3

A5

K8

CK

R3

NC5

L3

BA1

J7

VSSDL

L7

CAS

F2

VSSQ4

B3

UDM

M2

A10/AP

K2

CKE

R7

NC6

M7

A2

N7

A6

M8

A0

J1

VDDL

K3

WE

E8

LDQS

P7

A11

K9

ODT

A2

NC1

N2

A3

P2

A7

H8

VSSQ1

F7

LDQS

A8

UDQS

R2

A12

L8

CS

E2

NC2

E7

VSSQ5

D8

VSSQ6

D2

VSSQ7

A7

VSSQ8

B8

VSSQ9

B2

VSSQ10

P9

VSS1

N1

VSS2

J3

VSS3

E3

VSS4

A3

VSS5

G9

VDDQ1

G7

VDDQ2

G3

VDDQ3

G1

VDDQ4

E9

VDDQ5

C9

VDDQ6

C7

VDDQ7

C3

VDDQ8

C1

VDDQ9

A9

VDDQ10

R1

VDD1

M9

VDD2

J9

VDD3

E1

VDD4

A1

VDD5

B9

DQ15

B1

DQ14

D9

DQ13

D1

DQ12

D3

DQ11

D7

DQ10

C2

DQ9

C8

DQ8

F9

DQ7

F1

DQ6

H9

DQ5

H1

DQ4

H3

DQ3

H7

DQ2

G2

DQ1

G8

DQ0

DDR2_D[13]

DDR2_D[2]

DDR2_D[15]

DDR2_D[14]

DDR2_D[12]

DDR2_A[11]

DDR2_D[10]

DDR2_A[12]

DDR2_D[8]

DDR2_D[9]

DDR2_A[10]

DDR2_D[7]

DDR2_D[6]

DDR2_A[9]

DDR2_D[5]

DDR2_D[4]

DDR2_A[8]

DDR2_A[7]

DDR2_A[6]

DDR2_A[4]

DDR2_A[5]

DDR2_A[3]

DDR2_A[2]

DDR2_A[1]

DDR2_D[1]

DDR2_D[3]

DDR2_A[0]

DDR2_D[0]

DDR2_D[11]

DDR2 MEMORY

Close to DDR2 IC

#9.DDR2

Close to DDR2 IC

EAX58298501 Mstar LCD LH70

6 9MAIN DDR

H6 LH70 2008/09/20

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

RL_ON

OPC_OUT2

0 NON_LGD

R1053

P_16V

10KR1047

0.01uF

C1007

I-DIM

+5VST_MST

1.2K

R1005

10K

R1002

0.1uF

C1001

READY

C1020

0.01uF

C1008

SAM2333

LD1002

P_12V

2SC3875S

Q1002

123

0.01uF

C1046

+5VST_MST

P_12V

+16V_NTP

+12V_AUDIO

P_12V

P_5V

+5V_MULTI

0.1uF

READY

C1024

P_16V

10uF16V

C1003

P_16V

0

READY

R1066

10KR1003

DISP_EN/VAVS_ON

2SC3875S

Q1000

123

P_5V

0

SBL

R1067

P_5V

+5V_MULTI

47uF 25V

C1002

0.01uF

C1011

OPC_OUT1

2.2uF 16V

C1045

READY

0.01uF

C1021

+5V_MULTI

+12V_LCD

P_12V

10KR1006

10uF 25V

C1031

+5V_MULTI

2K

R1009

RT1C3904-T112

Q1004

EBC

33K

R1049

0R1073

10uF

C1016

BD9130EFJ-E2

IC1001

3

ITH

2

VCC

4

GND

1

ADJ

5

PGND6SW7PVCC8EN

0.1uF

C1015

1uF25V

C1047

10uF 16V

C1019

1.6K

R1069

+1.8V_DDR

PANEL_ON

22K

R1070

+5V_USB

+5V_TUNER

100uF16V

C1009

10KR1068

0.1uF

C1054

3.3K

R1010

+5V_MULTI

10uF

C1022

10uF 25V

C1030

+5V_MEMC

+5V_MULTI

P_12V

0.1uF

C1014

RT1C3904-T112

Q1001

EBC

0.1uF

C1005

+1.2V_VDDC_MST

P_5V

+3.3V_MULTI_MST

10uF 16V

C1000

0.01uF

C1010

MP2212DN

IC1006

3IN

2 GND

4BS

1FB

5VCC

6SW_1

7SW_2

8EN/SYNC

0.1uF

C1023

+1.8V

33K

R1065

0.1uF

C1026

10KR1048

1uF

C1048

POWER_SW

SI4925BDY

EBK32753101

Q1003

3S22G14

G2

1

S1

5

D2_16D2_27D1_18D1_2

10uF 16V

C1029

100uF 16V

C1028

1uF 25V

C1035

+5VST_MST

AP2121N-3.3TRE1

IC1007

1

GND

2VOUT3 VIN

0.01uF

C1053

+3.3V_MST

10uF 16V

C1052

30K

R1057

5.6K

R1058

100uF 16V

C1017

12KR1008

560pF

C1012

10KR1001

2.2uF

C1044

AZ1085S-3.3TR/E1

IC1003

1

ADJ/GND

2

OUTPUT

3

INPUT

AP1117EG-13

IC1002

1

ADJ/GND

2

OUT

3

IN

2.2K

R1051

2.2K

R1050

2.2K

R1052

68uF35V

C1006

PANEL_STATUS

10uF 16V

C1013

10uF 16V

C1004

10uF 16V

C1018

10uF 16V

C1025

3.6uHL1009500L1008

500L1003

500L1000

300

R1004

150

R1007

FM20020-24

P1000

19 NC

1412V

9 5.2V

4GND

1824V

13 12V

85.2V

3 GND

17 24V

12GND

7 5.2V

2Power_On

16GND

11 GND

6GND

1NC

20INV_ON

15 GND

105.2V

5 GND

21 A.DIM 22Err_Out

23 NC 24PWM_DIM

25

120-ohmL1001

120-ohmL1004

120-ohmL1005

120-ohm

L1006

120-ohmL1007

120-ohmL1010

120-ohmL1012

120-ohmL1013

120-ohm

MEMC

L1014

3K

R1046

2.2uHL1002

10K

R1045

1K

R1011

68uF

35V

READY

C1027

10K

R1059

2K

R1018

0.1uF

C1032

0.1uF

C1034

2.2K R1000

0.1uF

C1036

1uF 25V

READY

C1038

1uF 25V

READY

C1039

1uF 25V

READY

C1040

1uF 25V

READY

C1041

1uF 25V

READY

C1037

1K

R1012

10

R1019

0

R1056

READY

0

R1055

0.1uF

C1033

2008/09/20H6 LH70

7 9POWER

LED Block

EAX58298501

Mstar LCD LH70

**DC-DC CONVERTER_READY

12V->5V_TUNER/USB

MAX 2A

MAX 3A

700mA + 415mA

**5V_MULTI-->1.2V

DDR2, Vref

**Switch 12V:P12V

**Switch 5V:5V_MULTI -> 1.8V

R1

**5V_MULTI->3.3V->1.8V

MAX 1A

V0 = 0.8*(1+(R2/R1))

NTP,AUDIO DSP

OUT:3.3V

MAX 3A

OUT:5V

OUT:1.27V

*ST 5V->3.3V

R2

V0 = 1.25*(1+(R2/R1))

R2

R1

Close to Q1003

LGE Internal Use Only

10uF 10VC1126

0.1uFC1132

+3.3V_MEMC

0.1uFC1108

+3.3V_MEMC

1000pFC1151

ISP_TXD_TR

0.1uFC1145

0.01uF

C1133

+3.3V_MEMC

0.1uF

C1105

W25X20AVSNIG

IC1101

3

WP

2DO

4GND

1

CS

5 DIO

6 CLK

7

HOLD

8 VCC

1K

R1114

0.1uF

C1149

0.1uFC1142

10uF

C1121

1uFC1135

56R1125

ISP_RXD_TR

M_XTALO

0.1uF

C1131

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

M_SPI_CK

120-ohmL1104

+3.3V_MEMC

0.1uF

C1141

120-ohm

L1101

+1.26V_MEMC

10uFC1117

10K

R1111

10KR1122

22uFC1139

M_SPI_DI

120-ohmL1102

0.1uFC1125

0.1uFC1113

1MR1124

10uFC1140

M_SPI_DO

0.1uF

C1107

10uF

C1116

10uF 16VC1150

M_XTALI

15pF

C1147

+3.3V_MEMC

0.1uF

C1109

0.1uF

C1138

+12V_LCD

0R1109

56R1121

0.1uFC1112

0.1uF

C1136

22uF 16VC1115

0.1uFC1110

820R1110

12MHz

X1101

MEMC_DQ[0-15]

0.1uFC1118

0.1uFC1152

0.1uF

C1134

0.1uFC1111

M_SPI_CZ

120-ohmL1103

+3.3V_MEMC

1K

READY

R1117

0.1uFC1106

+3.3V_MEMC

0.1uF

C1137

+3.3V_MEMC

10K

R1103

10uFC1127

1KR1101

MEMC_A[0-12]

0.1uF

C1128

120-ohm

L1105

10uF 10VC1120

56R1120

1K

READY

R1102

0.1uFC1143

10K

R1104

56R1126

0.1uF

C1130

0.1uF

C1146

MEMC_DQ[16-31]

1uF

C1103

1K

R1116

0.1uFC1119

0.1uFC1123

+3.3V_MEMC

22uF 16VC1104

0.1uF

C1129

0.1uF

C1114

BLM18PG121SN1D

L1106

0.1uFC1144

+1.8V_MEMC

0.1uFC1101

LVDS_SEL

0.1uF

C1122

AFLC_EN

15pF

C1148

0.1uF

C1102

0.1uF

C1124

1K

READY

R1115

E-DIM

OPC_OUT1

OPC_OUT2

OPC_EN

4.7K

READY

R11290READY

R1132 0R1130

READY

0 READYR1143

0 READYR1142

0 READYR1141

0R1119

READY

0 READYR1140

0R1113 VESA

0 READY

R1137

0R1136

NOT_SBL

4.7K

READY

R1135

4.7K

READY

R1134

4.7K

READY

R1133

4.7K

READY

R1118

4.7K

READY

R1131

4.7KR1112

JEIDA

22R1139

22

SBL

R1123

100R1108

100R1107

22R1138

0

OPC_DIS

R1144

0

OPC_EN

R1145

100

R1146

100

R1147

100

R1148

100

R1149

100

R1150

100

R1151

100

R1156

100

R1155

100

R1152

100

R1157

100

R1154

100

R1153

ISP_RXD_TR

M_SDA

M_SCL

LED_DEMO

LVDS_SEL

AFLC_EN

MEMC_DQM3

MEMC_DQM2

MEMC_DQS2

MEMC_DQSB2

MEMC_DQS3

MEMC_DQSB3

MEMC_MCLK

MEMC_MCLKZ

MEMC_ODT

MEMC_RASZ

MEMC_CASZ

MEMC_WEZ

MEMC_BA1

MEMC_BA0

MEMC_MCLKE

MEMC_DQM1

MEMC_DQM0

MEMC_DQS0

MEMC_DQSB0

MEMC_DQS1

MEMC_DQSB1

MEMC_MCLK1

MEMC_MCLKZ1

MEMC_RESET

M_SPI_CK

M_SPI_DI

M_SPI_DO

M_SPI_CZ

M_XTALI M_XTALO

MEMC_RXO4MEMC_RXO4+ MEMC_RXO3MEMC_RXO3+ MEMC_RXOCMEMC_RXOC+ MEMC_RXO2MEMC_RXO2+ MEMC_RXO1MEMC_RXO1+ MEMC_RXO0MEMC_RXO0+

MEMC_RXE4MEMC_RXE4+ MEMC_RXE3MEMC_RXE3+ MEMC_RXECMEMC_RXEC+ MEMC_RXE2MEMC_RXE2+ MEMC_RXE1MEMC_RXE1+ MEMC_RXE0MEMC_RXE0+

URSA_B4M

URSA_B4P

URSA_B3M

URSA_B3P

URSA_BCKM

URSA_BCKP

URSA_B2M

URSA_B2P

URSA_B1M

URSA_B1P

URSA_B0M

URSA_B0P

URSA_A4M

URSA_A4P

URSA_A3M

URSA_A3P

URSA_ACKM

URSA_ACKP

URSA_A2M

URSA_A2P

URSA_A1M

URSA_A1P

URSA_A0M

URSA_A0P

URSA_D4M

URSA_D4P

URSA_D3M

URSA_D3P

URSA_DCKM

URSA_DCKP

URSA_D2M

URSA_D2P

URSA_D1M

URSA_D1P

URSA_D0M

URSA_D0P

URSA_C4M

URSA_C4P

URSA_C3M

URSA_C3P

URSA_CCKM

URSA_CCKP

URSA_C2M

URSA_C2P

URSA_C1M

URSA_C1P

URSA_C0M

URSA_C0P

ISP_TXD_TR

URSA_D1P

URSA_BCKP

URSA_B2P

URSA_CCKP

URSA_D4P

URSA_D2M

URSA_C2P

URSA_C0P

URSA_C3M

URSA_C4P

URSA_BCKM

URSA_C3P

URSA_B4P

URSA_DCKP

URSA_C1P

URSA_C4M

URSA_B3P

URSA_DCKM

URSA_D4M

URSA_C0M

URSA_D0P

URSA_B2M

URSA_D3P

URSA_B4M

URSA_D1M

URSA_C1M

URSA_D0M

URSA_C2M

URSA_B3M

URSA_CCKM

URSA_D3M

URSA_D2P

URSA_B0P

URSA_A2M

URSA_ACKM URSA_ACKP

URSA_A4P

URSA_A2P

URSA_A3M

URSA_A1M

URSA_B1M

URSA_A1P

URSA_A4M

URSA_A0P

URSA_A3P

URSA_A0M

URSA_B0M

URSA_B1P

LED_DEMO

CB3216PA501E

L1107

0R1106

0R1105

[E1]

[D1]

[L9]

[N5]

[N4]

[N12]

[N13]

LGE7329A

EAN60659201

IC1100

E1 SDAS

D1 SCLS

F1 GPIO[8]

G1 GPIO[9]

K8 GND_14

E5 VDDC_1

E2 GPIO[10]

F2 GPIO[11]

F3 GPIO[12]

G2 GPIO[13]

M4 GPIO[22]

M5 GPIO[23]

G3 GPIO[14]

E4 GPIO[15]

F4 GPIO[16]

G4 GPIO[17]

H4 GPIO[18]

J4 GPIO[19]

K4 GPIO[20]

L4 GPIO[21]

J6 VDDP_2

H9 GND_7

F6 VDDC_2

H1 MDATA[20]

H2 MDATA[19]

H3 MDATA[17]

J1 MDATA[22]

J2 MDATA[27]

J3 MDATA[28]

K1 MDATA[25]

K2 MDATA[30]

K6 AVDD_DDR_2

K3 DQM[3]

L1 DQM[2]

J8 GND_10

L2 DQS[2]

L3 DQSB[2]

L6 AVDD_DDR_4

L8 VDDP_3

H10 GND_8

M1 DQS[3]

M2 DQSB[3]

L7 AVDD_DDR_5

M3 MDATA[31]

N1 MDATA[24]

J9 GND_11

N2 MDATA[26]

N3 MDATA[29]

L10 AVDD_DDR_6

P1 MDATA[23]

R1 MDATA[16]

T1 MDATA[18]

T2 MDATA[21]

R2 MCLK[0]

P2 MCLKZ[0]

G7 GND_1

L9 AVDD_MEMPLL

N5 MVREF

N4 ODT

T3

RASZ

R3

CASZ

P3

MADR[0]

T4

MADR[2]

R4

MADR[4]

J10

GND_12

P4

MADR[6]

T5

MADR[8]

R5

MADR[11]

P5

WEZ

T6

BADR[1]

R6

BADR[0]

P6

MADR[1]

T7

MADR[10]

L11

AVDD_DDR_7

R7

MADR[5]

P7

MADR[9]

T8

MADR[12]

R8

MADR[7]

P8

MADR[3]

N8

MCLKE

K10

GND_16

F7

VDDC_3

T9

MDATA[4]

R9

MDATA[3]

K7

GND_13

P9

MDATA[1]

T10

MDATA[6]

K11

AVDD_DDR_3

R10

MDATA[11]

P10

MDATA[12]

T11

MDATA[9]

R11

MDATA[14]

J11

AVDD_DDR_1

P11

DQM[1]

T12

DQM[0]

R12

DQS[0]

P12

DQSB[0]

H11

VDDP_1

T13

DQS[1]

R13

DQSB[1]

P13

MDATA[15]

T14

MDATA[8]

R14

MDATA[10]

P14

MDATA[13]

T15

MDATA[7]

R15

MDATA[0]

P15

MDATA[2]

T16

MDATA[5]

R16

MCLK[1]

P16

MCLKZ[1]

N9

GPIO[26]

N10

GPIO[27]

N11

GND_17

M11

RESET

G6

VDDC_4

N12GPIO[28]

N13

GPIO[29]

N14

GPIO[30]

L13

SCK

M13

SDI

M12

SDO

K13

CSZ

L12

PWM1

K12

PWM0

J13

GPIO[0]

H13

GPIO[1]

G13

GPIO[2]

F13

GPIO[3]

E13

GPIO[4]

F12

GPIO[5]

D14

GPIO[6]

E12

GPIO[7]

N6

GPIO[24]

H6

VDDC_5

N15

LVD4M

N16

LVD4P

M14

LVD3M

M15

LVD3P

F8

AVDD_33_1

M16

LVDCKM

L16

LVDCKP

L15

LVD2M

L14

LVD2P

G9

GND_3

K14

LVD1M

J14

LVD1P

J16

LVD0M

J15

LVD0P

H15

LVC4M

H16

LVC4P

H14

LVC3M

G14

LVC3P

G16

LVCCKM

G15

LVCCKP

F15

LVC2M

F16

LVC2P

F14

LVC1M

E14

LVC1P

E16

LVC0M

E15

LVC0P

G10

GND_4

F9

AVDD_33_2

D16

LVB4M

D15

LVB4P

C16

LVB3M

B16

LVB3P

A16

LVBCKM

A15

LVBCKP

B15

LVB2M

C15

LVB2P

D2

GPIO_3

E3

GPIO_10

E10

GPIO_11

D10

GPIO_7D8GPIO_5

D12REXT

C14LVB1M C13LVB1P A13LVB0M B13LVB0P D7GPIO_4 D9GPIO_6 B12LVA4M A12LVA4P C12LVA3M C11LVA3P A11LVACKM B11LVACKP B10LVA2M A10LVA2P C10LVA1M C9LVA1P A9LVA0M B9LVA0P

F10AVDD_PLL G8GND_2 D11GPIO_8 D13GPIO_9 E11GPIO_12 N7GPIO[25] D6SCLM D5SDAM A14GPIO_1 B14GPIO_2 D3XIN D4XOUT K16GPIO_14 K15GPIO_13 H7GND_5 G11AVDD_LVDS_2 B8RO0N A8RO0P C8RO1N C7RO1P A7RO2N B7RO2P B6ROCKN A6ROCKP C6RO3N C5RO3P A5RO4N B5RO4P H8GND_6 F11AVDD_LVDS_1 B4RE0N A4

RE0P C4RE1N C3RE1P A3RE2N B3RE2P B2RECKN A2RECKP C2RE3N C1RE3P A1RE4N B1RE4P

GND_9

J7

GND_15K9

RT1C3904-T112

Q1101

EBC

470

R1127

+3.3V_MULTI_MST

1K OPC_ENR1128

TF05-41S

P1102

1234567891011121314151617181920212223242526272829303132333435363738394041

42

TF05-51S

P1101

123456789101112131415161718192021222324252627282930313233343536373839404142434445464748495051

52

SMAW250-04Q

P1103

123

4

5

1K

READY

R1159

1K

READY

R11001KR1158

1K

R1160

+3.3V_MEMC

0

READY

R1161

MEMC_DQ[8]

MEMC_DQ[13]

MEMC_DQ[4]

MEMC_A[1]

MEMC_A[12]

MEMC_A[4]

MEMC_DQ[0]

MEMC_DQ[9]

MEMC_DQ[18]

MEMC_DQ[16]

MEMC_DQ[27]

MEMC_A[10]

MEMC_DQ[19]

MEMC_DQ[1]

MEMC_DQ[14]

MEMC_DQ[29]

MEMC_DQ[7]

MEMC_A[6]

MEMC_A[7]

MEMC_DQ[2]

MEMC_DQ[6]

MEMC_A[8]

MEMC_A[2]

MEMC_DQ[31]

MEMC_DQ[5]

MEMC_DQ[12]

MEMC_DQ[17]

MEMC_DQ[20]

MEMC_A[5]

MEMC_A[0]

MEMC_A[9]

MEMC_DQ[23]

MEMC_DQ[11]

MEMC_DQ[28]

MEMC_A[3]

MEMC_DQ[3]

MEMC_DQ[22]

MEMC_DQ[25]

MEMC_A[11]

MEMC_DQ[26]

MEMC_DQ[24]

MEMC_DQ[21]

MEMC_DQ[15]

MEMC_DQ[30]

MEMC_DQ[10]

MVREF

LOW

HIGH

HIGH HIGH

XTAL

SPI FLASH

SP I HIGH

HIGHHIGH

HIGH

EEPROM

PWM0PWM1

LOWI2C

GPIO8

EAX58298501

Mstar LCD LH70

2008/09/20H6 LH70

8 9MEMC & LVDS Out

Closed to IC1100

LGE Internal Use Only

22AR1208

MEMC_DQ[16-31]

0.1uF

C1240

1000pF

C1239

56R1209

MEMC_WEZ

DDRA_A[0-12]

0.1uFC1216

MEMC_MCLK1

0.1uF

C1252

0.1uFC1206

A_URSA_BA0

56AR1214

MEMC_RASZ

56AR1202

MEMC_BA1

MEMC_BA0

MEMC_DQM3

DDRA_A[0-12]

0.1uFC1209

0.1uFC1223

MEMC_DQM0

0.1uFC1210

10uFC1227

22R1203

22AR1207

0.1uF

C1241

MEMC_MCLKE

MEMC_DQSB2

56AR1215

A_URSA_WEZ

A_URSA_CASZ

22AR1205

MEMC_ODT

B_URSA_RASZ

A_URSA_CASZ

+1.8V_MEMC_DDR

0.1uF

C1220

0.1uFC1229

17.4K 1%R1232

1K 1%

R1222

MEMC_MCLK

56R1217

MEMC_A[0-12]

MEMC_DQS0

+1.8V_MEMC_DDR

A_URSA_BA1

0.1uFC1231

0.1uFC1226

0.1uFC1237

MEMC_DQM2

0.1uF 16V

C1221

1K 1%

R1221

B_URSA_RASZ

22AR1212

22R1204

BLM18PG121SN1D

L1201

56R1216

0.1uFC1219

22R1212

MEMC_CASZ

+1.8V_MEMC_DDR

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

56R1214

0.1uFC1238

B_URSA_WEZ

150

READY

R1201

A_URSA_RASZ

0.1uFC1217

150READY

R1220

22AR1210

22R1213

B_URSA_BA1

1000pF

C1242

1K 1%

R1223

MEMC_DQS1

56AR1204

A_URSA_MCLKE

B_URSA_CASZ

22R1202

0.1uFC1230

A_URSA_WEZ

1K 1%

R1224

10uFC1203

56R1205

22AR1217

56R1215

+1.8V_MEMC

MEMC_DQS2

0.1uFC1233

+1.8V_MEMC_DDR

0.1uF

C1201

22R1211

56AR1203

0.1uFC1228

56R1210

MEMC_MCLKE

A_URSA_RASZ

56R1206

B_URSA_BA1

MEMC_DQSB0

0.1uFC1207

22AR1209

MEMC_DQSB3

56R1208

56R1218

56R1207

B_URSA_MCLKE

0.1uF

C1250

MEMC_MCLKZ

10uFC1212

A_URSA_BA1

0.1uFC1208

10uF 10V

C1202

22AR1211

0.1uFC1236

DDRB_A[0-12]

MEMC_RASZ

+1.8V_MEMC_DDR

0.1uFC1234

MEMC_ODT

56AR1213

56AR1216

+1.8V_MEMC

MEMC_DQ[0-15]

10uF 10V

C1249

MEMC_DQS3

MEMC_MCLKZ1

MEMC_DQM1

0.1uFC1235

0.1uFC1205

0.1uFC1204

+1.8V_MEMC_DDR

56R1219

22AR1206

B_URSA_MCLKE

B_URSA_WEZ

0.1uFC1224

HYB18TC256160BF-2.5

IC1202

J2VREF

J8CK

H2 VSSQ_2

B7UDQS

N8A4

P8A8

L1NC_4

L2BA0

R8NC_3

K7

RAS

F8 VSSQ_3

F3LDM

P3A9

M3A1

N3A5

K8

CK

R3NC_5

L3BA1

J7VSSDL

L7

CAS

F2 VSSQ_4

B3UDM

M2A10/AP

K2CKE

R7NC_6

M7A2

N7A6

M8A0

J1VDDL

K3

WE

E8

LDQS

P7A11

K9ODT

A2NC_1

N2A3

P2A7

H8 VSSQ_1

F7LDQS

A8

UDQS

R2A12

L8CS

E2NC_2

E7 VSSQ_5

D8 VSSQ_6

D2 VSSQ_7

A7 VSSQ_8

B8 VSSQ_9

B2 VSSQ_10

P9 VSS_1

N1 VSS_2

J3 VSS_3

E3 VSS_4

A3 VSS_5

G9 VDDQ_1

G7 VDDQ_2

G3 VDDQ_3

G1 VDDQ_4

E9 VDDQ_5

C9 VDDQ_6

C7 VDDQ_7

C3 VDDQ_8

C1 VDDQ_9

A9 VDDQ_10

R1 VDD_1

M9 VDD_2

J9 VDD_3

E1 VDD_4

A1 VDD_5

B9 DQ15

B1 DQ14

D9 DQ13

D1 DQ12

D3 DQ11

D7 DQ10

C2 DQ9

C8 DQ8

F9 DQ7

F1 DQ6

H9 DQ5

H1 DQ4

H3 DQ3

H7 DQ2

G2 DQ1

G8 DQ0

DDR_DQ[0-15]

0.1uFC1214

DDR_DQ[0-15]

56AR1201

DDR_DQ[16-31]

+1.8V_MEMC_DDR

MEMC_CASZ

MEMC_DQSB1

0.1uFC1225

MEMC_BA1

DDRB_A[0-12]

+1.8V_MEMC_DDR

0.1uFC1215

MEMC_BA0

A_URSA_BA0

B_URSA_BA0

0.1uFC1213

B_URSA_BA0

10uFC1222

B_URSA_CASZ

22AR1218

DDR_DQ[16-31]

HYB18TC256160BF-2.5

IC1201

J2 VREF

J8 CK

H2VSSQ_2

B7 UDQS

N8 A4

P8 A8

L1 NC_4

L2 BA0

R8 NC_3

K7

RAS

F8VSSQ_3

F3 LDM

P3 A9

M3 A1

N3 A5

K8

CK

R3 NC_5

L3 BA1

J7 VSSDL

L7

CAS

F2VSSQ_4

B3 UDM

M2 A10/AP

K2 CKE

R7 NC_6

M7 A2

N7 A6

M8 A0

J 1 VDDL

K3

WE

E8

LDQS

P7 A11

K9 ODT

A2 NC_1

N2 A3

P2 A7

H8VSSQ_1

F7 LDQS

A8

UDQS

R2 A12

L8 CS

E2 NC_2

E7VSSQ_5

D8VSSQ_6

D2VSSQ_7

A7VSSQ_8

B8VSSQ_9

B2VSSQ_10

P9VSS_1

N1VSS_2

J3VSS_3

E3VSS_4

A3VSS_5

G9VDDQ_1

G7VDDQ_2

G3VDDQ_3

G1VDDQ_4

E9VDDQ_5

C9VDDQ_6

C7VDDQ_7

C3VDDQ_8

C1VDDQ_9

A9VDDQ_10

R1VDD_1

M9VDD_2

J9VDD_3

E1VDD_4

A1VDD_5

B9DQ15

B1DQ14

D9DQ13

D1DQ12

D3DQ11

D7DQ10

C2DQ9

C8DQ8

F9DQ7

F1DQ6

H9DQ5

H1DQ4

H3DQ3

H7DQ2

G2DQ1

G8DQ0

0.1uFC1211

MEMC_WEZ

BLM18PG121SN1D

L1202

0.1uF

C1218

0.1uFC1232

1KR1230

100uF16V

C1251

10uF 16V

C1260

18nF 16V

C1259

10K1%

R1231

1uF

C1264

0.1uF

C1262

0.1uF

C1261

0.1uF

C1248

BD9130EFJ-E2

IC1203

3

ITH

2

VCC

4

GND

1

ADJ

5

PGND6SW7PVCC8EN

10KR1227

39K1%

R1228

30K 1%

R1229

+3.3V_MEMC

22uF

C1244

0R1233

+1.8V_MEMC

+5V_MEMC

+1.8V_MEMC

+1.26V_MEMC

100uF

C1243

0.1uF

C1267

10

R1234

47R1226

10uF 16V

C1258

MP2212DN

IC1205

3IN

2 GND

4BS

1FB

5VCC

6SW_1

7SW_2

8EN/SYNC

10nF

C1256

10uF 16V

C1257

10uF 25V

C1254

0.1uF

C1246

10uF 25V

C1253

1uF 25V

C1255

10KR1235

+3.3V_MEMC

+5V_MEMC

P_12V

39K

R1236

12K

R1237

330pF

C1245

18KR1225

22uF

C1247

3.6uHL1204

500

L1206

500

L1205

APE8953MP

IC1204

3VOUT_1

2FB

4VOUT_2

1GND

5 VIN

6 VCNTL

7 POK

8EN

2.2uH L1203

DDR_DQ[24]

DDR_DQ[7]

DDRB_A[8]

MEMC_DQ[10]

DDR_DQ[10]

MEMC_A[0]

DDR_DQ[17]

DDRA_A[10]

DDR_DQ[12]

MEMC_DQ[0]

DDRA_A[1]

MEMC_DQ[23]

DDR_DQ[29]

DDR_DQ[27]

MEMC_DQ[17]

DDRA_A[11]

DDRB_A[9]

DDR_DQ[23]

DDRB_A[3]

MEMC_DQ[28]

MEMC_DQ[6]

DDR_DQ[23]

DDR_DQ[3]

MEMC_A[8]

DDR_DQ[28]

DDR_DQ[9]

DDRB_A[1]

DDR_DQ[15]

DDR_DQ[3]

MEMC_A[8]

DDRA_A[9]

DDRA_A[5]

DDRB_A[8]

DDR_DQ[13]

MEMC_A[9] DDRA_A[9]

DDR_DQ[29]

MEMC_A[3]

MEMC_A[7]

DDRA_A[4]

DDRA_A[2]

DDRB_A[5]

DDRB_A[11]

DDRB_A[10]

MEMC_DQ[31]

DDR_DQ[5]

MEMC_A[12]

DDR_DQ[21]MEMC_DQ[21]

MEMC_DQ[2]DDR_DQ[19]

DDRA_A[12]

MEMC_DQ[22]

DDRB_A[6]

MEMC_A[1]

DDRB_A[0]

DDR_DQ[11]

DDR_DQ[26]

DDR_DQ[8]

DDRB_A[4]

MEMC_A[12]

MEMC_A[7]

MEMC_A[11]MEMC_DQ[18]

DDRA_A[6]

DDRB_A[9]

DDR_DQ[2]

MEMC_A[2]

MEMC_A[10]

MEMC_DQ[30]

MEMC_DQ[16]

DDRA_A[5]

MEMC_DQ[20]

MEMC_DQ[8]

DDRA_A[4]

DDR_DQ[8]

MEMC_A[3]

DDR_DQ[26]

MEMC_DQ[29]

DDRA_A[1]

DDR_DQ[9]DDRB_A[4]

DDR_DQ[4]

MEMC_DQ[26]

DDR_DQ[6]

DDRB_A[3]

DDRB_A[12]

DDRB_A[10]

DDR_DQ[19]

MEMC_DQ[3]

MEMC_DQ[25]

DDR_DQ[4]

DDRA_A[7]

MEMC_A[6]

DDRA_A[0]

DDR_DQ[13]

DDRB_A[0]

DDR_DQ[27]

DDR_DQ[22]

DDR_DQ[10]

DDR_DQ[7]

DDR_DQ[12]

MEMC_A[4]

DDRA_A[8]

DDR_DQ[11]MEMC_A[0]

MEMC_DQ[12]

DDRB_A[2]

DDR_DQ[1]

MEMC_DQ[14]

DDR_DQ[0]

MEMC_DQ[4]

DDRB_A[1]

MEMC_DQ[24]

DDRA_A[12]

DDRB_A[2]

MEMC_A[10]

MEMC_DQ[7]

DDRA_A[3]

DDRB_A[11]

DDR_DQ[5]

DDRB_A[6]

DDR_DQ[30]

MEMC_DQ[1]

DDRA_A[11]

DDR_DQ[25]

DDR_DQ[2]

DDR_DQ[14]

DDRA_A[2]

DDR_DQ[25]

DDR_DQ[6]

DDR_DQ[18]

DDRA_A[7]DDRB_A[7]

MEMC_A[5]

DDRB_A[12]

DDRB_A[7]

DDR_DQ[16]

DDR_DQ[15]

MEMC_A[1]

MEMC_DQ[9]

MEMC_A[9]

DDR_DQ[14]

DDRA_A[6]

DDRA_A[3]

MEMC_DQ[19]

DDR_DQ[20]

DDR_DQ[18]

DDRA_A[10]

DDR_DQ[31]

DDR_DQ[17]

DDR_DQ[1]

DDR_DQ[28]

DDR_DQ[20]

DDRA_A[8]

DDRB_A[5]

DDR_DQ[31]

DDR_DQ[0]

MEMC_A[4]

MEMC_A[2]

MEMC_DQ[15]DDR_DQ[16]

DDR_DQ[22]

MEMC_DQ[27]

MEMC_DQ[11]

DDR_DQ[21]

DDRA_A[0]

MEMC_A[6]

DDR_DQ[30]

MEMC_DQ[5]

MEMC_DQ[13]

DDR_DQ[24]

MEMC_A[5]

MEMC_A[11]

2A

+1.8V_MEMC for DDR

DDR2 1.8V By CAP - Place these Caps near Memory

1300 mA @85% efficiency

EAX58298501

Mstar LCD LH70

600 mA

400mA + 600mA

1000 mA @85% efficiency

+1.26V Core for MEMC

233 mA+400mA+600mA

Close to IC1204

2008/09/20H6 LH70

9 9MEMC_DDR & POWER

MAX 2A

R2

V0 = 0.8(1+R1/R2)

R1

+3.3V_MEMC

MAX 3A

Vo=0.8(1+R1/R2)

R1

R2

V0 = 0.8(1+R1/R2)

R1

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

120OHM

L501

10uH

L502

READY

C504

READY

M_SCL

10uF 16V

C508

+5V_TUNER

82pF

C507

READY

0.01uF

C501

220

R506

+5V_TUNER

120OHM

L500

READY

MAIN_SIF

4.7K

R502

0.01uF

50V

C503

47R504

TV_MAIN

M_SDA

220

R507

27pF

C502

47R505

27pF

C500

100uF 16V

C509

100uF 16V

C510

100uF 16V

C511

TAFT-Z203D

TU500

PAL_TUNER

14 NC_5

1 3 V-OUT

5 RF_AGC

12 NC_4

1 1 MOPLL_AS

2 GND_1

19 NC_8

18 NC_7

10 SCL

4 NC_2

1 NC_1

17 NC_6

9 SDA

8 GND_2

3 +B[5V]

16 SIF-OUT

7 NC_3

6 TP[3.3V_OPT]

1 5 A-OUT

21

SHIELD

20 NC_9

TAFT-H203F

TU500-*1

NTSC_TUNER

14

NC_5

13

V-OUT

5

RF_AGC

12

NC_4

11

MOPLL_AS

2

GND_1

19

NC_8

18

NC_7

10

SCL

4

NC_2

1

NC_1

17

NC_6

9

SDA

8

GND_2

3

+B[5V]

16

SIF-OUT

7

NC_3

6

TP[3.3V_OPT]

15

A-OUT

21

SHIELD

20

NC_9

ISA1530AC1

Q502

E

B

C

CVBS_VIN

DSUB_SCL

COMP2_R

PC_VS

+5V_TUNER

TXD

+5V_MULTI

DSUB_SDA

COMP1_R

PC_AUD_R

COMP2_PB

MUTE_LINE

PC_AUD_L

COMP2_PR

+3.3V_MST

COMP1_Y

COMP2_Y

M_SCL

+5V_MULTI

MNT_VOUT

SIDE_LIN

PC_HS

COMP1_PB

MAIN_SIF

COMP1_PR

SIDE_V

M_SDA

CVBS_LIN

MNT_LOUT

TV_MAIN

PC_R

+5V_TUNER

IR_OUT

CVBS_RIN

MNT_ROUT

S_VIDEO_DET

SIDE_RIN

501951-7019

P401

19

14

9

4

18

13

8

3

17

12

7

2

16

11

6

1

20

15

10

5

2122

2324

2526

2728

2930

3132

3334

3536

3738

3940

4142

4344

4546

4748

4950

5152

5354

5556

5758

5960

6162

6364

6566

6768

6970

71

RXD

COMP2_L

SIDE_C

SIDE_Y

COMP1_L

PC_B

PC_G

+3.3V_MST

1 2

TUNER

MStar 2 008. 5. 20

Near the pin

INTERFACE

UNER

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

10K

R132

SD05

ESD_READY

ZD105

75

R101

COMP1_Y

75

R126

0.1uF

C117

4.7K

R111

PC_HS

SD05 ESD_READY

ZD200

0.1uF

C118

SD05 ESD_READY

ZD102

COMP1_L

ENKMC2837-T112

D127

A

AC

C

75

R212

10K

R215

220K

R100

CDS3C30GTH

30V

D107

ESD_READY

RT1C3904-T112

Q201

E

B

C

12K

R140

RT1C3904-T112

Q200

E

B

C

12K

R218

SD05 ESD_READY

ZD201

10K

R139

SD05 ESD_READY

ZD109

100uF 16VC204

PEJ024-01

JK102

6B

T_TERMINAL28SHIELD_PLATE

7B

B_TERMINAL2

5

T_SPRING

4

R_SPRING

7A

B_TERMINAL1

6A

T_TERMINAL1

3

E_SPRING

COMP1_R

ENKMC2837-T112

D128

A

AC

C

12K

R136

DSUB_SCL

SD05 ESD_READY

ZD106

MUTE_LINE

DSUB_SDA

220K

R130

PC_AUD_L

4.7K

R112

SD05

ESD_READY

ZD100

SD05 ESD_READY

ZD107

12K

R137

MNT_VOUT

75

R125

10K

R133

75

R127

SD05 ESD_READY

ZD108

10uF

16V

C201

COMP2_PR

COMP2_L

12K

R117

MNT_ROUT

12K

R118

10K

R138

220K

R122

SD05 ESD_READY

ZD103

12K

R219

6630TGA004K

KCN-DS-1-0089

JK104

1

RED2GREEN3BLUE4GND_15DDC_GND

6

RED_GND7GREEN_GND8BLUE_GND9NC10SYNC_GND

11

GND_212DDC_DATA13H_SYNC14V_SYNC15DDC_CLOCK

16

SHILED

220K

R131

10K

R113

10K

R114

+5V_MULTI

PC_G

COMP1_PB

COMP1_PR

75

R210

ENKMC2837-T112

D126

A

AC

C

220K

R211

COMP2_Y

75

R109

SD05

ESD_READY

ZD101

COMP2_R

CDS3C30GTH

30V

D110

ESD_READY

0.1uF

C119

220K

R214

220K

R104

12K

R141

PC_R

100pF

READY

C200

75

R103

CVBS_RIN

PC_AUD_R

CVBS_LIN

10K

R217

PC_VS

0R206

NON_HOTEL_OPT

MNT_LOUT

SD05

ESD_READY

ZD104

75

R108

PC_B

COMP2_PB

MUTE_LINE

10uF

16V

C202

75

R102

220K

R121

CVBS_VIN

75

R107

CDS3C30GTH

30V

D121

ESD_READY

SIDE_RIN

4.7K

R123

ST3232CDR

IC101

3

C1-

2V+4

C2+

1

C1+

6V-5

C2-

7

T2OUT

8

R2IN

9

R2OUT10T2IN11T1IN12R1OUT13R1IN14T1OUT15GND16VCC

CDS3C30GTH

30V

D122

ESD_READY

0.1uF

C108

220K

R222

READY

SIDE_LIN

10KR225

0.1uF

C107

KCN-DS-1-0088

JK103

1

2

3

4

5

6

7

8

9

10

SIDE_V

0.1uF

C109

TP131

4.7K

R124

RXD

100

R145

12K

R228

100

R144

+3.3V_MST

12K

R226

TXD

220K

R223

READY

5.6B ZD203

ESD_READY

5.6B

ZD202

ESD_READY

IR_OUT

0.1uF

C106

10KR224

+3.3V_MST

75

R227

PPJ148-07

JK201

2 [YL]O-SPRING

1 [YL]GND

3 [YL]CONTACT

4 [WH]GND

5 [WH]C-LUG-L

6 [RD]GND

7 [RD]O-SPRING

8 [RD]CONTACT

30V

D101

ESD_READY

30V

CDS3C30GTH

D100

ESD_READY

30V

D114

ESD_READY

30V

D115

ESD_READY

30V

D201

NON_HOTEL_OPT

30V

D200

NON_HOTEL_OPT

30V

D203

ESD_READY

30V

D204

ESD_READY

30V

D206

ESD_READY

30V

D205

ESD_ESD_READY

CDS3C30GTH

30V

D119

ESD_READY

CDS3C30GTH

30V

D120

ESD_READY

SIDE_C

SD05

READY

ZD110

+3.3V_MST

75

R106

SIDE_Y

10K

R115

75

R105

SD05

READY

ZD111

30V

READY

D102

OPT

READY

C101

S_VIDEO_DET

30V

READY

D103

PSJ014-01

JK105

READY

GND

6

1

C-LUG12C-LUG230-SPRING4C-LUG35C-LUG4

SHIELD7

PPJ225-01

JK101

9J [GN]E-LUG

4A [GN]O-SPRING-S

3A [GN]CONTACT-S

9K [BL]E-LUG

8B [BL]C-LUG-S

9L [RD]E-LUG_1

8C [RD]C-LUG-S

9M [WH]E-LUG_1

8D [WH]C-LUG-S_1

9N [RD]E-LUG_2

4E [RD]O-SPRING-S_1

3E [RD]CONTACT-S_1

9P [YL]E-LUG

4F [YL]O-SPRING-S

3F [YL]CONTACT-S

9Q [WH]E-LUG_2

8G [WH]C-LUG-S_2

9R [RD]E-LUG_3

4H [RD]O-SPRING-S_2

3H [RD]CONTACT-S_2

5J[GN]O-SPRING-L

6J[GN]CONTACT-L

7K[BL]C-LUG-L

7L[RD]C-LUG_L

7M[WH]C-LUG-L_1

5N[RD]O-SPRING-L_1

6N[RD]CONTACT-L_1

5P[YL]O-SPRING-L

6P[YL]CONTACT-L

7Q[WH]C-LUG-L_2

5R[RD]O-SPRING-L_2

6R[RD]CONTACT-L_2

68

R11068R116

68pF

C100

68pF

C102

IR_OUT

2

A-TUNER/AV IN / OUT

MStar

2

2008. 5. 20

POP NOISE

COMPONENT1/2, AV1, MNT_OUT[JACK PACK TYPE C

COMPONENT2MNT_OUT

AV1COMPONENT1

PC

**MULTI ITEM

1.24C02-SUB:0IMMRAL014D

2.ENKMC2837-SUB:0DS226009AA

[KDS226]

PC SOUND

AV2RS-232C (CI ITEM)

S-VIDEO(LH30(China))

LGE Internal Use Only

Feb., 2009

Printed in KoreaP/NO : MFL60021524

LG 32LH70YR User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual