Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse(or Fusible Resistor) in this TV receiver is blown, replace
it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as “anti-static” can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°
F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
This specification sheet is applied to all of the LCD TV with
LD01R chassis.
2. Designation
1) The adjustment is according to the order which is designated
and which must be followed, according to the plan which can
be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 ºC ± 5 ºC
Relative humidity : 65 % ± 10 %
Input voltage : 220 V, 60 Hz
6) Adjustment equipments: Color Analyzer (CA-210 or CA-
110), Pattern Generator(MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, Service remote control.
7) Push the “IN STOP” key - For memory initialization.
3. Main PCB check process
* APC - After Manual-Insert, executing APC
* Boot file Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message.
If “Error” is displayed, Check connection between
computer, jig, and set.
3) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”.
4) Click “Connect” tab. If “Can’t” is displayed, check connection
between computer, jig, and set.
5) Click “Auto” tab and set as below.
6) Click “Run”.
7) After downloading, check “OK” message.
* USB DOWNLOAD(*.epk file download)
1) Put the USB Stick to the USB socket.
2) Automatically detecting update file in USB Stick
- If version of update file in USB Stick is Lower, it didn’t
work. But version of update file is Higher, USB data is
automatically detecting.
3) Show the message “Copying files from memory”
(4) Updating is starting.
(5) After updating is complete, the TV will restart automatically.
(6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In this case, you have to
channel recover. If all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
Case1 : Software version up
1. After downloading S/W by USB, TV set will reboot
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at first.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
(2)
(3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
filexxx.bin
(4)
(5)
(7) .OK
(6)
(1)
fil exxx.bi n
Page 10
* After downloading, have to adjust Tool Option again.
(1) Push “IN-START” key in service manual control.
(2) Select ‘Tool Option 1’ and push ‘OK’ key.
(3) Punch in the number. (Each models has their number.)
(4) Correction Tool option is completed.
3.1. ADC Process
• Enter ‘EZ ADJUST’ mode by pushing ‘ADJ’ key,
• Enter Internal ADC mode by pushing ‘G’ key at “7. ADC
Calibration”.
<Caution> Using ‘P-ONLY’ key of the Adjustment remote
control, power on TV.
* ADC Calibration Protocol (RS232)
Adjust Sequence
• aa 00 00 [Enter Adjust Mode]
• xb 00 40 [Component1 Input (480i)]
• ad 00 10 [Adjust 480i Comp1]
• xb 00 60 [RGB Input (1024*768)]
• ad 00 10 [Adjust 1024*768 RGB]
• aa 00 90 End Adjust mode
* Required equipment : Adjustment Remote control
3.2. EDID Download
1) After Enter Service Mode by pushing ‘ADJ’ key,
2) Enter EDID D/L mode.
3) Enter ‘START’ by pushing ‘OK’ key.
<Caution> Never connect HDMI & D-sub cable when EDID
50 6E 28 55 00 A0 5A 00 00 00 1E 00 00 00 FD 00 3A
60 3E 1F 46 10 00 0A 20 20 20 20 20 20d
70d00e
Model NameHEXEDID TableDDC Function
HD/FHD Model000101 00Analog/Digital
MODELMODEL NAME(HEX)
LG TV00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
EDID C/S dataFHDHD
HDMIRGBHDMIRGB
Check sum Block 0E2EDB4CD
(Hex)5F(HDMI1)75(HDMI1)
Block 1 4F(HDMI2)65(HDMI2)
3F(HDMI3)55(HDMI3)
INPUTMODEL NAME(HEX)
HDMI1 6503C001000
HDMI2 6503C002000
HDMI36503C003000
Page 11
3.4. Function Check
(1) Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV
3) COMPONENT1/2 (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In
* Display and Sound check is executed by remote control.
<Caution> Not to push the INSTOP key after completion if the
function inspection.
4. Total Assembly line process
4.1. Adjustment Preparation
· W/B Equipment condition
CA210
- CCFL/EEFL -> CH 9, Test signal : Inner pattern(80 IRE)
- LED -> CH 14, Test signal : Inner pattern(80 IRE)
· Above 5 minutes H/run in the inner pattern. (“power on” key
of adjustment remote control)
· Edge LED W/B Table in process of aging time(Only LGD
Module)
CA210 : CH14, Test signal : Inner patter (80 IRE)
* Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER ON -> Enter
the mode of White-Balance, the pattern will come out
* Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10 lux).
2) Adhere closely the Color Analyzer (CA210) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80º ~ 100º).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 15minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
• Auto adjustment Map(RS-232C)
RS-232C COMMAND
[CMD ID DATA]
Wb 0000White Balance Start
Wb 00ffWhite Balance End
** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)
* Manual W/B process using adjusts Remote control.
• After enter Service Mode by pushing “ADJ” key,
• Enter White Balance by pushing “
G
” key at “8. White
Balance”.
* After done all adjustments, Press “In-start” key and
compare Tool option and Area option value with its BOM, if
it is correctly same then unplug the AC cable. If it is not
same, then correct it same with BOM and unplug AC cable.
For correct it to the model’s module from factory Jig model.
* Push the “IN STOP” key after completing the function
inspection. And Mechanical Power Switch must be set “ON”.
Step 1) Turn on the TV set.
Step 2) Press “EYE” key on Adjustment remote control.
Step 3) Cover the Eye Q sensor at the front of set for 6 seconds.
Step 4) Check the value of Sensor Data. It must be below 10.
If not so, the Eye Q sensor may have some defect.
Change the Eye Q sensor.
Step 5) Wait for 6 seconds after withdrawing form the Eye Q
sensor.
Step 6) Check the value of Backlight. It must rise.
If not so, the Eye Q sensor may have some defect.
Change the Eye Q sensor.
* EYE-Q Test is except for LV23xx/LK33x/LK43x series.
4.3. Outgoing condition Configuration
- When pressing IN-STOP key by Service remote control, Red
LED are blinked alternatively. And then automatically turn
off. (Must not AC power OFF during blinking)
5. GND and HI-POT Test
5.1. GND & HI-POT auto-check preparation
Check the Power cable and Signal cable insertion condition
5.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (Power cord / AV cord is tightly
inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX.)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically.
5.3. Checkpoint
(1) Test voltage
- GND: 1.5 KV / min at 100 mA
- SIGNAL: 3 KV / min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = Power cord GND and Signal cord GND.
- Hi-pot Test = Power cord GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5 mArms
6. Model name & Serial number D/L
• Press “Power on” key of service remote control.
(Baud rate : 115200 bps)
• Connect RS232 Signal Cable to RS-232 Jack.
• Write Serial number by use RS-232.
• Must check the serial number at the Diagnostics of SET UP
menu(Refer to below.)
6.1. Signal TABLE
CMD : A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 +…+ Data_n
Delay : 20ms
6.2. Command Set
* Description
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,
Phase
Data write: Model name and Serial number write in EEPROM,.
6.3. Method & notice
A. Serial number D/L is using of scan equipment.
B. Setting of scan equipment operated by Manufacturing
Technology Group.
C. Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0.
If the TV set is downloaded by OTA or Service man, sometimes
model name or serial number is initialized.(Not always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the ‘Instart’ key of Adjustment remote control.
2) Go to the menu ‘6.Model Number D/L’ like below photo.
3) Input the Factory model name(ex 32LV3400-ZG) or Serial
number like photo.
4) Check the model name Instart menu. -> Factory name
displayed. (ex 32LV3400-ZG)
5) Check the Diagnostics. (DTV country only) -> Buyer model
displayed. (ex 32LV3400)
7. CI+ Key Download method
(1) Download Procedure
1) Press “Power on” key of a service remote control.
(Baud rate : 115200 bps)
2) Connect RS232-C Signal Cable.
3) Write CI+ Key through RS-232-C.
4) Check whether the key was downloaded or not at ‘In
Start’ menu. (Refer to below.)
=> Check the Download to CI+ Key value in LGset.
(1) Check the method of CI+ Key value.
a. Check the method on Instart menu.
b. Check the method of RS232C Command.
1) Into the main assembly mode (RS232 : aa 00 00)
2) Check the key download for transmitted command.
(RS232 : ci 00 10)
3) Result value
- normally status for download : OKx
- abnormally status for download : NGx
(2) Check the method of CI+ Key value.(RS232)
1) Into the main ass’y mode (RS232 : aa 00 00)
2) Check the method of CI+ key by command
(RS232 : ci 00 20)
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
300
200
810
540
400
900
800
521
A4
LV1
120
500
511
510
A5
A2
A21
A6
A10
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
PCM_A[0-7]
NC_29
NC_28
NC_27
NC_26
I/O8
I/O7
I/O6
I/O5
NC_25
NC_24
NC_23
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O4
I/O3
I/O2
I/O1
NC_19
NC_18
NC_17
NC_16
R140-*1
2.2K
R141-*1
2.2K
R11122
R11222
C106
8pF
OPT
<CHIP Config(LED_R/BUZZ)>
Boot from SPI CS1N(EXT_FLASH) 1’b0
Boot from SPI_CS0N(INT_FLASH) 1’b1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TU3701
TDFR-C036D
CN_2INPUT_H_LG3911
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC[IF_TP]
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
31
SHIELD
RF_S/W_CNTL
1
BST_CNTL
2
+B1[+5V]
3
NC[RF_AGC]
4
NC_1
5
SCLT
6
SDAT
7
NC_2
8
SIF
9
NC_3
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
NC_4
16
SCL
17
SDA
18
ERR
19
SYNC
20
VALID
21
MCL
22
D0
23
D1
24
D2
25
D3
26
D4
27
D5
28
D6
29
D7
30
close to TUNER
R3705 0
C3701
0.1uF
16V
R3707
C3706
0.1uF
16V
C3702
0.1uF 16V
C3737
100pF
50V
FULL_NIM
R3702 100
R3701 100
close to IF line
FULL_NIM
RF_SW_OPT
0
OPT
close to TUNER
+1.2V/+1.8V_TU
FULL_NIM
C3738
0.1uF
16V
C3705
100uF
16V
+5V_TU
C3704
C3703
0.1uF
100pF
16V
50V
CN
C3739
10uF
6.3V
close to the tuner pin, add,09029
Pull-up can’t be applied
because of MODEL_OPT_2
C3728
0.1uF
16V
OPT
C3707
100pF
50V
HALF_NIM
R3760 0
R3761 0
HALF_NIM
Close to the tuner
RF_SWITCH_CTL
Q3704
2SC3052
OPT
+3.3V_TU
C3708
0.1uF
16V
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM_CHINA
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM_CHINA
Close to the CI Slot
FULL_NIM_BR
+5V_TU
L3701
BOOSTER_OPT
BLM18PG121SN1D
BOOSTER_OPT
R3734
0
Q3701
BOOSTER_OPT
ISA1530AC1
E
C
C3709
0.01uF
25V
GPIO must be added.
C3731
10uF
10V
OPT
C
B
E
OPTION : RF AGC
R3754
10K
OPT
R3732
100
FE_AGC_SPEED_CTL
IF_AGC_SEL
TU_I2C_NON_FILTER
+3.3V_TU
R3733
100K
C3710
0.1uF
16V
TU_I2C_NON_FILTER
TUNER_RESET
C3711
18pF
50V
TU_IIC_NON_ATSC_SANYO
33
TU_I2C_NON_FILTER
33
TU_I2C_NON_FILTER
C3713
18pF
50V
TU_I2C_FILTER
C3711-*1
20pF
50V
TU_I2C_FILTER
TU_I2C_FILTER
R3735-*1
MLG1005SR27JT
R3704 100
C3716
0.1uF
16V
HALF_NIM
should be guarded by ground
BOOSTER_OPT
R3740-*1
1K
TU_IIC_ATSC_SANYO
R3735
R3736
C3742
20pF
50V
C3713-*1
20pF
50V
TU_I2C_FILTER
TU_I2C_FILTER
R3736-*1
MLG1005SR27JT
IF_AGC_MAIN
C3712
22pF
50V
FULL_NIM
+3.3V_TU
R3740
1.2K
C3743
20pF
50V
TU_I2C_FILTER
C3714
22pF
50V
B
BOOSTER_OPT
TU_IIC_ATSC_SANYO
R3741
1.2K
R3742
4.7K
FULL_NIM
FULL_NIM
R3737
2.2K
TU_IIC_NON_ATSC_SANYO
Q3702
2SC3052
R3741-*1
1K
TU_SCL
TU_SDA
+3.3V_TU
R3744
4.7K
BOOSTER_OPT
C
E
BOOSTER_OPT
FULL_NIM
R3743
10K
IF_N_MSTAR
IF_P_MSTAR
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
CN_2INPUT_H_ALTO
TU3701-*4
TDFR-C236D
RF_S/W_CNTL
1
BST_CNTL
2
+B1[+5V]
3
NC[RF_AGC]
4
NC_1
5
SCLT
6
SDAT
7
NC_2
8
SIF
9
NC_3
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
NC_4
16
SCL
17
SDA
18
ERR
19
SYNC
20
VALID
21
MCL
22
D0
23
D1
24
D2
25
D3
26
D4
27
D5
28
D6
29
D7
30
31
SHIELD
R3721
R3722
R3723
R3706
R3724
R3730
R3731
R3725
R3727
R3728
R3729
R3726
0
0
0
0
0
0
0
0
0
0
0
FE_TS_SYNC
FE_TS_VAL_ERR
FE_TS_CLK
FE_TS_DATA[0]
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
0
FE_TS_DATA[0-7]
FULL_NIM_BR
TU3701-*2
TDFR-B036F
RF_S/W_CNTL
1
BST_CNTL
2
+B1[5V]
3
NC_1[RF_AGC]
4
NC_2
5
SCLT
6
SDAT
7
NC_3
8
SIF
9
NC_4
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
NC_5
16
SCL
17
SDA
18
ERR
19
SYNC
20
VALID
21
MCL
22
D0
23
D1
24
D2
25
D3
26
D4
27
D5
28
D6
29
D7
30
31
SHIELD
BOOSTER : CHINA OPT
BOOSTER_OPT
R3745
10K
B
NON_BUFFER
R37730
R3749 0
DEMOD_SCL
DEMOD_SDA
200mA
FE_BOOSTER_CTL
LNA2_CTL
The pull-up/down of LNA2_CTL
is depended on MODLE_OPT_1.
GPIO must be added for FE_BOOSTER_CTL
+3.3V_TU
+3.3V_BUFFER
R3774
0
R3751
R3752
220
BUFFER
BUFFER
R3750
OPT
1K
E
BUFFER
B
Q3703
ISA1530AC1
C
+3.3V_TU
Please, check Multi Item! 10/12
C3717
0.1uF
16V
+5V_Normal
L3704
FULL_NIM_BCD
+5V_TU
Size change,0929
MLB-201209-0120P-N2
+5V_TUNER
C3719
C3724
22uF
0.1uF
10V
16V
+5V_TUNER
+5V_TUNER
+5V_TU
+5V_BUFFER
R3775
0
220
BUFFER
IC3703-*2
AZ1117BH-1.8TRE1
IN
3
1
ADJ/GND
HALF_NIM_1.8V
IC3703-*1
AP1117EG-13
OUTIN
ADJ/GND
HALF_NIM_1.2V_DIODES
R3771 10K
FULL_NIM_BCD
R3770 10K
FULL_NIM_SEMTEK
R376910K
FULL_NIM_BCD
+5V_TUNER
L3702
C3722
22uF
16V
+5V_TUNER
NON_BUFFER
R3772 0
TU_CVBS
OUT
2
INPUT
AP2132MP-2.5TRG1
PG
EN
VIN
VCTRL
NC_1
EN
VIN
NC_2
C3726
0.1uF
16V
+5V_TUNER
+3.3V_TU
+3.3V_BUFFER
R3776
R3755
B
R3753
BUFFER
4.7K
HALF_NIM_1.2V_BCD
IC3703
AZ1117BH-ADJTRE1
3
1
2
OUTPUT
IC3701
1
FULL_NIM_BCD
9
2
THERMAL
3
4
IC3701-*1
SC4215ISTRT
1
FULL_NIM_SEMTEK
2
3
4
60mA
0
BUFFER
470
E
BUFFER
ISA1530AC1
Q3705
C
ADJ/GND
HALF_NIM_1.2V
R3768
1.2K
R1
[EP]
GND
8
ADJ
7
VOUT
6
NC
5
GND
8
ADJ
7
VO
6
NC_3
5
+5V_TU
+5V_BUFFER
R3777
0
R3758
82
DEMOD_RESET
This was being applied to the only china demod,
so this has to be deleted in both main and ISDB sheet.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
8.5T_GAS
MDS62110209
6.5T_GAS
MDS62110206
GAS1-*5
GAS1-*6
8.5T_GAS
MDS62110209
6.5T_GAS
MDS62110206
GAS2-*5
GAS2-*6
8.5T_GAS
MDS62110209
6.5T_GAS
MDS62110206
GAS3-*5
GAS3-*6
GAS4-*5
8.5T_GAS
MDS62110209
GAS4-*6
6.5T_GAS
MDS62110206
GAS5-*5
8.5T_GAS
MDS62110209
GAS5-*6
6.5T_GAS
MDS62110206
GAS6-*5
8.5T_GAS
MDS62110209
GAS6-*6
6.5T_GAS
MDS62110206
8.5T_GAS
MDS62110209
6.5T_GAS
MDS62110206
GAS7-*5
GAS7-*6
GP3_S7LR
SMD_GAS
20110324
20
Page 41
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