Lenovo ThinkStation P320 User Manual [ru]

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THINKSTATION P320 TOWER & SFF

Section I: System Overview

System Overview

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P320 Tower P320 SFF

The single‐processor P320 workstation uses a Micro Advanced Technology Extended (MATX) motherboard, both 250 watt (W), and an optional 400 watt (W) power supply unit (PSU). The motherboard chipset consists of the Intel® 2400‐MHz PCH supporting error‐correcting code (ECC) Double Data Rate 4 (DDR4). Maximum memory supported is 64GB for UDIMMs. The processor socket is an Intel® LGA1150 GA‐C2 level with support for dual core, quad core, processors from the Intel® Xeon line (E3‐1200v6 family of processors) as well as Core i processors (i3, i5, i7).

The single‐processor P320 workstation uses a Micro Advanced Technology Extended (MATX) motherboard, with a 210 watt(W) power supply unit (PSU). The motherboard chipset consists of the Intel® 2400‐ MHz PCH supporting error‐correcting code (ECC) Double Data Rate 4 (DDR4). Maximum memory supported is 64GB for UDIMMs. The processor socket is an Intel® LGA1150 GA‐C2 level with support for dual core, quad core, processors from the Intel® Xeon line (E3‐1200v6 family of processors) as well as Core i (i3, i5, i7).

Operating Systems

P320 Tower P320 SFF

Preloaded

Genuine Windows 10® Professional 64‐bit Genuine Windows 10DG to 7® Professional 64‐bit

Supported

Red Hat Enterprise Linux

Preloaded

Genuine Windows 10® Professional 64‐bit Genuine Windows 10DG to 7® Professional 64‐bit

Supported

Red Hat Enterprise Linux

Motherboard – P320

Form Factor P320 Tower P320 SFF

Board Size 248mm*248mm 248mm*248mm

Motherboard Core

Processor Support Intel® Xeon™ E3‐1200v6/v5 Intel® Xeon™ E3‐1200v6/v5

Intel® i7™ Quad Core Intel® i7™ Quad Core

Intel® i5™ Quad Core Intel® i5™ Quad Core

Intel® i3™ Dual Core Intel® i3™ Dual Core

Socket Type LGA1151 LGA1151

Memory Support 2400 MHz 2400 MHz

QPI (GTPS) up to 9.6GT/s up to 9.6GT/s

Voltage Regulator 80W TDP 80W TDP

Chipset (PCH) Intel C236 Intel C236

Flash 16MB 16MB

HW Monitor – –

Super I/O Nuvoton NCT6685D Nuvoton NCT6685D

Clock Greenlow Native isCLK(Intel C236) Greenlow Native isCLK(Intel C236)

Audio ALC662VD‐GR ALC662VD‐GR

Ethernet Intel I219‐LM Intel I219‐LM

Memory

Slots 4 4

Channels 2 2

Type UDIMM UDIMM

ECC Support Yes (with Xeon Processor) Yes (with Xeon Processor)

Speed 2400 MHz 2400 MHz

Max DIMM Size 16GB 16GB

Max System Memory 64GB 64GB

Ethernet

Vendor Intel Intel

Count 1 1

EEPROM None None

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Speeds 10/100/1000 Mbps 10/100/1000 Mbps

Functions PXE, WOL,AMT PXE, WOL,AMT

Connectors (1) x RJ45 on Rear I/O (1) x RJ45 on Rear I/O

Audio

Type Integrated Audio Integrated Audio

Chipset ALC662VD‐GR ALC662VD‐GR

Stereo Conversion 2 4‐bit DAC and 24‐bit ADC 24‐bit DAC and 24‐bit ADC

High Definition Stereo Support v v

Number of Channels 2 channels (5.1 via Driver Selection) 2 channels (5.1 via Driver Selection)

Number of Bits/Audio Resolution 6 channels of DAC support 16/20/2 4‐bit PCM format for

5.1 audio solution 2 stereo ADC support 16/20‐bit PCM format

6 channels of DAC support 16/20/2 4‐bit PCM format for 5.1 audio solution 2 stereo ADC support 16/20‐bit PCM format

Sampling Rate (recording/playback) Support 44.1K/48K/96K sample rate Support 44.1K/48K/96K sample rate

Signal to Noise Ratio DAC SNR>98dBFSA, ADC SNR>90dBFSA DAC SNR>98dBFSA, ADC SNR>90dBFSA

Wavetable Voices 32‐voice wavetable(For XP only) 32‐voice wavetable(For XP only)

Analog Audio v v

Dolby Digital None None

THX None None

Digital Out (S/PDIF) None None

Speaker Power Rating Int Speaker (1.5W) / Ext 2.0 Speaker (4W) Int Speaker (1W) / Ext 2.0 Speaker (4W)

Video

Onboard Supported (On some Processors) Supported (On some Processors)

Type Integrated (Some Processors) Integrated (Some Processors)

Bus Interface Processor onboard Processor onboard

Display Interface VGA/DP/DP VGA/DP/DP

Video Resolution (max) DP: 4096×2304@60Hz DP: 4096×2304@60Hz

Graphics Cover Name Intel HD Graphics 530 Intel HD Graphics 530

Storage

Floppy None None

IDE None None

SATA (5) x SATA Connectors, Gen. 3

(1) x eSATA Connector, Gen. 3

(5) x SATA Connectors, Gen. 3 (1) x eSATA Connector, Gen. 3

SATA RAID 0,1,5,10 supported natively via Intel Controller

SATA RAID 0,1,5 supported natively via Intel Controller

eSATA (1) x eSATA Connector, Gen. 3 (1) x eSATA Connector, Gen. 3

Slots

PCI No No

Available Slots No No

PIN Count No No

Data Bus Width No No

Voltage No No

PCI Express x1 2pcs 2pcs

Available Slots 1 Full High 1 Low Profile

PIN Count 36 pins connectors 36 pins connectors

Data Bus Width 500MB/s per Direction; duplex 16GB/s 500MB/s per Direction; duplex 16GB/s

Voltage 12V 12V

Power (Max) 25W 25W

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PCI Express x4 Yes Yes

Available Slots 1 Full Height 1 Half High

PIN Count 164 pins connectors 164 pins connectors

Data Bus Width 8GB/s per Direction ; duplex 1GB/s 8GB/s per Direction ; duplex 1GB/s

Voltage 12V 12V

Power (Max) 75W 45W

PCI Express x16 Yes Yes

Available Slots 1 Full High 1 Half High

PIN Count 164 pins connectors 164 pins connectors

Data Bus Width 8GB/s per Direction; duplex 16GB/s 8GB/s per Direction; duplex 16GB/s

Voltage 12V 12V

Power (Max) 75W 45W

I/O

Front

High Speed USB 3.0 2 2

Internal High Speed USB 2.0 0 0

Microphone 1 1

Headphone 1 1

Back

High Speed USB 2.0 2 2

High Speed USB 3.0 4 4

1 standard serial, 1 optional via punching out

Yes Yes

Optional parallel Yes(header on MB) No

2 PS/2 Yes(header on MB) optional, via punching out

integrated VGA port 1 1

integrated Display port 2 2

RJ45 1 1

RJ11 (on selected models) 0 0

IEEE 1394 (on selected models) 0 0

Audio Line in 1 1

Audio line out 1 1

Mic In 1 1

eSATA 1 optional E‐SATA 1 optional E‐SATA

Thermal

Temp Sensors Ambient Cable Thermal Sensor Ambient Cable Thermal Sensor

VR Temperature Sensor VR Temperature Sensor

PSU Thermal Sensor(inside) PSU Thermal Sensor(inside)

Fans Rear SYSTEM Fan x1 4‐pin header with 4‐pin key Rear SYSTEM Fan x1 4‐pin header with 4‐pin key

Front Fan 4‐pin header with 4 pin key Front Fan 4‐pin header with 4 pin key

ODD bay Fan 4‐pin header with 3‐pin key ODD bay Fan 4‐pin header with 3‐pin key

PSU Fan Main PSU power connector PSU Fan Main PSU power connector

CPU Fan Header x1 4‐pin header with 4‐pin key CPU Fan Header x1 4‐pin header with 4‐pin key

Power Connectors

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Main (1) 10‐Pin (2×5) ATX Standard (1) 10‐Pin (2×5) ATX Standard

Memory & CPU 4‐Pin 4‐Pin

Graphics 6‐Pin (400W) (None for 250W) None

Security

TPM TPM 1.2 TPM 1.2

Asset ID Rohm BUL08‐1FJ‐W/FVJ‐W/NXP PCA24S08AD Rohm BUL08‐1FJ‐W/FVJ‐W/NXP PCA24S08AD

vPro E3 12xx v6/v5 yes E3 12xx v6/v5 yes

BIOS

Vendor AMI AMI

Chassis Information

P320 Tower P320 SFF

Format 25L Rack Mountable Tower 12L Rack Mountable Tower

Dimensions 425mm H x 175mm W x 431mm D 338mm H x 102mm W x 375mm D

Weight TWR(13kg(net

weight)+1.3kg (carton+p.47kg(plastic)+0.9375kg (wood) = 15.7075 kg)

SFF(7.9kg (net weight)+1.05kg (carton+0.36kg (plastic)+0.937 5kg (wood) = 10.2475 kg)

Packaging Parameters without External Speaker

Height (mm) 510 505

Height (inch) 20.08 19.88

Width (mm) 310 215

Width (inch) 12.2 8.46

Depth (mm) 540 530

Depth (inch) 21.26 20.87

Weight (kgs) 14 9.23

Weight (lbs) 30.86 20.34

Color Raven Black paint Raven Black paint

PSU 250 watt 85% efficient tool‐less power supply

400 watt 92% efficient tool‐less power supply

210 watt 85% efficient tool‐less power supply 210 watt 92% efficient tool‐less power supply

Thermal Solutions Rear Fan Standard – Optional Front fan required for

some configurations

Rear Fan Standard – Optional Front fan required for some configurations

Security & Serviceability

Access Panel Tool‐less side cover removal

Optical Drive Tool‐less

Hard Drives Tool‐less

Expansion Cards Tool‐less

Processor Socket Tool‐less

Color coded User Touch Points Yes

Color‐coordinated Cables and Connectors Yes

Memory Tool‐less

System Board Tool‐less

Green Color Power LED on Front of Computer Yes

Restore CD/DVD Set Restore system to original factory shipping image – Can be obtained via

Lenovo Support

Cable Lock Support Yes, Optional Kensington Cable Lock

Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control Yes

Power‐On Password Yes

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Setup Password Yes

NIC LEDs (integrated) Yes

Security Chip Yes

Access Panel Key Lock Optional

Boot Sequence Control Yes

Padlock Support Yes, loop in rear for optional padlock, prevents side panel removal

Boot without keyboard and/or mouse Yes

Operating Environment

Air Temperature • Operating: 10°C to 35°C (50°F to 95°F)

• Storage: ‐40°C to 60°C (‐40°F to 140°F) in original shipping carton

• Storage: ‐10°C to 60°C (14°F to 140°F) without carton

Humidity Operating 20% ~ 80% (non‐condensing)

Non‐Operating 20% ~ 90%(non‐condensing)

• Wet Bulb Temperature Operating: 25°C max

Altitude Operating: ‐15.2 m to 3048 m (‐50 ft to 10 000 ft)

Vibration With Packag ing 1.04 G at 2 to 200 Hz at 1 octave/min

Operating: 0.27 G at 5 to 500 Hz at 0.5 octave/min,Ramdom(without LCD panel)

Non‐ operatig 1.04 G at 2 to 200 Hz at 1 octave/min

Shock Without Package: Bottom half‐sine pulse with a change in velocity of 37.4 cm/sec

(14.7 inches/sec)

Operating: 45‐G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)

Regulations and Standards

EMC & Safety

FCC DoC for North America Yes

VCCI certification for Japan Yes

BSMI certification for Taiwan Yes

EU/EFTA CE Mark & DoC Yes

UL/CUL Yes

TUV‐GS Yes

IEC60950‐1 CB Report/Certificate Yes

Saudi Arabia ICCP(SASO) Yes

China CCC Mark Yes

Hong Kong SAR (CB report) Yes

Argentina S‐mark Yes

Singapore – PSB Yes

South Africa – SABS Yes

Russia‐GOST/EAC Yes

Mexico‐NOM Yes

Kazakhstan ‐GOST‐K/EAC Yes

Belarus‐certificate/EAC Yes

Croatia‐certificate/CE Yes

Serbia – KVALITET Yes

Ukraine – UKrCEPRO Yes

Energy Star 6.1 Yes

PERD(Product Environmental Review Database Yes

China RoHS Yes

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EU RoHS Yes

EU WEEE Yes

Japan J‐Moss Yes

California RoHS Yes

USA Chemical Emission Test Yes

New York RoHS Yes

Japan Energy Saving Yes

Environmentals

Energy Star Energy Star Program Requirements for Computers: Version 6.1 (select models)

EPEAT EPEAT™ Gold rating (select models)

ErP Lot‐3 2013 ErP Lot‐3 2013 (Enabled via system setup. Default on for systems shipped to EMEA.)

Hazardous Substances • Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1%

hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE).

• Products do not contain Asbestos.

• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1‐trichloroethane, methyl bromide

• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation.

• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10‐ 13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP

• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week.

Section II: Supported Components

Processor

KabyLake Xeon E3

E3‐1280 v6 ( 3.9GHz / 4C / 8M / 2400 / 72W / Turbo / HT / GT0 / No iGFx )

E3‐1275 v6 ( 3.8GHz / 4C / 8M / 2400 / 73W / Turbo / HT / GT2 )

E3‐1270 v6 ( 3.8GHz / 4C / 8M / 2400 / 72W / Turbo / HT / GT0 / No iGFx )

E3‐1245 v6 ( 3.7GHz / 4C / 8M / 2400 / 73W / Turbo / HT / GT2 )

E3‐1240 v6 ( 3.7GHz / 4C / 8M / 2400 / 72W / Turbo / HT / GT0 / No iGFx )

E3‐1230 v6 ( 3.5GHz / 4C / 8M / 2400 / 72W / Turbo / HT / GT0 / No iGFx )

E3‐1225 v6 ( 3.3GHz / 4C / 8M / 2400 / 73W / Turbo / HT / GT2 )

E3‐1220 v6 ( 3.0GHz / 4C / 8M / 2400 / 72W / Turbo / GT0 / No iGFx )

KabyLake‐Core

i7‐7700K ( 4.2GHz / 4c / 8M / 2400 / 95W / GT2 ) (Tower only)

i7‐7700 ( 3.6GHz / 4c / 8M / 2400 / 65W / GT2 )

i5‐7600 ( 3.5GHz / 4c / 6M / 2400 / 65W / GT2 )

i5‐7500 ( 3.4GHz / 4c / 6M / 2400 / 65W / GT2 )

i5‐7400 ( 3.0GHz / 4c / 6M / 2400 / 65W / GT2 )

i3‐7300 (4.0GHz / 2c /4M / 2400 / 51W / GT2 )

i3‐7100 (3.9GHz / 2c / 3M/ 2400 / 51W / GT2 )

SkyLake Xeon E3

E3‐1245 v5 ( 3.5GHz / 4C / 8M / 2133 / 80W/ Turbo / HT / GT2 )

E3‐1240 v5 ( 3.5GHz / 4C / 8M / 2133 / 80W / Turbo / HT / GT0 / No iGFx )

E3‐1230 v5 ( 3.4GHz / 4C / 8M / 2133 /80W/ Turbo /HT / GT0 / No iGFx )

E3‐1225 v5 ( 3.3GHz / 4C / 8M / 2133 /80W / Turbo/ GT2 )

E3‐1220 v5 ( 3.0GHz / 4C / 8M / 2133 / 80W / Turbo / GT0 / No iGFx )

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SkyLake Core

i7‐6700 ( 3.4GHz / 4c / 8M / 2133 / 65W /GT2 )

i5‐6500 ( 3.2GHz / 4c / 6M / 2133 / 65W / GT2)

i5‐6400 ( 2.7GHz / 4c / 6M / 2133 / 65W / GT2)

i3‐6100 ( 3.7GHz / 2C / 3M / 2133 / 51W / GT2 )

Multi core technologies are designed to improve performance of multithreaded software products and hardware‐ aware multitasking operating systems and may require appropriate operating system software for full benefits; check with software provider to determine suitability; not all customers or software applications will necessarily benefit from use of these technologies.

64‐bit computing on Intel® 64 architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not operate (including 32‐ bit operation) without an Intel® 64 architecture‐enabled BIOS. Performance will vary depending on your hardware and software configurations

Memory

UDIMMs – 2400MHz

4GB PC4‐2400MHz DDR4 non‐ECC‐UDIMM

8GB PC4‐2400MHz DDR4 non‐ECC‐UDIMM

16GB PC4‐2400MHz DDR4 non‐ECC ‐UDIMM

8GB PC4‐2400MHz DDR4 ECC‐UDIMM

16GB PC4‐2400MHz DDR4 ECC ‐UDIMM

Storage

3.5″ SATA Hard Disk Drive (HDD)

1TB SATA – 7200 rpm, 6 Gb/s, 64MB cache, 3.5″

2TB SATA – 7200 rpm, 6 Gb/s, 64MB cache, 3.5″

3.5″ Enterprise SASA Hard Disk Drive (HDD)

4TB SATA – 7200rpm, 128MB cache, 3.5″

2.5″ SATA Solid State Drive (SSD)

256GB SATA SSD, 6Gb/s, ,2.5″ OPAL

512GB SATA SSD, 6Gb/s, 2.5″ Non‐OPAL

512GB SATA SSD, 6Gb/s, 2.5″ OPAL

1 TB SATA SSD , 6Gb/s, , 2.5″ OPAL

2 TB SATA SSD , 6Gb/s, , 2.5″ OPAL

M.2 (NGFF) PCIe Solid State Drive (SSD)

256 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, OPAL NVMe

256 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, OPAL NVMe, Intel

512 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, NVMe

512 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, OPAL NVMe, Intel

1TB M.2 PCIe – Solid State Drive (SSD), Gen3x4, NVMe

RAID

Supported RAID levels for a system will vary from the stated capabilities of the RAID controller due to dependencies on the number and capacity of physical disks in the system and on customer requirements for performance, fault tolerance, or data redundancy. Max support RAID 0,1,5,10

RAID levels and requirements:

• RAID 0 (striping) provides increased performance by writing data across multiple drives.

• RAID 1 (mirroring) provides fault tolerance by writing the data on two drives.

• RAID 5 (striping with parity) uses distributed parity data to provide fault tolerance more efficiently than RAID 1. Requires three or more drives.

• RAID 10 (or RAID 1+0) combines

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• RAID 1 and RAID 0 to create a stripe of mirrors that is fault tolerant while offering increased performance. Requires four drives.

Optical Drive/Removable Media

P320 Tower P320 SFF

DVD‐ROM Drive DVD‐ROM Drive

DVD‐ROM Drive – 16x/48x (SATA) DVD‐ROM Drive – 16x/48x (SATA)

9mm Slim SATA DVD ROM(SATA) 9mm Slim SATA DVD ROM(SATA)

DVD Burner/CD‐RW Rambo Drive DVD Burner/CD‐RW Rambo Drive

DVD Burner/CD‐RW Rambo Drive (SATA) DVD Burner/CD‐RW Rambo Drive (SATA)

9mm Slim DVD Burner/CD‐RW Drive ( SATA ) 9mm Slim DVD Burner/CD‐RW Drive ( SATA )

Blu‐Ray Burner Drive Blu‐Ray Burner Drive

Blu‐Ray Burner Drive w/AACS encryption (SATA) Blu‐Ray Burner Drive w/AACS encryption (SATA)

9mm Slim SATA Blu‐Ray Burner(SATA) 9mm Slim SATA Blu‐Ray Burner(SATA)

Media Card Reader Media Card Reader

Front 9 in 1 Media Card reader Standard Front 9 in 1 Media Card reader Standard

Front 29 in 1 Media card reader, USB3.0, MPOB, 760mm (Requires FLEX Module)

Keyboard

Preferred Pro Fullsize Keyboard (PS/2)

Smart Card KYB

Chicony KUF1256 fingerprint KB

USB Calliope Keyboard Black

Traditional USB Keyboard

Pointing Devices

Lenovo USB Laser Mouse

PS2 black optical mouse with new logo

3DConnex ion CadMouse

USB Calliope Mouse Black(Red wheel)

Graphics Cards

P320 Tower P320 SFF

Integrated Graphics Integrated Graphics

with Intel® Xeon™ E3‐12*5v6/v5, i7™ Quad Core, i5™ Quad Core, i3™ Dual Core

Discrete Graphics Cards Discrete Graphics Cards

Nvidia NVS310 (DP x 2) – 1GB GDDR3‐HP Nvidia NVS310 (DP x 2) – 1GB GDDR3‐LP

Nvidia NVS315 (with DMS‐59 to Dual DVI single link dongle) – 1GB DDR3‐HP NVIDIA NVS315 (DMS‐59) – 1GB GDDR3 w/ DMS‐59 to Dual DVI

Dongle(single link) – LP

Nvidia NVS315 (with DMS‐59 to Dual Display Port dongle) – 1GB DDR3‐ HP NVIDIA NVS315 (DMS‐59) – 1GB GDDR3 w/ DMS‐59 to Dual DP Dongle – LP

NVIDIA 510 (mini DP x4) – 2GB GDDR3 with 4x miniDP to DP Dongle – HP NVIDIA 510 (mini DP x4) – 2GB GDDR3 with 4x miniDP to DP Dongle – LP

NVIDIA NVS810 (miniDP x8) – 4GB GDDR3 ‐HP (w/ short ext)

NVIDIA Quadro P400(miniDP x3) – 2GB GDDR5 – HP NVIDIA Quadro P400(miniDP x3) – 2GB GDDR5 – LP

NVIDIA Quadro P600(miniDP x4) – 2GB GDDR5 – HP NVIDIA Quadro P600(miniDP x4) – 2GB GDDR5 – LP

NVIDIA Quadro P1000(miniDP x4) – 4GB GDDR5 – HP NVIDIA Quadro P1000(miniDP x4) – 4GB GDDR5 – LP

NVIDIA Quadro P2000(DP x4) – 5GB GDDR5 – HP

NVIDIA Quadro P4000(DP x4) – 8GB GDDR5 – HP

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FLEX Components

Flex Bay: Formerly known as ODD bays. Will support not only ODD, but also HDDs and Flex Module

Flex Module: Module supported in the Flex Bay with several options integrated. Will support slim ODD, High Speed Media Card Reader or 2 universal ports supporting IEEE1394, eSATA, etc…

PCIe

P320 Tower P320 SFF

Network Intel® I210‐T1 Single Port Gigabit Ethernet

Adapter

Intel® I210‐T1 Single Port Gigabit Ethernet Adapter

Intel® I350‐T2 Dual Ports Gigabit Ethernet Adapter

Bitland BN8E88 1000M PCIE ASF HP Bitland BN8E88 1000M PCIE ASF LP

Aquantia PCIE 5G Full Height Ethernet adapter HP

Aquantia PCIE 5G Full Height Ethernet adapter LP

Thunderbolt

IEE 1394 IEEE 1394 (Firewire) PCI Express x1 Adapter

(TI XIO2213B) with 1 internal port, 1 external port‐HP

IEEE 1394 (Firewire) PCI Express x1 Adapter (TI XIO2213B) with 1 internal port, 1 external port‐LP

USB Rear dual port USB 3.1 type C High‐profile

PCIe adapter

Rear dual port USB 3.1 type C Low‐profile PCIe adapter

Audio Devices SOUND BLASTER Z(SB1502) BULK PK (Tower

only)

WIFI Cards Intel Windstorm Peak 8265 2*2ac+BT4.2 VPro

M.2 Module QS sample HP

Intel Windstorm Peak 8265 2*2ac+BT4.2 VPro M.2 Module QS sample LP

Parallel card

PCIe to M.2 Adapter Card PCIE x4 to M.2 (For NVMe SSD) – HP PCIE x4 to M.2 (For NVMe SSD) – LP

Front Access Storage Enclosure 5.25” Front Access Storage Enclosure 5.25” Front Access Storage Enclosure

Section III: System Technical Specifications

Power Supply Specifications

P320 Tower P320 SFF

Power Supply 250W 400W 210W 210W

Power Efficiency 85% 92% 85% 92%

Manual / Auto‐sensing auto‐sensing a uto‐sensing auto‐sensing auto‐sensing

Type ATX ATX ATX ATX

Wattage 250W 400W 210W 210W

AC Input Voltage Range 100~ 240v 100~240v 100~240v 100~240v

AC Input Current (low ac range/high AC range) 4A 6A 3A 6A

47~63 HZ 47~63 HZ 47~63 HZ 47~63 HZ

AC Holdup Time (50% load) 17ms 17ms 17ms 17ms

Minimum Efficiency 0.82 0.9 0.82 0.9

PFC (Active) active active active active

Aux Power Drop Single Drop 6pin

ThinkStation Power Calculator

BIOS Specifications

Features

WMI Support Compliant with Microsoft WBEM and the DMTF Common Information Model

ROM‐Based Setup Utility (F1) System Configuration Setup program available at power‐on with F1 key

Bootblock Recovery Recovers system BIOS when Flash ROM corrupted.

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Replicated Setup Saves System Configuration settings to file that can then be used replicated to other systems.

Boot Control Boot control available through ROM‐Based Setup Utility or with F12 key at power‐on

Memory Change Alert Power‐on Error message in event of decrease in system memory

Thermal Alert Power‐on Error message in event of fan failure

Asset Tag Support ability to set SMBIOS Type 2 Baseboard Asset Tag field.

System/Emergency ROM Flash Recovery with Video

Support process to recover system BIOS when Flash ROM corrupted

Remote Wakeup/Remote Shutdown

System admin can power on/off a client computer from remote location to provide maintenance

Quick Resume time Support low power S3 (suspend to RAM) and prompt resume times

ROM revision level System UEFI (BIOS) version reported in SMBIOS Type 0 structure and in BIOS Setup

Keyboard‐less Operation System can be booted without a keyboard

Per‐port Control Allows I/O ports to be individually enabled/disabled through ROM‐based setup or WMI interface

Adaptive Cooling Fans dynamically controlled by system BIOS based on temperature.

Security User and Administrator passwords can protect boot and ROM‐base Setup. Chassis intrusion detection protect

Intel(R) AMT (includes ASF 2.0) Allows system to be supported from a remote location

Intel(R) TXT Intel(R) Trusted Execution Technology provides a security foundation to build protections against software base

attacks.

Memory modes Supports mirroring, lock step, and sparing memory modes

Windows 10 ready Supports Windows 10 requirements – Secure flash, UEFI v 2.3.1 spec

Industry Standard Specification Support

UEFI Unified Extensible Firmware Interface v2.3.1

ACPI (Advanced Configuration and power Management Interface)

Advanced Configuration and Power Interface v4.0

ASF 2.0 DMTF Alert Standard Format Specification v2.0

ATA (IDE) None

CD Boot “El Torito” Bootable CD‐Rom Format Specification, Version 1.0

EHCI None, support RAID/AHCI

PCI None

PCI Express PCI Express Base Specification 3.0

SATA Serial ATA Revision 3.0 Specification

TPM Trusted Computing Group TPM Specification Version 1.2

UHCI None

USB Universal Serial Bus Revision 1.1

Universal Serial Bus v2.0

Universal Serial Bus v3.0

SMBIOS DMTF System Management Spec v2.7.1

XHCI eXtensible Host Controller Interface for Universal Serial Bus, Revision 3.0

Social and Environmental Responsibility

Quality Control

Lenovo is a member of an eco declaration system that enforces regular independent quality control

Hazardous substances and preparation

Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium,

0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal

reference and Note B1

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Products do not contain Asbestos

Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC),

hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1‐

trichloroethane, methyl bromide

Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated

terphenyl (PCT) in preparation

Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10‐13 carbon atoms in the

chain containing at least 48% per mass of chlorine in the SCCP

Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5

microgram/cm²/week

REACH Article 33 information about substances in articles is available at:

http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Batteries

If the product contains a battery or an accumulator, it is labeled with the disposal symbol and if it contains

more than 0.0005% of mercury (for button cells only) by weight, or more than 0.004% of lead, it shall be

marked with the chemical symbol for the metal concerned, Hg or Pb. Information on proper disposal is

provided in user manual

Button cells used in the product do not contain more than 2% by weight of mercury. Other batteries or

accumulators do not contain more than 0.0005% of mercury or 0.002% of cadmium

Batteries and accumulators are easily removable by either users or service providers (as dependent on the

design of the product). Exception: Batteries that are permanently installed for safety, performance, medical

or data integrity reasons do not have to be “easily removable

Safety, EMC connection to the telephone network and labeling

The product complies with legally required safety standards as specified

The product complies with legally required standards for electromagnetic compatibility

If product is intended for connection to a public telecom network or contains a radio transmitter, it complies

with legally required standards for radio and telecommunication devices

The product is labeled to show conformance with applicable legal requirements

Product packaging

Packaging and packaging components do not contain more than 0.01% lead, mercury, cadmium and

hexavalent chromium by weight of these together.

Plastic packaging material is marked according to ISO 11469 referring ISO 1043

The product packag ing material is free from ozone depleting substances as specified in the Montreal

Protocol

For more information on Lenovo social environmental practices visit: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment

Manageability

Industry Standard Specifications This product meets the following industry standard specifications for

manageability functionality:

• Intel LAN with AMT

Remote Manageability Software Solutions Lenovo ThinkStation is supported on the following remote manageability

software consoles:

• Lenovo ThinkManagement Console

• LANDesk Management Suite for ThinkVantage Technologies (www.landesk.com/lenovo)

• Microsoft System Center Configuration Manag er

Page 13

System Software Manager Lenovo ThinkStation supports software management tools from the

ThinkVantage System Update suite:

• System Update

• Update Retriever

• Thin Installer

Service, Support, and Warranty On‐site Warranty and Service: Three‐years, limited warranty and service

offering delivers on‐site, next business‐day service for parts and labor and includes free telephone support 8am – 5pm. Global coverage ensures that any product purchased in one country and transferred to another, non‐restricted country will remain fully covered under the original warranty and service offering.

Go to www.lenovo.com/support and www.lenovo.com/warranty for more details

Section IV: Component Specifications

HDD Specifications

3.5″ SATA Hard Disk Drive (HDD)

1TB SATA – 7200rpm, 6Gb/s, 3.5″

2TB SATA – 7200rpm, 6Gb/s, 3.5″

3.5″ Enterprise SATA Hard Disk Drive (HDD)

4TB SATA – 7200rpm, 6Gb/s, 3.5″



3.5 7200 Enterprise 4T (Model:MakaraBP)

3.5″ 7200 2T (Model:Grenada BP‐R )

3.5″ 7200 1T (Model:Pharaoh Oasis)

Connector SATA SATA SATA

Transfer Rate (Gb/sec) 600MB/sec 600MB/sec 600MB/sec

Performance

Spindle Speed(RPM) 7200 7200 7200

Power off to Spindle Stop(sec) 23 max 11 max 10 max

DC Power to Drive Ready(sec) 30 max 10 max

Receipt of Start Unit Command to Drive Ready(sec)

30 max 17 max 10 max

Average Latency(msec) 4.16 4.16 4.16

Power Management

Input(VDC) +5v +‐ 5%+12v +‐ 5% +5v +‐ 5%+12v +‐ 5% +5v +‐ 5%+12v +‐ 5%

Typical(Watts) 10(6T) 8 max 5.57 max

Idle(Watts) 6.2(6T) 5.4 (Idle 2) 4.21

Dimensions

Height(mm – Max) 26.11 26.1 20

Width(mm) 101.6 101.6 10 1.6

Depth(mm – Max) 146.99 146.99 146.99

Weight(grams) 705 max 626 max 415 max

Temprature

Operating(C) Ambient 5 to 60 0 to 60 0 to 60

Operating(C) Base Casting

Non‐Operating(C) Ambient ‐40 to 70 ‐40 to 70 ‐40 to 70

Gradient(C per Hour) 20 max 30 max 30 max

Shock

Operating(Gs @ 2ms) 70(read) 40(write) 70 max 80 max

Non‐Operating(Gs @ 2ms) 250 6T,300 other 350 max 300 max

Page 14

SSD Specifications

2.5″ SATA Solid State Drive (SSD)

256GB SATA SSD, 6Gb/s, 2.5″ OPAL

512GB SATA SSD, 6Gb/s, 2.5″ OPAL

512GB SATA SSD, 6Gb/s, 2.5″ Non‐OPAL

1 TB SATA SSD , 6Gb/s, 2.5″ Non‐OPAL

M.2 (NGFF) PCIe Solid State Drive (SSD)

256 GB M.2 PCIe OPAL NVMe‐ Solid State Drive (SSD), Gen3x4

512 GB M.2 PCIe NVMe‐ Solid State Drive (SSD), Gen3x4

1 TB SATA SSD, 6Gb/s, 2.5



256GB Flash SSD (Solid State Drive)

512GB Flash SSD (Solid State Drive)

1TB Flash SSD (Solid State Drive)

2TB Flash SSD (Solid State Drive)

256GB NVMe M.2 SSD

512GB NVMe M.2 SSD

1TB NVMe M.2 SSD

Supported Types Serial‐ATA Serial‐ATA Serial‐ATA Serial‐ATA PCIe Gen3 PCIe Gen3 PCIe Gen3

Dimensions inches/centimeters (W x D x H)

70 x 100 x 6.8 (Unit: mm)

22.00 x 80.00 x 2.38 (Unit: mm)

22.00 x 80.00 x

2.38 (Unit: mm)

22.00 x 80.00 x 2.38 (Unit: mm)

Size 2.5″ 2.5″ 2.5″ 2.5″ 3.3” (diameter

for PCB)

3.3” (diameter for PCB)

Interface Type SATA‐III SATA‐III SATA‐III SATA‐III PCIe 4x(Gen3) PCIe 4x(Gen3) PCIe 4x(Gen3)

Read/Write IOPS Specifications

4KB Random Reads: Up to 70K IOPS. 4KB Random Writes: Up to 60K IOPS.

4KB Random Reads: Up to 92K IOPS. 4KB Random Writes: Up to 83K IOPS.

4KB Random Reads: Up to 330K IOPS. 4KB Random Writes: Up to 280K IOPS.

4KB Random Reads: Up to 330K IOPS. 4KB Random Writes: Up to 300K IOPS.

4KB Random Reads: Up to 430K IOPS. 4KB Random Writes: Up to 320K IOPS.

Bandwidth Performanche

Read: Up to 540 MB/s. Write: Up to 495 MB/s

Read: Up to 530 MB/s. Write: Up to 500 MB/s

Sequential Read:3100 MB/s, Sequential Write:1400 MB/s

Sequential Read:320 MB/s, Sequential Write:1700 MB/s

Sequential Read:320 MB/s, Sequential Write:1800 MB/s

Power Consumption(Max)

≤1800mW ≤1950mW ≤2220mW ≤6000mW 6.1W for read,

5.1W for write

6.1W for read,

5.1W for write

6.1W for read,

5.1W for write

Active(AVG) 56mW 62mW 66mW 150mW 5.9W for read,

4.5W for write

5.9W for read,

4.5W for write

5.9W for read,

4.5W for write

Idle around 40mW around40 mW around 40mW around 110mW around 100mW around 100mW around

100mW

Min MTBF 1.5M hours 1.5M hours 1.5M hours 1.5M hours 1.5M hours 1.5M hours 1.5M hours

Hardware Encryption AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit AES 256 bit



Optical Drives Specifications

DVD‐ROM Drive (SATA) DVD Burner/CD‐RW Drive

(SATA)

Blu‐Ray Burner Drive (SATA) 9mm Slim SATA DVD

ROM(SATA)

9mm Slim DVD Burner/CD‐RW Drive (SATA)

9mm Slim SATA Blu‐ Ray Burner(SATA)

Type DVD‐ROM DVD Recorder DVD/BD Recordable DVD‐ROM DVD Recordable DVD/BD Recordable

External Dimensions INCHES/CENTIMETERS (Of Actual Drive Without Bezel‐W x H x D)

146±0.5×41.5±0.5×17 5(Max) Unit:mm

146±0.5×41.5 +0.5/‐0.7×184.7±0.5(Max) Unit:mm

128±0.4×9.0 ±0.4×127±0.4(Max) Unit:mm

Speed 16x /48x Max 16x/40x Max 6x Max 8x Max 24x Max (for CD‐R),

8x Max (for DVD ROM)

24x Max (for CD‐R), 8x Max (for DVD ROM)

Bay Type Half‐Height Half‐Height Half‐Height 9mm Slim Tray 9.5mm Slim Tray 9.5mm Slim Tray

Color Business Black Business Black Business Black Business Black Business Black Business Black

Page 15

Removable No No No No No No

Interface Type and Speed

SATA 1.5 Gb/s SATA 1.5 Gb/s SATA 1.5 Gb/s SATA 1.5 Gb/s SATA 1.5 Gb/s SATA 1.5 Gb/s

Weight (max) POUNDS/KILOGRAMS

1Kg 1Kg 1Kg 0.2Kg 0.2Kg 0.2Kg

Internal Buffer Size 196KB Min 0.75MB Min 2MB Min 0.5MB Min 0.5MB Min 2MB Min

Access Times (typical) 140 ms 140 ms 180 ms 160s 160s 160s

Rates

Writes NA 16x DVD+/‐R / 8x DVD+RW/

6x DVD‐RW/5x DVD‐RAM 40x CD ‐R / 24x CD‐RW

6x BD‐R / 2x BD‐RE 16XDVD +R / 8XDVD+RW / 4XDVD+R DL 16XDVD‐R / 6XDVD‐RW / 4XDVD‐R DL 5XDVD‐RAM 40XCD‐R / 24XCD‐RW

N/A 8x DVD+/‐R / 6x

DVD+/‐RW / 5x DVD‐ RAM / 24x CD‐R / 16x CD‐RW

8x DVD+/‐R / 6x DVD+/‐RW / 5x DVD‐ RAM / 24x CD‐R / 16x CD‐RW

Reads 48XCD‐ROM/16XDVD‐ROM 40XCD‐ROM/16XDVD‐ROM 6x BD‐ROM

16XDVD‐ROM, 40XCD‐ROM

8XDVD‐ROM / 24XCD‐ ROM

Power Source

DC Power Requirements

(+5V±5%; 12V±10%) (+5V±5%; 12V±10% ) +5V±5%; 12V±10% +5V±5% +5V±5% +5V±5%

DC Current Max 2.0A@12V

Max 1.5A@5v

Max 2.5A@12V Max 2.0A@5v

Max 3.0A@12V, Max

1.9A@5v

Max 2.5A@5v Max 2.5A@5v Max 2.5A@5v

Operating Temperature

5° to 50° C (41° to 122° F) 5° to 50° C (41° to 122° F) 5° to 50° C (41° to 122°F)5° to 50° C (41° to

122° F)

5° to 50° C (41° to 122° F)

Relative Humidity 8% to 80% 8% to 80% 8% to 80% 8% to 80% 8% to 80% 8% to 80%

Maximum Wet Bulb Temperature

30° C (86° F) 30° C (86° F) 30° C (86° F) 30° C (86° F) 30° C (86° F) 30° C (86° F)

Operating Systems Supported

Windows 10 Professional or Home 64‐bit, Windows 7 Professional 64‐ bit Red Hat Enterprise Linux(RHEL) 7.2 Desktop/Workstation. No driver is required for this device. Native support is provided by the operating system.

Windows 10 Professional or Home 64‐bit, Windows 7 Professional 64‐bit Red Hat Enterprise Linux(RHEL) 7.2 Desktop/Workstation. No driver is required for this device. Native support is provided by the operating system.



Graphics Cards

Integrated Graphics Adapter

Type Integrated

Bus Interface Processor onboard

Display Interface VGA/DP/DP

Video Resolution (max) DP/HDMI: 4096 *2304

Graphics Cover Name Intel HD Graphics

Video Ram Max 32G

Memory type UDIMM ECC/No‐ECC, 2CH DDR4 @ 1.2V

Trible Monitor Support Yes

Display Rotation Support 4096×2304/60Hz/DP, 4096×2304/24Hz/HDMI,

4K support on 60Hz

3D Setup & Render Engine Yes

GPU Core Clock 2GT

Maximum Color Depth 32 bit

Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)

4096×2304/60Hz/DP, 4096×2304/24Hz/HDMI, 60Hz

Discrete Graphics Adapter

NVIDIA NVIDIA NVS315 NVIDIA NVS510 NVIDIA NVIDIA P400 NVIDIA P600 NVIDIA NVIDIA NVIDIA NVIDIA NVIDIA

Page 16

NVS310 NVS810 P1000 P2000 P4000 P5000 P6000

Type Discrete Discrete discrete Discrete Discrete Discrete Discrete Discrete Discrete Discrete Discrete

Bus Interface PCI‐E 2.0,

16x

PCI‐E 2.0, 16x PCI‐E 2.0, 16x PCI‐E 3.0,

16x

PCI‐E 3.0, 16x

Display Interface

DP + DP DMS59 4 xmini‐DP 8 xmini‐DP

1.2

3 xMini DP 4 xMini DP 4 xMini DP 4 xDP 4 xDP 4

xDP+DVI‐D4xDP+DVI‐D

Graphics Chipset

Q310 GF119‐825

NVS315 GF119‐ 825

NVS 510 NVS 510 GP107‐825 GP107‐85 0 GP107‐806 GP106‐875 GP104‐850‐A1GP104‐

875‐A1

GP102‐ 875‐A1

Memory clock frequency(MHz)

875 MHz 875MHz 891 MHz TBD 2000MHz 2000MHz 2500 MHz 3500MHz 3802 MHz 4513 MHz 4513 MHz

Memory size 512 MB 1GB 2GB 4GB 2GB 2GB 4GB 5GB 8GB 16GB 24GB

Memory bit(bit) 64 bit 64 bit 128‐bit 128‐bit (64‐

bit per GPU)

64‐bit 128‐bit 128‐bit 160‐bit 256‐bit 2 56‐bit 384‐bit

Memory BW Up to

14GBps

Up to 14GBps Up to 28.5GBs 28.8 GB/s

(14.4 GB/s per GPU)

Up to 32 GBps

Up to 64 GBps

Up to 80 GBps

Up to 140 GBps

Up to 243 GBps

Up to 288 GBps

Up to 432 GBps

Dual Monitor Support

Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes

Display Rotation Support

Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes

3D Setup & Render Engine

DX 11 DX11 DX11 DX11 DX12 DX12 DX11 DX12 DX12 DX12 DX12

VRAM Type DDR3 D DR3 DDR3 DDR3 DDR5 DDR5 GDDR5 DDR5 DDR5 GDDR5 GDDR5

GPU Cuda Cores

48 48 192 1 024 256 384 6 40 1024 1792 2560 3840

GPU Core frequency(MHz)

523 MHz 523Mhz 797 MHz 900 MHz 1252 MHz 1556 MHz 1480 MHz 1480MHz 1480 MHz 1607 MHz 1506 MHz

Maximum Power Consumption

19.5 W 19.3W 33.4 W 68W 40W 40W 47w (Board Power)

75w (Board Power)

105W 180W 250W

Operating System Graphics/Video API Support

Window 7 64bit, Windows 10 64bit

Window 7 64bit, Windows 10 64bit, Linux 64bit

Supported Resolutions and Max Refresh Rates(Hz) (Note: analog and/or digital)

Digital Display Support



DisplayPort output

● Drives

two DisplayPort enabled digital display at resolutions up to 2560 × 1600 at 60 Hz with reduced blanking, when connected natively using the 2 DisplayPort connectors on the NVS 310 graphics card

● Supports

2 monitors up to resolution of 1920 × 1200 at 60 Hz with reduced blanking using DisplayPort

1.2 multi

stream topology technology.  DVI‐D output

Digital Display Support  VESA® DisplayPort™ output

● Drives two DisplayPort enabled digital display at resolutions up to 2560 × 1600 at 60 Hz with reduced blanking using DMS‐59 to dual DisplayPort cable adapters

● Supports 2 monitors up to resolution of 1920 × 1200 at 60 Hz with reduced blanking using DisplayPort 1.2 multi stream topology technology  Single‐link DVI‐I output

● Drives two digital display at resolutions up to 1920 × 1200 at 60 Hz with reduced blanking using DMS‐59 to dual DVI‐I cable adapters  HDMI output

● NVS 315 is capable of driving two high definition

Digital Display Support  DisplayPort output

● Drives four DisplayPort enabled digital display at resolutions up to 3840 × 2160 at 60 Hz with reduced blanking, when connected natively using the 4 DisplayPort connectors on the NVS 510 graphics card.  DVI‐D output

● Drives four digital displays at resolutions up to 1920 × 1200 at 60 Hz with reduced blanking using DisplayPort to DVI‐D single‐ link cable adaptors.

● Drives four digital displays at resolutions up to 2560× 1600 at 60 Hz with reduced blanking using DisplayPort to DVI‐D dual‐link cable adaptors.  HDMI output

● The NVS 510 graphics board